CN1336548A - Comb-shaped stereo silicon processing micro mechanical structure with fixed tooth offset - Google Patents
Comb-shaped stereo silicon processing micro mechanical structure with fixed tooth offset Download PDFInfo
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- CN1336548A CN1336548A CN 01141718 CN01141718A CN1336548A CN 1336548 A CN1336548 A CN 1336548A CN 01141718 CN01141718 CN 01141718 CN 01141718 A CN01141718 A CN 01141718A CN 1336548 A CN1336548 A CN 1336548A
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- 238000012545 processing Methods 0.000 title claims abstract description 17
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 12
- 239000010703 silicon Substances 0.000 title claims abstract description 12
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims description 11
- 239000000758 substrate Substances 0.000 claims abstract description 15
- 230000002146 bilateral effect Effects 0.000 claims description 5
- 239000003990 capacitor Substances 0.000 claims description 4
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 238000013461 design Methods 0.000 abstract description 6
- 238000000034 method Methods 0.000 abstract description 5
- 239000011521 glass Substances 0.000 abstract description 2
- 230000003247 decreasing effect Effects 0.000 abstract 1
- 238000001514 detection method Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
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Abstract
The invention relates to design of miniature physical structure in processing spatial silicon. The invented structure consists of sensing unit, fixed teeth, and substrate. The sensing unit is composed of tooth-comb, multi group of motion teeth. The intervals from each tooth of comb in the sensing unit to adjacent two fixed teeth are not equal. The ratio of interval to two sides is 1:8-12. The invented structure provides important merits usch as less linkage blocks, large area, reducing the difficulty for block to key in, small contact resistance in place of key joint, uniformity, yield notably improved. It makes the design and process of miniature physical structure from two dimensions to three dimensions possible. Also, the invention increases resolution and precision greatly. Many lead wires and electrodes on glass plate electrode needed by the scheme of equally placed are reduced evidently. Thus one side, it prevents the interfere from distributed capacitance between lead wires and electric signal, on the other hand the amount of lead wires is decreased, work load for lead wires to key in is reduced.
Description
Technical field
The invention belongs to the shaped stereo silicon processing micro mechanical structure design field, particularly the design of comb-tooth-type micro mechanical structure.
Background technology
The comb-tooth-type micro mechanical structure is a kind of typical structure of micro mechanical sensor, and existing comb-tooth-type micro mechanical structure is face processing and decides the even configuration structure of tooth.The application of on micro-mechanical accelerometer, having succeeded of this structure.Micro-mechanical accelerometer is nearly ten years emerging in the world growing up.The ADXLXX series of U.S. AD company is the highest micro-mechanical accelerometer of occupation rate on the market.The micro-mechanical accelerometer of AD company adopts is that face processing is decided tooth and evenly disposed the comb-tooth-type capacitance accelerometer.The accelerometer of this dynamic balance adopts surface processing technique to make sensitive axes and substrate parallel.This kind face processing is decided general structure that tooth evenly disposes the comb-tooth-type micro mechanical sensor as shown in Figure 1.Among Fig. 1, the bilateral comb structure that movable responsive mass elements 11 is micromechanicss, the substrate (not shown) that is used for fixing movable responsive mass elements relatively is unsettled, is fixed on the substrate by two ends folded beam structure 12.Each broach 13 is stretched out to its both sides by central quality bar 14 (tooth pivot), and each broach (movable tooth) is a float electrode of variable capacitance; Fixed teeth 15 directly is fixed on the substrate, and every group of fixed teeth combined by ∏ shape tooth 151 and L shaped tooth 152, fixed teeth by with movable tooth 13 staggered all equidistant d
0Configuration, form differential capacitor. the micromechanics bilateral comb structure and the substrate parallel of this responsive mass elements. responsive mass elements 11 can move to MD along sensitive axes. simultaneously, folded beam 12 self is a reasonable strain relief, so select for use folded beam also can reduce stress influence.The major advantage that this fixed teeth and movable tooth are all put scheme is to save tube core space of a whole page size, and this micro mechanical sensor for surface working is suitable.But, influenced the further raising of comb-tooth-type micro mechanical sensor resolution and precision because the comb-tooth-type structure measurement electric capacity that surface working obtains is less than normal.
For resolution and the precision that improves micro mechanical sensor, replacing surface working with the processing of body silicon is a valid approach.But for body processing comb structure, because it is little to decide the even configuration structure bonding face of tooth, body silicon is processed responsive quality activity sheet thickening in addition, quality strengthens, and after process flow got off, the tooth of deciding of bonding came off seriously; In addition, it is very big to record the resistance of deciding between cog by probe station, and this mainly is that bond strength is not enough, the bonding contact resistance causes too greatly.So just new problem occurred, yield rate is zero no better than.
Summary of the invention
The objective of the invention is for overcoming the weak point of prior art, a kind of comb-shaped stereo silicon processing micro mechanical structure of fixed tooth offset is proposed, make it have the bond strength height, bonding area is big, the bonding difficulty is low, the bonding contact resistance is little, even, the characteristics that yield rate is high, and then improved the resolution and the precision of comb-tooth-type micro mechanical sensor.
The comb-shaped stereo silicon processing micro mechanical structure of a kind of fixed tooth offset that the present invention proposes comprises a responsive mass elements that is made of tooth pivot, the moving tooth of many groups and folded beam group, fixed teeth and substrate; Should be stretched out to both sides by the tooth pivot by moving tooth, form bilateral comb-tooth-type structure, the folded beam at these tooth pivot two ends is fixed on the substrate, makes tooth pivot, moving unsettled the be arrangeding in parallel of the relative substrate of tooth of many groups; The moving tooth of each of said responsive mass elements is a float electrode of variable capacitance, and is interconnected with each broach of fixed teeth, totally forms differential capacitor; It is characterized in that this fixed teeth is for directly being fixed on the one-sided comb-tooth-type structure of on-chip many groups; Each broach of said responsive mass elements two constant pitch adjacent with it are not from waiting, and the both sides distance ratio is 1: (8-12).
The said responsive mass elements one-piece construction of the present invention forms and is symmetrically distributed with tooth pivot mid point is preferred plan.
Responsive mass elements of the present invention can be along the tooth pivot to moving.This structure mainly is the electric capacity that the little side of responsive distance forms, and can ignore the electric capacity of the big side of distance.Some moving tooth and fixed teeth are formed overall differential detection electric capacity and differential afterburning electric capacity.
Characteristics of the present invention and application
The most important advantage of fixed tooth offset structure of the present invention is exactly that the bonding piece is few, the monolithic bonding area is big, greatly reduce the bonding difficulty, and the bonding contact resistance is little, even.Because all the tooth of deciding on each moving tooth both sides of interposed structure is an opposed polarity, because the relation of lead-in wire is all wanted independent bonding, bond strength is little, is easy to come off; And fixed tooth offset structure centre line of the present invention is a kind of electrode with a left side, and center line is another kind of electrode with the right side, so can adopt several fixed meshing bondings together, has alleviated contradiction greatly.Prove that through process flow the present invention has significantly improved yield rate, make micro mechanical sensor be worked into body and be processed into possibility, thereby the resolution of making and precision improve greatly from face.
In addition, fixed tooth offset structure of the present invention has obviously reduced the necessary many inner leads of the scheme of all putting on the glass pole plate, electrode.The distributed capacitance between electrode, lead-in wire and the interference of electric signal have been avoided like this, on the one hand; On the other hand, reduce lead-in wire output number, reduced the workload of lead-in wire bonding.
Decide the equal interposed structure of tooth though the lateral dimension of bias structure of the present invention is slightly larger than, all the tooth of deciding of interposed structure is grown (with electric capacity and the bonding area that satisfies equal interposed structure), and in the process, tooth flexural deformation is bigger, and technology difficulty is big; Simultaneously, decide the operate as normal that the long flexural deformation meeting that causes of tooth directly influences sensor.In addition, all the longitudinal size of interposed structure is big, and utilization ratio of spaces is low.So on space of a whole page utilization, processing technology, fixed tooth offset structure of the present invention also is better than equal interposed structure.
Description of drawings
Fig. 1 is the existing evenly comb-tooth-type surface working micro mechanical structure synoptic diagram of configuration of tooth of deciding.
Fig. 2 is a fixed tooth offset comb-shaped stereo silicon processing micro mechanical structure embodiment synoptic diagram of the present invention.
The specific embodiment
The embodiment of the comb-shaped stereo silicon processing micro mechanical structure of a kind of fixed tooth offset of the present invention's design is such as Fig. 2 institute Show that present embodiment comprises: one by tooth pivot 24, the moving tooth 23 of many groups and 22 groups of sensitive-mass-elements that consist of of folded beam Part 21, fixed teeth 25 and substrate; Should moving tooth 23 be stretched out to both sides by tooth pivot 24, form bilateral comb-tooth-type structure, The folded beam 22 at these tooth pivot two ends is fixed on the substrate, makes tooth pivot, moving unsettled the be arrangeding in parallel of the relative substrate of tooth of many groups; Should Fixed teeth 25 is for directly being fixed on the one-sided comb-tooth-type structure of on-chip many groups; Each of said sensitive-mass element is moving Tooth is a float electrode of variable capacitance, and is interconnected with each broach of fixed teeth, totally forms differential capacitor; Present embodiment is with existing difference of deciding the comb-tooth-type Surface Machining micro mechanical structure of the even configuration of tooth, and is said Each broach of sensitive-mass element two constant pitch adjacent with it are not from waiting, and the both sides distance ratio is 1: 10, And form symmetrically with tooth pivot mid point, the capacitance that the side that main responsive distance is little forms can be ignored The capacitance of the side that distance is big. Some moving tooth and quiet tooth are formed overall differential detection electric capacity and differential reinforcing Electric capacity. In addition, the fixed teeth structure of present embodiment is more simple, is convenient to bonding.
The micro mechanical structure of present embodiment can be used for accelerometer, specifically is of a size of:
General plane size 2.8mm * 2.8mm sensitive-mass element 1500 μ m * 1000 μ m;
The long 270 μ m of broach, wide 6 μ m, it is long by 250 to decide tooth and moving tooth lap, and non-overlapped part is long 20 μ m;
Total number of teeth 22 * 2 * 2, the broach gap d0=2μm D
0=20μm;
One-sided detection comb quantity n1=13 force feedback broach are counted n2=9;
Detection capacitance 1.15pF, afterburning electric capacity 0.8pF; Sensitive-mass element quality 77.6 μ g
The folding wide 2.5 μ m of beam length 370 μ m, the long 27 μ m in folded beam termination, wide 30 μ m;
Deciding tooth two the moving space widths adjacent with it in the present embodiment is d0(2.0 μ m) and D0(be about d010 times). Like this, just formed the comb-tooth-type accelerometer of fixed tooth offset structure. Work as D0>>d
0The time, D0One lateral capacitance can be ignored Disregard.
The basic mechanical design feature index is as follows:
(1) range ± 30g
(2) scale factor 160mV/g
(3) linearity 500PPm (± 1g) be better than 1 ‰ (± 30g)
(4) bias stability 0.5mg
(5) the repeated 1mg (24~25 ℃) that setovers
(6) noise
(7) frequency band 500Hz
(8) gauge outfit shock resistance 1500g
(9) supply voltage ± 12V
(10) electric current 30mA
Claims (2)
1, a kind of comb-shaped stereo silicon processing micro mechanical structure of fixed tooth offset comprises a responsive mass elements that is made of tooth pivot, the moving tooth of many groups and folded beam group, fixed teeth and substrate; Should be stretched out to both sides by the tooth pivot by moving tooth, form bilateral comb-tooth-type structure, the folded beam at these tooth pivot two ends is fixed on the substrate, makes tooth pivot, moving unsettled the be arrangeding in parallel of the relative substrate of tooth of many groups; The moving tooth of each of said responsive mass elements is a float electrode of variable capacitance, and is interconnected with each broach of fixed teeth, totally forms differential capacitor; It is characterized in that this fixed teeth is for directly being fixed on the one-sided comb-tooth-type structure of on-chip many groups; Each broach of said responsive mass elements two constant pitch adjacent with it are not from waiting, and the both sides distance ratio is 1: (8-12).
2, the comb-shaped stereo silicon processing micro mechanical structure of fixed tooth offset as claimed in claim 1 is characterized in that, the whole formation of said responsive mass elements is symmetrically distributed with tooth pivot mid point.
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CNB011417188A CN1138148C (en) | 2001-09-14 | 2001-09-14 | Comb-shaped stereo silicon processing micro mechanical structure with fixed tooth offset |
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CNB011417188A CN1138148C (en) | 2001-09-14 | 2001-09-14 | Comb-shaped stereo silicon processing micro mechanical structure with fixed tooth offset |
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CN1336548A true CN1336548A (en) | 2002-02-20 |
CN1138148C CN1138148C (en) | 2004-02-11 |
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Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1332205C (en) * | 2004-07-19 | 2007-08-15 | 西北工业大学 | Single mass plate triaxial micro-mechanical accelerometer |
CN100425993C (en) * | 2006-01-25 | 2008-10-15 | 哈尔滨工业大学 | Differential capacitance type acceleration transducer with frame structure |
CN101819215A (en) * | 2010-04-20 | 2010-09-01 | 浙江大学 | Micro-mechanical finger gate capacitor accelerometer with adjustable elastic coefficients |
CN101834065A (en) * | 2010-04-20 | 2010-09-15 | 浙江大学 | Variable-area capacitive structure capable of adjusting elasticity coefficient of micro mechanical device |
CN101840781A (en) * | 2010-04-16 | 2010-09-22 | 清华大学 | Frame-type variable capacitor and preparation method thereof |
CN109490576A (en) * | 2018-12-19 | 2019-03-19 | 成都力创云科技有限公司 | Based on a kind of fully differential capacitor MEMS acceleration by SOI |
CN109507452A (en) * | 2018-12-19 | 2019-03-22 | 成都力创云科技有限公司 | A kind of high-performance bulk silicon MEMS capacitive accelerometer |
WO2022006910A1 (en) * | 2020-07-10 | 2022-01-13 | 瑞声声学科技(深圳)有限公司 | Comb tooth structure having initial position offset, and preparation method therefor |
-
2001
- 2001-09-14 CN CNB011417188A patent/CN1138148C/en not_active Expired - Fee Related
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1332205C (en) * | 2004-07-19 | 2007-08-15 | 西北工业大学 | Single mass plate triaxial micro-mechanical accelerometer |
CN100425993C (en) * | 2006-01-25 | 2008-10-15 | 哈尔滨工业大学 | Differential capacitance type acceleration transducer with frame structure |
CN101840781A (en) * | 2010-04-16 | 2010-09-22 | 清华大学 | Frame-type variable capacitor and preparation method thereof |
CN101819215A (en) * | 2010-04-20 | 2010-09-01 | 浙江大学 | Micro-mechanical finger gate capacitor accelerometer with adjustable elastic coefficients |
CN101834065A (en) * | 2010-04-20 | 2010-09-15 | 浙江大学 | Variable-area capacitive structure capable of adjusting elasticity coefficient of micro mechanical device |
CN109490576A (en) * | 2018-12-19 | 2019-03-19 | 成都力创云科技有限公司 | Based on a kind of fully differential capacitor MEMS acceleration by SOI |
CN109507452A (en) * | 2018-12-19 | 2019-03-22 | 成都力创云科技有限公司 | A kind of high-performance bulk silicon MEMS capacitive accelerometer |
WO2022006910A1 (en) * | 2020-07-10 | 2022-01-13 | 瑞声声学科技(深圳)有限公司 | Comb tooth structure having initial position offset, and preparation method therefor |
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CN1138148C (en) | 2004-02-11 |
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