CN1303329A - Multi-functional electrically and thermally conductive adhesive tape - Google Patents
Multi-functional electrically and thermally conductive adhesive tape Download PDFInfo
- Publication number
- CN1303329A CN1303329A CN99806793A CN99806793A CN1303329A CN 1303329 A CN1303329 A CN 1303329A CN 99806793 A CN99806793 A CN 99806793A CN 99806793 A CN99806793 A CN 99806793A CN 1303329 A CN1303329 A CN 1303329A
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- China
- Prior art keywords
- glue
- line
- adhesive tape
- base material
- conductive adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002390 adhesive tape Substances 0.000 title claims abstract description 195
- 239000000463 material Substances 0.000 claims abstract description 225
- 239000010410 layer Substances 0.000 claims abstract description 57
- 239000012790 adhesive layer Substances 0.000 claims abstract description 29
- 239000000853 adhesive Substances 0.000 claims abstract description 18
- 230000001070 adhesive effect Effects 0.000 claims abstract description 18
- 229910052751 metal Inorganic materials 0.000 claims description 110
- 239000002184 metal Substances 0.000 claims description 110
- 239000003292 glue Substances 0.000 claims description 45
- 230000001788 irregular Effects 0.000 claims description 37
- 230000000149 penetrating effect Effects 0.000 claims description 26
- 238000004519 manufacturing process Methods 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 18
- 239000000758 substrate Substances 0.000 claims description 17
- 239000004020 conductor Substances 0.000 claims description 9
- 230000005611 electricity Effects 0.000 claims description 4
- 238000005452 bending Methods 0.000 claims description 3
- 239000002019 doping agent Substances 0.000 abstract 1
- 238000003892 spreading Methods 0.000 description 56
- 230000007480 spreading Effects 0.000 description 56
- 239000012071 phase Substances 0.000 description 24
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 20
- 239000011248 coating agent Substances 0.000 description 16
- 238000000576 coating method Methods 0.000 description 16
- -1 polypropylene Polymers 0.000 description 16
- 239000011889 copper foil Substances 0.000 description 15
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 12
- 239000004743 Polypropylene Substances 0.000 description 12
- 239000002131 composite material Substances 0.000 description 12
- 229910003460 diamond Inorganic materials 0.000 description 12
- 239000010432 diamond Substances 0.000 description 12
- 239000002985 plastic film Substances 0.000 description 12
- 229920006255 plastic film Polymers 0.000 description 12
- 229920001155 polypropylene Polymers 0.000 description 12
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 9
- 229920000297 Rayon Polymers 0.000 description 9
- 238000009826 distribution Methods 0.000 description 9
- 239000000843 powder Substances 0.000 description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 239000000741 silica gel Substances 0.000 description 8
- 229910002027 silica gel Inorganic materials 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- 239000003822 epoxy resin Substances 0.000 description 7
- 238000003801 milling Methods 0.000 description 7
- 238000007747 plating Methods 0.000 description 7
- 229920000647 polyepoxide Polymers 0.000 description 7
- 238000012545 processing Methods 0.000 description 7
- 239000000047 product Substances 0.000 description 7
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 6
- 239000012528 membrane Substances 0.000 description 6
- 239000004800 polyvinyl chloride Substances 0.000 description 6
- 239000004698 Polyethylene Substances 0.000 description 5
- 239000005030 aluminium foil Substances 0.000 description 5
- 238000010276 construction Methods 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 239000010408 film Substances 0.000 description 5
- 239000011888 foil Substances 0.000 description 5
- 239000011159 matrix material Substances 0.000 description 5
- 229920003023 plastic Polymers 0.000 description 5
- 239000004033 plastic Substances 0.000 description 5
- 229920000573 polyethylene Polymers 0.000 description 5
- 229920000139 polyethylene terephthalate Polymers 0.000 description 5
- 239000005020 polyethylene terephthalate Substances 0.000 description 5
- 238000003466 welding Methods 0.000 description 5
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 4
- 239000004831 Hot glue Substances 0.000 description 4
- 238000004026 adhesive bonding Methods 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910052804 chromium Inorganic materials 0.000 description 4
- 239000011651 chromium Substances 0.000 description 4
- 239000006071 cream Substances 0.000 description 4
- 230000004927 fusion Effects 0.000 description 4
- 239000007769 metal material Substances 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 239000005060 rubber Substances 0.000 description 4
- 230000003068 static effect Effects 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 230000009471 action Effects 0.000 description 3
- 238000000637 aluminium metallisation Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 238000001883 metal evaporation Methods 0.000 description 3
- 229920000915 polyvinyl chloride Polymers 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 229910052718 tin Inorganic materials 0.000 description 3
- 239000011135 tin Substances 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- 206010037660 Pyrexia Diseases 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 230000003078 antioxidant effect Effects 0.000 description 2
- 235000006708 antioxidants Nutrition 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000012141 concentrate Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical class [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 125000005487 naphthalate group Chemical group 0.000 description 2
- 239000000615 nonconductor Substances 0.000 description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 238000009725 powder blending Methods 0.000 description 2
- 238000004904 shortening Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 239000012808 vapor phase Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 241000283070 Equus zebra Species 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000005056 compaction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000000994 depressogenic effect Effects 0.000 description 1
- 229910000939 field's metal Inorganic materials 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000000499 gel Substances 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000002905 metal composite material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000013047 polymeric layer Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
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- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/28—Metal sheet
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/16—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
- C09J2301/162—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer the carrier being a laminate constituted by plastic layers only
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
- C09J2301/204—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive coating being discontinuous
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
- C09J2400/16—Metal
- C09J2400/163—Metal in the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Laminated Bodies (AREA)
Abstract
A multi-functional electrically and thermally conductive adhesive tape is described. The adhesive tape at least has the following structures: a complex structure or a single structure having a plurality of protuberant holes or concavities extended from one side of the complex structure or the single structure. Adhesive material is coated on both sides or a single side of the complex structure or the single structure, wherein the adhesive layer is an electrically and thermally conductive layer or an electrically non-conductive layer. The electrically non-conductive adhesive layer, depending on the practical application, can be chosen from any kind of adhesive material. The electrically conductive adhesive layer can be chosen from any kind of adhesive material doped with electrically and thermally conductive dopants.
Description
The present invention relates to a kind of structure and manufacture method thereof of adhesive tape, and be particularly related to a kind of structure and manufacture method thereof with excellent conduction or superior thermal conductivity adhesive tape.
When the size of electronic installation more and more hour, the density of its circuit and the demand of precision also can be more and more higher thereupon, each element of the thing followed or equipment room are subjected between Electromagnetic Interference, electrostatic breakdown, each electrical appliance to use the solution game method of problem such as compatible to seem more important each other, and electrically and thermally conductive adhesive tape of the present invention has adherence and superior conduction and thermal conduction characteristic and simultaneously with the electromagnetic protection function characteristic.This adhesive tape has bigger convenience and progressive than the connector that traditional connector uses the mode of lock screw, rivet or welding to connect.
Traditional conduction or heat conduction adhesive tape are mostly with high-molecular organic material fusion heat conduction or conducting medium and make the adhesive tape that single or double has adhesiveness, please refer to Fig. 1, this conduction or heat conduction adhesive tape 10 include conduction or conduction material 12 is positioned at the one or both sides of an aluminum metal layer 11 to link thermal source and heat abstractor, as radiator fan.Yet, the conduction in this prior art products or the sticky material of conduction material are generally polymeric layer, layer of silica gel for example, and this type of macromolecular material (polymers) has continuous structure phase and heat endurance in using, but because itself substance characteristics mostly is and has low heat conduction coefficient and insulation characterisitic, with conduction and the fusion of thermal conductivity powder medium after its integral body conducting electricity or the heat conduction rerum natura on all far short of what is expected more than the simple metal material.
The present invention proposes a heat-conductivity conducting adhesive tape, this adhesive tape comprises array structure down: a composite construction or single matrix structure, prominent shape structure or groove with most irregular alignments, a side of this composite construction or single matrix structure is given prominence to or be depressed in to these prominent shape structures or groove.In addition, one side or the both sides of this composite construction or single matrix structure are coated with adhesive-layer, and be that handled easily uses, can fit in the outside of adhesive-layer a release liners or mould release membrance, or the opposite side coating behind single matrix structure coating adhesive-layer or the release thing of the release function of a tool of fitting, as release liners or release adhesive tape etc.Form the method for these prominent shape structures or groove on the structure, can form by the prominent shape wheel of diamond pinch roller, diamond platform rivet bucker, point or other similar spreading board spreadings of using the surface to have projection.The degree of depth and the diameter of projection or sunk structure are decided by compaction technology, for example decide by the size of adjustment projection and the pressure in the technology.The present invention advises using the diamond pinch roller, and it is extremely wide and convenient that range applications is made in its diamond grains point lug structure height size, distribution density and operation, and its execution conditions are decided according to the last product rerum natura quality demand of using.
Simple layer matrix structure material can be single plastic film or single metal foil layer herein, and the combination of composite construction can be plastic layer/metal level, metal level/plastic layer/metal level, metal level/metal level/plastic layer, or plastic layer/metal level/plastic layer etc., metal level wherein can be the single kind metal, alloy or multiple field metal composite foils, decide according to required rerum natura demand, required rerum natura is for example wear-resisting, anti-oxidant, good heat conduction or good electric conductivity etc., metal level material kind such as Copper Foil, aluminium foil, Kufil or silver-plated, zinc-plated, zinc-plated lead, chromium plating, nickel plating, the various combinations of gold-plated Copper Foil etc. or above-mentioned metal forming etc. can determine the combination of materials of required use or both to have it concurrently herein with regard to condition demand such as reality conduction or thermal conduction characteristic.If herein this metal level the oxidative phenomena of avoiding in the environment being caused, then can do the processing of the anti-oxidant or passivated surface layer of further tool in the outside of easily oxidized metal level, the oxidation-resistant metallic material that for example has higher oxidizing potential by plating or vapor phase metal evaporation last layer, the Copper Foil of example such as zinc-plated lead, this tin lead layer also can provide high heat conduction and low resistance impedance operator simultaneously herein, use normal aluminum metal or the copper of using in the vapor phase metal evaporation, also can use infiltration and the oxidation reaction of coating one organic material on the other hand, for example epoxy resin coating etc. with oxygen in isolated the Nature.
Adhesive-layer can be a simple viscose glue or is the electrical and thermal conductivity viscose glue.Wherein, the material of main adhesive-layer is then often decided on the demand of practical application field, can be any glue system, for example be polypropylene glue, silica gel, rubber, hot melt adhesive, epoxy resin etc., and its temperature range that is suitable for is extremely wide.And the adhesive-layer of electrical and thermal conductivity can be any of above-mentioned glue system, the medium that mixes and have electric conductivity herein.The kind of conductive medium then can be inorganic powder that powder conductive carbon powder, metal powder, metal oxide powder, the processing of tool conductive surface handles, through the mixture of organic powder of conductive surface processing, carbon fiber powder etc. or these conducting mediums.If on the other hand, in the heat-conducting glue aspect, generally speaking, itself also has splendid thermal conductivity the conducting resinl of all tool electric conductivity, but when not wishing conductive characteristic is arranged, the heat-conducting medium of the low specific heat of apparatus is substituted, as aluminium oxide, titania powder etc.
The advantage of electrically and thermally conductive adhesive tape of the present invention comprises:
(a) this electrically and thermally conductive adhesive tape can provide adhesion function and conductive characteristic simultaneously in a side of adhesive tape, owing to should prominent shape structure be a distribution arbitrarily, and distribution density is all very easily controlled and is made to rare by close, and is highly suitable for irregular affixed object surface, and its submissive adaptation is splendid.
(b) can be used as electromagnetic interference (EMI) covers and uses adhesive tape, its prominent shape structure has similar bee slot shape structure, this provides the bridging effect of a vertical electromagnetic wave direction of advance, and because the utmost point Low ESR of metal continuous phase itself prevents covering the adhesive tape mode that effect is much better than existing coating conducting medium fusion glue to electromagnetism and make.
(c) can be applicable to the electrostatic dissipation conducting usefulness of easy association static environment, as in the electrostatic dissipation safety floor of toilet (CleanRoom) or near the direct conducting of electrostatic dissipation the iconoscope backside loop to ground connection pedestal purposes.
(d) the direct electrostatic conducting discharge adhesive tape that can be used as the surface glass window of video picture screen or micro-wave oven is used.
(e) suitably select the heat conduction or the conductive characteristic of metal level material, the former has high thermal conductivity coefficient as zinc-plated Copper Foil, can be used as heat conduction and connect adhesive tape, the latter such as silver-plated or gold-plated Copper Foil have low-resistance coefficient, can be used as the conducting connector, with as ground connection and the usefulness that is connected of conduction, and adhesive tape of the present invention has the high density shape surface texture of dashing forward, and is fit to very much have the conducting that is fitted and connected on irregular object surface.
(f) element on computer and the various electrical equipment or accessory are if need ask electrostatic dissipation, ground connection, conducting or have conducting and when adhesion simultaneously, then can use adhesive tape of the present invention, if conductive tape needs and is struck up partnership by adhesion conducting thing surface, then can be by discharge processing, make prominent shape structural material and the melting welding of attached object metal surface be integral for example zinc-plated Copper Foil conductive tape.
(g) conductive and heat-conductive two-sided tape of the present invention, owing to utilize the metal in the adhesive tape directly to contact mutually with affixed object, its heat transfer efficiency is far superior to the heat-conducting cream of tradition use and coats the aluminium foil both sides, make the dusty material of apparatus thermal conductivity and low specific heat in latter's heat-conducting cream mostly, aluminium oxide or titania powder blending silica gel for example in than the insulating properties macromolecular material for example, because general macromolecular material is hot non-conductor and insulant, its thermally conductive heat coefficient is about 2 * 10
-4(cal/cm
2/ cm/s/ ℃), this is worth well below the metal fever good conductor, as the thermally conductive heat coefficient of copper, tin, gold, silver, by 0.9 to 1.5 (cal/cm
2/ cm/s/ ℃) in the scope, as seen its heat transfer efficiency differs and can reach more than thousand times.
(h) with the pierceability base material, single plastic film or metal/plastic film composite membrane, both sides coating conductive paste, for example a side is used the polypropylene conductive pressure-sensing glue, and the epoxide resin conductive adhesive of opposite side coating overpass degree so makes the both sides glue-line have the surface impedance value (Rs) of dissipation static characteristic between 10
0～10
11Ohm-sq (Ω/), with volume impedance (Rv) between 10
0～10
9Ohmcm (Ω cm), the volume impedance (Rv) of vertical thin-film direction then can be rolled over the gross area that penetrates in the area by change bondline thickness, base material thickness and unit and be controlled, and its volume resistance value is between 10
0～10
9Ohmcm (Ω cm).Generally speaking the volume impedance with by the prominent gross area relation of being inversely proportional to of wearing on the spreading base material unit are, herein if the plastic film of use AM aluminum metallization metal is for being rolled into the pierceability base material, then because of there being a middle conductive metal layer to make the shortening of whole conduction approach on the structure, can significantly reduce surface impedance value, thereby the use amount and the cost that can significantly reduce conducting medium can reach the electrical conductive tape of wishing to get along parallel or vertical substrate surface.
(ⅰ) electrically and thermally conductive adhesive tape of the present invention is because of having the prominent shape independence island metal structure of point on the outermost adhesion surface, when with engaged by coating surface after then have anti-skidding (anchor and anti-slip) the fixing characteristic of casting anchor.
(j) electrically and thermally conductive adhesive tape of the present invention has similar dry goods surface characteristic, is not easy phenomenon from the fold, does not also therefore have because of being subjected to stress to concentrate formed fracture phenomenon.
(k) the present invention makes the method for adhesive tape, has technology simpler, meticulous and precision height, roll milling wheel more than the existing method of tradition and does not have consume, production capacity height and low cost of manufacture.
For above-mentioned purpose of the present invention, feature and advantage can be become apparent, preferred embodiments more cited below particularly, and cooperate appended graphicly, be described in detail below:
Graphic simple declaration:
Fig. 1 represents the generalized section of the sheet adhesive of the middle clad aluminum foil of existing a kind of two-sided silica gel heat conduction film;
Fig. 2 A to Fig. 2 C represents the manufacturing process profile according to a kind of electrically and thermally conductive adhesive tape of the embodiment of the invention one;
Fig. 3 is shown in and forms the dash forward schematic diagram of island structure of overshooting shape groove and metal tip in the manufacturing step of electrically and thermally conductive adhesive tape;
Fig. 4 A to 4C represents the manufacturing process profile according to the electrically and thermally conductive adhesive tape of the embodiment of the invention two;
Fig. 5 is shown in and forms the dash forward schematic diagram of island structure of overshooting shape groove and metal tip in the manufacturing step of electrically and thermally conductive adhesive tape;
Fig. 6 represents two schematic diagrames that conductive tape is fitted mutually of the embodiment of the invention three;
Fig. 7 represents the schematic diagram of the bending applying conductive tape of the embodiment of the invention three;
Fig. 8 is shown in a kind of schematic diagram with conduction sticking tablet of female plug seat of the embodiment of the invention four; And
Fig. 9 is shown in a kind of schematic diagram with conduction sticking tablet of female plug seat of the embodiment of the invention four.
Embodiment one
Fig. 2 A to 2C represents the manufacturing process profile according to a kind of electrically and thermally conductive adhesive tape of a preferred embodiment of the present invention.
Please refer to Fig. 2 A, a base material 200 is provided, this base material can be plastic film, for example polypropylene (Polypropylene; PP), polyethylene terephthalate (Polyethylene Terephthalate; PET), polyethylene (Polyethylene; PE), polyethylene glycol is to naphthalate (polyethylenenaphthalate; PEN), pi (Polyimide; PI), polyvinyl chloride (Polyvinylchloride; PVC) film or other materials.In addition, according to method of the present invention, the material of this base material also can be metal forming (metal foil), for example Copper Foil (copper foil), aluminium foil (aluminum foil), single or double electrosilvering copper alloy (alloy), silver-plated (silver; Ag), various combination of the Copper Foil of zinc-plated lead (solder plated), chromium plating (chromium), nickel plating (nickel), gold-plated (gold) etc. or above-mentioned metal forming etc.Wherein, number in the figure TD represents vertical substrate surface direction (Transverse Direction), and label MD represents parallel substrate surface or machining direction (Machine Direction).
Please refer to Fig. 2 B, then, be coated with the side of a glue-line 204 in base material 200, the glue-line material is then based on best applications, can be pure glue system, conducting resinl or heat-conducting glue, the opposite side that glue-line 204 exposes then posts a release layer 205, and this release layer 205 can be release liners or mould release membrance.Then carry out the technology of spreading then, herein to use diamond wheel, diamond platform rivet bucker, the prominent shape wheel of point or other spreading board to come the spreading base material, the spreading direction is pressed by the direction of base material 200 side direction glue-lines 204, and wear out base material, use on base material 200, forming a plurality of perforates 202, make base material become conductivity of an aperture base material.At this moment, base material 200 wherein being shaped as of a side surface has a plurality of inner concavities zone, the shape of an other side surface is then for having a plurality of overshooting shapes zone, basically these inner concavities zone and overshooting shape zone two corresponding twenty percent on-states mutually, the regional and overshooting shape zone of the inner concavity of connecting mutually then constitutes perforate 202 in twos.Because these spreading boards have the ridge portion of irregular alignment, so can on base material, form the perforate 202 of irregular alignment.In addition, the degree of depth of perforate 202 and caliber size are then adjusted the spreading condition according to required situation, for example adjust the size and the spreading pressure size of the ridge portion of spreading board.
Yet spreading step of the present invention is not limited to penetrate base material 200, also can not penetrate base material 200 in the spreading step of the present invention, the public overshooting shape groove 210 that only in base material 200, forms a plurality of irregular alignments, as shown in Figure 3.From base material 200 side surface wherein, this overshooting shape groove 210 presents recess, but if from base material 200 opposite side surfaces, then this overshooting shape groove 210 presents the prominent shape structure of point.The degree of depth of overshooting shape groove 210 and width size then can be adjusted the spreading condition according to required situation.If spreading step of the present invention does not penetrate base material 200, only form overshooting shape groove 210, in the spreading step because penetrate and do not penetrate the resemble process of base material, so embodiment only makes example to penetrate base material 200, if only desire to make unifaciality adhesion electrically and thermally conductive adhesive tape, then so far the step product can be used.
Please refer to Fig. 2 C, however the present invention also respectively gluing in the both side surface of this base material 200 to make two-sided conduction or heat conduction adhesive tape (shown in Fig. 2 C).This is in and then need be coated with base material 200 surfaces that another glue-line 206 coverings have the recess zone on the technology, and one deck release layer 208 of can fitting then is in glue-line 208 surfaces, to constitute two-sided tape.
Conductive tape structure of the present invention penetrates perforate 202 or overshooting shape groove 210 because middle base material 200 is formed with, so the volume impedance (R of conductive viscose layer vertical direction
V TD) will be not equal to the volume impedance (R that is parallel to substrate plane or operating direction
V-MD), so have different direction electric conductivity.Penetrability plastic film base material only is suitable for the coating conducting resinl being prepared into the two-sided conductive tape of aeolotropic herein, and the volume impedance (R of two direction TD and MD
v) how many solids contents of total perforation field size and the conductive powder medium of unit are is inversely proportional on measuring value and the base material, but be directly proportional with conductive adhesive layer thickness.
More noticeable is that if the base material 200 among the present invention is a metal material, then adhesive-layer can be non-conductive adhesive-layer or electric conductivity adhesive-layer.Especially, after coating ground floor adhesive-layer 204 and spreading, from adhesion coating 204 glue face side surfaces, the prominent shape structure of these base material 200 formed points is to be the independently prominent island structure 211 (isolated island) of metal tip after penetrating softer glue-line 204, glue mutually then is a continuous phase structure and is surrounded on separately independently in the prominent island structure 211 of metal tip, and glue-line 204 outer surfaces have the metal of independent separate and the structure of continuous viscose glue two-phase simultaneously herein, and the functional characteristic of adhesion with conduction then is provided on using simultaneously.As for, metal tip island structure 211 overshooting shape height and the density of dashing forward, then can adjust prominent height, density and the spreading pressure condition of point on the roll milling wheel according to required situation.So far work as in the roll milling craft of the present invention and press prominent base material, and dash forward and wear glue-line 204 structures, this invention structural group compound can be used as conductive tape.And this conductive tape is except having adhesion and conduction conducting function simultaneously, and has the ELECTROMAGNETIC OBSCURANT function.If the equal gluing of both side surface of base material 200, then the glue-line 206 of second side can be played the part of an air and blocked interlayer, can prevent the oxidized of metal base, if base material 200 materials are the single insulating plastic film, then the material of both sides adhesive-layer all is required to be the electric conductivity adhesive-layer, just has two-sided conductive tape characteristic.
The rerum natura of the adhesive-layer of electric conductivity herein is as volume impedance (R
V_MD) generally can be between 10
-1～10
8Between Ω cm, and the volume impedance (R of vertical direction (TD)
V_TD) between 10
1～10
8Ω cm.
Wherein, influence the volume impedance (R of vertical direction
VTD) be relevant with following factors:
(a) the volume impedance (R of the conductive doped property of desire medium
v).
(b) put on the forward unit are pressure size of vertical direction.
(c) penetrated the area size by the spreading hole on the unit are.
(d) thickness of conductive viscose layer and base material.
(e) the right fixed ratio of conducting medium and gel phase.
(f) viscose glue kind.
Embodiment two
Fig. 4 A to Fig. 4 C represents the manufacturing process profile according to the electrically and thermally conductive adhesive tape of the embodiment of the invention two.
Please refer to Fig. 4 A, one base material 300 is provided, this base material can be plastic film, and for example polypropylene (PP), polyethylene terephthalate (PET), polyethylene (PE), polyethylene glycol are to naphthalate (PEN), polyimide film (PI), polyvinyl chloride (PVC) film or other materials.Then, a surface of a compound metal level 301 covering substrates 300, and constitute a structure of composite membrane.Wherein, the material of this metal level 301 can be a for example AM aluminum metallization film or be to fit or the metal forming of hot pressing of metal evaporation film, and this metal forming can be the various combination of Copper Foil, aluminium foil, single or double electrosilvering copper alloy, silver-plated, zinc-plated lead, chromium plating, nickel plating, gold-plated Copper Foil etc. or above-mentioned metal forming etc.Wherein, number in the figure TD represents vertical composite membrane in-plane, and label MD represents parallel composite membrane plane or machining direction.
Please refer to Fig. 4 B, then, be coated with the metal covering outside of a glue-line 304 in structure of composite membrane, the glue-line Material Selection then based on best practical application, can be pure glue system, conducting resinl or heat-conducting glue.Afterwards, then post a release layer 305 in glue-line 304 opposite sides, this release layer 305 can be release liners or mould release membrance.Then carry out the action of spreading then, for example use diamond pinch roller, diamond platform rivet bucker, the prominent shape wheel of point or other spreading board to come spreading, the spreading direction is pressed by the direction of base material side direction glue-line 304, and wear during spreading and press base material 300, and on base material 300, form the prominent shape perforate 302 of a plurality of points.At this moment, base material 300 opposite side surfaces form a plurality of concavities and convex zone, basically these inner concavities zone and overshooting shape zone two corresponding twenty percent on-states mutually, the inner concavity of connecting mutually in twos zone then constitutes the sharp shape perforate 302 of dashing forward with the overshooting shape zone.Because these spreading boards have the ridge portion of irregular alignment, so can on base material, form the perforate of irregular alignment.In addition, the degree of depth and the caliber size of the prominent shape perforate 302 of point are then adjusted the spreading condition according to required situation, for example adjust the size and the pressure size of the ridge portion of spreading board pinch roller.
Yet spreading step of the present invention is not limited to penetrate base material 300, also can not penetrate base material in the spreading step of the present invention, only forms the prominent shape groove 310 (as shown in Figure 5) of point of several irregular alignments in base material.From the adhesion coating surface, the prominent shape groove structure of this point is to be the independently prominent island structure 311 of metal tip after penetrating softer glue-line 304, glue mutually then is a continuous phase structure and is surrounded on separately the independently prominent island structure 311 of metal tip, and glue-line 304 outer surfaces have the metal of independent separate simultaneously herein then provides the functional characteristic of adhesion with conduction simultaneously with the structure of viscose glue two-phase continuously on using.Metal tip island structure 311 overshooting shape structure height and the density of dashing forward then can be adjusted prominent height, density and the spreading pressure condition of point on the roll milling wheel according to required situation.So far spreading step of the present invention has and presses prominent base material 300, and prominently wears glue-line 304 structures, and this invention textural association promptly can be used as conductive tape, and this conductive tape is except having adhesion and conduction conducting function simultaneously, and has the ELECTROMAGNETIC OBSCURANT function.
If but all gluings of the both side surface of base material 300, for example last layer glue-line 306 can stick the surface of one deck release layer 307 in glue-line 306 in addition on base material 300 second sides.Then the glue-line 306 of second side can be played the part of an air and blocked interface, can prevent the oxidized of metal level 301, herein if use polyvinyl chloride (PVC) plastic film to conform to the second glue face side or directly replace second glue-line with polyvinyl chloride (PVC) adhesive tape, then can become a splendid product, this is that a side has the conduction insulating tape that insulation characterisitic and another side have the conduction adhesiveness.Embodiment only makes example to penetrate base material herein.
Embodiment three
Please refer to Fig. 6, to use the base material 200 of metal level in the similar embodiment one, zinc-plated Copper Foil is used in suggestion, and be coated with a glue-line 204 in a side, glue-line 204 materials to select then the application scenario according to product the best for use be main, can be pure glue system, conducting resinl or heat-conducting glue, suggestion uses pure glue system to get final product, and pure glue is to can be any glue system, for example is polypropylene glue, silica gel, rubber, hot melt adhesive, epoxy resin etc.On the practice, then be fitted with a release layer 205 in the opposite side of glue-line 204, this release layer 205 can be release liners or mould release membrance.Then, then carry out the action of spreading, for example use diamond wheel, diamond platform rivet bucker, the prominent shape wheel of point or other spreading board to come spreading, during spreading, its spreading direction is then by the direction spreading of base material one side direction glue-line, and forms the prominent shape structure (as shown in Figure 3) of a plurality of points during spreading on base material 200.Because these spreading boards have the ridge portion of irregular alignment, so can on base material 200, form the prominent shape groove structure 210 of the point of irregular alignment.In addition, can regulate and control the height and size of the prominent shape groove structure 210 of point by the spreading condition, for example adjust size, density and the spreading pressure size of the ridge portion of spreading board pinch roller according to required situation.
Herein, the prominent shape groove structure 210 of this point is the independently prominent island structure 211 of metal tip after penetrating glue-line 204, remaining glue layer then is a continuous phase and is surrounded on separately the independently prominent island structure 211 of metal tip, glue-line 204 outer surfaces have the structure of the prominent and continuous viscose glue two-phase of metal tip of independent separate simultaneously herein, and the functional characteristic of adherence and current lead-through then is provided on using simultaneously.The structure height and the distribution density of the overshooting shape of the prominent island structure 211 of metal tip then can be adjusted prominent height, distribution density and the spreading pressure condition of point on the roll milling wheel according to required situation.
Then, in being coated with a glue-line 206 by the exposed surface side of the base material 200 of spreading and one-tenth concavity, for example be pure glue-line or conductive and heat-conductive layer, glue-line can be any glue system herein, for example be polypropylene glue, silica gel, rubber, hot melt adhesive, epoxy resin etc., the good polypropylene glue of weatherability is used in suggestion herein, and the heat conduction and the conducting medium that mix glue-line 206 can be aluminium oxide and metal nickel powder.
Then with this lamination layer structure 30 by this glue-line 206 being conformed to another bare substrate face adhesion pressing of another composite construction that one deck glue-line 204 is only arranged 31, and form the adhesive tape 32 with two-sided 204,206 adhesions and conductive and heat-conductive of symmetry on the structure.
Please refer to Fig. 7, herein if desire that better conduction conducting effect is arranged, on practice is used, then can with heat-conducting glue or conducting resinl 206 with comprehensive or the gluing of part zebra symmetry after, again with symmetric mode, to heat-conducting glue or conducting resinl 206 inboard doublings, and form a similar above-mentioned two-sided adhesion and the adhesive tape 33 of conductive and heat-conductive, herein because of having an edge to have continuous metal phase in two-sided electrically and thermally conductive adhesive tape 33 structures, so have preferable conduction conducting and heat-conducting effect, the mechanical resistance distressed structure of the last one also is provided on the structure simultaneously, present embodiment can be applied to need heat conduction adhesion and accessory indirectly or bonding conducting, for example heat conduction of computer cpu and cooling application when electronic component in the electronics industry.
Embodiment four
To use for example base material 200 of metal in the similar embodiment one, the composite metallic material of tin and copper or tin lead and copper is used in suggestion, and be coated with a glue-line 204 in a side, the glue-line material to select then the application scenario according to product the best for use be main, can be pure glue system, conducting resinl or heat-conducting glue.And pure glue is to can be any glue system, for example is polypropylene glue, silica gel, rubber, hot melt adhesive, epoxy resin etc.Afterwards, on the practice, then be fitted with a release layer 205 in the opposite side of glue-line 204, this release layer 205 can be release liners or mould release membrance.Then, then carry out the action of spreading, for example use diamond wheel, diamond platform rivet bucker, the prominent shape wheel of point or other spreading board to come spreading, during spreading, its spreading direction is then by the direction spreading of base material one side direction glue-line, and form during spreading to extend and press 200 layers of prominent metal bases and pressure to wear glue-line, the result forms the prominent shape structure (Fig. 3) of a plurality of points in appearance at metal base 200.Because these spreading boards have the ridge portion of irregular alignment, so can on base material 200, form the prominent shape groove structure 210 of the point of irregular alignment.In addition, can regulate and control the height and size of the prominent shape groove structure 210 of point, for example adjust size, density and the spreading pressure size of the ridge portion of spreading board pinch roller according to required situation mat spreading condition.
Herein, glue face side surface from glue-line 204, the prominent shape groove structure 210 of this metal tip is the independently prominent island structure 211 of metal tip after penetrating softer glue-line 204, the cross surface of all the other glue-lines 204 then be a continuous phase and the prominent island structure 211 of metal tip that is looped around separately independent (isolated island) mutually around, this surface surface texture of having metal and viscose glue two-phase simultaneously then provides the functional characteristic of adhesion and Metal Contact heat conduction simultaneously in application herein.The height and the distribution density of the raised structures of the prominent island structure 211 of metal tip then can be adjusted prominent height, distribution density and the spreading pressure condition of point on the roll milling wheel according to required situation.
Then, this conductive tape can be formed the conduction sticking tablet 400 of sheet, welding with the discharge processing mode or the fixing adhesion one of conducting resinl (not shown) has connector 402 on the metal connector of public plug 404 (as shown in Figure 9) or female plug seat 406 (as shown in Figure 8) in bare metal face side of this conduction sticking tablet 400, on the metal side of conduction sticking tablet 400, this public plug 404 or female plug seat 406 can be that vertical (as Fig. 8 with shown in 9) or parallel (not shown) are conducted electricity sticking tablet 400.And then a fit insulating tape or be coated with an insulated paint (not shown) of 402 tops of the connector on metal connector, on practice is used herein, processing mode seam metal connector can discharge, can directly the metal back side that 402 tops of the connector on the metal connector conform to conduction sticking tablet 400 can be reached conducting, connect and fixing effect with the insulating tape of area greater than connector 402 areas, herein for asking higher product quality, as interface resistance impedance phenomenon, the discharge welding is still adopted in suggestion.And two metal connectors that have public plug 404 and female plug seat 406 respectively, can do the application of a long distance conduction conducting each other by a lead, has operation convenience on the practice, this embodiment can be in many application such as electronic equipment ground connection, the conducting of interelement conductor, electrostatic grounding dissipation conductings, even the current signal that is applied on the monitoring instrument in the Medical Devices is surveyed on the joint.
In sum, the advantage of conductive tape of the present invention comprises:
(a) this electrically and thermally conductive adhesive tape can provide adhesion function and Metal Contact on state characteristic simultaneously in a side of adhesive tape, owing to should prominent shape structure be a distribution arbitrarily, and distribution density is all very easily controlled and is made to rare by close, and is highly suitable for irregular affixed object surface, and its submissive adaptation is splendid.
(b) can be used as electromagnetic interference covers and uses adhesive tape, its prominent shape structure has the bridging effect that similar bee slot shape provides vertical electromagnetic wave direction of advance, and because the utmost point Low ESR of metal continuous phase itself prevents covering the adhesive tape that effect is much better than existing coating conducting medium fusion glue to electromagnetism and make.
(c) can be applicable to the electrostatic dissipation of easy association static environment, as the electrostatic dissipation safety floor of toilet or near the direct conducting of electrostatic dissipation the iconoscope backside loop to ground connection pedestal purposes.
(d) the direct electrostatic conducting discharge adhesive tape that can be used as its surface glass window of video picture screen or micro-wave oven is used.
(e) suitably select the heat conduction or the conductive characteristic of metal level material, the former has high thermal conductivity coefficient as zinc-plated Copper Foil, can be used as heat conduction and connect adhesive tape, the latter such as silver-plated or gold-plated Copper Foil have low-resistance coefficient, can be used as the conducting connector, with as ground connection and the usefulness that is connected of conduction, and adhesive tape of the present invention has the high density shape surface texture of dashing forward, and is fit to very much have the conducting that is fitted and connected on irregular object surface.
(f) element on computer and the various electrical equipment or accessory are if need ask electrostatic dissipation, ground connection, conducting or have conducting and when adhesion simultaneously, then can use conductive tape of the present invention, if conductive tape needs and is formed one by adhesion conducting thing surface, then can be by discharge processing, make prominent shape structural material and the melting welding of attached object metal surface be integral for example zinc-plated Copper Foil conductive tape.
(g) conductive and heat-conductive two-sided tape of the present invention, owing to utilize the metal in the adhesive tape directly to contact mutually with affixed object, its heat transfer efficiency is far superior to the heat-conducting cream of tradition use and coats the aluminium foil both sides, make the dusty material of apparatus thermal conductivity and low specific heat in latter's heat-conducting cream mostly, aluminium oxide or titania powder blending silica gel for example in more for example than the insulating properties macromolecular material, because general macromolecular material is hot non-conductor and insulant, its thermally conductive heat coefficient is about 2 * 10
-4(cal/cm
2/ cm/s/ ℃), this value is well below the thermally conductive heat coefficient of metal fever good conductor, copper, tin, gold, silver, by 0.9 to 1.5 (cal/cm
2/ cm/s/ ℃) in the scope, as seen its heat conduction efficiency differs and can reach more than thousand times.
(h) with the pierceability base material, single plastic film or metal/plastic film composite membrane, both sides coating conductive paste, for example a side is used the polypropylene conductive pressure-sensing glue, and the epoxide resin conductive adhesive of opposite side coating overpass degree so makes the both sides glue-line have the surface impedance value (Rs) of dissipation static characteristic between 10
0～10
11(Ω/) and volume impedance (Rv) are between 10 for ohm-sq
0～10
9Ohmcm (Ω cm), the volume impedance (Rv) of vertical thin-film direction then can mat change bondline thickness, base material thickness and unit and are rolled over the gross area that penetrates in the area and must required electrical value, and its volume resistance value (Rv) is between 10
0～10
9Ohmcm (Ω cm), generally speaking the prominent gross area relation of being inversely proportional to of wearing on volume impedance (Rv) and the unit are, herein if the plastic film of use AM aluminum metallization metal is for being rolled into the pierceability base material, then because of there being a middle conductive metal layer to make the shortening of whole conduction approach on the structure, can significantly reduce surface and volume resistance value, thereby the use amount that can significantly reduce conducting medium can reach the electrical conductive tape of wishing to get along parallel or vertical substrate surface.
(i) electrically and thermally conductive adhesive tape of the present invention is because of having the prominent shape independence island metal structure of point on the outermost adhesion surface, when with engaged by coating surface after then have the anti-skidding fixing characteristic of casting anchor.
(j) electrically and thermally conductive adhesive tape of the present invention has similar dry goods surface characteristic, is not easy phenomenon from the fold, does not also therefore have because of being subjected to stress to concentrate formed fracture phenomenon.
(k) the present invention makes the method for adhesive tape, has technology simpler, meticulous and precision height, roll milling wheel more than the existing method of tradition and does not have consume, production capacity height and low cost of manufacture.
Though the present invention is to be disclosed by above-mentioned preferred embodiment; right its is not in order to limit the present invention; any those skilled in the art; without departing from the spirit and scope of the present invention; when can being used for a variety of modifications and variations, so protection scope of the present invention is as the criterion when looking the accompanying Claim person of defining.
Claims
Modification according to the 19th of treaty
1. an electrically and thermally conductive adhesive tape (32) comprises array structure down:
One base material (200);
One first glue-line (204) is positioned at one second side of this base material (200), wherein
This base material (200) has the overshooting shape groove (210) of a plurality of irregular arrangements, these overshooting shape grooves (210) present recess in one first side of this base material, and these overshooting shape grooves present overshooting shape with respect to this second side of this base material, these overshooting shape structures are the prominent island structure of independently a plurality of points after penetrating this first glue-line, this first glue-line (204) then is a continuous phase structure and around prominent island structures of these points independently, makes this heat-conductivity conducting adhesive tape that the function of adhesion and conduction or heat conduction can be provided simultaneously;
One first release layer (205) is positioned at this second side of this base material (200), and covers this first glue-line (204);
This groove (210) is formed on this first glue-line (204), and base material (200) does not extend to the side that glue-line does not contact with base material (200).
2. electrically and thermally conductive adhesive tape as claimed in claim 1 is characterized in that, also comprises one second glue-line, is positioned at this first side of this base material.
3. electrically and thermally conductive adhesive tape as claimed in claim 2 is characterized in that, also comprises one second release layer, is positioned at this first side of this base material, and covers this second glue-line.
4. electrically and thermally conductive adhesive tape as claimed in claim 1 is characterized in that, this base material is a conductive base.
5. electrically and thermally conductive adhesive tape as claimed in claim 4 is characterized in that, this first glue-line is a conductive adhesive layer.
6. electrically and thermally conductive adhesive tape as claimed in claim 4 is characterized in that, this first glue-line is a non-conductive glue-line.
7. electrically and thermally conductive adhesive tape as claimed in claim 1 is characterized in that, this base material is a non-conductive substrate.
8. electrically and thermally conductive adhesive tape as claimed in claim 7 is characterized in that, this first glue-line is a conductive adhesive layer.
9. electrically and thermally conductive adhesive tape comprises array structure down:
One base material (200);
One first glue-line (204) is positioned at one second side of this base material (200), wherein
This base material (200) has the overshooting shape perforate of a plurality of irregular arrangements, these overshooting shape perforates present recess with respect to one first side of this base material, and these overshooting shape perforates present overshooting shape in this second side of this base material, these overshooting shape perforates are the prominent island structure of independently a plurality of points after penetrating this glue-line (204), this remaining face of first glue-line then is a continuous phase structure and around prominent island structures of these points independently, makes this heat-conductivity conducting adhesive tape that the function of adhesion and conduction, heat conduction can be provided simultaneously;
One first release layer (205) is positioned at this second side of this base material (200), and covers this first glue-line; This groove is formed on this first glue-line, and base material does not extend to the side that glue-line does not contact with base material (200).
10. electrically and thermally conductive adhesive tape as claimed in claim 9 is characterized in that, also comprises one second glue-line, is positioned at this first side of this base material.
11. electrically and thermally conductive adhesive tape as claimed in claim 10 is characterized in that, also comprises one second release layer, is positioned at this first side of this base material, and covers this second glue-line.
12. electrically and thermally conductive adhesive tape as claimed in claim 9 is characterized in that, this base material is a conductive base.
13. electrically and thermally conductive adhesive tape as claimed in claim 12 is characterized in that, this first glue-line is a conductive adhesive layer.
14. electrically and thermally conductive adhesive tape as claimed in claim 12 is characterized in that, this first glue-line is a non-conductive glue-line.
15. electrically and thermally conductive adhesive tape as claimed in claim 9 is characterized in that, this base material is a non-conductive substrate.
16. electrically and thermally conductive adhesive tape as claimed in claim 15 is characterized in that, this first glue-line is a conductive adhesive layer.
17. an electrically and thermally conductive adhesive tape comprises array structure down:
One base material;
One metal level is positioned on one second side of this base material;
One first glue-line is positioned on this metal level, and is positioned on this second side of this base material, wherein
This metal level and this base material have the overshooting shape groove of a plurality of irregular arrangements, these overshooting shape grooves present recess in one first side of this base material, and these overshooting shape grooves present overshooting shape in this second side of this base material, these overshooting shape grooves are the prominent island structure of independently a plurality of points after penetrating this glue-line, this first glue-line then is a continuous phase structure and around prominent island structures of these points independently, makes this heat-conductivity conducting adhesive tape that the function of adhesion and conduction, heat conduction can be provided simultaneously;
One first release layer is positioned at this second side of this base material, and covers this first glue-line; This groove is formed on this first glue-line, and base material does not extend to the side that glue-line does not contact with base material.
18. electrically and thermally conductive adhesive tape as claimed in claim 17 is characterized in that, also comprises one second glue-line, is positioned at this first side of this base material.
19. electrically and thermally conductive adhesive tape as claimed in claim 18 is characterized in that, also comprises one second release layer, is positioned at this first side of this base material, and covers this second glue-line.
20. electrically and thermally conductive adhesive tape as claimed in claim 17 is characterized in that, this first glue-line is a conductive adhesive layer.
21. electrically and thermally conductive adhesive tape as claimed in claim 17 is characterized in that, this first glue-line is a non-conductive glue-line.
22. an electrically and thermally conductive adhesive tape comprises array structure down:
One base material;
One metal level is positioned on one second side of this base material;
One first glue-line is positioned on this metal level, and is positioned at this second side of this base material, wherein
This metal level and this base material have the overshooting shape perforate of a plurality of irregular arrangements, these overshooting shape perforates present recess in one first side of this base material, and these overshooting shape perforates present overshooting shape in this second side of this base material, these overshooting shape perforates are the prominent island structure of independently a plurality of metal tips after penetrating this first glue-line, this first glue-line then is a continuous phase structure and around the prominent island structure of these metal tips independently, makes this heat-conductivity conducting adhesive tape that the function of adhesion and conduction, heat conduction can be provided simultaneously;
One first release layer is positioned at this second side of this base material, and covers this first glue-line; This groove is formed on this first glue-line, and base material does not extend to the side that glue-line does not contact with base material.
23. electrically and thermally conductive adhesive tape as claimed in claim 22 is characterized in that, also comprises one second glue-line, is positioned at this first side of this base material.
24. electrically and thermally conductive adhesive tape as claimed in claim 23 is characterized in that, also comprises one second release layer, is positioned at this first side of this base material, and covers this second glue-line.
25. electrically and thermally conductive adhesive tape as claimed in claim 22 is characterized in that, this first glue-line is a conductive adhesive layer.
26. electrically and thermally conductive adhesive tape as claimed in claim 22 is characterized in that, this first glue-line is a non-conductive glue-line.
27. an electrically and thermally conductive adhesive tape comprises array structure down:
One first glue-line;
One first base material and one second base material lay respectively at one first side and one second side of this first glue-line;
One second glue-line is positioned at this first side of this first glue-line and covers this first base material; And
One the 3rd glue-line is positioned at this second side of this first glue-line and covers this second base material, wherein
This first base material has first ridge portion of a plurality of irregular arrangements, these first ridge portions are the prominent island structure of independently a plurality of first points behind this second glue-line for penetrating, and this second glue-line then is a continuous phase structure and around prominent island structures of these first points independently; And
This second base material has second ridge portion of a plurality of irregular arrangements, these second ridge portions are the prominent island structure of independently a plurality of second points behind the 3rd glue-line for penetrating, and the 3rd glue-line then is a continuous phase structure and around prominent island structures of these second points independently.
28. electrically and thermally conductive adhesive tape as claimed in claim 27 is characterized in that, this first base material and second base material are conductive material.
29. electrically and thermally conductive adhesive tape as claimed in claim 28 is characterized in that, this first glue-line, second glue-line and the 3rd glue-line are conducting resinl.
30. electrically and thermally conductive adhesive tape as claimed in claim 28 is characterized in that, this first glue-line, second glue-line and the 3rd glue-line are non-conductive adhesive.
31. electrically and thermally conductive adhesive tape as claimed in claim 28 is characterized in that, this first glue-line, second glue-line and the 3rd glue-line are heat-conducting glue.
32. electrically and thermally conductive adhesive tape as claimed in claim 27 is characterized in that, also comprises one first release layer and second release layer, covers this second glue-line and the 3rd glue-line respectively.
33. an electrically and thermally conductive adhesive tape comprises one first adhesive tape (31) and one second adhesive tape (32), wherein:
This first adhesive tape (31) comprises that one first base material (200) and one first glue-line (204) and second glue-line (206) lay respectively at the both sides of this first base material, this first base material has first ridge portion (311) of a plurality of irregular arrangements, these first ridge portions are the prominent island structure of independently a plurality of first points behind this first glue-line for penetrating, and this first glue-line then is a continuous phase structure and around prominent island structures of these first points independently;
This second adhesive tape (32) comprises that one second base material (200) and one the 3rd glue-line (204) are positioned at a side of this second base material, this base material has second ridge portion of a plurality of irregular arrangements, these second ridge portions are the prominent island structure of independently a plurality of second points behind the 3rd glue-line for penetrating, and the 3rd glue-line then is a continuous phase structure and around prominent island structures of these second points independently; And
This second glue-line of this first adhesive tape (31) is positioned on the opposite side of this second base material.
34. electrically and thermally conductive adhesive tape as claimed in claim 33, wherein this first base material and second base material are conductive material.
35. electrically and thermally conductive adhesive tape as claimed in claim 33 is characterized in that, this first glue-line, second glue-line and the 3rd glue-line are conducting resinl.
36. electrically and thermally conductive adhesive tape as claimed in claim 34 is characterized in that, this first glue-line, second glue-line and the 3rd glue-line are non-conductive adhesive.
37. electrically and thermally conductive adhesive tape as claimed in claim 34 is characterized in that, this first glue-line and second glue-line are non-conductive adhesive, and the 3rd glue-line is a conducting resinl.
38. electrically and thermally conductive adhesive tape as claimed in claim 34 is characterized in that, this first glue-line and second glue-line are non-conductive adhesive, and the 3rd glue-line is a heat-conducting glue.
39. electrically and thermally conductive adhesive tape as claimed in claim 33 is characterized in that, also comprises one first release layer and second release layer, covers this second glue-line and the 3rd glue-line respectively.
40. electrically and thermally conductive adhesive tape, form by crooked applying of an adhesive tape, one end of this electrically and thermally conductive adhesive tape presents connection status, wherein this adhesive tape comprises that a base material and one first glue-line and second glue-line lay respectively at the both sides of this base material, wherein this base material has the ridge portion of a plurality of irregular arrangements, these ridge portions are the prominent island structure of independently a plurality of points behind this first glue-line for penetrating, and this first glue-line then is a continuous phase structure and around prominent island structures of these points independently.
41. electrically and thermally conductive adhesive tape as claimed in claim 40 is characterized in that, this base material is a conductive material.
42. electrically and thermally conductive adhesive tape as claimed in claim 41 is characterized in that, this first glue-line and second glue-line are conducting resinl.
43. electrically and thermally conductive adhesive tape as claimed in claim 41 is characterized in that, this first glue-line and second glue-line are non-conductive adhesive.
44. electrically and thermally conductive adhesive tape as claimed in claim 41 is characterized in that, also comprises a release layer, covers this first glue-line.
45. a conduction sticking tablet comprises array structure down:
One metal base;
A connection piece is fixed in one first side of this metal base, and this connector has a connector, and this connector electrically connects this metal base; And
One glue-line covers one second side of this metal base, wherein
This metal base has the ridge portion of a plurality of irregular arrangements, these ridge portions protrude in this second side of this metal base, and be the prominent island structure of independently a plurality of points after penetrating this glue-line, this glue-line then is a continuous phase structure and around prominent island structures of these points independently, makes this conduction sticking tablet that adhesion and the function of conducting electricity can be provided simultaneously.
46. electrically and thermally conductive adhesive tape as claimed in claim 45 is characterized in that, this glue-line is a conducting resinl.
47. electrically and thermally conductive adhesive tape as claimed in claim 45 is characterized in that, this glue-line is a non-conductive adhesive.
48. electrically and thermally conductive adhesive tape as claimed in claim 45 is characterized in that, this connector is a public plug.
49. electrically and thermally conductive adhesive tape as claimed in claim 45 is characterized in that, this connector is the female plug seat.
50. the manufacture method of an electrically and thermally conductive adhesive tape is formed by crooked applying of an adhesive tape, an end of this electrically and thermally conductive adhesive tape presents connection status, and the manufacture method of this electrically and thermally conductive adhesive tape comprises:
One adhesive tape is provided, this adhesive tape comprises that a base material and one first glue-line lay respectively at a side of this base material, wherein this base material has the ridge portion of a plurality of irregular arrangements, these ridge portions are the prominent island structure of independently a plurality of points behind this first glue-line for penetrating, and this first glue-line then is a continuous phase structure and around prominent island structures of these points independently;
Be coated with one second glue-line and cover the opposite side of this base material;
Crooked this adhesive tape utilizes the viscosity of this second glue-line to form the adhesive tape of heat-conductivity conducting.
51. the manufacture method of electrically and thermally conductive adhesive tape as claimed in claim 50, it is characterized in that, be coated with in the step of this second glue-line, this substrate surface that also comprises the cover part, and be coated with this substrate surface of this second glue-line corresponding to this substrate surface that is not coated with this second glue-line after this adhesive tape bending.
52. the manufacture method of electrically and thermally conductive adhesive tape as claimed in claim 50 is characterized in that, is coated with in the step of this second glue-line, more comprises all surfaces that covers this base material.
Claims (55)
1. an electrically and thermally conductive adhesive tape (32) comprises array structure down:
One base material (200);
One first glue-line (204) is positioned at one second side of this base material (200), wherein
This base material (200) has the overshooting shape groove (210) of a plurality of irregular arrangements, these overshooting shape grooves (210) present recess in one first side of this base material, and these overshooting shape grooves present overshooting shape with respect to this second side of this base material, these overshooting shape structures are the prominent island structure of independently a plurality of metal tips after penetrating this first glue-line, this first glue-line (204) then is a continuous phase structure and around the prominent island structure of these metal tips independently, makes this heat-conductivity conducting adhesive tape that the function of adhesion and conduction or heat conduction can be provided simultaneously.
2. electrically and thermally conductive adhesive tape as claimed in claim 1 is characterized in that, also comprises one first release layer, is positioned at this second side of this base material, and covers this first glue-line.
3. electrically and thermally conductive adhesive tape as claimed in claim 2 is characterized in that, also comprises one second glue-line, is positioned at this first side of this base material.
4. electrically and thermally conductive adhesive tape as claimed in claim 3 is characterized in that, also comprises one second release layer, is positioned at this first side of this base material, and covers this second glue-line.
5. electrically and thermally conductive adhesive tape as claimed in claim 1 is characterized in that, this base material is a conductive base.
6. electrically and thermally conductive adhesive tape as claimed in claim 5 is characterized in that, this first glue-line is a conductive adhesive layer.
7. electrically and thermally conductive adhesive tape as claimed in claim 5 is characterized in that, this first glue-line is a non-conductive glue-line.
8. electrically and thermally conductive adhesive tape as claimed in claim 1 is characterized in that, this base material is a non-conductive substrate.
9. electrically and thermally conductive adhesive tape as claimed in claim 8 is characterized in that, this first glue-line is a conductive adhesive layer.
10. an electrically and thermally conductive adhesive tape (32) comprises array structure down:
One base material (200);
One first glue-line (204) is positioned at one second side of this base material (200), wherein
This base material (200) has the overshooting shape perforate of a plurality of irregular arrangements, these overshooting shape perforates present recess with respect to one first side of this base material, and these overshooting shape perforates present overshooting shape in this second side of this base material, these overshooting shape perforates are the prominent island structure of independently a plurality of metal tips after penetrating this glue-line (204), this remaining face of first glue-line then is a continuous phase structure and around the prominent island structure of these metal tips independently, makes this heat-conductivity conducting adhesive tape that the function of adhesion and conduction, heat conduction can be provided simultaneously.
11. electrically and thermally conductive adhesive tape as claimed in claim 10 is characterized in that, also comprises one first release layer, is positioned at this second side of this base material, and covers this first glue-line.
12. electrically and thermally conductive adhesive tape as claimed in claim 11 is characterized in that, also comprises one second glue-line, is positioned at this first side of this base material.
13. electrically and thermally conductive adhesive tape as claimed in claim 12 is characterized in that, also comprises one second release layer, is positioned at this first side of this base material, and covers this second glue-line.
14. electrically and thermally conductive adhesive tape as claimed in claim 10 is characterized in that, this base material is a conductive base.
15. electrically and thermally conductive adhesive tape as claimed in claim 14 is characterized in that, this first glue-line is a conductive adhesive layer.
16. electrically and thermally conductive adhesive tape as claimed in claim 14 is characterized in that, this first glue-line is a non-conductive glue-line.
17. electrically and thermally conductive adhesive tape as claimed in claim 10 is characterized in that, this base material is a non-conductive substrate.
18. electrically and thermally conductive adhesive tape as claimed in claim 17 is characterized in that, this first glue-line is a conductive adhesive layer.
19. an electrically and thermally conductive adhesive tape comprises array structure down:
One base material;
One metal level is positioned on one second side of this base material;
One first glue-line is positioned on this metal level, and is positioned on this second side of this base material, wherein
This metal level and this base material have the overshooting shape groove of a plurality of irregular arrangements, these overshooting shape grooves present recess in one first side of this base material, and these overshooting shape grooves present overshooting shape in this second side of this base material, these overshooting shape grooves are the prominent island structure of independently a plurality of metal tips after penetrating this glue-line, this first glue-line then is a continuous phase structure and around the prominent island structure of these metal tips independently, makes this heat-conductivity conducting adhesive tape that the function of adhesion and conduction, heat conduction can be provided simultaneously.
20. electrically and thermally conductive adhesive tape as claimed in claim 19 is characterized in that, also comprises one first release layer, is positioned at this second side of this base material, and covers this first glue-line.
21. electrically and thermally conductive adhesive tape as claimed in claim 20 is characterized in that, comprises that also one second glue-line is positioned at this first side of this base material.
22. electrically and thermally conductive adhesive tape as claimed in claim 21 is characterized in that, also comprises one second release layer, is positioned at this first side of this base material, and covers this second glue-line.
23. electrically and thermally conductive adhesive tape as claimed in claim 19 is characterized in that, this first glue-line is a conductive adhesive layer.
24. electrically and thermally conductive adhesive tape as claimed in claim 19 is characterized in that, this first glue-line is a non-conductive glue-line.
25. an electrically and thermally conductive adhesive tape comprises array structure down:
One base material;
One metal level is positioned on one second side of this base material;
One first glue-line is positioned on this metal level, and is positioned at this second side of this base material, wherein
This metal level and this base material have the overshooting shape perforate of a plurality of irregular arrangements, these overshooting shape perforates present recess in one first side of this base material, and these overshooting shape perforates present overshooting shape in this second side of this base material, these overshooting shape perforates are the prominent island structure of independently a plurality of points after penetrating this first glue-line, this first glue-line then is a continuous phase structure and around prominent island structures of these points independently, makes this heat-conductivity conducting adhesive tape that the function of adhesion and conduction, heat conduction can be provided simultaneously.
26. electrically and thermally conductive adhesive tape as claimed in claim 25 is characterized in that, also comprises one second glue-line, is positioned at this first side of this base material.
27. electrically and thermally conductive adhesive tape as claimed in claim 26 is characterized in that, also comprises one second release layer, is positioned at this first side of this base material, and covers this second glue-line.
28. electrically and thermally conductive adhesive tape as claimed in claim 25 is characterized in that, this first glue-line is a conductive adhesive layer.
29. electrically and thermally conductive adhesive tape as claimed in claim 25 is characterized in that, this first glue-line is a non-conductive glue-line.
30. an electrically and thermally conductive adhesive tape comprises array structure down:
One first glue-line;
One first base material and one second glue-line lay respectively at one first side and one second side of this first glue-line;
One second glue-line is positioned at this first side of this first glue-line and covers this first base material; And
One the 3rd glue-line is positioned at this second side of this first glue-line and covers this second base material, wherein
This first base material has first ridge portion of a plurality of irregular arrangements, these first ridge portions are the prominent island structure of independently a plurality of first points behind this second glue-line for penetrating, and this second glue-line then is a continuous phase structure and around prominent island structures of these first points independently; And
This second base material has second ridge portion of a plurality of irregular arrangements, these second ridge portions are the prominent island structure of independently a plurality of second points behind the 3rd glue-line for penetrating, and the 3rd glue-line then is a continuous phase structure and around prominent island structures of these second points independently.
31. electrically and thermally conductive adhesive tape as claimed in claim 30 is characterized in that, this first base material and second base material are conductive material.
32. electrically and thermally conductive adhesive tape as claimed in claim 31 is characterized in that, this first glue-line, second glue-line and the 3rd glue-line are conducting resinl.
33. electrically and thermally conductive adhesive tape as claimed in claim 31 is characterized in that, this first glue-line, second glue-line and the 3rd glue-line are non-conductive adhesive.
34. electrically and thermally conductive adhesive tape as claimed in claim 31 is characterized in that, this first glue-line, second glue-line and the 3rd glue-line are heat-conducting glue.
35. electrically and thermally conductive adhesive tape as claimed in claim 30 is characterized in that, also comprises one first release layer and second release layer, covers this second glue-line and the 3rd glue-line respectively.
36. an electrically and thermally conductive adhesive tape comprises one first adhesive tape and one second adhesive tape, wherein:
This first adhesive tape (31) comprises that one first base material (200) and one first glue-line (204) and second glue-line (206) lay respectively at the both sides of this first base material, this first base material has first ridge portion (311) of a plurality of irregular arrangements, these first ridge portions are the prominent island structure of independently a plurality of first points behind this first glue-line for penetrating, and this first glue-line then is a continuous phase structure and around prominent island structures of these first points independently;
This second adhesive tape (32) comprises that one second base material (200) and one the 3rd glue-line (204) are positioned at a side of this second base material, this base material has second ridge portion of a plurality of irregular arrangements, these second ridge portions are the prominent island structure of independently a plurality of second points behind the 3rd glue-line for penetrating, and the 3rd glue-line then is a continuous phase structure and around prominent island structures of these second points independently; And
This second glue-line of this first adhesive tape (31) is positioned on the opposite side of this second base material.
37. electrically and thermally conductive adhesive tape as claimed in claim 36, wherein this first base material and second base material are conductive material.
38. electrically and thermally conductive adhesive tape as claimed in claim 36 is characterized in that, this first glue-line, second glue-line and the 3rd glue-line are conducting resinl.
39. electrically and thermally conductive adhesive tape as claimed in claim 37 is characterized in that, this first glue-line, second glue-line and the 3rd glue-line are non-conductive adhesive.
40. electrically and thermally conductive adhesive tape as claimed in claim 37 is characterized in that, this first glue-line and second glue-line are non-conductive adhesive, and the 3rd glue-line is a conducting resinl.
41. electrically and thermally conductive adhesive tape as claimed in claim 37 is characterized in that, this first glue-line and second glue-line are non-conductive adhesive, and the 3rd glue-line is a heat-conducting glue.
42. electrically and thermally conductive adhesive tape as claimed in claim 36 is characterized in that, also comprises one first release layer and second release layer, covers this second glue-line and the 3rd glue-line respectively.
43. electrically and thermally conductive adhesive tape, form by crooked applying of an adhesive tape, one end of this electrically and thermally conductive adhesive tape presents connection status, wherein this adhesive tape comprises that a base material and one first glue-line and second glue-line lay respectively at the both sides of this base material, wherein this base material has the ridge portion of a plurality of irregular arrangements, these ridge portions are the prominent island structure of independently a plurality of points behind this first glue-line for penetrating, and this first glue-line then is a continuous phase structure and around prominent island structures of these points independently.
44. electrically and thermally conductive adhesive tape as claimed in claim 43 is characterized in that, this base material is a conductive material.
45. electrically and thermally conductive adhesive tape as claimed in claim 44 is characterized in that, this first glue-line and second glue-line are conducting resinl.
46. electrically and thermally conductive adhesive tape as claimed in claim 44 is characterized in that, this first glue-line and second glue-line are non-conductive adhesive.
47. electrically and thermally conductive adhesive tape as claimed in claim 44 is characterized in that, also comprises a release layer, covers this first glue-line.
48. a conduction sticking tablet comprises array structure down:
One metal base;
A connection piece is fixed in one first side of this metal base, and this connector has a connector, and this connector electrically connects this metal base; And
One glue-line covers one second side of this metal base, wherein
This metal base has the ridge portion of a plurality of irregular arrangements, these ridge portions protrude in this second side of this metal base, and be the prominent island structure of independently a plurality of points after penetrating this glue-line, this glue-line then is a continuous phase structure and around prominent island structures of these points independently, makes this conduction sticking tablet that adhesion and the function of conducting electricity can be provided simultaneously.
49. electrically and thermally conductive adhesive tape as claimed in claim 48 is characterized in that, this glue-line is a conducting resinl.
50. electrically and thermally conductive adhesive tape as claimed in claim 48 is characterized in that, this glue-line is a non-conductive adhesive.
51. electrically and thermally conductive adhesive tape as claimed in claim 48 is characterized in that, this connector is a public plug.
52. electrically and thermally conductive adhesive tape as claimed in claim 48 is characterized in that, this connector is the female plug seat.
53. the manufacture method of an electrically and thermally conductive adhesive tape is formed by crooked applying of an adhesive tape, an end of this electrically and thermally conductive adhesive tape presents connection status, and the manufacture method of this electrically and thermally conductive adhesive tape comprises:
One adhesive tape is provided, this adhesive tape comprises that a base material and one first glue-line lay respectively at a side of this base material, wherein this base material has the ridge portion of a plurality of irregular arrangements, these ridge portions are the prominent island structure of independently a plurality of points behind this first glue-line for penetrating, and this first glue-line then is a continuous phase structure and around prominent island structures of these points independently;
Be coated with one second glue-line and cover the opposite side of this base material;
Crooked this adhesive tape utilizes the viscosity of this second glue-line to form the adhesive tape of heat-conductivity conducting.
54. the manufacture method of electrically and thermally conductive adhesive tape as claimed in claim 53, it is characterized in that, be coated with in the step of this second glue-line, this substrate surface that also comprises the cover part, and be coated with this substrate surface of this second glue-line corresponding to this substrate surface that is not coated with this second glue-line after this adhesive tape bending.
55. the manufacture method of electrically and thermally conductive adhesive tape as claimed in claim 53 is characterized in that, is coated with in the step of this second glue-line, more comprises all surfaces that covers this base material.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US28600699A | 1999-04-05 | 1999-04-05 | |
| US09/286,006 | 1999-04-05 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1303329A true CN1303329A (en) | 2001-07-11 |
| CN1123440C CN1123440C (en) | 2003-10-08 |
Family
ID=23096642
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN99806793A Expired - Fee Related CN1123440C (en) | 1999-04-05 | 1999-06-29 | Multi-functional electrically and thermally conductive adhesive tape |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP2002541268A (en) |
| CN (1) | CN1123440C (en) |
| GB (1) | GB2353740A (en) |
| TW (1) | TW442554B (en) |
| WO (1) | WO2000059715A1 (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102118916A (en) * | 2009-12-30 | 2011-07-06 | 昆山雅森电子材料科技有限公司 | Heat-conducting covering film |
| CN102286254A (en) * | 2011-05-06 | 2011-12-21 | 广州方邦电子有限公司 | High-peeling-strength conductive adhesive film with through holes and preparation method thereof |
| CN103031074A (en) * | 2011-09-29 | 2013-04-10 | 黄伟 | Pressure-sensitive adhesive tape for heat conductivity and processing method |
| CN103072324A (en) * | 2012-12-28 | 2013-05-01 | 深圳创怡兴实业有限公司 | Electrostatic flocked product with stable impedance values |
| CN102176481B (en) * | 2006-04-26 | 2013-06-05 | 日立化成株式会社 | Adhesive tape and solar cell module using the same |
| CN107316972A (en) * | 2017-07-26 | 2017-11-03 | 苏长敏 | Conductive tab and flame-retardant conductive tab component applied to lithium ion battery |
| CN112552838A (en) * | 2020-12-18 | 2021-03-26 | 苏州佳值电子工业有限公司 | Copper-based heat dissipation vibration reduction composite film |
| CN115287009A (en) * | 2022-07-14 | 2022-11-04 | 深圳稀导技术有限公司 | Multi-channel heat conduction gasket and manufacturing method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4650822B2 (en) * | 2001-05-24 | 2011-03-16 | パナソニック株式会社 | Flat panel display |
| KR100774440B1 (en) * | 2007-01-17 | 2007-11-08 | 조인셋 주식회사 | Conductive pressure sensitive adhesive tape |
| JP2013116929A (en) * | 2011-12-01 | 2013-06-13 | Nitto Denko Corp | Conductive adhesive sheet, method for producing the same, collector electrode, and solar cell module |
| US9669426B2 (en) | 2013-05-14 | 2017-06-06 | Boe Hyundai Lcd Inc. | Heat conductive adhesive film, method for manufacturing the same and OLED panel |
| CN103331245B (en) * | 2013-05-14 | 2015-04-08 | 京东方科技集团股份有限公司 | Heat conduction glue film, fabrication method thereof, and OLED panel |
| CN105419671B (en) * | 2016-01-04 | 2019-01-04 | 京东方科技集团股份有限公司 | A kind of adhesive tape and preparation method thereof, display device |
| MX2018012380A (en) | 2016-04-11 | 2019-02-20 | Eaton Intelligent Power Ltd | Ground impedance measurement of a conduit system. |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3497383A (en) * | 1967-08-22 | 1970-02-24 | Minnesota Mining & Mfg | Electrically conductive adhesive tape |
| JPS58128509U (en) * | 1982-02-24 | 1983-08-31 | 日東電工株式会社 | Conductive adhesive tape or sheet |
| US4859189A (en) * | 1987-09-25 | 1989-08-22 | Minnesota Mining And Manufacturing Company | Multipurpose socket |
-
1999
- 1999-05-19 TW TW088108165A patent/TW442554B/en not_active IP Right Cessation
- 1999-06-29 WO PCT/US1999/014690 patent/WO2000059715A1/en active Application Filing
- 1999-06-29 GB GB0028271A patent/GB2353740A/en not_active Withdrawn
- 1999-06-29 JP JP2000609252A patent/JP2002541268A/en active Pending
- 1999-06-29 CN CN99806793A patent/CN1123440C/en not_active Expired - Fee Related
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102176481B (en) * | 2006-04-26 | 2013-06-05 | 日立化成株式会社 | Adhesive tape and solar cell module using the same |
| CN102118916A (en) * | 2009-12-30 | 2011-07-06 | 昆山雅森电子材料科技有限公司 | Heat-conducting covering film |
| CN102118916B (en) * | 2009-12-30 | 2013-10-09 | 昆山雅森电子材料科技有限公司 | Heat-conducting covering film |
| CN102286254A (en) * | 2011-05-06 | 2011-12-21 | 广州方邦电子有限公司 | High-peeling-strength conductive adhesive film with through holes and preparation method thereof |
| CN103031074A (en) * | 2011-09-29 | 2013-04-10 | 黄伟 | Pressure-sensitive adhesive tape for heat conductivity and processing method |
| CN103072324A (en) * | 2012-12-28 | 2013-05-01 | 深圳创怡兴实业有限公司 | Electrostatic flocked product with stable impedance values |
| CN107316972A (en) * | 2017-07-26 | 2017-11-03 | 苏长敏 | Conductive tab and flame-retardant conductive tab component applied to lithium ion battery |
| CN112552838A (en) * | 2020-12-18 | 2021-03-26 | 苏州佳值电子工业有限公司 | Copper-based heat dissipation vibration reduction composite film |
| CN115287009A (en) * | 2022-07-14 | 2022-11-04 | 深圳稀导技术有限公司 | Multi-channel heat conduction gasket and manufacturing method thereof |
| CN115287009B (en) * | 2022-07-14 | 2023-10-20 | 深圳稀导技术有限公司 | Multi-channel heat conduction gasket and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2002541268A (en) | 2002-12-03 |
| GB2353740A (en) | 2001-03-07 |
| GB0028271D0 (en) | 2001-01-03 |
| CN1123440C (en) | 2003-10-08 |
| WO2000059715A1 (en) | 2000-10-12 |
| TW442554B (en) | 2001-06-23 |
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| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20031008 Termination date: 20120629 |