CN1292822C - Cleaning device for use in cleaning liquid circulating system for increasing filter life - Google Patents

Cleaning device for use in cleaning liquid circulating system for increasing filter life Download PDF

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Publication number
CN1292822C
CN1292822C CNB2004100174103A CN200410017410A CN1292822C CN 1292822 C CN1292822 C CN 1292822C CN B2004100174103 A CNB2004100174103 A CN B2004100174103A CN 200410017410 A CN200410017410 A CN 200410017410A CN 1292822 C CN1292822 C CN 1292822C
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CN
China
Prior art keywords
cleaning
filter
cleaning device
hydrofluoric acid
circulation system
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Expired - Fee Related
Application number
CNB2004100174103A
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Chinese (zh)
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CN1676192A (en
Inventor
郭国超
江瑞星
梁世岳
刘文宏
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Shanghai Huahong Grace Semiconductor Manufacturing Corp
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Shanghai Huahong Grace Semiconductor Manufacturing Corp
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Priority to CNB2004100174103A priority Critical patent/CN1292822C/en
Publication of CN1676192A publication Critical patent/CN1676192A/en
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Abstract

The present invention provides a cleaning device applied to a cleaning liquid circulation system to prolong the service life of a filter, which is arranged in a cleaning liquid circulation system. The cleaning device comprises a second containing groove in which mixed liquid of hydrofluoric acid, hydrogen peroxide and hydrochloric acid is filled, a pipeline is connected and arranged on two control valves of the cleaning liquid circulation system, and the mixed liquid in the second containing groove circularly flows in the pipeline by a second pump and flows through a filter in the cleaning liquid circulation system so as to effectively clean the filter. The structure design is utilized to effectively prolong the service life of the filter in the cleaning liquid circulation system, and simultaneously the action for enhancing the cleaning effect is achieved.

Description

Cleaning device applied to cleaning fluid circulating system and capable of prolonging service life of filter
Technical Field
The present invention relates to a technique for prolonging the service life of a filter in a semiconductor integrated circuit cleaning process, and more particularly, to a cleaning apparatus which is applied to a cleaning solution circulation system and can prolong the service life of the filter.
Background
In the submicron wafer process, no matter film deposition, high-temperature furnace tube diffusion, oxidation or wafer surface treatment after etching, the wafer surface treatment and the like need to be subjected to a plurality of cleaning processes of high-purity chemicals, and then washed by ultrapure water until finally dehydrated and dried by isopropanol.
Semiconductor cleaning is dominated by multi-tank cleaning, and the american Radio Corporation (RCA) cleaning recipe, which has been developed since the early 60 s, is being used to date, although various applications continue to be developed in each module, limited to small adjustments in chemical ratios and cleaning sequences. The RCA cleaning process mainly comprises three steps:
1、H2SO4+H2O2(SPM), which uses Carlo's acid generated from sulfuric acid and hydrogen peroxide, whose strong oxidizing and dehydrating properties can destroy the hydrocarbon bonds of organic substances, mainly for photoresist stripping.
2、NH4OH+H2O2+H2O(APM, also called SC-1 or HA), which activates the surfaces of silicon wafers and particles by utilizing the alkalescence of ammonium hydroxide to enable the surfaces of the wafers and the particles to repel each other so as to achieve the purpose of cleaning, and hydrogen peroxide can also oxidize the surfaces of the silicon wafers so as to achieve the effect of removing the particles by micro-etching silicon dioxide by the hydrogen peroxide; the purpose of this cleaning step is to remove organic contaminants and particles.
3、HCl+H2O2+H2O (HPM, also called SC-2 or HB), which is dissolved by oxidizing the contaminated metal with hydrogen peroxide and then forming a soluble chloride with hydrochloric acid and metal ions, is used in the crystal washing step for the purpose of removing the metal contamination.
The cleaning solution of the cleaning process is circulated and filtered by a filter to remove impurities or contaminants in the cleaning solution. However, with the increase in the degree of integration of the devices, the Semiconductor Industry Association (SIA) is increasingly demanding wafer quality regulations, such as residual metals, anions (cations), oxygen, organic substances, fine particles, etc., and the frequency of replacing filters used in cleaning solution circulation systems is increasing accordingly. The cleaning method and device of the filter are disclosed in the national patent publication No. 429173, which uses a pressure control device to form a filtering system with a ring cap, a check sheet, a check ring, and a filter to clean the filter. However, the structure is complicated, and the solution components in the tank or the pipeline are not described, so that the cleaning effect is very limited.
Accordingly, the present invention provides a cleaning device applied in a cleaning solution circulation system to prolong the service life of a filter, so as to prolong the service life of the filter and improve the cleaning effect.
Disclosure of Invention
The invention mainly aims to provide a cleaning device capable of prolonging the service life of a filter, which is additionally arranged on a cleaning liquid circulating system, wherein the filter is cleaned by using a mixed liquid of hydrofluoric acid, hydrogen peroxide and hydrochloric acid so as to effectively remove particles of silicon dioxide, silicon and compounds thereof, metals and compounds thereof, organic matters and the like, thereby obtaining a better cleaning effect and further prolonging the service life of the filter.
Another object of the present invention is to achieve the effects of prolonging the service life of a filter in an SC-1 cleaning cycle system and improving the cleaning effect by using a simple structural design.
In order to achieve the above object, the present invention provides a cleaning device additionally installed in a cleaning solution circulation system, the cleaning device includes a second container containing therein a mixture of hydrofluoric acid, hydrogen peroxide and hydrochloric acid, the second container is connected to two control valves installed in the cleaning solution circulation system by a pipeline, and a second pump is used to circulate the mixture in the second container through the pipeline and pass through a filter in the cleaning solution circulation system, so as to effectively clean the filter.
The invention has the beneficial effects that: can effectively remove the particles of silicon dioxide, silicon and compounds thereof, metal and compounds thereof, organic matters and the like, has good cleaning effect and effectively prolongs the service life of the filter.
Drawings
FIG. 1 is a schematic view of a cleaning apparatus of the present invention installed in a cleaning solution circulation system.
FIG. 2 is a schematic structural diagram of the cleaning solution circulation system of the present invention when the cleaning solution needs to be replaced.
Fig. 3 is a schematic structural view of a filter being cleaned by using the cleaning apparatus of the present invention.
Description of reference numerals:
10 first accommodation groove
12. 120 pipeline
14 heater
16 first control valve
18 filter
20 second control valve
22 first pump
24 cleaning device
26 second receiving groove
28 second pump
Detailed Description
The structural features and advantages achieved by the present invention are further described below with reference to the accompanying drawings and embodiments.
The invention adds a cleaning device on a cleaning liquid circulating system, and uses the mixed liquid of hydrofluoric acid, hydrogen peroxide and hydrochloric acid in the cleaning device to clean the filter, so as to effectively remove particles or impurities of silicon dioxide, silicon and compounds thereof, metal and compounds thereof, organic matter types and the like.
Referring to fig. 1, a cleaning apparatus is additionally provided to a cleaning solution circulation system for RCA cleaning of semiconductor integrated circuits, the cleaning solution circulation system including a first container 10 in which ammonium hydroxide (NH) is disposed4OH), hydrogen peroxide (H)2O2) A mixed liquid (SC-1) of ultrapure water (D.I.water) and a cleaning liquid; the pipeline 12 is connected to a heater 14, a first control valve 16, a filter 18, a second control valve 20 and a first pump 22 respectively to form a loop for circulating the cleaning liquid, so that the cleaning liquid in the first container 10 is circulated through the filter by the first pump 22 to remove impurities such as silicon, silicon dioxide, metal, organic matters, micro-dust and the like of the cleaning liquid, and the cleaning liquid is maintained at a temperature of 25-90 ℃ by the heating of the heater 14; and the two control valves 16, 20 are respectively located on the pipelines 12 at both sides of the filter 18, and control the circulation or non-circulation of the cleaning solution by the operation of an automatic timer or a manual mode.Wherein, a cleaning device 24 with another bypass is arranged on the first control valve 16 and the second control valve 20, which is composed of a second containing tank 26 and a second pump 28, a mixed liquid of hydrofluoric acid, hydrogen peroxide and hydrochloric acid is arranged in the second containing tank 26, the second containing tank 26 is connected with the two control valves 16, 20 arranged on the cleaning liquid circulating system by a pipeline 120, and the two control valves 16, 20 can be used to control the flow of the mixed liquid, and the mixed liquid in the second containing tank 26 passes through the second pump 28The two pumps 28 are circulated in a flow path 120 through the filter 18 between the two control valves 16, 20.
The hydrofluoric acid, the hydrogen peroxide and the hydrochloric acid in the mixed solution in the second receiving groove 26 are all semiconductor grade (semiconductor grade), wherein the hydrofluoric acid is diluted hydrofluoric acid, and the dilution ratio of the hydrofluoric acid to water is between 1: 10 and 1: 100. The second pump 28 is made of a material resistant to the mixed solution of hydrofluoric acid, hydrogen peroxide, and hydrochloric acid; the pipes 12 and 120 used in the cleaning solution circulation system and the cleaning device 24 are made of polyvinylidene fluoride (PVDF), perfluoro-ethylene oxide (PFA) or polyether ether ketone (PEEK).
When the cleaning liquid in the cleaning liquid circulation system needs to be replaced, as shown in fig. 2, the cleaning liquid in the first containing groove 10, the mixed liquid of ammonium hydroxide, hydrogen peroxide and ultrapure water are discharged, and then ultrapure water is added into the first containing groove 10; the first pump 22 is then activated and the control valves 16, 20 are opened, allowing the line 12 to be routed to purge the circulation system. At this time, the heater 14 is not heated temporarily, and only the pipe is kept flowing, and the second tank 26 and the second pump 28 of the other bypass cleaning device 24 are idle at this time.
When the filter 18 in the cleaning solution circulation system needs to be cleaned, as shown in fig. 3, the first pump 22, the heater 14 and the first container 10 are in an idle state; the second pump 28 is activated, the first control valve 16 and the second control valve 20 are opened, the pipeline 120 forms another path, and the filter 18 is cleaned by the mixed solution of hydrofluoric acid, hydrogen peroxide and hydrochloric acid in the second container 26, so as to clean the filter 18.
Wherein, the hydrofluoric acid reacts with the silicon dioxide in the cleaning liquid to generate silicon tetrafluoride gas; the hydrogen peroxide can oxidize silicon and inactive metal particles in the cleaning solution to decompose light organic matter particles; hydrochloric acid can dissolve particles of the active metal and metal compound. Therefore, after the cleaning liquid passes through the second accommodating groove, a large amount of particles are reduced; when the cleaning liquid passes through the filter, the number of particles is small, the probability of the filter being blocked is reduced, and the service life of the filter is naturally prolonged. And the impurity part of the cleaning liquid is decomposed, and when the cleaning liquid flows into the first containing groove again, the cleaning effect can be effectively improved.
The invention uses the mixed liquid of hydrofluoric acid, hydrogen peroxide and hydrochloric acid to prolong the service life of the filter, and the chemical mechanism of the mixed liquid is as follows:
1. dissolving silicon dioxide by hydrofluoric acid:
2. hydrogen peroxide oxidizes silicon and non-reactive metals in acidic solution and decomposes organic particles:
exothermic reaction Δ G ═ 340KJ/mole
The first three reaction formulas are combined into
The endothermic reaction Δ G is 65.5KJ/mole or more as a combined reaction
The total heat of reaction Δ G ═ 275KJ/mole
3. Dissolving the metal compound particles with hydrochloric acid:
in summary, the present invention adds a cleaning device to the cleaning solution circulation system to effectively remove particles of silicon dioxide, silicon and its compounds, metals and their compounds, and organic substances, so as to obtain a better cleaning effect and prolong the service life of the filter. Therefore, the invention is a cleaning device which utilizes simple structural design to achieve the effects of prolonging the service life of the filter in the SC-1 cleaning circulating system and improving the cleaning effect.
The above-mentioned embodiments are only for illustrating the technical ideas and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and to carry out the same, but the scope of the present invention should not be limited by the embodiments, i.e. all equivalent changes or modifications made in the spirit of the present invention are still within the scope of the present invention.

Claims (8)

1. The utility model provides an use belt cleaning device that can prolong filter life in washing liquid circulation system installs in a washing liquid circulation system, and this washing liquid circulation system includes a first storage tank of placing the washing liquid, and it utilizes a pipeline intercommunication heater and a filter to utilize a first pump to make the washing liquid flow circulation and make the washing liquid through heater heating and filter filtering impurity, and respectively install a control valve on the pipeline of filter two ends, belt cleaning device characterized in that includes:
the second containing groove is internally provided with a mixed solution of hydrofluoric acid, hydrogen peroxide and hydrochloric acid, and is connected and arranged on the two control valves of the cleaning solution circulating system by using pipelines so as to control whether the cleaning solution and the mixed solution flow or not by using the control valves; and
and the second pump enables the mixed liquid in the second accommodating groove to flow and circulate in the pipeline and flow through the filter.
2. The cleaning device of claim 1, wherein: the cleaning solution is a mixed solution of ammonium hydroxide, hydrogen peroxide and ultrapure water.
3. The cleaning device of claim 1, wherein: the filter can filter impurities in the cleaning liquid and comprises silicon, silicon dioxide, metal, organic matters, micro dust and the like.
4. The cleaning device of claim 1, wherein: the opening and closing of the control valve can be controlled by an automatic timer or manually.
5. The cleaning device of claim 1, wherein: the hydrofluoric acid in the mixed liquid in the second accommodating groove is diluted hydrofluoric acid, and the dilution ratio of the hydrofluoric acid to the water is between 1: 10 and 1: 100.
6. The cleaning device of claim 1, wherein: hydrofluoric acid, hydrogen peroxide and hydrochloric acid in the mixed solution are all semiconductor grade.
7. The cleaning device of claim 1, wherein: the second pump is resistant to the hydrofluoric acid, the hydrogen peroxide and the hydrochloric acid.
8. The cleaning device of claim 1, wherein: the material of the pipeline is selected from polyvinylidene fluoride, perfluor ethylene oxide or polyether ether ketone or the combination thereof.
CNB2004100174103A 2004-04-01 2004-04-01 Cleaning device for use in cleaning liquid circulating system for increasing filter life Expired - Fee Related CN1292822C (en)

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CNB2004100174103A CN1292822C (en) 2004-04-01 2004-04-01 Cleaning device for use in cleaning liquid circulating system for increasing filter life

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CNB2004100174103A CN1292822C (en) 2004-04-01 2004-04-01 Cleaning device for use in cleaning liquid circulating system for increasing filter life

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Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102847480B (en) * 2012-09-19 2014-07-30 北京七星华创电子股份有限公司 Chemical liquid mixing device and method
CN104818164B (en) * 2015-05-18 2018-03-09 青岛双瑞海洋环境工程股份有限公司 The cleaning fluid and on-line cleaning device and method of the used filter of ballast for cruising water process
CN105413302B (en) * 2015-12-30 2018-11-13 攀枝花东方钛业有限公司 A kind of titanium white washing leaf filter filter cloth recycles washing system and method online
CN108823006A (en) * 2018-06-14 2018-11-16 上海华力集成电路制造有限公司 ICP-MS miniflow atomizer cleaning solution and its dredger and dredging method
CN109326505B (en) * 2018-08-27 2021-12-03 上海中欣晶圆半导体科技有限公司 Method and device for improving final metal cleaning degree of silicon wafer
CN109432882A (en) * 2018-12-25 2019-03-08 聚灿光电科技股份有限公司 For cleaning automatic cleaning equipment, control system and the control method of filter
CN112517517A (en) * 2020-12-17 2021-03-19 上海中欣晶圆半导体科技有限公司 Silicon wafer cleaning device and method for reducing accumulated pollution of filter in silicon wafer cleaning device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1206932A (en) * 1997-07-25 1999-02-03 三星电子株式会社 Washing composition for making semiconductor device and method for making said device by using same
CN1218982A (en) * 1997-11-28 1999-06-09 日本电气株式会社 Device for producing semiconductor device and its producing method

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1206932A (en) * 1997-07-25 1999-02-03 三星电子株式会社 Washing composition for making semiconductor device and method for making said device by using same
CN1218982A (en) * 1997-11-28 1999-06-09 日本电气株式会社 Device for producing semiconductor device and its producing method

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