CN1291418C - Electroconductive paste and method of producing the same - Google Patents
Electroconductive paste and method of producing the same Download PDFInfo
- Publication number
- CN1291418C CN1291418C CNB2004100592195A CN200410059219A CN1291418C CN 1291418 C CN1291418 C CN 1291418C CN B2004100592195 A CNB2004100592195 A CN B2004100592195A CN 200410059219 A CN200410059219 A CN 200410059219A CN 1291418 C CN1291418 C CN 1291418C
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- China
- Prior art keywords
- solvent
- paste
- conduction
- resin
- stick
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 title claims description 8
- 239000002904 solvent Substances 0.000 claims abstract description 132
- 239000000919 ceramic Substances 0.000 claims abstract description 82
- 229920005989 resin Polymers 0.000 claims abstract description 45
- 239000011347 resin Substances 0.000 claims abstract description 45
- 239000000843 powder Substances 0.000 claims abstract description 19
- 239000007787 solid Substances 0.000 claims abstract description 16
- 239000001856 Ethyl cellulose Substances 0.000 claims abstract description 15
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 claims abstract description 15
- 229920001249 ethyl cellulose Polymers 0.000 claims abstract description 15
- 235000019325 ethyl cellulose Nutrition 0.000 claims abstract description 15
- 239000011230 binding agent Substances 0.000 claims abstract description 13
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 claims abstract 2
- 239000004840 adhesive resin Substances 0.000 claims description 41
- 229920006223 adhesive resin Polymers 0.000 claims description 41
- 239000002253 acid Substances 0.000 claims description 33
- 125000001931 aliphatic group Chemical group 0.000 claims description 27
- 239000002002 slurry Substances 0.000 claims description 26
- UODXCYZDMHPIJE-UHFFFAOYSA-N menthanol Chemical compound CC1CCC(C(C)(C)O)CC1 UODXCYZDMHPIJE-UHFFFAOYSA-N 0.000 claims description 21
- 239000000203 mixture Substances 0.000 claims description 21
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N Butyraldehyde Chemical compound CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 claims description 16
- 229920002678 cellulose Polymers 0.000 claims description 15
- 238000004519 manufacturing process Methods 0.000 claims description 13
- 239000012046 mixed solvent Substances 0.000 claims description 13
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 claims description 12
- PWATWSYOIIXYMA-UHFFFAOYSA-N Pentylbenzene Chemical compound CCCCCC1=CC=CC=C1 PWATWSYOIIXYMA-UHFFFAOYSA-N 0.000 claims description 10
- 235000021355 Stearic acid Nutrition 0.000 claims description 10
- 125000004432 carbon atom Chemical group C* 0.000 claims description 10
- RWGFKTVRMDUZSP-UHFFFAOYSA-N cumene Chemical compound CC(C)C1=CC=CC=C1 RWGFKTVRMDUZSP-UHFFFAOYSA-N 0.000 claims description 10
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 claims description 10
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 claims description 10
- 239000008117 stearic acid Substances 0.000 claims description 10
- NHCREQREVZBOCH-UHFFFAOYSA-N 1-methyl-1,2,3,4,4a,5,6,7,8,8a-decahydronaphthalene Chemical class C1CCCC2C(C)CCCC21 NHCREQREVZBOCH-UHFFFAOYSA-N 0.000 claims description 8
- HGBOYTHUEUWSSQ-UHFFFAOYSA-N valeric aldehyde Natural products CCCCC=O HGBOYTHUEUWSSQ-UHFFFAOYSA-N 0.000 claims description 8
- 229920000305 Nylon 6,10 Polymers 0.000 claims description 6
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 claims description 6
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 claims description 6
- 239000001913 cellulose Substances 0.000 claims description 6
- 229920003086 cellulose ether Polymers 0.000 claims description 6
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 claims description 6
- IPCSVZSSVZVIGE-UHFFFAOYSA-N hexadecanoic acid Chemical compound CCCCCCCCCCCCCCCC(O)=O IPCSVZSSVZVIGE-UHFFFAOYSA-N 0.000 claims description 6
- 229940116411 terpineol Drugs 0.000 claims description 6
- UKMSUNONTOPOIO-UHFFFAOYSA-N docosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCC(O)=O UKMSUNONTOPOIO-UHFFFAOYSA-N 0.000 claims description 5
- POULHZVOKOAJMA-UHFFFAOYSA-M dodecanoate Chemical compound CCCCCCCCCCCC([O-])=O POULHZVOKOAJMA-UHFFFAOYSA-M 0.000 claims description 5
- 150000002168 ethanoic acid esters Chemical class 0.000 claims description 5
- 229940070765 laurate Drugs 0.000 claims description 5
- 229910052799 carbon Inorganic materials 0.000 claims description 4
- 239000002480 mineral oil Substances 0.000 claims description 4
- 235000010446 mineral oil Nutrition 0.000 claims description 4
- 235000021357 Behenic acid Nutrition 0.000 claims description 3
- 239000005711 Benzoic acid Substances 0.000 claims description 3
- 229920002134 Carboxymethyl cellulose Polymers 0.000 claims description 3
- 229920000663 Hydroxyethyl cellulose Polymers 0.000 claims description 3
- 239000004354 Hydroxyethyl cellulose Substances 0.000 claims description 3
- 229920001479 Hydroxyethyl methyl cellulose Polymers 0.000 claims description 3
- 229920002153 Hydroxypropyl cellulose Polymers 0.000 claims description 3
- 235000010233 benzoic acid Nutrition 0.000 claims description 3
- 239000001768 carboxy methyl cellulose Substances 0.000 claims description 3
- 235000010948 carboxy methyl cellulose Nutrition 0.000 claims description 3
- 239000008112 carboxymethyl-cellulose Substances 0.000 claims description 3
- 229920002301 cellulose acetate Polymers 0.000 claims description 3
- 150000002148 esters Chemical class 0.000 claims description 3
- 235000019447 hydroxyethyl cellulose Nutrition 0.000 claims description 3
- 239000001863 hydroxypropyl cellulose Substances 0.000 claims description 3
- 235000010977 hydroxypropyl cellulose Nutrition 0.000 claims description 3
- 229920000609 methyl cellulose Polymers 0.000 claims description 3
- 239000001923 methylcellulose Substances 0.000 claims description 3
- 235000010981 methylcellulose Nutrition 0.000 claims description 3
- 229920002689 polyvinyl acetate Polymers 0.000 claims description 3
- 239000011118 polyvinyl acetate Substances 0.000 claims description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 2
- 229940116226 behenic acid Drugs 0.000 claims description 2
- 150000004945 aromatic hydrocarbons Chemical class 0.000 abstract description 6
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 abstract description 5
- 150000001923 cyclic compounds Chemical class 0.000 abstract description 5
- 235000014113 dietary fatty acids Nutrition 0.000 abstract description 3
- 239000000194 fatty acid Substances 0.000 abstract description 3
- 229930195729 fatty acid Natural products 0.000 abstract description 3
- 150000004665 fatty acids Chemical class 0.000 abstract description 3
- 229910052802 copper Inorganic materials 0.000 abstract description 2
- 229910052759 nickel Inorganic materials 0.000 abstract description 2
- 230000000052 comparative effect Effects 0.000 description 34
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 16
- 238000002360 preparation method Methods 0.000 description 16
- 239000000758 substrate Substances 0.000 description 16
- BQFCCCIRTOLPEF-UHFFFAOYSA-N chembl1976978 Chemical compound CC1=CC=CC=C1N=NC1=C(O)C=CC2=CC=CC=C12 BQFCCCIRTOLPEF-UHFFFAOYSA-N 0.000 description 14
- 230000007797 corrosion Effects 0.000 description 11
- 238000005260 corrosion Methods 0.000 description 11
- 239000000853 adhesive Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 8
- 238000007639 printing Methods 0.000 description 8
- 238000003860 storage Methods 0.000 description 8
- 238000003475 lamination Methods 0.000 description 7
- KBPLFHHGFOOTCA-UHFFFAOYSA-N 1-Octanol Chemical compound CCCCCCCCO KBPLFHHGFOOTCA-UHFFFAOYSA-N 0.000 description 6
- VCLJODPNBNEBKW-UHFFFAOYSA-N 2,2,4,4,6,8,8-heptamethylnonane Chemical compound CC(C)(C)CC(C)CC(C)(C)CC(C)(C)C VCLJODPNBNEBKW-UHFFFAOYSA-N 0.000 description 6
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 4
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 4
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 4
- 239000005642 Oleic acid Substances 0.000 description 4
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 4
- 230000002950 deficient Effects 0.000 description 4
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 4
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 4
- -1 Dodecane Amylbenzene Chemical compound 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
- IGODOXYLBBXFDW-UHFFFAOYSA-N alpha-Terpinyl acetate Chemical compound CC(=O)OC(C)(C)C1CCC(C)=CC1 IGODOXYLBBXFDW-UHFFFAOYSA-N 0.000 description 2
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 2
- 229910002113 barium titanate Inorganic materials 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 238000007606 doctor blade method Methods 0.000 description 2
- SNRUBQQJIBEYMU-UHFFFAOYSA-N dodecane Chemical compound CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 239000004576 sand Substances 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- NMRPBPVERJPACX-UHFFFAOYSA-N (3S)-octan-3-ol Natural products CCCCCC(O)CC NMRPBPVERJPACX-UHFFFAOYSA-N 0.000 description 1
- NMRPBPVERJPACX-QMMMGPOBSA-N 3-Octanol Natural products CCCCC[C@@H](O)CC NMRPBPVERJPACX-QMMMGPOBSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 229920001727 cellulose butyrate Polymers 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- BNVPKVSILGFRTL-UHFFFAOYSA-N cumene heptane Chemical compound CCCCCCC.C1(=CC=CC=C1)C(C)C BNVPKVSILGFRTL-UHFFFAOYSA-N 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000005194 fractionation Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 238000005984 hydrogenation reaction Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229920005644 polyethylene terephthalate glycol copolymer Polymers 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000004626 scanning electron microscopy Methods 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 238000004513 sizing Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000001238 wet grinding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/008—Selection of materials
- H01G4/0085—Fried electrodes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
- H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Physics & Mathematics (AREA)
- Inorganic Chemistry (AREA)
- Conductive Materials (AREA)
- Ceramic Capacitors (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
Electroconductive paste includes electroconductive powder of Ni, Cu or the like, a first binder resin such as ethyl cellulose resin or the like, a fatty acid which is solid at ordinary temperature (20 to 25 DEG C.), and solvents. The solvents include a cyclic compound type solvent capable of dissolving the first binder resin, an aliphatic hydrocarbon type solvent incapable of dissolving a second binder resin such as butyral resin or the like contained in a ceramic green sheet, and an aromatic hydrocarbon type solvent incapable of dissolving the second binder resin.
Description
Technical field
The present invention relates to a kind of conduction and stick with paste and production method, especially, relate to a kind of be used to form the laminated ceramic electronic component for example the conduction of the internal electrode in the laminated ceramic compacitor etc. stick with paste.
Background technology
In recent years, the size of electronic component descends.Like this, just need the electronic component size reduce also can obtain rapidly the progress.Correspondingly, in the field of laminated ceramic electronic component, also need ceramic layer thickness to reduce, the thickness of living plate (green sheet is called " tellite " in the present invention) that need roasting during the formation of ceramic layer reduces.And capacitor volume is increased in the laminated ceramic compacitor field.Need reduce the thickness of ceramic printed-circuit board like this, strongly.
Usually, the conduction that for example will form internal electrode with silk screen printing in the production of laminated ceramic compacitor etc. at the laminated ceramic electronic component is stuck with paste and is printed onto on the ceramic printed-circuit board.Laminated ceramic tellite then, roasting should the pottery layered product.
The ceramic slurry body is formed into forms ceramic printed-circuit board on the thin slice with scraping powder method etc.By adhesive resin and organic solvent and ceramic coarse raw materials powder are formed ceramic slurry.Like this, form ceramic printed-circuit board.Conductive powder is dispersed in production conduction paste in the organic carrier that contains adhesive resin and solvent.
But, so-called substrate corrosion (sheet-attack) problem can take place during producing the lamination ceramic electronic component.Especially, the dissolution with solvents that contains in conduction is stuck with paste is contained in the adhesive resin in the ceramic printed-circuit board, so ceramic printed-circuit board expansion dissolving.This " substrate corrosion " defective causes the formation of the thin layer of ceramic printed-circuit board and has a strong impact on.
Therefore, the hydrogenation terpinyl acetate has been proposed as the solvent (seeing that Japanese unexamined patent discloses (patent document 1) 7-21833 number) in the conduction paste.
But, needing the layer thickness of ceramic printed-circuit board further to reduce in recent years.Even the conduction of using patent document 1 to describe is stuck with paste, " substrate corrosion " problem can not prevent fully that the laminated ceramic electronic component that uses this ceramic printed-circuit board to form is twisted or breaks.
Summary of the invention
Under aforesaid angle, designed the present invention.An object of the present invention is to provide the conduction that can suppress " substrate corrosion " problem and stick with paste and provide a kind of its production method.
According to the present invention, being used for of providing sticks with paste containing on the ceramics forming sheet of adhesive resin the conduction that forms conductive pattern, and described conduction is stuck with paste and comprised conductive powder; First kind of adhesive resin and multicomponent solvent, this multicomponent solvent comprise can dissolve first kind of adhesive resin basically by first kind of solvent of cyclic compound type solvent composition, in can not solution ceramic adhesive (" second kind of adhesive resin ") basically by second kind of solvent of aliphatic hydrocarbon type solvent composition and can not dissolve second kind of adhesive resin basically by the third solvent of aromatic hydrocarbon type solvent composition.Should conduction stick with paste with of the present invention, can prevent the substrate etching problem.And because aromatic hydrocarbon is as solvent composition, this conduction paste has high storage stability.
Preferably, this conduction is stuck with paste and is further comprised and at room temperature be the aliphatic acid of solid.
In the situation of the layer thickness that reduces ceramic printed-circuit board, the number of laminated ceramic tellite increases, and internal electrode is tending towards peeling off from the ceramic layer in the end of the ceramic layered product of roasting.That is, so-called layering takes place easily.According to the present invention, when producing the ceramics forming sheet under the room temperature for the aliphatic acid of solid becomes liquid, flow on the ceramics forming sheet.At room temperature, aliphatic acid turns back to solid state, or increases adhesion with the extruding bonding.Like this, improved internal electrode and ceramic layer bonding at end face.Like this, add the so-called layering that solid fatty acid can prevent end face effectively by sticking with paste to conduction.
Preferably, this aliphatic acid comprises at least a in stearic acid, laurate, tetradecylic acid, hexadecylic acid, behenic acid, benzoic acid and the decanedioic acid.
Preferably, first kind of adhesive resin comprises cellulose derivative.
This cellulose derivative can be cellulose ether, cellulose esters or their mixture.
Preferably, cellulose ether comprises at least a in ethyl cellulose, carboxymethyl cellulose, hydroxyethylcellulose, hydroxypropyl cellulose, methylcellulose, methyl hydroxyethylcellulose and the carboxymethylethylcellulose.
Preferably, this cellulose esters comprises at least a in cellulose acetate ester and the acetobutyric acid cellulose esters.
Preferably, second kind of adhesive resin comprises polyvinyl acetate type resin, acrylic resin and butyraldehyde resin.
Preferably, first kind of adhesive resin is ethyl cellulose type resin, and second kind of adhesive resin is the butyraldehyde resin.In this case, can guarantee to obtain advantage of the present invention.
Preferably, this polynary type solvent comprises second kind of solvent of first kind of solvent of about 30-70wt%, about 10-60wt% and the third solvent of about 1-20wt%.
Preferably, first kind of solvent comprises at least a in dihydro-terpineol, dihydro tyerpinyl acetic acid esters and the terpineol.
Preferably, second kind of solvent comprises the mineral oil of 7-20 the carbon atom of having an appointment.
Preferably, the third solvent comprises at least a in methyl decahydronaphthalenes, amylbenzene and the cumene.
And, according to the present invention, the method that the conduction that provides a kind of production to comprise conductive powder, first kind of adhesive resin and multicomponent solvent is stuck with paste, described conduction is stuck with paste and form conductive pattern on the ceramics forming sheet, and described method comprises step: preparation can dissolve first kind of adhesive resin basically by first kind of solvent of cyclic compound type solvent composition, can not dissolve second kind of adhesive resin basically by second kind of solvent of aliphatic hydrocarbon type solvent composition and can not dissolve second kind of adhesive resin basically by the third solvent of aromatic hydrocarbon type solvent composition; Mix first kind of solvent, second kind of solvent and the third solvent and produce a kind of mixed solvent; Hybrid conductive powder, first kind of adhesive resin, this mixed solvent and retarder thinner are not higher than the slurry of about 10mPas with production viscosity; From slurry, remove retarder thinner.
Like this, in the production process of this conduction paste, make slurry viscosity not be higher than about 10mPas, resin is pulverized and strong the adhesion excessively, produce a kind of conduction paste that suitable paste viscosity is arranged.Correspondingly, when using this conduction to stick with paste on ceramic printed-circuit board, to form conductive pattern, can prevent or postpone to print for example cut in the conductive pattern etc. of shortcoming.Like this, can guarantee superior printing character.
Embodiment
After this, will describe a scheme of the present invention in detail.
Conduction of the present invention is stuck with paste and is comprised conductive powder, first kind of adhesive resin and multicomponent solvent.Conduction of the present invention is stuck with paste and is used for forming conductive pattern containing on the ceramics forming sheet of second kind of adhesive resin.
As conductive powder, can use the metal dust of Ni, Cu, Ag, Pd etc.
As first kind of adhesive resin, can use cellulose derivative.As cellulose derivative, can use cellulose ether, cellulose esters or their mixture.
As cellulose ether, can use at least a resin in ethyl cellulose, carboxymethyl cellulose, hydroxyethylcellulose, hydroxypropyl cellulose, methylcellulose, methyl hydroxyethylcellulose and the carboxymethylethylcellulose.
As cellulose esters, can use at least a resin in cellulose acetate ester, cellulose butyrate and the acetobutyric acid cellulose esters.
This multicomponent solvent comprise can dissolve first kind of adhesive resin basically by first kind of solvent of cyclic compound type solvent composition, can not dissolve second kind of adhesive basically by second kind of solvent of aliphatic hydrocarbon type solvent composition and can not dissolve second kind of adhesive resin basically by the third solvent of aromatic hydrocarbon type solvent composition.
It mainly is to be used to dissolve first kind of resin that first kind of solvent is included in the conduction paste.As first kind of resin, can use at least a solvent in dihydro-terpineol, dihydro tyerpinyl acetic acid esters and the terpineol.
In this multicomponent solvent, preferably, the content of first kind of solvent is in the scope of about 30-70wt%, if this content is lower than about 30wt%, first kind of adhesive resin during conduction is stuck with paste in some cases can not dissolve fully.On the other hand, if this content surpasses about 70wt%, " substrate corrosion " defective will take place.
Second kind of solvent is included in the conduction paste and mainly prevents " substrate corrosion " defective.As second kind of solvent, can use the mineral oil of 7-20 the carbon atom of having an appointment.
In this multicomponent solvent, preferably, the content of second kind of solvent is in the scope of about 10-60wt%.If this content is lower than about 10wt%, the substrate corrosion default will take place.On the other hand, if this content surpasses about 60wt%, first kind of adhesive resin during conduction is stuck with paste in some cases can not dissolve fully.
The third solvent is included in the storage stability that the principal security conduction is stuck with paste in the conduction paste.As the third solvent, can use in methyl decahydronaphthalenes, amylbenzene and the cumene at least a.
In this multicomponent solvent, preferably, the content of the third solvent is in the scope of about 1-20wt%.If this content is lower than about 1wt%, the stability relevant with the time that conduction is stuck with paste may worsen.On the other hand, if this content surpasses about 20wt%, first kind of adhesive resin can not be dissolved in the conduction paste fully in some cases.
And preferably, conduction of the present invention is stuck with paste to be included in and is the aliphatic acid of solid under the room temperature (about 20-25 ℃).Reason is described below.
In the production process of laminated ceramic electronic component, lamination is printed with the ceramic printed-circuit board that conduction is stuck with paste thereon.The ceramic printed-circuit board of this lamination, for example under about 90 ℃ temperature, mutual extrusion bonds, and is cut into pre-sizing.Like this, form the ceramic layer compressing tablet.In this case, as above-mentioned, normal temperature is included in the conduction paste for the aliphatic acid that the fusing point of solid is lower than the temperature when pushing down.Thereby aliphatic acid fusion in the extruding bonding is dissolved on the ceramic printed-circuit board.When ceramic printed-circuit board returned to room temperature again, aliphatic acid solidified.Like this, the bonding between ceramic printed-circuit board and conduction are stuck with paste is enhanced.
If lamination and the thin ceramic printed-circuit board of extruding bonding, the conduction of use is stuck with paste and is tending towards peeling off from ceramic printed-circuit board in the end of ceramic layer compressing tablet.Layering takes place like this, easily.On the other hand, if solid fatty acid is included in during conduction sticks with paste, can be prevented from effectively in the layering of end face.
Even the fusing point of aliphatic acid is higher than the extruding sticking temperature, because aliphatic acid is by plastic deformation, the cohesive force between ceramic printed-circuit board and conduction are stuck with paste increases, and therefore conduction is stuck with paste and ceramic printed-circuit board closely adhesion densely mutually.
As being the aliphatic acid of solid under the above-mentioned room temperature, can use stearic acid (fusing point: 69.0 ℃), laurate (fusing point: 44.2 ℃), tetradecylic acid (fusing point: 53.9 ℃), hexadecylic acid (fusing point: 63.1 ℃ of), behenic acids (fusing point: 79.9 ℃), decanedioic acid (fusing point: 134.0 ℃) and benzoic acid (fusing point: 121.0-124.0 ℃).
Preferably, in conduction is stuck with paste in the scope of content at about 0.05-1.0wt% of aliphatic acid.If this content is lower than about 0.05wt%, the adhesion between ceramic printed-circuit board and conduction are stuck with paste can not improve significantly.On the other hand, if this content surpasses about 1.0wt%, first kind and second kind of adhesive are removed in the operation and can not be removed fully at adhesive, and the layering between them takes place easily.
And preferably, the weight ratio of the content of first kind of adhesive resin and multicomponent solvent is in about 1: 99～50: 50 scope.And the weight ratio of content that comprises the content of organic carrier of first kind of adhesive and multicomponent solvent and conductive powder is in about 20: 80～90: 10 scope.
As the second kind of adhesive that is included in the ceramics forming sheet, can use at least a in polyvinyl acetate type resin, acrylic type resin and the butyraldehyde resin.
Using ethyl cellulose type resin to be used as in the situation of second kind of adhesive resin, can obtain advantage of the present invention reliably especially as first kind of adhesive resin and butyraldehyde resin.
After this, will a kind of method that conduction is stuck with paste of producing be described.
At first, mix first kind of solvent, second kind of solvent and the third solvent with the predetermined mix weight ratio.Like this, preparation mixed solvent.Then, first kind of adhesive resin little by little is added in this mixed solvent, stirs fully.Like this, produce with predetermined weight than the organic carrier that comprises mixed solvent and first kind of adhesive resin.If desired, ordinary temp is included in this mixed solvent for the aliphatic acid of solid down.
Subsequently, predetermined amounts weighs up for example acetone etc. of conductive powder, organic carrier, retarder thinner, mixes, and disperses fully with husky mill.Like this, preparation viscosity is not higher than the slurry of about 10mPas.
If slurry viscosity surpasses 10mPas, owing to pulverize excessively, strong etc. to the absorption of resin, the viscosity that the finished product conduction is stuck with paste becomes big.As a result, when silk screen printing on ceramic printed-circuit board conduction was stuck with paste, conductive pattern was by cut etc.Like this, the print performance of conduction paste.If slurry viscosity is low excessively, conductive powder is tending towards precipitation.Like this, be difficult to handle slurry.Correspondingly, estimate to use for reality, slurry viscosity following is limited to about 3mPas.
After this, evaporate the acetone that is included in the slurry, produce conduction and stick with paste.
According to this scheme, conduction is stuck with paste and is comprised first kind of solvent, second kind of solvent and the third solvent.Like this, can suppress " substrate corrosion " defective, conduction is stuck with paste has superior storage stability.And if desired, conduction is stuck with paste to contain and is the aliphatic acid of solid under the ordinary temp.Like this, can suppress the end face layering of roasting ceramic layer compressing tablet.
And the dispersion in the production process of sticking with paste for conduction is adjusted to the viscosity of slurry and is not higher than about 10mPas.Therefore, can prevent undue pulverizing or to the strong adsorption of resin.Like this, can obtain having the paste of appropriate viscosity.Stick with paste the situation be used for forming conductive pattern on ceramic printed-circuit board in conduction, this paste shows superior printing performance, and does not have for example cut in the conductive pattern etc. of printing defects.
Embodiment
After this, embodiment of the present invention will be described.
Embodiment 1
Preparation has the solvent of component shown in the table 1.
Table 1
| Type of solvent | Content is than (weight ratio) | |||||
| Solvent orange 2 A | Solvent B | Solvent C | Solvent D | |||
| Embodiment | 1 | Dihydro-terpineol | Heptamethylnonane | The methyl decahydronaphthalenes | - | A∶B∶C＝60∶36∶4 |
| 2 | Dihydro tyerpinyl acetic acid esters | Dodecane | Amylbenzene | - | A∶B∶C＝60∶36∶4 | |
| 3 | Terpineol | Heptane | Cumene | - | A∶B∶C＝60∶36∶4 | |
| Comparative Examples | 1 | Dihydro-terpineol | - | - | - | - |
| 2 | - | Heptamethylnonane | - | - | - | |
| 3 | - | - | - | Octanol | - | |
| 4 | Dihydro-terpineol | Heptamethylnonane | - | - | A∶B＝60∶40 | |
| 5 | - | Heptamethylnonane | The methyl decahydronaphthalenes | Octanol | D∶B∶C＝60∶36∶4 | |
That is, in embodiment 1, as solvent orange 2 A (first kind of solvent: cyclic compound type solvent), use dihydro-terpineol.As solvent B (second kind of solvent: aliphatic hydrocarbon type solvent), use the heptamethylnonane of 16 carbon atoms.As solvent C (the third solvent: aromatic hydrocarbon type solvent), use the methyl decahydronaphthalenes.Like this, the content weight ratio with solvent orange 2 A, B and C is 80: 36: 4 these mixed solvents of preparation.
In embodiment 2, use respectively acetate dihydro-terpineol ester as solvent orange 2 A, 12 carbon atoms are arranged dodecane as solvent B and amylbenzene as solvent C.Like this, the mixed solvent of the content ratio of preparation similar embodiment 1.
And, in embodiment 3, use terpineol as solvent orange 2 A, 7 carbon atoms are arranged heptane as solvent B and cumene as solvent C.Like this, the mixed solvent of the content ratio of preparation similar embodiment 1.
And, in Comparative Examples 1, the solvent that preparation only is made up of dihydro-terpineol (solvent orange 2 A).In Comparative Examples 2, the solvent that preparation is made up of the heptamethylnonane that 16 carbon atoms are arranged (solvent B).In Comparative Examples 3, preparation is as the lard type higher alcohol solvent octanol of (after this being called solvent D).
In Comparative Examples 4, the content weight ratio of the heptamethylnonane (solvent B) of use dihydro-terpineol (solvent orange 2 A) and 16 carbon atoms formation solvent orange 2 A and solvent B is 60: 40 a mixed solvent.
In Comparative Examples 5, the content weight ratio of the heptamethylnonane (solvent B) of use octanol (solvent D), 16 carbon atoms and methyl decahydronaphthalenes (solvent C) preparation solvent D, solvent B and solvent C is 60: 36: 4 a mixed solvent.
Subsequently, in the solvent of each embodiment and Comparative Examples, add ethyl cellulose type resin gradually, stirred 24 hours with blender as first kind of adhesive resin.Like this, the content weight ratio of preparation solvent and ethyl cellulose type resin is 94: 6 a organic carrier.
Then, confirm whether ethyl cellulose type resin is dissolved in every kind of organic carrier.The organic carrier of Comparative Examples 2 does not comprise the solvent orange 2 A or the solvent D of energy ethyl cellulose dissolved type resin, and therefore, ethyl cellulose type resin is not dissolved in the organic carrier of Comparative Examples 2.On the other hand, ethyl cellulose type resin dissolves is in that comprise can ethyl cellulose dissolved in the organic carrier of other embodiment of the solvent orange 2 A of type resin or solvent D and Comparative Examples.
And, the organic carrier of embodiment and Comparative Examples is at room temperature placed 2 months examination storage stabilities.Comprise solvent C but do not comprise solvent orange 2 A and the organic carrier of the Comparative Examples 4 of B in separate.That is, find that solvent C and solvent orange 2 A and B join together the high storage stability of organic carrier is worked.
Then, comprise as the barium titanate of key component with as the ceramic slurry of the butyraldehyde resin of second kind of resin binder with known method preparation.Afterwards, this slurry is shaped, produces ceramic printed-circuit board with doctor blade method.Especially, should the pottery slurry when adjusting thickness in the film carrier top casting of making by PETG with scraper plate.Like this, form ceramic printed-circuit board.
Then, be placed on the ceramic printed-circuit board showing the embodiment 1-3 of high storage stability and the organic carrier of Comparative Examples 1,3 and 5.Check that visually whether the substrate corrosion default takes place.
As a result, the anti-substrate corrosive nature of embodiment 1-3 is superior.On the other hand, in Comparative Examples 1,3 and 5, observe the substrate corrosion default.
In the embodiment 1-3 of the superior anti-substrate corrosive nature of performance, ceramic printed-circuit board can break away from from film carrier fully.On the other hand, ceramic printed-circuit board is difficult to break away from from film carrier in Comparative Examples 1,3 and 5.
See that as in above-mentioned the solvent that uses among the Comparative Examples 1-5 is low the grade for the use in the conduction of the internal electrode that forms the lamination ceramic electronic component is stuck with paste.
The storage stability (decomposition of adhesive) of the organic carrier of table 2 expression embodiment and Comparative Examples and the test result of anti-substrate corrosive nature.
Table 2
| The solubility of adhesive | Anti-substrate corrosive nature | |||
| Initially | After 2 months | |||
| Embodiment | 1 | Dissolving | Dissolving | Superior |
| 2 | Dissolving | Dissolving | Superior | |
| 3 | Dissolving | Dissolving | Superior | |
| Comparative Examples | 1 | Dissolving | Dissolving | Inferior |
| 2 | Soluble | Soluble | Can not measure | |
| 3 | Dissolving | Dissolving | Inferior | |
| 4 | Dissolving | Dissolving | Can not measure | |
| 5 | Dissolving | Dissolving | Inferior | |
The solvent of only being made up of solvent B in Comparative Examples 2 is ethyl cellulose dissolved type resin not.In Comparative Examples 1,3,4 and 5, solvent one of does not comprise among solvent orange 2 A, B and the C, is not suitable for like this using in conduction is stuck with paste to form internal electrode.
On the other hand, the solvent among the embodiment 1-3 contains among solvent orange 2 A, B and the C all as solvent composition.As seen, this conduction is stuck with paste has superior storage stability, and the substrate corrosion default can be prevented from.
Embodiment 2
In an embodiment, use the solvent identical with embodiment 1.100 parts by weight solvent, 250 weight portion acetone, 42 weight portion Ni powder and 58 weight portion organic carriers mix.Afterwards, this mixture is placed in the sand mill that capacity is 0.6L, disperses to form in 60 minutes slurry.The viscosity of this slurry is measured with BL type viscosity apparatus (by TOKI SANYO CO., the LTD. preparation).
Then, similar embodiment 1 is with being equipped with the epicyclic mixer (planetary mixer) of pressure regulating equipment to evaporate acetone.The conduction that is prepared into the organic carrier of the Ni powder that contains 42wt% and 58wt% is like this stuck with paste, as embodiment 11.
The conduction for preparing Comparative Examples 11 and 12 with the same way as with embodiment 11 is stuck with paste, the solvent that different is based on 100 weight portions, and the content of acetone is respectively 30 weight portions and 110 weight portions.
Subsequently, measure the viscosity of the paste in embodiment 11 and Comparative Examples 11 and 12 with BL type viscosity apparatus (by TOKI SANGYO CO., the LTD. preparation).Afterwards, conduction is stuck with paste be screen-printed to and comprise that barium titanate is made major constituent and the butyraldehyde resin is done on the ceramic printed-circuit board of second kind of adhesive resin.Check printing performance.
The printing performance of the slurry viscosity of table 3 expression embodiment and Comparative Examples, paste viscosity and slurry or paste.
Table 3
| Acetone (weight portion) | Slurry viscosity (mPas) | Stick with paste viscosity (Pas) | Printing character | ||
| Embodiment | 11 | 250 | 10 | 9 | Good |
| Comparative Examples | 11 | 30 | 240 | 28 | Cut |
| 12 | 110 | 294 | 30 | Cut | |
As seen in Table 3, slurry viscosity is big in Comparative Examples 11 and 12, i.e. 240mPas and 294mPas.It is big sticking with paste viscosity, i.e. 28Pas and 30Pas.Form cut in conductive pattern, printing performance is inferior.
On the other hand, in embodiment 11, slurry viscosity is low, i.e. 10mPas, and it is also low suitably to stick with paste viscosity, i.e. 9Pas.Do not produce cut.Printing performance is superior.
Embodiment 3
In embodiment 3, use the solvent identical with embodiment 1.Based on the solvent of 100 weight portions, add the acetone of 250 weight portions.And, add the aliphatic acid (oleic acid that decanedioic acid that fusing point is 70.5 ℃ stearic acid, laurate that fusing point is 44.2 ℃, fusing point is 134 ℃ and fusing point are 13.3 ℃) of 0.05-1.2 weight portion, with capacity the sand mill dispersion 60 minutes of 0.6L.
Subsequently, the Ni powder of 42 weight portions and the organic carrier of 58 weight portions are added in the above-mentioned mixture, disperseed 5 hours with husky mill.Afterwards, remove acetone with fractionation.Like this, obtaining conduction sticks with paste.
On the other hand, with the barium titanate-type ceramic powders of 50wt%, the butyraldehyde resin of 10wt% and for example mixing such as ethanol, toluene of solvent of 40wt%, formed slurry in broken 3 hours with husky mill wet-milling.With doctor blade method this slurry is configured as ceramic printed-circuit board on the film carrier.
Subsequently, the conduction paste is screen-printed on the surface of ceramic printed-circuit board.The a plurality of ceramic printed-circuit boards that are formed with conductive pattern thereon are according to the mode lamination of arranging conductive pattern with predetermined direction.Then, this layered product is clipped between the potsherd that does not have conductive pattern, mutual extrusion and bonding are cut into preliminary dimension under 90 ℃ temperature.Like this, be prepared into ceramic layered product.This pottery layered product is containing N after degreasing
2And H
2Reducing atmosphere at 1200-1300 ℃ of roasting temperature 2-3 hour.Like this, obtain the ceramic post sintering spare of embodiment 21-28 and Comparative Examples 21 and 22.
And, there is not the ceramic post sintering spare of aliphatic acid with the preparation of above-mentioned same way as, as a comparison case 23.
Then, determine 10 mean roughness Rz of embodiment and Comparative Examples.Observe each the end face of 1500 samples of embodiment and Comparative Examples with scanning electron microscopy (SEM).The number of the sample that the counting end face peels off.
Table 4 is illustrated in type, content and fusing point and the measurement result of the aliphatic acid that uses in embodiment and the Comparative Examples.
Table 4
| Aliphatic acid | Content (wt%) | Fusing point (℃) | Measurement result | |||
| 10 mean roughness Rz (μ m) | Peel off the number (n=1500) of end face | |||||
| Embodiment | 21 | Stearic acid | 0.2 | 70.5 | 1.52 | 0 |
| 22 | Stearic acid | 0.2 | 70.5 | 1.53 | 0 | |
| 23 | Stearic acid | 0.05 | 70.5 | 1.62 | 0 | |
| 24 | Stearic acid | 1.0 | 70.5 | 1.45 | 0 | |
| 25 | Laurate | 0.2 | 44.2 | 1.53 | 0 | |
| 26 | Decanedioic acid | 0.2 | 134.0 | 1.55 | 0 | |
| 27 | Stearic acid | 0.03 | 70.5 | 1.63 | 3 | |
| 28 | Stearic acid | 1.2 | 70.5 | 1.46 | 5 | |
| Comparative Examples | 21 | Oleic acid | 0.2 | 13.3 | 1.53 | 70 |
| 22 | Oleic acid | 0.1 | 13.3 | 1.58 | 90 | |
| 23 | - | - | - | 2.50 | 110 | |
As seen in Table 4, in Comparative Examples 23, in sticking with paste, conduction do not add aliphatic acid.These 10 mean roughness Rz are big, i.e. 2.50 μ m.Surface flatness is low, and it is big to peel off the number of end face, and promptly 110.
On the other hand, in sticking with paste, the conduction of embodiment 21-28 and Comparative Examples 21 and 22 adds aliphatic acid.10 mean roughness Rz are in the 1.45-1.63 mu m range.Surface flatness is enhanced.
In Comparative Examples 21 and 22, the low melting point that has that is added in conduction is stuck with paste ordinary temp (20-25 ℃) under to liquid is 13.3 ℃ a oleic acid.This aliphatic acid does not become solid in the production process that conduction is stuck with paste, and is invalid in improving adhesion property.As seen, the number that peels off end face in Comparative Examples 21 and 22 is big, is respectively 70 and 90.
On the other hand, adding under the ordinary temp in conduction is stuck with paste in embodiment 21-28 is the aliphatic acid of solid.The number that peels off end face obviously reduces.Like this, the productive rate of product increases.
Especially, when producing ceramic layered product, aliphatic acid becomes liquid and is dissolved in the ceramic printed-circuit board in embodiment 21-25,27 and 28.Afterwards, this aliphatic acid becomes solid under ordinary temp.As a result, bonding force increases, and the number that peels off end face obviously reduces.Like this, the productive rate of product increases.
In embodiment 26, when producing the ceramic layer compressing tablet, have high-melting-point promptly 134.0 ℃ decanedioic acid be solid state.When the ceramic printed-circuit board of extruded lamination bonds it mutually, plastic deformation takes place, cause the high adhesion between conduction paste and the ceramic printed-circuit board.Therefore, the bonding between ceramic printed-circuit board and the interior electrode layer increases.Like this, the number that peels off end face may reduce.The productive rate of product increases.
Especially, in embodiment 21-26 the content of aliphatic acid in the 0.05-1.0wt% scope.This is effective significantly to preventing that end face from peeling off.
Claims (11)
1. be used for forming on the potsherd that comprises pottery and ceramic binder resin the conduction paste of conductive pattern, this paste comprises:
Conductive powder;
The paste adhesive resin that is different from the ceramic binder resin; With
Three kinds of different solvents,
To stick with paste adhesive resin and be selected from least one in the group of being made up of dihydro-terpineol, dihydro tyerpinyl acetic acid esters and terpineol, second kind of solvent be not to be solvent and to be not to be solvent and to be selected from the group of being made up of methyl decahydronaphthalenes, amylbenzene and cumene at least one for the ceramic binder resin by the mineral oil of 7-20 carbon atom and the third solvent for the ceramic binder resin in order dissolve for first kind of solvent.
2. stick with paste according to the conduction of claim 1, further comprise being the aliphatic acid of solid under the room temperature.
3. stick with paste according to the conduction of claim 2, wherein this aliphatic acid is at least one in the group of being made up of stearic acid, laurate, tetradecylic acid, hexadecylic acid, behenic acid, benzoic acid and decanedioic acid.
4. stick with paste according to the conduction of claim 1, wherein stick with paste adhesive resin and comprise cellulose derivative.
5. stick with paste according to the conduction of claim 4, wherein this cellulose derivative is cellulose ether, cellulose esters or their mixture.
6. stick with paste according to the conduction of claim 5, wherein this cellulose ether is at least one in the group of being made up of ethyl cellulose, carboxymethyl cellulose, hydroxyethylcellulose, hydroxypropyl cellulose, methylcellulose, methyl hydroxyethylcellulose and carboxymethylethylcellulose.
7. stick with paste according to the conduction of claim 5, wherein this cellulose esters is at least one in the group of being made up of cellulose acetate ester and acetobutyric acid cellulose esters.
8. stick with paste according to the conduction of claim 1, wherein this ceramic binder resin is at least one in the group of being made up of polyvinyl acetate resin, acrylic type resin and butyraldehyde resin.
9. stick with paste according to the conduction of claim 1, wherein this paste adhesive resin is an ethyl cellulose resin, and second kind of adhesive resin is butyral resin.
10. stick with paste according to the conduction of claim 1, wherein the amount of solvent is second kind of solvent of first kind of solvent, 10-60wt% of 30-70wt% and the third solvent of 1-20wt%.
11. method that production comprises conductive powder, sticks with paste the conduction paste of adhesive resin and three kinds of different solvents, described conduction is stuck with paste on the potsherd that is adapted at comprising pottery and ceramic binder resin and is formed conductive pattern, it is different sticking with paste with adhesive resin, and the method comprising the steps of:
First kind of solvent, second kind of solvent and the third solvent are provided, and wherein to stick with paste adhesive resin and be selected from least one in the group of being made up of dihydro-terpineol, dihydro tyerpinyl acetic acid esters and terpineol, second kind of solvent be not to be solvent and to be not to be solvent and to be selected from the group of being made up of methyl decahydronaphthalenes, amylbenzene and cumene at least one for the ceramic binder resin by the mineral oil of 7-20 carbon atom and the third solvent for the ceramic binder resin in order dissolve for first kind of solvent;
Mix first kind of solvent, second kind of solvent and the third solvent and generate mixed solvent;
Hybrid conductive powder, paste adhesive resin, mixed solvent and retarder thinner are not higher than the slurry of 10mPas with production viscosity; With
From this slurry, remove retarder thinner.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003168976 | 2003-06-13 | ||
| JP2003168976 | 2003-06-13 |
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| CN1574106A CN1574106A (en) | 2005-02-02 |
| CN1291418C true CN1291418C (en) | 2006-12-20 |
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| CNB2004100592195A Expired - Lifetime CN1291418C (en) | 2003-06-13 | 2004-06-09 | Electroconductive paste and method of producing the same |
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| Country | Link |
|---|---|
| US (1) | US6989110B2 (en) |
| KR (1) | KR100644047B1 (en) |
| CN (1) | CN1291418C (en) |
| TW (1) | TWI287804B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP3944495B2 (en) * | 2004-06-28 | 2007-07-11 | Ｔｄｋ株式会社 | Conductive paste, multilayer ceramic electronic component and manufacturing method thereof |
| KR100691366B1 (en) * | 2005-10-06 | 2007-03-09 | 삼성전기주식회사 | Binder resin for multi layer ceramic condenser internal electrode paste and method for preparing the binder resin and internal electrode paste |
| US20070193675A1 (en) * | 2006-02-22 | 2007-08-23 | Abhijit Gurav | Process of manufacturing a multilayer device and device manufactured thereby |
| EP1993228B1 (en) * | 2007-05-18 | 2012-05-23 | Huawei Technologies Co., Ltd. | Message sending method, message sending device and message transmission system |
| US20100038604A1 (en) * | 2007-08-03 | 2010-02-18 | Noritake Co., Limited | Nickel Paste |
| JP2009037974A (en) * | 2007-08-03 | 2009-02-19 | Noritake Co Ltd | Nickel paste |
| US8436537B2 (en) * | 2008-07-07 | 2013-05-07 | Samsung Sdi Co., Ltd. | Substrate structure for plasma display panel, method of manufacturing the substrate structure, and plasma display panel including the substrate structure |
| US8329066B2 (en) * | 2008-07-07 | 2012-12-11 | Samsung Sdi Co., Ltd. | Paste containing aluminum for preparing PDP electrode, method of preparing the PDP electrode using the paste and PDP electrode prepared using the method |
| KR101081320B1 (en) | 2008-08-28 | 2011-11-08 | 에스에스씨피 주식회사 | Conductive paste composition |
| ES2639292T3 (en) * | 2012-07-30 | 2017-10-26 | Ceramtec Gmbh | Procedure for making metallic through holes |
| KR102410080B1 (en) * | 2014-07-31 | 2022-06-16 | 스미토모 긴조쿠 고잔 가부시키가이샤 | Conductive paste |
| JP6091014B2 (en) * | 2014-11-07 | 2017-03-08 | 楠本化成株式会社 | Method of forming a pattern by screen printing |
| KR102101474B1 (en) * | 2015-12-15 | 2020-04-16 | 주식회사 엘지화학 | Metal paste and thermoelectric module |
| CN105470512B (en) * | 2016-01-15 | 2017-12-01 | 河南比得力高新能源科技有限公司 | A kind of blank preparation technicses of power lithium-ion battery |
| TWI660376B (en) * | 2017-08-09 | 2019-05-21 | 日商創想意沃股份有限公司 | Manufacturing method and device of electronic component and electronic component |
| JP2020119737A (en) * | 2019-01-23 | 2020-08-06 | 大陽日酸株式会社 | Conductive paste, base material with conductive film, production method of base material with conductive film |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1593099A (en) | 1976-12-03 | 1981-07-15 | Kilcher Chemie Ag | Method of producing an electrically conductive plastics material |
| FR2605326A1 (en) * | 1986-10-20 | 1988-04-22 | Rhone Poulenc Multi Tech | POTENTIALLY ADHESIVE COMPOSITION ELECTRICALLY CONDUCTIVE. |
| DE3809331C1 (en) * | 1988-03-19 | 1989-04-27 | Degussa Ag, 6000 Frankfurt, De | |
| JP2976268B2 (en) | 1993-07-05 | 1999-11-10 | 株式会社村田製作所 | Conductive paste and method for manufacturing multilayer ceramic electronic component using the same |
| JP3102454B2 (en) | 1993-07-05 | 2000-10-23 | 株式会社村田製作所 | Conductive paste and method for manufacturing multilayer ceramic electronic component using the same |
| JPH07326534A (en) * | 1994-05-30 | 1995-12-12 | Kyocera Corp | Organic vehicle for conductive paste, and conductive paste |
| US5647901A (en) * | 1994-12-14 | 1997-07-15 | Cerdec Corporation | High loading, low viscosity medium for ceramic coating composition |
| JP3539195B2 (en) | 1998-03-25 | 2004-07-07 | 株式会社村田製作所 | Conductive paste and method of manufacturing ceramic substrate using the same |
| JP2002270456A (en) | 2001-03-07 | 2002-09-20 | Murata Mfg Co Ltd | Conductive paste and laminated ceramic electronic component |
-
2004
- 2004-05-20 US US10/849,130 patent/US6989110B2/en not_active Expired - Lifetime
- 2004-06-03 TW TW093115981A patent/TWI287804B/en not_active IP Right Cessation
- 2004-06-09 CN CNB2004100592195A patent/CN1291418C/en not_active Expired - Lifetime
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| TWI287804B (en) | 2007-10-01 |
| KR20040107438A (en) | 2004-12-20 |
| CN1574106A (en) | 2005-02-02 |
| US20040251449A1 (en) | 2004-12-16 |
| TW200518113A (en) | 2005-06-01 |
| US6989110B2 (en) | 2006-01-24 |
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