CN1208420C - Heat conductive electronic pouring sealant - Google Patents
Heat conductive electronic pouring sealant Download PDFInfo
- Publication number
- CN1208420C CN1208420C CN 01127647 CN01127647A CN1208420C CN 1208420 C CN1208420 C CN 1208420C CN 01127647 CN01127647 CN 01127647 CN 01127647 A CN01127647 A CN 01127647A CN 1208420 C CN1208420 C CN 1208420C
- Authority
- CN
- China
- Prior art keywords
- component
- coupling agent
- parts
- agent
- sealant system
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000565 sealant Substances 0.000 title claims abstract description 25
- 239000007822 coupling agent Substances 0.000 claims abstract description 15
- 239000003822 epoxy resin Substances 0.000 claims abstract description 11
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 11
- 150000001412 amines Chemical class 0.000 claims abstract description 9
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 9
- 239000000843 powder Substances 0.000 claims abstract description 8
- 239000004593 Epoxy Substances 0.000 claims description 19
- 229920005989 resin Polymers 0.000 claims description 18
- 239000011347 resin Substances 0.000 claims description 18
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 claims description 10
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical group CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 claims description 10
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 7
- 239000004902 Softening Agent Substances 0.000 claims description 6
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 claims description 5
- 150000004982 aromatic amines Chemical class 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- 150000008431 aliphatic amides Chemical group 0.000 claims description 3
- JRSJRHKJPOJTMS-MDZDMXLPSA-N trimethoxy-[(e)-2-phenylethenyl]silane Chemical group CO[Si](OC)(OC)\C=C\C1=CC=CC=C1 JRSJRHKJPOJTMS-MDZDMXLPSA-N 0.000 claims description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 2
- 150000004645 aluminates Chemical class 0.000 claims description 2
- 150000005690 diesters Chemical class 0.000 claims description 2
- 239000002245 particle Substances 0.000 claims description 2
- 239000004014 plasticizer Substances 0.000 claims description 2
- 239000000203 mixture Substances 0.000 claims 2
- 125000005498 phthalate group Chemical class 0.000 claims 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 abstract description 2
- 241000779819 Syncarpia glomulifera Species 0.000 abstract 3
- 239000001739 pinus spp. Substances 0.000 abstract 3
- 229940036248 turpentine Drugs 0.000 abstract 3
- 241000894007 species Species 0.000 abstract 1
- 239000000126 substance Substances 0.000 abstract 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 8
- 238000003756 stirring Methods 0.000 description 8
- 230000000630 rising effect Effects 0.000 description 6
- 238000012360 testing method Methods 0.000 description 5
- 239000000049 pigment Substances 0.000 description 4
- 150000001993 dienes Chemical class 0.000 description 2
- 239000002270 dispersing agent Substances 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical class [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 description 2
- 150000005672 tetraenes Chemical class 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- 238000005698 Diels-Alder reaction Methods 0.000 description 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- OYHQOLUKZRVURQ-HZJYTTRNSA-N Linoleic acid Chemical compound CCCCC\C=C/C\C=C/CCCCCCCC(O)=O OYHQOLUKZRVURQ-HZJYTTRNSA-N 0.000 description 1
- 229920002292 Nylon 6 Polymers 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- UMHKOAYRTRADAT-UHFFFAOYSA-N [hydroxy(octoxy)phosphoryl] octyl hydrogen phosphate Chemical compound CCCCCCCCOP(O)(=O)OP(O)(=O)OCCCCCCCC UMHKOAYRTRADAT-UHFFFAOYSA-N 0.000 description 1
- 239000013543 active substance Substances 0.000 description 1
- CJZGTCYPCWQAJB-UHFFFAOYSA-L calcium stearate Chemical class [Ca+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CJZGTCYPCWQAJB-UHFFFAOYSA-L 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N ferric oxide Chemical compound O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 125000003253 isopropoxy group Chemical group [H]C([H])([H])C([H])(O*)C([H])([H])[H] 0.000 description 1
- 229960004232 linoleic acid Drugs 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229930006978 terpinene Natural products 0.000 description 1
- -1 terpinene maleic anhydride Chemical class 0.000 description 1
- AGGKEGLBGGJEBZ-UHFFFAOYSA-N tetramethylenedisulfotetramine Chemical compound C1N(S2(=O)=O)CN3S(=O)(=O)N1CN2C3 AGGKEGLBGGJEBZ-UHFFFAOYSA-N 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Abstract
The present invention relates to a novel epoxy resin heat-conducting electronic pouring sealant which comprises a component (A) and a component (B), wherein the component (A) comprises aluminum oxide powder, turpentine epoxy resin, plasticizing agents and coupling agents; the component (B) comprises amine curing agents. The curing substances of the pouring sealant are formed by the mixing and curing of the component (A) and the component (B) according to a weight ratio of 100: 5 to 35. Because the turpentine epoxy resin are used for preparing the novel heat-conducting electronic pouring sealant with double components, the application field of the turpentine epoxy resin is widened, the species of the electronic pouring sealants are rich; the performance is improved in a certain degree.
Description
The present invention relates to the novel heat conductive electronic pouring sealant of a kind of Resins, epoxy.
China's turps aboundresources, but use as cheap solvent mostly for a long time, waste is serious.Turps is carried out deep processing, and to improve its added value be a job that relates to comprehensive utilization of resources and Sustainable development.And the general main employing bisphenol A epoxide resin of traditional electron pouring sealant is a material, and kind is single.
The purpose of this invention is to provide the novel heat conductive electronic pouring sealant of a kind of Resins, epoxy, so that the turps resource obtains utilization, and this glue improves than the like product of traditional bisphenol A epoxide resin as caking agent at aspect of performances such as machinery, electricity, weathering resistancies.
The novel heat conductive electronic pouring sealant system of Resins, epoxy provided by the invention comprises component (A) and component (B), counts by weight, and component (A) is mixed by following component:
50～75 parts of alumina powders,
15～45 parts of turps Resins, epoxy,
7.5～10 parts in softening agent,
0.5～4.5 part of coupling agent;
Component (B) is an amine curing agent;
The cured article of this joint sealant is formed by 100: 5～35 weight ratio is mixing cured by described component (A) and component (B).
Among the present invention aluminum oxide adopt Powdered, preferred 0.01～100 μ m of particle diameter.
Softening agent can be selected from phthalate, diester class and epoxy plasticizer etc., especially can be phthalate, as dioctyl phthalate (DOP), dibutyl phthalate etc.
Coupling agent can be selected from organo-silicon coupling agent, titanate coupling agent and aluminate coupling agent etc., especially can be organo-silicon coupling agent, as styryl Trimethoxy silane, phenyltrimethoxysila,e etc.
Amine curing agent can be selected from aliphatic amide, modified fatty amine, aromatic amine and modified aromatic amine, as aliphatic amide (as polyamide 6 50) of tetraene five amine, diene triamine, triolefin tetramine, linolic acid modification etc.
Different pigment can also be added as required in the novel heat conductive electronic pouring sealant of Resins, epoxy of the present invention,, generally about 0.5 part pigment can be in component (A), added as black, mazarine and green.If add pigment in the novel heat conductive electronic pouring sealant of Resins, epoxy, also need add wetting dispersing agent in the component (A), can be tensio-active agent, silane coupling agent etc., as stearate, generally can in component (A), add about 2 parts wetting dispersing agent.
The turps Resins, epoxy that uses among the present invention can be raw material by turps, earlier and maleic anhydride through Diels-Alder react the terpinene maleic anhydride affixture, again with epichlorohydrin reaction obtain turps Resins, epoxy (ten thousand Rong, Song Zhanqian. the application of turps in Resins, epoxy.Thermosetting resin, 1997,1:29～32).
The novel heat conductive electronic pouring sealant method for making of bicomponent epoxy resin provided by the invention is simple, and component (A) and component (B) are at room temperature stirred respectively and can use, and solidifies, and obtains cured product.Condition of cure is self-vulcanizing 24 hours, and 60 ℃ of curing were solidified 1.5 hours in 3 hours or 120 ℃.
The novel heat conductive electronic pouring sealant of bi-component epoxide-resin provided by the invention is characterised in that two mixed viscosity of component are 30000～200000 centipoises, and the density of its cured product is 2～3 gram/millimeters
3, thermal conductivity be 1.2～1.4 watts/(rice. degree centigrade), dielectric strength 60～100 kvolts/millimeter, volume specific resistance 1～2.5 * 10
15Europe/millimeter, tensile strength are 6～7 * 10
7Handkerchief, ultimate compression strength are 1～2 * 10
8Handkerchief, shear strength are 3～4 * 10
7Handkerchief, the coefficient of expansion are 2～3 * 10
-6/ degree centigrade, water-intake rate is 0.1～0.2%; With its pouring electronics high-frequency transformer, test result shows the average temperature rising of transformer less than 60 ℃, meets U.S.'s electronic product safety standards average temperature rising requirement.
Prepare the two component electron pouring sealants of novel heat conduction with turps Resins, epoxy, not only expanded the Application Areas of turps Resins, epoxy, improve terebinthine added value, also enriched the kind of electron pouring sealant, changed with traditional bisphenol A epoxide resin and made the single situation of electron pouring sealant description of materials, and the electron pouring sealant that with turps Resins, epoxy is caking agent improves than the like product of traditional bisphenol A epoxide resin as caking agent at aspect of performances such as machinery, electricity, weathering resistancies, and good prospects for application is arranged.
Umber among the embodiment all by weight.
Embodiment 1
Get 50 parts of alumina powders, 45 parts of turps Resins, epoxy, 7.5 parts of dioctyl phthalate (DOP)s, 0.5 part of styryl Trimethoxy silane (trade names Y-5772) at room temperature stirs, and makes component (A).100 parts of components (A), 35 parts of component (B) tetraene five amine at room temperature stir, and with its pouring electronics high-frequency transformer, solidify 3 hours at 60 ℃, and test result shows 59.8 ℃ of the average temperature risings of transformer.
Embodiment 2
Get 60 parts of alumina powders, 25 parts of turps Resins, epoxy, 10 parts of dibutyl phthalates, 2 parts of phenyltrimethoxysila,e (trade names Z-6071), 2 parts of stearates, 0.5 part of black pigment at room temperature stirs, and makes component (A).100 parts of components (A), 20 parts of component (B) diene triamines at room temperature stir, and with its pouring electronics high-frequency transformer, solidify 1.5 hours at 120 ℃, and test result shows 59.4 ℃ of the average temperature risings of transformer.
Embodiment 3
Get 75 parts of alumina powders, 15 parts of turps Resins, epoxy, 7.5 parts of dioctyl phthalate (DOP)s, isopropoxy, 4.5 parts of three (dioctyl pyrophosphate) titaniums (KR-38) at room temperature stir, and make component (A).100 parts of components (A), 50 5 parts of component (B) polyamide 6s at room temperature stir, and with its pouring electronics high-frequency transformer, at room temperature solidify 24 hours, and test result shows 57.8 ℃ of the average temperature risings of transformer.
Embodiment 4
Get 70 parts of alumina powders, 15 parts of turps Resins, epoxy, 9 parts of dioctyl phthalate (DOP)s, 3.5 parts of Z-6071 at room temperature stir, and make component (A).100 parts of components (A), 5 parts of component (B) triolefin tetramines at room temperature stir, and with its pouring electronics high-frequency transformer, at room temperature solidify 24 hours, and test result shows 58.5 ℃ of the average temperature risings of transformer.
Claims (6)
1, a kind of epoxide resin type heat conductive electronic pouring sealant system comprises component (A) and component (B), counts component by weight
(A) mix by following component:
50～75 parts of alumina powders,
15～45 parts of turps Resins, epoxy,
7.5～10 parts in softening agent,
0.5～4.5 part of coupling agent;
Component (B) is an amine curing agent;
Component (A) and component (B) mix by 100: 5～35 weight ratio;
Wherein softening agent is selected from phthalate, diester class and epoxy plasticizer;
Coupling agent is selected from organo-silicon coupling agent, titanate coupling agent or aluminate coupling agent;
Amine curing agent is selected from aliphatic amide, modified fatty amine, aromatic amine and modified aromatic amine.
2,, it is characterized in that described alumina powder particle diameter is 0.01～100 μ m according to the joint sealant system described in the claim 1.
3,, it is characterized in that described softening agent is selected from phthalate according to the joint sealant system described in claim 1 or 2.
4,, it is characterized in that described softening agent is selected from dioctyl phthalate (DOP) and dibutyl phthalate according to the joint sealant system described in the claim 3.
5,, it is characterized in that described coupling agent is selected from organo-silicon coupling agent according to the joint sealant system described in claim 1 or 2.
6,, it is characterized in that described coupling agent is selected from styryl Trimethoxy silane and phenyltrimethoxysila,e according to the joint sealant system described in the claim 5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01127647 CN1208420C (en) | 2001-07-24 | 2001-07-24 | Heat conductive electronic pouring sealant |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01127647 CN1208420C (en) | 2001-07-24 | 2001-07-24 | Heat conductive electronic pouring sealant |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1329120A CN1329120A (en) | 2002-01-02 |
| CN1208420C true CN1208420C (en) | 2005-06-29 |
Family
ID=4667580
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 01127647 Expired - Fee Related CN1208420C (en) | 2001-07-24 | 2001-07-24 | Heat conductive electronic pouring sealant |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1208420C (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102443245B (en) * | 2010-10-12 | 2014-03-12 | 中国石油化工股份有限公司 | Earthquake physical model and preparation method and application thereof |
| CN102127382A (en) * | 2010-12-13 | 2011-07-20 | 烟台德邦电子材料有限公司 | High-heat-conductivity epoxy resin electronic binding glue |
| CN105450170A (en) * | 2015-12-18 | 2016-03-30 | 常熟高嘉能源科技有限公司 | Photovoltaic module connecting box |
| CN116606619B (en) * | 2023-07-17 | 2023-09-26 | 山东凯恩新材料科技有限公司 | Preparation method of single-component epoxy resin adhesive electronic pouring sealant |
-
2001
- 2001-07-24 CN CN 01127647 patent/CN1208420C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN1329120A (en) | 2002-01-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102504741A (en) | High-heat conductivity and electric conductivity die bonding adhesive for carbon nano tube-filled high-power light-emitting diode (LED) | |
| CN1208420C (en) | Heat conductive electronic pouring sealant | |
| CN101050344A (en) | Epoxy binder modified by micropowder of crosslinked rubber, and preparation method | |
| CN104592750B (en) | One kind can viscose glue high surface tension fiberglass reinforced PA 6/ABS composites and preparation method thereof | |
| CN112457740A (en) | Coupling agent modified nano-cellulose grafted epoxy resin composite water-based paint and preparation method thereof | |
| CN107325782A (en) | A kind of bi-component casting glue and preparation method thereof | |
| CN106147521A (en) | A kind of epoxy resin-based heat-dissipation powder paint of moisture-proof corrosion-proof ring and preparation method thereof | |
| CN106751467A (en) | A kind of epoxy resin-matrix Micron-nano composites and preparation method thereof | |
| CN103497717A (en) | LED (Light-Emitting Diode) heat-conductive solid crystal glue binder and preparation method thereof | |
| CN106147520A (en) | Epoxy resin-matrix heat-dissipation powder paint that a kind of adhesive force is strong and preparation method thereof | |
| CN105111678A (en) | Polymer composite for insulating protection layer of power electronic component and preparation method thereof | |
| CN111925745B (en) | Conductive adhesive and preparation method and application thereof | |
| CN108084498B (en) | A kind of thermoplastic cellular konilite and preparation method for plastics | |
| CN110527254A (en) | A kind of epoxy composite material and preparation method thereof | |
| CN1693403A (en) | Process for preparing modified epoxy adhesive agent with nano powder | |
| CN1169903C (en) | Heat connducting electronic pouring sealant | |
| CN110184009A (en) | A kind of preparation method of epoxy resin-matrix thermal conductive insulation glue | |
| JPS6155123A (en) | Producion of powdered epoxy resin composition | |
| CN107623063A (en) | Package support and package support preparation method | |
| CN108084497B (en) | A kind of thermoplasticity inorganic filler and preparation method thereof for plastics | |
| JP2005518957A (en) | Method for manufacturing and processing epoxy resin molding materials | |
| JPH09296158A (en) | Conductive adhesive | |
| CN86108060A (en) | Tung oil modified unsaturated polyester paint and synthesis method | |
| CN1353155A (en) | Insulating enamel paint resisting electric arc | |
| CN107393626A (en) | A kind of hot method powdery electric slurry and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C06 | Publication | ||
| PB01 | Publication | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Shenzhen FRD Science & Technology Co., Ltd. Assignor: Guangzhou Inst. of Chemistry, Chinese Academy of Sciences Contract fulfillment period: 2009.2.12 to 2014.2.11 contract change Contract record no.: 2009990000135 Denomination of invention: Heat-conduction electronic potting adhesive and preparation method thereof Granted publication date: 20050629 License type: Exclusive license Record date: 2009.2.27 |
|
| LIC | Patent licence contract for exploitation submitted for record |
Free format text: EXCLUSIVE LICENSE; TIME LIMIT OF IMPLEMENTING CONTACT: 2009.2.12 TO 2014.2.11; CHANGE OF CONTRACT Name of requester: SHENZHEN FRD SCIENCE + TECHNOLOGY CO., LTD. Effective date: 20090227 |
|
| EM01 | Change of recordation of patent licensing contract |
Change date: 20100716 Contract record no.: 2009990000135 Assignee after: Shenzhen FRD Science & Technology Co., Ltd. Assignee before: Shenzhen FRD Science & Technology Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20050629 Termination date: 20140724 |
|
| EXPY | Termination of patent right or utility model |