CN1298030C - Precisively butting apparatus for photoelectric device package - Google Patents

Precisively butting apparatus for photoelectric device package Download PDF

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Publication number
CN1298030C
CN1298030C CNB2003101108477A CN200310110847A CN1298030C CN 1298030 C CN1298030 C CN 1298030C CN B2003101108477 A CNB2003101108477 A CN B2003101108477A CN 200310110847 A CN200310110847 A CN 200310110847A CN 1298030 C CN1298030 C CN 1298030C
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China
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rods
opto
electronic device
micro
docking facilities
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CNB2003101108477A
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CN1614758A (en
Inventor
范守文
李辉
吴献钢
陈畅
袁太文
洪涛
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University of Electronic Science and Technology of China
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University of Electronic Science and Technology of China
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Abstract

The present invention provides a precise interfacing device used for packaging photoelectronic devices. The present invention is composed of a base (1), a two-way translational platform, four positioning bases (4, 7, 23, 26), a movable platform (9), rods (6, 19, 20, 24) in fixed length, an upper optical fiber clamping device (13), a lower optical fiber clamp (10), etc., wherein one end of each of the rods (6, 19, 20, 24) in fixed length is connected with the movable platform (8) through a spherical hinge, the other end of each of the rods (6, 20) with fixed length is connected with the positioning bases (4, 23) through a revolute pair, the rods (19, 24) with fixed length are connected with the positioning bases (7, 26) through hook hinges or spherical hinges, and a spatial parallel connection closed chain mechanism is formed. The present invention has the advantages of simple and compact structure, simple control, high movement resolution, moving decoupling, good dynamic performance, etc. The present invention can realize micro-motion interfacing packaging operation with high resolution to improve the packaging yield of photoelectronic devices.

Description

A kind of accurate docking facilities that is used for the opto-electronic device encapsulation
Technical field
This invention belongs to the light mechanical and electrical integration field, and it is particularly related to the accurate encapsulation technology of opto-electronic device.
Background technology
Encapsulation is very big with the reliability relation of opto-electronic device, and the packaging cost of integrated opto-electronics device accounts for the 70-90% of its total cost.Automatic butt device and technology are the key technologies of opto-electronic device encapsulation, and it can reduce production costs, and enhance productivity, and guarantee device quality.In the research of precise jiggle docking mechanism, parallel institution especially causes people's attention, this mainly is because parallel institution has the following advantages: (1) compact conformation (2) design processing is simple, can place on the pedestal (4) error value product to involve to the sensitivity of temperature not high (3) driver amplifies little (5) natural frequency height, has avoided the uncontrollable repetitive error of being introduced by vibrations.
Si Taodun (Stoughton) has designed a kind of jiggle robot of being made up of two parallel institutions, and each parallel institution is made up of six piezoelectric elements; Hu Genzi (Hudgens) and special plug (Tesar) have proposed this base of a fruit watt (Stewart) platform jiggle robot of a kind of complete parallel connection; More domestic units have also developed six-freedom parallel jiggle robot (Harbin Institute of Technology) based on GENERAL TYPE Stewart structure, series-parallel connection six-freedom micro displacement robot (BJ University of Aeronautics ﹠ Astronautics), based on the cell manipulation jiggle robot (Tongji University) and the parallel micromotion decoupling-structure jogging robot (University On The Mountain Of Swallows) of its (Delta) mechanism of Dare.They contribute with progressive for the development of jiggle robot, and the some of them achievement in research has been applied for patent.The bibliographical information that at present relevant opto-electronic device encapsulates automatically is few, and known to the inventor, the patent documentation of the accurate docking facilities of relevant opto-electronic device encapsulation does not almost have.
Summary of the invention
The object of the present invention is to provide a kind of accurate docking facilities that is used for the opto-electronic device encapsulation, advantages such as that this device has is simple and compact for structure, control simple, Motion Resolution rate height, mobile decoupling, dynamic property are good, can realize high-resolution fine motion butt joint encapsulation operation, to improve the encapsulation rate of finished products of opto-electronic device.
The technical scheme of the accurate docking facilities that is used for opto-electronic device encapsulation of the present invention is as follows:
A kind of accurate docking facilities that is used for the opto-electronic device encapsulation provided by the invention, as shown in Figure 1, it is characterized in that it is by pedestal 1,2,27, four positioning seats 4,7,23,26 of two-way translation platform, moving platform 9, connecting-rods with constant lengh 6,19,20,24, last optic fibre clamp, following fiber clamp 10, and laser welding gun 11,16,22 is formed; Said connecting-rods with constant lengh is 4, one end of connecting-rods with constant lengh 6,19,20,24 links by ball pivot and moving platform 9, link by revolute pair at the other end of connecting-rods with constant lengh 6,20 and positioning seat 4,23, connecting-rods with constant lengh 19,24 links by Hooke's hinge or ball pivot and positioning seat 7,26, thereby has formed space closed chain mechanism in parallel; Said two-way translation platform can be positioned at the top (as shown in Figure 12,27) of pedestal 1, also can be positioned at upper rack (as shown in Figure 2 38,40); Said fiber clamp 10 down is fixed on the moving platform 9, and last optic fibre clamp is made up of arc flexure spring 12, fiber clamp 13, micro-displacement driver 14, is positioned at upper rack; Laser welding gun 11,16,22 is positioned at and is mutually 120 ° of evenly distributions on the loop bracket 17, and loop bracket 17 connects firmly with rigidity of frame.
Need to prove:
Described positioning seat is made up of parallel-plate compliant translational joint 67, micro-displacement driver 66, positioning seat pedestal 65, by shown in Figure 5;
Above-mentioned ball pivot, Hooke's hinge and revolute pair are flexible hinge structure; Said micro-displacement driver 14,66 can be a piezoelectric micro-displacement actuator, also can be the micro-displacement driver of other type;
The anchor clamps 10,13 of above-mentioned fixed fiber can adopt step motor drive, also can adopt pneumatic; Form optic fibre clamp by arc flexure spring 12, fiber clamp 13, micro-displacement driver 14, can realize little translation of Y direction;
Said two-way translation platform can be realized the translation of X, Y direction under the driving of stepping motor;
Need to prove to be provided with two CCD cameras 15,18 on the loop bracket 17, be respectively applied for the alignment error of detection fiber in X-axis and Y direction; Laser welding gun 11,16,22, the molten solder that is used to dock optical fiber.
Because the present invention has adopted the space four-freedom parallel mechanism, and the space four-freedom parallel mechanism has characteristics such as kinematic accuracy height, mobile decoupling, as shown in Figure 3.Advantages such as that the accurate docking facilities that is used for the opto-electronic device encapsulation therefore provided by the invention has is simple and compact for structure, control is simple, Motion Resolution rate height, mobile decoupling, dynamic property are good, it can realize high-resolution fine motion butt joint encapsulation operation, to improve the encapsulation rate of finished products of opto-electronic device.
Description of drawings:
Accompanying drawing 1 is the general structure schematic diagram that is used for the accurate docking facilities embodiment one of opto-electronic device encapsulation of the present invention
1 pedestal among the figure, 2X be to mobile platform, 3 stepping motors, 4 positioning seats, 5 flexible revolute pairs, 6 connecting-rods with constant lenghs, 7 positioning seats, 8 flexible ball pivots, 9 moving platforms, 10 fiber clamps, 11 laser welding guns, 12 arc flexure springs, 13 fiber clamps, 14 micro-displacement drivers, 15CCD camera, 16 laser welding guns, 17 loop brackets, 18CCD camera, 19 connecting-rods with constant lenghs, 20 connecting-rods with constant lenghs, 21 flexible ball pivots, 22 laser welding guns, 23 positioning seats, 24 connecting-rods with constant lenghs, 25 flexible Hooke's hinge or ball pivots, 26 positioning seats, 27Y are to mobile platform, 28 stepping motors.
Accompanying drawing 2 is the general structure schematic diagram that is used for the accurate docking facilities embodiment two of opto-electronic device encapsulation of the present invention
29 pedestals among the figure, 30 positioning seats, 31 flexible revolute pairs, 32 connecting-rods with constant lenghs, 33 positioning seats, 34 flexible ball pivots, 35 moving platforms, 36 fiber clamps, 37 stepping motors, 38Y is to mobile platform, 39 laser welding guns, and 40X is to mobile platform, 41 stepping motors, 42 arc flexure springs, 43CCD camera, 44 micro-displacement drivers, 45 laser welding guns, 46 fiber clamps, the 47CCD camera, 48 loop brackets, 49 connecting-rods with constant lenghs, 50 laser welding guns, 51 connecting-rods with constant lenghs, 52 flexible ball pivots, 53 positioning seats, 54 connecting-rods with constant lenghs, 55 flexible Hooke's hinge or ball pivots, 56 positioning seats.
Accompanying drawing 3 is the schematic diagram of space four-freedom parallel mechanism
C among the figure 1, C 2, C 3, C 1The expression ball pivot, B 1, B 3Expression Hooke's hinge or ball pivot, B 2, B 4The expression revolute pair.
Accompanying drawing 4 is the schematic diagram of the Precision trimming mechanism of laser welding gun
57 rotational pins among the figure, 58 laser welding guns, 59 little snap rings, 60 micrometer adjusting screws, 61 big snap rings, 62 rotational pins, 63 supporting traverses, 64 supporting bases.
Accompanying drawing 5 is the positioning seat structural representation
Accompanying drawing 6 is that the A-A of positioning seat in the accompanying drawing 5 is to the sectional structure schematic diagram
65 is the positioning seat pedestal among the figure, and 66 is micro-displacement driver, and 67 is the parallel-plate compliant translational joint.
Embodiment
Below in conjunction with accompanying drawing, introduce two kinds of structure and operation principles of the present invention in detail based on the accurate docking facilities embodiment that is used for the opto-electronic device encapsulation of four-freedom parallel mechanism.
Embodiment one
Accompanying drawing 1 is one embodiment of the present of invention.This accurate docking facilities that is used for opto-electronic device encapsulation is by pedestal 1, moving platform 9, connecting-rods with constant lengh 6,19,20,24, positioning seat 4,7,23,26, micro-displacement driver, two- way translation platform 2,27, and composition such as fiber clamp 10,13.Link by 4 connecting-rods with constant lenghs between pedestal 1 and the moving platform 9, wherein the parallel-plate moving sets on two connecting-rods with constant lengh 6,20 1 ends and the positioning seat 4,23 links by revolute pair, the other end links by ball pivot and moving platform 9, two other connecting-rods with constant lengh 19,24 1 ends link by the parallel-plate moving sets on Hooke's hinge or ball pivot and the positioning seat 7,26, the other end links by ball pivot and moving platform 9, thereby has formed space parallel mechanism.Said revolute pair, Hooke's hinge or ball pivot all refer to flexible hinge, and the parallel-plate moving sets all adopts micro positioner to drive.On moving platform 9 and upper bracket, be provided with the anchor clamps 10,13 of clamping optical fiber, wherein the fiber clamp on the upper bracket 13 can realize under the driving of the micro-displacement driver of a side that the little of Y direction moves, opposite side is provided with arc flexure spring 12, and the pedestal and the upper bracket rigidity of the pedestal of micro-displacement driver 14 and arc flexure spring 12 connect firmly.Two- way translation platform 2,27 is installed on the pedestal, two-way translation platform can be realized the translation of X, Y direction under the driving of stepping motor 3,28, positioning seat 4,7,23,26, connecting-rods with constant lengh 6,19,20,24, the fiber clamp 10 on moving platform 9 and the moving platform all can move along with moving of two-way translation platform 2,27.Loop bracket 17 is provided with two CCD cameras 15,18, be used to provide the precision positions feedback information, also be provided with three laser welding guns 11,16,22 of 120 ° each other on the loop bracket 17, be used to dock the molten solder of optical fiber, the Precision trimming mechanism of laser welding gun 11,16,22 as shown in Figure 4.
Embodiment two
Accompanying drawing 2 is an alternative embodiment of the invention.By pedestal 29, moving platform 35, connecting-rods with constant lengh 32,49,51,54, positioning seat 30,33,53,56, micro-displacement driver, two-way translation platform 38,40, and composition such as fiber clamp 36,46.Link by 4 connecting-rods with constant lenghs between pedestal 29 and the moving platform 35, wherein the parallel-plate moving sets on two connecting-rods with constant lengh 32,51 1 ends and the positioning seat links by revolute pair, the other end links by ball pivot and moving platform 35, two other connecting-rods with constant lengh 49,54 1 ends link by the parallel-plate moving sets on Hooke's hinge or ball pivot and the positioning seat, the other end links by ball pivot and moving platform 35, thereby has formed space parallel mechanism.Positioning seat is provided with micro-displacement driver, and said revolute pair, Hooke's hinge or ball pivot all refer to flexible hinge, and the parallel-plate moving sets all adopts micro positioner to drive.On moving platform 35 and upper bracket, be provided with fiber clamp 36,46, wherein the fiber clamp on the upper bracket 46 can realize under the driving of the micro-displacement driver 44 of a side that the little of Y direction moves, opposite side is provided with arc-shaped elastic pair 42, and the pedestal and the upper bracket rigidity of the pedestal of micro-displacement driver 44 and arc flexure spring 42 connect firmly.Upper bracket is provided with two-way translation platform 38,40, can drive micro-displacement driver 44, fiber clamp 46 and the arc flexure spring 42 realization X on it, the translation of Y direction under the driving of stepping motor 37,41.Loop bracket 48 is provided with 43,47 and three of two CCD cameras, 120 ° laser welding gun 39,45,50 each other, and the Precision trimming mechanism of laser welding gun 11,16,22 as shown in Figure 4.。
Accompanying drawing 4 is the schematic diagram of the Precision trimming mechanism of laser welding gun.57,62 is bearing pin among the figure, and 58 is the laser welding gun, and 59,61 is snap ring, and 60 is micrometer adjusting screw, and 63 is crossbeam, and 64 is supporting base.By adjusting the attitude up and down that micrometer adjusting screw 60 can fine adjustment laser welding gun.
Need to prove that the foregoing description one with the difference of embodiment two is: said two-way translation platform can be positioned at the top of pedestal 1,2,27 in as shown in Figure 1; Also can be positioned at upper rack, 38,40 in as shown in Figure 2.
The course of work of the present invention: the process that the present invention is used for the opto-electronic device encapsulation can be divided into thick butt joint and two operating process of smart butt joint.LASER Light Source and light power meter are at first opened in thick butt joint, the starting power trace routine, realize carrying out the luminous power search by the two-way translation platform of step motor drive, when detected luminous power surpasses the noise level of a certain setting, start smart docking operation and carry out the fine motion adjusting; Be positioned at 4 micro-displacement drivers on the two-way translation platform and be positioned at micro-displacement driver on the frame by control, under the guiding of power system, carry out the precise jiggle butt joint, till searching maximum power point.After finishing, butt joint, finishes the molten solder work of butt joint optical fiber enabling laser welding gun irradiation junction.
Advantages such as that this accurate docking facilities that is used for opto-electronic device encapsulation has is simple and compact for structure, low cost of manufacture, control are simple, Motion Resolution rate height, dynamic characteristic are good, mobile decoupling, accumulated error are little, can realize high-resolution fine motion docking operation, improve the rate of finished products of opto-electronic device encapsulation.And can be applicable to other such as field and other occasions of handling small items, carrying out fine location and microoperation such as retrofit, integrated circuit manufacturing, CCD butt joint, biology and genetic engineering, microsurgery, microelectronics assemblings.

Claims (6)

1, a kind of accurate docking facilities that is used for opto-electronic device encapsulation, it is characterized in that it by: pedestal (1), two-way translation platform (2,27), four positioning seats (4,7,23,26), moving platform (9), connecting-rods with constant lengh (6,19,20,24), go up optic fibre clamp, fiber clamp (10) and laser welding gun (11,16,22) are formed down; Said connecting-rods with constant lengh is 4, one end of connecting-rods with constant lengh (6,19,20,24) links by ball pivot and moving platform (9), wherein the other end of two connecting-rods with constant lenghs (6,20) and positioning seat (4,23) link by revolute pair, two other connecting-rods with constant lengh (19,24) links by Hooke's hinge or ball pivot and positioning seat (7,26), thereby has formed space closed chain mechanism in parallel; Said two-way translation platform (2,27) can be positioned at the top of pedestal (1), also can be positioned at upper rack; Said fiber clamp (10) down is fixed on the moving platform (9), and last optic fibre clamp is made up of arc flexure spring (12), fiber clamp (13), micro-displacement driver (14), is positioned at upper rack; Positioning seat (4,7,23,26) is made up of parallel-plate compliant translational joint (67), micro-displacement driver (66), positioning seat pedestal (65).
2, a kind of accurate docking facilities that is used for the opto-electronic device encapsulation according to claim 1 is characterized in that described micro-displacement driver (14,66) adopts piezoelectric micro-displacement actuator.
3, a kind of accurate docking facilities that is used for the opto-electronic device encapsulation according to claim 1 is characterized in that the following fiber clamp (10) of described fixed fiber and fiber clamp (13) can adopt step motor drive, also can adopt pneumatic.
4, a kind of accurate docking facilities that is used for the opto-electronic device encapsulation according to claim 1, it is characterized in that described laser welding gun (11,16,22) is positioned at is mutually 120 ° and evenly distributes on the loop bracket (17), loop bracket (17) connects firmly with rigidity of frame.
5, a kind of accurate docking facilities that is used for the opto-electronic device encapsulation according to claim 4 is characterized in that described loop bracket (17) is provided with two CCD cameras (15,18).
6, a kind of accurate docking facilities that is used for the opto-electronic device encapsulation according to claim 1 is characterized in that described ball pivot, Hooke's hinge and revolute pair are flexible hinge structure.
CNB2003101108477A 2003-11-04 2003-11-04 Precisively butting apparatus for photoelectric device package Expired - Fee Related CN1298030C (en)

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Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1324334C (en) * 2005-12-05 2007-07-04 北京航空航天大学 Motion platform mechanism suitable for optical waveguide automatic-packaging robot system
CN102120289A (en) * 2010-12-16 2011-07-13 蚌埠市华泰液力变矩器有限公司 Numerical-control automatic three-gun welding machine
CN102275040B (en) * 2011-07-11 2013-12-11 中南大学 Auto-coupling welding and packaging mechanical device of coaxial-type optical transceiving device
CN102819186B (en) * 2012-09-07 2014-01-15 天津大学 3T1R four-degrees-of-freedom precise location workbench
CN108687470B (en) * 2018-05-22 2021-10-08 蔡仁爱 Welding robot
CN113246100A (en) * 2021-05-14 2021-08-13 湖北工业大学 Novel 3-PSS three-dimensional translational flexible parallel micro-motion platform

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5425616A (en) * 1993-07-15 1995-06-20 Agency Of Industrial Science & Technology Micromotion stage
US6516681B1 (en) * 1999-09-17 2003-02-11 Francois Pierrot Four-degree-of-freedom parallel robot
CN1399150A (en) * 2001-06-06 2003-02-26 株式会社藤倉 Optical fiber welding machine and welding method
CN1410231A (en) * 2001-09-29 2003-04-16 四川大学 New type series-parallel connection jogging robot

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5425616A (en) * 1993-07-15 1995-06-20 Agency Of Industrial Science & Technology Micromotion stage
US6516681B1 (en) * 1999-09-17 2003-02-11 Francois Pierrot Four-degree-of-freedom parallel robot
CN1399150A (en) * 2001-06-06 2003-02-26 株式会社藤倉 Optical fiber welding machine and welding method
CN1410231A (en) * 2001-09-29 2003-04-16 四川大学 New type series-parallel connection jogging robot

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Assignee: Zhongshan Silsmart Optoelectronics Co., Ltd.

Assignor: University of Electronic Science and Technology of China

Contract fulfillment period: 2007.3.3 to 2012.3.2 contract change

Contract record no.: 2008440000505

Denomination of invention: Precisively butting apparatus for photoelectric device package

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Record date: 20081211

LIC Patent licence contract for exploitation submitted for record

Free format text: EXCLUSIVE LICENSE; TIME LIMIT OF IMPLEMENTING CONTACT: 2007.3.3 TO 2012.3.2; CHANGE OF CONTRACT

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