CN1226313A - Spray-cooling electronic component - Google Patents
Spray-cooling electronic component Download PDFInfo
- Publication number
- CN1226313A CN1226313A CN97196828A CN97196828A CN1226313A CN 1226313 A CN1226313 A CN 1226313A CN 97196828 A CN97196828 A CN 97196828A CN 97196828 A CN97196828 A CN 97196828A CN 1226313 A CN1226313 A CN 1226313A
- Authority
- CN
- China
- Prior art keywords
- fluid
- hole
- cavity
- electronic component
- housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F7/00—Elements not covered by group F28F1/00, F28F3/00 or F28F5/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
- H01L23/4735—Jet impingement
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/02—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by influencing fluid boundary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
Abstract
The apparatus includes a housing (40) having a cavity (26), the cavity sized to enclose an electronic component (10). The housing includes a first layer (72) having a first aperture and a second layer (74) having a second aperture. The second aperture is in communication with the first aperture and in communication with the cavity. The first and second apertures are sized to receive a fluid, atomize the fluid and discharge the atomized fluid (70) into the cavity.
Description
Invention field
The present invention relates generally to the cooling of heat-generating electronic elements, relate to a kind of circuit board arrangement more precisely and be used for the apparatus and method of spray-cooling electronic component.
Background of invention
These are fixed to usually as the lip-deep electronic component of circuit board and so on to resemble integrated circuit, multi-chip module (multi-chip modules), passive component and power transistor, may be the thermal source that needs cooling in normal work period.
Usually electronic component is cooled off by nature or forced air convection, because air has less thermal capacity and thermal transmission coefficient, so forced air convection requires to make a large amount of air flow through element or flow through the thick fin that installs on these elements.But this Air-cooling Process possibly can't provide even refrigeration to electronic component, and undesirable noise or the dirt such as dust may be caused on the element.
Evaporation injection cooling be characterised in that will atomizing drop directly or indirectly be sprayed on the thermal source surface resemble the electronic component.When drop was fallen on the element surface, one deck fluid film was coated on the element, mainly by evaporation of liquid heat was taken away from the surface of element.
Though evaporation injection cooling is a kind of preferred heat dissipating method in many electronic application field, known spraying cooling system is general to adopt custom-designed device with to electronical elements surface transmission fluid, and with the surface removal of fluid from electronic component.Usually, these devices comprise a plurality of parts, install them on the circuit board surface that is fixed with electronic component.Like this, the space on the circuit board may take by injected cooling device, may seal completely before spraying cooling system work, and may be difficult to make electronic component to avoid the interference that is produced by electromagnetic radiation.In addition, known spraying cooling system possibly can't cool off the electronic component that is embedded in enclosure interior such as circuit board effectively.
Therefore, need a kind of apparatus and method that be used for spray-cooling electronic component, this apparatus and method need not an independent device is installed on the surface that is fixed with this electronic component, and number of parts is few, can make electronic component avoid electromagnetic radiation, and can cool off the electronic component that is embedded in circuit board inside.
Summary of the invention
According to an aspect of the present invention, aforementioned need realizes that by a kind of device that is used for spray-cooling electronic component this device comprises the housing that contains cavity, and the size of this cavity is suitable for surrounding an electronic component.This housing comprises the ground floor that contains first hole and contains the second layer in second hole.Second hole communicates with first hole, and communicates with cavity.The size in first hole and second hole is suitable for admitting fluid, atomizing fluids and with the atomizing release of fluid in cavity.
According to a further aspect in the invention, a kind of circuit board arrangement comprises first multilayer that forms first wall.Second multilayer forms second wall.Second wall is coupled on the first wall.The 3rd multilayer forms the 3rd wall.The 3rd wall also is coupled on the first wall.The 4th multilayer forms wall, and wall is coupled on second wall and is coupled on the 3rd wall.First, second, third and wall limit a cavity.In at least some layers in the 4th multilayer at least one hole is arranged.These holes are common to constitute a nozzle, the size of this nozzle be suitable for atomizing fluids and with this release of fluid in cavity.
According to another aspect of the invention, a kind of method that is used for spraying cool electronic assemblies comprises the housing that contains cavity is provided that the size of this cavity is suitable for surrounding this electronic component.This housing comprises the ground floor that contains first hole and contains the second layer in second hole.Second hole communicates with first hole, and communicates with cavity.Then, give first hole with FLUID TRANSPORTATION.First hole and second hole this fluid that atomizes, and with the release of fluid of atomizing in cavity.
Represent and detailed description to the preferred embodiment of the present invention be described that by accompanying drawing it is more obvious that advantage of the present invention will become to one skilled in the art according to following.Such as will be appreciated, the present invention can have other and different embodiment, and its details can be done the each side modification.Therefore, regard as accompanying drawing and description illustrative and not restrictive in fact.
The accompanying drawing summary
Fig. 1 is the perspective view of a typical electronic component.
Fig. 2 is the front view along the line 2-2 of electronic component shown in Figure 1, illustrates element is fixed to typical way on the substrate.
Fig. 3 is an installation drawing according to the preferred embodiment of the invention, and this device is used for holding and sprays electronic component shown in cooling Fig. 1 and 2.
Fig. 4 represents the top view in each hole of nozzle shown in Figure 3.
Preferred embodiment describes in detail
Referring to accompanying drawing, wherein identical digitized representation components identical, Fig. 1 is the perspective view of a typical electronic component 10, this element 10 comprises: a device pedestal or flange (flange) 12; Some terminations 14; Lid 16; And one or more matrix (dies) (not shown), in their tegmentums 16 are encapsulated in.
Fig. 2 is the front view along the line 2-2 of electronic component 10, illustrates with board (carrierplate) 19 element 10 is fixed to a kind of mode on the substrate 18.Substrate 18 preferably includes one or more layers pottery, but also can be epoxy resin, liquid crystal polymer, polytetrafluoroethylene, aluminium oxide, high-temperature resistance plastice or the other materials layer that is filled with glass.Board 19 can be made by for example pottery, copper, aluminum silicon carbide (AlSiC) or graphite.Board 19 is not necessary, can use it.
As shown in the figure, termination 14 links to each other with substrate 18.Can in every way termination 14 be fixed on other devices the metallized area (not shown) on the substrate 18 or on substrate 18, described variety of way for example is by welding or adopts conducting epoxy resin.The matrix 22 of heating is placed on the termination 14 or between them (removed lid shown in Figure 1 16, and among Fig. 2 expression cover 16).Can for example with screw flange 12 be fixed on the board 19 in various manners, this flange 12 can provide electrical grounding surface and provide better radiating condition for matrix 22.
Fig. 3 is the housing 40 of electronic component 10 as the front cross sectional view of a circuit board, and this housing 40 constitutes according to one preferred embodiment of the present invention.The housing 40 that preferably comprises multi-layer ceramics comprises the cavity 26 that forms with known technology, wherein as described in conjunction with Fig. 2, be fixed with electronic component 10, but described multi-layer ceramics layer also can be glass-filled epoxy resin, liquid crystal polymer, polytetrafluoroethylene, aluminium oxide, high-temperature resistance plastice or other materials layer.As shown in the figure, housing 40 every layer thickness are all near 0.206 millimeter, but every layer also can be any suitable thickness.Conceptive, wall 30,32,34 and 36 defines cavity 26, and each wall all has multilayer.As shown in the figure, cavity 26 has a rectangular cross section, but any suitable section configuration also can be arranged.Cavity 26 can also include electromagnetic interference attenuating material (not shown).
A kind of element 10 is encapsulated in proper method in the cavity 26, comprises housing 40 is made two or more ceramic spacer, they can be suitable for melting under the temperature of its each layer one is heated respectively.After being fixed to electronic component 10 at least one separator, available material known and technology are for good and all fixed these separators then.On the other hand, if electronic component 10 can tolerate high temperature, then can become independent one with housing 40 heat fused together.
Preferably one or more nozzle 60 is arranged in the roof 30 of housing 40.An independent nozzle 60 shown in the figure.Nozzle 60 is preferably a small-sized atomizer, for example single cyclone type (simplexpressure-swirl) atomizer of pressing.Single pressure cyclone type atomizer is shown people such as S.K.Chen in " Factors Influencing the Effective Spray Cone Angle of Pressure-SwirlAtomizers " and is had a detailed description, referring to Journal of Engineering for GasTurbines and Power, Vol.144, the 97-103 page or leaf, in January, 1992, be hereby incorporated by.
When one of each layer is stacked on another, just form the nozzle 60 that makes fluid atomizing.Part 62 and 64 has been characterised in that three holes, and these three holes are as fluid intake.Part 66 comprises an elongated hole, is referred to herein as the swirling flow hole.The outside 67 in this swirling flow hole makes fluid begin rotational flow, and the middle body 65 maintenances one center pressure in this swirling flow hole, forces swirling flow to flow through each separator afterwards, and fluid is charged into an injection cone.Part 68,70,72 and 74 hole diminish gradually, part 74 have one for example diameter be about the hole of the 0.15mm order of magnitude.When swirling flow sprayed the hole of part 74, the centrifugal force of this fluid was more much bigger than its shear strength, so that a small gangs of taper spray painting delivery nozzle 60.
Referring to Fig. 3, the work that is used for spraying the closed-loop system of electronic building brick 10 in the cooling housing 40 is according to one preferred embodiment of the present invention described again.Fluid pump 50 is carried coolant fluid to nozzle 60, and this fluid pump 50 is connected to a fluid arrival end 46 through pipe 52.Can pipe 52 be connected to fluid intake end 46 with the connector of a band barb or with any other appropriate device.
Remaining fluid 70 collects by fluid outlet 47, and by the low pressure of discharging they is removed from housing 40, and liquid outlet end 47 preferably forms by each separator of housing 40 is whole with being similar to the technology of setting up cavity 26.The storage liquid layer 45 of collecting any condensed fluid can be used for reducing the possibility of cavity 26 overflows, also can be used as a heat abstractor, to help fluid 70 evaporations.
The fluid that condenser 53 receives from fluid outlet 47, this condenser 53 is connected to pump 50 by pipe 54, and is connected to fluid outlet 47 by pipe 56.Available for example connector 51 or any other proper device of one or more band barb are connected to fluid outlet 47 with pipe 56.Fan 58 can be used to increase the cooling capacity of condenser 53.The fluid of cooling is flowed to pump 50 from condenser 53.So just, the closed loop that forms a cooling agent flows.Certainly, at any given time, cooling agent can be steam, liquid or steam and mixtures of liquids.
Coolant fluid can be the cooling agent of any insulation, and such cooling agent can have been bought as everyone knows and in a lot of places.A Fluorinert that example is 3M who is fit to cooling agent
TMDielectric fluid can have been bought from 3M, and sequence number is FC-72.Another kind is similar to the Fluorinert of 3M
TMThe perfluorocarbon fluid of dielectric fluid can be from Ausimont Galden
Bought.
For example, based on the purpose of redundancy, can envision, any conventional apparatus that is used to provide cooling agent stream can be used in combination with the above embodiment of the present invention, and more than one housing 40 can be connected to an independent coolant source, perhaps one or more coolant source can be connected to an independent housing 40.
Should select the size of fluid pump 50, condenser 53 and fan 58 based on the requirement of heat radiation and flow velocity.For example, the typical closed-loop fluid flows for per minute flows through the 500-1000 milliliter, dispels the heat 500-1000 watt.The pump of various sizes and condenser accessory can be from Isothermal SystemsResearch, and Inc. has bought, and qualified pipe and accessory can be from Vernon Hills, and the domestic Cole-Parmer of Illinois obtains.
With device disclosed herein can cool off effectively embed housing 40 as in the circuit board and every square centimeter reach 300 watts release can density an electronic component or one group of electronic component.Like this, bigger high heat-generating electronic elements can be embedded in the housing 40.Directly heat is taken away the working temperature that helps to reduce element from each electronic component,, improve its reliability by reducing thermal change and relevant thermal stress.
Owing to be not subjected to the domination of air containment requirement at interval, the roof 30 of housing 40 can be set near the surface of electronic component 10.Like this, can reduce the overall dimension of electronic component.In addition, different with air cooling, air cooling is the most effective when for example spreading all over big heat abstractor in the big zone of heat throughout, impels heat to concentrate and spray cooling, and this is another influential factor to reducing overall volume and weight.
Selectively electronic component is embedded circuit board, can help to reduce to be used for fixing on the intensive electronic building brick surface area of conventional spray cooling system, and these circuit boards can be the isolating points of high heat load in other low heat loads districts of electronic building brick.Like this, because spraying cooling system of the present invention is arranged, the size of electronic building brick can not increase.
Apparatus and method as herein described are to produce a kind of seal electronic element, and it is not subjected to the interference effect of electromagnetic radiation basically, and these apparatus and method also produce the spraying cooling system of less part.
Make nozzle directly be formed at housing, rather than respectively nozzle is bonded on the manifold, just reduced the be cooled chance of fluid capture and corrosion or stopped nozzles of dirt from the dirt of bonding agent such as solder flux or other sources basically as a circuit board inside.
Should be appreciated that the present invention is not limited to cooling electronic components, also can be suitable for cooling off any thermal source.
Can expect that also every sealing and/or fastening part of needing all can adopt many methods and material.For example, can adopt securing member, flexible gaskets, ultra-sonic welded, brazing, soldering or cast welding such as screw.
Obviously, under the situation that does not break away from appended claims and equivalent essence and scope, can produce the present invention other and further form, be to be understood that, the present invention is not limited to any way of above-mentioned specific embodiment, and only by following claims and equivalent decision thereof.
Claims (10)
1. one kind is used for the device of spray-cooling electronic component, comprising:
One housing, it has a cavity, and the size of this cavity is suitable for surrounding this electronic component, and this housing comprises:
Ground floor, it has first hole,
The second layer, it has second hole, and this second hole communicates with first hole, also communicates with cavity,
The size in first hole and second hole be suitable for admitting fluid, atomizing fluids and with the release of fluid of atomizing in cavity.
2. according to the process of claim 1 wherein that ground floor comprises pottery.
3. according to the device of claim 1, also comprise:
One fluid arrival end, it is arranged in the housing, and the size of this fluid intake end is suitable for to the first hole conveyance fluid.
4. according to the device of claim 1, also comprise:
The one fluid port of export communicates with cavity, its size fluid from cavity that is suitable for collecting.
5. according to the device of claim 4, also comprise:
One fluid pump, it communicates with the fluid intake end; With
One condenser, it communicates with this fluid pump and fluid outlet,
This condenser is admitted the fluid from fluid outlet, and co-current flow body arrival end conveyance fluid forms closed loop fluid stream.
6. according to the device of claim 1, wherein fluid comprises dielectric fluid.
7. according to the device of claim 1, wherein the section configuration in first hole is essentially circular.
8. according to the device of claim 1, also comprise:
One electronic component, it is arranged in the cavity.
9. device according to Claim 8, wherein this electronic component is chosen from the group of being made up of following element basically: passive component; Multi-chip module and radio-frequency (RF) power transistor.
10. according to the device of claim 1, its middle shell comprises circuit board.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/709,247 US5768103A (en) | 1996-08-30 | 1996-08-30 | Circuit board apparatus and apparatus and method for spray-cooling an electronic component |
| US08/709,247 | 1996-08-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1226313A true CN1226313A (en) | 1999-08-18 |
| CN1119619C CN1119619C (en) | 2003-08-27 |
Family
ID=24849048
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN97196828A Expired - Fee Related CN1119619C (en) | 1996-08-30 | 1997-07-08 | Spray-cooling electronic component |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US5768103A (en) |
| EP (1) | EP0922192A4 (en) |
| JP (1) | JP2000517108A (en) |
| KR (1) | KR20000035950A (en) |
| CN (1) | CN1119619C (en) |
| WO (1) | WO1998009129A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100442964C (en) * | 2004-11-16 | 2008-12-10 | 国际商业机器公司 | Fluidic cooling systems and methods for electronic components |
| CN101090625B (en) * | 2006-06-12 | 2010-06-09 | 财团法人工业技术研究院 | Active loop heat sink device with atomizer |
| CN111361293A (en) * | 2018-12-26 | 2020-07-03 | 广东科达洁能股份有限公司 | Ceramic ink-jet printer ink path system |
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| US6205799B1 (en) * | 1999-09-13 | 2001-03-27 | Hewlett-Packard Company | Spray cooling system |
| US6377458B1 (en) * | 2000-07-31 | 2002-04-23 | Hewlett-Packard Company | Integrated EMI containment and spray cooling module utilizing a magnetically coupled pump |
| US6462949B1 (en) * | 2000-08-07 | 2002-10-08 | Thermotek, Inc. | Electronic enclosure cooling system |
| WO2002046677A1 (en) * | 2000-12-04 | 2002-06-13 | Fujitsu Limited | Cooling system and heat absorbing device |
| US6525420B2 (en) | 2001-01-30 | 2003-02-25 | Thermal Corp. | Semiconductor package with lid heat spreader |
| US6644058B2 (en) * | 2001-02-22 | 2003-11-11 | Hewlett-Packard Development Company, L.P. | Modular sprayjet cooling system |
| US7082778B2 (en) * | 2001-02-22 | 2006-08-01 | Hewlett-Packard Development Company, L.P. | Self-contained spray cooling module |
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| US6993926B2 (en) | 2001-04-26 | 2006-02-07 | Rini Technologies, Inc. | Method and apparatus for high heat flux heat transfer |
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| EP1388277B1 (en) * | 2001-05-16 | 2010-07-07 | Cray Inc. | Method and apparatus for cooling electronic components |
| JP2003051689A (en) * | 2001-08-06 | 2003-02-21 | Toshiba Corp | Heating element cooling unit |
| US6604571B1 (en) | 2002-04-11 | 2003-08-12 | General Dynamics Land Systems, Inc. | Evaporative cooling of electrical components |
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| US7806166B1 (en) * | 2003-02-18 | 2010-10-05 | Parker-Hannifin Corporation | Insulated spray cooling system for extreme environments |
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| US7709296B2 (en) | 2006-10-19 | 2010-05-04 | International Business Machines Corporation | Coupling metal clad fiber optics for enhanced heat dissipation |
| US7911161B2 (en) * | 2007-06-28 | 2011-03-22 | GM Global Technology Operations LLC | Automotive power inverter with reduced capacitive coupling |
| US8739856B2 (en) * | 2007-08-20 | 2014-06-03 | Georgia Tech Research Corporation | Evaporation-enhanced thermal management devices, systems, and methods of heat management |
| US7755186B2 (en) * | 2007-12-31 | 2010-07-13 | Intel Corporation | Cooling solutions for die-down integrated circuit packages |
| US7808780B2 (en) * | 2008-02-28 | 2010-10-05 | International Business Machines Corporation | Variable flow computer cooling system for a data center and method of operation |
| US7866173B2 (en) * | 2008-02-28 | 2011-01-11 | International Business Machines Corporation | Variable performance server system and method of operation |
| KR100921120B1 (en) * | 2008-03-04 | 2009-10-12 | 현대자동차주식회사 | Evaporation cooling system for motor and controller of fuel cell |
| US8953314B1 (en) * | 2010-08-09 | 2015-02-10 | Georgia Tech Research Corporation | Passive heat sink for dynamic thermal management of hot spots |
| TWI419641B (en) | 2010-10-29 | 2013-12-11 | Ind Tech Res Inst | Cooling structure of electronic device |
| US8842435B2 (en) * | 2012-05-15 | 2014-09-23 | Toyota Motor Engineering & Manufacturing North America, Inc. | Two-phase heat transfer assemblies and power electronics incorporating the same |
| US9398721B2 (en) * | 2013-07-25 | 2016-07-19 | Hamilton Sundstrand Corporation | Cooling fluid flow passage matrix for electronics cooling |
| WO2018085199A1 (en) | 2016-11-01 | 2018-05-11 | Massachusetts Institute Of Technology | Thermal management of rf devices using embedded microjet arrays |
| US10665529B2 (en) | 2017-07-21 | 2020-05-26 | Massachusetts Institute Of Technology | Modular microjet cooling of packaged electronic components |
| US11482472B2 (en) | 2018-06-13 | 2022-10-25 | Intel Corporation | Thermal management solutions for stacked integrated circuit devices |
| US11688665B2 (en) | 2018-06-13 | 2023-06-27 | Intel Corporation | Thermal management solutions for stacked integrated circuit devices |
| US11903171B2 (en) * | 2021-08-05 | 2024-02-13 | Nan Chen | System for modular liquid spray cooling of electronic devices |
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1996
- 1996-08-30 US US08/709,247 patent/US5768103A/en not_active Expired - Lifetime
-
1997
- 1997-07-08 CN CN97196828A patent/CN1119619C/en not_active Expired - Fee Related
- 1997-07-08 JP JP10511625A patent/JP2000517108A/en active Pending
- 1997-07-08 EP EP97932519A patent/EP0922192A4/en not_active Withdrawn
- 1997-07-08 WO PCT/US1997/011806 patent/WO1998009129A1/en not_active Application Discontinuation
- 1997-07-08 KR KR1019997001691A patent/KR20000035950A/en not_active Application Discontinuation
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100442964C (en) * | 2004-11-16 | 2008-12-10 | 国际商业机器公司 | Fluidic cooling systems and methods for electronic components |
| CN101090625B (en) * | 2006-06-12 | 2010-06-09 | 财团法人工业技术研究院 | Active loop heat sink device with atomizer |
| CN111361293A (en) * | 2018-12-26 | 2020-07-03 | 广东科达洁能股份有限公司 | Ceramic ink-jet printer ink path system |
| CN112582360A (en) * | 2020-12-10 | 2021-03-30 | 江苏佳成冷却系统有限公司 | Shunting microchannel radiator |
| CN112582360B (en) * | 2020-12-10 | 2024-01-26 | 江苏佳成冷却系统有限公司 | Split-flow type micro-channel radiator |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2000517108A (en) | 2000-12-19 |
| EP0922192A1 (en) | 1999-06-16 |
| US5768103A (en) | 1998-06-16 |
| CN1119619C (en) | 2003-08-27 |
| KR20000035950A (en) | 2000-06-26 |
| WO1998009129A1 (en) | 1998-03-05 |
| EP0922192A4 (en) | 2000-11-02 |
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