CN1192963A - Recording liquid jetting device of printing head and method thereof - Google Patents

Recording liquid jetting device of printing head and method thereof Download PDF

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Publication number
CN1192963A
CN1192963A CN97122162A CN97122162A CN1192963A CN 1192963 A CN1192963 A CN 1192963A CN 97122162 A CN97122162 A CN 97122162A CN 97122162 A CN97122162 A CN 97122162A CN 1192963 A CN1192963 A CN 1192963A
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China
Prior art keywords
film
memorial alloy
film shape
printhead
shape memorial
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CN97122162A
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Chinese (zh)
Inventor
崔海龙
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Samsung Electronics Co Ltd
Samsung Electro Mechanics Co Ltd
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Samsung Electro Mechanics Co Ltd
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Publication of CN1192963A publication Critical patent/CN1192963A/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14427—Structure of ink jet print heads with thermal bend detached actuators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/015—Ink jet characterised by the jet generation process
    • B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
    • B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
    • B41J2/04501—Control methods or devices therefor, e.g. driver circuits, control circuits
    • B41J2/04585—Control methods or devices therefor, e.g. driver circuits, control circuits controlling heads based on thermal bent actuators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14008—Structure of acoustic ink jet print heads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/1433—Structure of nozzle plates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2002/14346—Ejection by pressure produced by thermal deformation of ink chamber, e.g. buckling

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  • Particle Formation And Scattering Control In Inkjet Printers (AREA)

Abstract

The present invention can shorten the time that a vibration board is restored to the bend deformation state after record liquid is sprayed, increase action frequency, improve printing speed, increase the intensity of the vibration board and reduce the damage caused by outer impact. The present invention provides a device which is equipped with the vibration board, a power supply part, a flow path board and a nozzle board. The vibration board consists of thin-film-shaped memory alloy and a thin-film. The power supply part causes the temperature change of the thin-film-shaped memory alloy. The flow path board is arranged at the thin-film-shaped memory alloy and is provided with a liquid chamber, and one side surrounding the wall face of the liquid chamber forms a flow path. The nozzle board is arranged at the flow path board and is provided with a nozzle. When the thin film is changed, the record liquid is sprayed as the liquid dripping state.

Description

The recording liquid jetting device of printhead and method thereof
The present invention relates to the recording liquid jetting device and the method thereof of printhead, specifically describe, relate to a kind of like this apparatus and method, promptly, the variations in temperature of film shape memorial alloy makes vibration plate vibrates in this device, the regulator solution chamber pressure, and the 2nd film vapor deposition that will have a residual compression stress is on the film shape memorial alloy, can easily regulate the deflection of oscillating plate, regulate recuperability, increase operating frequency, improve print speed, can realize miniaturization, simple structure is produced in batches with semiconductive thin film manufacturing process, and productivity is good.
Usually the printhead that extensively adopts is DOD (Dorp On Demand) mode.This DOD mode needn't make record liquid droplet charged or deflection, does not also need high pressure, can immediately injection record drop, printing easily under atmospheric pressure.Therefore, this mode is used more and more.Its representational ejector principle is the oscillatory type gunite that adopts the heated type gunite of resistance and adopt piezoelectric element (Piezo-Electric).
Fig. 1 illustrates that heated type sprays ratio juris.Adorning in having in the device chamber a1 that writes down liquid, from this chamber a1 towards the jet a2 that is recorded material, burying underground in the chamber a1 bottom of this jet a2 opposition side be used to bring out the resistance a3 that air expands.By the dilated bubble of resistance the record liquid of chamber a1 inside is released jet a2, record liquid sprays towards being recorded material under this power effect.
Fig. 2 illustrates the oscillatory type injection method principle that adopts piezoelectric element.Adorning the chamber b1 that writes down liquid in having in the device, from this chamber b1 towards the jet b2 that is recorded material, the piezoelectric element that is used for induced vibration (Piezo-Transducer) buried underground in the bottom of this jet b2 opposition side.
Like this, when the piezoelectric element b3 in chamber b1 bottom had brought out vibration, record liquid was released jet b2 by vibration force, and record liquid is ejected on the record material by this vibration force.
Because this injection method by means of piezoelectric element does not adopt heat, so the selectance of record liquid is big.
In addition, in order to discharge record liquid, adopt marmem in the existing printhead.Opening clear 57-203177 number, spy the Japanese patent gazette spy opens clear 63-57251 number, spy and opens flat 4-247680 number, spy and open flat 2-265752 number, spy and open flat 2-308466 number, spy and open and disclosed the embodiment that uses the printhead of marmem in flat 3-65349 number.Among these existing embodiment, there is the different marmem of phase transformation temperature difference, thickness a plurality of combined and produce diastrophic structure, also has by elastomeric element to produce diastrophic structure etc. with combining of marmem.
But the shortcoming of above-mentioned heated type injection method is, record liquid is heated and brings out chemical change, and this record liquid can stop up attached to the inner face of jet a2, and the life-span of heat generating resistor is short.And,, be unfavorable for the preservation of file owing to use water-soluble record liquid.
The shortcoming of above-mentioned injection method with piezoelectric element is, the processing difficulties of piezoelectric element, particularly piezoelectric element is being paid in the operation of chamber b1 bottom more difficult, so the productivity of batch process is poor.
Adopt the printhead of existing marmem, be not easy to realize miniaturization, the closeness of nozzle is low, and the imaging degree is poor, and manufacturing is not easy, and the property produced in batches is poor.In addition, used marmem is not a film, but thickness is about the thick film of 50 μ m, so the power consumption of when heating is big, cool time is long, and operating frequency is low, and print speed is slow, the shortage practicality.
The present inventor has applied for the invention of a printhead in order to solve above-mentioned each problem, and this printhead is by the pressure variation of liquid chamber and injection record liquid, and the variation of this liquid chamber pressure is produced by film shape memorial alloy variations in temperature.The printhead that this has been applied for is because the generation power (Actuating force) of film shape memorial alloy is big, so can reduce the obstruction of nozzle, and because the deflection of film shape memorial alloy is big, so, can make printhead little, improve the closeness of nozzle, improve the imaging degree.Can easily must lead the film shape memorial alloy with semiconductive thin film manufacturing process and substrate etching work procedure, improve the property produced in batches.
The present invention is the improvement of having applied for printhead to above-mentioned, the purpose of this invention is to provide a kind of recording liquid jetting device and method thereof of printhead.In the apparatus and method of the present invention, the 2nd film that enables to regulate oscillating plate deflection and recuperability with semiconductive thin film manufacturing process combines with the film shape memorial alloy, when in the process of film shape memorial alloy cooling, resetting into the flexural deformation state, by increasing this recuperability, make record liquid spray the time shortening that the after vibration plate resets into the flexural deformation state, increase operating frequency, improve print speed, and the intensity of raising oscillating plate, reduce the damage that produces because of external impact.
To achieve these goals, printhead recording liquid jetting device of the present invention is characterized in that, has oscillating plate, power suppling part, stream plate and nozzle plate;
Oscillating plate by the film shape memorial alloy and at least a slice the 2nd film constitute, the marmem material of film shape memorial alloy changes shape by varying with temperature is made, the 2nd film combines and regulates its change of shape amount with the film shape memorial alloy;
Power suppling part makes the film shape memorial alloy produce variations in temperature;
The stream plate is arranged on the film shape memorial alloy, is formed for the liquid chamber of store recording liquid, flows into the stream of usefulness for record liquid in the side formation of the wall that surrounds liquid chamber;
The nozzle plate is arranged on the stream plate, forms the nozzle of area less than the liquid chamber area of stream plate on it, and when above-mentioned film changes shape, record liquid is ejected with droplet morphology.
Recording liquid jetting device of the present invention can overcome the mode of employing piezoelectric element of the prior art and make the shortcoming of the mode of air expansion by heating, also can overcome the shortcoming of existing employing marmem mode, on substrate, form oscillating plate with semiconductive thin film manufacturing process, this oscillating plate is made of film shape memorial alloy and the 2nd film with residual compression stress, part to substrate is carried out etching, formation makes the vibratile spatial portion of oscillating plate, by means of the vibration jet drop of oscillating plate.
This injection apparatus is after using vacuum cathode metallikon evaporation on the substrate, heat-treats, and forms the film shape memorial alloy.Therefore, become the flat pattern of parent phase state.The 2nd film also is to combine with the film shape memorial alloy with semiconductive thin film manufacturing process.The 2nd film of evaporation can have residual compression stress, according to evaporation coating method, evaporation conditioned disjunction material, can change the size of residual compression stress.The part of substrate is carried out etching and when forming spatial portion, and the oscillating plate that is made of film shape memorial alloy and the 2nd film produces flexural deformation under the residual compression stress effect of the 2nd film.When the film shape memorial alloy is heated, be varied to flat form by marmem, at this moment, the liquid chamber volume reduces, and record liquid is ejected.When the film shape memorial alloy is cooled,, at this moment, write down refill (Refill) of liquid by means of the residual compression stress generation flexural deformation of the 2nd film.This process is carried out continuous record liquid injection repeatedly.
Simple structure of the present invention, just can make the oscillating plate that constitutes by film shape memorial alloy and the 2nd film with semiconductive thin film manufacturing process and substrate etching work procedure, utilization is by the residual compression stress of the 2nd film of semiconductive thin film manufacturing process manufacturing, the displacement of the required oscillating plate of injection record liquid can be obtained easily, batch process can be improved.In addition, the size of the residual stress by changing the 2nd film can be regulated deflection, can obtain big addendum modification, thereby can reduce the area of oscillating plate.Therefore, can realize the miniaturization of printhead, improve the closeness of nozzle, improve the imaging degree.In addition, the 2nd film is regulated the variation that the flexural deformation direction can realize the recording liquid jetting device structure.
Among the present invention, owing to adopt the film shape memorial alloy, power consumption when having reduced heating, also reduce cool time, after record liquid sprayed, when the film shape memorial alloy was reset into diastrophic state by the residual compression stress of the 2nd film, its recuperability did not produce residual vibration by force, so, the injection that can stably write down liquid.Therefore, operating frequency increases, and improves print speed.
Fig. 1 is the sectional drawing of existing heated type injection apparatus.
Fig. 2 is the sectional drawing of existing piezoelectric element formula injection apparatus.
Fig. 3 is the exploded perspective view of one embodiment of the invention injection apparatus.
Fig. 4 is the stereogram that the record liquid of expression one embodiment of the invention flows.
Fig. 5 A, Fig. 5 B, Fig. 5 C are the positive views of one embodiment of the invention injection apparatus.
Fig. 6 A, Fig. 6 B, Fig. 6 C are sectional view, the expression course of action of one embodiment of the invention injection apparatus.
Fig. 7 is the line chart of the phase change of expression film shape memorial alloy of the present invention.
Fig. 8 is the process chart of expression oscillating plate manufacture method of the present invention.
Fig. 9 is the block diagram of expression oscillating plate manufacture method of the present invention.
Figure 10 is the line chart of expression film heat time heating time of the present invention and temperature.
Figure 11 is the sectional drawing of expression oscillating plate size of the present invention.
Figure 12 A, 12B, 12C are the sectional drawings of another embodiment of the present invention injection apparatus, are the figure of expression course of action.
Figure 13 A, 13B, 13C, 13D are the sectional drawings of expression another embodiment of the present invention injection apparatus.
Figure 14 A, 14B are the sectional drawings of expression another embodiment of the present invention injection apparatus.
Below, with reference to the description of drawings embodiments of the invention.
Fig. 3 is the exploded perspective view of one embodiment of the invention injection apparatus, and Fig. 4 is the stereogram that record liquid flows in expression one embodiment of the invention.Injection apparatus of the present invention, in order to improve the imaging degree, the nozzle 19 of injection record liquid sets many rows in vertical, horizontal, and the oscillating plate 12 that record liquid is sprayed is corresponding one by one with these nozzles 19.That is,, form the spatial portion 11 of a plurality of perforation upper and lower sides, have a plurality of oscillating plates 12 that are combined in the top of substrate 10 and stop up each spatial portion 11 in the front and back of substrate 10.Oscillating plate 12 is by means of the variations in temperature vibration, and the power that produces during vibration (generation power) is sprayed record liquid 20.This oscillating plate 12 is made of film shape memorial alloy (Thin film Shaoememory alloy) 12a and the 2nd film 12b, the 2nd film 12b is made of the material of the deflection that can regulate oscillating plate 12 and recuperability, flexural deformation speed (recuperability) is increased, improve operating frequency.
Also have the stream plate 13 on topped substrate 10 tops, on this stream plate 13, directly over each oscillating plate 12, form the liquid chamber 14 of accommodating record liquid 20.Central authorities at stream plate 13 have the primary flow path 15 that flows through for record liquid 20, and primary flow path 15 is interconnected by stream 16 with liquid chamber 14.In a side of substrate 10, have the liquid inlet 17 that is communicated with a side primary flow path 15 of stream plate 13, record liquid 20 is fed into primary flow path 15.
Also have the nozzle plate 18 that is combined in stream plate 13 tops, form a plurality of nozzles 19 on nozzle plate 18, these nozzles 19 are corresponding with each liquid chamber 14 on being formed on stream plate 13.In addition, each nozzle 19 is corresponding with the oscillating plate 12 that exposes towards liquid chamber 14 sides, and during these oscillating plate 12 vibrations, the pressure of liquid chamber 14 changes, and record liquid 20 is ejected on the printing paper by each nozzle 19 with the drop state.
The film shape memorial alloy 12a that constitutes oscillating plate 12 produces phase change continuously because of variations in temperature, causes vibration in this process, and record liquid 20 is ejected with the drop state by each nozzle 19.Shown in Fig. 5 A, film shape memorial alloy 12a is heated by power suppling part 21.That is, be combined in when having connected the power supply of power suppling part 21 on the electrode 21a at film shape memorial alloy 12a two ends, film shape memorial alloy 12a is heated because of impedance own, and temperature rises and becomes flat.When the dump of power suppling part 21, film shape memorial alloy 12a cools off naturally, and oscillating plate 12 is returned to the original state of heaving by the 2nd film 12b.
Shown in Fig. 5 B, also paid in the side of the 2nd film 12b heating film shape memorial alloy 12a by the heater 21b of the power supply of power suppling part 21 heating.In addition, shown in Fig. 5 C,, also heat dissipation film 12c can paid bottom surface at the 2nd film 12b in order to improve the cooling velocity of oscillating plate 12.Heat dissipation film 12c makes the oscillating plate 12 that has been heated cool off at short notice and restore, thereby the operating frequency of oscillating plate 12 is increased.This heat dissipation film 12c is made of the good nickel of thermal diffusivity (Ni), and its thickness is about 0.5 μ m～3 μ m.The film shape memorial alloy 12a that constitutes oscillating plate 12 is a main component with titanium (Ti) and nickel (Ni), and its thickness is about 0.1 μ m～5 μ m.The 2nd film 12b silica (the Thermallygrown Sio of heat 2) or polysilicon (Polysilicon) etc. make, its thickness is about 0.1 μ m～3 μ m.
Fig. 6 A to Fig. 6 C is the cross-sectional side view of one embodiment of the invention injection apparatus.The material of substrate 10 is a silicon.Oscillating plate 12 is at the opposition side of nozzle 19, its A-stage is to be the deformation state of heaving, under this state, when film shape memorial alloy 12a is heated to fixed above temperature, oscillating plate 12 becomes flat, at this moment, the interior pressure of liquid chamber 14 increases and is compressed, and record liquid 20 just ejects by nozzle 19.
When film shape memorial alloy 12a temperature drops to design temperature when following, oscillating plate 12 is under the residual compression stress effect of the 2nd film 12b, return to the original state of heaving, at this moment, the internal drop of liquid chamber 14 is low, record liquid 20 flows into liquid chamber 14 under the capillarity and inhalation power effect of nozzle 19.Following said process repeatedly continuously, record liquid ejects as the drop state.In addition, be deformed into when heaving state at oscillating plate 12, the recuperability of oscillating plate 12 is strengthened by the residual compression stress of the 2nd film 12b, operating frequency increases, and promptly the 2nd film 12b increases the recuperability of oscillating plate 12, can restore at short notice, like this, additional being able to of record liquid carried out very soon, can immediately write down the injection of liquid, can improve the responsiveness of printhead.
Fig. 8 is the process chart of expression oscillating plate manufacture method of the present invention.Fig. 9 is the block diagram of expression oscillating plate manufacture method of the present invention, adopts semiconductive thin film manufacturing process and substrate etching work procedure.Have step (100)～(108).In step (100), on the substrate 10 that constitutes by materials such as silicon, glass, metal or polymer, form the 2nd film 12b with semiconductive thin film manufacturing process, and make it have a certain size residual compression stress.In step (101), film shape memorial alloy 12a evaporation on the top of the 2nd film 12b, is constituted oscillating plate 12.The method of this evaporation mainly adopts vacuum cathode spraying plating (Sputterdeposition).In step (102), with certain temperature film shape memorial alloy 12a is carried out the heat treatment of certain hour, make its crystallization, dull and stereotyped state is remembered as parent phase.In step (103), make film shape memorial alloy 12a be cooled to promptly about 40～70 ℃ of martensite finishing temperature (Mf), become martensite.
In step (104), etching is carried out in the positive bottom of oscillating plate 12, on substrate 10, form spatial portion 11, make oscillating plate 12 to exposing outside.In step (105), while make oscillating plate 12 to expose outside make its under the residual stress effect of the 2nd film 12b to bottom (or top) flexural deformation, become shape shown in Fig. 6 A.The 2nd film 12b, in the process that forms with semiconductive thin film manufacturing process, can regulate the size of residual stress according to evaporation condition and material, by upside that the 2nd film 12b is formed on film shape memorial alloy 12a or the bending direction that downside can determine oscillating plate 12.
In this diastrophic process, film shape memorial alloy 12a is keeping martensite.In step (106), film shape memorial alloy 12a is heated to design temperature, when being about 50～90 ℃ of parent phase finishing temperature (Af), is deformed into the dull and stereotyped state shown in Fig. 6 B, record liquid 20 is injected.In step (107), film shape memorial alloy 12a is cooled and when becoming martensite, flexural deformation under the residual compression stress effect of the 2nd film 12b, and record liquid 20 is added to liquid chamber 14.In step (108), above steps (106), (107) repeatedly by means of the variations in temperature of film shape memorial alloy 12a, record liquid 20 is injected and print as the drop state.
Film shape memorial alloy 12a of the present invention is out of shape by means of temperature difference, becomes the flat of parent phase when heating, becomes martensite flexural deformation during cooling, so the vibration number (operating frequency) of the more little film 12 of temperature difference increases more.Therefore, in order to reduce temperature difference, can in the alloy of titanium (Ti) and nickel (Ni), add copper (Cu).Like this, adopted the marmem of titanium, nickel, copper can reduce the phase change temperature difference, the vibration number that can increase film shape memorial alloy 12a is operating frequency, improves print speed.
Below, illustrate that the film shape memorial alloy of the present invention of above-mentioned structure forms the possibility of drop.
The energy density that is produced by film shape memorial alloy 12a is 10 * 10 to the maximum 6J/m 3, whether when the size that is exposed to spatial portion 11 of film shape memorial alloy 12a was 200 * 200 * 1 μ m, the liquid-drop diameter of establishing generation was 60 μ m, then can make to spray as shown in the formula ground decision film to produce.
U＝U s+U k
U s＝πR 2V U k = 1 12 πρ R 3 γ 2
U=produces the energy of the drop needs of required record liquid
U sThe surface energy of=record liquid
U kThe kinergety of=record liquid
The diameter of R=drop
The speed of V=record liquid
Density (the 1000kg/m of ρ=record liquid 3)
The surface tension (0.073N/m) of γ=record liquid
If the liquid drop speed of wishing is 10m/sec, then institute's energy requirement (U) is
U＝2.06×10 -10+7.07×10 -10＝9.13×10 -10j
The ceiling capacity that film shape memorial alloy 12a produces is
W max＝W v·V
W max＝(10×10 8)·(200×200×1)
＝4×10 -7j
In addition, when liquid-drop diameter was 100 μ m, energy needed was
U＝3.85×10 -9j
Therefore, because W Max" U, so can form the drop of required size.That is, because the power that film shape memorial alloy 12a produces is very big, so can obtain the drop of required record liquid easily.
Below, the addendum modification that heat time heating time in analysis one embodiment of the invention and consumed energy and residual compression stress cause.Connect power supply for film shape memorial alloy 12a, produce heat by itself impedance, this heat causes phase change, though ask 25 ℃ film shape memorial alloy 12a be heated to 70 ℃ its become required heat time heating time of parent phase and consumed energy.Obtain with following formula.
Material=the TiNi of film shape memorial alloy
The length of film shape memorial alloy (1)=400 μ m
The density of film shape memorial alloy (ρ s)=6450kg/m 3
Temperature variation (Δ T)=70-25=45 ℃
Thermal capacity (Specific heat) (C ρ)=230J/kg ℃
Ratio opposing (the ρ)=80 μ cm of film shape memorial alloy
Electric current (I)=1.0A
The width of film shape memorial alloy (W)=300 μ m
The height of film shape memorial alloy (t)=1.0 μ m
Heat time heating time (t n) t h = ρ s Δ TC D ( W · t ) 2 ρ · I 2 = 7.4 μ sec The impedance of film shape memorial alloy (R)=ρ (1/Wt)=1.1 Ω consumes electric power (I 2R)=the required energy of 1.1Watt generation drop
The heat time heating time * consumption electric power=8.1 μ J
Therefore, injection record liquid 20, produce the required energy of drop and be about 8.1 μ J, reduced consumed energy than 20 μ J of mode of heating before.
Figure 10 is the heat time heating time of expression film shape memorial alloy of the present invention and the line chart of temperature, and the physics value that is used to test is as follows.
The thickness of film shape memorial alloy 12a is 1 μ m, and environment temperature is 25 ℃.
When environment temperature is 25 ℃, is heated to 70 ℃ and becomes, be cooled to about 200 μ sec of time of 30 ℃ again, be scaled vibration frequency and then be about 5KHz to behind the parent phase.Therefore, the operating frequency of printhead is about 5KHz.But the temperature (martensite finishing temperature) that distortion is all over is about 45 ℃, so, there is no need to be cooled to 30 ℃, can heat again before this, continue injection record liquid 20, so, can improve the above operating frequency of 5KHz.Operating frequency greatly then print speed is fast.
Below, the addendum modification and the recuperability that cause with reference to Figure 11 analysed film marmem with because of himself residual compression stress.
During a=b, a=200 μ m
Material=the TiNi of film shape memorial alloy
The Young's modulus of film shape memorial alloy (Em)=30GPa
Residual compression stress=the 30MPa that is present in the film shape memorial alloy
Poisson's ratio (Poisson ' sratio) (ν)=0.3
Length=the a of the film shape memorial alloy that exposes to spatial portion 11
Thickness=the h of film shape memorial alloy m
Width=the b of the film shape memorial alloy that exposes to spatial portion 11
Critical pressure (the S of film shape memorial alloy Cr) S cr = 4.38 h 2 m a 2 E m 1 - v 2 - - - ( 1 ) S CrCenter displacement (the δ of=3.6MPa film shape memorial alloy m): δ m = 2.298 h m ( S S cr - 1 ) - - - ( 2 ) δ mThe ceiling capacity W that=6.2 μ m film shape memorial alloys produce Max=W VV (W V: the energy J/m that per unit film shape memorial alloy can be brought into play 3V: the volume W of film shape memorial alloy Max=(10 * 10 6) (200 * 200 * 1)=4 * 10 -7During the j cooling, the energy (U that the bending of film shape memorial alloy (Buckling) produces m) be U m = 2500 D m h 2 m 33 a 2 ( S S cr - 1 ) 2 D m = E m h 3 m 12 ( 1 - v 2 ) ＝2.8×10 -10j
After record liquid 20 sprayed, the energy that produces when the film shape memorial alloy is crooked becomes made the film shape memorial alloy produce diastrophic recuperability P.Recuperability is as follows.
U m＝P·ΔV
Volume Changes (Δ V)=(δ sα 2)/4=6.2 * 10 -14m 3
Recuperability (P)=4.5KPa
Suppose that 1/2 of Volume Changes that the bending of film shape memorial alloy produces is used for spraying, and then can form the drop of 39 μ m.
Addendum modification with respect to film shape memorial alloy thickness is as shown in the table, and unit is (μ m).
Table 1
????a×b×h m 300×120×0.5 ?400×120×0.5 ?600×120×0.5
Addendum modification 4.5 ?4.5 ?4
????a×b×h m 300×150×0.5 ?400×150×0.5 ?600×150×0.5
Addendum modification 5.7 ?5.7 ?5.7
????a×b×h m 300×200×0.5 ?400×200×0.5 ?600×200×0.5
Addendum modification 7.4 ??7.6 ?7.6
????a×b×h m 300×120×1.0 ??400×120×1.0 ?600×120×1.0
Addendum modification 4.0 ??4.0 ?4.0
????a×b×h m 300×150×1.0 ??400×150×1.0 ?600×150×1.0
Addendum modification 5.3 ??5.3 ?5.3
????a×b×h m 300×200×1.0 ??400×200×1.0 ?600×200×1.0
Addendum modification 7.1 ??7.4 ?7.4
????a×b×h m 300×120×1.5 ??400×120×1.5 ?600×120×1.5
Addendum modification 3.1 ??3.1 ?3.1
????a×b×h m 300×150×1.5 ??400×150×1.5 ?600×150×1.5
Addendum modification 4.6 ??4.6 ?4.6
????a×b×h m 300×200×1.5 ??400×200×1.5 ?600×200×1.5
Addendum modification 6.7 ??6.9 ?6.9
In addition, when not having residual compression stress on the film shape memorial alloy 12a that constitutes oscillating plate 12, ask the addendum modification and the recuperability of the residual compression stress generation of the 2nd film 12b by the following method.
(seeing Figure 11)
During a=b, a=200 μ m
Material=the TiNi of film shape memorial alloy
The material of the 2nd film=thermal oxide SiO 2
The Young's modulus of film shape memorial alloy (Em)=30GPa
Young's modulus (the E of the 2nd film s)=70GPa
Act on residual compression stress (the S)=300MPa of the 2nd film
Poisson's ratio (Poisson ' s ratio) (γ)=0.3
Length=the a of the oscillating plate 12 that exposes to spatial portion 11
Width=the b of the oscillating plate 12 that exposes to spatial portion 11
Thickness (the h of film shape memorial alloy m)=1 μ m
Thickness (the h of the 2nd film s)=1 μ m
Critical pressure (the S of the 2nd film Cr) S cr = 4.38 h 2 m a 2 E m 1 - v 2 - - - ( 1 )
S cr＝8.4MPa
Center displacement (the δ of the 2nd film when combining with the film shape memorial alloy s): δ m = 2.298 h ( S S cr - 1 ) - - - - ( 2 ) δ sBending (bending) energy (U that the residual compression stress of=13.5 μ m the 2nd film produces b) U b = Π 4 δ 2 D s α 2 ????????????? D s = E s h 3 s 12 ( 1 - v 2 ) ＝2.9×10 -19j
The flexional of the 2nd film stores as the flexional of the oscillating plate 12 that is made of film shape memorial alloy and the 2nd film. U b = Π 2 δ 2 D s α 2 + Π 4 δ 2 D m α 2
D s＝6.5×10 -9N/m
D m＝2.7×10 -9N/m
Ask the addendum modification (δ) of oscillating plate 12 with preceding formula, then
δ＝11.4μm
When record liquid sprayed because of the heating of film shape memorial alloy, the energy that is lost by the 2nd film was the flexional of the residual compression pressure generation of the 2nd film.
Flexional (U s)=2.9 * 10 -9j
The ceiling capacity W that the film shape memorial alloy produces Max=W VV
(W V: the energy J/m that per unit film shape memorial alloy can be brought into play 3
V: the volume of film shape memorial alloy
W max＝(10×10 6)·(200×200×1)＝4×10 -7j
The energy of the 2nd film consumption is calculated the ratio (U of ceiling capacity with respect to this of film shape memorial alloy s/ W Max) be 0.73%.Therefore, when record liquid sprays, can ignore the loss influence of the energy that the 2nd film causes.Energy (the U that produces when the 2nd film is crooked s) U S = 2500 D s h 2 s 33 α 2 ( S S cr - 1 ) 2 = 1.5 × 10 - 8 j
After record liquid sprays, the energy U that produces when the 2nd film is crooked sBecome recuperability (P) for oscillating plate 12.Recuperability is as follows.
U s＝P·ΔV
Volume Changes (Δ V)=(δ sα)/4=1.4 * 10 -13m 3
Recuperability (P)=107.1KPa
Suppose that 1/2 of Volume Changes that the distortion of oscillating plate 12 produces is used for spraying, then liquid-drop diameter is 51 μ m.
The structure that only is made of the film shape memorial alloy is compared with the oscillating plate that is made of film shape memorial alloy and the 2nd film, and addendum modification is increased to 11.4 μ m from 6.2, has increased by 2 times approximately.Recuperability is increased to 107.1KPa from 4.5KPa, has increased by 20 times approximately.Therefore, adopt the 2nd film can easily obtain required addendum modification, can increase recuperability.
The addendum modification of the oscillating plate 12 that is made of film shape memorial alloy and the 2nd film is as shown in the table, and its unit is (μ m)
Table 2
??a×b×h m ?300×120×0.5 ??400×120×0.5 ?600×120×0.5
Addendum modification ?9.1 ??9.1 ?9.1
??a×b×h m ?300×150×0.5 ??400×150×0.5 ?600×150×0.5
Addendum modification ?11.4 ??11.5 ?11.5
??a×b×h m ?300×200×0.5 ??400×200×0.5 ?600×200×0.5
Addendum modification ?15.0 ??15.4 ?15.4
??a×b×h m ?300×120×1.0 ??400×120×1.0 ?600×120×1.0
Addendum modification ?7.8 ??7.8 ?7.8
??a×b×h m ?300×150×1.0 ??400×150×1.0 ?600×150×1.0
Addendum modification ?9.8 ??9.8 ?9.8
??a×b×h m ?300×200×1.0 ??400×200×1.0 ?600×200×1.0
Addendum modification ?12.9 ??13.2 ?13.3
??a×b×h m ?300×120×1.5 ??400×120×1.5 ?600×120×1.5
Addendum modification ?6.0 ??6.0 ?6.0
??a×b×h m ?300×150×1.5 ??400×150×1.5 ?600×150×1.5
Addendum modification ?7.5 ??7.5 ?7.5
??a×b×h m ?300×200×1.5 ??400×200×1.5 ?600×200×1.5
Addendum modification ?9.8 ??10.1 ?10.1
Figure 12 is the sectional drawing of another embodiment of the present invention injection apparatus, annotates with same numeral with same parts among Fig. 3.Among this embodiment, have stream plate 13 and nozzle plate 18 in the bottom of substrate 10, the bonding state of expression film.On substrate 10, form the spatial portion 11 that above-below direction connects, also have the top that is combined in substrate 10 and the oscillating plate 12 of cover space portion 11.Oscillating plate 12 vibrates by means of the variations in temperature of film shape memorial alloy 12a, and the power that produces during this vibration is sprayed record liquid 20.The 2nd film 12b that constitutes oscillating plate 12 increases the flexural deformation speed (recuperability) of oscillating plate 12, improves operating frequency.
Also have the stream plate 13 of topped substrate 10 bottoms, on this stream plate 13, form and spatial portion 11 liquid chambers 14 corresponding, that accommodate record liquid 20.Also have the nozzle plate 18 that is combined in stream plate 13 bottoms, on this nozzle plate 18, form the nozzle 19 corresponding with above-mentioned liquid chamber 14.Nozzle 19 is corresponding with the oscillating plate 12 that exposes towards liquid chamber 14 1 sides, and during oscillating plate 12 distortion, the pressure of liquid chamber 14 changes, and record liquid 20 is ejected on the printing paper by nozzle 19 with the drop state.
Like this, in the present embodiment after film shape memorial alloy 12a has been formed at the top of substrate 10, the top of the 2nd film 12b evaporation at film shape memorial alloy 12a.Then, form spatial portion 11 with the bottom that is etched in substrate 10, like this, oscillating plate 12 just can produce flexural deformation under the residual compression stress effect of the 2nd film 12b.When this diastrophic state heating film shape memorial alloy 12a, oscillating plate 12 distortion become the tabular attitude, be cooled then and flexural deformation to A-stage.In the bending deformation process of oscillating plate 12, the recuperability that the residual compression stress of the 2nd film 12b causes is reinforced, and operating frequency improves.
Figure 13 is the sectional drawing of another embodiment of the present invention injection apparatus, and the parts identical with above-mentioned the 1st embodiment are annotated with same numeral.In the present embodiment, form oscillating plate 12, form stream plate 13 and nozzle plate 18 respectively on the top of substrate 10 in the bottom of substrate 10.That is, in the not heated A-stage of film shape memorial alloy 12a, oscillating plate 12 is the states that are projected into spatial portion 11 inside, becomes after the heating to be flat form.Therefore, when oscillating plate 12 was heated as flat, record liquid 20 added to liquid chamber 14 inside, and during flexural deformation, liquid chamber 14 pressure inside increase during oscillating plate 12 cooling, and record liquid 20 is ejected.
Figure 14 is the sectional drawing of another embodiment of the present invention injection apparatus, and the parts identical with above-mentioned the 1st embodiment are annotated with same numeral.In the present embodiment, used some the 2nd film 12b, constituted the 2nd film 12b with different materials.Among Figure 14 A, 2 the 2nd film 12b of formation below film shape memorial alloy 12a.Among Figure 14 b, form the 2nd film 12b respectively in the top and bottom of film shape memorial alloy 12a.This structure can be strengthened the recuperability of oscillating plate 12 more, obtains required addendum modification more easily.In addition, can also increase oscillating plate 12 durability, guarantee reliability.
As mentioned above, according to the present invention, oscillating plate vibrates by means of the variations in temperature of film shape memorial alloy, and this vibration is sprayed record liquid.Because in conjunction with the 2nd film with residual compression stress, so when resetting into A-stage being cooled, this residual compression stress is strengthened recuperability, operating frequency increases.Because the addendum modification of oscillating plate is big, each spatial portion that is formed on the substrate can reduce with each liquid chamber that is formed on the stream plate, like this, has reduced the overall dimensions of printhead, can realize miniaturization, improves the closeness of nozzle, helps realizing high imaging degree.
Because the intensity of oscillating plate is strengthened because of the 2nd film, so the damage that external impact causes is little.Because the power that takes place during vibration is big, the power that record liquid is released increases, and can reduce the obstruction of nozzle, improves reliability.And the drop size of record liquid can form very for a short time, can obtain high print quality.Because driving voltage below 10 volts, so the design of drive circuit and making all are easy to, very easily obtains oscillating plate with conventional semiconductor thin film fabrication operation and etching work procedure, so, can improve the productivity of producing in batches, and simple structureization.

Claims (19)

1. the recording liquid jetting device of a printhead is characterized in that, has oscillating plate (12), power suppling part (21), stream plate (13) and nozzle plate (18);
Oscillating plate (12) by film shape memorial alloy 12a and at least a slice the 2nd film (12b) constitute, the marmem material of film shape memorial alloy (12a) changes shape by varying with temperature is made, and the 2nd film (12b) combines and regulate its change of shape amount with film shape memorial alloy (12a);
Power suppling part (21) makes above-mentioned film shape memorial alloy (12a) produce variations in temperature;
Stream plate (13) is arranged on the above-mentioned film shape memorial alloy (12a), is formed for the liquid chamber (14) of store recording liquid (20), flows into the stream (16) of usefulness for record liquid (20) in the side formation of the wall that surrounds above-mentioned liquid chamber (14);
Nozzle plate (18) is arranged on the above-mentioned stream plate (13), form the nozzle (19) of area on it less than liquid chamber (14) area of above-mentioned stream plate (13), when (12) film memorial alloy 12a changes shape, above-mentioned record liquid (20) is ejected with droplet morphology.
2. the recording liquid jetting device of printhead as claimed in claim 1 is characterized in that, above-mentioned film shape memorial alloy (12a) is to be the marmem of main component with titanium (Ti) and nickel (Ni).
3. the recording liquid jetting device of printhead as claimed in claim 2 is characterized in that, in order to reduce the phase change temperature difference, to improve operating frequency, has also added copper (Cu) in the above-mentioned film shape memorial alloy (12a).
4. the recording liquid jetting device of printhead as claimed in claim 1 is characterized in that, the thickness of above-mentioned film shape memorial alloy (12a) is about 0.3～5 μ m.
5. the recording liquid jetting device of printhead as claimed in claim 1 is characterized in that, the thickness of above-mentioned the 2nd film (12b) is about 0.1～3 μ m.
6. the recording liquid jetting device of printhead as claimed in claim 1 is characterized in that, above-mentioned the 2nd film (12b) contains thermal silicon dioxide (SiO 2).
7. the recording liquid jetting device of printhead as claimed in claim 1 is characterized in that, above-mentioned the 2nd film (12b) contains polysilicon.
8. the recording liquid jetting device of printhead as claimed in claim 1, it is characterized in that, above-mentioned power suppling part (21) has the electrode (21a) that is combined in film shape memorial alloy (12a) two ends, makes film shape memorial alloy (12a) be generated heat by direct impedance.
9. the recording liquid jetting device of printhead as claimed in claim 1 is characterized in that, above-mentioned power suppling part (21) has the heater (21b) that is formed on oscillating plate (12) one sides, by connecting power supply heating film shape memorial alloy (12a).
10. the recording liquid jetting device of printhead as claimed in claim 1 is characterized in that, has the heat dissipation film (12c) that is formed on oscillating plate (12) one sides, and the film (12c) that should loose when cooling off again after film shape memorial alloy (12a) is heated makes thermal transpiration.
11. the recording liquid jetting device of printhead as claimed in claim 10 is characterized in that, the thickness of above-mentioned heat dissipation film (12c) is about 0.5～3 μ m.
12. the recording liquid jetting device of printhead as claimed in claim 10 is characterized in that, above-mentioned heat dissipation film (12c) contains the good nickel of heat conductivity (Ni).
13. the recording liquid jetting device of printhead as claimed in claim 1 is characterized in that, has to be arranged on the following substrate (10) of oscillating plate (12), goes up the spatial portion (11) that formation can make oscillating plate (12) change of shape at this substrate (10).
14. the recording liquid jetting device of printhead as claimed in claim 13 is characterized in that, above-mentioned oscillating plate (12) exposes towards spatial portion (11), and the area of its change of shape is: width (b) is 100 μ m-500 μ m, and length (a) is 100～300 μ m.
15. the recording liquid jetting device of printhead as claimed in claim 13 is characterized in that, aforesaid substrate (10) contains the monocrystalline silicon material.
16. the recording liquid jetting device of printhead as claimed in claim 1 is characterized in that, above-mentioned oscillating plate (12) is changed to the dull and stereotyped state of parent phase when film shape memorial alloy (12a) is heated to the parent phase finishing temperature; When being cooled to the martensite finishing temperature, film shape memorial alloy (12a) is changed to martensite, at this moment by the residual compression stress flexural deformation of the 2nd film (12b).
17. the recording liquid jetting device of printhead as claimed in claim 16 is characterized in that, the parent phase finishing temperature of film shape memorial alloy (12a) is about 50～90 ℃, and the martensite finishing temperature is about 40～70 ℃.
18. the recording liquid jetting device of printhead as claimed in claim 16 is characterized in that, above-mentioned film shape memorial alloy (12a) is heated to and is cooled to the martensitic time behind the parent phase and is about below the 200 μ sec, and operating frequency is more than the 5KHz.
19. the record liquid injection method of a printhead is characterized in that having step (100)～(108);
In step (100), go up formation the 2nd film (12b) at substrate (10);
In step (101), on film shape memorial alloy (12a) evaporation to the 2 films (12b), form oscillating plate (12);
In step (102), (12a) heat-treats to the film shape memorial alloy, and flat board is remembered as parent phase;
In step (103), cool off above-mentioned film shape memorial alloy (12a), make it become martensite;
In step (104), the part of substrate (10) is carried out etching, the part of above-mentioned oscillating plate (12) is exposed;
In step (105), make the extending part of oscillating plate (12) be produced flexural deformation by the residual compression stress of the 2nd film (12b);
In step (106), film shape memorial alloy (12a) is heated and becomes tabular, and record liquid (20) is ejected;
In step (107), film shape memorial alloy (12a) is cooled and becomes martensite, is produced flexural deformation by the residual compression stress of above-mentioned the 2nd film (12b), and record liquid (20) is added to the inside of liquid chamber (14);
In step (108), by means of the variations in temperature of film shape memorial alloy (12a), above-mentioned steps (106), (107) repeatedly, record liquid (20) is injected and print with droplet-like.
CN97122162A 1997-03-10 1997-11-21 Recording liquid jetting device of printing head and method thereof Pending CN1192963A (en)

Applications Claiming Priority (2)

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KR8268/97 1997-03-10
KR19970008268 1997-03-10

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101855090B (en) * 2007-11-12 2013-03-27 京瓷株式会社 Channel member, inkjet head structure and inkjet recording device

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100472494B1 (en) * 2003-06-10 2005-03-09 삼성전자주식회사 Micro actuator using a shape memory alloy

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101855090B (en) * 2007-11-12 2013-03-27 京瓷株式会社 Channel member, inkjet head structure and inkjet recording device

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