CN1283884A - Modular IC socket - Google Patents
Modular IC socket Download PDFInfo
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- CN1283884A CN1283884A CN 99111324 CN99111324A CN1283884A CN 1283884 A CN1283884 A CN 1283884A CN 99111324 CN99111324 CN 99111324 CN 99111324 A CN99111324 A CN 99111324A CN 1283884 A CN1283884 A CN 1283884A
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Abstract
A modular IC socket for different ICs with different number of pins and different pin pitches is disclosed. The contact terminals are fixed in the slot on base. The straight ends are welded to circuit board. The contact pads and conductive lines are arranged on insertion plate. One contact pad is in contact with IC pin. Another contact pad is in contact with the contact terminal. An adapter is above the base and insertion plate. The top cover is coupled with the pressing member of adapter. The IC is pressed when pulled upward and is released when pushed downward. Its advantage is easy exchange.
Description
The present invention relates to the modularity integrated socket of the socket of integrated circuit (IC), particularly a kind of replaceable type.
The development of semi-conductor industry in recent years is quite quick, when live width from micron (μ m) grade progress to time micron, even when the deep-sub-micrometer, (Integrated Circuit, integrated level IC) is more and more big, and its life cycle is more and more short for integrated circuit.Add the diversity of product demand, the IC of various different application functions, size and pin position (pin assignment) constantly occurs especially.
In semiconductor fabrication, after IC completed, the many testing procedures of the experience of still needing can guarantee its function and quality.For example in pre-burning (burn in) test, may just comprise whether test I C external pins is intact, whether all pins inputs are all high impedance, IC energy consumption situation, its basic logic and voltage level ... etc. the testing procedure of aspect.And to carry out this type of test, its most basic hardware structure is socket (socket) or the connector (connector) of putting the IC element.
The connector of IC element all is the socket of specific pin position and purposes traditionally, for example socket of central processing unit (CPU), memory body (memory) etc.Because its pin position need cooperate the design on the circuit, therefore have the property of not replacing, and also all it directly is welded on the printed circuit board (PCB) (PCB) usually.In addition, with IC, its socket traditionally also all is designed to the mode of fixing for the above-mentioned test of carrying out pre-burning, and the IC product that aims at difference in functionality designs, utilize fixed clamp structure above the socket then, as fixing IC and have the function of conducting circuit concurrently.
Test for convenience, the IC socket that this class testing is used also is welded on the printed circuit board (PCB) usually.Yet, because lifetime of IC is very short, when a product is no longer produced, the printed circuit board (PCB) that IC socket of this test usefulness is connected with it may be all with abandon need not, and develop new IC socket more in addition.Moreover, because the test of this type of conventional version is to be fixed on the printed circuit board (PCB) with the IC socket,, then be not easy to be keeped in repair if the situation of indivedual damages is arranged, often the large assemblies of whole printed circuit board (PCB) is changed.As truly keeping in repair, then the socket tip-off of damaging must be pulled out, and then welding again.Keep in repair in this way, not only labor intensive and uneconomical.In addition, when the pin number of IC is more and more many, the pin column pitch is hour (being referred to as fine pitch IC) more and more, owing to be formed in one, under the situation that must take into account fine pin distance, the cost that is spent also and then improves with the IC socket in traditional test.
In sum, traditional IC socket is fixed and does not have displacement, therefore will keep in repair comparatively difficult; This socket can only be suitable for the IC of single kind of pin position simultaneously, and also improper for the IC of fine pin distance.If use this type of socket, the cost of equipment is too high, and does not meet economic benefit.Therefore, urgently need a kind of novel socket and solve these problems.
In above-mentioned background of invention, the socket (socket) of traditional integrated circuit (IC) test usefulness is that to aim at the IC of specific function designed, its pin position (pin assignment) is fixing can not conversion, and this socket is to be welded on the printed circuit board (PCB), and maintenance is difficult for.Therefore main purpose of the present invention provides a kind of integrated circuit socket, not only also maintenance of displacement easily, also applicable to the IC element of different types, different pin numbers and fine pin apart from IC, and cost is low.
The object of the present invention is achieved like this: a kind of modular integrated circuit socket, comprise pedestal, contact terminal, loam cake and spring, the elastomer of base unit is positioned at the first half of pedestal, contact terminal is fixed in the bearing groove of this pedestal, the rectilinear end of this contact terminal stretches out the Lower Half of this pedestal and is welded on the circuit board, the first half of outstanding this pedestal of another contact jaw of this contact terminal;
Insert plate and be positioned at this base unit top, which is provided with first contact mat, second contact mat and lead, this first contact mat is electrically conducted by this lead and this second contact mat, and the mutual conducting of pin of this first contact mat and integrated circuit component, this contact terminal of this second contact mat and this base unit contacts conducting, and this insertion plate is provided with the location hole that the fastening screw on this base unit with bottom is aimed at;
Adapter device is positioned at the top of this base unit and this insertion plate, comprising the adapter seat of the location correcting function that this integrated circuit component can be provided, and the pressure member that can compress or discharge this integrated circuit component;
Capping device is positioned at the top of this base unit, this insertion plate, this adapter device, comprising loam cake and spring, but this loam cake vertical up-or-down movement, and and this of this adapter device press member coupling, when this loam cake vertically upward the time, to drive this pressure member and compress this integrated circuit component, and, then drive this pressure member and discharge this integrated circuit component when this loam cake vertically downward the time.
This elastomer of wherein above-mentioned base unit has compressibility and elasticity.
This contact terminal of wherein above-mentioned base unit is provided with provides the U type of the suitable flexibility of this contact terminal cantilever beam.
Wherein above-mentioned insertion plate is the combination of soft board and stiffening plate.
This first contact mat of wherein above-mentioned insertion plate is a concave shape, and guides the insertion of this integrated circuit component pin.
This first contact mat of wherein above-mentioned insertion plate pin direct and this integrated circuit component contacts with each other conducting.
Wherein above-mentioned pressure member is rotated by the axle center and is urged to this integrated circuit component, and direct and this first contact mat contacts with each other conducting.
This first contact mat of wherein above-mentioned insertion plate is pressed the indirect conducting of pin of member and this integrated circuit component by this.
Wherein above-mentioned pressure member is provided with second contact terminal that can increase the U of flexibility type cantilever beam, simultaneously the ledge that this second contact terminal is provided with and the pin of this integrated circuit component contacts with each other.
First, second contact mat of this of wherein above-mentioned insertion plate covers the anti-oxidation conductive layer of one deck.
Wherein above-mentioned adapter device is provided with trip, and this trip and this base unit make up mutually.
Wherein above-mentioned capping device is provided with the spring that the upper and lower elastic force that moves both vertically of this loam cake can be provided.
A kind of modular integrated socket, this socket comprises pedestal, contact terminal, loam cake and spring, base unit comprising the pedestal and first contact terminal are arranged, is fixed in the bearing groove of this pedestal as this first contact terminal of the electrical connection device of the circuit board of bottom and upper component;
Insert plate and be positioned at this base unit top, be provided with first contact mat, second contact mat and lead above, this first contact mat electrically conducts through this lead and this second contact mat, and this first contact terminal of this second contact mat and this base unit contacts conducting;
Adapter device, be positioned at the top of this base unit and this insertion plate, comprising the adapter seat and second contact terminal are arranged, this adapter seat can provide the location correcting function of integrated circuit component, and this first contact mat of an end of this second contact terminal and this insertion plate contacts conducting, the pin of the other end and this integrated circuit component contacts conducting, and this second contact terminal can utilize an end that contacts with the pin of this integrated circuit component to compress or discharges this integrated circuit component;
Capping device is positioned at the top of this adapter device, and and this second contact terminal of this adapter device be coupled mutually, this capping device can upper and lowerly move both vertically and compress or discharge this integrated circuit component to drive this second contact terminal.
This first contact terminal of wherein above-mentioned base unit is provided with the U type cantilever beam of the flexibility that this contact terminal is provided.
The location hole that wherein above-mentioned insertion plate is provided with and this base unit fastening screw is aimed at.
First, second contact mat of this of wherein above-mentioned insertion plate covers the anti-oxidation conductive layer of one deck.
This second contact terminal of wherein above-mentioned adapter device is provided with can increase the U of flexibility type cantilever beam.
The linking part that the second wherein above-mentioned contact terminal is provided with and this capping device is coupled mutually moves this by the upper and lower motion of this capping device and is connected part, makes this second contact terminal can compress or discharge this integrated circuit component.
Wherein above-mentioned adapter device is provided with the trip of working in coordination with base unit.
The present invention needs only the removable parts module and is applicable various IC pattern owing to utilize design of modularization to constitute test IC socket, and is cost-saved; Owing to utilize modular IC socket, only need the removable parts module to get final product when making maintenance, therefore convenient saving trouble; Owing to utilize modular IC socket, make it be more suitable for fine pin apart from (fine pitch) IC, to meet semi-conductive trend.
According to above-described purpose, the invention provides a kind of replaceable type modularity integrated circuit socket.In the first embodiment of the present invention, this socket mainly comprises:
(1) base unit (base unit).In this base unit, even comprise pedestal (base), contact terminal (contact pin) and elastomer (elastomer) etc.Has bearing groove on the pedestal, in order to place contact terminal and elastomer, one end of contact terminal is a linear, the other end is the U type cantilever beam (cantilever) for having flexibility then, and linear one end that is embedded in the contact terminal in the pedestal passes the pedestal Lower Half, so that be welded on the printed circuit board (PCB), an end of cantilever beam protrudes in the pedestal first half slightly, as the usefulness of contact.Elastomer then has compressibility and elasticity, can provide when actual contact and contact effect closely;
(2) insert plate (interposer).This inserts plate is the interface of IC element and base unit, has contact mat and lead on its contact-making surface, so that the pin of IC can be electrically connected by the contact terminal in contact mat and lead and the pedestal, wherein has location hole so that accurately contact with base unit simultaneously;
(3) adapter device (adapter unit).This device is positioned at pedestal and inserts on the plate, and includes adapter seat (adapter base), pressure member (depressor) and axle center (shaft) etc.Adapter device can provide the function of IC element location, makes the IC correcting in the test section, and can the axle center rotates and press member compressing IC element or with its release.Simultaneously, around adapter device, have trip and beneath insertion plate and base unit fixed, and allow and insert contact terminal combination closely in plate and the base unit;
(4) capping device (cover unit).The top that this device is positioned at pedestal, inserts plate and adapter device more includes elements such as loam cake and spring simultaneously.Capping device can vertical upper and lower motion, when loam cake when pressing down, will drive and the pressure member of the adapter device of its coupling, make IC be in state freely, when its vertically upward the time, then IC can be compressed, allow IC and beneath member keep the excellent contact state.
The modularity IC socket of the invention described above first embodiment is specially adapted to the IC element of the encapsulation of array for example kenel etc.And by also finding out in the above-mentioned explanation, when if the pattern of IC element changes, for example has only the pin difference, as long as then may insert circuit redesigns such as contact point above the plate and lead can use once again, the renewal of perhaps adding converter apparatus and capping device gets final product, and the base unit of the bottom then need not carry out any change.And this IC socket is when damaging, also as long as the module that damages of new portion more more can be saved manpower and cost.
In the second embodiment of the present invention, modular IC socket then comprises:
(1) base unit.This device comprised with first embodiment in identical pedestal and contact terminal etc., it also utilizes the contact terminal that is fixed in the pedestal, and the one end can be welded on the printed circuit board (PCB), the other end then can cooperate with upper component and form excellent electrical property and contact;
(2) insert plate.This inserts plate is the contact terminal of adapter device and the interface of base unit, on contact-making surface and have contact mat and be connected so that telecommunication to be provided with lead;
(3) adapter device.This device is positioned at pedestal and inserts on the plate, and includes adapter seat and contact terminal.Contact terminal is embedded among the adapter seat, and an end can contact with each other with the contact mat on the insertion plate of bottom, and the other end then is a rubber-like U type cantilever beam, and it has the jag that contacts with the IC element;
(4) capping device.The top that this device is positioned at pedestal, inserts plate and adapter device also includes elements such as loam cake and spring simultaneously.And can vertical upper and lower motion compressing the IC element or it discharged, and, make contact terminal be in the state of replying or stretching through upper and lower moving wherein by ramp structure in the loam cake and the coupling of the contact terminal in the adapter device.
The modularity IC socket of this second embodiment is comparatively suitable with wire-frame type encapsulation kenel IC, and the IC socket of this embodiment also only needs the module of removable parts to test again when changing different IC patterns simultaneously.In addition, for the IC of trickle pin distance, these two embodiment are owing to not only be fit to the IC element of single pin position, when the pin position changes, still can under the module of changing minority, for example change the contact mat pin position design of inserting plate, can reach the test of the IC of fine pin distance.
Preferred embodiment of the present invention will be aided with following figure and do more detailed elaboration in comment backward, wherein:
Fig. 1 is the decomposition diagram according to modularity integrated socket of the present invention;
Fig. 2 is the front view according to the modularity integrated circuit socket of first specific embodiment of the present invention;
Fig. 3 is the B-B cutaway view of Fig. 2;
Fig. 4 is the C-C cutaway view of Fig. 2;
Fig. 5 is the A-A partial sectional view of Fig. 2;
Fig. 6 is the base unit partial cross section enlarged diagram according to first specific embodiment of the present invention;
Fig. 7 is (interposer) front view according to the insertion plate of first specific embodiment of the present invention;
Fig. 8 is during according to the array of first specific embodiment of the present invention encapsulation IC test and the cross-sectional schematic that contacts of insertion plate;
Fig. 9 is during according to the array of first specific embodiment of the present invention encapsulation IC test and inserts the part amplification cross-sectional schematic that plate contacts;
Figure 10 is the front view according to the modularity integrated circuit socket of second specific embodiment of the present invention;
Figure 11 is the B-B cutaway view of Figure 10;
Figure 12 is the A-A cutaway view of Figure 10;
Figure 13 is the contact terminal cross section enlarged diagram according to second specific embodiment of the present invention;
Figure 14 is the insertion plate front view according to second specific embodiment of the present invention.
The present invention is disclosed to be a kind of integrated circuit (IC) test jack (socket) of modularity replaceable type.Based on the difficult displacement of traditionally IC test jack and expensive, IC socket of the present invention is not only replaced easily and is keeped in repair, also applicable to the IC element of different types, different pin numbers and fine pin apart from (finepitch) IC.In today of semi-conductor industry fast development, IC test jack of the present invention can effectively reduce occurrences in human life and equipment cost.For describing the present invention in detail, below will be illustrated respectively with two specific embodiments.And for the purpose of must be noted that for convenience of description, components identical will be indicated with identical number in this two embodiment.
First embodiment
Consult Fig. 1, the shown decomposition diagram that is modularity IC socket of the present invention among the figure.IC socket module in this figure is respectively the base unit (base unit) 100 that is positioned at the bottom, has terminal in this base unit 100 and can be connected on the printed circuit board (PCB) large assemblies such as (not showing in the drawings); Insert plate (interposer) 200, have contact mat (pad) and lead above, to use as electrically connecting; Adapter device (adapter unit) 300 has trip above, entire module IC socket tightly can be fastened; Capping device (cover unit) 400 can be used as the device that IC picks and places.
Consult Fig. 2,3,4,5, shown the view after the modularity IC receptacle combinations of the first embodiment of the present invention among the figure.The cross section of Fig. 2 is from be presented at Fig. 5, and section B-B, C-C then are presented among Fig. 3,4.For the purpose of understanding easily, be illustrated with four main devices:
(1) base unit 100.Consult Fig. 5, this base unit 100 is made up of pedestal (base) 110, contact terminal (contact pin) 150,160 and elastomer (elastomer) 190, has bearing groove in the pedestal 110 to place contact terminal 150,160 and elastomer 190.Elastomer 190 then is installed in the first half of pedestal 110, and has compressibility or elasticity.When the assembling of entire module socket was finished, because the elastic reaction of this elastomer 190, test I C element can engage closely with inserting plate 200 and this base unit 100, so that the excellent electrical property contact is provided.
Contact terminal 150,160 then lays respectively at the both sides and the left-right symmetric of base unit 100.Simultaneously by among Fig. 5 as can be seen, in order to increase the convenience on pin count and the circuit design, contact terminal 150 and 160 slightly different in the position of the straight line pin that passes pedestal 110, like this then can form the pin position that is staggered front to back.
Consult Fig. 6, then shown the amplification sectional view of the base unit 100 among Fig. 5 among this figure.Wherein insert plate 200 and nestle up pedestal 110, between also is equipped with elastomer 190.Contact terminal 150 its effects of being fixed in the pedestal 110 are that the insertion plate 200 on upper strata and the printed circuit board (PCB) of bottom (not showing in the drawings) are electrically connected.As shown in FIG., welding ends 152 can penetrate printed circuit board (PCB) and weld thereon, and contact terminal 150 is fixed in the pedestal 110.
The standing part 154 of contact terminal 150 is mounted on the groove seat of pedestal 110, and mid portion has more cantilever beam (cantilever) 156 and the contact portion 158 of U type, because the special tectonic of this cantilever beam 156, make terminal have flexibility, when the insertion plate 200 on upper strata and base unit 100 fit together, contact portion 158 will with insert plate 200 and contact with each other, and keep because of the elasticity of U type cantilever beam 156 and insert excellent electrical property connection between the plate 200.
(2) insert plate 200.See also Fig. 7, this figure is the front view that inserts plate 200.Insert plate 200 and form, and processed location hole 240 at the two ends of inserting plate 200 by ball seat 210, lead 220, pad 230, soft board 260 and stiffening plate 250, so as during assembling can with the fastening screw cooperation on the base unit 100.During actual the operation, the ball seat 210 that is positioned at mid portion can contact with the tin ball on the IC element pin, and holding wire is transferred to pad 230 by lead 220 then, is passed on the circuit of printed circuit board (PCB) through the contact terminal that is in contact with it again.
Consult Fig. 8,9, this two figure is the cutaway view that inserts plate 200.Among Fig. 8, inserting plate 200 mainly is to be made of soft board 260, soft board 260 has advantages such as lower dielectric constant, high glass transition temperature (Tg) and favorable mechanical characteristic, extremely be fit to be applied in the test of high temperature and high frequency aspect, but, so need in addition fixed support of stiffening plate 250 because it be soft board.Stiffening plate 250 is made for exotic material.
Return Fig. 8, the ball seat 210 that is arranged in soft board 260 is connected to pad 230 through lead 220, and this pad 230 promptly and the contact portion 158 of the contact terminal 150 of Fig. 6 contact with each other and form conducting state.This pad 230 is made for copper material, produces oxidation and the anti-oxidation conductive layer of contact portion coating one deck that it can be exposed when avoiding actual test.
(3) adapter device 300.Get back to Fig. 2,3,4,5, insert as can be seen in the drawings between plate 200 and the capping device 400 and be adapter device 300.This device comprises adapter seat (adapterbase) 330 (being indicated among Fig. 4), presses member (depressor) 310 and axle center (shaft) 320 elements such as (being indicated among Fig. 3).Wherein adapter seat 330 is the location correcting functions that are used to provide IC element 500, when IC element 500 is placed, can make it be easy to drop in the test section, so that contact with insertion plate 200.
Pressure member 310 among Fig. 3 can be that pivot point rotates by axle center 320 supports and with it, one end and capping device 400 couplings, and IC element 500 can be pushed down or discharge to the other end then by the action of capping device 400.Among this figure, capping device 400 is to lay respectively at two upper and lower different positions, when capping device 400 when pressing down and the pressure member 310 of its coupling will and then remove IC element 500, make it be in state freely; When capping device 400 up the time, then will drive and press member 310 down tightly to push down IC element 500.
(4) capping device 400.This device has comprised elements such as loam cake and spring at least.As described above, capping device 400 can carry out vertical upper and lower motion, and the pressure member 310 that drives coupling compresses or discharges IC element 500.Other consults Fig. 4, has also shown capping device among this figure in two upper and lower different positions, the spring 410 that is arranged in capping device 400 required elastic force during then as the loam cake vertical moving, and can be in four corners of capping device 400 mounting spring 410 all.Simultaneously by coming as can be seen among Fig. 2; because IC element 500 is the holes that are seated in capping device 400 centres; then this mechanism when operation because of discharging IC to pressing down; the action of upwards drawing and compressing IC makes that also the storing of IC element 500 is more or less freely, also has preferable protection effect simultaneously when test.
The modularity IC socket of the first embodiment of the present invention will be specially adapted to for example IC element of array encapsulation kenel.And by also coming as can be seen in the above-mentioned explanation, big or small identical when IC element 500, but the pin position is not simultaneously, and ball seat, lead and the contact pins redesign of inserting on the plate 200 can be suitable for once again; Even the big or small pattern of IC element is not simultaneously, also can will can use once again after adapter device 300 and capping device 400 displacements, 100 of base units that originally are welded on the printed circuit board (PCB) can remain unchanged.And on large assemblies such as printed circuit board (PCB),, also needn't change with making a great fuss or keep in repair if when having only single IC socket to damage, need only will damage the module replacing.
Second embodiment
Consult Figure 10,11,12, then shown among this figure according to the view after the modularity IC socket assembling of the second embodiment of the present invention.And the section A-A among Figure 10 is presented among Figure 12, and section B-B then is presented among Figure 11.
(1) base unit 100.Consult Figure 12, also include pedestal 110 and contact terminal 150,160 etc. in this base unit 100.The 26S Proteasome Structure and Function of the base unit among base unit 100 in this embodiment and above-mentioned first embodiment almost is identical, but has lacked elastomeric device.Contact terminal 150,160 is as the usefulness of the electric connection of the printed circuit board (PCB) (not showing) that inserts plate 200 and bottom.
Consult Figure 13, what show among this figure is the part zoomed-in view among Figure 12.The standing part 154 of the contact terminal 150 in the base unit 100 is installed on the groove seat of pedestal 110, wherein has more U type cantilever beam 156 and contact portion 158, to keep base unit 100 and to insert excellent contact between the plate 200.
(2) insert plate 200.Consult Figure 14, shown the vertical view and the end view that insert plate 200 among this figure.Wherein insert plate 200 and form, and have location hole 240 at the two ends of inserting plate 200 by hardboard 250, pad 230A, 230B and lead 220.Insert the signaling conversion circuit plate that plate 200 can be used as the base unit 100 of the adapter device 300 on upper strata and lower floor, and the contact terminal 340 in the adapter device 300 promptly contacts (will be explained below) with pad 230A, pass the signal to the pad 230B of lower floor via lead 220, and then contact with contact terminal 150 in the base unit 100 and reach the purpose of telecommunication conducting.In addition, insert plate 200 and can make by exotic material, and can pass location hole 240 by the latch in the base unit 100 and with base unit 100, insert plate 200 and adapter device 300 is correctly located.Pad 230A, 230B are that copper material is made, and influence the conduction of telecommunication to prevent oxidation at the anti-oxidation conductive layer of its exposed parts lining one deck.
(3) adapter device 300.Get back to Figure 13, adapter device 300 is at capping device 400 and insert between the plate 200, and has more comprised adapter seat 330 and contact terminal 340.Adapter seat 330 is used to provide the placement positioning function of IC, and contact terminal 340 then is installed in the adapter seat 330, is contacted with IC element pin by an end, and the other end then contacts with insertion plate 200, and the function of electric connection is provided.
(4) capping device 400.This device has comprised elements such as loam cake and spring, relies on the elastic force of spring can make capping device 400 vertical upper and lower motions.And it is aforesaid, the linking part 380 that this capping device 400 has more inclined-plane 420 and contact terminal 340 contacts: when this capping device 400 of operation makes progress, contact terminal 340 will be returned to normal position because of the effect of U type cantilever beam 370, and the IC element is compressed; When capping device 400 downwards the time, inclined-plane 420 will oppress and will be connected part 380, impel contact terminal 340 past next doors to draw back, thereby make the IC element be in state freely.
The modularity IC socket of present embodiment is specially adapted to the IC element of wire-frame type encapsulation kenel, and by the easy displacement that also can find out this modularity IC socket in the present embodiment, even the pin position of test I C or size difference, the assembly of removable parts socket are promptly applicable to different situations.
Though the life cycle of IC element is very short at present, but because the substitutability of modularity IC socket of the present invention, thereby can change unaccommodated assembly along with the development of IC, even if it is completely newly also applicable to the IC kenel, do not need to eliminate and change whole printed circuit-board assembly, so can effectively reduce cost.
Claims (19)
1. a modular integrated circuit socket comprises pedestal, contact terminal, loam cake and spring, it is characterized in that:
The elastomer of base unit is positioned at the first half of pedestal, and contact terminal is fixed in the bearing groove of this pedestal, and the rectilinear end of this contact terminal stretches out the Lower Half of this pedestal and is welded on the circuit board, the first half of outstanding this pedestal of another contact jaw of this contact terminal;
Insert plate and be positioned at this base unit top, which is provided with first contact mat, second contact mat and lead, this first contact mat is electrically conducted by this lead and this second contact mat, and the mutual conducting of pin of this first contact mat and integrated circuit component, this contact terminal of this second contact mat and this base unit contacts conducting, and this insertion plate is provided with the location hole that the fastening screw on this base unit with bottom is aimed at;
Adapter device is positioned at the top of this base unit and this insertion plate, comprising the adapter seat of the location correcting function that this integrated circuit component can be provided, and the pressure member that can compress or discharge this integrated circuit component;
Capping device is positioned at the top of this base unit, this insertion plate, this adapter device, comprising loam cake and spring, but this loam cake vertical up-or-down movement, and and this of this adapter device press member coupling, when this loam cake vertically upward the time, to drive this pressure member and compress this integrated circuit component, and, then drive this pressure member and discharge this integrated circuit component when this loam cake vertically downward the time.
2. modular integrated circuit socket as claimed in claim 1 is characterized in that: this elastomer of wherein above-mentioned base unit has compressibility and elasticity.
3. modular integrated circuit socket as claimed in claim 1 is characterized in that: this contact terminal of wherein above-mentioned base unit is provided with provides the U type of the suitable flexibility of this contact terminal cantilever beam.
4. modular integrated circuit socket as claimed in claim 1 is characterized in that: wherein above-mentioned insertion plate is the combination of soft board and stiffening plate.
5. modular integrated circuit socket as claimed in claim 1 is characterized in that: this first contact mat of wherein above-mentioned insertion plate is a concave shape, and guides the insertion of this integrated circuit component pin.
6. modular integrated circuit socket as claimed in claim 1 is characterized in that: this first contact mat of wherein above-mentioned insertion plate pin direct and this integrated circuit component contacts with each other conducting.
7. modular integrated circuit socket as claimed in claim 6 is characterized in that: wherein above-mentioned pressure member is rotated by the axle center and is urged to this integrated circuit component, and direct and this first contact mat contacts with each other conducting.
8. modular integrated circuit socket as claimed in claim 1 is characterized in that: this first contact mat of wherein above-mentioned insertion plate is by the indirect conducting of pin of this pressure member and this integrated circuit component.
9. modular integrated circuit socket as claimed in claim 8, it is characterized in that: wherein above-mentioned pressure member is provided with second contact terminal that can increase the U of flexibility type cantilever beam, simultaneously the ledge that this second contact terminal is provided with and the pin of this integrated circuit component contacts with each other.
10. modular integrated circuit socket as claimed in claim 1 is characterized in that: first, second contact mat of this of wherein above-mentioned insertion plate covers the anti-oxidation conductive layer of one deck.
11. modular integrated circuit socket as claimed in claim 1 is characterized in that: wherein above-mentioned adapter device is provided with trip, this trip and this base unit make up mutually.
12. modular integrated circuit socket as claimed in claim 1 is characterized in that: wherein above-mentioned capping device is provided with the spring that the upper and lower elastic force that moves both vertically of this loam cake can be provided.
13. a modular integrated socket, this socket comprises pedestal, contact terminal, loam cake and spring, it is characterized in that:
Base unit comprising the pedestal and first contact terminal are arranged, is fixed in the bearing groove of this pedestal as this first contact terminal of the electrical connection device of the circuit board of bottom and upper component;
Insert plate and be positioned at this base unit top, be provided with first contact mat, second contact mat and lead above, this first contact mat electrically conducts through this lead and this second contact mat, and this first contact terminal of this second contact mat and this base unit contacts conducting;
Adapter device, be positioned at the top of this base unit and this insertion plate, comprising the adapter seat and second contact terminal are arranged, this adapter seat can provide the location correcting function of integrated circuit component, and this first contact mat of an end of this second contact terminal and this insertion plate contacts conducting, the pin of the other end and this integrated circuit component contacts conducting, and this second contact terminal can utilize an end that contacts with the pin of this integrated circuit component to compress or discharges this integrated circuit component;
Capping device is positioned at the top of this adapter device, and and this second contact terminal of this adapter device be coupled mutually, this capping device can upper and lowerly move both vertically and compress or discharge this integrated circuit component to drive this second contact terminal.
14. modular integrated circuit socket as claimed in claim 13 is characterized in that: this first contact terminal of wherein above-mentioned base unit is provided with the U type cantilever beam of the flexibility that this contact terminal is provided.
15. modular integrated circuit socket as claimed in claim 13 is characterized in that: the location hole that wherein above-mentioned insertion plate is provided with and this base unit fastening screw is aimed at.
16. modular integrated circuit socket as claimed in claim 13 is characterized in that: first, second contact mat of this of wherein above-mentioned insertion plate covers the anti-oxidation conductive layer of one deck.
17. modular integrated circuit socket as claimed in claim 13 is characterized in that: this second contact terminal of wherein above-mentioned adapter device is provided with can increase the U of flexibility type cantilever beam.
18. modular integrated circuit socket as claimed in claim 13, it is characterized in that: the linking part that the second wherein above-mentioned contact terminal is provided with and this capping device is coupled mutually, move this by the upper and lower motion of this capping device and be connected part, make this second contact terminal can compress or discharge this integrated circuit component.
19. modular integrated circuit socket as claimed in claim 13 is characterized in that: wherein above-mentioned adapter device is provided with the trip of working in coordination with base unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 99111324 CN1118889C (en) | 1999-08-06 | 1999-08-06 | Modular IC socket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 99111324 CN1118889C (en) | 1999-08-06 | 1999-08-06 | Modular IC socket |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1283884A true CN1283884A (en) | 2001-02-14 |
| CN1118889C CN1118889C (en) | 2003-08-20 |
Family
ID=5275022
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 99111324 Expired - Fee Related CN1118889C (en) | 1999-08-06 | 1999-08-06 | Modular IC socket |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1118889C (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102325435A (en) * | 2011-09-14 | 2012-01-18 | 姜国清 | Electric bicycle, controller and functional wire end cover thereof |
| CN102544913A (en) * | 2010-11-19 | 2012-07-04 | 森萨塔科技麻省公司 | Socket |
| CN105322376A (en) * | 2014-07-28 | 2016-02-10 | 金瑞通科技股份有限公司 | Electronic device replacement structure |
-
1999
- 1999-08-06 CN CN 99111324 patent/CN1118889C/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102544913A (en) * | 2010-11-19 | 2012-07-04 | 森萨塔科技麻省公司 | Socket |
| CN102544913B (en) * | 2010-11-19 | 2015-11-25 | 森萨塔科技麻省公司 | Socket |
| CN102325435A (en) * | 2011-09-14 | 2012-01-18 | 姜国清 | Electric bicycle, controller and functional wire end cover thereof |
| CN105322376A (en) * | 2014-07-28 | 2016-02-10 | 金瑞通科技股份有限公司 | Electronic device replacement structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1118889C (en) | 2003-08-20 |
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| C14 | Grant of patent or utility model | ||
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| CF01 | Termination of patent right due to non-payment of annual fee |