CN1273647C - Reinforced electroplating process with masked cathode - Google Patents
Reinforced electroplating process with masked cathode Download PDFInfo
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- CN1273647C CN1273647C CN 03136301 CN03136301A CN1273647C CN 1273647 C CN1273647 C CN 1273647C CN 03136301 CN03136301 CN 03136301 CN 03136301 A CN03136301 A CN 03136301A CN 1273647 C CN1273647 C CN 1273647C
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Abstract
The present invention relates to a reinforced electroplating technique of masking a cathode. A masked unit is additionally arranged at the circumference part of a plating piece, and the shape and the structure of the masked unit are closely fit with those of the circumference part of the surface of the plating piece; the masked unit has the structure of permeation prevention, so the distance between electroplating solution ions attached to the circumference part of the plating piece is lengthened, and the concentration of the electroplating solution irons plated at the circumference part of the plating piece can be controlled in order to reduce the thickness of a plating film at the circumference part of the plating piece; therefore, a uniform plating film surface is formed on the surface of the plating piece, and the electroplating thickness of the surface in the middle of the plating piece can be increased. Meanwhile, the electroplating thickness of the circumference part is controlled so that the functions of strengthening and assembling conveniently are realized.
Description
Technical field
The present invention relates to the reinforcement electroplating technology that a kind of negative electrode covers, relate in particular to a kind of shielding cell that on plating piece, adds, so that the surface coating of plating piece is more even, and increase plating piece intermediate surface electroplating thickness, control the reinforcement electroplating technology that the negative electrode of plating piece circumference electroplating thickness covers simultaneously.
Background technology
At present, on industrial application, generally can be in metal or outer other chemical substance of last layer of electroplating of plastic material, to promote characteristic or size attractive in appearance or the change body surface, increase antirust, the anti-abrasion of article, the conductance that improves material, intensity, oilness, thermotolerance, weathering resistance etc., to increase the Application Areas of virgin metal or plastic material.
In carrying out electroplating process, the electroplating thickness on plating piece surface is relevant with factors such as galvanized strength of current, electroplating time, negative and positive interpolar distances.When strength of current is strong more, electroplating time is long more, and negative and positive interpolar distance is short more, and then the electroplating thickness on plating piece surface also increases thereupon; Otherwise then electroplating thickness reduces thereupon.
But metal or plastic material are being carried out in the galvanized process, and the charge distribution on plating piece surface can make the electric current that puts on the plating piece different, thereby it is inhomogeneous to be plated on the quality on plating piece surface.Promptly in galvanized process, the distribution because of the strength of electric field that distribution caused of the circumference quantity of electric charge of plating piece makes the strength of electric field of circumference big than the intermediate surface of plating piece, and the strength of current that puts on circumference in other words is bigger.Therefore, when energising is electroplated, often cause the coating film thickness that circumference produced of plating piece thick, make the stress structure of intermediate surface comparatively fragile than intermediate surface, and the thicker trouble that also causes in the plating piece assembling of circumference thickness.Generally, for improving intermediate surface intensity, the electroplating time that extends usually is increasing the thickness of plating piece intermediate surface, but meanwhile, the peripheral part also thickens simultaneously, causes the increasing of plating piece periphery and intermediate surface thickness disparity and the increase of plating piece overall weight more; Or take to elongate the way of plating piece and anodic distance so that the electroplating thickness of circumference reduces, but this moment the plating piece intermediate surface the thickness attenuation, make plating piece comparatively fragile, be subjected to more limitation in the use.
As shown in Figure 1, be the synoptic diagram of the surface coating of known plating piece 11; This plating piece 11 is placed in the placement hole 121 of cathode carrier 12, via the electrode holder 111 that passes fixed part 122 plating piece 11 is fixed on the cathode carrier 12, this plating piece 11 is connected with electric wire 123 on the cathode carrier 12 via electrode holder 111, cathode carrier 12 is contacted with plating piece 11, thereby make it in the electroplate liquid 131 of plating tank 13, carry out galvanizing process; After plating is carried out, the circumference on plating piece 11 surfaces often, its electroplating thickness can be thick by the plated portions site surface than other.
In addition, on industrial application, the general suitable additive of all can adding is to modify the configuration of surface of coating, as smooth agent or gloss-imparting agent, with improve smooth or glossy regional, or be covered in concavo-convex surface, the current density of male and fomale(M﹠F) is reduced, and then reduce this position analyse plating speed, thereby reduce the thickness on surface; But this processing mode needs do each plating piece in advance to apply operation, empty hyperplasia stages of labor preface numerous and diverse, and lower throughput rate.
And, the present aluminum magnesium alloy material of using on the industry, because of the characteristic with light weight is widely used, but the reinforcement electroplating technology that covers with negative electrode of the present invention through galvanized plastics comparison, have following advantage through galvanized plastics:
1. with regard to mould, the longer service life of mould of plastics, about 100,000 moulds of aluminum magnesium alloy more than plastics 400,000 moulds, have been saved the expense expenditure of mould, can effectively reduce production costs;
2. the ohmic value through galvanized plastics levels off to zero, to eliminating electromagnetic interference (E.M.I.) great help is arranged;
3. the aluminum magnesium alloy of identical shaped size of weight ratio and thickness is lighter;
4. in nickel plating thickness 35 μ, its intensity almost approaches aluminum magnesium alloy;
5. the selectivity height of plastic material, ABS (acrylonitrile-butadiene-styrene), PC (polycarbonate)+ABS (acrylonitrile-butadiene-styrene), PC (polycarbonate)+glass fibre or PC (polycarbonate)+carbon fibre etc., all can choose at random, required light and thin the most suitable to the mobile computer shell, and make the research and development designer in appearance design, can bring into play broader space, needn't be limited everywhere.
Therefore, because every shortcoming of above-mentioned already known processes and material, the artificial enhancement of this case invention this case is more reached perfection, then exhaust its intelligence, to be engaged in the sector experience for many years, concentrate on studies and innovated improvement, successfully this part " the reinforcement electroplating technology that negative electrode covers " case is finished in research and development finally, is the invention that a tool effect is promoted in fact.
Summary of the invention
Main purpose of the present invention ties up to provides a kind of electroplate technology that can effectively reduce negative electrode plating piece peripheral part electroplating thickness;
Another object of the present invention ties up to provides a kind of electroplating thickness that can effectively increase the electroplating thickness of plating piece intermediate surface and control the plating piece circumference simultaneously.
Above-mentioned purpose of the present invention is achieved in that the reinforcement electroplating technology that a kind of negative electrode covers, and its step that comprises has:
Plating piece is carried out the electroless plating program, make plating piece surface attachment layer of metal film;
Install the shielding cell program, this shielding cell shape and structure of impermeable structure and the circumference shape on plating piece surface are coincide mutually, settle plating piece on cathode carrier behind the installing shielding cell, and this cathode carrier is provided with cathode block, to be connected to plating piece;
Carry out galvanizing process, this shielding cell of impermeable structure, make the electroplate liquid ion can't directly be attached to the plating piece circumference, and enter by the space between shielding cell and plating piece, the plating distance of plating piece circumference that promptly adds shielding cell so that the concentration of electroplate liquid ion plating on the circumference of plating piece reduces, is plated on the thickness attenuation of circumference than the middle table face length, and the electroplating time that can extend increases the coating film thickness of plating piece intermediate surface, thereby reaches the effect of ease of assembly and reinforcement.
Wherein can be provided with placement hole on the cathode carrier, to place plating piece.
Wherein on the placement hole snapping portion can be housed.
Wherein shielding cell can be transparent material.
Characteristic on above-mentioned purpose of the present invention and structure thereof and the function will be illustrated according to preferred embodiment shown in the drawings.
Description of drawings
Fig. 1 is the synoptic diagram of the surface coating of known plating piece;
Fig. 2 is the three-dimensional exploded view of shielding cell of the present invention and plating piece;
Fig. 3 is the three-dimensional exploded view of cathode carrier of the present invention, shielding cell and plating piece;
Fig. 4 is a three-dimensional combination figure of the present invention;
Fig. 5 is a process flow sheet of the present invention;
Fig. 6 is an electroplate liquid ion flow synoptic diagram of the present invention;
Fig. 7 is the surface coating synoptic diagram of plating piece of the present invention.
The bis explanation
11, plating piece; 111, electrode holder; 12, cathode carrier; 121, placement hole;
122, fixed part; 123, electric wire; 13, plating tank; 131, electroplate liquid;
21, shielding cell; 211, open-work; 212, electrode holder; 22, plating piece;
221, circumference; 222, screw; 223, intermediate surface; 23, shielding cell
24, cathode carrier; 241, placement hole; 241a, snapping portion; 242, cathode block;
242a, electric wire; 25, plating tank; 251, electroplate liquid; 252, anode;
31, electroless plating program; 32, inspection of semifinished product program; 33, surface treatment program
34, installing shielding cell program; 35, setting hook program; 36, galvanizing process;
Embodiment
As Fig. 2, Fig. 3, Fig. 4 and shown in Figure 5, it mainly contains: shielding cell 21, plating piece 22, shielding cell 23, cathode carrier 24, plating tank 25.
Wherein shielding cell 21 is impermeable structure, circumference 221 shapes on the shape and structure of this shielding cell 21 and plating piece 22 surfaces are coincide mutually, reduce than other surface location of plating piece 22 so that be plated on the ionic concn of the circumference 221 of plating piece 22, so that the thickness of plating piece 22 whole surface coatings reaches even; Offer open-work 211 on this shielding cell 21 again, wherein electrode holder 212 shells are the insulation material, and interior be conductive material, can the power utmost point insertion of an end of this electrode holder 212, and an end is a screw-like; Wherein plating piece 22 is plastics, offers screw 222 on this plating piece 22; Wherein the shape and structure of shielding cell 23 also coincide mutually with circumference 221 shapes on plating piece 22 surfaces, and this shielding cell 21 can be transparent material with shielding cell 23, carries out the observation of situation in the time of can conveniently electroplating; Wherein cathode carrier 24 has a plurality of placement holes 241, the 241a of snapping portion is arranged on the placement hole 241, this cathode carrier 24 is provided with cathode block 242,242a picks out with electric wire, electroplate liquid 251 and anode 252 are wherein arranged in the plating tank 25, and current paths and metal ion were with control electrolytic coating character when this electroplate liquid 251 provided plating.
Before carrying out galvanizing process 36, advanced luggage is established shielding cell program 34, electrode holder 212 is passed the open-work 211 of shielding cell 21,, thereby shielding cell 21 and plating piece 22 are installed with each other so that the screw thread screw lock of electrode holder 212 1 ends is fixed on the screw 222 of plating piece 22; The shielding cell 21 that will be installed with each other with the 241a of snapping portion is placed in the placement hole 241 of cathode carrier 24 with plating piece 22; And on the another side of cathode carrier 24, settle shielding cell 23.
Carry out setting hook program 35, the cathode block on the cathode carrier 241 242 is connected on the electrode holder 212 with electric wire 242a, so that cathode block 242 contacts with the metallic film on plating piece 221 surfaces via electrode holder 212 and guarantees that plating piece 22 normally conducts electricity.
As shown in Figure 6, carry out galvanizing process 36, plating piece 22 is placed in the plating tank 25, drive electroplate liquid 251 ions directly is attached on plating piece 22 intermediate surface 223 that crested unit 21 and shielding cell 23 do not cover via anode 252 discharge, impermeable structure because of shielding cell 21 and shielding cell 23, electroplate liquid 251 ions can't directly be attached to the circumference 221 of plating piece 22, and by shielding cell 21, the space that shielding cell 23 and plating piece are 22 enters, the plating distance of circumference 221 of plating piece 22 that promptly adds shielding cell 21 and shielding cell 23 is longer than intermediate surface 223, so that the concentration of the ion plating of electroplate liquid 251 on the circumference 221 of plating piece 22 reduces, thereby effectively reduce in galvanized process circumference 221 and intermediate surface 223 situation in uneven thickness.
As shown in Figure 7, after being the invention process, the synoptic diagram of plating piece 22 surface coatings, because of the use of shielding cell 21 with shielding cell 23, make the surface coating situation of plating piece 22 comparatively even, system effectively improves the circumference of known plate surface and the situation that intermediate surface is electroplated became uneven, and make it attractive in appearance, reduce subsequent disposal program and cost, and ease of assembly.
This preparation technology can increase electroplating time, and with the electroplating thickness of increase intermediate surface 223, and in the electroplating thickness that increases intermediate surface 223, the electroplating thickness of circumference 221 also is controlled; The increase of intermediate surface 223 electroplating thickness can strengthen the intensity of plating piece 22 intermediate surface 223, thereby makes plating piece 22 can bear bigger external impacts, to reach the function of reinforcement; And because of shielding cell 21 and shielding cell 23 put on the two sides of plating piece 22, thus can make the electroplating thickness on plating piece 22 two sides comparatively even, thus the degree of deformation of plating piece 22 is reduced, improved Application Areas and function more through galvanized plastics.
In sum, the plating piece finished of this technology has following advantage:
1. the electroplating thickness of the circumference 221 of plating piece 22 effectively reduces, so that circumference 221 is more even with intermediate surface 223 electroplating thickness of plating piece 22;
2. the electroplating thickness of the intermediate surface 223 of plating piece 22 increases, and has strengthened the intensity of plating piece 22 intermediate surface 223, and has controlled the electroplating thickness of circumference 221 simultaneously;
3. and because of shielding cell 21 and shielding cell 23 are the two sides that is arranged on plating piece 22, thus can make the electroplating thickness on plating piece 22 two sides comparatively even, thus the degree of deformation of plating piece 22 is reduced.
In sum, preparation technology is electroplated in the reinforcement that a kind of negative electrode provided by the present invention covers, and really meets the important document that grants a patent.
The above only is a preferred embodiment of the present invention, and the variation that utilizes the above-mentioned method of the present invention, shape, structure, device to do such as all should be contained in the interest field of this case.
Claims (4)
1. reinforcement electro-plating method that negative electrode covers, it is characterized in that: its step that comprises has:
Plating piece is carried out the electroless plating program, make plating piece surface attachment layer of metal film;
Install the shielding cell program, this shielding cell shape and structure of impermeable structure and the circumference shape on plating piece surface are coincide mutually, settle plating piece on cathode carrier behind the installing shielding cell, and this cathode carrier is provided with cathode block, to be connected to plating piece;
Carry out galvanizing process, this shielding cell of impermeable structure, make the electroplate liquid ion can't directly be attached to the plating piece circumference, and enter by the space between shielding cell and plating piece, the plating distance of plating piece circumference that promptly adds shielding cell so that the concentration of electroplate liquid ion plating on the circumference of plating piece reduces, is plated on the thickness attenuation of circumference than the middle table face length, and the electroplating time that can extend increases the coating film thickness of plating piece intermediate surface, thereby reaches the effect of ease of assembly and reinforcement.
2. the reinforcement electro-plating method that negative electrode as claimed in claim 1 covers, wherein cathode carrier is provided with placement hole, to place plating piece.
3. the reinforcement electro-plating method that negative electrode as claimed in claim 2 covers wherein is equipped with snapping portion on the placement hole.
4. the reinforcement electro-plating method that covers of the described negative electrode of claim 1, wherein shielding cell is a transparent material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03136301 CN1273647C (en) | 2003-05-20 | 2003-05-20 | Reinforced electroplating process with masked cathode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03136301 CN1273647C (en) | 2003-05-20 | 2003-05-20 | Reinforced electroplating process with masked cathode |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1548588A CN1548588A (en) | 2004-11-24 |
| CN1273647C true CN1273647C (en) | 2006-09-06 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 03136301 Ceased CN1273647C (en) | 2003-05-20 | 2003-05-20 | Reinforced electroplating process with masked cathode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1273647C (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008303451A (en) * | 2007-06-11 | 2008-12-18 | Umg Abs Ltd | Electroplating fixture |
| CN102719865B (en) * | 2012-07-13 | 2016-02-24 | 曲悦峰 | A kind of film plating die |
-
2003
- 2003-05-20 CN CN 03136301 patent/CN1273647C/en not_active Ceased
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| Publication number | Publication date |
|---|---|
| CN1548588A (en) | 2004-11-24 |
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Decision date of declaring invalidation: 20100201 Decision number of declaring invalidation: 14396 Granted publication date: 20060906 |