CN1323973C - Method and apparatus for removing thin metal films - Google Patents
Method and apparatus for removing thin metal films Download PDFInfo
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- CN1323973C CN1323973C CNB2003801012044A CN200380101204A CN1323973C CN 1323973 C CN1323973 C CN 1323973C CN B2003801012044 A CNB2003801012044 A CN B2003801012044A CN 200380101204 A CN200380101204 A CN 200380101204A CN 1323973 C CN1323973 C CN 1323973C
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Abstract
A system for removing a thin metal film comprising an inclining metal plate electrode (21) for guiding a downward electrolyte flow, an auxiliary electrode (22) placed on the upstream or downstream side of the metal plate electrode (21) such that a part of the auxiliary electrode is immersed into the electrolyte, and a power supply (23) for applying a DC voltage to the both electrodes. The system is used to remove a metal thin film (24a) on the surface of an insulator (24) by making the electrolyte (26) flowing down the metal plate electrode (21) strike against the metal thin film (24a) under a state where the DC voltage is applied to the metal plate electrode (21) and the auxiliary electrode (22).
Description
Technical field
For example the present invention relates to by evaporation or when electroplating the metallic film that forms and to satisfy quality control standard, method that this metallic film is removed from substrate and the device of implementing this method.
Background technology
High-performance glass substrate with good optical property (transmitance etc.) and mechanical property (Flatness etc.) can be used for such as flat-panel screens etc.But because it costs an arm and a leg, when therefore the metallic film of going up formation when its surface can not satisfy quality control standard, this metallic film was removed in hope, and glass substrate then can be used again.
The method of removing this metallic film has chemical etching to remove method.As shown in figure 18, this method is need to be removed the substrate 2 that is formed at its surperficial metallic film impregnated in the chemical solution 1, make metallic film be dissolved in this chemical solution (for example, with reference to Japanese patent laid-open 6-321581 number, Japanese patent laid-open 9-86968 number) by chemical reaction.
But, because the chemical etching method of removing will be used chemical solutions such as strong acid and highly basic, therefore there is following problem:
Must pay close attention to when 1) using, operability is poor,
2) must carry out the erosion resistance processing to installing, the cost height,
3) promptly discarded after chemical solution is to use basically, produce a large amount of waste liquids thus.
4) after the use, the difficult treatment of chemical waste fluid.
The present invention is the invention of finishing in view of above-mentioned technical problem.The purpose of this invention is to provide chemical solutions such as not using strong acid and highly basic and do not need accurate position control, can remove the method for metallic film effectively with contactless state basically and implement the device of this method.
The announcement of invention
The method of removing of the 1st metallic film of the present invention is to use by the metal plate electrode that flows down, the upstream that is installed in this metal plate electrode or downstream side that be obliquely installed, guiding electrolysis stream and a part and should immerses supporting electrode in the electrolytic solution, put on the device of removing of the 1st metallic film of the present invention that the dc voltage power supply of above-mentioned two electrodes constitutes, above-mentioned metal plate electrode and supporting electrode are being applied under the state of volts DS, make the electrolytic solution that flows down from above-mentioned metal plate electrode and the metallic film on insulant surface produce collision, metallic film is removed.
And, strong acid and the such chemical solution of highly basic are not used in the 1st invention, do not need to control the exact position of injector electrode with respect to the metallic film on insulant surface, owing to be contactless state, so can not cause damage, can remove metallic film efficiently to insulant.
The method of removing of the 2nd metallic film of the present invention is used between the above-mentioned metal plate electrode and supporting electrode of removing device of the 1st metallic film that must pass through the invention described above, below this two electrode bottom-side electrodes is installed, to this bottom-side electrodes also must by dc voltage power supply apply the volts DS of above-mentioned supporting electrode and above-mentioned metal plate electrode and the 2nd metallic film of the present invention that constitutes remove device; Removing in the method for above-mentioned the 1st metallic film of the present invention, also applied the state of volts DS with bottom-side electrodes to the inner face side that is disposed at above-mentioned insulant, make the electrolytic solution that flows down from above-mentioned metal plate electrode and the metallic film on insulant surface produce collision, metallic film is removed.
Like this, more help the performance of effect than the 1st invention.
In the 1st or the 2nd above-mentioned invention, at least the running gear that the either party make the insulant that impregnated in electrolytic solution or metal plate electrode moves with respect to the opposing party is set, if make above-mentioned insulant and metal plate electrode can when relatively moving, remove metallic film, so just can remove wider metallic film.
The method of removing of the 3rd metallic film of the present invention is to use in the above-mentioned the 1st or the 2nd invention, the intrusion that is provided with electrolytic solution at the approaching side of the insulant of above-mentioned metal plate electrode suppress member the 3rd metallic film of the present invention remove device, invade the edge side of insulant to suppress early stage electrolytic solution.
Like this, just can prevent to produce pitted skin shape metallic film.
The method of removing of the 4th metallic film of the present invention is to use in above-mentioned the 1st～the 3rd the invention, with the metal plate electrode make revolvable electrode, installed at the position that contacts with the metallic film of this electrode grind base material, possess to the position that contacts with the metallic film of above-mentioned electrode supply with the supply mean that grinds base material the 4th metallic film of the present invention remove device, by the nuzzle up surface of metallic film of the grinding base material that is positioned at the position that contacts with the metallic film of above-mentioned electrode.
The 4th invention can be removed fully because of the residual film of electrolysis stripping.
The simple declaration of accompanying drawing
Fig. 1 is a schematic configuration synoptic diagram of implementing an example of the 1st metal foil film removing apparatus of inventing.Fig. 2 is a schematic configuration synoptic diagram of implementing the example 2 of the 1st metal foil film removing apparatus of inventing.Fig. 3 is the one-piece construction figure of Fig. 2.Fig. 4 be expression when forming electrolytic solution-supporting electrode-dc voltage power supply in dc voltage power supply-metal plate electrode-Continuous Flow-metallic film-working groove closed circuit voltage and the synoptic diagram of current relationship.(a) of Fig. 5 is the reason explanatory view that metallic film remains in terminal region in the 1st invention.(b) of Fig. 5 is the figure that metallic film remains in the insulant of terminal region.Fig. 6 does not make metallic film remain in the explanatory view of the method for terminal region situation generation in the 1st invention.(a) of Fig. 7 is the explanatory view of other state of taking place of the situation that do not make metallic film remain in terminal region in the 1st invention (b).Fig. 8 is a schematic configuration synoptic diagram of implementing an example of the 2nd metal foil film removing apparatus of inventing.Fig. 9 is with the explanatory view of pitted skin shape metal remained film in the end of insulant.Figure 10 is a schematic configuration synoptic diagram of implementing a routine metal foil film removing apparatus of the 3rd invention.Figure 11 is another routine schematic configuration synoptic diagram of implementing the metal foil film removing apparatus of the 3rd invention.Figure 12 is a schematic configuration synoptic diagram of implementing the routine metal foil film removing apparatus of the 3rd other embodiment that invents.Figure 13 is a schematic configuration synoptic diagram of implementing a routine metal foil film removing apparatus of the 4th invention.Figure 14 is a schematic configuration synoptic diagram of implementing the example 2 of the 4th metal foil film removing apparatus of inventing.Figure 15 is a schematic configuration synoptic diagram of implementing the example 3 of the 4th metal foil film removing apparatus of inventing.Figure 16 is a schematic configuration synoptic diagram of implementing the example 4 of the 4th metal foil film removing apparatus of inventing.Figure 17 is a schematic configuration synoptic diagram of implementing the example 5 of the 4th metal foil film removing apparatus of inventing.Figure 18 is an explanatory view of removing the method for metallic film by chemical etching.
The best mode that carries out an invention
For explaining the present invention in more detail, now be illustrated with reference to the accompanying drawings.
At first, one of the 1st metal foil film removing apparatus of the present invention example is represented with Fig. 1～Fig. 3.
In Fig. 1～Fig. 3, the 21st, have the width roughly the same with insulant described later for example 24, above electrolytic solution 26 with the skewed upright metal plate electrode of establishing, 22 impregnated in the supporting electrode of electrolytic solution 26 for the bottom, 23 is dc voltage power supply, 24 for being immersed in the insulant in the electrolytic solution (as salt solution) 26 in the working groove 25, formed the metallic film 24a that desires to remove on its surface.In addition, M represents electrolysis stripping portion, and V represents valve.
Wherein, the example shown in Fig. 1 is represented by pump 28 electrolytic solution 26 in the electrolytic bath 27 to be delivered to the situation of metal plate electrode 21, and supporting electrode 22 be cylindric, to erect setting with the discontiguous state of the metallic film 24a on above-mentioned insulant 24 surfaces.
In Fig. 2 and example shown in Figure 3, supporting electrode 22 for example form the cylinder shape that rotates freely and with metal plate electrode 21 configured in parallel, this supporting electrode 22 is contacted with the metallic film 24a on insulant 24 surfaces, and, as shown in Figure 3, electrolytic solution 26 after the processing is recovered into electrolytic bath 27, and the electrolytic solution of recovery filters through filter 30 and delivers to metal plate electrode 21, and so just expression has recycled electrolytic solution 26.The supporting electrode 22 of cylinder shape also can with the discontiguous state fixed configurations of the metallic film 24a on insulant 24 surfaces.
The 1st above-mentioned invention is removed metallic film 24a by following principle.
1) flows out electrolytic solution 26 from metal plate electrode 21 to metallic film 24a, form uninterrupted current 26a.
2) for example apply with metal plate electrode 21 and be negative pole, be the anodal volts DS, then form the closed circuit of dc voltage power supply 23-metal plate electrode 21-Continuous Flow 26a-metallic film 24a-electrolytic solution 26-supporting electrode 22-dc voltage power supply 23 with supporting electrode 22.
3) if form foregoing circuit, then voltage and electric current are curve shown in Figure 4.If surpass the A voltage among this Fig. 4, then the surface from metal plate electrode 21 and metallic film 24a begins to produce hydroxide ion and micro-bubble.If surpass B voltage, then electric current begins rapid rising, and the generation of bubble sharply strengthens thereupon.
4) further if surpass voltage C, then voltage and electric current are proportionlity roughly, below 1. the Coulomb's law shown in the formula roughly set up, the stripping of film metal occurs, and can carry out the processing of removing of film metal 24a.Self-evident, at this moment insulant 24 can the electrolysis stripping.D voltage is the minimum voltage value of metal stripping, i.e. decomposition voltage, and D voltage is by decisions such as electrode materials (surface activity), concentration of electrolyte, circuit resistances.
W＝η1·η2·k·I·t ……①
Wherein, η 1: dissolution efficiency (%), η 2: current efficiency (%), k: electrochemical equivalent (mg/c), I: Faradaic current (A), T: electrolysis time (scc).
Above-mentioned the 1st invention (except that the example shown in Fig. 2,3) does not therefore damage insulant, and does not need the position between counter electrode and metallic film accurately to control owing to be the processing method of noncontact.In addition, owing to be not that chemistry is removed method, but the processing method by the electrolysis stripping, so, can use NaNO so long as the electrolytic solution that can switch on gets final product
3, neutral salt electrolytic solution such as NaCl, so good operability, and the liquid waste disposal of electrolytic solution is easier to.Shown in Fig. 2,3 the 1st invention also has only the supporting electrode 22 of cylinder shape to come in contact, and is therefore same as described above basically.
In the 1st above-mentioned invention, for example mobile insulant 24, metallic film 24a is removed gradually, arrives the words of its terminal, shown in Fig. 5 (a), the distance that metallic film 24a and supporting electrode are 22 gradually away from, the magnitude of current that flows through metallic film 24a is than lacking in the electrolytic solution 26, therefore, current efficiency reduces, shown in Fig. 5 (b), final, just metallic film 24a remains in end, downstream side (the paper left side of Fig. 5).
Therefore, as shown in Figure 6, in the 1st invention, if the end, downstream side (the paper left side of Fig. 6) at insulant 24 is provided with and the roughly the same electrical conductor plate 31 of insulant 24 thickness, even then in the terminal of insulant 24 by after the supporting electrode 22, owing to form the closed circuit of dc voltage power supply 23-metal plate electrode 21-Continuous Flow 26a-metallic film 24a-electrical conductor plate 31-electrolytic solution 26-supporting electrode 22-dc voltage power supply 23, so also can prevent the reduction of current efficiency, and at end of downstream side kish film 24a not.Form above-mentioned closed circuitly, then the length of the electrode travel direction of electrical conductor plate 31 must be longer than the interval a of 22 of metal plate electrode 21 and supporting electrodes.
In addition, the electrode that is used for stripping adopts shown in Fig. 7 (a), be arranged alternately a plurality of negative electrodes (as metal plate electrode 21) and anode (as supporting electrode 22) electrode, or shown in Fig. 7 (b), a plurality of inboards with cylinder 32 are set is negative electrode, be the electrical conductor plate 31 roughly the same that the anodic electrode replaces the end of downstream side at insulant 24 shown in Figure 6 to be provided with the outside with insulant 24 thickness, also can play and be provided with the same effect of electrical conductor plate 31.
Shown in Fig. 7 (a) is to connect negative electrode and anodic structure with isolator 33.
Then, one of the 2nd metal foil film removing apparatus of the present invention is for example shown in Figure 8.In Fig. 8,29 is must be through the bottom-side electrodes of configuration between above-mentioned metal plate electrode 21 and the supporting electrode 22, below these two electrodes 21,22, and all the other structures are identical with example shown in Figure 3.
But, in these the 1st, the 2nd inventions, because the metallic film stripping under the anode part, and along with constantly the carrying out of stripping, the distance of anode and film strengthens, and electric current just can not flow through, stripping stops, therefore, during the surperficial broad of insulant 24, just can not all remove the metallic film 24a that forms from the teeth outwards.
Therefore, in these the 1st, the 2nd inventions, arbitrary moving structure that can move with respect to the opposing party of the insulant 24 impregnated at least in the electrolytic solution or metal plate electrode 21 is set, if remove metallic film 24a when above-mentioned insulant 24 is relatively moved with metal plate electrode 21, then can remove metallic film 24a in a big way.At this moment, in the 1st and the 2nd invention, the width of establishing metal plate electrode 21 is W (cm), and relative moving speed is V (cm/min), and electric current is I (A), preferably moves with the relative moving speed that satisfies following relation.
0.1≥I/(W×V)≥0.03
When this metal plate electrode 21 is moved with respect to the opposing party, in the 1st and the 2nd invention, for example put on anodal supporting electrode 22 and be positioned at upstream side more than the metal plate electrode 21 that puts on negative pole, that is to say, preferably supporting electrode 22 is provided with to such an extent that pass through on the metallic film 24a on insulant 24 surfaces earlier than metal plate electrode 21.
Its reason is because the electrolysis stripping is from putting on the stripping of anodal anode part, the stripping of metallic film 24a is near putting on the negative electrode of negative pole, is the cause from the metallic film 24a stripping that is positioned at metal plate electrode 21 belows as Fig. 1～Fig. 3, Fig. 5 and Fig. 6, example shown in Figure 8.In a word, if move in the other direction, then the part of metallic film 24a stripping is by between electrode, can not form previous said closed circuit, and stripping continuously.For preventing the anodic stripping, be preferably in and use carbon on the anode electrode or implement lily gilding.
In above-mentioned the 1st, the 2nd invention, make metal plate electrode 21 when insulant 24 moves, if supporting electrode 22 is fixed, moving then along with metal plate electrode 21, pole distance changes, thereby voltage-electric current changes, and can cause that the situation that can not remove metallic film 24a equably takes place.
At this moment, as shown in Figures 2 and 3,, both are moved simultaneously, just can address the above problem supporting electrode 22 and metal plate 21 configured in parallel.
In addition, in above-mentioned the 1st, the 2nd the invention, remove processing right in the middle, if electrolytic solution 26 leaks what carry out metallic film 24a, cover above the insulant 24, then the end of insulant 24 just began the electrolysis stripping before by metal plate electrode 21 or supporting electrode 22.This is because usually because interelectrode electric field (intensity of current concentration) is the strongest, just separate out between electrode, and the generation electric field is concentrated in the end that is dipped in the insulant 24 of electrolytic solution 26, reach and electrode between the cause of equal strength of electric field.
And, because the electric field of insulant 24 ends is inhomogeneous, cause that removing of metallic film 24a is also inhomogeneous, therefore in the end of insulant 24, metallic film 24a is as shown in Figure 9, and is residual with the pitted skin shape.The 24b of Fig. 9 represents with pitted skin shape metal remained film.
Even the residual part of such pitted skin shape metallic film 24b is by metal plate electrode 21, because metallic film cut off continuously at pitted skin shape position, therefore can not form previous said closed circuitly, thereby metallic film 24b is not removed and residual.
Therefore, in the 1st or the 2nd invention, approaching side at the insulant 24 of metal plate electrode 21 is provided with the member that control electrolytic solution 26 is invaded, as has the shown in Figure 10 rubber system next door 34a roughly wide with insulant 24, makes it contact the surface of insulant 24 as much as possible; Or setting has the shown in Figure 11 rubber system cylinder 34b roughly wide with insulant 24, by spring 35 it is pressed on the face side of insulant 24, like this, just can control the intrusion of 26 pairs of insulant 24 ends of early stage electrolytic solution, prevent to produce pitted skin shape metallic film 24b.The 3rd invention that Here it is.
In above-mentioned the 1st～the 3rd invention, owing to electric current flows through by electrolytic solution 26, so the electric current that flows through in the electrolytic solution 26 makes the dissolution efficiency variation of metallic film 24a.
Therefore, in the 1st～the 3rd invention, between the metal plate electrode 21 and supporting electrode 22 of insulant 24 face side, be provided with and the roughly wide insulating wall 36 of insulant 26, as shown in Figure 12, make it as much as possible to reduce the electric current that flows through in the electrolytic solution 26 like this, improve the dissolution efficiency of metallic film 24a near the surface of insulant 24.
Although above-mentioned the 1st～the 3rd invention can be removed metallic film 24a effectively under the situation of not damaging insulant 24, but owing to being that the electric current that flows through electrolytic solution 26 makes metallic film 24a stripping remove metallic film 24a, thereby also can produce the residual situation of film that residual amount is arranged because of the electrolysis stripping sometimes.
In the 1st～the 3rd invention, replace metal plate electrode 21 with revolvable electrode 37, and at the position configuration grinding base material that contacts with the metallic film 24a of this electrode 37, possessing to the position that contacts with the metallic film 24a of above-mentioned electrode 37 provides the supply mean that grinds base material.During this constitutes,, just can remove fully because of the residual film of electrolysis stripping with the nuzzle up surface of metallic film 24a of the grinding base material that is positioned at the position that contacts with the metallic film 24a of above-mentioned electrode 37.The 4th invention that Here it is.
For example, in the example shown in Figure 13, provide electrolytic solution 26 to the centre of the rotatable stick electrode 37 that has disposed grinding base material in periphery, electrolytic solution 26 is flowed out from the peripheral part of stick electrode 37 with water flowing by electrolytic bath 27.In addition, example shown in Figure 14 is the supporting electrode 22 of example shown in Figure 13 and the situation of stick electrode 37 configured in parallel; Example shown in Figure 15 is the situation that the rotatable discoid electrode 37 of the grinding base material with water flowing has been housed below having disposed, to replace stick electrode shown in Figure 13; Example shown in Figure 16 is the situation that makes supporting electrode shown in Figure 14 22 form the cylinder shape and contact with the metallic film 24a on insulant 24 surfaces; Example shown in Figure 17 is that electrolytic solution 26 is not in the inside of electrode 37 but situation about supplying with from the outside.
Above example is illustrated in the position that contacts with the metallic film 24a of electrode 37 and has disposed the situation of grinding base material, but, do not grind base material, but provide the grinding base material also passable at the position that contacts with the metallic film 24a of this electrode 37 in electrode 27 configurations.
Below, the result of implementation that carries out for affirmation effect of the present invention is illustrated.
A. the 1st inventive embodiment (one of)
(the metal plate electrode is wide: 1000mm) to use the device of removing of the 1st metallic film of the present invention of formation shown in Figure 3, under following processing conditions, implement the method for removing of the 1st metallic film of the present invention, can effectively remove evaporation on the glass substrate of 1000mm * 1000mm, thick 1000 * 10
-10The aluminium film of m, and glass substrate can utilize again.In addition, with cylinder shape supporting electrode and glass substrate with the contactless state fixed configurations, electric current becomes 300A, in addition other processing conditions is identical, implement the method for removing of the 2nd metallic film of the present invention, with above-mentioned same, can effectively remove the aluminium film of evaporation on glass substrate, and glass substrate can utilize again.
[processing conditions]
Electrolytic solution: 20%NaCl
Ejection flow: about 30 liters/min
Apply voltage: about 100V
Electric current: 150A
Glass substrate translational speed: 1m/min
B. the 1st inventive embodiment (two)
Use formation shown in Figure 3 the 1st metallic film of the present invention remove device, as shown in Figure 6, the carbon plate of same thickness is set in the terminal of the glass substrate (thick 0.7mm) of 1000mm * 1000mm, under following processing conditions, implement the method for removing of the 1st metallic film of the present invention, can effectively remove till the end evaporation on above-mentioned glass substrate 1000 * 10
-10The aluminium film that m is thick, and glass substrate can utilize again.
[processing conditions]
Electrolytic solution: 5%NaCl
Ejection flow: about 30 liters/min
Apply voltage: about 100V
Electric current: 300A
Glass substrate translational speed: 1m/min
C. the 3rd inventive embodiment (one of)
Use formation shown in Figure 10 the 3rd metallic film of the present invention remove device, under following processing conditions, implement the method for removing of the 3rd metallic film of the present invention, can effectively remove till the end evaporation on the glass substrate (thick 0.7mm) of 1000mm * 1000mm 1000 * 10
-10The aluminium film that m is thick, and glass substrate can utilize again.
[processing conditions]
Electrolytic solution: 5%NaCl
Ejection flow: about 30 liters/min
Auxiliary voltage: about 100V
Electric current: 300A
Glass substrate translational speed: 1m/min
Invade control member: rubber system next door
D. the 3rd inventive embodiment (two)
Use formation shown in Figure 12 the 3rd metallic film of the present invention remove device, under following processing conditions, implement the method for removing of the 3rd metallic film of the present invention, even translational speed improves 10% than other embodiment, also can effectively remove evaporation on the glass substrate (thick 0.7mm) of 1000mm * 1000mm 1000 * 10
-10The aluminium film that m is thick, and glass substrate can utilize again.
[processing conditions]
Electrolytic solution: 5%NaCl
Ejection flow: about 30 liters/min
Apply voltage: about 100V
Electric current: 300A
Glass substrate translational speed: 1.1m/min
Insulant next door: polyvinyl chloride system next door
E. the 4th inventive embodiment
Use formation shown in Figure 16 the 4th metallic film of the present invention remove device, under following processing conditions, implement the method for removing of the 4th metallic film of the present invention, can remove fully to noresidue evaporation on 1000mm * 1000mm glass substrate 1000 * 10
-10The aluminium film that m is thick, and glass substrate can utilize again.
[processing conditions]
Electrolytic solution: 20%NaCl
Supply flow rate: about 30 liters/min
Stick electrode rotation number: 600rpm
Abrasive abrasive particle: #3000 alumina abrasive grain (mixing supply with electrolytic solution)
Apply voltage: about 100V
Electric current: 200A
Glass substrate translational speed: 1m/min
Self-evident, the foregoing description and not exclusively corresponding all claim items, even but the invention of putting down in writing in the claim item of not enumerating as embodiment also can be removed the metallic film that forms on the insulant effectively, and can be realized the regeneration of insulant.
The possibility of utilizing in the industry
As mentioned above, the present invention does not use strong acid, the such chemical solution of highly basic, and do not need to carry out corresponding to The accurate Position Control of the electrode of the metallic film on insulant surface can in substantially non-contacting mode, not damaged Metallic film is effectively removed on insulant ground, makes the regeneration of the functional glass substrate of the high price of using in the semiconductor applications Utilization becomes possibility.
Claims (10)
1. remove the method for metallic film in the noncontact mode, it is characterized in that, the metal plate electrode of tilted configuration and the upstream that is configured in this metal plate electrode or downstream side and a part should be impregnated in the state that supporting electrode in the electrolytic solution has applied volts DS, make the electrolytic solution that flows down from above-mentioned metal plate electrode and the metallic film on insulant surface produce collision, metallic film is removed.
2. the method for claim 1, its feature also is, inner face side configuration at above-mentioned insulant must be through the bottom-side electrodes between above-mentioned metal plate electrode and the supporting electrode, this bottom-side electrodes is also applied the state of the volts DS of supporting electrode and metal plate electrode, make the electrolytic solution that flows down from above-mentioned metal plate electrode and the metallic film on insulant surface produce collision, metallic film is removed.
3. method as claimed in claim 1 or 2, its feature also are, make above-mentioned insulant and metal plate electrode remove metallic film when relatively moving.
4. method as claimed in claim 1 or 2, its feature also be, the intrusion that electrolytic solution is set at the insulant approaching side of above-mentioned metal plate electrode suppresses member, to suppress the early stage intrusion of electrolytic solution.
5. method as claimed in claim 3, its feature also be, the intrusion that electrolytic solution is set at the insulant approaching side of above-mentioned metal plate electrode suppresses member, to suppress the early stage intrusion of electrolytic solution.
6. remove the device of metallic film in the noncontact mode, it is characterized in that, constitute by the metal plate electrode that flows down, the upstream that is configured in this metal plate electrode or downstream side tilted configuration, guiding electrolytic solution and dc voltage power supply that a part should immerse the supporting electrode in the electrolytic solution and put on above-mentioned two electrodes.
7. device as claimed in claim 6, its feature also is, must pass through between above-mentioned metal plate electrode and the supporting electrode, below this two electrode, dispose bottom-side electrodes, also applying the volts DS of supporting electrode and metal plate electrode on this bottom-side electrodes by dc voltage power supply.
8. as claim 6 or 7 described devices, its feature also is, the running gear that the either party that makes the insulant that impregnated in the electrolytic solution or metal plate electrode at least moves with respect to the opposing party is set.
9. as claim 6 or 7 described devices, its feature also is, is provided with the intrusion inhibition member of electrolytic solution at the insulant approaching side of above-mentioned metal plate electrode.
10. device as claimed in claim 8, its feature also are, are provided with the intrusion inhibition member of electrolytic solution at the insulant approaching side of above-mentioned metal plate electrode.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002298947 | 2002-10-11 | ||
| JP298947/2002 | 2002-10-11 | ||
| JP336838/2002 | 2002-11-20 |
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| CN1703380A CN1703380A (en) | 2005-11-30 |
| CN1323973C true CN1323973C (en) | 2007-07-04 |
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| US9150980B2 (en) * | 2013-08-08 | 2015-10-06 | The Boeing Company | Method of removing a metal detail from a substrate |
| JP7340744B2 (en) * | 2020-02-10 | 2023-09-08 | パナソニックＩｐマネジメント株式会社 | portable electrolyzed water sprayer |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07207500A (en) * | 1994-01-18 | 1995-08-08 | Nishiyama Stainless Chem Kk | Method for regenerating glass plate and device therefor |
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Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07207500A (en) * | 1994-01-18 | 1995-08-08 | Nishiyama Stainless Chem Kk | Method for regenerating glass plate and device therefor |
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