CN1238723C - Electronic component, and rotating speed sensor using same - Google Patents
Electronic component, and rotating speed sensor using same Download PDFInfo
- Publication number
- CN1238723C CN1238723C CNB011355859A CN01135585A CN1238723C CN 1238723 C CN1238723 C CN 1238723C CN B011355859 A CNB011355859 A CN B011355859A CN 01135585 A CN01135585 A CN 01135585A CN 1238723 C CN1238723 C CN 1238723C
- Authority
- CN
- China
- Prior art keywords
- terminal
- electronic component
- electrostatic induction
- electrically connected
- function
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
- Transmission And Conversion Of Sensor Element Output (AREA)
- Elimination Of Static Electricity (AREA)
- Electronic Switches (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
An electronic component and a rotating speed sensor using same. The electronic component comprises: a function part, a carrier part with a function part mounted at suface thereof, a terminal part having a GND terminal which is electric connected with the function part, a mold resin part having a function part and one end of the terminal part, with the other end of the terminal part projecting outside from a mold resin part, an electrostatic induction part projecting outside from the mold resin part which is electric connected with the GND terminal. Thereby the present invention has a small number of parts items and improced assemblability without requiring sticking of an electrostatic induction part separately on a wiring part.
Description
Technical field
The invention relates to and to play the electronic component of internal protection effect and to use the speed probe of this part static.
Background technology
Open the electronic component of the past of flat 7-147378 communique announcement below in conjunction with the description of drawings spy.
Fig. 7 is the stereographic map of electronic component in the past.End by resin portion 1 begins, protruding power supply terminal 2, lead-out terminal 3 and the GND terminal 4 of being provided with.Being arranged on 3 wiring parts 5 installing on the circuit board (not illustrating) that electronic component uses is electrically connected with scolding tin with an end of power supply terminal 2, lead-out terminal 3 and GND terminal 4 respectively.Establish the electrostatic induction portion 6 with wiring part 5 splits on wiring part 5 in addition, this electrostatic induction portion 6 is through distribution portions 5 and be electrically connected with GDN terminal 4.Electrostatic induction portion 6 has the leading section 7 higher than the resin portion of electronic component.
Below the action of in the past electronic component is described.
The static that produces on the top of electronic component arrives 6 leading section 7 of electrostatic induction portion, arrives GND (not illustrating) from electrostatic induction portion 6 by wiring part 5.Therefore static can not arrive the power supply terminal 2 and the lead-out terminal 3 of electronic component, can not arrive the function portion (not illustrating) of electronic component inside.Its result, electronic component can not break down because of static.
Above-mentioned electronic component will fix the electrostatic induction portion 6 of wiring part 5 and split, the assembling difficulty.
Summary of the invention
The object of the present invention is to provide the few and easy-on electronic component of a kind of part number of packages and use the speed probe of this part.
This electronic component has: the electrostatic induction portion that the portion of terminal that contains the GND terminal, the inside that function portion, surface be provided with the released part of function portion, be electrically connected with function portion is buried casting resin portion that the other end of end of released part and above-mentioned portion of terminal and above-mentioned portion of terminal stretches out underground, stretched out and be electrically connected with above-mentioned GND terminal from above-mentioned casting resin portion.
This speed probe has: connection terminal, the containment circuit board that electronic component, treatment circuit, mounted on surface that the output signal of electronic component is carried out conversion have the circuit board of electronic component and treatment circuit, be electrically connected with portion of terminal and possess connection terminal and the crown cap of the above-mentioned peristome of the resin system shell of peristome, closure.Gap between the front end of electrostatic induction portion and the lid is less than the gap between portion of terminal and the lid.
Brief description of drawings
Fig. 1 is the sectional view of the speed probe of the invention process form.
Fig. 2 be the expression example the speed probe major part, be near the sectional view of the speed probe of the structure electronic component.
Fig. 3 is the sectional view of the electronic component of example.
Fig. 4 is the vertical view of electronic component its released part before ester moulding of example.
Fig. 5 is the sectional view of other speed probe of example.
Fig. 6 is the sectional view of other speed probe of example.
Fig. 7 is the stereographic map of electronic component in the past.
The working of an invention form
Fig. 1 is the sectional view of the speed probe of the invention process form, Fig. 2 be the expression example the speed probe major part, be near the sectional view of the speed probe of the structure electronic component, Fig. 3 is the sectional view of electronic component.
As shown in Figure 3, the function portion 14 that a pair of magnetoresistive element constituted that electronic component 11 has released part 12, the insulation course 13 that constitutes across Si on released part 12 is provided with, the portion of terminal 15 that is constituted by power supply terminal 16 and lead-out terminal 17 and GND terminal 18.Power supply terminal 16, lead-out terminal 17 and GND terminal 18 are electrically connected with function portion 14 by lead 19 respectively.Released part 12 and power supply terminal 16, lead-out terminal 17, GND terminal 18 end separately is embedded in casting resin portion 20.Integrally formed and stretch out from casting resin portion with released part 12 with the electrostatic induction portion 21 that GND terminal 18 is electrically connected.
Thereby need not establish the electrostatic induction portion of split again, can provide the part number of packages the few and high electronic component of assembling performance.In addition, because GND terminal 18 and electrostatic induction portion 21 are arranged at released part 12 integratedly,, protect electronic component to avoid electrostatic influence reliably so electrostatic induction portion 21 is connected reliably with GND terminal 18.
The following electronic component of explanation said structure and use the assemble method of the speed probe of this part.
At first, the fixing insulation course 13 that constitutes by Si on released part 12.
The function portion 14 that vacuum metallizing is shaped and is made of a pair of magnetoresistive element on insulation course 13 then.
Then, with lead 19 with function portion 14 with after power supply terminal 16, lead-out terminal 17 and GND terminal 18 are connected, power supply terminal 16, lead-out terminal 17 and GND terminal 18 and released part 12 are arranged in the forming metal mould (not illustrating).At this moment, as shown in Figure 4, behind forming metal mould (not illustrating) clamping branching portion (ダ イ バ-) 12a,, form electronic component 11 with resin injection molding metal pattern.
The electrostatic induction portion 21 upwards bendings that then, will constitute by the branching portion 12a that is bearing in the metal pattern.Since be branching portion 12a that fixing forming metal mould is used as 21 uses of electrostatic induction portion, therefore, need not establish the electrostatic induction portion 21 of split on the electronic component in addition, can provide the part number of packages few and inexpensive electronic component.
After electronic component 11 has been installed on circuit board 22, installation treatment circuit 23 below circuit board 22.
Then, after circuit board 22 folding and unfoldings are in the shell 24 that is provided with connection terminal 25 in advance integratedly, power supply terminal 16, lead-out terminal 17 and GND terminal 18 on connection terminal 25 and the electronic component 11 are electrically connected with scolding tin respectively.
At last, the peristome with crown cap 26 covering shells 24 that shape through deep-draw in advance then with the leading section bending of pull and stretch, will cover 26 thus and be fixed on the shell 24.
The action of the speed probe that as above forms and assemble below is described.
The position, opposite of lid 26 is provided with gear (not illustrating).Along with the revolution of the jog of this gear, the magnetic flux density that puts on function portion 14 set above the magnet 27 changes.And the variation of this magnetic flux density is exported with sine-shaped output signal.And then the processed circuit 23 of this output signal is transformed into pulse signal, and by in the connection terminal 25 input computing machines, and detected as revolution.
When static when the outside puts on the lid 26 of speed probe, arrive and cover 26 static and reach electrostatic induction portion 21, and by 21 arrival GND terminals 18 and then the arrival GND of electrostatic induction portion.Because static can not arrive power supply terminal 16 and lead-out terminal 17, can not make the electronic component of function portion 14 deterioration in characteristics and use the speed probe of this part because of static so can provide a kind of.
On the speed probe of the invention process form, the gap that the leading section of electrostatic induction portion 21 and lid are 26 is less than power supply terminal 16, lead-out terminal 17 and GND terminal 18 and cover 26 gap.As shown in Figure 5, also electrostatic induction portion 28 can be bent into along with the shape of lid 26 vertical direction deflections so that the end of electrostatic induction portion 28 directly with lid 26 butts.Like this, arrived by the outside and cover 26 static and can not arrive power supply terminal 16 or lead-out terminal 17 mistakenly, its result can guarantee that static is by lid 26 arrival electrostatic induction portions 28.Thereby the speed probe that the characteristic that function portion 14 can be provided can not fluctuate.
In addition, the speed probe of the invention process form is provided with electronic component 11 on circuit board 22, below set handling circuit 23.But also can bury the function portion 14 that is made of magnetoresistive element underground in the inside of casting resin portion 20 and reach the treatment circuit 29 that the output signal of this function portion 14 is carried out conversion as shown in Figure 6, obtain electrostatic protection IC30 thus, this IC30 has effect same.
In addition, the electronic component of the speed probe of example is to bury the function portion 14 that is made of magnetoresistive element in casting resin portion 11 underground.Even if but being embedded in function portion 14 electric capacity, resistance or the coil of casting resin portion 11, electronic component also has same effect.
Also have, the speed probe of example possesses 3 connection terminals, but the quantity of connection terminal is not limit by this.
Claims (7)
1. electronic component has:
Function portion,
The surface be provided with described function portion released part,
The portion of terminal that contains the GND terminal that is electrically connected with described function portion,
Inside bury underground casting resin portion that the other end of end of described released part and described portion of terminal and described portion of terminal stretches out,
The electrostatic induction portion of stretching out and being electrically connected with described GND terminal from described casting resin portion.
2. electronic component as claimed in claim 1 is characterized in that, described GND terminal, described electrostatic induction portion and described released part form one.
3. electronic component as claimed in claim 2 is characterized in that, the branching portion that the fixedly forming metal mould that also have the end of being located at described released part, works as described electrostatic induction portion is used.
4. speed probe has:
The portion of terminal that contains the GND terminal that electronic component, described electronic component have the function portion that contains magnetoresistive element, be electrically connected with described function portion, be electrically connected with described GND terminal and outwardly directed electrostatic induction portion;
The output signal of described electronic component is carried out the treatment circuit of conversion;
Mounted on surface has the circuit board of described electronic component and described treatment circuit;
The connection terminal that is electrically connected with described portion of terminal;
Hold described circuit board and possess connection terminal and the resin system shell of peristome;
Seal the crown cap of the described peristome of described shell,
The front end of described electrostatic induction portion and the gap between the described lid are less than the gap between described portion of terminal and the described lid.
5. speed probe as claimed in claim 4 is characterized in that, described electrostatic induction portion has along the shape of the direction bending vertical with described lid, the end and the described lid butt of described electrostatic induction portion.
6. speed probe has:
Electrostatic protection IC; the portion of terminal that contains the GND terminal that described electrostatic protection IC has the function portion that contains magnetoresistive element, be electrically connected with described function portion, the electrostatic induction portion that the output signal of described function portion is carried out the treatment circuit of conversion, is electrically connected with described GND terminal, and described electrostatic induction portion stretches out:
The connection terminal that is electrically connected with described portion of terminal;
Hold described circuit board, be provided with connection terminal and have the resin system shell of peristome integratedly;
Seal the crown cap of the described peristome of described shell,
The front end of described electrostatic induction portion and the gap between the described lid are less than the gap between described portion of terminal and the described lid.
7. the manufacture method of an electronic component comprises:
The operation that portion of terminal and the function portion that puts at released part are connected with lead,
With described portion of terminal and described released part be arranged on molding metal mold operation,
To after branching portion clamping integrally formed on the described released part, resin be injected the operation of described forming metal mould.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000314863A JP4415477B2 (en) | 2000-10-16 | 2000-10-16 | Electronic components |
| JP314863/00 | 2000-10-16 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1349097A CN1349097A (en) | 2002-05-15 |
| CN1238723C true CN1238723C (en) | 2006-01-25 |
Family
ID=18794053
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB011355859A Expired - Fee Related CN1238723C (en) | 2000-10-16 | 2001-10-16 | Electronic component, and rotating speed sensor using same |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP4415477B2 (en) |
| CN (1) | CN1238723C (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103681650B (en) * | 2012-09-06 | 2016-08-10 | 瑞昱半导体股份有限公司 | Integrated circuit |
-
2000
- 2000-10-16 JP JP2000314863A patent/JP4415477B2/en not_active Expired - Fee Related
-
2001
- 2001-10-16 CN CNB011355859A patent/CN1238723C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2002122411A (en) | 2002-04-26 |
| CN1349097A (en) | 2002-05-15 |
| JP4415477B2 (en) | 2010-02-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: PANASONIC INDUSTRIAL DEVICES (TIANJIN) CO., LTD. Assignor: Matsushita Electric Industrial Co., Ltd. Contract record no.: 2012990000472 Denomination of invention: Electronic component, and rotating speed sensor using same Granted publication date: 20060125 License type: Common License Open date: 20020515 Record date: 20120703 |
|
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20060125 Termination date: 20131016 |
|
| EC01 | Cancellation of recordation of patent licensing contract |
Assignee: PANASONIC INDUSTRIAL DEVICES (TIANJIN) CO., LTD. Assignor: Matsushita Electric Industrial Co., Ltd. Contract record no.: 2012990000472 Date of cancellation: 20160106 |
|
| LICC | Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model |