CN1309284C - Electric circuit base board assembling body - Google Patents
Electric circuit base board assembling body Download PDFInfo
- Publication number
- CN1309284C CN1309284C CNB2004100082883A CN200410008288A CN1309284C CN 1309284 C CN1309284 C CN 1309284C CN B2004100082883 A CNB2004100082883 A CN B2004100082883A CN 200410008288 A CN200410008288 A CN 200410008288A CN 1309284 C CN1309284 C CN 1309284C
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- Prior art keywords
- circuit substrate
- sheet metal
- circuit
- conductor
- installation portion
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- 239000002184 metal Substances 0.000 claims abstract description 107
- 229910052751 metal Inorganic materials 0.000 claims abstract description 107
- 239000000758 substrate Substances 0.000 claims description 201
- 150000002739 metals Chemical class 0.000 claims description 32
- 239000004020 conductor Substances 0.000 abstract description 21
- 239000000126 substance Substances 0.000 abstract 2
- 238000009434 installation Methods 0.000 description 49
- 238000005476 soldering Methods 0.000 description 25
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 14
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 11
- 239000011159 matrix material Substances 0.000 description 10
- 230000000694 effects Effects 0.000 description 8
- 150000004696 coordination complex Chemical class 0.000 description 4
- 229910000906 Bronze Inorganic materials 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 239000010974 bronze Substances 0.000 description 3
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical group [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229920003002 synthetic resin Polymers 0.000 description 3
- 239000000057 synthetic resin Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 230000004927 fusion Effects 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000010935 stainless steel Chemical group 0.000 description 1
- 229910001220 stainless steel Chemical group 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
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- Combinations Of Printed Boards (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
Provided is a circuit board assembly in which a first circuit board and a second circuit board are electrically and mechanically connected stably and firmly in an inexpensive and simple structure. A plurality of elongated conductor strips are provided for making electrical connection between conductor patterns formed on respective surfaces of the first and the second circuit boards. Specifically, each of the elongated conductor strips is made of a metal sheet having a spring characteristic and is bent in a prescribed shape. One end of each elongated conductor strip is positioned almost parallel to the surface of the first circuit board and is fixed to the conductor pattern of the first circuit board by a prescribed electrical conductor substance, while the other end is positioned almost parallel to the surface of the second circuit board and is fixed to the conductor pattern by the prescribed conductor substance, to mutually fix the first and the second circuit boards electrically and mechanically.
Description
Technical field
The present invention relates to and has the 1st circuit substrate and the 2nd circuit substrate and the circuit substrate assembling body to being electrically connected with a plurality of sheet metals of curved shape each other at the surperficial formed circuit of each circuit substrate.
Background technology
The 2nd circuit substrate is erected be configured on the 1st circuit substrate, with the occasion that these the 1st and the 2nd circuit substrates are electrically connected, generally use flat cable, FPC (pliability printed base plate; FlexiblePrinted Circuits), union piece such as base-plate terminal, angle pin.Flat cable and base-plate terminal, union pieces such as angle pin fixing to circuit substrate that also has hook-type, as disclosing in the Japanese patent laid-open 7-326860 communique, be to pass the Connection Element that is arranged on the circuit substrate by leading section the through hole of usefulness is installed, these ends carried out in the rear side of described circuit substrate and the conductor portion of regulation (portion of terminal) soldering realizes the lead terminal of the heart yearn of flat cable and base-plate terminal even angle pin.In addition, in Japanese patent laid-open 9-83132 communique, disclosed utilize the lead terminal that is bent to form multistage clamp circuit substrate, with the described lead terminal technology of soldering on 2 circuit substrates respectively.
But, as mentioned above, when being fixed in Connection Element on the circuit substrate, need on circuit substrate, to offer in advance through hole.And, need to pass the heart yearn of Connection Element of described through hole and lead terminal etc. and carry out soldering with the rear side of circuit substrate.Therefore, existence can't be used for the rear side of circuit substrate the problem of other purposes effectively.
This respect can be considered by the heart yearn of flat cable and the conductor portion of FPC are directly carried out soldering with the conductor portion (portion of terminal) that is arranged on the face side of circuit substrate, to be electrically connected.But the mechanical strength of flat cable and FPC is low, for example, need utilize the mechanical type support accessory of L type corner member etc. to fix carrying out mechanical stability between the 1st and the 2nd circuit substrate.And, for this kind L type corner member is fixed on the circuit substrate, for example, need to utilize the through hole that is arranged on the circuit substrate that L type corner member is carried out screw.Thereby, still through hole need be set on circuit substrate, the same problem that exists effective utilization of circuit substrate rear side.
In addition, the lead terminal that is bent to form multistage has the structure (curved shape) that the end of circuit substrate is sandwiched the one end.Therefore, according to the thickness of applied circuit substrate, need prepare the different multiple lead terminal of its curved shape respectively.And there is the high problem of cost of parts in the warp architecture complexity of lead terminal itself.
Summary of the invention
The present invention makes in order to address the above problem, its purpose is, provide a kind of and be located on the 1st circuit substrate the 2nd circuit substrate is upright, can stably these the 1st and the 2nd circuit substrates be carried out the circuit substrate assembling body of electric and mechanical connection, cheapness and simple structure.
In order to achieve the above object, the invention provides a kind of circuit substrate assembling body, have the 1st circuit substrate and the 2nd circuit substrate, and utilize a plurality of sheet metals be curved shape that the surperficial formed circuit at each circuit substrate is electrically connected each other to form, wherein, the 1st end of described sheet metal is fixed on the circuit of described the 1st circuit substrate, the 2nd end is fixed on the circuit of described the 2nd circuit substrate, be formed with the gap between described the 1st circuit substrate and described the 2nd circuit substrate, and be configured to the 1st end of described sheet metal and the mid portion between the 2nd end, and make described mid portion deviate from the described the 1st and the 2nd circuit substrate respectively and play a role as spring portion by this gap.
Adopt the circuit substrate assembling body of structure like this, as long as the two ends of sheet metal are individually fixed on the circuit of above-mentioned each circuit substrate (that is, mounted on surface), so need on circuit substrate, not offer through hole.Therefore, do not need rear side with circuit substrate to be used for the fixing of above-mentioned sheet metal etc., thereby can be effectively the rear side of this circuit substrate be applied to other purposes.In addition, the effect of sheet metal rubber-like, even thereby the 2nd circuit substrate with respect to the setting angle of the 1st circuit substrate deviation is slightly arranged, utilize the deflection of sheet metal can easily realize electric and mechanical connection stable between the 1st and the 2nd circuit substrate.In addition, can flexibly bear the mechanical distortion that puts between the 1st and the 2nd circuit substrate by the deflection of rubber-like sheet metal.Therefore, can improve the mechanical support intensity of the 1st circuit substrate to the 2nd circuit substrate.
And, utilize the gap that between the surface of the end of the 1st circuit substrate and the 2nd circuit substrate, is provided with that sheet metal is set, the length of described sheet metal is prolonged, can improve the effect of sheet metal as spring.Its result can make the surf zone of the limited size of the 1st circuit substrate utilize effectively, can improve the packing density of various parts.
According to a second aspect of the invention, a kind of circuit substrate assembling body is provided, have the 1st circuit substrate and the 2nd circuit substrate, and utilize a plurality of sheet metals be curved shape that the surperficial formed circuit at each circuit substrate is electrically connected each other to form, wherein, the 1st end of described sheet metal is fixed on the circuit of described the 1st circuit substrate, the 2nd end is fixed on the circuit of described the 2nd circuit substrate, described a plurality of sheet metal is leaving under the state that is spaced setting mutually, by the supporting of the supporting mass of electric insulating quality, this supporting mass is positioned in the gap that forms between described the 1st circuit substrate and described the 2nd circuit substrate and the 1st and the 2nd end of described sheet metal is separately fixed on the described the 1st and the 2nd circuit substrate.
In addition, many sheet metals are arranged in parallel, on the insulating properties supporting mass at position beyond the both ends that cover each sheet metal, grooving are set in advance, be preferably made the structure of utilizing this grooving position the sheet metal of each stated number can be cut.Such structure utilizes grooving easily above-mentioned supporting mass to be cut off in the orientation of a plurality of sheet metals.Therefore, can regulate the sheet metal number that is supported the body supporting according to the connection specification of circuit substrate etc., so can improve the convenience of its use.
And the surface that is preferably in the 1st circuit substrate is provided with the support of concavity in advance, and the end of the 2nd circuit substrate is embedded in the support of this concavity, makes the 2nd circuit substrate and stands in state on the 1st circuit substrate.Make structure like this, can easily carry out at least one side in the 1st and the 2nd circuit substrate and the soldering operation of sheet metal.
Adopt the present invention of above explanation, need on the 1st circuit substrate, not offer the through hole of union piece installation usefulness etc.Therefore, the end of sheet metal etc. can be outstanding to the rear side of circuit substrate by through hole, so can be effectively the rear side of each circuit substrate be applied to other purposes.
In addition, the length of sheet metal is prolonged, can improve the effect of sheet metal, utilize the deflection of sheet metal can absorb by the circuit substrate externally applied forces as spring.Therefore, can alleviate the distortion of the connecting portion that acts on sheet metal and circuit substrate, and prevent that reliably it from peeling off.Its result has and can be stably will carry out electric and mechanical fixed between the 1st and the 2nd circuit substrate, simultaneously the surf zone of the limited size of the 1st circuit substrate be utilized effectively, can improve the such excellent results of packing density of various parts.
In addition, simple in structure because of it, can realize at an easy rate, so also be very big in industrial advantage.
Description of drawings
Fig. 1 is that the circuit substrate of expression example 1 of the present invention is assembled the stereogram of the summary structure of body.
Fig. 2 is the end view of expression circuit substrate assembling body shown in Figure 1.
Fig. 3 is that expression circuit substrate shown in Figure 1 is assembled the stereogram of the summary structure of the composite conductor sheet sheet metal that uses in the body.
Fig. 4 is that expression is assembled the stereogram that transversely arranged one-tenth 1 row of a plurality of sheet metals that use in the body are imbedded the example of the union piece in the matrix with the circuit substrate of example 2 of the present invention.
Fig. 5 is the stereogram that the example of the union piece in the matrix is imbedded transversely arranged one-tenth 2 row of a plurality of sheet metals that use in the circuit substrate assembling body of the present invention in expression.
Fig. 6 is the cutaway view of major part of the relation of the variation of the union piece that uses in the expression circuit substrate of the present invention assembling body and circuit substrate.
Fig. 7 is the stereogram of other examples of the expression union piece of a plurality of sheet metals that use in the circuit substrate of the present invention assembling body being imbedded matrix.
Fig. 8 is that expression circuit substrate of the present invention is assembled the figure of the variation of the sheet metal that uses in the body.
Embodiment
Below, describe with reference to the circuit substrate assembling body of accompanying drawing example of the present invention.
[example 1]
Fig. 1 is the stereogram of summary structure of the circuit substrate assembling body of expression example 1, and 10 is the 1st circuit substrates, the 20th, on the 1st circuit substrate 10, erect the 2nd circuit substrate of setting.These the 1st and the 2nd circuit substrates 10,20, be with have the conductor layer of pasting Copper Foil etc. on the flat substrate surface of electric insulating quality carry out etching form allocated circuit conductor fig, be so-called printed circuit board (PCB).Circuit substrate assembling body is to carry out electric to these the 1st and the 2nd circuit substrates 10,20 and mechanical connection is realized by the sheet metal 1 that describes below utilizing.
The sheet metal 1 of the elongated shape that uses in being connected and fixed of these the 1st and the 2nd circuit substrates 10,20, for example, the plate by the elongated shape that will be made of phosphor bronze or stainless steel forms to the shape that its thickness of slab direction bends to regulation.Especially, sheet metal 1, have substantial middle portion at length direction is bent into the shape of roughly L font from the bend 1a of approximate right angle to its thickness of slab direction, have and to clip lip-deep 1st the installation portion 1b of a pair of both ends soldering of described bend 1a at described the 1st circuit substrate 10, soldering structure at lip-deep the 2nd the installation portion 1c of the 2nd circuit substrate 20.
Specifically, assemble in the end view of body at the circuit substrate of Fig. 2, shown in the curved shape of sheet metal 1, the sheet metal 1 of elongated shape has the bend 1a that bends to approximate right angle in the substantial middle portion of its length direction with forming circular arc.Then, will extend and the end of the side that is connected with the 1st circuit substrate 10 is bent to form the 1st step 1d a little towards the outside to a side from this bend 1a, and have by the 1st stage portion 1d be provided with the shape of above-mentioned the 1st installation portion 1b.Then, with the 1st installation portion 1b soldering during the 1st circuit substrate 10 surperficial (when face is installed), make formation predetermined gap d1 between the surface of above-mentioned bend 1a and above-mentioned the 1st circuit substrate 10.
In addition, the position between described installation portion 1c and the 1st stage portion 1d becomes towards the deflection division with specific length of the face direction deflection of the 1st circuit substrate 10.This deflection division has the effect of leaf spring.
On the other hand, extend round about and the end of the side that is connected with the 2nd circuit substrate 20, form inwards the 2nd stage portion 1e of bending a little, the 2nd installation portion 1c is set by the 2nd stage portion 1e from above-mentioned bend 1a.Then, when soldering is carried out on the surface (rear side) of the 2nd installation portion 1c and the 2nd circuit substrate 20 (when face is installed), form predetermined gap d2 between the back side of above-mentioned bend 1a and above-mentioned the 2nd circuit substrate 20.
Utilize the electric and mechanical connection between the above-mentioned the 1st and the 2nd circuit substrate 10,20 of sheet metal 1 of structure like this (curved shape), for example shown in the end view of Fig. 2, above-mentioned the 1st the installation portion 1b with sheet metal 1 locatees on the surface of the regulation conductor fig (not shown) that forms the 1st circuit substrate 10 abreast earlier.Then, utilize regulation conducting objects, specifically utilize scolding tin respectively the 1st installation portion 1b to be fixed on the portion of terminal (not shown) of conductor fig set on the surface of the 1st circuit substrate 10.
Then, with the 2nd circuit substrate 20 from the top of the deflection division of sheet metal 1 with respect to the 1st circuit substrate 10 approximate right angle and and the surface of above-mentioned the 1st circuit substrate 10 between form under the state of specified gap S and position.Then, the sheet metal 1 that is fixed in the 1st circuit substrate 10 passes through from the lower end side of the 2nd circuit substrate 20, is directed to the rear side of the 2nd circuit substrate 20.Promptly, form gap S between the end of the surface of the 1st circuit substrate 10 and the 2nd circuit substrate 20, above-mentioned the 2nd circuit substrate 20 is configured in the top of above-mentioned the 1st circuit substrate 10 so that be positioned at the face installation portion 1c and the deflection division in the middle of the face installation portion 1b of sheet metal 1 and passes through above-mentioned gap S.Under this state, location, surperficial almost parallel ground with the rear side of the 2nd installation portion 1c of above-mentioned sheet metal 1 and above-mentioned the 2nd circuit substrate 20 utilizes soldering that the 2nd installation portion 1c is fixed on the portion of terminal (not shown) of conductor fig set on the surface of the 2nd circuit substrate 20.
That is, abreast along the portion of terminal surface that is separately positioned on the conductor fig on each circuit substrate 10,20, (face installation portion 1b, 1c) carries out soldering with the portion of terminal of conductor fig respectively with these ends with the end (face installation portion 1b, 1c) of sheet metal 1.Here, with the such solid form of sheet metal 1, be called mounted on surface (face installation) is carried out with respect to circuit substrate 10,20 in the end of sheet metal 1 with respect to circuit substrate 10,20.
In example shown in Figure 1,10 identical shaped sheet metals 1 have been represented to utilize, the example that the 1st circuit substrate 10 and the 2nd circuit substrate 20 are connected and fixed.These a plurality of sheet metals 1, for example, as shown in Figure 3, can be that the leading section with the 1st installation portion 1b is connected with the matrix 2 of the wide cut that becomes its base portion respectively, the sheet metal complex 4 that forms is set broach shape ground abreast, provide with this with the interval many (for example 10) of regulation.
Such sheet metal complex 4 at first, will be processed into the graphics shape of regulation as the phosphor bronze thin plate stamping-out of its material, and be formed on wide cut matrix 2 edge portion broach shape be provided with the board member of a plurality of sheet metals 1.Then, the zone each sheet metal 1, that should become above-mentioned installation portion 1a, 1c of this board member implement as required gold-plated after, by punch process the ground bending of the central portion approximate right angle of the length direction of each sheet metal 1 is made.
Connection between the 1st and the 2nd circuit substrate 10,20 of a plurality of sheet metals (union piece) 1 that provide as sheet metal complex 4 has been provided, at first, the 1st installation portion 1b of one side that will be connected with matrix 2 carries out soldering with the not shown conductor fig portion (circuit) of the 1st circuit substrate 10 respectively with above-mentioned the 1st installation portion 1b respectively abreast behind location on the assigned position of the 1st circuit substrate 10.Then, cut off the connecting portion of the leading section of above-mentioned matrix 2 and the 1st installation portion 1b, a plurality of sheet metals 1 are cut respectively and separate from above-mentioned matrix 2.But, be installed in state on the 1st circuit substrate 10 because many sheet metals 1 have been in face respectively, thereby the ordered state of these many sheet metals 1 can be kept former state.
Then, as mentioned above, should on the 1st circuit substrate 10, found the assigned position that the 2nd circuit substrate 20 location of establishing are arranged on this circuit substrate 10.The 2nd installation portion 1c of above-mentioned each sheet metal 1 distinguished soldering in the not shown conductor fig portion (circuit) of the 2nd circuit substrate 20.Thus, each sheet metal 1 face respectively is installed on the surface of the 2nd circuit substrate 20, as shown in Figure 1, realize utilizing many sheet metals 1 the 1st circuit substrate 10 and upright the 2nd circuit substrate 20 that is located on the 1st circuit substrate 10 to be carried out the circuit substrate assembling body of the structure of electric and mechanical connection.
So circuit substrate is assembled body, as long as with the both ends (face installation portion 1b, 1c) of a plurality of sheet metals 1 with respect to the 1st circuit substrate 10 and upright the 2nd circuit substrate 20 that is located on the 1st circuit substrate 10, face is installed in the surface of each circuit substrate 10,20 respectively, just can the above-mentioned the 1st and the 2nd circuit substrate 10,20 stably be carried out electric and mechanical connection by many sheet metals 1.And, each sheet metal 1, as mentioned above, has effect as spring, thereby, even the setting angle of the 2nd circuit substrate 20 has deviation slightly, utilize the deflection of sheet metal 1 stably the 2nd circuit substrate 20 mechanically to be bearing on the 1st circuit substrate 10, and can be electrically connected reliably between these circuit substrates 10,20.
Especially as shown in Figure 2, fixing respectively (face installations) in the 1st and the 2nd installation portion 1b, 1c zone in addition of the 1st and the 2nd circuit substrate 10,20, promptly, comprise that the zone of the bend 1a between above-mentioned stage portion 1d, the 1e leaves the 1st and the 2nd circuit substrate 10,20 respectively.Especially be configured in to the deflection division deflection of sheet metal 1 in the gap between the bottom of the surface of the 1st circuit substrate 10 and the 2nd circuit substrate, thereby can set the flexible position that to bring into play sheet metal 1 more longways.Like this, not only to the external force in the 2nd circuit substrate 20 but also to external force, also can relax by the deflection in the zone (deflection division) beyond the 1st and the 2nd face connecting part 1b, the 1c of above-mentioned sheet metal 1 from its plate face directive effect from the thickness of slab directive effect.Thereby, can not produce excessive power to the soldering position of the sheet metal 1 on the 1st and the 2nd circuit substrate 10,20.Its result, even the external force of being subjected to, its soldering place can not ruptured yet, and can realize utilizing sheet metal 1 stably 10,20 of the 1st and the 2nd circuit substrates to be carried out the circuit substrate assembling body of electric and mechanical connection.
In addition, as use above-mentioned sheet metal complex 4, the connection (mounted on surface) of 1 pair the 1st of many sheet metal and the 2nd circuit substrate 10,20 once can be carried out, so can carry out its assembling operation simply.
And, as long as go up on face each surface of being installed in the 1st and the 2nd circuit substrate 10,20 respectively end (face installation portion 1b, 1c) that will many sheet metals 1, thereby do not need as the occasion that above-mentioned use lead-in wire is sold etc., on circuit substrate 10,20, to offer the through hole of union piece installation usefulness.And, because the end (face installation portion 1b, 1c) of each sheet metal 1 can be not outstanding towards the rear side of circuit substrate 10,20 by through hole, thereby the rear side of each circuit substrate 10,20 can be effectively applied to for example install display element and switch element etc.
In addition, sheet metal 1 itself has elasticity, so for example, even external force acts between the circuit substrate 10,20, also can be relaxed by the deflection of sheet metal 1 and absorb the distortion that this external force causes.Especially, the deflection by bend 1a and deflection division can absorb the external force that the 2nd circuit substrate 20 is acted on from the thickness of slab direction of the 2nd circuit substrate 20 effectively.Its result can prevent that face installation portion 1b, the 1c of sheet metal 1 from peeling off from foregoing circuit substrate 10,20, can fully improve the reliability of its connection.
In addition, face installation portion 1b, the 1c of sheet metal 1 have flat shape, clip scolding tin ground and fix between the circuitous pattern on the plane of the plane of this face installation portion 1b, 1c and circuit substrate 10,20, thereby its mechanical bond intensity is extremely strong.That is, fix mutually between the plane with facing, thereby can easily realize having the stationary state of sufficient mechanical strength.
[example 2]
Below example 2 of the present invention is described.This example 2, respectively as Fig. 4 and shown in Figure 5, above-mentioned many sheet metals 1 are separated the transversely arranged and setting abreast of predetermined distance, position in addition, both ends (face installation portion 1b, 1c) with these sheet metals 1, in other words, bend 1a is made with the synthetic resin phantom system with insulating properties, with this synthetic resin body (molding) as the pedestal (supporting mass) 3 that above-mentioned each sheet metal 1 is supported.
Fig. 4 represents many sheet metals 1 direction is arranged in the union piece that 1 row are arranged on the structure on the pedestal 3 alignedly, in addition, Fig. 5 represents many sheet metals 1 direction is arranged in 2 row on the contrary, circuit substrate 20 is embedded the union piece to support between this 2 row sheet metal 1.
Thus, to many sheet metals 1 are transversely arranged and be arranged, these sheet metals 1 are imbedded the occasion that the union piece of the structure that supports in the pedestal 3 that is made of the synthetic resin body uses in parallel, as shown in Figure 6, the 1st installation portion 1b from the outstanding sheet metal 1 of pedestal 3, as long as set following for one side with said base 3 for, above-mentioned installation portion 1b installs the obstruction that just can not be subjected to said base 3 to the face of circuit substrate 10.In addition, the projection 3a of location usefulness is set below pedestal 3 in advance, use in the 10a of portion of hole as long as this projection 3a is embedded the location that sets in advance on the 1st circuit substrate 10, just can easily limit with respect to the installation site of the 1st circuit substrate 10 even the installation site of a plurality of sheet metal 1 pedestal 3.
[other examples]
In addition, occasion at the union piece of the structure that realizes utilizing pedestal 3 that a plurality of sheet metals 1 are supported thus, for example, as shown in Figure 7, it also is useful that the support 3b that clamps the コ font (concavity) that the 2nd circuit substrate 20 supports from the two sides is set in advance at the both ends of pedestal 3.As long as so support 3b is set in advance, will be above pedestal 3 the 2nd installation portion 1c of outstanding sheet metal 1 when soldering is on the 2nd circuit substrate 20 respectively, can prevent falling down of the 2nd circuit substrate 20, and stably keep.Thereby can easily carry out its soldering operation (face installation exercise).
In addition, for example, as shown in Figure 8, also can be on the pedestal (supporting mass) 3 of a plurality of sheet metals 1 of supporting, be provided with in advance and will separate between the sheet metal 1 of predetermined distance setting the grooving 3c that number is in accordance with regulations divided.Utilize such grooving 3c to cut off pedestal 3 then, downcut use, can improve its versatility as long as will connect the sheet metal 1 of the 1st and the 2nd circuit substrate 10,20 required radicals.
In addition, utilize the union piece of the structure that pedestal 3 supports a plurality of sheet metals 1, with the 1st installation portion 1b soldering in back on the 1st circuit substrate 10, the 2nd installation portion 1c soldering on the 2nd circuit substrate 20 time, can be absorbed the heat that transmits to the 1st installation portion 1b by sheet metal 1 from the 2nd installation portion 1c by plastic pedestal 3.Its result can prevent to make the casual fusion of the soldering-tin layer that the 1st installation portion 1b be connected with the 1st circuit substrate 10, so its connection reliability is high and have the 2nd effect that can stably keep etc.
When fixing (face installation) is on the 1st and the 2nd circuit substrate 10,20 respectively at the both ends with sheet metal 1, for example, use high temperature scolding tin as the scolding tin that is used at first sheet metal 1 is fixed (face installation) with respect to the 1st circuit substrate 10, as being used for sheet metal 1 fixing (face installation) is preferably used low temperature scolding tin in the scolding tin of the 2nd circuit substrate 20 then.Thus scolding tin distinguish is used, with the 2nd installation portion 1c soldering on the 2nd circuit substrate 20 time, can prevent the scolding tin of first soldering on the 1st installation portion 1b and the 1st circuit substrate 10 fusion and peeling off of causing unintentionally effectively.
In addition, utilizing soldering backflow (Japanese: the occasion that sheet metal 1 is connected with circuit substrate 10,20 リ Off ロ one), for example, with under a plurality of sheet metals 1 and the state that above-mentioned matrix 2 is connected or utilize under the state that pedestal 3 supports a plurality of sheet metals 1, utilize in advance high temperature scolding tin with several sheet metal 1 handworks ground solderings on circuit substrate 10, then, remaining sheet metal 1 is connected by the backflow that utilizes low temperature scolding tin (for example paste soldering material) get final product.In addition, also can for example, acutangulate, a plurality of sheet metals 1 can be supported oneself down with respect to the state that above-mentioned matrix 2 connects not to the occasion of the 1st circuit substrate 10 vertical fixing by the bending angle of bend 1a is done at the 2nd circuit substrate 20.Thus, can realize the simplification of the connection operation that soldering refluxes.
But, the present invention is not limited to above-mentioned each example.Here be that example is illustrated to only 1 the 2nd circuit substrate 20 being found the occasions of being located on the 1st circuit substrate 10, but equally applicable to multi-disc the 2nd circuit substrate 20 is arranged the occasion that is provided with.In addition, the size of sheet metal 1 and arrangement pitch and angle of bend etc. also can connect specification according to it and determine.And, as the material of sheet metal 1, except the phosphor bronze thin plate, also can use aluminium alloy or aluminum steel etc., in addition, also can use at its electroplating gold on surface etc.And, also can utilize the binding agent of conductivity to replace scolding tin that the both ends of sheet metal are fixed on the circuit substrate respectively, or fix by laser welding.Other can carry out various distortion in aim scope of the present invention.
Claims (2)
1. circuit substrate assembling body has the 1st circuit substrate and the 2nd circuit substrate, and utilizes a plurality of sheet metals that are curved shape that the surperficial formed circuit at each circuit substrate is electrically connected each other to form, it is characterized in that,
The 1st end of described sheet metal is fixed on the circuit of described the 1st circuit substrate, and the 2nd end is fixed on the circuit of described the 2nd circuit substrate,
Be formed with the gap between described the 1st circuit substrate and described the 2nd circuit substrate, and be configured to the 1st end of described sheet metal and the mid portion between the 2nd end, and make described mid portion deviate from the described the 1st and the 2nd circuit substrate respectively and play a role as spring portion by this gap.
2. circuit substrate assembling body as claimed in claim 1 is characterized in that, described the 2nd circuit substrate, and its end is located at for thirty years of age on described the 1st circuit substrate by the support part supports of the concavity on the surface that is arranged on described the 1st circuit substrate.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003051746 | 2003-02-27 | ||
| JP2003051746A JP4318201B2 (en) | 2003-02-27 | 2003-02-27 | Circuit board assembly |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1527657A CN1527657A (en) | 2004-09-08 |
| CN1309284C true CN1309284C (en) | 2007-04-04 |
Family
ID=33116816
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100082883A Expired - Lifetime CN1309284C (en) | 2003-02-27 | 2004-02-27 | Electric circuit base board assembling body |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP4318201B2 (en) |
| CN (1) | CN1309284C (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101370355B (en) * | 2007-08-15 | 2010-12-01 | 华为技术有限公司 | Module, circuit board assembly, communication equipment and module assembly method |
| TWI386118B (en) * | 2008-09-30 | 2013-02-11 | Kingbright Electronics Co Ltd | Vertical circuit board combination structure |
| JP5325085B2 (en) * | 2009-12-24 | 2013-10-23 | 日本碍子株式会社 | Connection device |
| DE102010023917A1 (en) * | 2010-06-16 | 2011-12-22 | Continental Automotive Gmbh | Device with a connecting part for electrical connection between two electrical components |
| JP2015060958A (en) | 2013-09-19 | 2015-03-30 | 日立オートモティブシステムズ株式会社 | Lead frame, electronic controller using lead frame, and lead frame mounting method |
| DE102015100647B4 (en) * | 2015-01-19 | 2021-05-06 | Lisa Dräxlmaier GmbH | PCB with plug contact element |
| EP3456161A1 (en) * | 2016-05-11 | 2019-03-20 | Flex Automotive GmbH | Electrical circuitry assembly and method for manufacturing the same |
| JP6499735B2 (en) * | 2017-08-30 | 2019-04-10 | 日立オートモティブシステムズ株式会社 | Electronic control unit |
| US11088066B2 (en) * | 2018-03-19 | 2021-08-10 | Tactotek Oy | Multilayer structure and related method of manufacture for electronics |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5441430A (en) * | 1994-04-06 | 1995-08-15 | North American Specialties Corporation | Electrical lead for surface mounting of substrates |
| US5490788A (en) * | 1994-11-01 | 1996-02-13 | Emc Technology, Inc. | Surface mount terminal for electrical component |
| JPH1050433A (en) * | 1996-07-30 | 1998-02-20 | Nec Software Ltd | Board-connecting structure |
| FR2761852A1 (en) * | 1997-04-08 | 1998-10-09 | Proner Comatel Sa | Perpendicular Board connection for Printed Circuit mother Boards |
| JP2001345133A (en) * | 2000-05-31 | 2001-12-14 | Advantest Corp | Inter-board connector structure |
| JP2002083638A (en) * | 2000-09-07 | 2002-03-22 | Yazaki Corp | Terminal for substrate connection and connector using the same |
-
2003
- 2003-02-27 JP JP2003051746A patent/JP4318201B2/en not_active Expired - Lifetime
-
2004
- 2004-02-27 CN CNB2004100082883A patent/CN1309284C/en not_active Expired - Lifetime
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5441430A (en) * | 1994-04-06 | 1995-08-15 | North American Specialties Corporation | Electrical lead for surface mounting of substrates |
| US5490788A (en) * | 1994-11-01 | 1996-02-13 | Emc Technology, Inc. | Surface mount terminal for electrical component |
| JPH1050433A (en) * | 1996-07-30 | 1998-02-20 | Nec Software Ltd | Board-connecting structure |
| FR2761852A1 (en) * | 1997-04-08 | 1998-10-09 | Proner Comatel Sa | Perpendicular Board connection for Printed Circuit mother Boards |
| JP2001345133A (en) * | 2000-05-31 | 2001-12-14 | Advantest Corp | Inter-board connector structure |
| JP2002083638A (en) * | 2000-09-07 | 2002-03-22 | Yazaki Corp | Terminal for substrate connection and connector using the same |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1527657A (en) | 2004-09-08 |
| JP2004260107A (en) | 2004-09-16 |
| JP4318201B2 (en) | 2009-08-19 |
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Granted publication date: 20070404 |