CN1214993A - Method for quick-binding jet hole piece of ink-jetting head - Google Patents
Method for quick-binding jet hole piece of ink-jetting head Download PDFInfo
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- CN1214993A CN1214993A CN 97121342 CN97121342A CN1214993A CN 1214993 A CN1214993 A CN 1214993A CN 97121342 CN97121342 CN 97121342 CN 97121342 A CN97121342 A CN 97121342A CN 1214993 A CN1214993 A CN 1214993A
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Abstract
The present invention relates to a method for quick-binding jet orifice sheet of ink gun. Said ink gun contains several ink chambers for holding ink, a jet orifice sheet equipped with several ink-jet orifices corresponding to said several ink chambers for jetting ink, and a crystal wafer for controlling ink jet. Its method includes the following steps: a) applying an adhesion layer with photoresisting property on a wafer containing several said above-mentioned chips; b) forming said several ink chambers on the adhesion layer; c). placing a flat plate containing said several jet orifice sheets on the several ink chambers parallelly to the wafer, and making the several ink jet orifices align with the several ink chambers; and d). heating the adhesion layer to make said adhesion layer bind the wafer and said flat plate together.
Description
The present invention relates to a kind of method of spray nozzle sheet of bonding ink-jet printer ink gun, but the method for the spray nozzle sheet of outstanding reference and a kind of quick-binding ink-jet printer ink gun.
Ink-jet printer occupies a tiny space on printing market always, along with its definition that day by day increases, and the characteristic that is applied to colored printing easily, ink-jet printer is not eliminated because of the appearance of laser printer.For ink-jet printer, ink gun promptly is a considerable part, because of itself and print quality closely related.See also Fig. 1, show a typical ink gun, the main body of ink gun is a wafer 1, wherein include circuit, be used for accepting the control of software to carry out the ink-jet action, the centre has a hollow out place to be ink seasoning place 2, in order to all inks 21 of seasoning, many ink containers 3 are arranged around ink seasoning place 2, can communicate with ink seasoning place 2, make that ink 21 is flowed into, covering one contains the spray nozzle sheet 4 of many jet orifice 41 on ink container 3, each ink container 3 is all corresponding to a jet orifice 41, as the outlet of penetrating ink.See also Fig. 2, it is the schematic diagram of method of the spray nozzle sheet of known bonding ink gun, comprise dozens of wafer 1 in the wafer 5, these wafers 1 have passed through many treatment steps, as steps such as deposition, etchings, and comprising due circuit, ink seasoning place 2 and ink container 3 or the like, following step is that spray nozzle sheet 4 and each wafer 1 is bonding.Known method is to put glue on the appropriate location of a wafer, with suction nozzle one spray nozzle sheet 4 is placed on this wafer 1 then; Then on another wafer 1, put glue again, and then another sheet spray nozzle sheet 4 is positioned on this wafer 1; Identical some glue, placement step just so repeat tens of times, and wafers 1 all on wafer 5 have all covered a spray nozzle sheet 4.Then, can finish adhesion step with this wafer 5 and all spray nozzle sheet 4 pressurized, heated.The step that spray nozzle sheet 4 is positioned on the wafer 1 need be carried out in the mode of accurate contraposition, make each jet orifice 41 can correspond to each ink container 3, in order to avoid cause the outlet of ink 21 to be plugged, therefore single contraposition step promptly needs a bit of time.So, the shortcoming of known method is just very obvious, repeats identical step and expends considerable time, generally promptly need to surpass hundred times accurate contraposition gummed step at a wafer 5, not only consuming time, owing to put the accurate control that is difficult to of glue amount, scrappage also can't reduce.
The object of the present invention is to provide a kind of method of spray nozzle sheet of quick-binding ink gun, reach the effect of saving the bonding time with less step.
The object of the present invention is achieved like this, a kind of method of spray nozzle sheet of quick-binding ink gun, and this ink gun comprises most ink containers, in order to the splendid attire ink; Most jet orifice corresponding to this majority ink container are arranged, in order to penetrate this ink on one spray nozzle sheet; One wafer, in order to control the ejaculation of this ink, its step comprises: a) coating one adhesion coating on a wafer, wherein this wafer comprises most these wafers; B) on this adhesion coating, form this majority ink container; C) flat board is placed on this majority ink container with the angle that is parallel to this wafer, wherein this flat board comprises this majority spray nozzle sheet, and should a majority jet orifice aim at this majority ink container; And d) heats this adhesion coating, make bonding this wafer of this adhesion coating and this flat board.
According to above-mentioned technical solution, this cutting step e in the method for the spray nozzle sheet of quick-binding ink gun) can the diamond patterning method, laser cutting method or rotating blade cut method and implement.
According to above-mentioned technical solution, this adhesion coating is a photoresist layer in the method for the spray nozzle sheet of quick-binding ink gun.
According to above-mentioned technical solution, the material of this photoresist layer is a dry type photoresistance in the method for the spray nozzle sheet of quick-binding ink gun, and then this photoresist layer thickness is preferably 50 μ m to 1000 μ m.
According to above-mentioned technical solution, the material of this photoresist layer is a liquid formula photoresistance in the method for the spray nozzle sheet of quick-binding ink gun, and the thickness of this photoresist layer is preferably 0.1 μ m to 50 μ m.
According to above-mentioned technical solution, this forming step b in the method for the spray nozzle sheet of quick-binding ink gun) implement with lithography process.
According to above-mentioned technical solution, this heating steps d in the method for the spray nozzle sheet of quick-binding ink gun) the preferred temperature scope is at 100 ℃ to 250 ℃, with parallel heating plate heating at 1 minute to 10 hours.
According to above-mentioned technical solution, wherein this spray nozzle sheet is a sheet metal.
Owing to adopted above-mentioned technical solution, the method of the spray nozzle sheet of quick-binding ink gun of the present invention promotes the binding speed of hundreds of times thus, can significantly increase efficient, simultaneously because the present invention replaces traditional dispensing method with the little shadow of precision, the disqualification rate of contraposition gummed more is able to a large amount of reductions, it is proper to need only unique gummed enforcement once simultaneously, and then this adhesion step can not cause disqualification rate, and its improvement and progress to the ink gun manufacture process of ink-jet printer is extremely important.
Below by the detailed description of diagram and preferred embodiment, the present invention is done deep understanding.
Fig. 1 is the schematic diagram of typical ink gun;
Fig. 2 is the schematic diagram of method of the spray nozzle sheet of known bonding ink gun;
Fig. 3 is the schematic diagram of method of the spray nozzle sheet of the bonding ink gun of the present invention;
Fig. 4 is the bonding program schematic diagram of part-structure among the embodiment of Fig. 3.
See also Fig. 3, it is the schematic diagram of the preferred embodiment of the method for the spray nozzle sheet of the bonding ink gun of the present invention, comprise dozens of wafer 1 in the wafer 5, these wafers 1 are same through many treatment steps, as deposition, steps such as etching, and comprise the circuit of application, ink seasoning place 2 and ink container 3 or the like, next on wafer, suitably be coated with an adhesion coating 31, the flat board 6 that will comprise many spray nozzle sheets 4 with suction nozzle is positioned on this wafer 5 with the angle of parallel this wafer 5, this step also will be carried out in the mode of accurate contraposition certainly, makes each jet orifice 41 on the spray nozzle sheet 4 can correspond to each ink container 3; With this wafer 5 and dull and stereotyped 6 pressurized, heated, can finish adhesion step then, carry out cutting apart of element more at last, can obtain the ink gun of single ink-jet printer.
Dividing method as for element can adopt traditional cutting method, as diamond patterning method with diamond cutter cutting, and with the laser cutting method of laser irradiation, or with the method that cuts of rotating blade cutting.
The flat board that the difference of this embodiment and known method is to comprise many spray nozzle sheets is placed on the wafer in the mode of accurate contraposition, only needs gummed once, spray nozzle sheet that can be bonding up to a hundred just, and the time of whole adhesion step can shorten into more than one of percentage.But this method that once all spray nozzle sheets is positioned on the wafer should be in conjunction with the improvement of sticker coating technique, otherwise have that spray nozzle sheet comes off, ink is sewed or problem such as jet orifice obstruction produces, the bonding program of following spray nozzle sheet promptly is specially adapted to this kind method.
See also Fig. 4, it is the bonding program schematic diagram of part-structure among the embodiment of Fig. 3, see also Fig. 4 A, at first on wafer 1, be coated with a photoresist layer 31, the material of this photoresist layer 31 uses known light sensation material to get final product, as long as decide use liquid formula photoresistance or dry type photoresistance according to the thickness of required photoresist layer 31, the solvent composition in the liquid formula photoresistance is more, be fit to form thin photoresist layer, thickness is about 0.1 μ m to 50 μ m; And the solvent in the dry type photoresistance becomes less, the photoresist layer that suitable formation is thicker, and thickness is about 50 μ m to 1000 μ m, and present ink gun adopts the dry type photoresistance more, can hold more ink.In addition, as long as the resinous principle in the photoresist can have good adhesion effect, do not need special requirement; The mode of coating is to utilize spin-coating method, so method can be coated on photoresist layer 31 on the wafer 1 equably.
See also Fig. 4 B, then implement a little shadow step, through after soft roasting, exposure and showing, the unwanted part of flush away forms circular hole groove one by one in regular turn, and this groove part is exactly to be used for the ink container 3 of splendid attire ink 21.By known manufacture method, be hard roasting with that after little shadow step, to evaporate the solvent in the photoresist layer 31, increase the adhesive force of 31 pairs of wafers 1 of photoresist layer, but after photoresist layer 31 done, just can not adhere to other article again.See also Fig. 4 C, suspend known hard roasting step earlier, before photoresist layer 31 does not also lose viscosity, the ink channel of having given a farfetched interpretation earlier, utilize accurate alignment device immediately, spray nozzle sheet 4 is placed on the tram of wafer 1, make the last jet orifice 41 of spray nozzle sheet 4 aim at each corresponding ink container 3.
Then that whole element is in addition roasting firmly, reduce in the photoresist layer 31 residual solvent, make photoresist layer 31 can suitably adhere on wafer 1 and the spray nozzle sheet 4, be with traditional heat exchange pattern heating during hard baking, heat with parallel heating plate at wafer 1 and spray nozzle sheet 4 both sides, the temperature and time of heating comes in addition careful selection according to the characteristic of photoresist, generally speaking, heats 1 minute to 10 hours with 100 ℃ to 250 ℃ approximately.If heating-up temperature is too low, just need the long time that solvent is evaporated; If heating-up temperature is too high, the element inequality of being heated then, the surface portion of photoresist layer 31 is sclerosis in advance, competing solvent then just can't be evaporated, can influence the adherence of photoresist layer 31, what is more, the tack that can make photoresist layer 31 is stretched stress and is reduced because of accumulating too many connecing; If heat time heating time is too short, the solvent remaining quantity of photoresist layer 31 inside is too much, bonding firmly wafer 1 and spray nozzle sheet 4 that also can't be appropriate; And if heat time heating time is long, its cohesive also can reduce because of photoresistance becomes fragile, and wastes heating cost simultaneously.In addition, in heating process, also can on spray nozzle sheet 4, apply about 0.01kg/cm
2To 1kg/cm
2Pressure, can quicken bonding efficient.
The method of the spray nozzle sheet of quick-binding ink gun of the present invention is specially adapted to the bonding program of this kind, because save a glue step, needn't worry because the sticker coating time oversize, probably adherence is also uncoated fully, early the sticker of coating is stiff, this moment flat board is positioned over and carries out bondingly on the wafer, can cause early to be coated with the bonding improper of adhesive regions.The method of the spray nozzle sheet of quick-binding ink gun of the present invention promotes the binding speed of hundreds of times thus, can significantly increase efficient, simultaneously because the present invention replaces traditional dispensing method with the little shadow of precision, the disqualification rate of contraposition gummed more is able to a large amount of reductions, needing only unique gummed once simultaneously implements proper, then this adhesion step can not cause disqualification rate, and its improvement and progressive to the ink gun manufacture process of ink-jet printer is unquestionable.
Claims (10)
1. the method for the spray nozzle sheet of a quick-binding ink gun, this ink gun comprise most ink containers, in order to the splendid attire ink; Most jet orifice corresponding to this majority ink container are arranged, in order to penetrate this ink on one spray nozzle sheet; One wafer in order to control the ejaculation of this ink, is characterized in that comprising the following steps:
A) coating one adhesion coating on a wafer, wherein this wafer comprises most these wafers;
B) on this adhesion coating, form this majority ink container;
C) flat board is placed on this majority ink container with the angle that is parallel to this wafer, wherein this flat board comprises this majority spray nozzle sheet, and should a majority jet orifice aim at this majority ink container; And
D) heat this adhesion coating, make bonding this wafer of this adhesion coating and this flat board.
2. the method for the spray nozzle sheet of a kind of quick-binding ink gun according to claim 1 is characterized in that: also comprise a step e) after step d), cut this wafer after bonding with dull and stereotyped, to obtain most these ink guns.
3. the method for the spray nozzle sheet of a kind of quick-binding ink gun according to claim 2 is characterized in that: described cutting step e) by diamond patterning method, laser cutting method and cut method etc. and one of select as patterning method.
4. the method for the spray nozzle sheet of a kind of quick-binding ink gun according to claim 1 is characterized in that: described adhesion coating is a photoresist layer.
5. the method for the spray nozzle sheet of a kind of quick-binding ink gun according to claim 4 is characterized in that: the material of described photoresist layer is a dry type photoresistance, and this photoresist layer thickness is 50 μ m to 1000 μ m.
6. the method for the spray nozzle sheet of a kind of quick-binding ink gun according to claim 4 is characterized in that: the material of described photoresist layer is a liquid formula photoresistance, and the thickness of this photoresist layer is 0.1 μ m to 50 μ m.
7. the method for the spray nozzle sheet of a kind of quick-binding ink gun according to claim 1 is characterized in that: described formation step b) is with lithography process for it.
8. the method for the spray nozzle sheet of quick-binding ink gun according to claim 1, it is characterized in that: described heating steps d) be for it with a parallel heating plate, the temperature range of this heating steps is at 100 ℃ to 250 ℃, and the time range of this heating steps was at 1 minute to 10 hours.
9. the method for the spray nozzle sheet of a kind of quick-binding ink gun according to claim 1 is characterized in that: described flat board is a sheet metal.
10. the method for the spray nozzle sheet of a kind of quick-binding ink gun according to claim 9 is characterized in that: described sheet metal is a nickel sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN97121342A CN1073938C (en) | 1997-10-21 | 1997-10-21 | Method for quick-binding jet hole piece of ink-jetting head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN97121342A CN1073938C (en) | 1997-10-21 | 1997-10-21 | Method for quick-binding jet hole piece of ink-jetting head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1214993A true CN1214993A (en) | 1999-04-28 |
| CN1073938C CN1073938C (en) | 2001-10-31 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN97121342A Expired - Fee Related CN1073938C (en) | 1997-10-21 | 1997-10-21 | Method for quick-binding jet hole piece of ink-jetting head |
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| Country | Link |
|---|---|
| CN (1) | CN1073938C (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114434970A (en) * | 2020-11-03 | 2022-05-06 | 研能科技股份有限公司 | Wafer structure |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3143307B2 (en) * | 1993-02-03 | 2001-03-07 | キヤノン株式会社 | Method of manufacturing ink jet recording head |
| AU5066996A (en) * | 1995-04-14 | 1996-10-24 | Canon Kabushiki Kaisha | Method for producing liquid ejecting head and liquid ejecting head obtained by the same method |
| JP3343875B2 (en) * | 1995-06-30 | 2002-11-11 | キヤノン株式会社 | Method of manufacturing inkjet head |
-
1997
- 1997-10-21 CN CN97121342A patent/CN1073938C/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114434970A (en) * | 2020-11-03 | 2022-05-06 | 研能科技股份有限公司 | Wafer structure |
| CN114434970B (en) * | 2020-11-03 | 2023-11-24 | 研能科技股份有限公司 | Wafer structure |
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| Publication number | Publication date |
|---|---|
| CN1073938C (en) | 2001-10-31 |
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| C06 | Publication | ||
| PB01 | Publication | ||
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20011031 Termination date: 20111021 |