CN1320579A - Process for preparing gallium nitride ceramics - Google Patents

Process for preparing gallium nitride ceramics Download PDF

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Publication number
CN1320579A
CN1320579A CN 01110203 CN01110203A CN1320579A CN 1320579 A CN1320579 A CN 1320579A CN 01110203 CN01110203 CN 01110203 CN 01110203 A CN01110203 A CN 01110203A CN 1320579 A CN1320579 A CN 1320579A
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China
Prior art keywords
gallium nitride
piece
nitride ceramics
sealed
high pressure
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CN 01110203
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Chinese (zh)
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CN1159262C (en
Inventor
马贤锋
洪瑞金
阎学伟
赵伟
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Changchun Institute of Applied Chemistry of CAS
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Changchun Institute of Applied Chemistry of CAS
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Priority to CNB011102039A priority Critical patent/CN1159262C/en
Publication of CN1320579A publication Critical patent/CN1320579A/en
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Publication of CN1159262C publication Critical patent/CN1159262C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Crystals, And After-Treatments Of Crystals (AREA)

Abstract

A process for preparing gallium nitride ceramic includes such steps as preparing gallium nitride powder, mixing with lithium amide, loading in ultrahigh-pressure equipment, sealing, and high-pressure sintering.

Description

The preparation method of gallium nitride ceramics
The invention belongs to the preparation method of gallium nitride ceramics.
Gan has characteristics such as good thermostability, radioresistance, thermal conductivity as a kind of wide energy gap semiconductor material.At present, gan is regarded as at blueness-the most promising photoelectric material in ultraviolet band zone in material science, also is simultaneously the good material of preparation high temperature semiconductors and high power semiconductor device.Gan is one of focus in the material field at present.Many countries have dropped into huge fund itself and relevant material, device are developed, developed.
Up to now, various countries' researcher mainly concentrates on synthetic, the crystal/growth for Thin Film and the relevant device exploitation of gan to the research interest of gan.And the preparation of relevant gallium nitride ceramics does not still have report at present both at home and abroad.This mainly is that gan at high temperature easily decomposes, and common pottery can't obtain its ceramic body.
The preparation method who the purpose of this invention is to provide a kind of gallium nitride ceramics.This method with the gallium nitride powder moulding after, assemble, be sealed in the ultra-high pressure device with Lithamide, obtain its ceramic body by the high-pressure sinter gallium nitride powder.
Because Lithamide can discharge ammonia by decomposing under proper temperature, high ammonia pressure energy suppresses gan and decomposes, and pressure can obviously reduce the sintering temperature and the sintering time of gan, and improves the density of ceramic body.The present invention with the gallium nitride powder moulding after, assemble, be sealed in the ultra-high pressure device with Lithamide, can obtain gallium nitride ceramics by sintering under the high pressure.
Preparation process of the present invention, get gallium nitride powder 2 gram/piece material, make cylindrical blocks with Φ 13 pattern tools, the piece material is placed in the middle, be chosen under the cryogenic high pressure and can decompose around it, the material Lithamide of release ammonia and hexagonal boron nitride are by weight 1: the batch mixing that the ratio of 4-10 is made is sealed in the carbon tube, and with on the carbon tube, following two ends successively with graphite flake, the titanium sheet, the conductive ring assembling, be sealed in the agalmatolite piece, the agalmatolite piece is placed the cubic apparatus ultra-high pressure device, is 500-1800 ℃ in temperature, pressure is to obtain gallium nitride ceramics through 2-60 minute sintering under the condition of 2.5-5.5Gpa.
Method of the present invention has the sintering temperature that reduces ceramic body, improves the density of product, effectively stops gan to decompose, and eliminates the characteristics such as nitrogen omission in the gan.The lattice parameter of gallium nitride ceramics and thermal expansivity and gan have good being complementary property, are expected the substrate material as growing gallium nitride.
Embodiment provided by the invention is as follows:
Embodiment 1: get gallium nitride powder 2 gram/piece material, make right cylinder with Φ 13 pattern tools, be the compound assembling of making at 1: 4 by weight, be sealed in the agalmatolite piece with Lithamide and hexagonal boron nitride, and place the cubic apparatus ultra-high pressure device.500 ℃ of temperature, pressure is 2.5GPa, through 2 minutes sintering, obtains gallium nitride ceramics.
Embodiment 2: get gallium nitride powder 2 gram/piece material, make right cylinder with Φ 13 pattern tools, be the compound assembling of making at 1: 6 by weight, be sealed in the agalmatolite piece with Lithamide and hexagonal boron nitride, and place the cubic apparatus ultra-high pressure device.Temperature is 1000 ℃, and pressure is 4.5GPa, through 20 minutes sintering, obtains gallium nitride ceramics.
Embodiment 3: get gallium nitride powder 2 gram/piece material, make right cylinder with Φ 13 pattern tools, be the compound assembling of making at 1: 10 by weight, be sealed in the agalmatolite piece with Lithamide and hexagonal boron nitride, and place the cubic apparatus ultra-high pressure device.Temperature is 1800 ℃, and pressure is 5.5GPa, through 60 minutes sintering, obtains gallium nitride ceramics.

Claims (1)

1. the preparation method of a gallium nitride ceramics, it is characterized in that getting gallium nitride powder 2 gram/piece material, make cylindrical blocks with Φ 13 pattern tools, the piece material is placed in the middle, be chosen under the cryogenic high pressure and can decompose around it, the material Lithamide of release ammonia and hexagonal boron nitride are by weight 1: the batch mixing that the ratio of 4-10 is made, be sealed in the carbon tube, and with on the carbon tube, following two ends successively with graphite flake, the titanium sheet, the conductive ring assembling, be sealed in the agalmatolite piece, the agalmatolite piece is placed the cubic apparatus ultra-high pressure device, is 500-1800 ℃ in temperature, pressure is to obtain gallium nitride ceramics through 2-60 minute sintering under the condition of 2.5-5.5Gpa.
CNB011102039A 2001-04-02 2001-04-02 Process for preparing gallium nitride ceramics Expired - Fee Related CN1159262C (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNB011102039A CN1159262C (en) 2001-04-02 2001-04-02 Process for preparing gallium nitride ceramics

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNB011102039A CN1159262C (en) 2001-04-02 2001-04-02 Process for preparing gallium nitride ceramics

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CN1320579A true CN1320579A (en) 2001-11-07
CN1159262C CN1159262C (en) 2004-07-28

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CNB011102039A Expired - Fee Related CN1159262C (en) 2001-04-02 2001-04-02 Process for preparing gallium nitride ceramics

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101928145A (en) * 2010-06-01 2010-12-29 上海玻璃钢研究院有限公司 Preparation method of superfine and high-purity gamma-ALON transparent ceramics powder
CN103178154A (en) * 2012-09-28 2013-06-26 吉林大学 High-pressure production method of high-density single-tetragon CZTS (copper zinc tin sulfide) material

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101928145A (en) * 2010-06-01 2010-12-29 上海玻璃钢研究院有限公司 Preparation method of superfine and high-purity gamma-ALON transparent ceramics powder
CN103178154A (en) * 2012-09-28 2013-06-26 吉林大学 High-pressure production method of high-density single-tetragon CZTS (copper zinc tin sulfide) material
CN103178154B (en) * 2012-09-28 2015-11-25 吉林大学 The high pressure method for preparing of a kind of high densification, single tetragonal copper-zinc-tin-sulfur material

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CN1159262C (en) 2004-07-28

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