CN1265936C - Process for preparing electronic soft-soldering alloy - Google Patents
Process for preparing electronic soft-soldering alloy Download PDFInfo
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- CN1265936C CN1265936C CNB2003101111018A CN200310111101A CN1265936C CN 1265936 C CN1265936 C CN 1265936C CN B2003101111018 A CNB2003101111018 A CN B2003101111018A CN 200310111101 A CN200310111101 A CN 200310111101A CN 1265936 C CN1265936 C CN 1265936C
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Abstract
The present invention discloses a technology for preparing an electronic soft-soldering material alloy. The electronic soft-soldering material alloy is finished by two sections of smelting: a well type electric furnace and a closed converter, and then ingoting and processing. In the first section of smelting, the raw material of soldering material is put in the well type electric furnace to carry out oxidation refining and boiling refining; in the second section of smelting, the closed converter is adopted and the alloy liquid obtained from the first section of smelting is injected into the closed converter; the alloy liquid is degassed in vacuum firstly, and then, trace amount of additive is added to the alloy liquid for modifying and refining under the protective atmosphere. Finally, the alloy liquid ingot is cast under the vacuum or protective atmosphere, and the liquid phase alloy is rapidly cooled to solidify; the obtained cast ingot can be formed into soldering material products of rods, strips, wires, plates, bands, foils, sheets, granules, etc. after processed under pressure. The technology of the present invention finishes the purification and the modification of the soldering material once without needing to additionally preparing intermediate alloys, and has the advantages of simple technology, high productive efficiency, high, low production cost, favorable environmental protection conditions, accurate product formula, uniform ingredients, stable performance, optimal technologic performance, etc.
Description
Technical field
The invention belongs to the used solder of electronic product dress connection technology field, relate in particular to a kind of preparation technology of electronics soft soldering alloy.
Background technology
As everyone knows, the soldering of electronic product is with solder fusing, relies on the capillary wetting action to fill weld seam, makes dissolving mutually and diffusion take place between scolder and mother metal surface metal atom and to form interface intermediate alloy generation bonding.Under the certain condition, the quality of soldering depends primarily on the composition and the performance of molten tin scolder.Scolder goods such as stick of solder, bar, silk, plate, band, paper tinsel, sheet, ball, powder, cream all require to have prescription, uniform composition and consistent physical and chemical performance accurately.
At present, in the process of making the high-grade scolder of electronic product, not only to improve the purity of scolder, prevent the pollution of metal, improve the surface property of scolder under high temperature fused state but also need to add surfactant.But because the additive that adds is very micro-, generally all be that unit calculates with ppm, be difficult to realize the accurate adding of these additives and evenly distribution, especially the physicochemical properties of some additive and scolder heavy metal element differ greatly, and the homogenising of their alloying reaction and composition all is difficult to realize.Past, the manufacturing process of solder alloy adopts the system of open type usually, its major defect one is low to the degree of purification of solder alloy, the 2nd, the material oxidation is serious under the high temperature, except that causing the wasting of resources, more seriously because the scaling loss and the uniformity of trace additives is uncontrollable, cause the alloy product produced second-rate.Chinese patent 00120551.X has reported a kind of preparation method of welding flux additive alloy, and this method adopts preparation interpolation alloy in airtight container.But,, can not obtain and design mix and the on all four product of performance so can not avoid scaling loss, oxidation and the component segregation of alloying element because the melting mode of open type is still adopted in the production of final scolder.
Summary of the invention
The objective of the invention is to overcome the deficiencies in the prior art, a kind of preparation technology of electronics soft soldering alloy that can be consistent with design mix and performance height is provided.
The preparation technology of electronics soft soldering alloy of the present invention has well-type electric furnace and two sections fusion process of sealed stove, and it comprises refinement oxide, operations such as boiling refining, vacuum outgas and modification refining.In first section melting, the scolder raw material inserted and carry out refinement oxide and boiling refining in the well-type electric furnace; In second section melting, adopt sealed stove, in the alloy liquid injection sealed stove with first section melting gained, carry out vacuum outgas earlier, under protective atmosphere, add trace mineral supplement then and carry out the modification refining; After two sections meltings are finished, carry out ingot casting at last and make the fast condensation of liquid phase alloy solid under vacuum or protective atmosphere, the gained ingot casting promptly may be molded to scolder goods such as rod, bar, silk, plate, band, paper tinsel, sheet, grain through pressure processing.
Well-type electric furnace of the present invention is electrically heated open type electric furnace, and converter is electrically heated rotating closed electric furnace.
The technological parameter of solder alloy preparation requires: refinement oxide is to carry out 5～60 minutes time being higher than under 10～200 ℃ of temperature of liquidus curve; Boiling refining time 10～60 minutes; The modification refining is carried out 10～60 minutes time being higher than under 100～500 ℃ of temperature of liquidus curve.
Two sections smelting processes of this process using make the open type melting combine with the closed melting, and the former is that the latter is for the ease of degassing refining and modification refining for the ease of refinement oxide and boiling refining.Refinement oxide is in order effectively to remove the non-metallic inclusion that feed stock for blast furnace brings into and density is low, the slag making element of easy oxidation.The boiling refining is a large amount of carbon, the hydrogen that produces after the hydrocarbon thermal decomposition that utilizes in the organic reagent that adds, the gathering of these gases produces a large amount of bubbles and passes the discharge of alloy liquid, alloy liquid in the strong agitation molten bath, make alloy liquid be " boiling " state, effectively purify the impurity such as O, S that dissolve in the alloy liquid, other residual in alloy liquid nonmetallic inclusion also is removed with the bubble rising." boiling " of reducing gas be fast reaction speed not only, and makes the temperature of alloy liquid and chemical composition more even, can also effectively avoid the oxidization burning loss of alloy.Adopt after the vacuum outgas in the sealed stove; under protective atmosphere, make the sealed stove upset; alloy liquid carries out the modification refining under intense agitation; except that the oxidization burning loss of having avoided element fully, also make trace mineral supplement and solder alloy liquid produce quick alloying reaction and make that the chemical composition height is even.Employing is ingot casting and rapid solidification under vacuum or protective atmosphere, is for fear of surface oxidation and component segregation.The composition and the performance of gained solder alloy and design are in full accord, and it only is the physical deformation process that its ingot blank following process becomes scolder goods such as rod, bar, silk, plate, band, paper tinsel, sheet, grain, can not change the composition and the performance of solder alloy.
The present invention compared with prior art has the following advantages:
1, purification, the modification of scolder are once finished, do not needed to prepare in addition intermediate alloy, technology is simple, energy savings, production efficiency height;
2, can not only effectively remove harmful element in the scolder, and guarantee that micro-property-modifying additive does not have scaling loss, products obtained therefrom impurity is low, the purity height, and prescription is accurate, and composition is even, stable performance, manufacturability spy is good;
3, metal recovery rate height, low cost of manufacture;
4, environmental condition is good, and handling safety is reliable.
The specific embodiment
Be embodiments of the invention below:
Take by weighing each raw metal by the product grade requirement and insert heat fused in the well-type electric furnace, be higher than under 120 ℃ of temperature of liquidus curve, refinement oxide is 15 minutes continuously; In the motlten metal scolder, add the organic reducing agent A refining 30 minutes of seething with excitement again; The alloy liquid that the boiling refining is finished injects in the sealed stove; vacuum outgas is 10 minutes under the 10-2pa condition, adds mixed and modified additive B then under argon shield, is being higher than under 280 ℃ of temperature of liquidus curve; speed rotation with 20r/min was carried out the modification refining 20 minutes, stopped reaction.Carry out vacuum-casting at last, quick cooled and solidified, the gained ingot blank promptly gets goods such as stick of solder, bar, silk, plate, band, paper tinsel, sheet through the pressure processing physical deformation.
The sealed stove structure that adopts in the preparation is referring to Fig. 1, and it comprises a heating furnace 1, and it has a heating furnace body 2, is provided with electric heater unit 3 on the madial wall of body of heater.In heating furnace body 2 bottoms is hemisphere, and top is provided with movably heat tracing cover 4, also is provided with electric heater unit 5 in the inboard of heat tracing cover 4; Be provided with draining hole 6 in the bottom of heating furnace body 2, on draining hole 6, be provided with drainage tube 7.In the internal cavity of body of heater 2, be provided with reactor 8, on the horizontal axis of reactor 8, be fixedly connected with turning cylinder 9, be provided with transmission device 10 at an end of turning cylinder 9; Reactor 8 is the interception bodily form, and seal cover 11 is established in the cross section, and the sealing lid forms dismountable being tightly connected with reactor, is respectively equipped with bleeding point 12 and charging aperture 13 on seal cover 11.On bleeding point 12, establish exhaust tube 14, on exhaust tube 14, establish seal valve 15, on charging aperture 13, establish feed pipe 16, on the port of feed pipe 16, establish seal cover 17; Establish discharging opening 18 in the bottom of reactor 8, on discharging opening 18, establish discharge nozzle 19, on discharge nozzle 19, establish bleeder valve 20.
The above-mentioned sealed stove that exemplifies is the adoptable a kind of device structure preferably of technology of the present invention, is not the qualification to the invented technology protection domain.
Claims (2)
1, a kind of preparation technology of electronics soft soldering alloy is characterized in that may further comprise the steps;
(1) well-type electric furnace melting: the scolder raw material inserted carry out refinement oxide in the well-type electric furnace, in fusion welding, add organic reducing agent again or feed the reducibility gas refining of seething with excitement;
(2) sealed stove melting: the solder alloy liquid that preceding step refining is finished injects in the sealed stove, carries out vacuum outgas earlier, adds micro-property-modifying additive then under protective atmosphere in converter, sealed stove is rotated with certain speed carry out the modification refining; Described sealed stove has the heating furnace body opened of a charged heater, and the bottom of heating furnace body is provided with draining hole and drainage tube; Be provided with reactor in the inner chamber body of body of heater, be fixedly connected with turning cylinder on the horizontal axis of reactor, this turning cylinder passes the body of heater outside to left and right extension respectively, and an end connects transmission device; Seal cover is established in the top of described reactor, is respectively equipped with bleeding point and charging aperture on the seal cover; Establish the exhaust tube of a band seal valve on the described bleeding point, establish the feed pipe of a with closure on the described charging aperture; The discharge nozzle of discharging opening and band bleeder valve is established in the bottom of described reactor;
(3) rapid solidification ingot casting under vacuum or protective atmosphere obtains the scolder goods through pressure processing then.
2, the preparation technology of electronics soft soldering alloy according to claim 1 is characterized in that: described well-type electric furnace is electrically heated open type electric furnace, and described sealed stove is electrically heated rotating closed electric furnace.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2003101111018A CN1265936C (en) | 2003-12-02 | 2003-12-02 | Process for preparing electronic soft-soldering alloy |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2003101111018A CN1265936C (en) | 2003-12-02 | 2003-12-02 | Process for preparing electronic soft-soldering alloy |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1546274A CN1546274A (en) | 2004-11-17 |
| CN1265936C true CN1265936C (en) | 2006-07-26 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2003101111018A Expired - Fee Related CN1265936C (en) | 2003-12-02 | 2003-12-02 | Process for preparing electronic soft-soldering alloy |
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| CN (1) | CN1265936C (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110856881B (en) * | 2018-08-24 | 2024-10-11 | 广州倬粤动力新能源有限公司 | Device for adding solder |
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2003
- 2003-12-02 CN CNB2003101111018A patent/CN1265936C/en not_active Expired - Fee Related
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| Publication number | Publication date |
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| CN1546274A (en) | 2004-11-17 |
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Granted publication date: 20060726 Termination date: 20131202 |