CN1222687A - Camera - Google Patents
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- CN1222687A CN1222687A CN 98122983 CN98122983A CN1222687A CN 1222687 A CN1222687 A CN 1222687A CN 98122983 CN98122983 CN 98122983 CN 98122983 A CN98122983 A CN 98122983A CN 1222687 A CN1222687 A CN 1222687A
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- flexible printed
- printed board
- camera
- light
- flip
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Abstract
A camera having a flexible printed board on which a semiconductor element is flip-chip-bonded, a light-shieldable member such as a housing, a lens barrel, or an outer member. An element formation surface of a semiconductor element flip-chip-bonded on the flexible printed board is arranged to oppose the light-shieldable member.
Description
The present invention relates to a kind of camera, and be particularly related to a kind of have a flexible printed board, the camera of semiconductor element flip-chip bonded on this flexible printed board.
In traditional midget plant such as camera, often adopt flexible printed board that various circuit are set in a compact shell.The technological means that connects an element such as IC by usually said flip-over type bonding method also is known.
This flip-over type bonding method is that a kind of being used for put upside down the method for attachment that is arranged on the printed panel with an element such as IC.According to the method, an outer electrode on the IC is directly connected on the plated circuit figure line or by conducting particles it through a projection (protrusion) processing this outside electrode is connected on the printing plate figure line.As an example of this flip-over type joint method, be all to disclose this joint method in the middle of Japan of 62-6652 has examined Japanese unexamined patent publication No. that patent, publication number are 7-211423 and other similar patents at publication number.
The flexible printed board of formed routine is that Copper Foil is arranged between the thin slice with tens fathoms (Fm) thickness.Because described thin slice comprises a kind of almost material transparent such as polyimide or polyester, so flexible printed board is significantly less than rigid printed panel at the light shield aspect of performance.
When utilizing the flip-over type bonding method semiconductor element such as IC to be connected on the flexible printed board of light shield poor-performing, following defective will appear.Or rather, when a kind of like this flexible printed board is used on camera product of using under extraneous high light or the product that target light is imported to product inside, because the light shield poor-performing of flexible printed board itself as mentioned above, so just daylight, illumination light or shine on the surface of semiconductor element such as IC from the leak light of internal electron flashlamp, date LED or object like that.As a result, in semiconductor element, owing to photoelectric effect has produced disadvantageous performance change or maloperation.
First purpose of the present invention is to provide a kind of camera, even wherein this camera comprises that a flip-chip bonded on it has the flexible printed board of semiconductor element, the surface of this semiconductor element also can shield from the light of outside or suchlike light.
Second purpose of the present invention is to provide a kind of camera, performance change, maloperation or the suchlike phenomenon that wherein can avoid the photoelectric effect owing to element on the internal semiconductor to produce easily.
In a word, according to camera of the present invention, have a flip-chip bonded on it flexible printed board of semiconductor element and member such as housing, lens barrel and the external member of a maskable light are arranged, the element that wherein is used for the semiconductor element of flip-chip bonded on flexible printed board forms the surface and is configured to relative with the member of maskable light.
This purpose of the present invention and advantage will become clearer by following detailed description.
Fig. 1 is a sectional view, expression according to the camera of first embodiment of the invention when external member partly cuts, the front of this camera;
Fig. 2 is a sectional view, in the camera of expression according to first embodiment, and the further detailed status of the semiconductor body part of flip-chip bonded on a flexible printed board;
Fig. 3 is a sectional view that amplifies, expression according to the camera of second embodiment of the invention when external member partly cuts, this camera body front partly; And
Fig. 4 is a sectional view that amplifies, expression according to the camera of third embodiment of the invention when lens barrel partly cuts, the side of this camera.
Below with reference to relevant drawings embodiments of the invention are described.
Fig. 1 is a sectional view, expression according to the camera (comprising a flexible printed board) of first embodiment of the invention when external member partly cuts, the front of this camera.
As shown in fig. 1, in the camera according to this embodiment, a LCD window 3 that is used for the LCD demonstration is arranged on the upper surface of external member 1, and a LCD 4 who is engaged on the flexible printed board 2 relatively is arranged in the camera with LCD window 3.LCD 4 carries out display operation according to the prearranged signals from flexible printed board 2.
Flexible printed board 2 along body surfaces, run through a plurality of surfaces and be arranged on the camera body 6, and predetermined electronic circuit component is engaged on the surface of this flexible printed board 2.Semiconductor 5 is engaged on the flexible printed board 2 by usually said flip-chip method, and the element of semiconductor 5 forms surperficial 5a and is inverted setting towards the face side of flexible printed board 2.For this reason, the element of semiconductor 5 forms surperficial 5a and is engaged in as near the camera body 6 of light shield, thereby the exterior light that incides on the element is suppressed to minimum.
In the ordinary camera, in its part formation one be used to load or the magazine of image pickup element to guarantee the light shield performance.But from can projecting easily on the part that circuit block is set, and can't avoid exterior light to project on this part easily as the LCD window 3 of transparent component or from the seam of external member 1 or the light at similar position.
As mentioned above, even external member is hermetic closed fully, during the camera assembling or repairing, circuit block also will be exposed in the extraneous light.
According to it is characterized in that of the camera of this embodiment,, can prevent as far as possible positively that exterior light from projecting on the semiconductor element by above-mentioned setting.
Fig. 2 is a sectional view, the further detailed status of semiconductor 5 main parts of expression flip-chip bonded on flexible printed board 2.
As shown in Figure 2, flexible printed board 2 is by a base material 2c, and an overlayer 2a and a copper figure line 2b constitute.Copper figure line 2b is installed on the base material 2c, and is covered by overlayer 2a.Or rather, copper figure line 2b is arranged between overlayer 2a and the base material 2c.
Overlayer 2a and base material 2c comprise a kind of almost material transparent such as polyimide.Therefore, can think that by overlayer 2a and base material 2c, copper figure line 2b can't shield from light from outside or from the light of inside.
Semiconductor 5 is connected on the copper figure line 2b by a bossing 8.Or rather, bossing 8 is arranged on the external electrode of semiconductor 5, so a predetermined electrode of semiconductor 5 can be directly connected to copper figure line 2b and goes up or can be connected on the copper figure line 2b by conducting particles (not shown) or similar substance.
One bonding agent 9 is filled into and is formed at around the bossing 8 and in the narrower space between semiconductor 5 and the base material 2c.Bonding agent 9 is used for flexible printed board 2 is adhered to semiconductor 5.Bonding agent 9 can contain conducting particles recited above.
Camera body 6 with fabulous light shield performance be arranged on the flexible printed board 2 that is provided with as mentioned above below.So, the light shield performance of camera body 6 can prevent that exterior light from projecting on the semiconductor 5, and can obtain to avoid easily performance change that the photoelectric effect by element on the semiconductor causes, maloperation or the like this advantage.
Certainly, preferably flexible printed board 2 is directly installed on the camera body 6.But as shown in Figure 2,, also can obtain above-mentioned advantage fully even under situation, flexible printed board 2 is arranged on the camera body 6 with small distance interval.
In this embodiment, adopt the light rain shield device of camera body as semiconductor 5.But the present invention is not limited only to camera body.Any member such as other having the light shield performance and can be arranged near semiconductor 5 rigid printed panels all can be used as light rain shield device.
Camera (containing a flexible printed board) according to second embodiment of the invention will be described below.
In first embodiment, the flexible printed board 2 that flip-chip bonded has semiconductor 5 on it is along the body surfaces setting, thereby makes flexible printed board 2 be installed on the camera body 6.But second embodiment is characterized in that, semi-conductive flexible printed board of flip-chip bonded is provided with along an external member on it.
Fig. 3 is a sectional view that amplifies, expression according to the camera (containing a flexible printed board) of second embodiment of the invention when external member partly cuts, the front of this camera body.
As shown in Figure 3, second embodiment is characterized in that, semiconductor 13 flip-chip bonded flexible printed board 12 thereon is arranged to contact with an external member 10 near the part of bond semiconductor 13.
Suppose that flexible printed board 12 has the setting identical with flexible printed board 2 among first embodiment, and 12 pairs of unglazed shielding propertiess of exterior light of flexible printed board.
Conductive rubber 11a integrally is fixed on the lower surface of the rubber button switch 11 that is arranged on the external member 10.Rubber button switch 11 is downward by the copper figure line 12a short circuit that can make on the flexible printed board 12, thereby connects a predetermined switch.
Semiconductor 13 is for being used to handle an IC from the signal of a plurality of rubber button switches 11.Semiconductor 13 is engaged to making that its element forms the surface relative with external member 10 1 sides.
So, in a second embodiment, the light shield performance of external member 10 can prevent that extraneous light from projecting on the semiconductor 13.
Camera (comprising a flexible printed board) according to third embodiment of the invention will be described below.
In first embodiment, semiconductor 5 flip-chip bonded flexible printed board 2 thereon is installed on the camera body 6.In contrast, the 3rd embodiment is characterized in that, semiconductor flip-chip bonded flexible printed board thereon is provided with along the lens barrel inner wall surface.
Fig. 4 is a sectional view that amplifies, expression according to the camera (comprising a flexible printed board) of third embodiment of the invention when lens barrel partly cuts, the side of this camera.
As shown in Figure 4, the 3rd embodiment is characterized in that, semiconductor 22 flip-chip bonded flexible printed board 21 thereon is configured near the part of bond semiconductor 22 and the contacted form of the inner wall surface of zoom lens barrel 20.
In this embodiment, can suppose that also flexible printed board 21 has the setting identical with flexible printed board 2 among first embodiment, and 2 pairs of unshielded performances of extraneous light of flexible printed board.
For this reason, in the 3rd embodiment, the light shield performance of zoom lens barrel can stop light to project on the semiconductor 22.
To the camera (containing a flexible printed board) according to fourth embodiment of the invention be described below.
To be described with reference to 1 couple the 4th embodiment of figure more below.
Referring to Fig. 1, semiconductor 7 flip-chip bonded are in an end of a flexible printed board 2.The flexible printed board 2 that is connected with semiconductor 7 part places directly is not arranged to an interior fixed part of camera.In this case, semiconductor 7 is engaged on the flexible printed board 2, puts upside down setting thereby make the element of semiconductor 7 form the surface towards the external member 1 of camera.So, can stop the extraneous light that receives from the seam crossing of LCD window 3 or external member 1 to project on the semiconductor 7.
As mentioned above, according to the described camera of above-mentioned each embodiment, when flip-chip bonded on it has the camera apparatus that semi-conductive flexible printed board is used for using out of doors or receives light, semiconductor carries out suitable connection and setting the camera planted agent, and promptly semiconductor should be arranged so that semi-conductive element forms the parts that the surface has the light shield function in the camera and puts upside down setting.By this set, the extraneous light that projects semiconductor component surfaces can obtain to avoid easily owing to this advantage of the caused performance change of element photoelectric effect, maloperation or the like on the semiconductor by the signature system to minimum simultaneously.
In the present invention, do not breaking away from the basis of the present invention of essence of the present invention and scope, clearly can obtain distinguishing the various working methods that are wide region.The present invention is not subjected to the restriction of any specific embodiment except that being limited by additional claim.
Claims (7)
1. camera, have a flip-chip bonded on it flexible printed board of semiconductor element and the member of a maskable light are arranged, it is characterized in that: the element of the described semiconductor element of flip-chip bonded on described flexible printed board forms the surface and is configured to relative with the member of described maskable light.
2. camera, have a flip-chip bonded on it flexible printed board of semiconductor element and the member of a maskable light are arranged, it is characterized in that: it comprises a flexible printed board, and it has one and is fixed in the free end that the stiff end and on the member of described maskable light extends from stiff end; And semiconductor element, its flip-chip bonded is also pointed to the direction that is different from described camera external member indication in the free end of described flexible printed board.
3. camera, have a flip-chip bonded on it flexible printed board of semiconductor element and the member of a maskable light are arranged, it is characterized in that: it comprises a flexible printed board, and it has one and is fixed in the free end that the stiff end and on the member of described maskable light extends from stiff end; One first semiconductor element, this first semiconductor element flip-chip bonded are in the free end of described flexible printed board and to be arranged to make the element of described semiconductor element to form the surface relative with the member of described maskable light; And one second semiconductor element, this second semiconductor element flip-chip bonded is in the free end of described flexible printed board, and the element of the described semiconductor element of flip-chip bonded on described flexible printed board forms the surface and points to the direction that is different from described camera external member indication.
4. camera according to claim 1 is characterized in that: described light shielding member is at least a kind of in housing, lens barrel or the external member of described camera.
5. camera according to claim 1, it is characterized in that: the member of described maskable light is a lens barrel, and the element of the described semiconductor element of flip-chip bonded on described flexible printed board forms the surface and is arranged on almost and the relative position of described lens barrel inwall.
6. camera according to claim 1 is characterized in that: the member of described maskable light is a lens barrel, and described flexible printed board is configured to contact with the inwall of described lens barrel and be provided with along inwall.
7. camera according to claim 1 is characterized in that: the member of described maskable light is an embossing seal brush board with light shield performance.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 98122983 CN1222687A (en) | 1997-12-03 | 1998-12-02 | Camera |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP333218/97 | 1997-12-03 | ||
| CN 98122983 CN1222687A (en) | 1997-12-03 | 1998-12-02 | Camera |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1222687A true CN1222687A (en) | 1999-07-14 |
Family
ID=5227993
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 98122983 Pending CN1222687A (en) | 1997-12-03 | 1998-12-02 | Camera |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1222687A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100474096C (en) * | 2005-01-18 | 2009-04-01 | 佳能株式会社 | Imaging device |
-
1998
- 1998-12-02 CN CN 98122983 patent/CN1222687A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100474096C (en) * | 2005-01-18 | 2009-04-01 | 佳能株式会社 | Imaging device |
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