CN1257048C - Monitoring controller for mould of injection moulding machine - Google Patents
Monitoring controller for mould of injection moulding machine Download PDFInfo
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- CN1257048C CN1257048C CN 03110704 CN03110704A CN1257048C CN 1257048 C CN1257048 C CN 1257048C CN 03110704 CN03110704 CN 03110704 CN 03110704 A CN03110704 A CN 03110704A CN 1257048 C CN1257048 C CN 1257048C
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- injection molding
- monitoring device
- molding machine
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/84—Safety devices
- B29C45/844—Preventing damage caused by obstructions or foreign matter caught between mould halves during mould closing, e.g. moulded parts or runners
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The mold monitoring device 1 for an injection molding machine which can pick up a cavity position Xc of an opening mold C and distinguish the cavity position Xc state via the image processing. The invention is provided with a light emitting section 2 emitting light L other than visible light to a cavity position Xc, an image pickup section 5 for picking up the light L reflected from the cavity position Xc through a filter 3 cutting off the visible light with an image sensor 4, and an image processing section 6 for discriminating the condition of the cavity position Xc by the image processing based on an image signal obtained from the image sensor 4.
Description
Technical field
The present invention relates to be made a video recording and handle the supervising device of the injection molding machine mould of differentiating die cavity position state by image in the die cavity position of the mould opened.
Background technology
Their brightness of benchmark image comparison that television eye takes the situation of mould for image and pre-stored has been known to have or not the method for moulded work in the detection mould; but this method can be because the influence of the ON/OFF of electric light, outer light cause the light and shade (brightness) of mould machine periphery when changing, and will cause normal condition is differentiated for unusual or abnormality differentiated be normal maloperation problem.
On the other hand, in order to address the above problem, by imageing sensor the mold monitoring device (method for monitoring) of the injection molding machine of differentiating die cavity position state is handled simultaneously by the imageing sensor shooting in the die cavity position of the mould opened through image, also can from day disclosure special permission communique NO.63 (1988)-No. 126718 communique, know.
Method for monitoring in the above-mentioned communique carries out in the following manner: the image of mould is divided into pixel; Survey the brightness of each pixel; With image binaryzation, be as benchmark with a binaryzation brightness that presets then at this; The binary image that the two-value of trying to achieve is like this turned to the normal condition of the image of white and black and pre-stored compares, detect the darkest brightness of intending in the detected image entire image this moment, when this darkest brightness is promptly ended injection-molded operation in addition in the default the darkest brightness range of allowing, and when this darkest brightness in default allowing in the darkest brightness range, then the darkest brightness ratio in all pixels of normal condition image of the darkest brightness in the detected image entire image and pre-stored has been.If this luminance difference more than feasible value, is just done increase and decrease according to this luminance difference and is regulated to carry out the binaryzation of detected image.
But also there is the following problem that should solve in above-mentioned method for monitoring (monitoring arrangement).
The first, owing on principle, can not avoid the influence that mould machine periphery light and shade changes, so can not eliminate maloperation fully.Limited the raising of reliability and security.
The second, when image is handled, to do processing especially and might reduce processing accuracy for the influence of proofreading and correct light and shade.
Summary of the invention
The object of the present invention is to provide and to get rid of mould machine periphery light and shade with the influence of moulded work color, prevent the mold monitoring device of the injection molding machine of maloperation and raising reliability and security reliably from principle.
Another object of the present invention is to provide the monitoring arrangement that can make image handle the injection molding machine mould of summary and high precision int.
To achieve these goals, the invention provides a kind of mold monitoring device of injection molding machine, comprise: image pickup part, be used for being made a video recording in the die cavity position of the mould opened, image processing part, be used for handling by image and differentiate die cavity position state, it is characterized in that also comprising: the light emission part is used for shining above-mentioned die cavity position with the light beyond the luminous ray; Image pickup part is used for and will be made a video recording by imageing sensor from the light of above-mentioned die cavity position reflection by the optical filter by luminous ray; And image processing part, the picture signal that is used for trying to achieve based on above-mentioned imageing sensor is differentiated above-mentioned die cavity position state through processes pixel.
Go up according to this and arrange, the light beyond the luminous ray is shone the die cavity position from the light emission part.On the other hand, by by the optical filter of luminous ray and by the shooting of the imageing sensor the image pickup part, the imageing sensor picture signal of trying to achieve sends image processing part to thus simultaneously from the light of die cavity position reflection.At image processing part, carry out processes pixel based on picture signal, and can differentiate moulded work whole or a part of to have deny the state at die cavity position such as residual.So just the influence of having got rid of mould machine periphery light and shade from principle is the influence that visible light causes.
Description of drawings
Fig. 1 is the plane of the state in the injection molding machine that the mold monitoring device of most preferred embodiment of the present invention is installed to.
Fig. 2 is the front view of light emission part in this mold monitoring device.
Fig. 3 is the plane of image pickup part in this mold monitoring device.
Fig. 4 is the front view of the state in the injection molding machine that is installed in this mold monitoring device.
Fig. 5 is the performance plot of the light intensity of the light that the light emission part sends in this mold monitoring device with respect to the IR wavelength cell relation.
Fig. 6 is the block diagram of electric system in this mold monitoring device.
Fig. 7 is the image processing spec figure of this mold monitoring device.
Fig. 8 shows that bright this mold monitoring device once monitors the flow chart of step in the processing.
Fig. 9 shows that bright this mold monitoring device secondary monitors the flow chart of step in the processing.
Concrete form of implementation
Below with reference to accompanying drawing in detail most preferred embodiment of the present invention is described in detail.These accompanying drawings are to be used for being convenient to understand the present invention but not limitation of the present invention.In addition, for ease of clearly highlighting the present invention, known part is then omitted its detailed description.
The structure of the mold monitoring device 1 of this embodiment at first is described with reference to figure 1～6.
Fig. 1 and 4 shows the part of the injection molding machine M of bright installation 3 mold monitoring devices 1.Injection molding machine M has mold closing mechanism MC, and this mold closing mechanism MC comprises fixed disk 11, be located at four pull bars 12 between this fixed disk 11 and the not shown pressure take-up reel, make slidably movable plates 13 of supporting for these four pull bars.On this fixed disk 11 fixed mould Cc is installed, and moveable die Cm is installed on movable plate 13, fixed mould Cc and moveable die Cm constitute mould C thus.So movable plate 13 is moved by not shown driving mechanism advance and retreat with respect to fixed disk 11, and can carry out mold closing, matched moulds and the die sinking of mould C.In addition, Mi is an injection device, the die cavity of Cf (Fig. 4 etc.) expression mould C.
On the other hand, mold monitoring device 1 has: the light emission part 2 that the light L beyond the luminous ray such as infrared ray Li are transmitted into film chamber position Xc; By optical filter 3 (Fig. 3) by luminous ray, the image pickup part 5 that the infrared ray Li (regular reflection light Lr) that film chamber position Xc is reflected is made a video recording by imageing sensor 4.
Light emission part main body 23 has the flat rectangular-shaped casing that recording quantity is arranged 25 of formation.In this casing 25, be provided with and be arranged with many light transmitting substrates 26 that send ultrared infrarede emitting diode 7.So just, having constituted becomes the integrated planar luminous body E of each of spot light infrarede emitting diode 7.The size (shape) of this planar luminous body E as shown in Figure 4, and is selected corresponding to the monitoring range A relative with die cavity position Xc, can consider that especially with respect to monitoring range A be identical or bigger area.At this moment these infrarede emitting diodes 7 are preferably got as shown in Figure 2 and are staggered.According to this structure, just can improve the outer uniformity that can also improve illumination of illumination.Have again, in casing 25, be provided with and then can suppress the pattern that mould C internal cause grinds with respect to radiative diffuser plate and cause catoptrical decay, can carry out uniform and stable irradiation simultaneously.Fig. 5 shows the relation of the wave-length coverage of the infrared ray Li that understands that infrarede emitting diode 7 (light emission part 2) sends to light intensity, and with contrast with visible light.
On the other hand, image pickup part 5 is installed on the opposing party's the side 11g of fixed disk 11, and this setting height(from bottom) makes consistent with the height of die cavity position Xc as shown in Figure 4.Image pickup part 5 has the supporting device 31 that is installed on the 11q of side as shown in Figure 3.This supporting device 31 has: be fixed to installation portion 31a on the 11q of side by a plurality of bolts 32; The carriage 31b of supporting image pickup part main body 33; Position-regulation portion 31c between this carriage 31b and installation portion 31a.Like this, by regulating the combination of bolt 34 and slotted hole 35, can make carriage 31b adjust the position along fore-and-aft direction with respect to installation portion 31a.Carriage 31b has a pair of supporting slice 31S, the 31S that curves the right angle on both sides (upper and lower sides), supporting image pickup part main body 33 between this supporting slice 31S and 31S.Just,, support by the installation screw 37,37 that screws togather by each supporting slice 31S, 31S with the side (top and bottom) of image pickup part main body 33.Thus, by regulating the degree of tightness that screw 37,37 is installed, can set the camera angle of (change) image pickup part main body 33.
Like this, in on the side 11p that photo-emission part 2 is installed to fixed disk 11 1 sides among the mold closing mechanism Mc, if image pickup part 5 is installed on fixed disk 11 the opposing party's the side 11q, then image pickup part 5 can obtain from the regular reflection light Lr of the infrared ray Li of light emission part 2 emission, also promptly equals the reverberation that this reverberation was produced with respect to angle of reflection condition following time of this datum axis at the light of light emission part 2 emissions with respect to the incidence angle of datum axis.
Image pickup part main body 33 has the box portion 9 that forms cuboid and include auxiliary circuit 8, with respect to this box portion 9 detecting means 10 with imageing sensor 4 is installed by predetermined angular R.By setting this angle R, can reduce image pickup part 5 towards laterally projecting degree.Detecting means 4 also is provided with learns 38, is provided with optical filter 3, lens 39 by luminous ray in this learns in 38 from front to back in turn, establishes this imageing sensor 4 in the rear of this optics tube 38.As imageing sensor 4, preferably adopt the CmOS imageing sensor that easily reduces power consumption, miniaturization and cost degradation.
Show the structure of understanding power system among Fig. 6.41 is the control part that is connected with imageing sensor 4, the input/output port of 42 these control parts 41 of expression, and this control part 41 is located in the box portion 9 of image pickup part main body 33 as above-mentioned auxiliary circuit 8 with input/output port 42.Infrarede emitting diode 7 is connected with control part 41 by input/output port 42, and the mould machine controller 43 that is built in injection molding machine M then is connected with control part 41 by input/output port 42.In addition, 41 of control parts link to each other with all-purpose computer (personal computer) PC through USB cable 44.This all-purpose computer PC has constituted according to the picture signal DV from imageing sensor 4, handles the image processing part 6 of differentiating die cavity position Xc state by image.
The using method and the operation of the mold monitoring device 1 of these embodiment are described referring to Fig. 1～9 below.
At first set the angle of light emission part main body 23 and image pickup part main body 33.Now but the position with opened dynamic model Cm is made as solid line position shown in Figure 1.Under this state, be set at by the angle (irradiating angle) of the infrared ray Li of light emission part main body 23 emission that can to shine film chamber position Xc be the whole of monitoring range A shown in Figure 4.At this moment irradiating angle is easily set by degree of tightness set screw 24,24.Like this, infrared ray Li promptly gets oblique irradiation die cavity position Xc.
Next sets the camera angle of image pickup part main body 33.At this moment, as shown in Figure 1, set the regular reflection light Lr that enables from the infrared ray Li of film chamber position Xc reflection for and make a video recording.By detecting reflection differences, reduce the influence of the next light of other angles so can improve the S/N ratio to this regular reflection light Lr shooting.In addition, by degree of tightness screw 37,37 is installed and is set camera angle easily.Aforementioned angle has, even but when the position of dynamic model Cm had been done to be altered among Fig. 1 with the Cma shown in the dummy line, Cmb position during with die sinking, also can easily be set with identical operations again.
Then carry out the setting of Benchmark brightness.There is the state of die cavity cf wherein in the moulded work of taking regular (qualified) this moment, as the first Benchmark brightness data entry, to the state shooting of the die cavity cf that do not have moulded work, logins as second Benchmark brightness simultaneously.During login, at first connect infrarede emitting diode T.So infrared ray Li shines die cavity position Xc, by the Xc regular reflection of die cavity position, the infrared ray Li that is reflected (regular reflection light Lr) incides the detecting means 10 of image pickup part main body 33, imaging on imageing sensor 4.At this moment, the luminous ray of mould machine periphery is that optical filter 3 ends, and is infrared ray (regular reflection light Lr) imaging on imageing sensor 4 of being reflected.Then, the picture signal Dv by imageing sensor 4 is tried to achieve logins in the memory of all-purpose computer PC by control part 41.
Method for monitoring in the actual moulding technology below is described.In service at injection molding machine M offers all-purpose computer PC from the various control signals of mould machine controller 43 by input/output port 42 and control part 41.Establish this moment through having finished the die sinking operation of mould C behind injection molding process operation and the refrigerating work procedure.All-purpose computer PC after the die sinking end of job, give its with the die sinking end signal thus PC once monitor processing.This monitors that once handling is that the supervision of carrying out before the injection operation is handled after die sinking, can carry out whether existing in the moulded work not the filling part bad differentiation of molding that grades thus.
Fig. 8 shows the bright above-mentioned flow chart that once monitors the step of handling.At first, after the die sinking end signal was sent to all-purpose computer PC, sign on was taken in all-purpose computer PC output, connected infrarede emitting diode 7 in the illuminating part, made image pickup part 5 startings simultaneously and began shooting (step S1).As a result, light emission part L projects die cavity position Xc with infrared ray Li, and in the Xc regular reflection of die cavity position.The infrared ray Li that is reflected (regular reflection light Lr) incides in the detecting means 10 of image pickup part main body 33 imaging on imageing sensor 4.At this moment, the visible light of mould machine periphery has only the infrared ray Li (regular reflection light Lr) of reflection to shine on the imageing sensor 4 for my sheet 3 of filter ends.Then, the picture signal DV that derives from imageing sensor 4 flows to all-purpose computer PC by control part 41.In addition, owing to adopt infrared ray Li, also different even be when light emission part 2 is connected with luminous ray, can not make the operator have strange and unplessantness displeasure.
On the other hand, poor (the step S2) that obtains both by more initial pixel intensity of all-purpose computer PC and aforesaid first Benchmark brightness.Again with the difference of being tried to achieve and threshold ratio (step S3).At this moment, if when carrying out normal molding, " difference≤threshold value " then arranged, but when existing filling bad, then this part becomes " difference＞threshold value ", and counts (step S4) as distinguished point in a part.Later on dimension is continuous in turn repeats same processing to pixel, is performed until last pixel (step S5, S2, or the like).
When all-purpose computer PC received the picture signal DV of a picture part, all-purpose computer PC just exported the shooting END instruction, turned off infrarede emitting diode 7 in the light emission part, stopped the work of image pickup part 5, finished shooting (step S6).Like this, just connect when just making a video recording, can reduce power consumption owing to light emission part 2.All-purpose computer PC with count value (aggregate value) Nc of the distinguished point that obtains be used for differentiating wrong and predefined mistake intensity level (level) Ne of mistake relatively, when " Nc＞Ne ", promptly conclude mistake has taken place, end the work of injection molding machine M, carry out mistake simultaneously and show equal difference fault reason (step S7, S8).On the other hand, the situation of mistake is not taking place, again count value Nc and the alarm intensity level Na that presets are compared, when " Nc＞Na ", then be right after the processing before mistake takes place, promptly end the work of injection molding machine M, carry out alarm processing (step S9, S10) such as alarm demonstration as the preparation warning.In contrast, when once monitoring result, just transfer to secondary and monitor processing (step S11) for just often.In this monitor to handle and since carried out with respect to the differentiation of the threshold value of mistake and with respect to the differentiation of the Benchmark brightness (level) of distinguished point count value the two, so can improve discrimination precision.
Fig. 9 shows bright flow process of carrying out the step of this after-treatment.This secondary monitors that handling is to inject post-job supervision to handle, and can differentiate injection in view of the above and whether carry out.If will inject end signal from mould machine controller 43 flows to all-purpose computer PC, then all-purpose computer PC exports the shooting sign on now, connects the infrarede emitting diode 7 of light emission part 2, starts image pickup part 5 simultaneously and begins shooting (step S21).As a result, infrared ray Li is projected die cavity position Xc, and go up regular reflection in die cavity position Xc from light emission part 2.In addition, the infrared ray Li of reflection (regular reflection light Lr) incides the sensor portion 10 of image pickup part main body 33 and imaging on imageing sensor 4.At this moment, the luminous ray of mould machine periphery is that optical filter 3 ends, and is infrared ray Li (regular reflection light Lr) imaging on imageing sensor 4 of being reflected.The picture signal Dv that obtains from imageing sensor 4 flows to all-purpose computer PC through control part 41.
On the other hand, all-purpose computer PC when initial pixel intensity and aforesaid second Benchmark brightness relatively, ask both differences (step S22).With the difference of trying to achieve and threshold ratio (step S23).At this moment, if carry out be normal molding the time then " difference≤threshold value ", but exist filling bad when a part, then this part becomes " difference＞threshold value ", as distinguished point counting (step S24).Later continue in turn pixel is repeated same processing, uprightly proceed to last pixel (step S25, S22).Then, if all-purpose computer PC receives the picture signal Dv of a picture part, infrarede emitting diode 7 in the black out emission part is closed in this all-purpose computer PC output shooting END instruction, stops the work of image pickup part 5, finishes shooting (step S26).
All-purpose computer PC mistake brightness Nx that count value (aggregate value) Nc of the distinguished point of trying to achieve is default with being used to differentiate mistake relatively, when " Nc＞Nx ", if the work that mistake promptly stops injection molding machine M takes place, carry out mistake and show equal difference fault reason (step S27, S28).For example show the bright die cavity position Xc that does not wherein have the die cavity Cf of moulded work with Fig. 7 (a), Fig. 7 (b) then shows the bright state that remaining β of moulded work arranged, and at this moment, remaining β of formed products makes a video recording as distinguished point.This moulded work remnants β of portion becomes the part that different reflectivity is arranged with the state of die cavity Cf as a result.So the data De of mistake shown in Fig. 7 (c) is fully as distinguished point counting, " Nc＞Nx " arranged thus and carries out and above-mentionedly monitor that once handling identical mistake handles.On the other hand, when just often carrying out next shooting processing, then transform to and once monitor processing (step S29, S30) according to treatment step shown in Figure 8.The constipation bundle monitors and handles (step S29) next time when not making a video recording.
Mold monitoring device 1 according to this embodiment, during by 2 pairs of die cavity positions of light emission part Xc irradiation infrared ray Li, is the imageing sensor shooting from the infrared ray Li (regular reflection light Lr) of die cavity position Xc reflection by the optical filter 3 by luminous ray, therefore can get rid of the influence of luminous ray and the influence of moulded work color from principle.The result can prevent maloperation reliably, improve reliability and security, also owing to do not need unnecessary processing such as corrections, can make image processing summary and high precision int.
Though above explain embodiment, but the present invention is not limited to described embodiment, about structure, shape, data, material and the numerical value etc. of details, in the scope that does not break away from spirit of the present invention, can note change, can append as required and delete simultaneously.For example among the embodiment, may not be defined in infrared ray and also can adopt other light such as ultraviolet ray and far infrared as the light beyond the luminous ray.In addition, illustrative in light emission part 2 is the situation that adopts a plurality of light emitting diodes 7, is not beneficial to other luminescent devices but do not get rid of.Have again, shown in bright be all-purpose computer (personal computer) as image processing part 6, but also utilizable energy is built in microcomputer in the box portion 9 etc.
Claims (13)
1, a kind of mold monitoring device of injection molding machine, comprise: image pickup part, be used for being made a video recording in the die cavity position of the mould opened, image processing part, be used for handling by image and differentiate die cavity position state, it is characterized in that also comprising: the light emission part is used for shining above-mentioned die cavity position with the light beyond the luminous ray; Image pickup part is used for and will be made a video recording by imageing sensor from the light of above-mentioned die cavity position reflection by the optical filter by luminous ray; And image processing part, the picture signal that is used for trying to achieve based on above-mentioned imageing sensor is differentiated above-mentioned die cavity position state through processes pixel.
2, the mold monitoring device of injection molding machine according to claim 1 is characterized in that, above-mentioned light is infrared ray.
3, the mold monitoring device of injection molding machine according to claim 1 is characterized in that, above-mentioned smooth emission part is to arrange a plurality of light emitting diodes and form in the face selected corresponding to the monitoring range at above-mentioned die cavity position.
4, the mold monitoring device of injection molding machine according to claim 3 is characterized in that, above-mentioned smooth emission part has the casing portion that is provided with above-mentioned a plurality of light emitting diodes and is provided with diffuser plate with respect to the light of being launched in the inside of this casing portion.
5, the mold monitoring device of injection molding machine according to claim 1 is characterized in that, above-mentioned smooth emission part is with the oblique above-mentioned die cavity position that projects of above-mentioned light.
6, the mold monitoring device of injection molding machine according to claim 1 or 5 is characterized in that above-mentioned smooth emission part is to be installed on the side of fixed disk one side in the mold closing mechanism.
7, the mold monitoring device of injection molding machine according to claim 6, it is characterized in that, above-mentioned smooth emission part has the carriage on the side that is installed on said fixing dish one side, in order to change the crevice projection angle of light emission part main body, the side of above-mentioned smooth emission part main body is supported by the screw that the supporting slice that has on this carriage screws togather simultaneously.
8, the mold monitoring device of injection molding machine according to claim 1 is characterized in that, above-mentioned smooth emission part is only connected when shooting.
9, the mold monitoring device of injection molding machine according to claim 1 is characterized in that, above-mentioned image pickup part is to making a video recording from the regular reflection light at above-mentioned die cavity position.
10, the mold monitoring device of injection molding machine according to claim 6 is characterized in that, above-mentioned image pickup part is to be installed on said fixing dish the opposing party's the side.
11, the mold monitoring device of injection molding machine according to claim 10, it is characterized in that, above-mentioned image pickup part is installed on said fixing dish the opposing party's side and comprises supporting device, and this supporting device has the adjustment part, position of the image pickup part main body being adjusted the position along fore-and-aft direction.
12, the mold monitoring device of injection molding machine according to claim 11, it is characterized in that, above-mentioned supporting device has carriage, simultaneously in order to change the camera angle of image pickup part main body, the side of supporting above-mentioned image pickup part main body with the screw that screws togather installation by the supporting member that has on the carriage.
13, according to the mold monitoring device of claim 11 or 12 described injection molding machines, it is characterized in that, above-mentioned image pickup part main body has the box portion of accommodating auxiliary circuit, will have the sensor portion of above-mentioned imageing sensor simultaneously, installs with respect to above-mentioned box portion by predetermined angle is set.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002109355A JP3728423B2 (en) | 2002-04-11 | 2002-04-11 | Mold monitoring device for injection molding machine |
| JP109355/2002 | 2002-04-11 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1449904A CN1449904A (en) | 2003-10-22 |
| CN1257048C true CN1257048C (en) | 2006-05-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 03110704 Expired - Fee Related CN1257048C (en) | 2002-04-11 | 2003-04-11 | Monitoring controller for mould of injection moulding machine |
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| Country | Link |
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| JP (1) | JP3728423B2 (en) |
| CN (1) | CN1257048C (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4146382B2 (en) * | 2004-03-31 | 2008-09-10 | 日精樹脂工業株式会社 | Method for detecting mold closing position of mold clamping device |
| CN100415487C (en) * | 2006-03-07 | 2008-09-03 | 济南杰菲特气动有限公司 | Injection machine |
| JP4448869B2 (en) * | 2007-07-02 | 2010-04-14 | ウシオ電機株式会社 | Mold monitoring device |
| CN102152457B (en) * | 2011-01-31 | 2014-01-08 | 宁波伊士通技术股份有限公司 | Embedded plastic mould protector based on histogram matching |
| CN102303397B (en) * | 2011-08-29 | 2013-05-15 | 厦门伟迪康科技有限公司 | Mold image monitoring method and device for mold forming machine |
| CN103273632A (en) * | 2013-05-24 | 2013-09-04 | 杭州电子科技大学 | Injection moulding machine control system based on function adapter line boxes with CPUs (central processing units) |
| CN104484920B (en) * | 2014-11-19 | 2017-08-04 | 湖南鑫隆模塑科技开发有限公司 | It is a kind of can remote monitoring technique and Intelligent Recognition mould open, the method for mode-lock status |
| CN116277727B (en) * | 2023-04-10 | 2023-08-25 | 宁波永成双海汽车部件股份有限公司 | Nut feeding machine |
-
2002
- 2002-04-11 JP JP2002109355A patent/JP3728423B2/en not_active Expired - Fee Related
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2003
- 2003-04-11 CN CN 03110704 patent/CN1257048C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP3728423B2 (en) | 2005-12-21 |
| JP2003305748A (en) | 2003-10-28 |
| CN1449904A (en) | 2003-10-22 |
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