CN1216768C

CN1216768C - Tools for loading IC wafers to packing boxes

Info

Publication number: CN1216768C
Application number: CN 02107548
Authority: CN
Inventors: 徐裕国; 陈世坤; 陈友平
Original assignee: Macronix International Co Ltd
Current assignee: Macronix International Co Ltd
Priority date: 2002-03-15
Filing date: 2002-03-15
Publication date: 2005-08-31
Anticipated expiration: 2022-03-15
Also published as: CN1445138A

Abstract

The present invention relates to a filling tool of an IC wafer packaging box, and the filling tool is used for transferring an IC wafer to a wafer packaging box. The filling tool is composed of a seat and an annular sidewall, wherein the annular sidewall is integrally formed and arranged on the seat, the inner diameter of the annular sidewall is larger than the diameter of the wafer, and the external diameter of the annular sidewall is smaller than the inner diameter of the wafer packaging box. Moreover, the annular sidewall is provided with at least one opening which extends downward from the top of the annular sidewall, and the IC wafer is safely and easily filled in the filling tool from the opening.

Description

Integrated circuit (IC) wafer packing box tools for loading

Technical field

The invention relates to a kind of wafer (wafer) packing box tools for loading, and particularly be used to load integrated circuit (IC) wafer, and it is transferred to the box-packed instrument of filling out of wafer packaging of wafer packaging box about a kind of.

Background technology

The mode of existing storage integrated circuit (IC) wafer; as shown in Figure 1, be stored in a kind of wafer packaging box 10 cylindraceous, integrated circuit (IC) wafer when filling to face up; and be positioned over one by one in the wafer packaging box 10, and in the last underlay of integrated circuit (IC) wafer with several layers of sponge as protection.Generally speaking, when using this kind wafer packaging box 10 to carry out the filling of integrated circuit (IC) wafer, as shown in Figure 2, must be with the back side of vacuum WAND 12 absorption integrated circuit (IC) wafer 14, and, with vacuum WAND 12 integrated circuit (IC) wafer 14 is inserted in the wafer packaging box 10 again the facing up of integrated circuit (IC) wafer 14.

Yet, because this kind wafer packaging box 10 has the box mouth design that cooperates the integrated circuit (IC) wafer size on making.Therefore as shown in Figure 2, vacuum WAND 12 can only be put into wafer packaging box 10 with integrated circuit (IC) wafer 14 with about 45 ° angle.Bleeding off vacuum with vacuum WAND 12 this moment, in the time of vacuum WAND 12 being taken out, and quite easy and integrated circuit (IC) wafer 14 collisions of vacuum WAND 12, and cause integrated circuit (IC) wafer 14 that the situation of fragmentations takes place.

Summary of the invention

The object of the present invention is to provide a kind of integrated circuit (IC) wafer packing box tools for loading, can and be loaded into easily in this integrated circuit (IC) wafer packing box tools for loading integrated circuit (IC) wafer safety, and the switching of integrated circuit (IC) wafer packing box tools for loading thus, integrated circuit (IC) wafer is inserted in the wafer packaging box safely, and actv. prevents that integrated circuit (IC) wafer from producing fragmentation when filling.

Another object of the present invention is to provide a kind of integrated circuit (IC) wafer packing box tools for loading, this integrated circuit (IC) wafer packing box tools for loading can use with the wafer packaging box collocation of existing use, must not buy the expensive wafer packaging box of particular design in addition, and can save the cost of wafer packaging box.

According to above-mentioned purpose of the present invention, a kind of integrated circuit (IC) wafer packing box tools for loading is provided, this integrated circuit (IC) wafer packing box tools for loading comprises circular base, and the integrally formed annular sidewall that is erected at the base top forms.The internal diameter of this annular sidewall is greater than the diameter of wafer, and the external diameter of this annular sidewall is less than the internal diameter of wafer packaging box, and on annular sidewall, has one first opening at least, this first opening extends downward base by the top of annular sidewall, so that load requisite number purpose integrated circuit (IC) wafer easily.

And, at the base of integrated circuit (IC) wafer packing box tools for loading one second opening can be set so that in control step described later, with integrated circuit (IC) wafer packing box tools for loading by taking out in the wafer packaging box.In addition, also can on the circular arch wall, form the 3rd opening, be out of shape to avoid annular sidewall to be subjected to the external force extruding.

According to the box-packed instrument of filling out of said integrated circuit wafer packaging, this wafer packaging is box-packed to be filled out instrument and utilizes first opening on the annular sidewall, with being placed in the tools for loading of integrated circuit (IC) wafer level, then the wafer packaging box is entangled in the tools for loading, wafer packaging box and the box-packed instrument of filling out of wafer packaging combined of counter-rotating again, then with the box-packed instrument of filling out of wafer packaging by taking out in the wafer packaging box, and can with semiconductor wafer by the tools for loading safe transfer to the wafer packaging box.

Description of drawings

Fig. 1 is the scheme drawing of public wafer packaging box;

Fig. 2 becomes the scheme drawing of circuit chip for using the box-packed packing of public wafer packaging;

Fig. 3 A and Fig. 3 B are the scheme drawing of the integrated circuit (IC) wafer packing box tools for loading of one embodiment of the invention;

Fig. 4 is for being filled to integrated circuit (IC) wafer the scheme drawing of the integrated circuit (IC) wafer packing box tools for loading of one embodiment of the invention; And

Fig. 5 A to Fig. 5 C is for using the integrated circuit (IC) wafer packing box tools for loading of one embodiment of the invention, and integrated circuit (IC) wafer is filled to scheme drawing in the wafer packaging box.

Description of reference numerals:

10: the wafer packaging box

12: vacuum WAND

14: integrated circuit (IC) wafer

20: tools for loading

22: base

24: annular sidewall

26,28,30: opening

32: sponge

The specific embodiment

Integrated circuit (IC) wafer packing box tools for loading of the present invention please refer to Fig. 3 A and Fig. 3 B and is described as follows.

Fig. 3 A is the scheme drawing of the integrated circuit (IC) wafer packing box tools for loading of one embodiment of the invention.According to above-mentioned relevant drawings, this integrated circuit (IC) wafer packing box tools for loading has comprised base 22 and an annular sidewall 24, and this integrated circuit (IC) wafer packing box tools for loading for example is by the plastic material manufacturing.What annular sidewall 24 was one of the forming is arranged at above base 22, and can be in order to the filling integrated circuit (IC) wafer, and wherein the internal diameter of annular sidewall 24 is greater than the diameter of wafer, and the external diameter of this annular sidewall 24 is less than the internal diameter of wafer packaging box.At least have an opening 26 in annular sidewall 24, this opening 26 extends to the surface of base 22 by the top of annular sidewall 24 so that the work of filling integrated circuit (IC) wafer thus opening 26 carry out easily and safely.

And, shown in Fig. 3 B, this integrated circuit (IC) wafer packing box tools for loading can also have an opening 28 at base 22, this opening 28 is arranged on the base 22 between the annular sidewall 24, the effect of this opening 28 is convenient in aftermentioned tools for loading and the combination of wafer packaging box, and after integrated circuit (IC) wafer gone to the wafer packaging box, be convenient to tools for loading by taking out in the wafer packaging box.

And, in Fig. 3 A and Fig. 3 B, also opening 30 can be set in addition on the annular sidewall 24 of this integrated circuit (IC) wafer packing box tools for loading, this opening 30 can be arranged at the optional position that does not form opening 26 on the annular sidewall 24, the purpose of this opening 30 is set, and is in order to reduce the probability of annular sidewall 24 extrusions.

Please refer to Fig. 4, Fig. 4 is for being filled to integrated circuit (IC) wafer the scheme drawing of the integrated circuit (IC) wafer packing box tools for loading of one embodiment of the invention.At first in tools for loading 20 pad with several layers sponge 32, the then back side of drawing integrated circuit (IC) wafer 14, and, integrated circuit (IC) wafer 14 being positioned in the tools for loading 20 with the face down of integrated circuit (IC) wafer 14 with vacuum WAND 12.In this filling process, because tools for loading 20 has opening 26, so vacuum WAND 12 can be through opening 26 being positioned in the tools for loading 20 integrated circuit (IC) wafer 14 levels thus.And, vacuum WAND 12 is the back side back side of integrated circuit (IC) wafer 14 (promptly be up) of being drawn integrated circuit (IC) wafer 14 by the top, after vacuum WAND 12 bleeds off vacuum, vacuum WAND 12 will can not have any contacting with integrated circuit (IC) wafer 14 again, therefore can reduce integrated circuit (IC) wafer 14 produces fragmentation when packed action probability greatly.

Then, for the using method of integrated circuit (IC) wafer packing box tools for loading of the present invention, please refer to Fig. 5 A to Fig. 5 C and be described as follows.

Please refer to Fig. 5 A, shown in Fig. 5 A, in tools for loading 20 with the described method of Fig. 4, in tools for loading 20, be packed into several pieces integrated circuit (IC) wafer 14, and be lined with several layers sponge 32 at the upper and lower sides of integrated circuit (IC) wafer 14, wherein the sponge 32 of integrated circuit (IC) wafer 14 upsides is filled to the degree contour with annular sidewall 24, to prevent the follow-up space that produces when pouring integrated circuit (IC) wafer 14 into wafer packaging box 10.

Then, please refer to Fig. 5 B, with the opening of wafer packaging box 10 down, and wafer packaging box 10 is inserted in the tools for loading 20.

Then, please refer to Fig. 5 C, with the wafer packaging box combined 10 and tools for loading 20 counter-rotatings, again with tools for loading 20 by taking out in the wafer packaging box 10, so then can be with integrated circuit (IC) wafer 14 with heads state, by being transferred in the wafer packaging box 10 of tools for loading 20 safety.

In the above-mentioned step that tools for loading 20 is taken out by wafer packaging box 10, because the annular sidewall 24 of tools for loading 20 may be slightly tight with the applying of the inwall of wafer packaging box 10, and make tools for loading 20 be difficult for taking out, promptly can fasten base 22 by both hands this moment, and via the opening on the base 22 28, for example with thumb to sponge 32 gentle pressure, and smoothly tools for loading 20 is pulled out.

The using method of the invention described above is done explanation with the integrated circuit (IC) wafer packing box tools for loading with opening 28 of Fig. 3 B, yet except opening 28 function partly, the same integrated circuit (IC) wafer packing box tools for loading that also goes for Fig. 3 A.

In sum, integrated circuit (IC) wafer packing box tools for loading of the present invention has following advantage:

1. because the annular sidewall of tools for loading is provided with the opening that is extended by the annular sidewall top downwards, therefore can use vacuum WAND to draw wafer, and through opening thus with being packed in the tools for loading of integrated circuit (IC) wafer level, safer and easy in the operation of filling integrated circuit (IC) wafer.

And, vacuum WAND is drawn the back side back side of integrated circuit (IC) wafer (promptly be up) of integrated circuit (IC) wafer by the top, after vacuum WAND bleeds off vacuum, vacuum WAND will can not have any contacting with integrated circuit (IC) wafer again, therefore can exempt from integrated circuit (IC) wafer and vacuum WAND and produce collision, reduce the probability of integrated circuit (IC) wafer fragmentation greatly.

3. this integrated circuit (IC) wafer packing box tools for loading can use with the wafer packaging box collocation of existing use, therefore can continue to use the wafer packaging box with low cost of existing use, must not buy the expensive wafer packaging box of particular design in addition, and can significantly be reduced in the expenditure cost on the wafer packaging box.

Though the present invention with embodiment explanation as above; right its is not in order to limiting the present invention, anyly is familiar with this operator, without departing from the spirit and scope of the present invention; when can doing various changes and modification, so protection scope of the present invention is when being as the criterion with claims.

Claims

1. integrated circuit (IC) wafer packing box tools for loading, in order to an integrated circuit (IC) wafer is transferred in the wafer packaging box, it is characterized by: this tools for loading comprises:

One base; And

One annular sidewall, be arranged in one piece on this base, and have a top away from base, an internal diameter and an external diameter, wherein this internal diameter of this annular sidewall is greater than the diameter of this integrated circuit (IC) wafer, and this external diameter of this annular sidewall is less than the internal diameter of this wafer packaging box, and has one first opening that is extended by this top of this annular sidewall on this annular sidewall downwards.

2. integrated circuit (IC) wafer packing box tools for loading as claimed in claim 1 is characterized by: wherein this first opening extends to this base.

3. integrated circuit (IC) wafer packing box tools for loading as claimed in claim 1 is characterized by: wherein have one second opening on this base, and this second opening is arranged on this base in this annular sidewall.

4. integrated circuit (IC) wafer packing box tools for loading as claimed in claim 1 is characterized by: wherein have one the 3rd opening on this annular sidewall, the 3rd opening is arranged at the optional position that does not form this first opening on this annular sidewall.

5. integrated circuit (IC) wafer packing box tools for loading as claimed in claim 1, it is characterized by: wherein this tools for loading is by the plastics manufacturing.

6. integrated circuit (IC) wafer packing box tools for loading as claimed in claim 3 is characterized by:

At least in addition have one the 3rd opening on described this annular sidewall, the 3rd opening is arranged at the optional position that does not form this first opening on this annular sidewall.

7. integrated circuit (IC) wafer packing box tools for loading as claimed in claim 6, it is characterized by: wherein this tools for loading is by the plastics manufacturing.