CN1351906A - Method for preparing active aluminium oxide layer on metal carrier surface - Google Patents
Method for preparing active aluminium oxide layer on metal carrier surface Download PDFInfo
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- CN1351906A CN1351906A CN 01134723 CN01134723A CN1351906A CN 1351906 A CN1351906 A CN 1351906A CN 01134723 CN01134723 CN 01134723 CN 01134723 A CN01134723 A CN 01134723A CN 1351906 A CN1351906 A CN 1351906A
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- metal carrier
- carrier surface
- decomposition temperature
- aluminium lamination
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- 238000000034 method Methods 0.000 title claims abstract description 23
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 22
- 239000002184 metal Substances 0.000 title claims abstract description 22
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 title abstract description 22
- 238000007254 oxidation reaction Methods 0.000 claims abstract description 47
- 230000003647 oxidation Effects 0.000 claims abstract description 42
- 238000000354 decomposition reaction Methods 0.000 claims abstract description 23
- 239000011888 foil Substances 0.000 claims abstract description 23
- 229910002060 Fe-Cr-Al alloy Inorganic materials 0.000 claims abstract description 5
- 239000004411 aluminium Substances 0.000 claims description 23
- 229910052782 aluminium Inorganic materials 0.000 claims description 23
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 23
- 238000003475 lamination Methods 0.000 claims description 23
- 238000007598 dipping method Methods 0.000 claims description 9
- 238000005979 thermal decomposition reaction Methods 0.000 claims description 9
- 230000001590 oxidative effect Effects 0.000 claims description 7
- 229910001092 metal group alloy Inorganic materials 0.000 claims description 4
- 239000000084 colloidal system Substances 0.000 abstract description 9
- 238000010438 heat treatment Methods 0.000 abstract description 8
- 229910045601 alloy Inorganic materials 0.000 abstract description 7
- 239000000956 alloy Substances 0.000 abstract description 7
- 239000003054 catalyst Substances 0.000 abstract description 4
- 238000005516 engineering process Methods 0.000 abstract description 4
- 229910021502 aluminium hydroxide Inorganic materials 0.000 abstract 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 abstract 1
- 229910001679 gibbsite Inorganic materials 0.000 abstract 1
- 238000001802 infusion Methods 0.000 abstract 1
- 238000002791 soaking Methods 0.000 abstract 1
- 239000011159 matrix material Substances 0.000 description 13
- 239000000243 solution Substances 0.000 description 8
- 238000009736 wetting Methods 0.000 description 7
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 244000137852 Petrea volubilis Species 0.000 description 2
- 238000002425 crystallisation Methods 0.000 description 2
- 230000008025 crystallization Effects 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910018626 Al(OH) Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000013467 fragmentation Methods 0.000 description 1
- 238000006062 fragmentation reaction Methods 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000000197 pyrolysis Methods 0.000 description 1
- 238000003980 solgel method Methods 0.000 description 1
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Abstract
The present invention relates to the field of metal carrier preparing technology. A process of preparing active aluminal layer on metal carrier surface features that heaitng pre-oxidation of RE-Fe-Cr-Al alloy foil in air at 870-930 deg.C for 1-24 hr; direct infusion of oxided alloy foil in Al(OH)3 colloid solution fo 1.10-1.20 g/ml concentration, at least four times soaking and heating decomposition conrses to reach an alloy foil weight increment of 10-20 wt%; and final decomposition temperature 520-580 deg.C and period 2-4 hr. The said process can prepare porous active alumina layer wall combined with the alloy carrier on the surface of the alloy carrier and the active alumina layer can be used in carrying catalyst.
Description
One, technical field
The invention belongs to the metallic carrier preparing technical field.
Two, background technology
Can realize reducing the resistance of clarifier owing to adopt metallic carrier to motor vehicle exhaust emission, and improve the clean-up effect of clarifier simultaneously to tail gas, prolong the service life of clarifier, at developed country's metallic carrier research having become one of research focuses of clarifier such as Germany, Japan and the U.S., adopt metallic carrier to be undoubtedly the developing direction of clarifier at present.In the research to metallic carrier, must solve the problem of several aspects: (1) improves the high-temperature oxidation resistance of metallic carrier itself; (2) be used for the formation of active oxidation aluminium lamination on metallic carrier that the catalyst activity component supports; (3) heat endurance of active oxidation aluminium lamination; (4) loading method of catalyst.The domestic and international research of carrying out at present mainly concentrates on (1) and (3), and is few to the research report of (2) and (4) two aspects.
On metallic carrier, can adopt the sol-gel processing similar adhering to the active oxidation aluminium lamination through pretreated metal carrier surface to ceramic monolith.But, therefore can not take identical process at oxide alloy foil surface preparation active oxidation aluminium lamination with ceramic monolith because the metal carrier surface state is different with the surface state of ceramic monolith matrix after the oxidation.
Three, summary of the invention
Problem to be solved by this invention provide a kind of metal carrier surface prepare the active oxidation aluminium lamination method.Be used for supporting of metal carrier surface catalyst by the formed active oxidation aluminium lamination of this method.
Provided by the present inventionly prepare the method for active oxidation aluminium lamination at metal carrier surface, it is characterized in that it may further comprise the steps: (1) heats pre-oxidation with the Fe-Cr-Al alloy with rare-earths foil in air, 870～930 ℃ of oxidizing temperatures, oxidization time 10～24h; (2) the metal alloy foil after the oxidation is directly immersed Al (OH)
3Colloidal solution, control Al (OH)
3Colloidal solution concentration is 1.10～1.20g/ml, and through at least 4 dippings, add thermal decomposition process, when the weightening finish of metal alloy foil reached 10～20% (percentage by weights), finally adding heat decomposition temperature was 520～580 ℃, time 2～4h.
Above-describedly prepare the method for active oxidation aluminium lamination, it is characterized in that the oxidizing temperature in the step (1) is 900 ℃ at metal carrier surface.
Above-describedly prepare the method for active oxidation aluminium lamination at metal carrier surface, it is characterized in that step (2) through 3 dippings, add thermal decomposition process, the 1st time adds heat decomposition temperature is 200 ℃, time 30min; The 2nd time adds heat decomposition temperature is 400 ℃, time 30min; The 3rd time adds heat decomposition temperature is 500 ℃, time 30min.
Above-describedly prepare the method for active oxidation aluminium lamination, it is characterized in that the heat decomposition temperature that finally adds in the step (2) is 550 ℃ at metal carrier surface.
See Table 1, table 1 is the influence of oxidation technology to the colloid dipping.Its result shows that in 870～930 ℃ temperature range, the alloy foil in air behind the heated oxide is by Al (OH)
3Colloidal solution soaks into fully, the Al after solidifying (OH)
3Colloid is good more with combining of oxidation foil surface.At 900 ℃, oxidization time 10～24h, the Al after solidifying (OH)
3The situation that combines of colloid and oxidation foil all reaches good effect.Oxidizing temperature is when 800 ℃ and 1000 ℃, though the alloy foil after the oxidation is by Al (OH)
3Colloidal solution soaks into fully, but the Al after solidifying (OH)
3Bigger cracking has taken place, the description taken in conjunction variation in colloid and oxidation foil surface.
Take the method for colloidal sol dilution that collosol concentration is reduced for making the gel layer attenuation.Table 2 is the influence of collosol concentration to the alumina layer that adheres to.As can be seen from Table 2, collosol concentration can be blocked up attached to gel layer after the colloidal sol drying of metal base surface when 1.25g/ml, gel layer fragmentation when causing heating.Therefore collosol concentration need be controlled at 1.10～1.20g/ml.Can satisfy the practical thickness that requires owing to can not reach, so must be by the process of repeatedly " flooding-adding thermal decomposition " by the alumina layer that single-steeping adheres to metal carrier surface.Be understood that the inevitable quality that directly influences adhesion layer of heating-up temperature wherein.On the one hand, the Al (OH) after dipping solidifies
3Colloid will lose the crystallization water in the colloid in heating process, form the active oxidation aluminium lamination of loose structure, and heating-up temperature will determine colloid to lose the speed of the crystallization water, thus the microcellular structure in the final active oxidation aluminium lamination that forms of decision; On the other hand,, therefore in heating process, will produce stress,, may cause that then the active oxidation aluminium lamination that adheres to comes off from metallic matrix if mode of heating is inappropriate because the alumina layer that adheres to is different with the coefficient of thermal expansion of oxidation foil matrix.After repeatedly " flooding-add thermal decomposition ", when the carrier weightening finish reaches 10～20% (percentage by weights), the thermal decomposition that finally adds that to carry out the long period is the principal element of tack between decision active oxidation aluminium lamination microcellular structure and active oxidation aluminium lamination and oxidation foil matrix to obtain porous active alumina layer completely, finally to add heat decomposition temperature.
Table 3 for the alumina layer that adheres to and with the situation that combines of metallic matrix.The sem observation result shows from table 3, active oxidation aluminium lamination after 550 ℃ of 2h heating combines with metallic matrix better, and has an oxide structure that seems loose preferably, and the active oxidation aluminium lamination after 500 ℃ of 2h heating combines relatively poor with metallic matrix, caking has appearred in 600 ℃ of 2h heating rear oxidation aluminium laminations, and obviously this will reduce the voidage and the specific area of alumina layer greatly.Therefore, will finally add heat decomposition temperature and be controlled at 520～580 ℃.
Four, the specific embodiment
Embodiment:
Example 1: before heated oxide, use 1200#SiC sand paper with surface grinding commercially available Fe-Cr-Al alloy with rare-earths foil, with ultrasonic wave that surface clean is clean in acetone then, oxidation is carried out in dry back in air, 900 ℃ of oxidizing temperatures, oxidization time 12h directly immerses Al (OH) with the metal foil after the oxidation
3Colloidal solution, control Al (OH)
3Colloidal solution concentration is 1.15g/ml, through 3 times the dipping, add thermal decomposition process, the 1st time adds heat decomposition temperature is 200 ℃, time 30min; The 2nd time adds heat decomposition temperature is 400 ℃, time 30min; The 3rd time adds heat decomposition temperature is 500 ℃, time 30min.When the metal foil weightening finish reached 10% (percentage by weight), finally adding heat decomposition temperature was 550 ℃, time 2h.Obtain combining well porous alumina layer at last with metallic matrix.
Example 2: before heated oxide, use 1200#SiC sand paper with surface grinding commercially available Fe-Cr-Al alloy with rare-earths foil, with ultrasonic wave that surface clean is clean in acetone then, oxidation is carried out in dry back in air, 900 ℃ of oxidizing temperatures, oxidization time 12h directly immerses Al (OH) with the metal foil after the oxidation
3Colloidal solution, control Al (OH)
3Colloidal solution concentration is 1.15g/ml, through 3 times the dipping, add thermal decomposition process, the 1st time adds heat decomposition temperature is 200 ℃, time 30min; The 2nd time adds heat decomposition temperature is 400 ℃, time 30min; The 3rd time adds heat decomposition temperature is 500 ℃, time 30min.When the metal foil weightening finish reached 10% (percentage by weight), finally adding heat decomposition temperature was 550 ℃, time 2h.Obtain combining well porous alumina layer at last with metallic matrix.
Table 1 oxidation technology is to the impact of colloid dipping
| Sequence number | Temperature (℃) | Temperature retention time (h) | The colloidal sol Infiltrating | Gel is in conjunction with situation |
| 1 | 800 | 12 | Complete wetting | Difference |
| 2 | 870 | 12 | Complete wetting | Well |
| 3 | 900 | 10 | Complete wetting | Good |
| 4 | 900 | 12 | Complete wetting | Good |
| 5 | 900 | 24 | Complete wetting | Good |
| 6 | 930 | 6 | Complete wetting | Well |
| 7 | 1000 | 12 | Complete wetting | Difference |
Table 2 collosol concentration is to the impact of the alumina layer that adheres to
| Sequence number | Al(OH) 3Collosol concentration (g/ml) | 550 ℃ of pyrolysis rear surface situations |
| 1 | 1.10 | Alumina layer does not have obviously and comes off |
| 2 | 1.15 | Alumina layer does not have obviously and comes off |
| 3 | 1.20 | Alumina layer does not have obviously and comes off |
| 4 | 1.25 | Alumina layer obviously comes off |
The alumina layer that table 3 adheres to and with metallic matrix in conjunction with situation
| Finally add heat decomposition temperature (℃) | Time (h) | The sem observation result |
| 500 | 2 | Alumina layer is loose structure, and it is poor to be combined with metallic matrix |
| 550 | 2 | Alumina layer is loose structure, is combined with metallic matrix |
| 600 | 2 | Occur caking in the alumina layer, be combined with metallic matrix |
Claims (4)
1, a kind ofly prepare the method for active oxidation aluminium lamination at metal carrier surface, it is characterized in that it may further comprise the steps: (1) heats pre-oxidation with the Fe-Cr-Al alloy with rare-earths foil in air, 870～930 ℃ of oxidizing temperatures, oxidization time 10～24h; (2) the metal alloy foil after the oxidation is directly immersed Al (OH)
3Colloidal solution, control Al (OH)
3Colloidal solution concentration is 1.10～1.20g/ml, and through at least 4 dippings, add thermal decomposition process, when the weightening finish of metal alloy foil reached 10～20% (percentage by weights), finally adding heat decomposition temperature was 520～580 ℃, time 2～4h.
2, according to claim 1ly prepare the method for active oxidation aluminium lamination, it is characterized in that the oxidizing temperature in the step (1) is 900 ℃ at metal carrier surface.
3, according to claim 1ly prepare the method for active oxidation aluminium lamination at metal carrier surface, it is characterized in that step (2) through 3 dippings, add thermal decomposition process, adding heat decomposition temperature for the first time is 200 ℃, time 30min; For the second time adding heat decomposition temperature is 400 ℃, time 30min; Adding heat decomposition temperature for the third time is 500 ℃, time 30min.
4, according to claim 1ly prepare the method for active oxidation aluminium lamination, it is characterized in that the heat decomposition temperature that finally adds in the step (2) is 550 ℃ at metal carrier surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01134723 CN1124180C (en) | 2001-11-09 | 2001-11-09 | Method for preparing active aluminium oxide layer on metal carrier surface |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01134723 CN1124180C (en) | 2001-11-09 | 2001-11-09 | Method for preparing active aluminium oxide layer on metal carrier surface |
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| Publication Number | Publication Date |
|---|---|
| CN1351906A true CN1351906A (en) | 2002-06-05 |
| CN1124180C CN1124180C (en) | 2003-10-15 |
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| CN 01134723 Expired - Fee Related CN1124180C (en) | 2001-11-09 | 2001-11-09 | Method for preparing active aluminium oxide layer on metal carrier surface |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100395028C (en) * | 2005-11-03 | 2008-06-18 | 安泰科技股份有限公司 | Porous catalytic filtering metal material and its prepn |
| CN100423839C (en) * | 2006-04-10 | 2008-10-08 | 中国科学院大连化学物理研究所 | Method for supporting catalyst on the metal base |
| CN100423838C (en) * | 2006-04-18 | 2008-10-08 | 天津大学 | Preparation method of coppor cerium catalyst coated on FeCrAl carrior |
| CN102553652A (en) * | 2011-04-02 | 2012-07-11 | 朱文杰 | Steel-based mesh ceramic filler for loading photocatalyst |
| WO2016004649A1 (en) * | 2014-07-07 | 2016-01-14 | 中国科学院过程工程研究所 | Monolithic metal-based catalyst, and preparation method and application therefor |
-
2001
- 2001-11-09 CN CN 01134723 patent/CN1124180C/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100395028C (en) * | 2005-11-03 | 2008-06-18 | 安泰科技股份有限公司 | Porous catalytic filtering metal material and its prepn |
| CN100423839C (en) * | 2006-04-10 | 2008-10-08 | 中国科学院大连化学物理研究所 | Method for supporting catalyst on the metal base |
| CN100423838C (en) * | 2006-04-18 | 2008-10-08 | 天津大学 | Preparation method of coppor cerium catalyst coated on FeCrAl carrior |
| CN102553652A (en) * | 2011-04-02 | 2012-07-11 | 朱文杰 | Steel-based mesh ceramic filler for loading photocatalyst |
| WO2016004649A1 (en) * | 2014-07-07 | 2016-01-14 | 中国科学院过程工程研究所 | Monolithic metal-based catalyst, and preparation method and application therefor |
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| Publication number | Publication date |
|---|---|
| CN1124180C (en) | 2003-10-15 |
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Granted publication date: 20031015 Termination date: 20101109 |