CN1345084A - Abnormality detector for chemical and mechanical grinding - Google Patents
Abnormality detector for chemical and mechanical grinding Download PDFInfo
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- CN1345084A CN1345084A CN 00128962 CN00128962A CN1345084A CN 1345084 A CN1345084 A CN 1345084A CN 00128962 CN00128962 CN 00128962 CN 00128962 A CN00128962 A CN 00128962A CN 1345084 A CN1345084 A CN 1345084A
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Abstract
The invention discloses equipment for detecting abnomrity happened in chemical and mechanical grinding. The equipment is composed of electrical motor, inverter, control circuit, speed sensor, current probe, relay controller and mechanical grinding controller. The control circuit controls alternating current outputted by the inventer and its work. The speed sensor converts the speed of the motor to the signal of rotating speed being sent to the control circuit. The current probe is used to detect alternating current of the motor and send the signal of output current to the relay controller that outputs driving signal to mechanical grinding controller. Thereby the mechanical grinding controller outputs a stopping signal to control circuit, thus wafer scratched and crack happened in grinding process can be detected in time, in order to reduce the amount of wafers damaged caused by grinding.
Description
The present invention relates to a kind of detector of surveying wafer in the situation of chemical mechanical planarization process, and particularly relate to a kind of wafer is surveyed wafer generation scratch of grinding or the situation of breaking in chemical mechanical planarization process detector.
Chemical mechanical milling method (Chemical-Mechanical Polishing, CMP) provide " comprehensive planarization " a kind of technology (GlobalPlanarization) of VLSI (ultra-large integrated) or ULSI (imperial scale is integrated) technical process, this technology is to utilize the mechanical type of similar " grinding tool " to grind modulus principle, cooperate suitable chemical assistant (Reagent), the wafer surface planarization that the profile that differs polished that just rises and falls.
Fig. 1 represents the apparatus sketch of cmp flatening process process.In Fig. 1, one is used for carrying out the grinding table 10 that wafer 14 grinds, and one is used for catching by 16 compositions of the lever of grinding wafers 14 (Holder).Wherein, lever 16 is caught the back side of wafer 14, then, the front of wafer 14 is pressed on the grinding table 10 that is covered with one deck grinding pad (Polishing Pad) 12, to carry out so-called cmp.
When cmp when carrying out, grinding table 10 and lever 16 are all along certain direction rotation, and when grinding, usefulness is helped the chemical assistant (not shown) that cmp carries out, and continues ceaselessly to be fed on the grinding table 10.The chemical reaction that promptly utilizes chemical assistant and provided, and wafer 14 mechanical lapping of being born on grinding table 10 are removed the sedimentary deposit that protrudes on the wafer 14 length by length.
When wafer when carrying out cmp flatening process process, the grinding pollutant on the grinding table sometimes can make the wafer of grinding cause serious scratch or breaks.And when wafer serious scratch took place or breaks, grinding table can't in time be monitored and send warning signal, and carries out cmp flatening process process to stop wafer, and in time removed the grinding pollutant that throws into question.Because modern technical process all continues to carry out, when finding the scratch that the wafer generation is serious at BEOL or breaking, existing many batches of wafers cause scratch because of the grinding pollutant of grinding table or break, at this moment just begin to seek impaired wafer forward, often cause the wafer of One's name is legion to scrap.
Therefore the present invention system provides a kind of abnormality detector for chemical and mechanical grinding, can in time detect wafer and in the process of grinding, whether be subjected to the grinding pollutant effects of grinding table and serious scratch or the situation of breaking take place, to avoid the causing wafer of One's name is legion to scrap.
The present invention system provides a kind of abnormality detector for chemical and mechanical grinding to comprise: a motor; An inverter is converted to AC power with DC power supply, and AC power is supplied to motor; A control circuit, the alternating current that control inverter is exported the size and whether work; A transducer rotating speed of motor is converted to tach signal, and the output speed signal is to control circuit; And a detector is surveyed the size that inverter exports the alternating current of motor to, to export stopping signal to control circuit.
The present invention system provides a kind of abnormality detector for chemical and mechanical grinding to comprise: a motor; An inverter is converted to AC power with DC power supply, and AC power is supplied to motor; A control circuit, the alternating current that control inverter is exported the size and whether work; Speed probe is converted to tach signal with the rotating speed of motor, and the output speed signal is to control circuit; A current probe, the size of the alternating current of detection motor, and output current signal.A window machine controller, the current signal of received current detector, and output drive signal; And a mechanical lapping controller receives the empty drive signal of making device of relaying (relay), to export stopping signal to control circuit.
The present invention system provides a kind of abnormality detector for chemical and mechanical grinding, when wafer when serious scratch takes place or breaks in the process of grinding, have unusual stress in mechanical lapping, then electrical system also has unusual electric current, the electric current of surveying electrical system changes, and just can in time detect the situation whether wafer scratch takes place or break in the process of grinding.
For above-mentioned purpose of the present invention, feature and advantage can be become apparent, hereinafter introduce preferred embodiment, and conjunction with figs., be described in detail below:
Fig. 1 represents the apparatus sketch of cmp flatening process process;
Fig. 2 represents cmp circuit block diagram of the present invention;
Fig. 3 represents the cmp circuit block diagram of preferred embodiment of the present invention; And
Fig. 4 A, Fig. 4 B, Fig. 4 C represent to be measured by current transformer the waveform of the phase current of three-phase alternating-current induction motor.
Label declaration:
10: grinding table
12: grinding pad
14: wafer
16: lever
20,36: DC power supply
22: inverter (inverter)
24: motor
26: transducer
28: detector
30,38: control circuit
32: three-phase alternating-current induction motor
34: three-phase inverter (three phase inverter)
40: speed probe
42: current transformer
44: window machine controller
46: the mechanical lapping controller
48: transistor
50: diode
Fig. 2 represents cmp circuit block diagram of the present invention.In Fig. 2, grinding table is by motor 24 rotations, and motor 24 can be a three-phase alternating-current induction motor, and the power supply of motor 24 is provided by inverter 22, inverter mainly is with DC power supply 20 conversion three-phase alternating-current supplies, exports three-phase alternating-current supply again and is supplied to motor 24.
In Fig. 2, the size of the AC power that control circuit 30 control inverters 22 are exported, and whether control inverter 22 works.The signal of 30 while of control circuit receiving sensor 26 and the signal of detector 28, the signal that transducer 26 is exported is a speed of representing motor 24 rotations, when signal that control circuit 30 receiving sensors 26 are exported, the out-put supply of control circuit 30 meeting control inverters 22 makes motor 24 keep certain rotating speed.The signal that detector 28 is exported is a situation of representing motor 24 operating currents, and when signal that control circuit 30 pick-up probes 28 are exported, the working condition that control circuit 30 can control inverters 22 makes motor 24 rotations or stops.
Fig. 3 represents the cmp circuit block diagram of preferred embodiment of the present invention.In Fig. 3, be example with three-phase alternating-current induction motor 32, for grinding table produces rotary power.Three-phase inverter 34 is converted to three-phase alternating-current supply to be supplied to three-phase alternating-current induction motor 32 with DC power supply Ed 36, three-phase inverter 34 is formed three-phase circuit by six transistors 48, by the ON time of control circuit 38 each transistor 48 of control, each transistor 48 diode 50 in parallel is to produce afterflow effect (FlywheelEffect).
In Fig. 3, speed probe 40 detects the rotating speed of three-phase alternating-current induction motor 32, and speed probe 40 and output speed signal are given control circuit 38.When control circuit 38 receives the tach signal of speed probe 40, the ON time of the transistor 48 in the control circuit 38 control three-phase inverters 34, three phase mains with 34 outputs of control three-phase inverter makes three-phase alternating-current induction motor 32 keep certain rotating speed.
In Fig. 3, between three-phase inverter 34 and three-phase alternating-current induction motor 32, add a current transformer 42, current transformer 42 is measured the phase current i that is supplied to three-phase alternating-current induction motor 32 by three-phase inverter 34
a, and the input of output current signal in the I/O (I/O) of window machine controller 44.Window machine controller 44 is according to the size of the current signal that is received at the I/O input, compare with the electric current in window machine controller 44 bist data storehouses, when the current signal that is received has bigger change, the grinding of the wafer situation that produces scratch or break for example, window machine controller 44 are just sent the input of an I/O drive signal in the I/O of mechanical lapping controller 46.When mechanical lapping controller 46 received the I/O drive signal of window machine controller 44, then mechanical lapping controller 46 was sent stopping signal and is given control circuit 38.After control circuit 38 received stopping signal, control three-phase inverter 34 output three-phase alternating-current supplies were zero, and three-phase alternating-current induction motor 32 is stopped the rotation.At this moment, grinding table can be sent warning signal shuts down for the Field Force with the removing grinding table problem.
In Fig. 3, the torque of three-phase alternating-current induction motor 32 rotations is T=P Φ
a* i
aWherein, P is the number of poles of three-phase alternating-current induction motor 32 magnetic poles, Φ
aBe the magnetic flux of three-phase alternating-current induction motor 32 magnetic poles, i
aPhase current for three-phase alternating-current induction motor 32.The number of poles of three-phase alternating-current induction motor 32 magnetic poles is fixed, and the magnetic flux of three-phase alternating-current induction motor 32 magnetic poles is relevant with the temperature and the magnetic saturation of permanent magnet, so the magnetic flux of three-phase alternating-current induction motor 32 magnetic poles does not have big change.Therefore, the torque of three-phase alternating-current induction motor 32 rotations is relevant with the phase current of three-phase alternating-current induction motor 32, that is the torque of three-phase alternating-current induction motor 32 rotations is the variations that are directly proportional with the relation of the phase current of three-phase alternating-current induction motor 32.
When the velocity-stabilization of three-phase alternating-current induction motor 32 rotation, if grinding table is in the grinding wafers generation scratch or the situation of breaking, grinding table gets friction will be increased, so, the change that the level of torque of three-phase alternating-current induction motor 32 rotations will produce, the change that the phase current size of three-phase alternating-current induction motor 32 also can produce.
At this moment, current transformer 42 can detect the phase current i that is supplied to three-phase alternating-current induction motor 32 by three-phase inverter 34
aVariation, as Fig. 4 A, Fig. 4 B, Fig. 4 C represent to be measured shown in the waveform of phase current of three-phase alternating-current induction motor by current transformer.In Fig. 4 A, when grinding table when scratch does not take place or breaks in grinding wafers, the not too big change of the waveform of current transformer 42 phase current that detects.In Fig. 4 B, when the situation of grinding table in grinding wafers generation scratch, the waveform of current transformer 42 phase current that senses has bigger change.In Fig. 4 C, when grinding table during in the situation that grinding wafers is broken, the waveform of current transformer 42 phase current that detects is then less than normal phase current waveform.
Therefore, current transformer 42 is converted to input among the I/O that current signal exports window machine controller 44 to the phase current ia of the three-phase alternating-current induction motor 32 measured, window machine controller 44 is according to the size of the current signal that input received in I/O, compare with the electric current in window machine controller 44 bist data storehouses, when the current signal that is received has bigger change, the grinding of the wafer situation that produces scratch or break for example, window machine controller 44 are just sent the input of an I/O drive signal in the I/O of mechanical lapping controller 46.When mechanical lapping controller 46 received the I/O drive signal of window machine controller 44, then mechanical lapping controller 46 was sent stopping signal and is given control circuit 38.After control circuit 38 received stopping signal, control three-phase inverter 34 made three-phase alternating-current induction motor 32 stop the rotation.Simultaneously, grinding table can be sent warning signal shuts down for the Field Force with removing grinding table machine problem.
Therefore, the invention has the advantages that when wafer when serious scratch takes place or breaks in the process of grinding, mechanical lapping has unusual stress, then electrical system also has unusual electric current, the electric current that utilizes current transformer to detect electrical system changes, and compare with the electric current in bist data storehouse, can in time detect the situation whether wafer scratch takes place or break in the process of grinding, to reduce wafer because of grinding impaired quantity.
In sum; though above to introduce the present invention by preferred embodiment; right its is not in order to limit the present invention; those skilled in the art; without departing from the spirit and scope of the present invention; can do various changes and improvement, so protection scope of the present invention is as the criterion with appended claim restricted portion.
Claims (9)
1. abnormality detector for chemical and mechanical grinding comprises:
One motor is in order to produce the power of cmp;
One inverter is connected to this motor, is an AC power with a direct current power source conversion, and this AC power is supplied to this motor;
One control circuit is connected to this inverter, controls the size of this alternating current that this inverter exports and whether works;
One transducer is connected between this motor and this control circuit, the rotating speed of this motor is converted to a tach signal, and exports this tach signal to this control circuit; And
One detector is connected to this control circuit, surveys the size that this inverter exports this alternating current of this motor to, to export a stopping signal to this control circuit.
2. abnormality detector for chemical and mechanical grinding as claimed in claim 1, wherein this motor is a three-phase alternating-current induction motor.
3. abnormality detector for chemical and mechanical grinding as claimed in claim 1, wherein this inverter is that this DC power supply is converted to three-phase alternating-current supply.
4. abnormality detector for chemical and mechanical grinding as claimed in claim 1, wherein this transducer is a speed probe.
5. abnormality detector for chemical and mechanical grinding as claimed in claim 1, wherein this detector comprises a current probe, a window machine controller and a mechanical lapping controller.
6. abnormality detector for chemical and mechanical grinding comprises:
One motor is in order to produce the power of cmp;
One inverter is connected to this motor, and DC power supply is converted to AC power, and this AC power is supplied to this motor;
One control circuit is connected to this inverter, controls the size of this alternating current that this inverter exports and whether works;
One speed probe is connected between this motor and this control circuit, the rotating speed of this motor is converted to a tach signal, and exports this tach signal to this control circuit;
One current probe detects the size of this alternating current of this motor, to export a current signal;
One window machine controller is connected to this current transformer, receives this current signal of this current transformer, to export a drive signal; And
One mechanical lapping controller is connected between this window machine controller and this control circuit, receives the drive signal of this window machine controller, to export a stopping signal to this control circuit.
7. abnormality detector for chemical and mechanical grinding as claimed in claim 6, wherein this motor is a three-phase alternating-current induction motor.
8. abnormality detector for chemical and mechanical grinding as claimed in claim 6, wherein this inverter is that this DC power supply is converted to three-phase alternating-current supply.
9. abnormality detector for chemical and mechanical grinding as claimed in claim 6, wherein this current probe is a current transformer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB001289624A CN1168127C (en) | 2000-09-22 | 2000-09-22 | Abnormality detector for chemical and mechanical grinding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB001289624A CN1168127C (en) | 2000-09-22 | 2000-09-22 | Abnormality detector for chemical and mechanical grinding |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1345084A true CN1345084A (en) | 2002-04-17 |
| CN1168127C CN1168127C (en) | 2004-09-22 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB001289624A Expired - Fee Related CN1168127C (en) | 2000-09-22 | 2000-09-22 | Abnormality detector for chemical and mechanical grinding |
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| Country | Link |
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| CN (1) | CN1168127C (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101427435B (en) * | 2006-04-19 | 2013-01-02 | 戴姆勒股份公司 | Device for operating an electric motor |
| CN111113255A (en) * | 2018-10-30 | 2020-05-08 | 台湾积体电路制造股份有限公司 | Chemical mechanical polishing equipment and irregular mechanical motion prediction system and method |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010067732A1 (en) * | 2008-12-12 | 2010-06-17 | 旭硝子株式会社 | Grinding device, grinding method, and method of manufacturing glass sheet |
-
2000
- 2000-09-22 CN CNB001289624A patent/CN1168127C/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101427435B (en) * | 2006-04-19 | 2013-01-02 | 戴姆勒股份公司 | Device for operating an electric motor |
| CN111113255A (en) * | 2018-10-30 | 2020-05-08 | 台湾积体电路制造股份有限公司 | Chemical mechanical polishing equipment and irregular mechanical motion prediction system and method |
| CN111113255B (en) * | 2018-10-30 | 2022-05-10 | 台湾积体电路制造股份有限公司 | Chemical mechanical polishing equipment and irregular mechanical motion prediction system and method |
| US11731232B2 (en) | 2018-10-30 | 2023-08-22 | Taiwan Semiconductor Manufacturing Company, Ltd. | Irregular mechanical motion detection systems and method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1168127C (en) | 2004-09-22 |
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Granted publication date: 20040922 Termination date: 20100922 |