CN1258307C - Flexible printed circuit board and producing method thereof - Google Patents

Flexible printed circuit board and producing method thereof Download PDF

Info

Publication number
CN1258307C
CN1258307C CNB031385680A CN03138568A CN1258307C CN 1258307 C CN1258307 C CN 1258307C CN B031385680 A CNB031385680 A CN B031385680A CN 03138568 A CN03138568 A CN 03138568A CN 1258307 C CN1258307 C CN 1258307C
Authority
CN
China
Prior art keywords
mentioned
circuit board
resin plate
printed circuit
flexible printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB031385680A
Other languages
Chinese (zh)
Other versions
CN1507312A (en
Inventor
道胁茂
菅慎司
大槻充
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Meiko Electronics Co Ltd
Original Assignee
Victor Company of Japan Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Victor Company of Japan Ltd filed Critical Victor Company of Japan Ltd
Publication of CN1507312A publication Critical patent/CN1507312A/en
Application granted granted Critical
Publication of CN1258307C publication Critical patent/CN1258307C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09154—Bevelled, chamferred or tapered edge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

Provided is a flex rigid printed wiring board where a reduction in cost can be attained and is less in an equipment investment and its manufacturing method. First and second resin sheets 5a, 5b are press-bonded on both sides of a rigid wiring board R respectively and are unified to form a flexible portion F. The rigid wiring board R is equipped with a wiring pattern 1b, a wiring pattern 7b is formed on at least one of the first and second resin sheets 5a, 5b, and the wiring patterns 1b of a plurality of the rigid wiring boards R are electrically connected with wiring patterns 7b formed on the resin sheets 5a, 5b. The material of the resin sheet is to be an epoxy, polyolefin, or polyimide resin having flexibility even after real hardening.

Description

Flexible printed circuit board and manufacture method thereof
Technical field
The present invention relates to flexible printed circuit board and manufacture method thereof.
Background technology
In recent years, the development of the high speed of the miniaturization of electronic equipment, multifunction and processing speed for achieving the above object, for the printed circuit board (PCB) of installing in this equipment, has proposed all high-density installation requirements correspondingly rapidly.
One of means of this kind requirement are tackled in the employing of flexible printed circuit board just.Owing in electronic equipment, adopt this kind flexible printed circuit board, can remove and be used for the plug connector that is electrically connected between each substrate, thereby enlarge installing space; Because length of arrangement wire shortens, thereby can carry out the signal processing of more speed; The three-dimensional circuit board configuration of this characteristic of flexible behind the assembly element owing to applied in a flexible way, the free layout of the parts in the equipment also becomes possibility, thereby can make electronic equipment miniaturization more.
Can mainly contain two kinds of structures for practical flexible printed circuit board at present.
One class is (below be referred to as the category-A type) on the part of one or both sides that rigid substrates such as FR-4 is attached to the flexible substrate.
Another kind of for the part of flexible substrate is stacked, make it to be formed with the multilayer flexible substrate of rigidity, so that when keeping necessary rigidity, also can form desired wiring figure (below be referred to as the category-B type).
And no matter which kind of type, the circuit board that forms multiple layer combination on the two-sided or single face of rigid element is practicability all.
Put down in writing an example of the printed circuit board (PCB) relevant in the patent documentation 1 with the category-A type.(with reference to Figure 26)
This printed circuit board (PCB) is bonded in hard printed circuit board 104 about it by adhesive plate 102 on the part on the two sides of flexible print wiring board 101, forms an entity.
Put down in writing an example (with reference to Figure 27) of the multi-layer flexible printed circuit board (PCB) relevant in the patent documentation 2 with the category-B type.
This multilayer flexible printed circuit board (PCB) by two places laminated 4 layers of single face apply copper flexible print wiring board material 204 formed multi-layer portion 208 and a part and have only the two-layer flex section 207 of the cable feature that this multi-layer portion 208 is electrically connected that makes to constitute.
Patent documentation 1: the spy opens flat 4-34993 communique (the 3rd page upper right section, the 1st figure)
Patent documentation 2: the spy opens flat 5-90757 communique (paragraph 0002, Fig. 2)
Summary of the invention
(category-A type)
Yet, among the category-A type that with rigid substrates flexible substrate is clipped in therebetween, in the operation of making multilayer flexible rigid substrates,, must independently carry out rigid substrates production process and flexible substrate production process separately as preparatory process.
And, also must carry out following each procedure as subsequent handling:
1. make rigid substrates and flexible substrate bonded to each other by adhesive layer.
2. through hole is set makes each layer electrical connection.
3. make the top layer constitute figure.
Because whole operation is extremely long, cost improves, and rigid substrates production equipment and flexible substrate production equipment are difficult to compatible each other, must buy this equipment respectively, so there is the huge problem of equipment investment expense volume.
In addition; the material that forms this flexible rigid substrates is polyimides (flexible substrate), epoxy resin (rigid substrates), polyimides (protective layer) and acrylic resin (adhesive layer), individual integrated this substrate that forms afterwards that the material that these three kinds of kinds are different constitutes.
Therefore exist because of the coefficient of thermal expansion difference of various materials is very big, because of temperature load makes the binding ability of the electroplates in hole uneven, each coupling part produces to come off etc. and is related to reliability problems.
Also exist the position of the wiring figure of each layer that deviation is arranged with the exception of this, lack the problem of conformability, and exist, the problem that tends to make the installation of element to become very difficult because the prying of substrate self is excessive with distortion.
(category-B type)
In addition, make it after stacked among the category-B type multi-layer flexible printed circuit board (PCB) of rigidization the part of polyimides flexible substrate, at first identical with category-A type situation, exist because of uneven the binding ability of the integrated plating that produces of kinds of materials, each coupling part comes off etc. and to be related to reliability problems.
In addition, the polyimides moisture absorption of using as the flexible baseplate material is big, has the shortcoming that the scolding tin thermal endurance descends after the moisture absorption.Thereby in the packing of opening the polyimides raw material, place under the situation of a few days, must before being about to use, carry out dry preliminary treatment to it, there is the problem that increases operation.
Exist in addition with rigid substrates and compare, the specification error was big between the polyimides flexible substrate was made batch, under the situation with its multiple stratification, wanted to make the position of the wiring figure between each layer aligned with each other, improved the very problem of difficulty of its conformability.
Under the situation with this flexible substrate multiple stratification, if its number of plies is compared with rigid substrates below ten layers, its rigidity is quite low in addition.Therefore among the mounted on surface operation, just need add backing plate sometimes, increase equipment and used number at the back side opposite with installed surface.
Therefore, the problem that the present invention need solve just is to provide a kind of flexible printed circuit board and manufacture method thereof, even the substrate that is made of flexible material and rigid material does not need to increase cost yet, and can make with the less equipment investment.
A kind of flexible printed circuit board and manufacture method thereof are provided in addition, can the temperature load when making to produce the tack of electroplating uneven, each coupling part can not produce and come off, the position of the wiring figure of each layer can not produce deviation, conformability is good, the prying of substrate self and twist for a short time can carry out reliable element and install.
In order to solve above-mentioned problem, as solution, the present patent application has following formation.
Promptly, one of scheme, the flexible printed circuit board that is proposed, it constitutes to have a plurality of rigid circuit boards that wiring figure is arranged of flex section connection that insulating properties and flexual resin plate constitute, and it is characterized in that: a surface and another surperficial edge with above-mentioned flex section link at above-mentioned a plurality of rigid circuit boards form chamfering; If the width that the angle that the surface of above-mentioned chamfering and above-mentioned rigid circuit board constitutes is θ, establish the thickness direction of the not chamfered part of above-mentioned rigid circuit board on the end face of above-mentioned flex section one side is α, then θ is in being no more than 35 ° scope, and α is in being no more than the scope of 0.3mm; The the 1st and the 2nd resin plate 5a, 5b are adhered to respectively on an above-mentioned surface and another surface, and the integrated back of the above-mentioned the 1st and the 2nd resin plate 5a, 5b is constituted above-mentioned flex section F.
Two of scheme according to technical scheme 1 described flexible printed circuit board, is characterized in that: the above-mentioned the 1st or the 2nd resin plate 5a, 5b have insulating properties by multilayer and flexual resin plate is stacked forms.
Three of scheme, according to technical scheme 1 described flexible printed circuit board, it is characterized in that: on the above-mentioned the 1st or the 2nd resin plate 5a, 5b, form wiring figure 7b, the wiring figure 1b of many pieces of above-mentioned rigid circuit board R is electrically connected to each other by the above-mentioned wiring figure 7b that on the above-mentioned the 1st or the 2nd resin plate 5a, 5b, forms.
Four of scheme according to technical scheme 1 described flexible printed circuit board, is characterized in that: the above-mentioned the 1st or the 2nd resin plate 5a, 5b are made of epoxy resin.
Five of scheme according to technical scheme 1 described flexible printed circuit board, is characterized in that: the above-mentioned the 1st or the 2nd resin plate 5a, 5b are made of vistanex.
Six of scheme according to technical scheme 1 described flexible printed circuit board, is characterized in that: the above-mentioned the 1st or the 2nd resin plate 5a, 5b are made of polyimide resin.
The present invention has following operational sequence as method in addition.
Promptly, seven of scheme, the manufacture method of flexible printed circuit board, many pieces of rigid circuit board R of flex section F connection that the formation of this circuit board constitutes to have insulating properties and flexual resin plate 5a, 5b, it is characterized in that this manufacture method comprises at least: on the rigid circuit board R of regulation shape, set the 1st operation with above-mentioned flex section F corresponding opening portion 3; The 2nd operation of implementing chamfer machining in a surface and another surperficial marginal portion of above-mentioned peristome one side of above-mentioned rigid circuit board, if the width that the angle that the surface of above-mentioned chamfering and above-mentioned rigid circuit board constitutes is θ, establish the thickness direction of the not chamfered part of above-mentioned rigid circuit board on the end face of above-mentioned flex section one side is α, then θ in being no more than 35 ° scope and α be no more than in the scope of 0.3mm; On the surface and another surface of above-mentioned rigid circuit board R, to cross over the mode of peristome 3, the 3rd operation of difference the bonding the 1st and the 2nd resin plate 5a, 5b; And make the above-mentioned the 1st and the 2nd resin plate 5a, 5b in above-mentioned peristome, form the 4th operation of one.
Eight of scheme, manufacture method according to technical scheme 7 described flexible printed circuit boards, it is characterized in that: the above-mentioned the 1st and the 2nd resin plate 5a, 5b are made of epoxy resin, vistanex or polyimide resin, above-mentioned the 3rd operation is the above-mentioned the 1st and the 2nd resin plate 5a of bonding semi-cured state, the operation of 5b, above-mentioned the 4th operation is to make the above-mentioned the 1st and the 2nd resin 5a, 5b by pressing method incorporate while in above-mentioned peristome 3, the operation that makes it to solidify by heating.
Description of drawings
Fig. 1 is the fragmentary perspective view of the 1st execution mode of expression flexible printed circuit board of the present invention.
Fig. 2 is the vertical view of manufacturing process of the 1st execution mode of explanation pliability embossing seal printed circuit board of the present invention.
Fig. 3 is the 1st cutaway view of manufacturing process of the 1st execution mode of explanation flexible printed circuit board of the present invention.
Fig. 4 is the 2nd cutaway view of manufacturing process of the 1st execution mode of explanation flexible printed circuit board of the present invention.
Fig. 5 is the 3rd cutaway view of manufacturing process of the 1st execution mode of explanation flexible printed circuit board of the present invention.
Fig. 6 is the 4th cutaway view of manufacturing process of the 1st execution mode of explanation flexible printed circuit board of the present invention.
Fig. 7 is the 5th cutaway view of manufacturing process of the 1st execution mode of explanation flexible printed circuit board of the present invention.
Fig. 8 is the 6th cutaway view of manufacturing process of the 1st execution mode of explanation flexible printed circuit board of the present invention.
Fig. 9 is the 7th cutaway view of manufacturing process of the 1st execution mode of explanation flexible printed circuit board of the present invention.
Figure 10 is the 8th cutaway view of manufacturing process of the 1st execution mode of explanation flexible printed circuit board of the present invention.
Figure 11 is the 9th cutaway view of manufacturing process of the 1st execution mode of explanation flexible printed circuit board of the present invention.
Figure 12 is the 1st cutaway view of manufacturing process of the 2nd execution mode of explanation flexible printed circuit board of the present invention.
Figure 13 is the 2nd cutaway view of manufacturing process of the 2nd execution mode of explanation flexible printed circuit board of the present invention.
Figure 14 is the 3rd cutaway view of manufacturing process of the 2nd execution mode of explanation flexible printed circuit board of the present invention.
Figure 15 is the 4th cutaway view of manufacturing process of the 2nd execution mode of explanation flexible printed circuit board of the present invention.
Figure 16 is the 5th cutaway view of manufacturing process of the 2nd execution mode of explanation flexible printed circuit board of the present invention.
Figure 17 is the cutaway view of other execution mode of expression flexible printed circuit board of the present invention.
Figure 18 is the fragmentary perspective view of other execution mode of explanation flexible printed circuit board of the present invention.
Figure 19 is the cutaway view of variation of the 1st execution mode of explanation flexible printed circuit board of the present invention.
Figure 20 is the 1st cutaway view of manufacturing process of the 3rd execution mode of explanation flexible printed circuit board of the present invention.
Figure 21 is the 2nd cutaway view of manufacturing process of the 3rd execution mode of explanation flexible printed circuit board of the present invention.
Figure 22 is the 3rd cutaway view of manufacturing process of the 3rd execution mode of explanation flexible printed circuit board of the present invention.
Figure 23 is the 4th cutaway view of manufacturing process of the 3rd execution mode of explanation flexible printed circuit board of the present invention.
Figure 24 is the cutaway view of another variation of the 1st execution mode in the expression flexible printed circuit board of the present invention.
Figure 25 is the cutaway view of the chamfering in each execution mode of explanation flexible printed circuit board of the present invention.
Figure 26 is the cutaway view of existing multilayer board.
Figure 27 is the cutaway view of existing multilayer flexible printed circuit board.
Embodiment
With Fig. 1 to Figure 24, introduce embodiments of the present invention below with preferred forms.
Fig. 1 is the fragmentary perspective view of the 1st execution mode of expression flexible printed circuit board of the present invention.
Fig. 2 is the vertical view of manufacturing process of the 1st execution mode of explanation pliability embossing seal printed circuit board of the present invention.
Fig. 3 is the 1st cutaway view of manufacturing process of the 1st execution mode of explanation flexible printed circuit board of the present invention.
Fig. 4 is the 2nd cutaway view of manufacturing process of the 1st execution mode of explanation flexible printed circuit board of the present invention.
Fig. 5 is the 3rd cutaway view of manufacturing process of the 1st execution mode of explanation flexible printed circuit board of the present invention.
Fig. 6 is the 4th cutaway view of manufacturing process of the 1st execution mode of explanation flexible printed circuit board of the present invention.
Fig. 7 is the 5th cutaway view of manufacturing process of the 1st execution mode of explanation flexible printed circuit board of the present invention.
Fig. 8 is the 6th cutaway view of manufacturing process of the 1st execution mode of explanation flexible printed circuit board of the present invention.
Fig. 9 is the 7th cutaway view of manufacturing process of the 1st execution mode of explanation flexible printed circuit board of the present invention.
Figure 10 is the 8th cutaway view of manufacturing process of the 1st execution mode of explanation flexible printed circuit board of the present invention.
Figure 11 is the 9th cutaway view of manufacturing process of the 1st execution mode of explanation flexible printed circuit board of the present invention.
Figure 12 is the 1st cutaway view of manufacturing process of the 2nd execution mode of explanation flexible printed circuit board of the present invention.
Figure 13 is the 2nd cutaway view of manufacturing process of the 2nd execution mode of explanation flexible printed circuit board of the present invention.
Figure 14 is the 3rd cutaway view of manufacturing process of the 2nd execution mode of explanation flexible printed circuit board of the present invention.
Figure 15 is the 4th cutaway view of manufacturing process of the 2nd execution mode of explanation flexible printed circuit board of the present invention.
Figure 16 is the 5th cutaway view of manufacturing process of the 2nd execution mode of explanation flexible printed circuit board of the present invention.
Figure 17 is the cutaway view of other execution mode of expression flexible printed circuit board of the present invention.
Figure 18 is the fragmentary perspective view of other execution mode of explanation flexible printed circuit board of the present invention.
Figure 19 is the cutaway view of variation of the 1st execution mode of explanation flexible printed circuit board of the present invention.
Figure 20 is the 1st cutaway view of manufacturing process of the 3rd execution mode of explanation flexible printed circuit board of the present invention.
Figure 21 is the 2nd cutaway view of manufacturing process of the 3rd execution mode of explanation flexible printed circuit board of the present invention.
Figure 22 is the 3rd cutaway view of manufacturing process of the 3rd execution mode of explanation flexible printed circuit board of the present invention.
Figure 23 is the 4th cutaway view of manufacturing process of the 3rd execution mode of explanation flexible printed circuit board of the present invention.
Figure 24 is the cutaway view of another variation of the 1st execution mode in the expression flexible printed circuit board of the present invention.
Figure 25 is the cutaway view of chamfering of each execution mode of expression flexible printed circuit board of the present invention.
The present invention is characterised in that: adopt to have pliability, the plate that flexible dielectric resin material constitutes replaces the existing flexible substrate that is made of polyimides, with the insulating barrier of this plate, form curve partly (flex section) of flexible printed circuit board at rigid element as combination layer.
Here said flexing contains flexing and the two kinds of implications of broad warp with the wide-angle bending simultaneously, also is like this in the following description.
As the material of this plate, can adopt to have pliability, after final curing, still have epoxy resin, vistanex or the polyimide resin of flexibility, can from above-mentioned material, select suitable according to various objectives.
Here said final curing is meant that the structure of resin material forms last stable form rather than refers to firmization, also is like this in the following explanation.
For example, generally speaking, can use the epoxy resin of various physical properties with suitable balance.If adopt this epoxy resin, then flex section and rigid element are commaterial, coefficient of thermal expansion is identical, can or not produce the wiring figure deviation of each layer that forms with method described later and the prying of substrate itself because of coming off of the uneven and coupling part of through hole adherence of coating appears in temperature load yet.
If consider from the angle that suppresses circuit loss, can use vistanex with low tan δ characteristic.If, then can use the polyimide resin of good flexibility from can the anti-angle that bends repeatedly considering.
Below introduce in detail flexible printed circuit board and the manufacture method thereof that adopts this resin plate.
As rigid substrates, adopt multilayer laminate or two-sided copper clad plate.Among present embodiment, adopt the multilayer laminate 1 of the regulation of laminated respectively one deck, on two surfaces of this multilayer laminate 1, form copper foil layer 1a on the two sides of the two-sided copper clad plate of FR-4.This multilayer laminate 1 thickness is 0.4mm, and the thickness of Copper Foil is 12 μ m.
As rigid substrates, can use does not naturally have laminated substrate yet, and in addition, under the situation as multilayer, but its stacked number also arbitrarily, and wiring figure, inner via hole etc. also can be pre-formed.
According to its production process, introduce＜the 1 execution mode respectively in detail below 〉,＜the 2nd execution mode 〉,＜the 3rd execution mode 〉.
＜the 1 execution mode 〉
At first the Fig. 3 with the stage of representing (operation 5) illustrates (operation 1)～(operation 5).
The diameter that (operation 1) adopts boring processing to form inner via hole 6 (below be referred to as IVH6) IVH6 on multilayer laminate 1 can be illustrative 0.3mm.
Two faces of multilayer laminate 1 are ground in (operation 2) light polishing, remove the burr of IVH6 opening part.
(operation 3) forms copper layer 1c with electroless copper method and electrocoppering at the inner surface of IVH6.1c is electrically connected to each other the Copper Foil on two sides by this copper layer.The about 20 μ m of thickness of the copper layer IC that forms.
(operation 4) fills this IVH6 (buried via hole) with resin 2.
(operation 5) adopts lithography corrosion technology to make the copper foil layer on two surfaces constitute figure, forms the wiring figure 1b (with reference to Fig. 3) of regulation.
(operation 6) adopts Milling Process to remove the flexibleization part of multilayer laminate 1, forms flexible opening 3 (with reference to Fig. 2, Fig. 4).Fig. 2 is the simplification vertical view of multilayer laminate.This opening is a plurality of rigid circuit boards gap separated from one another that is used for making flexible printed circuit board in the present embodiment.
(operation 7) forms chamfering 4 on the opposite side of openend one side of flexible opening 3.(with reference to Fig. 2, Fig. 5).This chamfering 4 is by the edge part to the two sides, adopts the execution of instrument of the tip angle with regulation to dig to cut to process.Details aftermentioned about this chamfering 4.
(operation 8) implemented melanism to the surface of wiring figure 1b and handled.Its purpose is to improve the binding ability of the layer (resin plate 5) that forms in the subsequent handling on this wiring figure.
(operation 9) but still have epoxy resin board 5a, the 5b of the semi-cured state of pliability flexing to overlap two surfaces (with reference to Fig. 2) of multilayer laminate after will finally solidifying.The thickness of resin plate 5a, 5b is such as being 70 μ m.This resin plate still has pliability after also can adopting final curing as mentioned above, but the plate that the vistanex of the semi-cured state of flexing or polyimide resin constitute.
(operation 10) overlapped single face on resin plate 5a, the 5b by the Copper Foil 7 of alligatoring, make its alligatoring facing to resin plate 5 one sides, heat when pressurize in two surfaces with vacuum laminated machine (not shown), make two resin plate 5a, 5b hot pressing (with reference to Fig. 6).
Calculate on wiring figure 1b surface from rigid element R under this state, and the thickness of resin plate 5a, 5b is about 50 μ m.In addition, the thickness of Copper Foil 7 is such as being 12 μ m.
In addition, improved the hard rubber barrier film of pressing in it by compressed air and pressurizeed in order fully to affact the depressed area corresponding, can to adopt with flexible opening 3.
Example as the condition that heats and pressurize: epoxy resin, vistanex, any one material of polyimide resin are 120 ℃, 7kg/cm 2
(operation 11) implements heat treatment, and resin 5a, 5b are finally solidified.
Example as heat-treat condition: epoxy resin board is 180 ℃, placed 60 minutes; Polyolefin resin sheet is 170 ℃, placed 60 minutes, polyimide plate is 200 ℃, placed 60 minutes.
By this final curing, resin plate 5a, 5b form one as laminated insulating barrier and multilayer laminate 1.The surface of multilayer laminate 1 formed wiring figure situation under, one of them part is covered by this resin plate 5a, 5b, makes this SI semi-insulation.So, when introduction overlaps resin plate 5a, 5b multilayer laminate 1 surface and forms one, be referred to as to cover.
By this operation, even resin plate 5a, 5b also fully solidify at flex section but still have pliability, but flexing.
In addition, in this heat treatment, if multilayer laminate is lain in the heat-treatment furnace, will become under the big situation of the area of flex section (part that is equivalent to flexible opening 3) of resin plate 5a, 5b, resin 5a, the 5b of this part (containing Copper Foil 7) is often sagging because of deadweight.Therefore preferably use and keep anchor clamps etc. that multilayer laminate is erected heat-treating.
By above (operation 1)～(operation 11), the resin plate 5a, the 5b that outer surface are had Copper Foil 7 are used to have pliability, but in the time of the flex section F of flexing, also it can be laminated to two surfaces of multilayer laminate 1 as laminated insulating barrier, form the flexible printed circuit board 50 (with reference to Fig. 6) that constitutes by flex section F and rigid element R with this.
Be presented in the operation that flexible printed circuit board 50 surfaces that form until (operation 11) operation before further form wiring figures etc. below.
(operation 12) implements photoetching corrosion processing on the Copper Foil on resin plate 5a, the 5b, remove the Copper Foil 7 of laser the region between the heart and the diaphragm hole (below be referred to as LBH) perforation.The formation (with reference to Fig. 7) of Here it is so-called conformal mask 8.
(operation 13) adopts laser processing, forms LBH9 (Fig. 8) on resin plate 5a, 5b.The maximum gauge of laser processing (diameter of conformal mask 8) is such as being Φ 150 μ m.
(operation 14) adopts electroless copper and electroplates copper-plating method, comprises the inner surface of LBH9, forms copper plate 9c, by this copper plate 9c, makes the wiring figure 1b of resin plate 5a, 5b internal layer and the outer field Copper Foil 7 of resin plate 5a, 5b be electrically connected (with reference to Fig. 9).The thickness of formed copper layer 9c is such as being about 20 μ m, and with the Copper Foil addition, conductor thickness adds up to 32 μ m.
(operation 15) constitutes figure containing Copper Foil on interior outer contact, as shown in Figure 8, at flexible opening, because two resin plate 5a, 5b are pressed together, thereby each side has produced the step H of about 0.15mm between the surface of the surface of flex section F and rigid element R.
Exist so big step to make the dry plate of normally used exposure usefulness agree to the applying of this step to become quite difficult sometimes.
Therefore, for the convex-concave that can agree to surface step to cause, preferably use the photoresist of liquid electrode appositional pattern.This photoresist is such as the Sani EDUV376 that can use Northwest coating joint-stock company to produce.
The composition of outer contact at first adopts electro-deposition, make above-mentioned photoresist adhere to the surface after, adopt the figure egative film to carry out the conductor fig exposure.
Among this exposure, if adopt the exposure of carrying out usually of being close to, though the figure egative film can be close to rigid element R, owing at flex section F, have step H, egative film becomes vacant state, so can not focus on, forms the exposure of fuzzy figure.Consequently often can not form the fine rule figure.
Therefore exposure device preferably uses the dark projection-type equipment of district's degree of depth of taking pictures.
And, use this device exposure, develop then and etch processes, can form the wide wiring figure 7b that is respectively 100 μ m/100 μ m in live width/interval at flex section F.In addition, can form the wiring figure (not shown) (with reference to Figure 10) of 75 μ m/75 μ m equally at rigid element R.
Exposure mode can adopt the laser direct imaging device (Laser DirectImage) by laser explosure.
(operation 16) forms solder mask layer 10 with layered manner on two surfaces, by adopting the photoresist etching, form the opening figure 10a (with reference to Figure 11) of regulation on this layer.
This solder mask layer 10 has the function of the protective layer that is used for protecting flex section F.
The material of this solder mask layer 10 can use has flexibility and photosensitive common flexible substrate protective layer material.
By when stacked, using vacuum laminated machine, during composition after stacked, use above-mentioned projection exposure equipment, can form solder mask layer 10 in high quality with regulation opening figure 10a.
(operation 17) adopts machining, cuts out the 50A with regulation external shape, thus finish flexible printed circuit board 50 with regulation profile (with reference to Fig. 1, Fig. 2).
Introduce the 2nd execution mode below.
＜the 2 execution mode 〉
The 2nd execution mode adopts at the film carrier (not shown) with good thermal endurance and the fissility after the heat treatment and goes up stacked resin plate.This resin plate still has pliability after solidifying, but the epoxy resin of the semi-cured state of flexing, vistanex or polyimide resin constitute, and its thickness is such as being 70 μ m.
Coating foil not on this resin plate, but film carrier is placed outermost, with two resin plate hot pressings.Peel off film carrier then, adopt galvanoplastic to form the copper layer, and this copper layer is carried out composition, produce flexible printed circuit board 51 on its surface.
The production process of this flexible rigid circuit board 51, the first half is identical with above-mentioned (operation 1)～(operation 9).Therefore,, add A, introduced with Figure 12 to Figure 16 at its label afterbody to its later operation.
Heating when (operation 10A) adopts vacuum laminated machine (not shown) to pressurize from the two sides is with two resin plate 5a, 5b heat seal (with reference to Figure 12).
Fully affact the sunk part corresponding for making this add pressure energy, be embodied as with the hard rubber barrier film that adopts pneumatically to improve interior pressure with flexible opening 3.
Example as the condition that heats and pressurize is 120 ℃, 7kg/cm to epoxy resin, vistanex, any one material of polyimide resin 2
(operation 11A)
The multilayer laminate 1 that obtains by operation 11A is implemented heat treatment, resin 5a, 5b are finally solidified.
Being exemplified as of heat-treat condition: epoxy resin being 180 ℃, placing 60 minutes, vistanex is 170 ℃, placed 60 minutes, is 200 ℃ to polyimide resin, places 60 minutes.
By this final curing, resin 5a, 5b form one as the combined insulation layer with multilayer laminate 1.
In addition, among this heat treatment,, under the big situation of the area of the flex section (position that is equivalent to flexible opening 3) that constitutes resin plate 5a, 5b, often sagging because of the deadweight of this part if multilayer laminate 1 is lain in the heat-treatment furnace.Therefore preferably use and keep anchor clamps etc. that multilayer laminate is erected heat-treating.
By above (operation 1)～(operation 9), (operation 10A) and (operation 11A), because of outermost layer is resin 5a, 5b, when using it for flex section F, also can be used as laminated insulating barrier, be layered on the two sides of multilayer laminate 1, can form the flexible printed circuit board 51 (with reference to Figure 12) that constitutes by flex section F and rigid element R like this.
Be presented in below by the operation that further forms wiring figure on the surface of the flexible printed circuit board 51 that forms until (operation 11A) operation before.
(operation 12A) peels off film carrier, on resin plate 5a, 5b surface, adopts well-known method, forms (the region between the heart and the diaphragm hole) LBH12 (with reference to Figure 13) on assigned position.
(operation 13A) adopts electroless copper and electroplates copper-plating method and comprise (the region between the heart and the diaphragm hole) LBH12 inner surface, forms copper plate 13, and the wiring figure 1b of the internal layer of resin 5a, 5b is electrically connected (with reference to Figure 14) with copper plate 13.The thickness of formed copper layer 13 is such as about 20 μ m.
(operation 14A) carries out composition to copper layer 13.As shown in Figure 14, because at flexible opening 3, with two resin plate 5a, 5b pressing, thereby each side has produced the step H of about 0.15mm between the surface of the surface of flex section F and rigidity R.
Described in the introduction of the 1st execution mode,, often be difficult to make the dry plate and the position driving fit that comprises this step of normally used exposure usefulness in case the step of this kind degree occurs.
Therefore, for the convex-concave that can agree to surface step to cause, preferably use liquid electrode appositional pattern photoresist.The Sani EDUV376 that this photoresist can use Kansai Paint Co., Ltd to make.
Composition at first by electro-deposition, makes above-mentioned photoresist stick to the surface, and then carries out the exposure of conductor fig with the figure egative film.
Among this exposure, if adopt the exposure of carrying out usually of being close to,,,, egative film can't focus on so becoming vacant state owing to have step H at flex section F though the figure egative film can be close to rigid element R, form the exposure of fuzzy figure.Consequently often can not form the fine rule figure.
Therefore exposure device preferably uses the dark projection-type equipment of district's degree of depth of taking pictures.And, develop then and etch processes by using this device exposure, can form the wide wiring figure 13b that is respectively 75 μ m/75 μ m in live width/interval at flex section F.In addition, at rigid element R, can form the wiring figure (diagrammatic sketch shows) (with reference to Figure 15) that is similarly 50 μ m/50 μ m.
Exposure mode can adopt the laser direct imaging device with laser explosure.
(operation 15A) adopts layered manner to form solder mask layer 10 on two surfaces, by adopting the etching of photoresist, forms the opening figure 10a (with reference to Figure 16) of regulation on this layer.
This solder mask layer 10 has the function of the protective layer that is used for protecting flex section F.
The material of this solder mask layer 10 can use the protective layer material with flexibility and photosensitive common flexible substrate use.
By when stacked, using vacuum laminated machine, use above-mentioned projection exposure equipment on the figure after stacked, can form solder mask layer 10 in high quality with regulation opening figure 10a.
(operation 16A) adopts any processing method to be separated into the outer shape 51A of regulation, finishes flexible printed circuit board 51 (with reference to Fig. 1, Fig. 2).
Among above-mentioned execution mode 1,2, because available identical production equipment is made flex section and rigid element by series of processes,, cost is descended so do not need two kinds of operations of two complete equipments, also can reduce the equipment investment that is used to make in addition.
＜the 3 execution mode 〉
Among above-mentioned execution mode, owing to have step H in the junction of rigid element R and flex section F, thereby be provided with on the surface of flex section F under the situation of the wiring figure of crossing over this step H, often be difficult to make wiring figure meticulously.
Therefore pass through to reduce this step with the 3rd execution mode introduction below, can form the example of more trickle wiring figure on the surface of flex section F.
The 3rd execution mode is by having flexual photosensitive resin film at flexible opening 3 landfills in advance, form resin sheet 5a, 5b on this resin molding, reducing the flexible printed circuit board 51 of its step.
Making among the operation of this flexible printed circuit board 51, preceding half section identical with above-mentioned (operation 1)～(operation 9), thereby in following operation, its label not tail add B, introduce the operation of second half section with Figure 20～23.
(operation 10B) adopts vacuum laminated machine (not shown) from two surfaces of rigid circuit board two photosensitive resin film 14a, 14b to be covered, and heating makes it heat seal in the time of pressurization.
This photosensitive resin film can use common photo anti-corrosion agent material, for example can use Hitachi to change into " Lay tech FR-5000 " that Industry Stock Company produces.(" Lay tech " is the registered trade mark that Hitachi changes into Industry Stock Company).
The pressurization of this moment with the diaphragm of rubber that uses compressed air to improve to press in it for well, so that can fully affact the sunk part corresponding with flexible opening.Heating and pressurized conditions are 80 ℃, 5kg/cm 2
(operation 11B) is retained in the flexible opening 3 photosensitive resin film 14a, 14b, and photosensitive resin 14a, the 14b of unnecessary part removed (with reference to Figure 21) with photoetching technique.After this was removed and handles, the surface of photosensitive resin film 14a, 14b was compared with the surface of rigid element R, though still have a little depression, its step H 2Littler, each side can be controlled in 0.10mm.
(operation 12B) to two pieces of photosensitive resin film 14a, 14b irradiation ultraviolet radiation after, heating makes it to solidify.Irradiation and heating condition are exemplified as: available 1j/cm 2Ultraviolet irradiation can be heated with 160 ℃ of placements in hot-air drying stove in 60 minutes.
(operation 13B) with vacuum laminated machine (not shown), from two surperficial pressurized, heated, with two resin plate 5a, 5b heat seal (with reference to Figure 22) and, then cover on photosensitive resin film 14a, the 14b heat seal resin plate 5a, 5b at flexible opening 3.This pressurization can use the vulcanie barrier film that has improved interior pressure by compressed air to carry out, and makes it fully to affact a little sunk part corresponding with flexible opening 3.
As the example of the condition that heats and pressurize, epoxy resin, vistanex, any one material of polyimide resin all can adopt 120 ℃, 7kg/cm 2Carrying out.
(operation 14B) implements heat treatment to the multilayer laminate 1 that obtains with operation 13B, and resin plate 5a, 5b are finally solidified.As the example of heat-treat condition, epoxy resin is 180 ℃, placed 60 minutes, vistanex is 170 ℃, placed 60 minutes, polyimide resin is 200 ℃, placed 60 minutes.By this final curing, resin 5a, 5b form one as the combined insulation layer with multilayer laminate.
By above (operation 1)～(operation 9) and (operation 10B)～(operation 14B), forming outermost layer is resin plate 5a, 5b, at flex section F, use photosensitive resin film 14a, the 14b of above-mentioned resin plate 5a, 5b and layer formation within it, simultaneously with this resin plate 5a, 5b as laminated insulating barrier, be layered in the flex section F on two sides of multilayer laminate 1 and the flexible printed circuit board 54 (with reference to Figure 22) that rigid element R constitutes.
Using on the surface of the flexible printed circuit board 54 that this (operation 14B) operation before forms, further form under the situation of figure, can adopt the operation identical to carry out with (operation 12A)～(operation 16A) in the 2nd execution mode.
When implementing this operation, because the every side of step H3 (with reference to Figure 22) on the flex section F of this flexible printed circuit board 54 and the surface of rigid element R has only about 0.10mm, very little, thereby among (operation 14A), be easy to make normally used exposure dry plate driving fit.Certainly also can use the photoresist of liquid electrode depositional mode.
In addition, exposure device also needn't use especially by the dark mode of the photographed region degree of depth, can use usually the mode of the side of making.
And, by implementing (operation 16A) operation before, can obtain flexible printed circuit board shown in Figure 23 54.
＜other execution mode 〉
More than the 1st to the 3rd execution mode introduced in detail for be the example that respectively forms the combination layer of one deck resin sheet 5a, 5b on the two sides, also can form certainly this resin sheet be increased to two-layer more than, form the flexible printed circuit board 52 of combination layer.
In the case, because outermost resin plate 5Aa, the 5Ab of flex section F has the function of the protective layer of the wiring figure 7b of one deck below this layer of protection, also can only on rigidity R, form solder mask layer 10A.Among this constituted, solder mask layer 10A did not have flexing, thereby can use and do not possess flexual material (with reference to Figure 17).
Because when adopting this method to form a plurality of layers of resin plate, can make flex section F and rigid element R by a series of multiple stratification operation with identical production equipment, and needn't adopt equipment and the operation that has nothing in common with each other, thereby can reduce cost, also can reduce investment in production equipment.
In addition, under wiring figure that flex section forms and situation that wiring figure on the rigid substrates is electrically connected, its integration performance has been improved in the position of as easy as rolling off a log aligning wiring figure.In addition, form composite bed, form at each interlayer under the situation of wiring figure at bonding a plurality of layers of resin plate, owing to improved the conformability of position between each layer of aiming at wiring figure, thereby also as easy as rolling off a log carrying out.
Below the main points of each execution mode of just introducing in detail further introduced.
At first, among (operation 10) (with reference to Fig. 6), be that resin plate 5a, 5b are overlapped with Copper Foil 7, the legal hot pressing of employing vacuum layer, but this is under the situation of having only resin 5a, 5b, in order to prevent that resin 5a, 5b run off because of heat treated intensification viscosity descends, and guarantee the thickness that it is stable and the measure of taking.
In addition, among (operation 10A),, thereby can guarantee stable thickness because film carrier and above-mentioned Copper Foil 7 have same effect.
Resin plate 5a, 5b integrated is not limited to heat seal, and preferably suitably selecting, the method for suitable this plate makes it integrated.
In addition, among (operation 7) (with reference to Fig. 5), form chamfering 4, can suppress of the rapid variation of the thickness of resin sheet 5a, 5b in its joint portion by joint portion at rigid element R and flex section F.With the exception of this, but also relieve stresses is concentrated, and effectively improves the intensity of joint portion.Especially repeatedly the intensity of flexing.
About this chamfering, introduce in detail with Figure 25.
Figure 25 (a) is the chamfer angle θ and chamfering not of chamfering 4 of the opening 3 of rigid circuit board 1, the cutaway view of the residue width α of the thickness direction of the end face remainder of opening 3.
For example, be not form under the situation of chamfering 4 on the rigid circuit board 1 of 0.6mm at thickness, shown in Figure 25 (c).After the end of opening 3 resin plate 5a, the unexpected flexing of 5b, form an integral body.
Because resin plate 5a, 5b were in semi-cured state before this integrated heat seal, though can implement final curing according to shape in a way, can't agree to the end face of opening 3 to change fully, space 15 might appear.
In addition, the thickness of the shoulder 16 of flexing has the tendency of attenuation, might guarantee the buckling strength repeatedly of whole resin plate equably.
Therefore, the inventor finds after studying intensively, no matter adopt chamfering 4 rigid circuit board R how thickly to have, no matter at what position, can both guarantee uniformly buckling strength repeatedly, with the exception of this, by the setting of chamfer angle θ and above-mentioned width α, found to guarantee this inhomogeneity upper limit more reliably.
The situation of this respect is introduced with following table 1
Table 1
The combination evaluation result of the width of chamfer angle θ and thickness direction
Figure C0313856800271
Total following five kinds of the rigid circuit board thickness t that is for experiment: 0.2mm, 0.3,0.4,0.6,0.8.
Annotate 1 no chamfering
This table 1 illustrates: chamfer angle is set at from 6 kinds of 0 ° to 45 °, in addition, amplitude alpha is made as 5 kinds from 0mm to 0.6mm, just forms the trial-production by the latter made flexible rigid circuit board of its chamfering that combines respectively, by bending the evaluation result of bending strength test repeatedly.
In addition, rigid circuit board 1 has adopted thickness of slab to be respectively 0.2mm, 0.3mm, and 0.4mm, 0.6mm, the 0.8mm5 kind is manufactured experimently respectively.
Estimate good and bad degree, adopted ◎ by its intensity: special excellent, zero: excellent, ◇: on good, △: good 4 grades.Self-evident, even if good, when using, reality also has enough intensity.
In addition, the θ=0 ° situation when not forming chamfering, θ is that 20 °～45 ° evaluation represents to have the situation above the rigid circuit board of the thickness of slab of its width.For example, 30 ° of θ, the evaluation ◎ of α=0.3 represent that thickness of slab is the evaluation of 3 kinds of above rigid circuit boards of 0.4mm.
The evaluation and the thickness of slab of the formation of chamfering do not have dependence as can be known from this result.
Being evaluated as of the no chamfering of chamfering below 40 ° time the (θ=0 °): be lower than evaluation that chamfering is arranged or identical with it, and situation about not surpassing, hence one can see that is preferably formed as chamfering 4.
In addition, prove also that thus chamfer angle θ and width α all have the upper limit of its optimum range.
That is, hence one can see that, is no more than 35 ° and α at θ and is no more than in the scope of 0.3mm, and θ and α combination form are best chamfering forms.
Figure 25 (α) illustrates the visual performance of this scope.Among this figure, the zone that goes out with the oblique line frame is chamfering form θ of the best and the zone of α.
If form this chamfering 4, make resin plate 5a, 5b integrated, then shown in Figure 25 (b), can not produce the space in the end of opening 3, and near shoulder 16, also can form the thickness of regulation, no matter thereby can guarantee what position, whole resin sheet all has extremely uniformly buckling strength repeatedly.
Yet, owing to go up the very difficult wiring figure that forms at the slant range L (with reference to Figure 25 (a)) that forms because of this chamfering, thereby set in high density under the situation of wiring figure 13b, can consider according to the thickness of used rigid circuit board R and the density of wiring figure 13b, set required MIN slant range L, preferably can in satisfying the scope of this condition, form chamfering 4.
Resin plate can be selected to use from the material with following physical property and characteristic, but there is no need all to satisfy shown below 1. reach 2. insulating properties and the performance beyond the pliability, can select according to different behaviours in service.
But can satisfy above-mentioned various condition at the resin plate with pliability flexing that is made of epoxy resin, vistanex or polyimide resin described in each execution mode, be fabulous material.
1. form by insulating material, also have the function of serving as insulating barrier.
2. have still pliability and folding quality with bending reply repeatedly after solidifying through heat treatment is final.
3. its thickness has the thickness of 70 μ m approximately under semi-solid preparation (so-called B level) state, and in addition, stacked this resin material on conductor fig under the final solid state after the heat treatment, has the thickness of 50 μ m approximately on conductor fig.
4. with copper plate good adaptation is arranged.When being used for the purposes shown in the 2nd execution mode, be on the plate surface, to obtain the good adaptation with copper plate, should adopt potassium permanganate etc. to carry out surface coarsening.
5. as the suitable material of the insulating material and the flexible base plate of multilayer laminate, should have good laser and machining property, drug-resistant performance, heat resistance, fire resistance etc.
The thermal expansion ratio and the low water absorbable that 6. should have anti-insulating properties, resistance to migration, appropriateness.
7. as baseplate material, should have suitable electrical property (especially dielectric constant and dielectric loss angle tangent).
Embodiments of the present invention are not limited to above-mentioned formation, in being no more than the scope of main points of the present invention, can carry out the change of following example.
Still adopt galvanoplastic to set the copper layer that constitutes wiring figure as for adopting Copper Foil to set, can select arbitrarily, also can use diverse ways respectively on two surface.
Each rigid element R that is connected by flex section F also can not use same substrate to constitute, and also the rigid substrates R that can be formed by different substrates is set to constitute the gap 3 back configurations of flex section F, connects with resin plate 5, forms an integral body.
As introducing in the execution mode, gap 3 not only means makes it the gap of separating fully, and the opening of introducing in the execution mode 3 being provided with on the plate is also contained among this gap 3.
Also can adopt in addition by flex section F and constitute each rigid element R of the different numbers of plies is connected to one another.
Can make the end of flex section F not connect rigid circuit board 1 in addition, but as free end.If plug is installed at this free end, then can be without electric wire but with free form directly with for rigid circuit board apart the plug connector of certain distance be connected.
Flexible opening 3 is not limited to a place.Also can adopt to have a plurality of flexible openings 3, with a plurality of flex section F1, the flexible formation of F2.Figure 18 illustrates the one example.
As shown in Figure 18, by having a plurality of flex section F1, F2, just can be configured in the electronic equipment or be used for moving part with form more freely.
In addition, among the 1st to the 3rd execution mode, show on two surfaces of substrate respectively formation, but only also can adopt, form the formation of flex section with this resin plate at surface stacked 1 or a multi-disc resin plate with two stacked resin plate hot pressings.Also can make the sheet of the stacked resin plate in two surfaces count difference.
In addition, variation as the 1st execution mode, also can be with resin plate 5a, 5b, a part of 5a1, the 5b1 of flex section F one side that connects as the interlayer of the insulating barrier that is used for rigid element R use, and with the flexible rigid circuit board 53 of the insulating barrier 5c structure of well-known laminated insulating barrier formation other parts.Figure 19 illustrates the one example.
Among this example, resin plate 5a, 5b do not cover all wiring figure 7b of rigid element R, but only cover its part, have the function of the insulation that makes this part.
In addition, another kind of variation as the 1st execution mode, can resin plate 5a, 5b not used as the insulating barrier of rigid element R yet, but adopt a part that does not form the multilayer laminate 1A of wiring figure as the surface, form at its outermost, form the flexible rigid circuit board 55 of insulating barrier 5c structure on this surface with well-known laminated insulating material, Figure 24 illustrates the one example.
Because resin plate 5a, the 5b of this moment are not insulating barriers, thereby the reduced thickness of resin plate can be arrived required Min..Thereby can obtain better flexible.
The material of resin plate 5a, 5b that is bonded in the two sides of rigid circuit board also not necessarily uses commaterial, for example also a side can be set at epoxy resin, constitutes and opposite side is set at vistanex.
In addition, under the situation of this resin plate of stacked multilayer 5a, 5b, resin plate that also can stacked different materials.
The invention effect
Describe in detail as above, according to the present invention, owing to adopted a surface and another surface that the 1st and the 2nd resin plate is adhered to rigid circuit board respectively with wiring figure, make the 1st and the 2nd resin plate integrated, constitute the structure of flex section, thereby can use the operation and the production equipment that adhere to same system separately with rigid portion to make this flex section and needn't increase production cost, can obtain to reduce the effect of manufacturing equipment investment.
In addition, owing to formed chamfering at the edge of rigid circuit board and flex section link, thereby can guarantee that repeatedly buckling strength is not different because of the position, have this intensity uniformly.
In addition, because the 1st or the 2nd resin plate multilayer that is stacked has insulating properties and flexual resin plate forms, thereby the multiple stratification operation and the production equipment of available and rigid element same system are made flex section, in multiple stratification, do not increase cost yet, can obtain to reduce the effect of manufacturing equipment investment.
Owing on the 1st or the 2nd resin plate, form wiring figure, to be electrically connected to each other between the wiring figure on a plurality of rigid circuit boards by the wiring figure that forms on the above-mentioned the 1st or the 2nd resin plate, even so under the situation of multiple stratification, the wiring figure that also can obtain to aim at each interlayer at an easy rate improves the effect of its conformability.
In addition, because the material of the 1st or the 2nd resin plate has adopted epoxy resin, therefore but rigid element is identical with the basic composition of flection part, the difference of coefficient of thermal expansion is minimum, can not produce the problem that the galvanization coating tack is inconsistent and the coupling part comes off that causes because of variations in temperature, improved the position conformability of each layer wiring figure, the prying and the distortion of substrate itself also can not take place, thereby can carry out the reliable element assembling, the moisture absorption of epoxy resin is very low, can not produce because of moisture absorption makes the decline of scolding tin heat resistance, thereby the dry effects of pretreatment before can obtaining not need to use.
In addition,, thereby low tan δ characteristic can be obtained, the especially effect of the loss of the power consumption under the situation that forms the high frequency wiring figure can be obtained to suppress because the material of the 1st or the 2nd resin plate adopts vistanex.
In addition, because the material of the 1st or the 2nd resin plate has adopted polyimide resin, thereby can obtain good refrangibility and bendability, can obtain to be used for for a long time the purposes that bends especially repeatedly.
In addition since its manufacture method comprise at least: be bonded in a surface of rigid circuit board and another lip-deep the 3rd operation in the mode of crossing over the gap respectively in the 1st operation that forms the gap corresponding on the rigid substrates with the 1st and the 2nd resin plate with flex section and in this gap with incorporate the 4th operation of the 1st and the 2nd resin plate, thereby might make flex section and rigid element with same set of operation and production equipment, can obtain making the effect of production cost decline, minimizing equipment investment.

Claims (8)

1. flexible printed circuit board, it constitutes, and has the flex section that insulating properties and flexual resin plate constitute and connects a plurality of rigid circuit boards with wiring figure, it is characterized in that:
A surface and another surperficial edge with above-mentioned flex section link at above-mentioned a plurality of rigid circuit boards form chamfering;
If the width that the angle that the surface of above-mentioned chamfering and above-mentioned rigid circuit board constitutes is θ, establish the thickness direction of the not chamfered part of above-mentioned rigid circuit board on the end face of above-mentioned flex section one side is α, then θ is in being no more than 35 ° scope, and α is in being no more than the scope of 0.3mm;
The the 1st and the 2nd resin plate is adhered to respectively on an above-mentioned surface and another surface, and the integrated back of the above-mentioned the 1st and the 2nd resin plate is constituted above-mentioned flex section.
2. flexible printed circuit board according to claim 1 is characterized in that: the above-mentioned the 1st or the 2nd resin plate has insulating properties by many pieces and flexual resin plate is laminated.
3. flexible printed circuit board according to claim 1 is characterized in that:
On the above-mentioned the 1st or the 2nd resin plate, form wiring figure,
Above-mentioned wiring figure by forming on the above-mentioned the 1st or the 2nd resin plate is electrically connected to each other the wiring figure of many pieces of above-mentioned rigid circuit boards.
4. flexible printed circuit board according to claim 1 is characterized in that: the above-mentioned the 1st or the 2nd resin plate is made of epoxy resin.
5. flexible printed circuit board according to claim 1 is characterized in that: the above-mentioned the 1st or the 2nd resin plate is made of vistanex.
6. flexible printed circuit board according to claim 1 is characterized in that: the above-mentioned the 1st or the 2nd resin plate is made of polyimide resin.
7. the manufacture method of a flexible printed circuit board, the constituting of this circuit board connects a plurality of rigid circuit boards with having the flex section that insulating properties and flexual resin plate constitute, and it is characterized in that:
This manufacture method comprises at least:
The 1st operation with above-mentioned flex section corresponding opening portion is set on the rigid circuit board of regulation shape;
The 2nd operation of implementing chamfer machining in a surface and another surperficial marginal portion of above-mentioned peristome one side of above-mentioned rigid circuit board, if the width that the angle that the surface of above-mentioned chamfering and above-mentioned rigid circuit board constitutes is θ, establish the thickness direction of the not chamfered part of above-mentioned rigid circuit board on the end face of above-mentioned flex section one side is α, then θ in being no more than 35 ° scope and α be no more than in the scope of 0.3mm;
The the bonding the 1st and the 2nd resin plate respectively on a surface of above-mentioned rigid circuit board and another surface, the 3rd operation that makes it to cross over above-mentioned peristome; And
Make the above-mentioned the 1st and the 2nd resin plate incorporate the 4th operation in above-mentioned peristome.
8. the manufacture method of flexible printed circuit board according to claim 7 is characterized in that:
The the above-mentioned the 1st or the 2nd resin plate is made of epoxy resin, vistanex or polyimide resin;
Above-mentioned the 3rd operation is the operation of the above-mentioned the 1st and the 2nd resin plate of bonding semi-cured state;
Above-mentioned the 4th operation is to adopt the pressing method to make the above-mentioned the 1st and the 2nd resin plate integrated in above-mentioned peristome, simultaneously the operation that makes it to solidify by heating.
CNB031385680A 2002-12-13 2003-05-29 Flexible printed circuit board and producing method thereof Expired - Fee Related CN1258307C (en)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2002361904 2002-12-13
JP361904/2002 2002-12-13
JP2003045507 2003-02-24
JP045507/2003 2003-02-24
JP2003090301 2003-03-28
JP090301/2003 2003-03-28

Publications (2)

Publication Number Publication Date
CN1507312A CN1507312A (en) 2004-06-23
CN1258307C true CN1258307C (en) 2006-05-31

Family

ID=32512131

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB031385680A Expired - Fee Related CN1258307C (en) 2002-12-13 2003-05-29 Flexible printed circuit board and producing method thereof

Country Status (4)

Country Link
US (1) US6841738B2 (en)
KR (1) KR100521071B1 (en)
CN (1) CN1258307C (en)
TW (1) TWI233771B (en)

Families Citing this family (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005027597A1 (en) * 2003-09-10 2005-03-24 Unitika Ltd. Substrate for flexible printed wiring board and method for manufacturing same
JP4468691B2 (en) * 2003-12-26 2010-05-26 オリンパス株式会社 Ultrasonic signal cable connector device
TW200638811A (en) * 2004-09-21 2006-11-01 Ibiden Co Ltd Flexible printed wiring board
DE102005035589A1 (en) * 2005-07-29 2007-02-01 Polyic Gmbh & Co. Kg Manufacturing electronic component on surface of substrate where component has two overlapping function layers
KR100722606B1 (en) * 2005-09-12 2007-05-28 삼성전기주식회사 Manufacturing method of copper clad laminate for Via on pad
JP4703386B2 (en) * 2005-11-30 2011-06-15 富士通株式会社 Foldable information processing device
JP4849908B2 (en) * 2006-02-27 2012-01-11 株式会社フジクラ Rigid board connection structure
US20070208396A1 (en) * 2006-03-03 2007-09-06 Gary Whatcott Systems and methods for providing a dynamic light pad
US20070208289A1 (en) * 2006-03-03 2007-09-06 Jay Walther Systems and methods for providing light therapy traction
US20080047135A1 (en) * 2006-08-28 2008-02-28 Chipstack Inc. Rigid flex printed circuit board
WO2008029813A1 (en) * 2006-09-04 2008-03-13 Nec Corporation Wiring board composite body, semiconductor device, and method for manufacturing the wiring board composite body and the semiconductor device
US8188372B2 (en) * 2006-09-21 2012-05-29 Daisho Denshi Co., Ltd. Flex-rigid printed wiring board and manufacturing method thereof
KR101442276B1 (en) * 2006-10-24 2014-09-22 파나소닉 주식회사 Printed wiring board, method for manufacturing printed wiring board, and electric device
JP4840132B2 (en) * 2006-12-26 2011-12-21 株式会社デンソー Multilayer substrate manufacturing method
JPWO2008102795A1 (en) * 2007-02-20 2010-05-27 日立化成工業株式会社 Flexible multilayer wiring board
US7615860B2 (en) * 2007-04-19 2009-11-10 Advanced Flexible Circuits Co., Ltd. Rigid-flex printed circuit board with weakening structure
TW200906263A (en) * 2007-05-29 2009-02-01 Matsushita Electric Ind Co Ltd Circuit board and method for manufacturing the same
US7829796B2 (en) * 2007-11-06 2010-11-09 The Boeing Company Circuit joining assembly materials for multi-layer lightning protection systems on composite aircraft
CN101910918A (en) * 2007-12-10 2010-12-08 聚合物视象有限公司 The electronic installation that comprises flexible region with specific curvature district
CN101720568B (en) * 2008-01-22 2012-01-04 索尼化学&信息部件株式会社 Method for manufacturing substrate for mounting component thereon, and substrate for mounting component thereon
JP5161617B2 (en) * 2008-03-03 2013-03-13 日本メクトロン株式会社 Flexible circuit board and manufacturing method thereof
US20090277670A1 (en) * 2008-05-10 2009-11-12 Booth Jr Roger A High Density Printed Circuit Board Interconnect and Method of Assembly
KR101208379B1 (en) 2008-05-19 2012-12-05 이비덴 가부시키가이샤 Wiring board and method for manufacturing the same
CN102090159B (en) * 2008-07-16 2013-07-31 揖斐电株式会社 Flex-rigid wiring board and electronic device
KR101044200B1 (en) * 2009-09-25 2011-06-28 삼성전기주식회사 A rigid-flexible circuit board and a method of manufacturing the same
TW201127246A (en) * 2010-01-22 2011-08-01 Ibiden Co Ltd Flex-rigid wiring board and method for manufacturing the same
US8493747B2 (en) * 2010-02-05 2013-07-23 Ibiden Co., Ltd. Flex-rigid wiring board and method for manufacturing the same
US8759687B2 (en) * 2010-02-12 2014-06-24 Ibiden Co., Ltd. Flex-rigid wiring board and method for manufacturing the same
CN102009515B (en) * 2010-07-21 2013-01-02 广东生益科技股份有限公司 Two-layer-method double-sided flexible CCL (Copper-Clad Laminate) and manufacture method thereof
WO2012147484A1 (en) * 2011-04-26 2012-11-01 株式会社村田製作所 Rigid-flexible substrate and method for manufacturing same
US20120325524A1 (en) * 2011-06-23 2012-12-27 Ibiden Co., Ltd. Flex-rigid wiring board and method for manufacturing the same
EP2547182A1 (en) * 2011-07-15 2013-01-16 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Method of manufacturing a printed circuit board or a sub-assembly thereof as well as printed circuit board or a sub-assembly thereof and use thereof
JP5887790B2 (en) * 2011-09-21 2016-03-16 ソニー株式会社 Display device and electronic device
US8957531B2 (en) 2011-10-20 2015-02-17 International Business Machines Corporation Flat laminate, symmetrical test structures and method of use to gauge white bump sensitivity
JP5406907B2 (en) * 2011-11-28 2014-02-05 株式会社フジクラ Printed wiring board
WO2015015975A1 (en) * 2013-07-30 2015-02-05 株式会社村田製作所 Multilayer substrate and method for manufacturing multilayer substrate
CN103491705B (en) * 2013-09-27 2017-04-05 深圳莱宝高科技股份有限公司 A kind of flexible circuit board
KR102142521B1 (en) * 2013-12-26 2020-08-07 삼성전기주식회사 Rigid flexible printed circuit board and method of manufacturing the same
KR20150083278A (en) * 2014-01-09 2015-07-17 삼성전기주식회사 Multilayered substrate and method of manufacturing the same
WO2017051649A1 (en) * 2015-09-25 2017-03-30 株式会社村田製作所 Antenna module and electronic device
CN105590559A (en) * 2016-03-07 2016-05-18 京东方科技集团股份有限公司 Display device and manufacturing method thereof
CN107404797B (en) * 2016-05-18 2019-06-11 庆鼎精密电子（淮安）有限公司 Multilayer circuit board and preparation method thereof with segment difference structure
CN107484323B (en) * 2016-06-07 2019-09-20 鹏鼎控股(深圳)股份有限公司 Multi-layer flexible circuit board and preparation method thereof
CN105934093A (en) * 2016-07-20 2016-09-07 苏州福莱盈电子有限公司 Flexible-rigid combined printed circuit board
CN209693203U (en) 2016-12-27 2019-11-26 株式会社村田制作所 Multilager base plate and electronic equipment
KR20190099709A (en) * 2018-02-19 2019-08-28 삼성전기주식회사 Printed circuit board
CN110536567B (en) * 2018-05-25 2021-02-09 庆鼎精密电子（淮安）有限公司 Manufacturing method of rigid-flexible circuit board
CN108469244B (en) * 2018-06-22 2020-05-05 广州兴森快捷电路科技有限公司 Prepreg thickness measuring and calculating method
KR102561936B1 (en) * 2018-11-14 2023-08-01 삼성전기주식회사 Printed circuit board
CN110012616B (en) * 2019-05-15 2020-06-23 江苏联康电子有限公司 Manufacturing method of rigid-flex board
KR20220012075A (en) * 2020-07-22 2022-02-03 삼성전기주식회사 Printed circuit board
CN114982386A (en) * 2020-12-25 2022-08-30 京东方科技集团股份有限公司 Flexible circuit board and display device

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3832769A (en) * 1971-05-26 1974-09-03 Minnesota Mining & Mfg Circuitry and method
JPS5671990A (en) 1979-11-19 1981-06-15 Tokyo Shibaura Electric Co Method of manufacturing rigid flexible composite printed circuit board
JPH0434993A (en) 1990-05-30 1992-02-05 Sekisui Chem Co Ltd Manufacture of multilayer printed wiring board having flexible part
US5262594A (en) * 1990-10-12 1993-11-16 Compaq Computer Corporation Multilayer rigid-flex printed circuit boards for use in infrared reflow oven and method for assembling same
JP2708980B2 (en) 1991-09-26 1998-02-04 シャープ株式会社 Multi-layer flexible printed wiring board
JP3462230B2 (en) 1993-01-13 2003-11-05 イビデン株式会社 Manufacturing method of printed wiring board
JPH07135375A (en) * 1993-11-10 1995-05-23 Mitsui Toatsu Chem Inc Rigid flex wiring board and its production
JPH08107266A (en) * 1994-10-04 1996-04-23 Cmk Corp Printed-wiring board
JP2606177B2 (en) * 1995-04-26 1997-04-30 日本電気株式会社 Printed wiring board
JPH0983092A (en) * 1995-09-12 1997-03-28 Seiko Epson Corp Reinforcing tape
JPH1084014A (en) * 1996-07-19 1998-03-31 Shinko Electric Ind Co Ltd Manufacture of semiconductor device
KR100278609B1 (en) * 1998-10-08 2001-01-15 윤종용 Printed circuit board
JP4276740B2 (en) * 1999-07-22 2009-06-10 日東電工株式会社 Multilayer wiring board

Also Published As

Publication number Publication date
TW200410621A (en) 2004-06-16
TWI233771B (en) 2005-06-01
KR20040053734A (en) 2004-06-24
CN1507312A (en) 2004-06-23
KR100521071B1 (en) 2005-10-14
US6841738B2 (en) 2005-01-11
US20040112632A1 (en) 2004-06-17

Similar Documents

Publication Publication Date Title
CN1258307C (en) Flexible printed circuit board and producing method thereof
CN1288947C (en) Multi-layer wire distributed substrate and mfg method
CN1882224A (en) Wiring board and method for manufacturing the same
CN1191742C (en) Heat transfer substrate and method for mfg. same
CN1765161A (en) Rigid-flex wiring board
CN1123015C (en) Resistor and its producing method
CN1873935A (en) Method of fabricating wiring board and method of fabricating semiconductor device
CN1674269A (en) Interlayer member used for producing multi-layer wiring board and method of producing the same
CN1812088A (en) Multi-level semiconductor module and method for fabricating the same
CN101066005A (en) Multilayer wiring board and method for manufacturing same
CN1608100A (en) Resin composition, prepreg, laminate, and semiconductor package
CN1870857A (en) Shielded electronic circuit unit and method of manufacturing the same
CN1578589A (en) Wiring substrate for intermediate connection and multi-layered wiring board and their production
CN1454045A (en) Wiring transfer sheet material and producing method thereof, wiring substrate and producing method thereof
CN1723747A (en) Board pieces and composite wiring boards using the board pieces
CN1374827A (en) Multilayer base plate with holes for assembly and its producing method
CN1882218A (en) Substrate with composite medium and multilayer substrate made by the same
CN1874648A (en) Wiring board and manufacturing method of wiring board
CN1171167A (en) Composite intermediate connecting element of microelectronic device and its production method
CN1440232A (en) Wiring membrane connector and manufacture thereof, multilayer wiring substrate manufacture
CN1947475A (en) Printed wiring board assembled panel, unit sheet for mounting printed wiring board, rigid-flexible board and method for manufacturing them
CN1339940A (en) Multiplayer circuit base and its producing method
CN1344014A (en) Semiconductor device and semiconductor assembly
CN1106977A (en) Metallic foil with adhesion promoting layer
CN1574027A (en) Wired circuit board

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: MEIKO CO., LTD.

Free format text: FORMER OWNER: VICTOR COMPANY OF JAPAN

Effective date: 20080613

C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20080613

Address after: Kanagawa

Patentee after: Meiko Electronics Co., Ltd.

Address before: Yokohama City, Kanagawa Prefecture, Japan

Patentee before: Victory Co., Ltd.

C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20060531

Termination date: 20140529