CN1319084C - Method for controlling electronic device powder packaging apparatus - Google Patents
Method for controlling electronic device powder packaging apparatus Download PDFInfo
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- CN1319084C CN1319084C CNB2005100963077A CN200510096307A CN1319084C CN 1319084 C CN1319084 C CN 1319084C CN B2005100963077 A CNB2005100963077 A CN B2005100963077A CN 200510096307 A CN200510096307 A CN 200510096307A CN 1319084 C CN1319084 C CN 1319084C
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Abstract
The present invention relates to a method for controlling electronic device powder packaging apparatuses. According to the technological requirement for electronic device packaging, a flow control unit enables insulation powder to reach a uniform and loose state, and the insulation powder waits for the powder dipping of the electronic device; then, powder dipping parameters are set according to the technological requirement for packaging, a control unit of a power dipping mechanism enables the electric device arranged on the power dipping mechanism to be inserted into the insulation powder of a powder fluid bed to dip powder When the set powder dipping parameters for powder packaging are satisfied, the electronic device enters a heating and thermal insulation mechanism to flat and fuse the insulation powder at the surface of the electronic device. The present invention controls the powder fluid bed mechanism by the flow control unit to ensure the fluidized uniformity of the insulation powder, enhances the powder dipping uniformity and the consistency of the electronic device, accurately controls the movement of the powder dipping mechanism by the control unit of the powder dipping mechanism, and reduces the dissipation of the preheating temperature in the process of the movement of the electronic device.
Description
Technical field
The present invention relates to a kind of control method of powder packaging apparatus, particularly a kind of control method of electronic component powder packing apparatus.
Background technology
The powder encapsulating technology is a kind of hot coating technology, it is by the fluidized bed coating method insulating powder to be coated on the pre-warmed electronic devices and components, again by heating to element, make insulating powder be deposited over the outer surface of element, form layer of even insulation paint film, the insulating coating of this moment does not also have due insulation and mechanical strength, will apply good element again through further heating, carry out 1～2 hour cured, just form the firm insulating barrier of one deck on the surface of electronic devices and components.
Electronic devices and components mainly contain ceramic capacitor, book membrane capacitance, mica condenser, monolithic capacitor, tantalum electric capacity, varistor, network resistor, PTC, NTC, inductor etc., and they must pass through insulation-encapsulated.The powder encapsulating technology of electronic devices and components, owing to have solvent-free, pollution-free, excellent electrical properties, packaging efficiency height, be easy to realize characteristic such as large-scale production, in the production field of various electronic devices and components, replaced traditional liquid encapsulation technology, and powder packaging apparatus is exactly its critical equipment.
In the electronic component powder packing process, the powder mode of soaking of powder fluidized state, electronic devices and components etc. is directly connected to the quality of sealing back electronic devices and components electric property.The quality of insulating powder fluidized state is directly connected to the uniformity that insulating powder distributes on the one hand, is only guaranteeing could to guarantee the uniformity that electronic devices and components are sealed under the uniform prerequisite of insulating powder; On the other hand, the control of soaking the powder mode directly has influence on the electronic devices and components pin and seals the precision of height and the solderability of consistency and electronic devices and components.
Traditional fluid bed control technology is not too high because control procedure is accurate inadequately to different insulative powder fluidization control precision, has influenced insulation and has sealed the fluidised uniformity coefficient of powder; Soak powder mechanism for electronic component powder packing apparatus, on the one hand, traditional accurate control that powder mechanism is difficult to guarantee to soak powder mechanism of soaking by the pneumatic mechanism driving, main on the other hand problem are that the single powder mechanism controls technology of soaking can't solve the conforming contradiction of precision that preheat temperature is scattered and disappeared and the electronic devices and components pin is sealed in the electronic devices and components motion process.Fluid bed and the technical problem of soaking the existence of powder mechanism controls aspect all make the quality of sealing of electronic devices and components descend, thereby cause the performance decrease of electronic devices and components.
Summary of the invention
The objective of the invention is to overcome the shortcoming of above-mentioned prior art, provide a kind of electronic devices and components that both guaranteed to soak the uniformity and the consistency of powder, guaranteed again that the electronic devices and components pin soaks the precision and the consistency of powder, improved the control method that electronic devices and components are sealed the electronic component powder packing apparatus of quality.
For achieving the above object, the technical solution used in the present invention is: at first according to the technological requirement of sealing of electronic devices and components, flow controlling unit is set the fluidisation parameter of insulating powder, start flow controlling unit control low pressure choke valve and high pressure choke valve and make pressure work under 0.4MPa～06MPa, the fluidisation of process 10s～30s makes insulating powder reach full and uniform fluidized state;
During the requiring of the parameter of satisfy setting when insulating powder fluidisation parameter, close high pressure choke valve [9] by break valve [12], flow controlling unit [11] control low pressure choke valve [10] makes pressure work under 0.01MPa～0.1MPa, and making the normal density through fluidisation is 0.6g/cm
3～0.8g/cm
3Insulating powder to become density be 0.3g/cm
3～0.4g/cm
3The insulating powder of even rarefaction, wait for the powder that soaks of electronic devices and components;
The powder encapsulating of setting according to the technological requirement sealed soaks the powder parameter then, detect to soak the position of powder mechanism and testing result fed back to by the displacement signal processing unit by null pick-up and soak powder mechanism controls unit, be in zero-bit if soak powder mechanism, then soak the operation of powder mechanism by soaking powder mechanism controls unit starting;
Soak powder mechanism and move to the buffer sensor position, soak powder mechanism kinematic control unit and send instruction, control is soaked powder mechanism and is moved to down the buffer sensor position fast, control is afterwards soaked powder mechanism and is run slowly, make in the insulating powder that is installed in the electronic devices and components insertion fluidized powder bed mechanism of soaking in the powder mechanism and soak powder, when the powder encapsulating that satisfies setting soaked the powder parameter, electronic devices and components entered levelling in heating and the heat preservation mechanism, the insulating powder on fusion electronic devices and components surface.
The present invention is according to the encapsulating process requirement of electronic devices and components, and mechanism has guaranteed the fluidised uniformity of insulating powder by flow controlling unit control fluidized powder bed, has improved uniformity and consistency that electronic devices and components soak powder; Realized soaking the accurate control of powder mechanism kinematic by soaking powder mechanism controls unit, reduced the scattering and disappearing of preheat temperature of electronic devices and components motion processes, and cause that owing to electronic devices and components insert the fluid bed excessive velocities element pin hangs the technical barrier that powder influences the element solderability, improved the quality of sealing of electronic devices and components.
Description of drawings
Fig. 1 is the composition structure chart of powder packaging apparatus;
Fig. 2 is the process chart that electronic devices and components are sealed;
Fig. 3 is the structure principle chart of flow controlling unit 11 of the present invention;
Fig. 4 is the control flow chart of flow controlling unit 11 of the present invention;
Fig. 5 is the control principle figure that the present invention soaks the powder mechanism kinematic;
Fig. 6 is the control flow chart that the present invention soaks the powder mechanism kinematic.
Embodiment
Below in conjunction with accompanying drawing the present invention is described in further detail.
Referring to Fig. 1, powder packaging apparatus comprises heating and heat preservation mechanism 1, soaks powder mechanism 2, fluidized powder bed mechanism 3, control and actuator 4, source of the gas 5, power supply 6.Heating is the heating electronic devices and components with the effect of heat preservation mechanism 1 on the one hand, is to make insulating powder evenly be deposited over the outer surface of electronic devices and components on the other hand; The effect of soaking powder mechanism 2 is to make to be loaded on the framework, to enter in the fluid-bed of fluidized powder bed mechanism 3 through the electronic devices and components of preheating, makes insulating powder be coated in the outer surface of electronic devices and components equably; The effect of fluidized powder bed mechanism 3 is to load insulating powder and equipment that the powder fluidisation is provided and the environment that electronic component powder packing is used; Control with actuator 4 and comprise flow controlling unit 11 and soak 18 two parts in powder mechanism controls unit: flow controlling unit 11 is control air-flows, and its effect is to make the insulating powder in the fluid-bed of fluidized powder bed mechanism 3 be in even fluidized state and even rarefaction; Soaking powder mechanism controls unit 18 is electrical controls, and its effect is that the control electronic devices and components are sealed (comprise and soak powder, fluidisation, insulation etc.), realizes the automation of electronic devices and components encapsulating process; The effect of power supply 5 is to provide electric power to supply with to the powder encapsulating machine; The effect of source of the gas 6 is that the fluidisation to powder provides air-flow.
Referring to Fig. 2, at first set the encapsulating process parameter of electronic devices and components, with the framework that loads electronic devices and components be placed on preheat in heating and the heat preservation mechanism 1 after; By the fluidized powder bed mechanism 3 of packaging apparatus, make the abundant fluidisation of powder and evenly loose to satisfy the requirement that electronic devices and components are sealed; What start powder packaging apparatus soaks powder mechanism 2, makes in the fluid-bed that is loaded on the framework, inserts through the electronic devices and components of preheating fluidized powder bed mechanism 3 from top to bottom electronic devices and components are soaked powder; When reach electronic devices and components regulations seal parameter after, the frame movement of sealing that is loaded with electronic devices and components is carried out levelling to heating and heat preservation mechanism 1, in baking oven, solidified again 1～2 hour afterwards, can finish the overall process that the electronic devices and components insulation is sealed.
Referring to Fig. 3, the fluidization control of insulating powder of the present invention is to realize by the air-flow in the fluid-bed of control inflow fluidized powder bed mechanism 3, the size of air-flow relies on the adjusting of choke valve to finish, flow controlling unit 11 comprises the filter 7 that is connected with source of the gas 5, pressure-reducing valve 8, high pressure choke valve 9, low pressure choke valve 10, break valve 12, the effect of its middle filtrator 7 is that to guarantee to enter the gas of fluidized powder bed mechanism 3 be clean gas, the effect of pressure-reducing valve 8 makes and reduces the amount of gas pressure that enters fluidized powder bed mechanism 3, high pressure choke valve 9, the effect of low pressure choke valve 10 is the requirements according to different powder fluid technologies, jointly control the throughput that enters in the fluidized powder bed mechanism 3 with flow controlling unit 11, the effect of stop valve 12 is to open/close high pressure choke valve 9.
Referring to Fig. 4, concrete air-flow control flow is: the fluidisation parameter of at first setting insulating powder by flow controlling unit 11, start flow controlling unit 11 afterwards, make pressure work at 0.4MPa～0.6MPa state by high pressure choke valve 9, the full and uniform fluidisation of insulating powder; When powder fluidisation parameter satisfies, make the little stream condition of pressure work by 10 controls of low pressure choke valve at 0.01MPa～0.1Mpa, it is 0.3g/cm that insulating powder is in density
3～0.4g/cm
3Relatively evenly rarefaction, wait for the powder process of soaking of electronic devices and components.
Referring to Fig. 5, the powder mechanism controls unit 18 that soaks of the present invention realizes that by the information fusion technology of a plurality of transducers wherein transducer comprises null pick-up 13, goes up buffer sensor 14, middle level sensor 15 and following buffer sensor 16.These displacement signals reach displacement signal processing unit 17, through displacement signal processing unit 17, output to and soak powder mechanism controls unit 18, send the motion that commands for controlling is soaked powder mechanism 2, comprise and soak powder motion of mechanism direction and movement velocity by soaking powder mechanism controls unit 18.
Referring to Fig. 6, the control procedure that electronic component powder packing soaks the powder process is: at first soak the powder parameter by what soak that powder mechanism controls unit 18 sets powder encapsulatings, and detect to soak the position of powder mechanism 2 and send into by null pick-up 13 and soak powder mechanism controls unit 18 by the signal that displacement signal processing unit 17 obtains detection, be in zero-bit if soak powder mechanism 2, then start and soak 2 slow runnings of powder mechanism, move to buffer sensor 14 positions, displacement signal processing unit 17 will be gone up signal that buffer sensor 14 detects and send into and soak powder mechanism controls unit 18, send instruction by soaking powder mechanism controls unit 18, the position that powder mechanism 2 moves to down buffer sensor 16 is fast soaked in control, control is afterwards soaked powder mechanism 2 and is run slowly, soak powder in the insulating powder of electronic devices and components insertion fluidized powder bed mechanism 3, when satisfy to set soak the powder parameter time, electronic devices and components enter in heating and the heat preservation mechanism 1 and carry out levelling, the insulating powder on fusion electronic devices and components surface.The present invention adopt multi-sensor information fusion technology electronic component powder packing apparatus soak powder mechanism, can reduce on the one hand electronic devices and components the scattering and disappearing of heat in motion process, can also prevent that on the other hand electronic devices and components from inserting the excessive velocities of insulating powder, cause the insulating powder sputter, thereby the solderability of precision that the pin that influences electronic devices and components is sealed and consistency and pin improves the quality that electronic devices and components are sealed.
The present invention has high and low two independently air-flow air pressure controls separately in automatic powder fluid mapper process.Wherein hyperbar makes that insulating powder is in the homogeneous fluidization state in the fluid-bed, and low pressure then makes fluid bed be in relative static conditions, and insulating powder is in even rarefaction, and the little stream condition of low pressure remains in whole encapsulation process.
Adopt multi-sensor information fusion technology, the powder motion of mechanism is soaked in control stage by stage, has both solved the lost problem of electronic devices and components preheat temperatures, has overcome the sputter of soaking insulating powder in the powder process again and the technical barrier that influences the electronic devices and components solderability.
Claims (1)
1, a kind of control method of electronic component powder packing apparatus is characterized in that:
1) at first according to the technological requirement of sealing of electronic devices and components, flow controlling unit [11] is set the fluidisation parameter of insulating powder, start flow controlling unit [11] control low pressure choke valve [10] and high pressure choke valve [9] and make pressure work under 0.4MPa～0.6MPa, the fluidisation of process 10s～30s makes insulating powder reach full and uniform fluidized state;
2) during the requiring of the parameter of satisfy setting when insulating powder fluidisation parameter, close high pressure choke valve [9] by break valve [12], flow controlling unit [11] control low pressure choke valve [10] makes pressure work under 0.01MPa～0.1MPa, and making the normal density through fluidisation is 0.6g/cm
3～0.8g/cm
3Insulating powder to become density be 0.3g/m
3～0.4g/cm
3The insulating powder of even rarefaction, wait for the powder that soaks of electronic devices and components;
3) powder encapsulating of setting according to the technological requirement sealed then soaks the powder parameter, detect to soak the position of powder mechanism [2] and testing result fed back to by displacement signal processing unit [17] by null pick-up [13] and soak powder mechanism controls unit [18], be in zero-bit if soak powder mechanism [2], then soak powder mechanism [2] operation by soaking powder mechanism controls unit [18] startup;
4) soak powder mechanism [2] and move to buffer sensor [14] position, soak powder mechanism kinematic control unit [18] and send instruction, control is soaked powder mechanism [2] and is moved to down buffer sensor [16] position fast, control is afterwards soaked powder mechanism [2] and is run slowly, make in the insulating powder that is installed in the electronic devices and components insertion fluidized powder bed mechanisms [3] of soaking in the powder mechanism [2] and soak powder, when the powder encapsulating that satisfies setting soaks the powder parameter, electronic devices and components enter heating and the middle levelling of heat preservation mechanism [1], the insulating powder on fusion electronic devices and components surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100963077A CN1319084C (en) | 2005-11-07 | 2005-11-07 | Method for controlling electronic device powder packaging apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100963077A CN1319084C (en) | 2005-11-07 | 2005-11-07 | Method for controlling electronic device powder packaging apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1801416A CN1801416A (en) | 2006-07-12 |
| CN1319084C true CN1319084C (en) | 2007-05-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100963077A Expired - Fee Related CN1319084C (en) | 2005-11-07 | 2005-11-07 | Method for controlling electronic device powder packaging apparatus |
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| Country | Link |
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| CN (1) | CN1319084C (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109935534B (en) * | 2017-12-19 | 2024-01-09 | 昆山万盛电子有限公司 | Short-wave infrared heating type powder encapsulation machine and heating control method |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5710369A (en) * | 1980-06-19 | 1982-01-19 | Matsushita Electric Ind Co Ltd | Fluidization dip painting method |
| CN2107951U (en) * | 1990-05-10 | 1992-06-24 | 西安交通大学 | Electrostatic powder packaging apparatus for electronic elements and devices |
-
2005
- 2005-11-07 CN CNB2005100963077A patent/CN1319084C/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5710369A (en) * | 1980-06-19 | 1982-01-19 | Matsushita Electric Ind Co Ltd | Fluidization dip painting method |
| CN2107951U (en) * | 1990-05-10 | 1992-06-24 | 西安交通大学 | Electrostatic powder packaging apparatus for electronic elements and devices |
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|---|---|
| CN1801416A (en) | 2006-07-12 |
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Granted publication date: 20070530 Termination date: 20111107 |