CN118629735A - Varistor module and method for producing a varistor module - Google Patents
Varistor module and method for producing a varistor module Download PDFInfo
- Publication number
- CN118629735A CN118629735A CN202310213606.2A CN202310213606A CN118629735A CN 118629735 A CN118629735 A CN 118629735A CN 202310213606 A CN202310213606 A CN 202310213606A CN 118629735 A CN118629735 A CN 118629735A
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- varistor
- contact
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- fixed
- metal
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 8
- 239000002184 metal Substances 0.000 claims abstract description 68
- 229910052751 metal Inorganic materials 0.000 claims abstract description 68
- 238000005476 soldering Methods 0.000 claims description 36
- 238000000034 method Methods 0.000 claims description 27
- 239000004033 plastic Substances 0.000 claims description 27
- 229920003023 plastic Polymers 0.000 claims description 27
- 238000003466 welding Methods 0.000 claims description 17
- 239000011248 coating agent Substances 0.000 claims description 12
- 238000000576 coating method Methods 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229920000106 Liquid crystal polymer Polymers 0.000 claims description 6
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 claims description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 4
- 238000002844 melting Methods 0.000 description 5
- 230000008018 melting Effects 0.000 description 5
- 229910000831 Steel Inorganic materials 0.000 description 4
- 239000010959 steel Substances 0.000 description 4
- 239000000428 dust Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
Landscapes
- Thermistors And Varistors (AREA)
Abstract
The present invention relates to a varistor module and a method for producing a varistor module. A varistor module is provided comprising a varistor (1), a contact element (2, 3) fixed to the varistor (1) and a terminal (4) comprising a metal contact (7, 8), wherein the contact element (2, 3) is fixed to the metal contact (7, 8), and wherein the metal contact (7, 8) comprises a lower surface (14) facing away from the varistor (1) and configured for surface mounting.
Description
Technical Field
The present invention relates to a varistor module and a method of manufacturing a varistor module.
Background
In applications where high surge capability is critical, particularly for ESD protection, it is common to use monolithic disc varistors that can be soldered via two lead terminals. However, problems arise when varistor modules of this type are used for SMD (surface mounted device) applications. The soldered connection of the lead terminals to the varistor disc is vulnerable to high temperatures occurring during the SMD process. If the lead contacts are soldered to the varistor disc and then the final device is used in an SMD process, the heat applied during the SMD process may loosen the soldered contact between the lead contacts and the varistor, resulting in device failure.
Disclosure of Invention
It is an object of the present invention to provide an improved varistor module and a method for its manufacture.
A varistor module is proposed, comprising a varistor, a contact element fixed to the varistor and a terminal comprising a metal contact, wherein the metal contact is fixed to the contact element, and wherein the metal contact comprises a lower surface facing away from the varistor and configured for surface mounting.
The contact element itself is not intended to be used as a contact surface for surface mounting. Instead, the contact element is fixed to a metal contact of the surface mountable terminal, i.e. it is configured to serve as a contact surface for surface mounting. Thereby, it can be ensured that the high temperatures occurring during the SMD process are not directly applied to the contact elements, but only indirectly to the contact elements via the metal contacts to a somewhat reduced extent. This design protects the fixation of the contact element to the varistor and prevents the contact element from melting in connection with the varistor.
The addition of terminals may make piezoresistors with contact elements including leads compatible with surface mount technology. Even existing varistors with contact elements can be combined with terminals to make the varistors surface mountable, which has not previously been possible.
The piezo-resistor may be a monolithic disc with electrodes on both its upper and lower surfaces. The contact element may be a strip-like element which is fixed to the electrode of the varistor, for example by soldering or welding. The contact element may be used to apply an electrical signal to the varistor. An electrical signal is applied from the outside to the varistor via the metal contacts and the contact elements. In particular, a high voltage and/or a high current may be applied to the varistor via the contact element.
The contact element may comprise a lead. The contact element may consist of a lead. The contact element may be covered by a coating comprising or consisting of copper. The contact element may be covered by a coating comprising or consisting of tin. The use of leads in ESD applications is advantageous because the leads can withstand high surge loads. The contact element may comprise copper coated steel, tin coated steel, copper plated steel or tin plated steel.
The contact element may be fixed to the varistor by soldering or by welding.
Preferably, the contact element is soldered to the metal contact. Alternatively, the contact element is soldered to the metal contact. In particular, high temperature solders with melting temperatures above 250 ℃ may be used to braze the contact elements to the metal contacts. Both welding and soldering offer the advantage that high temperatures are only locally applied at the location where the contact element is fixed to the metal contact. Such local occurrence of high temperatures does not allow for releasable connection of the contact element to the varistor.
The terminal may comprise a plastic base, wherein the metal contact is integrated in the plastic base. The plastic base may comprise a plastic material capable of withstanding high temperatures, particularly those that occur during reflow soldering. For example, the plastic base may comprise or may consist of a Liquid Crystal Polymer (LCP). Alternatively, the plastic base may comprise another plastic material.
The metal contacts integrated in the plastic base may be arranged in the plastic base such that the lower surfaces of the metal contacts are arranged at the lower surfaces of the terminals facing away from the varistor and such that the upper surfaces of the metal contacts are arranged at the upper surfaces of the terminals facing the varistor.
The metal contact may include an upper surface and a soldering region. The upper surface may be parallel to the lower surface and may face the varistor when the varistor is secured to the terminal. The welding region may be perpendicular to the upper surface and may protrude toward the varistor. The contact element may be soldered to the soldering region.
The varistor and the contact element may be covered by a coating. For example, the varistor and the contact element may be covered by a coating comprising a plastic material or a glass material. The coating may provide additional thermal protection for the connection between the varistor and the contact element.
The varistor module may further comprise a housing, wherein the varistor and the contact element are arranged in the housing, and wherein the terminal and the housing enclose a cavity in which the varistor and the contact element are arranged. The housing may protect the varistor from environmental influences, such as moisture or dust. In addition, air may be disposed between the inner surface of the housing and the varistor. The air layer may provide thermal protection that prevents heat transfer to the connection between the contact element and the varistor during the SMD process, thereby also improving the heat resistance of the varistor module.
The varistor module may comprise more than one varistor. For example, at least a second varistor may be provided comprising a second contact element fixed to the second varistor, wherein the terminal comprises a second metal contact fixed to the second contact element (e.g. by welding or soldering), wherein the second metal contact comprises a lower surface facing away from the second varistor and configured for surface mounting. Thus, two or more piezoresistors may be secured to one terminal by soldering or brazing respective contact elements to respective metal contacts of the terminal. The terminals can thus protect the connection between each varistor and each contact element from melting during the SMD process.
Another aspect relates to a method of manufacturing a varistor module. The varistor module manufactured by the method may be the above-described varistor module. The method comprises the following steps:
Providing a varistor with contact elements fixed to the varistor,
-Providing a terminal comprising a metal contact comprising a lower surface configured for surface mounting, and
-Fixing (e.g. soldering) the contact element to the metal contact such that the lower surface of the metal contact faces away from the varistor.
The method may further include the step of placing the housing over the varistor and the contact element such that the housing and the terminals enclose a cavity.
The contact element may be fixed to the varistor by soldering or by welding.
The method may further comprise the steps of:
-providing a second varistor having a second contact element secured to the second varistor, wherein the terminal includes a second metal contact including a lower surface configured for surface mounting, and
-Fixing (e.g. soldering) the second contact element to the second metal contact such that the lower surface of the second metal contact faces away from the second varistor.
Drawings
Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.
Each of fig. 1 and 2 shows a varistor module in perspective view.
Fig. 3 shows a terminal.
Fig. 4 shows a metal contact.
Fig. 5 shows a perspective view of a varistor module comprising a housing.
Fig. 6 shows a varistor module according to a second embodiment, in which a plurality of piezoresistors are arranged on a single terminal.
Fig. 7 shows a welding method of the welding process.
Detailed Description
Each of fig. 1 and 2 shows a varistor module in perspective view.
The varistor module comprises a varistor 1, two contact elements 2,3 and a terminal 4.
The varistor 1 has a first external electrode at its upper surface and a second external electrode at its lower surface. The varistor 1 is a monolithic varistor disc. The varistor 1 is constructed as a monolithic varistor disc. The monolithic varistor disc has a very high surge capacity. The varistor 1 is intended for surge protection. For example, the varistor module may be part of an ESD (esd=electrostatic discharge) protection device.
The contact elements 2, 3 are strips or lead terminals. One of the contact elements 2 is connected to a first external electrode of the varistor 1 and the other contact element 3 is connected to a second external electrode of the varistor 1.
The contact elements 2,3 are fixed to the varistor 1 by soldering. In particular, the first end of each ribbon-shaped contact element 2,3 is fixed to the varistor 1, for example by soldering. As an alternative to a soldered connection, the contact elements 2,3 may be soldered to the varistor 1. Braze and weld connections can withstand higher surge loads than mechanical connections (e.g., clamp connections).
The contact elements 2,3 consist of leads which are tin-plated copper leads or tin-plated highly conductive metal leads.
The varistor 1 and the contact elements 2, 3 are covered by a coating 5, which can be applied by overmolding. The coating 5 comprises a material with a high moisture resistance, such as epoxy or silicone. The coating 5 provides protection against external influences such as dust, moisture etc. Furthermore, the coating reduces the heat transfer from the outside to the varistor 1.
The varistor module is intended for surface mounting.
As will be described below, the varistor is constructed such that the heat applied during the SMD process, in particular during reflow soldering, does not loosen the contact between the contact elements 2, 3 and the varistor 1. Otherwise, releasing the contact between the contact elements 2, 3 and the varistor 1 will lead to a malfunction of the varistor module. In particular, the addition of the terminals 4 ensures that the connection of the contact elements 2, 3 and the varistor 1 is not excessively heated during the SMD process, so that the contact between the contact elements 2, 3 and the varistor 1 is prevented from being released.
The contact elements 2, 3 are not directly surface mounted on an application, such as a printed circuit board. Instead, the varistor module comprises terminals 4 to which the contact elements 2, 3 are fixed. In particular, the ends of the strip-shaped contact elements 2, 3 opposite to the ends fixed to the varistor 1 are fixed to the terminals 4. The contact elements 2, 3 are fixed to the terminals 4 by soldering or by soldering with a high temperature solder having a melting point higher than 250 c.
Fig. 3 shows a more detailed view of the terminal 4. The terminal 4 comprises a plastic base 6 and two metal contacts 7, 8. The terminals 4 are arranged at the bottom side of the varistor module. The varistor 1 is fixed to the terminal 4 via contact elements 2, 3 fixed to the terminal 4. The terminals 4 are surface mounted to an SMD application, for example to a printed circuit board.
The plastic base 6 of the terminal 4 comprises a plastic material capable of withstanding high temperatures, such as a Liquid Crystal Polymer (LCP). In particular, the plastic base 6 can withstand the high temperatures that occur during reflow soldering.
The plastic base 6 comprises two spring arms 9, the spring arms 9 being configured to snap into openings 10 of the housing 11 in order to attach the terminals 4 to the housing 11.
Two metal contacts 7, 8 are integrated into the plastic base 6. Each metal contact 7, 8 is connected to one of the contact elements 2, 3. Fig. 4 shows a more detailed view of one 8 of the metal contacts. The metal contacts 7, 8 consist of tin-plated copper sheets or tin-plated highly conductive metals.
Each metal contact 7, 8 comprises a lower surface 14, which lower surface 14 faces away from the varistor 1 when the terminal 4 is fixed to the varistor 1. The lower surfaces 14 of the metal contacts 7, 8 are intended for surface mounting to an application.
The metal contacts 7, 8 further comprise an upper surface 15, which upper surface 15 is parallel to the lower surface 14 and which upper surface 15 faces the varistor 1 when the varistor 1 is fixed to the terminal 4. Each metal contact 7, 8 is U-shaped, wherein the lower surface 14 and the upper surface 15 of the metal contact are connected by a short connection 16, the short connection 16 being perpendicular to the lower surface 14 and perpendicular to the upper surface 15.
The metal contacts 7, 8 comprise a soldering zone 17, the soldering zone 17 being formed by a wall arranged on the upper surface 15 and perpendicular to the upper surface 15. The welding area 17 protrudes from the upper surface 15 towards the varistor 1. Each contact element 2, 3 of the varistor 1 is soldered to the soldering region 7 of the respective metal contact 7, 8.
During the welding, high temperatures only occur locally at the locations where the contact elements 2,3 are welded to the welding area 17. Thus, high temperatures occur locally at the ends of the ribbon-shaped contact elements 2,3 opposite to the ends of the contact elements 2,3 fixed to the varistor 1. Since the heat must travel along the contact elements 2,3 before reaching the connection with the varistor 1, the heat is partly radiated to the environment and only partly applied to the connection of the contact elements 2,3 and the varistor 1. The ribbon-shaped contact elements 2,3 are constructed long enough that a sufficient amount of heat is radiated to the environment and the heat applied during soldering of the contact elements 2,3 to the terminals 4 does not damage the connection between the contact elements 2,3 and the varistor 1.
In an alternative embodiment, each contact element 2, 3 of the varistor 1 is soldered to the soldering zone 7 of the respective metal contact 7, 8 using a high temperature solder that does not melt during reflow soldering in an SMD process. During soldering with high temperature solder, heat is also only locally applied at the end of the ribbon-shaped contact element 2, 3 opposite the end at which the contact element 2, 3 is fixed to the varistor 1. The ribbon-shaped contact elements 2, 3 are constructed long enough that a sufficient amount of heat is radiated to the environment and the heat applied during soldering of the contact elements 2, 3 to the terminals 4 does not damage the connection between the contact elements 2, 3 and the varistor 1.
Fig. 5 shows a perspective view of the end product of the varistor module. The varistor module comprises a housing 11, which is not shown in fig. 1 and 2.
The housing 11 is attached to the terminal 4. The housing comprises two openings 10, wherein the spring arms 9 of the terminals 4 snap into the openings 10.
The housing 11 and the terminals 4 enclose a cavity in which the varistor 1 and the contact elements 2, 3 are arranged. The varistor 1 and the contact elements 2, 3 are protected by a housing 11.
The housing 11 has a cubic shape with no bottom. When the housing 11 is attached to the terminal 4, the terminal 4 forms the bottom of the cavity, and the housing 11 forms the other wall of the cavity. The lower surface 14 of the metal contact 8 may be contacted as a mounting counterpart for surface mounting. In particular, the lower surface 14 may be fixed to the printed circuit board during the SMD process, in particular during reflow soldering.
The housing 11 may comprise a plastics material. For example, housing 11 may comprise the same plastic material as plastic base 6 of terminal 4. For example, the housing 11 and the plastic base 6 may both comprise LCP.
Alternatively, the housing 11 may comprise a material different from the plastic base 6.
When the case 11 is fixed to the terminal 4, an air layer is formed inside the case 11 between the inner surface of the case 11 and the varistor 1. Thus, neither the varistor 1 nor the contact elements 2, 3 abut any inner surface of the housing 11.
The air layer within the housing 11 partly absorbs the heat occurring during the SMD process, for example during reflow soldering, so that a lower amount of heat is applied to the connection between the contact elements 2, 3 and the varistor 1. The air layer inside the housing 11 thus reduces the heat transfer to the connection of the contact elements 2, 3 and the varistor 1 during the SMD process.
Fig. 6 shows a varistor module according to a second embodiment. According to the second embodiment, a plurality of piezoresistors 1 are arranged on a single terminal 4. In the embodiment shown in fig. 6, three piezoresistors 1 are arranged on the terminal 4. However, any other number of varistors 1 may be used.
The terminal 4 comprises a single plastic base 6 and two metal contacts 7, 8 for each varistor 1. The metal contacts 7, 8 are formed and arranged in the same manner as described above in relation to the first embodiment. Each metal contact 7, 8 is configured to be surface mounted and each metal contact 7, 8 comprises a soldering region 14, which soldering region 14 is configured to be soldered or soldered to the respective contact element 2, 3 using a high temperature solder. Furthermore, a housing 11 may be provided which is fixed to the terminal 4 such that the terminal 4 and the housing 11 enclose a cavity in which the varistor 1 and the contact elements 2, 3 are arranged.
The varistor module according to the invention can withstand heat during the SMD process better than a varistor module in which the contact element is used directly as a mounting counterpart for surface mounting to an SMD application. In particular, the connection between the contact elements 2, 3 and the varistor 1 is better protected from melting.
In both embodiments, measures prevent or reduce the heat transfer to the connection between the contact elements 2,3 and the varistor 1 during the SMD process. By providing terminals 4 surface mounted to SMD applications, the contact elements do not act as mounting counterparts during surface mounting, so that heat is not directly applied to the contact elements 2,3, but to the terminals 4.
Furthermore, by providing an air layer between the inner surface of the housing 11 and the varistor 1, an additional isolation of the connection of the varistor 1 and the contact elements 2,3 is provided. Furthermore, by providing a coating of the varistor 1 and the contact elements 2,3, the connection is made more heat resistant.
The terminals 4 may be combined with an existing lead varistor to form a surface mountable package. The varistor module is a low cost varistor module with high surge capability. The connection of the contact elements 2, 3 to the respective metal contact 7, 8 can withstand the high temperatures of reflow soldering and also the high frequency vibrations which are common in automotive applications. In general, the varistor module has a simple structure, which is easy to integrate into automated production.
Fig. 7 shows a welding method of the welding process.
Reference numerals
1 Piezoresistor
2 Contact element
3 Contact element
4 Terminal
5 Coating
6 Plastic base
7 Metal contact
8 Metal contact
9 Spring arm
10 Openings of
11 Shell body
14 Lower surface
15 Upper surface
16 Connector
17 Welding area
Claims (15)
1. A varistor module comprises
A varistor (1),
-A contact element (2, 3) fixed to the varistor (1), and
-A terminal (4) comprising a metal contact (7, 8), wherein the contact element (2, 3) is fixed to the metal contact (7, 8), and wherein the metal contact (7, 8) comprises a lower surface (14) facing away from the varistor (1) and configured for surface mounting.
2. The varistor module of claim 1,
Wherein the contact elements (2, 3) comprise copper or tin coated leads.
3. The varistor module of claim 1,
Wherein the contact element (2, 3) is fixed to the varistor (1) by soldering or by welding.
4. The varistor module of claim 1,
Wherein the contact element (2, 3) is fixed to the metal contact (2, 3) by soldering or by soldering using a high temperature solder.
5. The varistor module of claim 1,
Wherein the terminal (4) comprises a plastic base (6),
Wherein the metal contacts (7, 8) are integrated in the plastic base (6).
6. The varistor module of claim 5,
Wherein the plastic base (6) comprises a liquid crystal polymer or another plastic material.
7. The varistor module of claim 1,
Wherein the metal contact (7, 8) comprises an upper surface (15) and a soldering region (17),
Wherein the upper surface (15) is parallel to the lower surface (14) and faces the varistor (1),
Wherein the soldering region (17) is perpendicular to the upper surface of the metal contact (7, 8) and protrudes towards the varistor (1),
Wherein the contact elements (2, 3) are welded to the welding areas of the metal contacts (7, 8).
8. The varistor module of claim 1,
Wherein the varistor (1) and the contact elements (2, 3) are covered by a coating (5).
9. The varistor module of claim 1,
Further comprises a shell (11),
Wherein the terminal (4) and the housing (11) enclose a cavity, and wherein the varistor (1) and the contact elements (2, 3) are arranged in the cavity.
10. The varistor module of claim 9,
Wherein air is arranged between the inner surface of the housing (11) and the varistor (1).
11. The varistor module of claim 1,
Comprising at least a second varistor (1), wherein a second contact element (2, 3) is fixed to said second varistor (1), and
Wherein the terminal (4) comprises a second metal contact (7, 8), wherein the second metal contact (7, 8) is fixed to the second contact element (2, 3), and wherein the second metal contact (7, 8) comprises a lower surface (14) facing away from the second varistor (1) and configured for surface mounting.
12. A method of manufacturing a varistor module, comprising the steps of:
providing a varistor (1), the varistor (1) having contact elements (2, 3) fixed to the varistor (1),
Providing a terminal (4) comprising a metal contact (7, 8) comprising a lower surface (14) configured for surface mounting,
-Fixing the contact element (2, 3) to the metal contact (7, 8) such that a lower surface (14) of the metal contact (7, 8) faces away from the varistor (1).
13. The method of claim 12, further comprising the step of:
-placing a housing (11) over the varistor (1) and the contact elements (2, 3) such that the terminals (4) form the bottom side of the housing.
14. The method according to claim 12,
Wherein the contact element (2, 3) is fixed to the varistor (1) by soldering or by welding.
15. The method according to claim 12,
Wherein the method comprises the steps of:
Providing a second varistor (1) with a second contact element (2, 3) fixed to the second varistor (1),
Wherein the terminal (4) comprises a second metal contact (7, 8) comprising a lower surface (14) configured for surface mounting,
-Fixing the second contact element (2, 3) to the second metal contact (7, 8) such that a lower surface (14) of the second metal contact (7, 8) faces away from the second varistor (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310213606.2A CN118629735A (en) | 2023-03-07 | 2023-03-07 | Varistor module and method for producing a varistor module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310213606.2A CN118629735A (en) | 2023-03-07 | 2023-03-07 | Varistor module and method for producing a varistor module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN118629735A true CN118629735A (en) | 2024-09-10 |
Family
ID=92598357
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310213606.2A Pending CN118629735A (en) | 2023-03-07 | 2023-03-07 | Varistor module and method for producing a varistor module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN118629735A (en) |
-
2023
- 2023-03-07 CN CN202310213606.2A patent/CN118629735A/en active Pending
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Inventor after: Huang Yongde Inventor after: Yang Wen Inventor after: Tian Xiaojia Inventor after: He Zhouquan Inventor after: D. Krause Inventor after: Liu Hao Inventor before: Huang Yongde Inventor before: Yang Wen Inventor before: Tian Xiaojia Inventor before: He Zhouquan Inventor before: D. Klaus Inventor before: Liu Hao |
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