CN1288737C - Detection device, testing device of semiconductor device and testing method - Google Patents
Detection device, testing device of semiconductor device and testing method Download PDFInfo
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- CN1288737C CN1288737C CN 03120525 CN03120525A CN1288737C CN 1288737 C CN1288737 C CN 1288737C CN 03120525 CN03120525 CN 03120525 CN 03120525 A CN03120525 A CN 03120525A CN 1288737 C CN1288737 C CN 1288737C
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Abstract
The subject of the invention is to realize a stable contact between IC terminal and probing terminal even when the height deviation of IC terminals of the semiconductor device is large. Through the carrying stage 9 and the ground wiring 11, the wafer 7 is provided with a grounding voltage. Through the carrying height driving unit 17, the carrying stage is moved horizontally to raise the carrying stage 9 to a position with the determined height after the IC terminal 15 of the chip region 13 to be tested is disposed at a position corresponding to the probing terminal 25. By adding the determined current to each probing terminal 25 through the current-addition-determined voltage portion 31, the voltage variation caused by the contact between IC terminal 15 and the probing terminal 25 is monitored. As the carrying stage 9 is further raised and the current-addition-determined voltage portion 31 detects the contact between the IC terminal and the probing terminal 25, contact judgment portion 39 outputs a signal of the information; from the moment, the carrying stage 9 is stopped rising.
Description
Technical field
The present invention relates to make the sniffer of IC terminal of some detection terminal contact semiconductor devices, be provided with the verifying attachment of the semiconductor device of this sniffer, and implement to make the method for inspection of semiconductor device of IC terminal of some detection terminal contact semiconductor devices.
Sniffer of the present invention, the verifying attachment of semiconductor device and the method for inspection are used for for example check of wafer scale (wafer level) chip size package (Chip Size Package, below brief note is " CSP ").
Background technology
In the past, at integrated circuit (Integrated Circuit as semiconductor device, below brief note is for " IC ") production process in, the following stated operation is arranged: make some detection termination contact be formed on the IC terminal on the IC by sniffer, the service test device is supplied with the signal of telecommunication etc. by surveying terminal and IC terminal to IC, carries out the electrical characteristics check of IC.Being documented in the spy as the example of sniffer opens in the flat 11-2448 communique.
Continuously to some IC occasion of testing, the detection terminal of sniffer and the contraposition of IC terminal are performed such: before carrying out initial IC check, carry out the contraposition of horizontal direction by optical means, then, carry out the contraposition of short transverse by pressure sensor or optical means etc., its positional information is stored in the sniffer, and later IC terminal carries out under the equal height condition continuously with contacting all of terminal of detection.The IC terminal height of the IC that the prerequisite of this method is checked continuously is in the certain limit.
In recent years, use the packaging part of wafer level chip size package as semiconductor device.Wafer level chip size package is to be assembled in (reference example such as spy open the 2000-260910 communique) in the packaging part with wafer scale.
Figure 13 is the sectional view of expression wafer level chip size package one example.
On semiconductor substrate 81, form semiconductor elements (diagram is omitted) such as transistor, form IC pad 83 and the metal wiring (diagram is omitted) that for example constitutes by dielectric film (diagram is omitted) thereon again by aluminium.The polyimide by for example film like of boning thereon again constitutes is used to be electrically connected and the wiring substrate 85 of electric wiring.Corresponding with IC pad 83 on wiring substrate 85, be pre-formed electric conducting material 87.On wiring substrate 85 and electric conducting material 87, form copper wiring layer 89 and the copper bump 91 that for example constitutes by Cu.Copper wiring layer 89 and copper bump 91 are called wiring layer more again.
On wiring substrate 85, on the copper wiring the layer 89 and side of copper bump 91 forms sealing resin 93.For example, in the metal pattern of resin-sealed usefulness, the semiconductor substrate 81 of wafer scale is set, sealing resin, and temporarily with film (being used for not making the material of resin contacting metal mould), sealing resin 93 is heated compression, up to making copper bump 91 degree occur from sealing resin 93 surfaces.On copper bump 91, pass through the fixed for example solder ball of mechanical means, as IC terminal 15.IC pad 83 and IC terminal 15 are realized being electrically connected by electric conducting material 87, copper wiring layer 89 and copper bump 91.
As one of feature of wafer level chip size package, can be set forth in its production process, the formation of sealing resin 93 is carried out with wafer scale up to the operation of the formation of IC terminal, after this, wafer is cut into each IC sheet.Consider to utilize this feature, before wafer being cut into each IC sheet, implement the electrical characteristic check of 1C with wafer scale.
But, as shown in figure 14,, be bonding wiring substrate 85 on wafer at the IC of wafer level chip size package terminal 15, on wiring substrate 85, form 1C terminal 15 again, therefore, the height of IC terminal 15 has big deviation.Have again, as shown in figure 15, wafer scale before wafer being cut into each IC sheet, produce stress because of sealing resin 93 is punctured into cause, because this stress, wafer 7 bends, because the influence of this bending, deviation also takes place near the height of the IC terminal 15 of the central and outer regions of wafer 7, and therefore, the height of the 1C terminal 15 of wafer 7 integral body has bigger deviation.
In the electrical characteristic check of IC, when the IC terminal of the CSP that make to survey terminal contact wafer level, use serves as necessarily to implement electrical characteristic check occasion as the sniffer in the past of prerequisite with IC terminal height, at the low IC of IC terminal height, the IC terminal does not contact with the detection terminal, therefore, the problem that existence can not correctly be checked, mistake is judged to be qualified product defective item.
In addition,, make the detection terminal cross and suppress terminal, have the problem that makes damage of IC terminal or distortion to IC at the high IC of IC terminal height.Have, suppress the terminal to IC because the detection terminal is crossed, the positional precision of surveying terminal is incorrect, has the problem of later IC check being brought more incorrect result.
Summary of the invention
The present invention puts forward for solving the existing problem of above-mentioned prior art, the objective of the invention is to: even provide as mentioned above IC terminal height tolerance is big like that semiconductor device for example wafer level chip size package etc. also can realize the IC terminal and survey terminal and stablize the sniffer that contacts, the verifying attachment of semiconductor device, and the method for inspection.
To achieve these goals, the present invention proposes a kind of sniffer, control by control part, make driving mechanism be driven, make the IC terminal of some detection terminal contact semiconductor devices, it is provided with surveys terminal position measuring device and IC terminal position determinator, and above-mentioned detection terminal position measuring device is measured the height and position that detects the above-mentioned detection terminal before beginning, and above-mentioned IC terminal position determinator is measured the height and position that detects the preceding above-mentioned IC terminal of beginning; Be provided with contact detection mechanism, measurement result according to above-mentioned detection terminal position measuring device and above-mentioned IC terminal position determinator, and the driving by above-mentioned driving mechanism, so that the above-mentioned IC terminal of above-mentioned detection termination contact, when above-mentioned detection terminal and IC terminal near the time, above-mentioned contact detection mechanism be used to detect above-mentioned certain survey contacting of terminal and above-mentioned IC terminal; The above-mentioned driving mechanism of above-mentioned control part controlling and driving detects above-mentioned detection terminal and above-mentioned IC termination contact constantly from above-mentioned contact detection mechanism, makes above-mentioned detection terminal and IC terminal towards the only mobile predefined limited amount of approaching mutually direction.
To achieve these goals, the present invention proposes a kind of verifying attachment of semiconductor device, be provided with sniffer and check portion, above-mentioned sniffer makes the IC terminal of some detection terminal contact semiconductor devices, above-mentioned check portion is used for being undertaken by above-mentioned detection terminal and IC terminal the electrical inspection of semiconductor device, and the verifying attachment of semiconductor device of the present invention is provided with the sniffer of the invention described above as above-mentioned sniffer.
To achieve these goals, the present invention proposes a kind of method of inspection of semiconductor device, makes the IC terminal of some detection terminal contact semiconductor devices test, and it comprises following operation:
Measure the height and position of the preceding above-mentioned detection terminal of check beginning;
The height and position of the above-mentioned IC terminal before the sampling and measuring check beginning;
Make above-mentioned detection terminal and IC terminal near so that during the above-mentioned IC terminal of above-mentioned detection termination contact, detect certain above-mentioned detection terminal and above-mentioned IC termination contact;
From detecting above-mentioned time of contact, make above-mentioned detection terminal and above-mentioned IC terminal move towards mutual direction of closing, only move predefined limited amount, make above-mentioned detection terminal and above-mentioned IC termination contact.
The verifying attachment of sniffer involved in the present invention, semiconductor device, and the method for inspection of semiconductor device in, make above-mentioned detection terminal and IC terminal near so that during the above-mentioned IC terminal of above-mentioned detection termination contact, detect certain and survey terminal and IC termination contact, from detecting above-mentioned time of contact, make above-mentioned detection terminal and above-mentioned IC terminal move towards mutual direction of closing, only move predefined limited amount, therefore, can improve the correctness of surveying terminal and IC termination contact.Have again, owing to survey the terminal and the IC termination contact moment from detecting, make above-mentioned detection terminal and above-mentioned IC terminal move towards mutual direction of closing, only move predefined limited amount, therefore, can prevent to survey terminal crosses to suppress and causes IC terminal breakage etc. to the IC terminal.Like this, can realize that the IC terminal contacts with detection the stable of terminal.
The following describes effect of the present invention.
In sniffer of the present invention, be provided with contact detection mechanism, driving by above-mentioned driving mechanism, so that the above-mentioned IC terminal of above-mentioned detection termination contact, when above-mentioned detection terminal and IC terminal near the time, above-mentioned contact detection mechanism be used to detect above-mentioned certain survey contacting of terminal and above-mentioned IC terminal; The above-mentioned driving mechanism of control part controlling and driving detects above-mentioned detection terminal and above-mentioned IC termination contact constantly from above-mentioned contact detection mechanism, makes above-mentioned detection terminal and IC terminal towards the only mobile predefined limited amount of approaching mutually direction.
In the verifying attachment of semiconductor device of the present invention, be provided with sniffer and check portion, the sniffer that is provided with the invention described above is as above-mentioned sniffer.
In the method for inspection of semiconductor device of the present invention, comprise following operation: make to survey terminal and during the above-mentioned IC terminal of approaching so that above-mentioned detection termination contact, detect any above-mentioned detection terminal and above-mentioned IC termination contact with the IC terminal; From detecting above-mentioned time of contact, make above-mentioned detection terminal and above-mentioned IC terminal move towards mutual direction of closing, only move predefined limited amount, make above-mentioned detection terminal and above-mentioned IC termination contact.
Therefore, can improve the correctness of surveying terminal and IC termination contact.Have again, owing to survey the terminal and the IC termination contact moment from detecting, make above-mentioned detection terminal and above-mentioned IC terminal move towards mutual direction of closing, only move predefined limited amount, therefore, can prevent to survey terminal crosses to suppress and causes IC terminal breakage etc. to the IC terminal.Like this, can realize that the IC terminal contacts with detection the stable of terminal.
In sniffer of the present invention, be provided with and survey terminal position measuring device and IC terminal position determinator, above-mentioned detection terminal position measuring device is measured the height and position of the above-mentioned detection terminal before the check beginning, and above-mentioned IC terminal position determinator is measured the height and position of the above-mentioned IC terminal before the check beginning; When driving by above-mentioned driving mechanism, above-mentioned detection terminal and IC terminal with first speed near the time, above-mentioned control part is according to the measurement result of above-mentioned detection terminal position measuring device and IC terminal position determinator, control above-mentioned driving mechanism, at least be positioned at and the above-mentioned IC terminal of the immediate height and position of height and position of above-mentioned detection terminal and the interval of above-mentioned detection termination contact, making above-mentioned detection terminal and IC terminal approaching with the second speed action that is lower than first speed; Above-mentioned contact detection mechanism is at above-mentioned driving mechanism during with second speed action beginning, begins to detect contacting of above-mentioned detection terminal and above-mentioned IC terminal.
In the method for inspection of semiconductor device of the present invention, measure the height and position of the preceding above-mentioned detection terminal of check beginning, the height and position of the above-mentioned IC terminal before the sampling and measuring check beginning; When above-mentioned detection terminal and IC terminal with first speed near the time, according to the height and position of the detection terminal of said determination and the height and position of IC terminal, at least be positioned at and the above-mentioned IC terminal of the immediate height and position of height and position of above-mentioned detection terminal and the interval of above-mentioned detection termination contact, making above-mentioned detection terminal and IC terminal approaching with the second speed action that is lower than first speed; With second speed when beginning action, begin to detect contacting of above-mentioned detection terminal and above-mentioned IC terminal above-mentioned.
Therefore, can correctly carry out following action:, make above-mentioned detection terminal and IC terminal only move predefined limited amount towards mutual direction of closing from detecting the time of contact of surveying terminal and IC terminal.Have again, survey between terminal and the approaching action whole district of IC terminal occasion and compare with making, can shorten Check-Out Time with low speed action.
In sniffer of the present invention, before reaching predefined limit amount, above-mentioned control part makes above-mentioned detection terminal and above-mentioned IC terminal approaching, do not detect above-mentioned detection terminal and above-mentioned IC termination contact occasion by above-mentioned contact detection mechanism, stop the approaching of above-mentioned detection terminal and above-mentioned IC terminal.
In the method for inspection of semiconductor device of the present invention, before reaching predefined limit amount, make that above-mentioned detection terminal and above-mentioned IC terminal are approaching, do not detect above-mentioned detection terminal and above-mentioned IC termination contact occasion, stop the approaching of above-mentioned detection terminal and above-mentioned IC terminal.
Like this, can prevent to survey terminal crosses to suppress to semiconductor device and causes its damage.
In sniffer of the present invention, as first example of above-mentioned contact detection mechanism, it comprises:
Wiring part is used to make semiconductor device to be changed to certain potentials;
Power supply unit is used for to sub-supplying electric current of above-mentioned end of probe or voltage;
Electrical measurement portion is used to measure the voltage or the electric current of above-mentioned detection terminal;
The contact judging part according to the output signal of above-mentioned electrical measurement portion, detects contacting of above-mentioned detection terminal and above-mentioned IC terminal.
First method of inspection as semiconductor device of the present invention comprises following operation:
Make semiconductor device be changed to certain potentials;
To sub-supplying electric current of above-mentioned end of probe or voltage;
Monitor that change in voltage in the above-mentioned detection terminal or electric current change, detect contacting of above-mentioned detection terminal and above-mentioned IC terminal.
Like this, make and survey terminal and IC terminal near so that make when surveying terminal and IC termination contact, can detect contacting of certain detection terminal and IC terminal.
In first example of the contact detection mechanism of sniffer of the present invention, above-mentioned wiring part comprises the objective table that is used to dispose above-mentioned semiconductor device.
In first method of inspection of semiconductor device of the present invention,, make semiconductor device be changed to certain potentials by making that the objective table that is used for the configuring semiconductor device is a certain potentials.
Like this, be easy to make that semiconductor device is changed to certain potentials.
In first example of the contact detection mechanism of sniffer of the present invention, be provided with above-mentioned electrical measurement portion at each above-mentioned detection terminal.
In first method of inspection of semiconductor device of the present invention, each above-mentioned detection terminal is monitored that change in voltage or electric current in the above-mentioned detection terminal change.
Like this, even comprise the outstanding such defective products IC occasion of certain IC terminal height, also can prevent to survey terminal and cross to suppress and cause its damage to semiconductor device.
In sniffer of the present invention, as second example of above-mentioned contact detection mechanism, wherein:
Above-mentioned contact detection mechanism is provided with near the sensor terminal that is configured in the above-mentioned detection terminal, and is used to detect the short-circuit detecting portion that above-mentioned detection terminal and the sensor terminal are electrically connected;
The sensor terminal arrangement is in such position: above-mentioned detection terminal not with above-mentioned IC termination contact state under, this sensor terminal and above-mentioned detection terminal have at interval, and because of above-mentioned detection terminal and above-mentioned IC termination contact are cause, this sensor terminal and above-mentioned detection termination contact.
As second method of inspection of semiconductor device of the present invention, wherein:
Sensor terminal is configured in such position: above-mentioned detection terminal not with above-mentioned IC termination contact state under, this sensor terminal and above-mentioned detection terminal have at interval, and because of above-mentioned detection terminal and above-mentioned IC termination contact are cause, this sensor terminal and above-mentioned detection termination contact;
By detecting being electrically connected of above-mentioned detection terminal and the sensor terminal, detect contacting of above-mentioned detection terminal and above-mentioned IC terminal.
Like this, make and survey terminal and IC terminal near so that make when surveying terminal and IC termination contact, can detect contacting of certain detection terminal and IC terminal.Have again,, also can detect contacting of above-mentioned detection terminal and above-mentioned IC terminal even semiconductor device or IC terminal or both sides' current potential is in indeterminate state.
In second example of the contact detection mechanism of sniffer of the present invention, each surveys terminal relatively, and the sensor terminal is set.
In second method of inspection of semiconductor device of the present invention, each surveys terminal relatively, and configuration the sensor terminal is surveyed terminal to each, detects being electrically connected of above-mentioned detection terminal and the sensor terminal.
Like this, even comprise the outstanding such defective products IC occasion of certain IC terminal height, also can prevent to survey terminal and cross to suppress and cause its damage to semiconductor device.
Description of drawings
Fig. 1 is the summary pie graph of an embodiment of the verifying attachment of expression semiconductor device;
Fig. 2 is the block diagram of this embodiment of expression;
Fig. 3 be this embodiment of expression wafer, survey terminal and apply the circuit diagram of amperometric determination voltage portion;
The flow chart that moves when Fig. 4 is the electrical inspection of this embodiment of expression;
Fig. 5 is the summary pie graph of another embodiment of the verifying attachment of expression semiconductor device;
Fig. 6 is the block diagram of this embodiment of expression;
Fig. 7 be this embodiment of expression wafer, survey terminal and apply the circuit diagram of voltage determination electric current portion;
The flow chart that moves when Fig. 8 is the electrical inspection of this embodiment of expression;
Fig. 9 is the summary pie graph of another embodiment of the verifying attachment of expression semiconductor device;
Figure 10 is the block diagram of this embodiment of expression;
Figure 11 is the circuit diagram of detection terminal, sensor terminal and the short-circuit detecting portion of this embodiment of expression;
The flow chart that moves when Figure 12 is the electrical inspection of this embodiment of expression;
Figure 13 is the sectional view of expression wafer level chip size package one example;
Figure 14 is the sectional view that expression IC terminal height has the wafer level chip size package of deviation;
Figure 15 is the side view that expression is cut into the preceding wafer of each IC sheet.
Embodiment
Below, example of the present invention is described.
In sniffer of the present invention, be preferably, be provided with and survey terminal position measuring device and IC terminal position determinator, above-mentioned detection terminal position measuring device is measured the height and position of the above-mentioned detection terminal before the check beginning, and above-mentioned IC terminal position determinator is measured the height and position of the above-mentioned IC terminal before the check beginning; When driving by above-mentioned driving mechanism, above-mentioned detection terminal and IC terminal near the time, above-mentioned control part is according to the measurement result of above-mentioned detection terminal position measuring device and IC terminal position determinator, control above-mentioned driving mechanism, at least be positioned at and the above-mentioned IC terminal of the immediate height and position of height and position of above-mentioned detection terminal and the interval of above-mentioned detection termination contact, making above-mentioned detection terminal and IC terminal approaching with the low speed action; Above-mentioned contact detection mechanism begins to detect contacting of above-mentioned detection terminal and above-mentioned IC terminal when above-mentioned driving mechanism low speed action beginning.
In the method for inspection of semiconductor device of the present invention, be preferably, measure the height and position of the preceding above-mentioned detection terminal of check beginning, the height and position of the above-mentioned IC terminal before the sampling and measuring check beginning; When above-mentioned detection terminal and IC terminal near the time, according to the height and position of the detection terminal of said determination and the height and position of IC terminal, at least be positioned at and the above-mentioned IC terminal of the immediate height and position of height and position of above-mentioned detection terminal and the interval of above-mentioned detection termination contact, making above-mentioned detection terminal and IC terminal approaching with the low speed action; When above-mentioned low speed action beginning, begin to detect contacting of above-mentioned detection terminal and above-mentioned IC terminal.
At least be positioned at and the above-mentioned IC terminal of the immediate height and position of height and position of above-mentioned detection terminal and the interval of above-mentioned detection termination contact, make above-mentioned detection terminal and IC terminal approaching with low speed action, can correctly carry out following action:, make above-mentioned detection terminal and IC terminal only move predefined limited amount towards mutual direction of closing from detecting the time of contact of surveying terminal and IC terminal.
Have again,, can carry out, therefore, compare, can shorten Check-Out Time with make between detection terminal and the approaching action whole district of IC terminal occasion with the low speed action with high speed motion surveying the approaching action of terminal and IC terminal to shifting to the low speed active region from beginning to make.
In sniffer of the present invention, be preferably, before reaching predefined limit amount, above-mentioned control part makes above-mentioned detection terminal and above-mentioned IC terminal approaching, do not detect above-mentioned detection terminal and above-mentioned IC termination contact occasion by above-mentioned contact detection mechanism, stop the approaching of above-mentioned detection terminal and above-mentioned IC terminal.
In the method for inspection of semiconductor device of the present invention, be preferably, before reaching predefined limit amount, make that above-mentioned detection terminal and above-mentioned IC terminal are approaching, do not detect above-mentioned detection terminal and above-mentioned IC termination contact occasion, stop the approaching of above-mentioned detection terminal and above-mentioned IC terminal.
Like this, can prevent to survey terminal crosses to suppress to semiconductor device and causes its damage.
In sniffer of the present invention, as first example of above-mentioned contact detection mechanism, can be listed below: it comprises:
Wiring part is used to make semiconductor device to be changed to certain potentials;
Power supply unit is used for to sub-supplying electric current of above-mentioned end of probe or voltage;
Electrical measurement portion is used to measure the voltage or the electric current of above-mentioned detection terminal;
The contact judging part according to the output signal of above-mentioned electrical measurement portion, detects contacting of above-mentioned detection terminal and above-mentioned IC terminal.
First method of inspection as semiconductor device of the present invention can be listed below: it comprises following operation:
Make semiconductor device be changed to certain potentials;
To sub-supplying electric current of above-mentioned end of probe or voltage;
Monitor that change in voltage in the above-mentioned detection terminal or electric current change, detect contacting of above-mentioned detection terminal and above-mentioned IC terminal.
Like this, make and survey terminal and IC terminal near so that make when surveying terminal and IC termination contact, can detect contacting of certain detection terminal and IC terminal.
In first example of the contact detection mechanism of sniffer of the present invention, be preferably, above-mentioned wiring part comprises the objective table that is used to dispose above-mentioned semiconductor device.
In first method of inspection of semiconductor device of the present invention, be preferably, by making that the objective table that is used for the configuring semiconductor device is a certain potentials, make semiconductor device be changed to certain potentials.
Like this, be easy to make that semiconductor device is changed to certain potentials.
In first example of the contact detection mechanism of sniffer of the present invention, be preferably, be provided with above-mentioned electrical measurement portion at each above-mentioned detection terminal.
In first method of inspection of semiconductor device of the present invention, be preferably, each above-mentioned detection terminal is monitored that change in voltage or electric current in the above-mentioned detection terminal change.
Like this, even comprise the outstanding such defective products IC occasion of certain IC terminal height, also can prevent to survey terminal and cross to suppress and cause its damage to semiconductor device.
In sniffer of the present invention, second example as above-mentioned contact detection mechanism can be listed below:
Above-mentioned contact detection mechanism is provided with near the sensor terminal that is configured in the above-mentioned detection terminal, and is used to detect the short-circuit detecting portion that above-mentioned detection terminal and the sensor terminal are electrically connected;
The sensor terminal arrangement is in such position: above-mentioned detection terminal not with above-mentioned IC termination contact state under, this sensor terminal and above-mentioned detection terminal have at interval, and because of above-mentioned detection terminal and above-mentioned IC termination contact are cause, this sensor terminal and above-mentioned detection termination contact.
Second method of inspection as semiconductor device of the present invention can be listed below:
Sensor terminal is configured in such position: above-mentioned detection terminal not with above-mentioned IC termination contact state under, this sensor terminal and above-mentioned detection terminal have at interval, and because of above-mentioned detection terminal and above-mentioned IC termination contact are cause, this sensor terminal and above-mentioned detection termination contact;
By detecting being electrically connected of above-mentioned detection terminal and the sensor terminal, detect contacting of above-mentioned detection terminal and above-mentioned IC terminal.
Like this, make and survey terminal and IC terminal near so that make when surveying terminal and IC termination contact, can detect contacting of certain detection terminal and IC terminal.Have again,, also can detect contacting of above-mentioned detection terminal and above-mentioned IC terminal even semiconductor device or IC terminal or both sides' current potential is in indeterminate state.
In second example of the contact detection mechanism of sniffer of the present invention, be preferably, each surveys terminal relatively, and the sensor terminal is set.
In second method of inspection of semiconductor device of the present invention, be preferably, each surveys terminal relatively, and configuration the sensor terminal is surveyed terminal to each, detects being electrically connected of above-mentioned detection terminal and the sensor terminal.
Like this, even comprise the outstanding such defective products IC occasion of certain IC terminal height, also can prevent to survey terminal and cross to suppress and cause its damage to semiconductor device.
With reference to the accompanying drawings, be described in more detail the embodiment of the invention.
Fig. 1 is the summary pie graph of an embodiment of the verifying attachment of expression semiconductor device, and Fig. 2 is the block diagram of this embodiment of expression.
Verifying attachment 1 is made of sniffer 3 and verifier (check portion) 5, above-mentioned sniffer 3 is used to make the IC terminal of some detection terminal contact semiconductor devices, and above-mentioned verifier 5 is provided with and is used for by surveying the check portion that terminal and IC terminal carry out the electrical inspection of IC.In Fig. 1 and Fig. 2, the means diagram that is used to supply with the check signal that sets for the electrical inspection that carries out IC etc., determination check result is omitted.
Be provided with objective table 9 at sniffer 3, be used for disposing the wafer 7 (omitting) of the many wafer level chip size packages of formation before for example cutting off in Fig. 2 diagram.By there not being illustrated vacuum attraction mechanism, above-mentioned wafer 7 is attracted on the objective table 9.The part of the configuration wafer 7 of objective table 9 is connected with earthing potential (certain potentials) by ground connection distribution (wiring part) 11.
Cut crystal 7, chip area 13 assortments that become a wafer level chip size package become array-like, form IC terminal 15 at each chip area 13.In Fig. 1, illustration forms six IC terminals 15 to a wafer level chip size package.
The objective table height driven unit 17 that is provided for making objective table 9 to move along the vertical direction.Objective table height driven unit 17 comprises and is used to driving mechanism 19 that objective table 9 is moved and the control part 21 (with reference to Fig. 2) that is used for controlling and driving mechanism.
With the configuration wafer 7 of objective table 9 in the face of to, configuration is provided with the probe card (probe card) 23 that the six roots of sensation is surveyed terminal 25.Survey terminal 25 and be supported on the probe card 23, make that six IC terminals 15 in surveying terminal 25 front ends and being configured in chip area 13 are corresponding.The height and position of probe card 23 is fixed.
Measure means in sniffer 3 pressure sensor 27 as the IC terminal position, be used for the height and position of sampling and measuring IC terminal 15.Near configuration charge coupled device probe card 23 (ChargeCoupled Device, below brief note is " CCD ") transducer 29 as surveying terminal position finding means, is used for for example height and position on optical detecting detection terminal 25 tops.The output signal of the output signal of pressure sensor 27 and ccd sensor 29 is sent to the control part 21 of objective table height driven unit 17.
Be provided with six at verifier 5 and apply amperometric determination voltage portion 31 as electrical measurement portion.Survey terminal 25 at each and be provided with the amperometric determination voltage portion 31 that applies, survey terminal 25 and apply amperometric determination voltage portion 31 electrical wirings.
Fig. 3 represents the circuit diagram surveying terminal 25 and apply amperometric determination voltage portion 31.
Apply amperometric determination voltage portion 31 by switch 33, constitute as the constant-current source 35 of power supply unit and as the potentiometer 37 of electrical measurement portion.The switching of the on/off of switch 33 is by control part 21 controls.One terminal of switch 33 is connected with detection terminal 25, and another terminal is connected with constant-current source 35.Potentiometer 37 is connected in parallel on the distribution between switch 33 and the constant-current source 35.For example the little occasion of the predefined assigned voltage of the voltage ratio of measuring, the contact decision signal that applies amperometric determination voltage portion 31 is that logical value is 0 the signal of telecommunication, in the above occasion of assigned voltage, above-mentioned contact decision signal is that logical value is 1 the signal of telecommunication.Constant-current source 35 is supplied with for example constant current of one 10 μ A (microampere).Constant-current source 35 both can apply amperometric determination voltage portion 31 at each and be provided with, and it is shared also can somely to apply amperometric determination voltage portion 31.
In the present embodiment, constitute part by P type substrate and become checked object as wafer 7.As shown in Figure 1, wafer 7 is connected with earthing potential by objective table 9 and ground connection distribution 11.Therefore, wafer 7 and negative electrode and IC terminal 15 is connected, anode is connected with earthing potential pn junction diode equivalence.
Get back to Fig. 1 and Fig. 2 goes on to say, be provided with contact judging part 39, be used for judging signal, detect contacting of any IC terminal 15 and detection terminal 25 according to the contact that applies amperometric determination voltage portion 31 in check portion 5.For example can use and six import the OR-gate logical circuits as contact judging part 39.The output signal of contact judging part 39 is sent to the control part 21 of objective table height driven unit 17.
In this embodiment, first example of contact detection of the present invention mechanism is made of switch 33, the amperometric determination voltage portion 31 that applies that is provided with constant-current source 35 and potentiometer 37, objective table 9, ground connection distribution 11 and contact judging part 39.
The flow chart that moves when Fig. 4 is the electrical inspection of this embodiment of expression.Move when the electrical inspection of present embodiment being described with reference to Fig. 1-Fig. 4.By explanation, an embodiment of first method of inspection of semiconductor device of the present invention is described to this action.
One wafer 7 as one group, is carried out a series of action to each group, the electrical inspection of beginning IC (group beginning).When the check beginning, objective table 9 is configured in the initial value height and position, and switch 33 disconnects.
By ccd sensor 29, measure to survey the height and position on terminal 25 tops and the position of horizontal direction, the positional information of the height and position on above-mentioned detection terminal 25 tops and horizontal direction is sent to the control part 21 (step S1) of objective table height driven unit 17.
By control part 21, driving mechanism 19 is driven, and makes objective table 9 rise, by the detection signal of pressure sensor 27, and the height and position of sampling and measuring 1C terminal 15 (step S2).After this, make objective table 9 get back to the initial value height and position.
Sampling and measuring IC terminal 15 height and positions one example is described, carries out the contraposition of the horizontal direction of wafer 7 by ccd sensor (diagram omit) in advance, with the horizontal direction location storage of IC terminal 15 at sniffer 3.Ccd sensor used herein both can by change be used to measure the height and position of surveying terminal 25 and horizontal direction position ccd sensor 29 towards use, also can not be ccd sensor 29, and prepare in addition.
Make objective table 9 horizontal directions move, the IC terminal of sampling and measuring come be right after pressure sensor 27 below.Make objective table 9 rise, measure the height and position of the IC terminal 15 of sampling and measuring by pressure sensor 27.After this, make objective table 9 descend.
The horizontal direction of objective table 9 moves, rises and descends repeatedly, and the number of occurrence is the number of the IC terminal 15 of sampling and measuring, obtains necessary sampled data.
Getting back to Fig. 4 goes on to say, by control part 21, according to sampling and measuring result at above-mentioned steps S2, deduction has the height and position of the IC terminal 15 of maximum height position (with the immediate height and position of height and position of surveying terminal 25) in wafer 7, height and position information according to this inferred results and detection terminal 25 tops, set above-mentioned being inferred as and have the height that contacts with detection terminal 25 with the IC terminal 15 of the immediate height and position of height and position of surveying terminal 25, begin height (step S3) as IC terminal 15 and the contact detection of surveying terminal 25.The driving of control part 21 controlling and driving mechanisms 19 begins height and position interval more than the height in contact detection, with the low speed action objective table 9 is risen.
Make driving mechanism 19 drive by control part 21, make the height and position of objective table 9 keep initial value to move horizontally, the IC terminal 15 of the chip area 13 of testing at first is configured in the position (step S4) corresponding with surveying terminal 25.
To with the chip area 13 of surveying terminal 25 corresponding configurations, begin electrical inspection (chip inspection begins).
Make driving mechanism 19 drive by control part 21, make objective table 9 rise to contact detection and begin height (step S5) from the initial value height and position with high speed motion.
By the control of control part 21, connect switch 33, apply for example electric current of one 10 μ As (step S6) by switch 33 to surveying terminal 25 from constant-current source 35.
Measure the voltage (step S7) of respectively surveying terminal 25 by potentiometer 37.When the little occasion of the predefined assigned voltage of mensuration voltage ratio, potentiometer 37 output logic values be 0 the signal of telecommunication as the contact decision signal, in the above occasion of assigned voltage, the output logic value is 1 the signal of telecommunication.
By contact judging part 39, according to the output logic value of above-mentioned potentiometer 37, judge whether that the voltage of detection terminal 25 is more than the assigned voltage, promptly survey terminal 25 and whether contact with IC terminal 15.When the whole logical values of contact decision signal from potentiometer 37 are 0 (littler than assigned voltage) occasion, contact judging part 39 output logic values are 0 the signal of telecommunication, judge that promptly which surveys terminal 25 and all do not have to contact with IC terminal 15; When certain the contact decision signal logical value from potentiometer 37 is 1 (more than the assigned voltage) occasion, contact judging part 39 output logic values are 1 the signal of telecommunication, judge that promptly certain surveys terminal 25 and contact (step S8) with IC terminal 15.
It when contact judging part 39 output logic values 0 the signal of telecommunication, the detection voltage that is which potentiometer 37 is all than the little occasion of assigned voltage ("No" of step S8), and control part 21 judges whether the height and position (objective table height) of objective table 9 is limits value (step S9).Limits value is set in the rising of 21 pairs of objective tables 9 of control part, suppresses the damage that causes wafer 7 and detection terminal 25 to wafer 7 to prevent that end of probe 25 from crossing.
At step S9, be judged as objective table 9 and highly do not reach the limits value occasion, the driving of 21 pairs of driving mechanisms 19 of control part is controlled, and makes the objective table 9 for example 10 μ m (step S10) that only rise.At this moment, continue to measure the voltage (step S7) of respectively surveying terminal 25, judge IC terminal 15 and contact (the step S8) that surveys terminal 25 by potentiometer 37.
At step S9, be judged as objective table 9 and highly reach the limits value occasion, the chip of the chip area 13 in 21 pairs of checks of control part is judged as defective (step S11), makes objective table 9 drop to the initial value height and position.Like this, can prevent to survey terminal 25 crosses to suppress to wafer 7 and be thereby the wafer 7 that causes and the damage of detection terminal 25.For being judged as underproof chip area 13, finish chip inspection (chip inspection end).
At step S8, it when contact judging part 39 output logic values 1 the signal of telecommunication, the detection voltage that is certain potentiometer 37 is the above occasion of assigned voltage ("Yes" of step S8), the driving of 21 pairs of driving mechanisms 19 of control part is controlled, and makes the objective table 9 predefined a certain amount of for example 40 μ m (step S12) that only rise.
It is when certain detection terminal 25 contacts with IC terminal 15 that the detection voltage of certain potentiometer 37 becomes more than the assigned voltage, predefined a certain amount of by making constantly that from this objective table 9 only rises, can improve and all survey the correctness that terminal 25 contacts with IC terminal 15.Can prevent to survey terminal 25 crosses to suppress and causes to wafer 7 and to survey terminal 25 breakages etc.Like this, can realize that IC terminal 15 contacts with detection the stable of terminal 25.
It is predefined a certain amount of to make objective table 9 only rise, make and all to survey terminals 25 and after IC terminal 15 contacts, enter common check problem, the electrical inspection in the 1C zone 13 in testing, judge be verified IC zone 13 corresponding be verified IC chip whether qualified (step S13).
Behind the electrical inspection that sets, make objective table 9 drop to the height and position of initial value,, finish chip inspection (chip inspection end) for the chip area 13 in the check.
After chip inspection finishes, judge whether whole chip areas 13 test endings (step S 14) in the wafer 7.There are not checking chip zone 13 occasions ("No" of step S14), driving by 21 pairs of driving mechanisms 19 of control part is controlled, make objective table 9 keep the height and position of initial value to move horizontally, the IC terminal 15 of next chip area of testing 13 is configured in the position (step S 15) corresponding with surveying terminal 25, to this chip area 13, beginning electrical inspection (chip inspection begins).At step S14, finish occasion ("Yes" of step S14) if be judged as whole chip area 13 electrical inspections, to the wafer 7 that is configured in objective table 9, finish electrical inspection (group finishes).
According to present embodiment, even the big occasion of IC terminal height tolerance on the wafer 7, detect IC terminal 15 and survey contacting of terminal 25, constantly make the objective table 9 predefined limited amount that only rises from this detection, each chip area 13 is implemented above-mentioned action, therefore, at whole chip areas 13, can realize that IC terminal 15 contacts with detection the stable of terminal 25.
In the embodiment shown in fig. 1, make IC terminal 15 with survey that terminal 25 contacts so that when carrying out electrical inspection, on detection terminal 25, apply the constant current that sets, detection is the change in voltage in the detection terminal 25 of cause because of IC terminal 15 contacts with detection terminal 25, but the present invention is not limited thereto, also can on detection terminal 25, apply the constant voltage that sets, by detecting, detect IC terminal 15 and survey contacting of terminal 25 because of IC terminal 15 contacts to the electric current in the detection terminal 25 of cause changes with surveying terminal 25.Below, this embodiment is described.
Fig. 5 is the summary pie graph of another embodiment of the verifying attachment of expression semiconductor device, and Fig. 6 is the block diagram of this embodiment of expression.Be marked with same-sign with Fig. 1 and Fig. 2 same section, the appropriate section explanation is omitted.
Verifying attachment 41 is made of sniffer 43 and verifier 45, above-mentioned sniffer 43 is used to make the IC terminal of some detection terminal contact semiconductor devices, and above-mentioned verifier 45 is provided with and is used for by surveying the check portion that terminal and IC terminal carry out the electrical inspection of IC.In Fig. 5 and Fig. 6, the means diagram that is used to supply with the check signal that sets for the electrical inspection that carries out IC etc., determination check result is omitted.
At sniffer 43, be provided with objective table 9, ground connection distribution 11, probe card 23, pressure sensor 27, ccd sensor 29, reach objective table height driven unit 47, above-mentioned objective table 9 is used to dispose the wafer 7 that is formed with chip area 13 and IC terminal 15.Objective table height driven unit 47 comprises driving mechanism 19, and the control part 49 (with reference to Fig. 6) that is used for controlling and driving mechanism 19.The output signal of the output signal of pressure sensor 27 and ccd sensor 29 is sent to the control part 49 of objective table height driven unit 47.
Be provided with six at verifier 45 and apply voltage determination electric current portion 51 as electrical measurement portion.Survey terminal 25 at each and be provided with the voltage determination electric current portion 51 that applies, survey terminal 25 and apply voltage determination electric current portion 51 and be electrically connected.
Fig. 7 represents wafer 7, detection terminal 25 and applies the circuit diagram of voltage determination electric current portion 51.
Apply voltage determination electric current portion 51 by switch 53, constitute as the constant pressure source 55 of power supply unit and as the galvanometer 57 of electrical measurement portion.The switching of the on/off of switch 53 is by control part 49 controls.One terminal of switch 53 is connected with detection terminal 25, and another terminal is connected with constant pressure source 55.Galvanometer 57 is connected in series on the distribution between switch 53 and the constant pressure source 55.For example the little occasion of the predefined rated current of the current ratio of measuring, the contact decision signal that applies voltage determination electric current portion 51 is that logical value is 0 the signal of telecommunication, in the above occasion of rated current, above-mentioned contact decision signal is that logical value is 1 the signal of telecommunication.Constant pressure source 55 for example supplies with-constant voltage of 1V (volt).Constant pressure source 55 both can apply voltage determination electric current portion 51 at each and be provided with, and it is shared also can somely to apply voltage determination electric current portion 51.
In the present embodiment, constitute part by P type substrate and become checked object as wafer 7.As shown in Figure 5, wafer 7 is connected with earthing potential by objective table 9 and ground connection distribution 11.Therefore, wafer 7 and negative electrode and IC terminal 15 is connected, anode is connected with earthing potential pn junction diode equivalence.
Get back to Fig. 5 and Fig. 6 goes on to say, be provided with contact judging part 59, be used for judging signal, detect contacting of any IC terminal 15 and detection terminal 25 according to the contact that applies voltage determination electric current portion 51 in check portion 45.For example can use and six import the OR-gate logical circuits as contact judging part 59.The output signal of contact judging part 59 is sent to the control part 490 of objective table height driven unit 47
In this embodiment, first example of contact detection of the present invention mechanism is made of switch 53, the voltage determination electric current portion 51 that applies that is provided with constant pressure source 55 and galvanometer 57, objective table 9, ground connection distribution 11 and contact judging part 59.
The flow chart that moves when Fig. 8 is the electrical inspection of this embodiment of expression.Move when the electrical inspection of present embodiment being described with reference to Fig. 5-Fig. 8.By explanation, another embodiment of first method of inspection of semiconductor device of the present invention is described to this action.
One wafer 7 as one group, is carried out a series of action to each group, the electrical inspection of beginning IC (group beginning).When the check beginning, objective table 9 is configured in the initial value height and position, and switch 53 disconnects.
By ccd sensor 29, measure to survey the height and position on terminal 25 tops and the position of horizontal direction, the positional information of the height and position on above-mentioned detection terminal 25 tops and horizontal direction is sent to the control part 49 (step S31) of objective table height driven unit 47.
By control part 49, driving mechanism 19 is driven, and makes objective table 9 rise, by the detection signal of pressure sensing 327, and the height and position of sampling and measuring IC terminal 15 (step S32).After this, make objective table 9 get back to the initial value height and position.
By control part 49, according to sampling and measuring result at above-mentioned steps S32, deduction has the height and position of the IC terminal 15 of maximum height position in wafer 7, height and position information according to this inferred results and detection terminal 25 tops, set above-mentioned being inferred as and have the height that contacts with detection terminal 25 with the IC terminal 15 of the immediate height and position of height and position of surveying terminal 25, begin height (step S33) as IC terminal 15 and the contact detection of surveying terminal 25.The driving of control part 49 controlling and driving mechanisms 19 begins height and position interval more than the height in contact detection, with the low speed action objective table 9 is risen.
Make driving mechanism 19 drive by control part 49, make the height and position of objective table 9 keep initial value to move horizontally, the IC terminal 15 of the chip area 13 of testing at first is configured in the position (step S34) corresponding with surveying terminal 25.
To with the chip area 13 of surveying terminal 25 corresponding configurations, begin electrical inspection (chip inspection begins).
Make driving mechanism 19 drive by control part 49, make objective table 9 rise to contact detection and begin height (step S35) from the initial value height and position with high speed motion.
By the control of control part 49, connect switch 53, for example apply to surveying terminal 25-voltage (step S36) of 1V by switch 53 from constant pressure source 55.
Measure the electric current of respectively surveying in the terminal 25 (step S37) by galvanometer 57.When the little occasion of the predefined rated current of mensuration current ratio, galvanometer 57 output logic values are 0 the signal of telecommunication, and in the above occasion of rated current, the output logic value is 1 the signal of telecommunication.
By contact judging part 59, according to the output logic value of above-mentioned galvanometer 57, judge whether that the electric current of detection terminal 25 is more than the rated current, promptly survey terminal 25 and whether contact with IC terminal 15.When whole logical values of contact decision signal from galvanometer 57 not are 0 (littler than rated current) occasion, contact judging part 59 output logic values are 0 the signal of telecommunication, judge that promptly which surveys terminal 25 and all do not have to contact with IC terminal 15; When certain the contact decision signal logical value from galvanometer 57 is 1 (more than the rated current) occasion, contact judging part 59 output logic values are 1 the signal of telecommunication, judge that promptly certain surveys terminal 25 and contact (step S38) with IC terminal 15.
When contacting judging part 59 output logic values is 0, and promptly the detection electric current of which galvanometer 57 is all than the little occasion of rated current ("No" of step S38), and control part 49 judges whether the height and position (objective table height) of objective table 9 is limits value (step S39).Limits value is set in the rising of 49 pairs of objective tables 9 of control part, suppresses the damage that causes wafer 7 and detection terminal 25 to wafer 7 to prevent that end of probe 25 from crossing.
At step S39, be judged as objective table 9 and highly do not reach the limits value occasion, the driving of 49 pairs of driving mechanisms 19 of control part is controlled, and makes the objective table 9 for example 10 μ m (step S40) that only rise.At this moment, continue to measure the electric current of respectively surveying in the terminal 25 (step S37), judge IC terminal 15 and contact (the step S38) that surveys terminal 25 by galvanometer 57.
At step S39, be judged as objective table 9 and highly reach the limits value occasion, the chip of the chip area 13 in 49 pairs of checks of control part is judged as defective (step S41), makes objective table 9 drop to the initial value height and position.Like this, can prevent to survey terminal 25 crosses to suppress to wafer 7 and be thereby the wafer 7 that causes and the damage of detection terminal 25.For being judged as underproof chip area 13, finish chip inspection (chip inspection end).
At step S38, when contact judging part 59 output logic values are 1, the detection electric current that is certain galvanometer 57 is the above occasion of rated current ("Yes" of step S38), the driving of 49 pairs of driving mechanisms 19 of control part is controlled, and makes the objective table 9 predefined a certain amount of for example 40 μ m (step S42) that only rise.
It is when certain detection terminal 25 contacts with IC terminal 15 that the detection voltage of certain galvanometer 57 becomes more than the assigned voltage, predefined a certain amount of by making constantly that from this objective table 9 only rises, can improve and all survey the correctness that terminal 25 contacts with IC terminal 15.Can prevent to survey terminal 25 crosses to suppress and causes to wafer 7 and to survey terminal 25 breakages etc.Like this, can realize that IC terminal 15 contacts with detection the stable of terminal 25.
It is predefined a certain amount of to make objective table 9 only rise, make and all to survey terminals 25 and after IC terminal 15 contacts, enter common check problem, the electrical inspection in the IC zone 13 in testing, judge be verified IC zone 13 corresponding be verified IC chip whether qualified (step S43).
Behind the electrical inspection that sets, make objective table 9 drop to the height and position of initial value,, finish chip inspection (chip inspection end) for the chip area 13 in the check.
After chip inspection finishes, judge whether whole chip areas 13 test endings (step RS44) in the wafer 7.There are not checking chip zone 13 occasions ("No" of step S44), driving by 49 pairs of driving mechanisms 19 of control part is controlled, make objective table 9 keep the height and position of initial value to move horizontally, the IC terminal 15 of next chip area of testing 13 is configured in the position (step S45) corresponding with surveying terminal 25, to this chip area 13, beginning electrical inspection (chip inspection begins).At step S44, finish occasion ("Yes" of step S44) if be judged as whole chip area 13 electrical inspections, to the wafer 7 that is configured in objective table 9, finish electrical inspection (group finishes).
According to present embodiment, even the big occasion of IC terminal height tolerance on the wafer 7, detect IC terminal 15 and survey contacting of terminal 25, constantly make the objective table 9 predefined limited amount that only rises from this detection, each chip area 13 is implemented above-mentioned action, therefore, at whole chip areas 13, can realize that IC terminal 15 contacts with detection the stable of terminal 25.
Fig. 9 is the summary pie graph of another embodiment of the verifying attachment of expression semiconductor device, and Figure 10 is the block diagram of this embodiment of expression.Be marked with same-sign with Fig. 1-Fig. 4 same section, the appropriate section explanation is omitted.
Verifying attachment 61 is made of sniffer 63 and verifier 65, above-mentioned sniffer 63 is used to make the IC terminal of some detection terminal contact semiconductor devices, and above-mentioned verifier 65 is provided with and is used for by surveying the check portion that terminal and IC terminal carry out the electrical inspection of IC.In Fig. 9 and Figure 10, the means diagram that is used to supply with the check signal that sets for the electrical inspection that carries out IC etc., determination check result is omitted.
At sniffer 63, be provided with objective table 9, ground connection distribution 11, probe card 69, pressure sensor 27, ccd sensor 29, and objective table height driven unit 65, above-mentioned objective table 9 is used to dispose the wafer 7 that is formed with chip area 13 and IC terminal 15, and above-mentioned probe card 69 disposes surveys terminal 25 and sensor terminal 71.Sensor terminal 71 is surveyed terminal 25 corresponding settings with each.Objective table height driven unit 65 comprises driving mechanism 19, and the control part 67 (with reference to Figure 10) that is used for controlling and driving mechanism 19.The output signal of the output signal of pressure sensor 27 and ccd sensor 29 is sent to the control part 67 of objective table height driven unit 65.
Be provided with six short-circuit detecting portions 73 as electrical measurement portion at verifier 65.As shown in the figure, relatively respectively survey terminal 25 and sensor terminal and be provided with short-circuit detecting portion 73 for 71 groups, survey terminal 25 and sensor terminal 71 and short-circuit detecting portion 73 and be electrically connected.
Figure 11 is the pie graph of detection terminal 25, sensor terminal 71 and the short-circuit detecting portion 73 of this embodiment of expression.
Short-circuit detecting portion 73 is used for electrical and surveys contacting of terminal 25 and sensor terminal 71, the on/off that can move in inner change detection.When detection terminal 25 did not contact with sensor terminal 71, the contact decision signal of short-circuit detecting portion 73 was signals of telecommunication of logical value 0, and when detection terminal 25 contacted with sensor terminal 71, the contact decision signal of short-circuit detecting portion 73 was signals of telecommunication of logical value 1.
Get back to Fig. 9 and Figure 10 goes on to say, be provided with contact judging part 75, be used for judging signal, detect contacting of certain IC terminal 15 and detection terminal 25 according to the contact of short-circuit detecting portion 73 in check portion 65.For example can use and six import the OR-gate logical circuits as contact judging part 75.The output signal of contact judging part 75 is sent to the drawing portion 67 of objective table height driven unit 65.
In this embodiment, second example of contact detection of the present invention mechanism is made of sensor terminal 71, short-circuit detecting portion 73 and contact judging part 75.
The flow chart that moves when Figure 12 is the electrical inspection of this embodiment of expression.Move when the electrical inspection of present embodiment being described with reference to Fig. 9-Figure 12.By explanation, an embodiment of second method of inspection of semiconductor device of the present invention is described to this action.
One wafer 7 as one group, is carried out a series of action to each group, the electrical inspection of beginning IC (group beginning).When the check beginning, objective table 9 is configured in the initial value height and position, and short-circuit detecting portion 73 disconnects.
By ccd sensor 29, measure to survey the height and position on terminal 25 tops and the position of horizontal direction, the positional information of the height and position on above-mentioned detection terminal 25 tops and horizontal direction is sent to the control part 67 (step 551) of objective table height driven unit 65.
By control part 67, driving mechanism 19 is driven, and makes objective table 9 rise, by the detection signal of pressure sensor 27, and the height and position of sampling and measuring IC terminal 15 (step S52).After this, make objective table 9 get back to the initial value height and position.
By control part 67, according to sampling and measuring result at above-mentioned steps S52, deduction has the height and position of the IC terminal 15 of maximum height position in wafer 7, height and position information according to this inferred results and detection terminal 25 tops, set above-mentioned being inferred as and have the height that contacts with detection terminal 25 with the IC terminal 15 of the immediate height and position of height and position of surveying terminal 25, begin height (step S53) as IC terminal 15 and the contact detection of surveying terminal 25.The driving of control part 67 controlling and driving mechanisms 19 begins height and position interval more than the height in contact detection, with the low speed action objective table 9 is risen.
Make driving mechanism 19 drive by control part 67, make the height and position of objective table 9 keep initial value to move horizontally, the IC terminal 15 of the chip area 13 of testing at first is configured in the position (step S54) corresponding with surveying terminal 25.
To with the chip area 13 of surveying terminal 25 corresponding configurations, begin electrical inspection (chip inspection begins).
Make driving mechanism 19 drive by control part 67, make objective table 9 rise to contact detection and begin height (step S55) from the initial value height and position with high speed motion.
By the control of control part 67, connect short-circuit detecting portion 73, detect survey terminal 25 and sensor terminal 71 contact (short circuit) (step S56).Survey terminal 25 and contact occasion with sensor terminal 71, the contact decision signal of short-circuit detecting portion 73 output logic values 1 is surveyed terminal 25 and is not contacted occasion with sensor terminal 71, the contact decision signal of short-circuit detecting portion 73 output logic values 0.
By contact judging part 75,, judged whether to survey terminal 25 and contacted with IC terminal 15 according to the contact decision signal of above-mentioned short-circuit detecting portion 73.When the whole logical values of contact decision signal from short-circuit detecting portion 73 are 0 occasion, contact judging part 75 output logic values 0, judge that promptly which detection terminal 25 does not all have to contact with IC terminal 15; When certain the contact decision signal logical value from short-circuit detecting portion 73 is 1 occasion, contact judging part 75 output logic values 1, judge that promptly certain detection terminal 25 contacts (step S57) with IC terminal 15.
When contact judging part 75 output logic values, 0 occasions ("No" of step S57), control part 67 judges whether the objective table height of objective table 9 is limits value (step S58).Limits value is set in the rising of 67 pairs of objective tables 9 of control part, suppresses the damage that causes wafer 7 and detection terminal 25 to wafer 7 to prevent that end of probe 25 from crossing.
At step S58, be judged as objective table 9 and highly do not reach the limits value occasion, the driving of 67 pairs of driving mechanisms 19 of control part is controlled, and makes the objective table 9 for example 10 μ m (step S59) that only rise.At this moment, continue to monitor that by short-circuit detecting portion 73 each surveys, contact (the step S56) of terminal 25 and sensor terminal 71 judges contact (the step S57) of detection terminal 25 and sensor terminal 71.
At step S58, be judged as objective table 9 and highly reach the limits value occasion, the chip of the chip area 13 in 67 pairs of checks of control part is judged as defective (step S60), makes objective table 9 drop to the initial value height and position.Like this, can prevent to survey terminal 25 crosses to suppress to wafer 7 and be thereby the wafer 7 that causes and the damage of detection terminal 25.For being judged as underproof chip area 13, finish chip inspection (chip inspection end).
At step S57, when contact judging part 75 output logic values, 1 occasions ("Yes" of step S57), the driving of 67 pairs of driving mechanisms 19 of control part is controlled, and makes the objective table 9 predefined a certain amount of for example 40 μ m (step S61) that only rise.
It is to survey terminal 25 because of certain to contact with IC terminal 15 and be thereby when causing surveying terminal 25 and contacting with sensor terminal 71 that the output of contact judging part 75 becomes logical value 1, predefined a certain amount of by making constantly that from this objective table 9 only rises, can improve and all survey the correctness that terminal 25 contacts with IC terminal 15.And then, can prevent to survey terminal 25 and cross to suppress and cause IC terminal 15 breakages etc. to IC terminal 15.Like this, can realize that IC terminal 15 contacts with detection the stable of terminal 25.
It is predefined a certain amount of to make objective table 9 only rise, make and all to survey terminals 25 and after IC terminal 15 contacts, enter common check problem, the electrical inspection in the IC zone 13 in testing, judge be verified IC zone 13 corresponding be verified IC chip whether qualified (step S62).
Behind the electrical inspection that sets, make objective table 9 drop to the height and position of initial value,, finish chip inspection (chip inspection end) for the chip area 13 in the check.
After chip inspection finishes, judge whether whole chip areas 13 test endings (step S63) in the wafer 7.There are not checking chip zone 13 occasions ("No" of step S63), driving by 67 pairs of driving mechanisms 19 of control part is controlled, make objective table 9 keep the height and position of initial value to move horizontally, the IC terminal 15 of next chip area of testing 13 is configured in the position (step S64) corresponding with surveying terminal 25, to this chip area 13, beginning electrical inspection (chip inspection begins).At step S63, finish occasion ("Yes" of step S63) if be judged as whole chip area 13 electrical inspections, to the wafer 7 that is configured in objective table 9, finish electrical inspection (group finishes).
According to present embodiment, even the big occasion of IC terminal height tolerance on the wafer 7, detect IC terminal 15 and survey contacting of terminal 25, constantly make the objective table 9 predefined limited amount that only rises from this detection, each chip area 13 is implemented above-mentioned action, therefore, at whole chip areas 13, can realize that IC terminal 15 contacts with detection the stable of terminal 25.
In the above-described embodiments, by control part 21,49, infer the height and position be positioned at the IC terminal 15 of the immediate height and position of height and position of surveying terminal 25, this is positioned at and surveys the height that terminal 25 contacts with detection terminal 25 near the IC terminal 15 of height and position, begin height as IC terminal 15 and the contact detection of surveying terminal 25, before chip inspection, set, when electrical inspection is carried out in each zone 13, make objective table 9 rise to above-mentioned contact detection and begin height from initial value height and position high speed motion, after contact detection begins height, each 10 μ m ground rise objective table 9 with the low speed action, therefore, all objective table 9 rising occasions are compared, can be shortened Check-Out Time with the low speed action with whole interval.
Make the interval that objective table 9 rises with low speed action, not being defined as and being estimated as the above interval of height and position that contacts with detection terminal 25 with the IC terminal 15 of surveying terminal 25 immediate height and positions, also can be to comprise the interval that contacts with detection terminal 25 with the IC terminal 15 of surveying terminal 25 immediate height and positions at least.
At the illustrated embodiment of reference Fig. 1-Fig. 4 and with reference to Fig. 5-Fig. 8 among the illustrated embodiment, wafer 7 is made as earthing potential, but the present invention is not limited thereto, also the current potential of wafer 7 can be made as certain level.
In the illustrated embodiment of reference Fig. 9-Figure 12, objective table 9 is made as earthing potential, and wafer 7 is made as earthing potential, but in this embodiment, also can objective table 9 be made as earth level, makes it become indeterminate state.
Among the verifying attachment embodiment, the fixing terminal 25 of surveying only makes objective table 9 move in the above, but the present invention is not limited thereto, also fixing objective table 9 is surveyed terminal 25 and is moved and make, and perhaps also can be constructed such that to survey terminal 25 and objective table 9 both sides move.
In the above among the verifying attachment embodiment, constitute contact detection mechanism the amperometric determination voltage portion 31 that applies, apply voltage determination electric current portion 51, short-circuit detecting portion 73 and contact judging part 39,59,75 and be arranged in the verifier 5,45,65, but the present invention is not limited thereto, a part wherein can be included in the sniffer 3,43,63, perhaps also can be so that the contact detecting machine structure all is included in the sniffer 3,43,63.
In the above among the verifying attachment embodiment, be provided with ccd sensor 29 as surveying terminal position finding means, be used to measure the height and position on preceding detection terminal 25 tops of check beginning and the position of horizontal direction, but being not limited to CCD as surveying terminal position finding means, also can be to measure the height and position on preceding detection terminal 25 tops of check beginning and other means of horizontal direction position.
In the above among the verifying attachment embodiment, be provided with pressure sensor 27 and measure means as the IC terminal position, the height and position that is used for the preceding IC terminal of sampling and measuring check beginning, but being not limited to pressure sensor as IC terminal position mensuration means, also can be other means of the height and position of the IC terminal before the energy sampling and measuring check beginning.
Above with reference to description of drawings embodiments of the invention, but the present invention is not limited to the foregoing description.Can do all changes in the technology of the present invention thought range, they all belong to protection scope of the present invention.
Claims (24)
1. sniffer by control part control, makes drive mechanism, makes to it is characterized in that the IC terminal of some detection terminal contact semiconductor devices:
Be provided with and survey terminal position measuring device and IC terminal position determinator, above-mentioned detection terminal position measuring device is measured the height and position that detects the preceding above-mentioned detection terminal of beginning, and above-mentioned IC terminal position determinator mensuration detects the height and position of the above-mentioned IC terminal before the beginning;
Be provided with contact detection mechanism, measurement result according to above-mentioned detection terminal position measuring device and above-mentioned IC terminal position determinator, and the driving by above-mentioned driving mechanism, so that the above-mentioned IC terminal of above-mentioned detection termination contact, when above-mentioned detection terminal and above-mentioned IC terminal near the time, detect above-mentioned certain survey contacting of terminal and above-mentioned IC terminal;
The above-mentioned driving mechanism of above-mentioned control part controlling and driving detects above-mentioned detection terminal and above-mentioned IC termination contact constantly from above-mentioned contact detection mechanism, makes above-mentioned detection terminal and IC terminal move only mobile predefined limited amount towards mutual direction of closing.
2. sniffer according to claim 1 is characterized in that:
When driving by above-mentioned driving mechanism, above-mentioned detection terminal and IC terminal with first speed near the time, above-mentioned control part is according to the measurement result of above-mentioned detection terminal position measuring device and IC terminal position determinator, control above-mentioned driving mechanism, at least be positioned at and the above-mentioned IC terminal of the immediate height and position of height and position of above-mentioned detection terminal and the interval of above-mentioned detection termination contact, making above-mentioned detection terminal and IC terminal approaching with the second speed action that is lower than above-mentioned first speed;
Above-mentioned contact detection mechanism is at above-mentioned driving mechanism during with second speed action beginning, begins to detect contacting of above-mentioned detection terminal and above-mentioned IC terminal.
3. according to the sniffer described in claim 1 or 2, it is characterized in that, before reaching predefined limit amount, above-mentioned control part makes above-mentioned detection terminal and above-mentioned IC terminal approaching, do not detect above-mentioned detection terminal and above-mentioned IC termination contact occasion by above-mentioned contact detection mechanism, stop the approaching of above-mentioned detection terminal and above-mentioned IC terminal.
4. according to the sniffer described in claim 1 or 2, it is characterized in that above-mentioned contact detection mechanism comprises:
Wiring part is used to make semiconductor device to be changed to certain potentials;
Power supply unit is used for to sub-supplying electric current of above-mentioned end of probe or voltage;
Electrical measurement portion is used to measure the voltage or the electric current of above-mentioned detection terminal;
The contact judging part according to the output signal of above-mentioned electrical measurement portion, detects contacting of above-mentioned detection terminal and above-mentioned IC terminal.
5. according to the sniffer described in the claim 4, it is characterized in that above-mentioned wiring part comprises the objective table that disposes above-mentioned semiconductor device.
6. according to the sniffer described in the claim 4, it is characterized in that above-mentioned contact detection mechanism is provided with above-mentioned electrical measurement portion at each above-mentioned detection terminal.
7. according to the sniffer described in claim 1 or 2, it is characterized in that:
Above-mentioned contact detection mechanism is provided with near the sensor terminal that is configured in the above-mentioned detection terminal, and is used to detect the short-circuit detecting portion that above-mentioned detection terminal and the sensor terminal are electrically connected;
The sensor terminal arrangement is in such position: above-mentioned detection terminal not with above-mentioned IC termination contact state under, this sensor terminal and above-mentioned detection terminal have at interval, and because of above-mentioned detection terminal and above-mentioned IC termination contact are cause, this sensor terminal and above-mentioned detection termination contact.
8. according to the sniffer described in the claim 7, it is characterized in that above-mentioned contact detection mechanism is provided with the sensor terminal at each above-mentioned detection terminal.
9. the verifying attachment of a semiconductor device, be provided with sniffer and check portion, control by control part, make drive mechanism, above-mentioned sniffer makes the IC terminal of some detection terminal contact semiconductor devices, above-mentioned check portion is used for being undertaken by above-mentioned detection terminal and IC terminal the electrical inspection of semiconductor device, it is characterized in that
Be provided with and survey terminal position measuring device and IC terminal position determinator, above-mentioned detection terminal position measuring device is measured the height and position that detects the preceding above-mentioned detection terminal of beginning, and above-mentioned IC terminal position determinator mensuration detects the height and position of the above-mentioned IC terminal before the beginning;
Be provided with contact detection mechanism, measurement result according to above-mentioned detection terminal position measuring device and above-mentioned IC terminal position determinator, and the driving by above-mentioned driving mechanism, so that the above-mentioned IC terminal of above-mentioned detection termination contact, when above-mentioned detection terminal and above-mentioned IC terminal near the time, detect above-mentioned certain survey contacting of terminal and above-mentioned IC terminal;
The above-mentioned driving mechanism of above-mentioned control part controlling and driving detects above-mentioned detection terminal and above-mentioned IC termination contact constantly from above-mentioned contact detection mechanism, makes above-mentioned detection terminal and IC terminal move only mobile predefined limited amount towards mutual direction of closing.
10. verifying attachment according to claim 9 is characterized in that:
When driving by above-mentioned driving mechanism, above-mentioned detection terminal and IC terminal with first speed near the time, above-mentioned control part is according to the measurement result of above-mentioned detection terminal position measuring device and IC terminal position determinator, control above-mentioned driving mechanism, at least be positioned at and the above-mentioned IC terminal of the immediate height and position of height and position of above-mentioned detection terminal and the interval of above-mentioned detection termination contact, making above-mentioned detection terminal and IC terminal approaching with the second speed action that is lower than above-mentioned first speed;
Above-mentioned contact detection mechanism is at above-mentioned driving mechanism during with second speed action beginning, begins to detect contacting of above-mentioned detection terminal and above-mentioned IC terminal.
11. according to the verifying attachment described in claim 9 or 10, it is characterized in that, before reaching predefined limit amount, above-mentioned control part makes above-mentioned detection terminal and above-mentioned IC terminal approaching, do not detect above-mentioned detection terminal and above-mentioned IC termination contact occasion by above-mentioned contact detection mechanism, stop the approaching of above-mentioned detection terminal and above-mentioned IC terminal.
12. the verifying attachment according to described in claim 9 or 10 is characterized in that, above-mentioned contact detection mechanism comprises:
Wiring part is used to make semiconductor device to be changed to certain potentials;
Power supply unit is used for to sub-supplying electric current of above-mentioned end of probe or voltage;
Electrical measurement portion is used to measure the voltage or the electric current of above-mentioned detection terminal;
The contact judging part according to the output signal of above-mentioned electrical measurement portion, detects contacting of above-mentioned detection terminal and above-mentioned IC terminal.
13. the verifying attachment according to described in the claim 12 is characterized in that, above-mentioned wiring part comprises the objective table that disposes above-mentioned semiconductor device.
14. the verifying attachment according to described in the claim 12 is characterized in that, above-mentioned contact detection mechanism is provided with above-mentioned electrical measurement portion at each above-mentioned detection terminal.
15. the verifying attachment according to described in claim 9 or 10 is characterized in that:
Above-mentioned contact detection mechanism is provided with near the sensor terminal that is configured in the above-mentioned detection terminal, and is used to detect the short-circuit detecting portion that above-mentioned detection terminal and the sensor terminal are electrically connected;
The sensor terminal arrangement is in such position: above-mentioned detection terminal not with above-mentioned IC termination contact state under, this sensor terminal and above-mentioned detection terminal have at interval, and because of above-mentioned detection terminal and above-mentioned IC termination contact are cause, this sensor terminal and above-mentioned detection termination contact.
16. the verifying attachment according to described in the claim 15 is characterized in that, above-mentioned contact detection mechanism is provided with the sensor terminal at each above-mentioned detection terminal.
17. the method for inspection of a semiconductor device makes the IC terminal of some detection terminal contact semiconductor devices test, and it is characterized in that, comprises following operation:
Measure the height and position of the preceding above-mentioned detection terminal of check beginning;
The height and position of the above-mentioned IC terminal before the sampling and measuring check beginning;
Make above-mentioned detection terminal and IC terminal near so that during the above-mentioned IC terminal of above-mentioned detection termination contact, detect certain above-mentioned detection terminal and above-mentioned IC termination contact;
From detecting above-mentioned time of contact, make above-mentioned detection terminal and above-mentioned IC terminal move towards mutual direction of closing, only move predefined limited amount, make above-mentioned detection terminal and above-mentioned IC termination contact.
18. the method for inspection of semiconductor device according to claim 17 is characterized in that, further comprises following operation:
When above-mentioned detection terminal and IC terminal with first speed near the time, according to the height and position of the detection terminal of said determination and the height and position of IC terminal, at least be positioned at and the above-mentioned IC terminal of the immediate height and position of height and position of above-mentioned detection terminal and the interval of above-mentioned detection termination contact, making above-mentioned detection terminal and IC terminal approaching with the second speed action that is lower than first speed;
When above-mentioned second speed action beginning, begin to detect contacting of above-mentioned detection terminal and above-mentioned IC terminal.
19. the method for inspection according to the semiconductor device described in claim 17 or 18, it is characterized in that, before reaching predefined limit amount, make that above-mentioned detection terminal and above-mentioned IC terminal are approaching, do not detect above-mentioned detection terminal and above-mentioned IC termination contact occasion, stop the approaching of above-mentioned detection terminal and above-mentioned IC terminal.
20. the method for inspection according to the semiconductor device described in claim 17 or 18 is characterized in that:
Make semiconductor device be changed to certain potentials;
To sub-supplying electric current of above-mentioned end of probe or voltage;
Monitor that change in voltage in the above-mentioned detection terminal or electric current change, detect contacting of above-mentioned detection terminal and above-mentioned IC terminal.
21. the method for inspection according to the semiconductor device described in the claim 20 is characterized in that, by making that the objective table of configuring semiconductor device is a certain potentials, makes semiconductor device be changed to certain potentials.
22. the method for inspection according to the semiconductor device described in the claim 20 is characterized in that, each above-mentioned detection terminal is monitored that change in voltage or electric current in the above-mentioned detection terminal change.
23. the method for inspection according to the semiconductor device described in claim 17 or 18 is characterized in that:
Sensor terminal is configured in such position: above-mentioned detection terminal not with above-mentioned IC termination contact state under, this sensor terminal and above-mentioned detection terminal have at interval, and because of above-mentioned detection terminal and above-mentioned IC termination contact are cause, this sensor terminal and above-mentioned detection termination contact;
By detecting being electrically connected of above-mentioned detection terminal and the sensor terminal, detect contacting of above-mentioned detection terminal and above-mentioned IC terminal.
24. the method for inspection according to the semiconductor device described in the claim 23 is characterized in that, to above-mentioned each detection terminal arrangement the sensor terminal, above-mentioned each detection terminal is detected being electrically connected of above-mentioned detection terminal and the sensor terminal.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP070529/02 | 2002-03-14 | ||
| JP070529/2002 | 2002-03-14 | ||
| JP2002070529A JP3898074B2 (en) | 2002-03-14 | 2002-03-14 | Probing apparatus, semiconductor device inspection apparatus and inspection method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1445833A CN1445833A (en) | 2003-10-01 |
| CN1288737C true CN1288737C (en) | 2006-12-06 |
Family
ID=28035064
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 03120525 Expired - Fee Related CN1288737C (en) | 2002-03-14 | 2003-03-13 | Detection device, testing device of semiconductor device and testing method |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP3898074B2 (en) |
| CN (1) | CN1288737C (en) |
| TW (1) | TWI221199B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007088203A (en) | 2005-09-22 | 2007-04-05 | Tokyo Electron Ltd | Method and device for wafer inspection, and computer program |
| CN112540278A (en) * | 2019-09-05 | 2021-03-23 | 泰瑞达亚洲股份有限公司 | Apparatus and method for testing semiconductor device |
-
2002
- 2002-03-14 JP JP2002070529A patent/JP3898074B2/en not_active Expired - Fee Related
-
2003
- 2003-03-13 CN CN 03120525 patent/CN1288737C/en not_active Expired - Fee Related
- 2003-03-14 TW TW92105687A patent/TWI221199B/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| JP2003273175A (en) | 2003-09-26 |
| CN1445833A (en) | 2003-10-01 |
| TWI221199B (en) | 2004-09-21 |
| TW200305726A (en) | 2003-11-01 |
| JP3898074B2 (en) | 2007-03-28 |
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