CN118559556A - Ultra-precise grinding tool for high-length-diameter-ratio high-gradient complex surface and use method thereof - Google Patents
Ultra-precise grinding tool for high-length-diameter-ratio high-gradient complex surface and use method thereof Download PDFInfo
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- 238000000034 method Methods 0.000 title claims abstract description 46
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- 238000005299 abrasion Methods 0.000 claims description 30
- 238000009826 distribution Methods 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 239000000463 material Substances 0.000 abstract description 28
- 230000003287 optical effect Effects 0.000 abstract description 11
- 238000003754 machining Methods 0.000 abstract description 9
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- 238000012545 processing Methods 0.000 description 31
- 238000005520 cutting process Methods 0.000 description 13
- 239000002245 particle Substances 0.000 description 6
- 239000006061 abrasive grain Substances 0.000 description 5
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Abstract
The invention discloses an ultra-precise grinding tool for a complex surface with large length-diameter ratio and high gradient and a use method thereof, wherein the grinding tool comprises a grinding wheel which is of a hemispherical structure, the side of the grinding wheel is provided with a plurality of microstructure grooves distributed along the circumferential direction of the center of the grinding wheel, the microstructure grooves extend from the center to the periphery in a divergent mode, and the intervals between adjacent grooves are gradually changed according to rules. According to the invention, on one hand, the arrangement spacing of the micro grooves is changed to adapt to grinding areas with different curvatures, and on the other hand, the chip thickness is thinned to realize wide plastic domain removal, so that the roughness and waviness of the grinding surface are obviously reduced; in addition, in the case of keeping the material removal rate unchanged in the use method, the machining efficiency of the grinding process can also not be reduced. The invention can be popularized to ultra-precise machining of complex surfaces of various optical elements such as glass, crystals, ceramics and the like.
Description
Technical Field
The invention relates to the technical field of optical machining, in particular to an ultra-precise grinding tool for a complex surface with a large length-diameter ratio and high steepness and a use method thereof.
Background
Compared with the conventional metal and polymer materials, the hard brittle material has the advantages of stable physical and chemical properties, high hardness, high strength, mechanical properties, excellent wear resistance, corrosion resistance and the like. Hard brittle materials represented by optical glass, advanced ceramics and ceramic matrix composite materials are widely applied to components in the fields of aerospace, optical imaging, biomedical and the like. However, due to the high hard brittleness and anisotropy thereof and the application requirements on the surface of the hard brittle material with high precision and low damage, the ultra-precise processing technology for the hard brittle material has great difficulty.
The present ultra-precise grinding technology around the hard and brittle materials has been widely studied by scholars at home and abroad, the study is mainly focused on the grinding mechanism analysis and the process optimization of a plane or small curvature surface, and in the ultra-precise grinding process of a high-gradient element with a large length-diameter ratio, the contact position of a workpiece and a grinding wheel is changed due to the change of the curvature of the workpiece surface in a grinding path, so that the maximum undeformed chip thickness corresponding to single-abrasive-grain cutting is inconsistent, the phenomenon of unstable grinding force occurs, the quality of the processing surface of the workpiece is seriously influenced, and the surface shape precision of the processing surface is greatly reduced. Therefore, for ultra-precise grinding of high-gradient complex surfaces with large length-diameter ratio, development of an ultra-precise grinding tool for high-gradient complex surfaces with large length-diameter ratio and a use method thereof are needed to solve the problems.
Disclosure of Invention
The invention provides an ultra-precise grinding tool for a complex surface with a large length-diameter ratio and high steepness and a use method thereof, which are used for solving the problems of unstable grinding force and low quality of a processed surface in the ultra-precise processing technology for the complex surface of an optical element in the prior art.
In order to achieve the above object, the invention provides an ultra-precise grinding tool for a complex surface with a large length-diameter ratio and high steepness, which comprises a grinding wheel, wherein the grinding wheel is of a hemispherical structure, a plurality of grooves are formed in the side surface of the grinding wheel and distributed along the circumferential direction of the center of the grinding wheel, two ends of each groove extend to the large end and the small end of the grinding wheel respectively, and the distance between every two adjacent grooves is gradually increased along the direction away from the small end.
Preferably, the distance between adjacent ones of the grooves becomes gradually larger in a direction away from the small end in a range of 10 μm to 42.3 μm.
On the other hand, the invention also provides a use method of the ultra-precise grinding tool for the complex surface with large length-diameter ratio and high steepness, which comprises the following steps:
Acquiring first wear data and second wear data of a grinding wheel, wherein the first wear data comprise grinding wheel surface contour errors, and the second wear data comprise average depth of groove wear;
repairing the grinding wheel when the first abrasion data is determined to be larger than a first preset value;
Repairing the groove when the second abrasion data is determined to be larger than a second preset value;
When it is determined that the first wear data is not greater than a first preset value and the second wear data is not greater than a second preset value, grinding the surface of the workpiece with the grinding tool according to claim 1 or 2 based on the set trajectory.
Preferably, the method for acquiring the first wear data and the second wear data of the grinding wheel comprises the following steps:
and acquiring the surface profile error of the grinding wheel and the average depth of the abrasion of the groove based on a laser micrometer.
Preferably, the first preset value is 80 μm and the second preset value is 10 μm.
Preferably, the grinding wheel comprises a first body and a second body which are connected, wherein the first body is a top circular arc part of the grinding wheel, and the second body is a peripheral circular arc part of the grinding wheel.
Preferably, before the first wear data are obtained, contour splicing is performed on the first body and the second body, and the grinding wheel is obtained.
Preferably, the method for repairing the grinding wheel when the first abrasion data is determined to be larger than a first preset value comprises the following steps:
And fitting the first abrasion data, comparing the first abrasion data with the first preset value to obtain abrasion distribution data, and compensating and correcting the surface profile of the grinding wheel through a repairing tool based on the abrasion distribution data.
Preferably, the grain size of the repairing tool is larger than that of the abrasion tool, the rotation axes of the repairing tool and the abrasion tool are perpendicular to each other, and the rotation speed of the grinding tool is larger than that of the repairing tool.
Preferably, the set trajectory comprises a course of a rough, semi-refined or refined process.
Compared with the prior art, the invention has the following advantages and technical effects:
(1) The microstructured ball head grinding wheel has the function of reducing the average chip thickness so as to realize low-damage processing, and can ensure constant grinding force of a grinding whole path; the roughness and waviness of the surface of the optical element after grinding processing are reduced by utilizing the optimized technological parameter means of the ultra-precise processing technological method, so that the ultra-precise processing of the optical complex surface is realized;
(2) The surface of the optical element is subjected to microstructuring treatment, so that the number of diamond micro-blades is increased, the average chip thickness can be reduced under the same grinding feed depth, and meanwhile, the material removal rate is not reduced, so that the surface machining precision of the optical element is improved, better machining surface quality is facilitated, and the machining efficiency of the optical element is not influenced;
(3) The micro-blade array on the surface of the invention is arranged in a variable pitch way, so that the maximum undeformed chip thickness and grinding force of the material in the processed area can be accurately controlled in the processing process, and the invention is beneficial to obtaining better processing surface quality. In addition, the same grinding depth of each point on a grinding path is realized by increasing the cutter compensation quantity delta on a machine tool control console, so that the aim of stabilizing grinding force is fulfilled, and compared with a moving machine tool guide rail, the method is more efficient and has higher point location precision;
(4) The invention has stronger universality, can be used for ultra-precise grinding processing of complex surfaces such as various aspheric surfaces, free curved surfaces, structural surfaces and the like by adjusting the microstructure groove array arrangement mode of the tool according to processing path functions facing different optical elements, and can be suitable for various hard and brittle materials such as glass, ceramics, crystals and the like.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the application. In the drawings:
FIG. 1 is a block diagram of a microstructured grinding tool of an embodiment of the invention;
FIG. 2 is a schematic diagram of the relative positional relationship and motion trail of a grinding tool and a workpiece according to an embodiment of the present invention;
FIG. 3 is a schematic view of a conventional abrasive grain cutting process for a grinding tool according to an embodiment of the present invention;
fig. 4 is a schematic view of a microstructured abrasive tool abrasive grain cutting process according to an embodiment of the present invention.
Detailed Description
It should be noted that, without conflict, the embodiments of the present application and features of the embodiments may be combined with each other. The application will be described in detail below with reference to the drawings in connection with embodiments.
As shown in fig. 1-4, the invention provides an ultra-precise grinding tool for a complex surface with a large length-diameter ratio and high steepness, which comprises a grinding wheel, wherein the grinding wheel is of a hemispherical structure, a plurality of grooves are formed in the side surface of the grinding wheel and are circumferentially distributed along the center of the grinding wheel, two ends of each groove extend to a large end and a small end of the grinding wheel respectively, and the distance between every two adjacent grooves is gradually increased along the direction away from the small end.
The distance between adjacent grooves becomes larger gradually in the direction away from the small end in the range of 10 μm to 42.3 μm.
Further, the grinding wheel is a diamond spherical grinding wheel, and the structure of the grinding wheel comprises a hemispherical main body section of the grinding wheel, a cylindrical transition section and a cutter handle base section; and carrying out micro-structuring treatment on the surface of the hemispherical main body section of the grinding wheel by using picosecond laser.
The grooves are microstructure grooves, and the intervals of the microstructure grooves are distributed along the axial variable pitch of the grinding wheel as shown in figure 2. The arrangement is carried out from the top of the grinding wheel to the big end with a variable pitch of 10-42.3 mu m. The proportional relationship of the microstructure groove spacing d t to the maximum undeformed chip thickness h max provides for uniform workpiece material removal over the grinding path, thus providing for a constant overall grinding force.
The microstructure trench spacing d t can be found by:
dt＝k·hmax
d t is the spacing between the microstructured grooves, k is the scaling factor, and h max is the maximum undeformed chip thickness.
The width of the microstructure groove is controlled to be 7-10 mu m, and the depth of the groove is controlled to be 15-20 mu m; the width and depth of the micro grooves are consistent in the grinding area of the grinding wheel.
The microstructure trench width d and depth h can be determined by:
R 0 is the radius of a laser spot, I d is the peak energy density of picosecond laser, I t is the critical laser energy density for material removal, alpha is the workpiece material absorption coefficient, d is the width of a microstructure groove, and h is the depth of the microstructure groove.
In order to ensure that the grinding area of the ball head grinding wheel has enough chip containing space, the depth h of the microstructure groove is required to be ensured to be larger than the maximum undeformed thickness h max; meanwhile, in order to ensure that the grinding wheel microstructure abrasive particles have enough cutting strength, the sharpening back angle is required to be ensured to be larger than 90 degrees, and the micro-blade height h is required to be ensured to be smaller than the distance d t, and the following formula is adopted:
dt＞h＞hmax
As shown in fig. 3, in the present embodiment, a workpiece coordinate system O 1 (x, y, z) is set to define the position and the region to be machined of the high-gradient workpiece with a large aspect ratio, and a tool coordinate system is set to define the ball grinding wheel. And defining an aspherical generatrix equation which is a processing target surface under a workpiece coordinate system, and taking the aspherical generatrix equation as a motion trail equation of the spherical grinding wheel.
The aspherical bus equation is:
where c is paraxial curvature, k is an eccentricity function, k= -e 2 (e is eccentricity), and a 4、A6 is an aspherical coefficient.
A tool coordinate system O 2 (p, q, r) is established at the sphere center of the grinding wheel, and the surface profile curve of the grinding wheel is as follows:
In this embodiment, since the working material facing the present invention is a brittle material, in order to obtain a surface roughness of nanometer scale during the working process, the material removal process must be plastic domain removal, i.e. the maximum undeformed chip thickness h max during the working process should be smaller than the plastic-brittle transition critical depth η th of the material.
The plastic-brittle transition critical depth delta th of the material can be obtained according to the plastic processing theory of the brittle material:
as shown in fig. 4, the maximum undeformed chip thickness h max during cutting of workpiece material by a single abrasive particle can be represented by the following formula:
The contact area equivalent radius r e can be found by:
at the grinding depth delta, the material removal amount of the workpiece at the processing point is the intersection area of the spherical grinding wheel and the circular arc surface, and the curvature radius of each point in the processed area of the workpiece can be assumed to be the same because the grinding depth is in the sub-nanometer level and the tool contact area is tiny enough.
The radius of curvature r 1 can be solved by the following formula:
The average pressure P ave of the grinding region can be expressed by the following formula:
the normal grinding force F n can be determined as follows:
Fn＝S·Pave
The friction coefficient mu of the surface of the grinding wheel is unchanged as other technological parameters are unchanged and the grinding performance of the grinding wheel on a processing path is basically unchanged; from equation F t＝μFn, it is known that tangential friction remains stable during grinding. Therefore, when the grinding depths of all points on the grinding path are consistent, the maximum undeformed chip thickness is unchanged, so that the total grinding force is stable in the whole process.
On one hand, the number of abrasive grain cutting micro-edges is increased after the surface of the grinding tool is subjected to micro-structuring, so that the average cutting material thickness of the micro-edges is reduced at the same grinding depth, and the plastic domain removal of the workpiece surface material is easier to realize without reducing the grinding efficiency; in the process of cutting a workpiece by using microstructured abrasive particles, the maximum undeformed chip thickness corresponding to chips formed by micro-blade cutting is inversely related to the number of micro-blades in a contact area, the abrasive particles are microstructured to form micro-blades g 1、g2、g3, and the chip thickness h g1、hg2、hg3 is formed by sequentially cutting the surface of the workpiece, so that the effect of thinning the maximum undeformed chip thickness h max corresponding to single abrasive particles is achieved; in addition, the microstructure grooves are regularly arranged at set intervals so as to adapt to the variation of the rotating speed of the contact point of the grinding tool on the grinding path and the variation of the curvature of the machined point of the workpiece, thereby keeping the thickness of the maximum undeformed cutting chip constant in the grinding process; and because the grinding force is related to the maximum undeformed chip thickness, the total grinding force of the whole path can be kept stable.
On the other hand, the abrasive particles on the surface of the grinding tool are uniformly distributed through the micro-cutting edges after being microstructured, and the chip thickness uniformity formed by the micro-cutting edges can be realized aiming at the curvatures of different processing areas on the surface of the optical element with large length-diameter ratio and high steepness; and selecting proper grinding parameters according to a maximum deformation chip thickness formula, so that the chip thickness of the micro-blade is smaller than the critical depth of plastic-brittle transition of a material removing mode, and the plastic domain of the hard-brittle material can be removed, thereby reducing or avoiding the generation of subsurface cracks and meeting the requirements of high-precision low-damage processing of the hard-brittle material. Specific parameters may refer to the refining parameters in table 1.
A picosecond laser with Gaussian intensity is adopted; the laser adopts power of 1.0W, the repetition frequency is 5kHz, the pulse width is 140ps, the laser wavelength is 532nm, the positive defocus processing is carried out, and the defocus amount is 0.6mm; the relationship between laser ablated trench width d and laser energy density can be expressed by:
Wherein R 0 is the laser spot radius, I d is the laser power, and I t is the critical laser power for material removal.
The embodiment also provides a use method of the ultra-precise grinding tool for the complex surface with large length-diameter ratio and high steepness, which specifically comprises the following steps:
Acquiring first abrasion data and second abrasion data of the grinding wheel, wherein the first abrasion data comprise grinding wheel surface contour errors, and the second abrasion data comprise average depth of groove abrasion;
further, repairing the grinding wheel when the first abrasion data is determined to be larger than a first preset value;
repairing the groove when the second abrasion data is determined to be larger than a second preset value;
And when the first abrasion data is not larger than the first preset value and the second abrasion data is not larger than the second preset value, grinding the surface of the workpiece based on the set track.
The first preset value comprises a standard value which is compared with the surface profile error of the grinding wheel, in the embodiment, 80 mu m, and if the current value is larger than the standard value by 80 mu m, the grinding wheel needs to be repaired; the second preset value is a standard value that is compared with the average depth of the groove wear, in this embodiment 10 μm, and when the average depth of the groove wear is greater than 10 μm, the groove is repaired.
Installing a ball grinding wheel and a high-length-diameter ratio high-steepness fairing blank on processing equipment, detecting, trimming, laser microstructured and other components, and determining the relative positions of the components; the ball head grinding wheel is arranged on a horizontal rotating shaft of processing equipment, and then a large-length-diameter-ratio high-gradient complex surface workpiece is fixed on a main shaft of the processing equipment; the grinding tool surface inspection assembly, the profile conditioning assembly, and the in-situ laser structuring assembly are separately mounted to the machining apparatus.
Dividing the surface of the grinding tool into a top arc part and a peripheral arc part, respectively detecting the two parts, and then performing contour splicing.
And detecting the surface profile error of the grinding wheel by a laser micrometer, and repairing the grinding wheel when the first abrasion data is determined to be larger than a first preset value.
Specifically, detecting the surface profile error of the grinding wheel by a laser micrometer, and fitting the measured data, wherein the fitting radius and the residual error value correspond to the measured radius and the profile error of the grinding tool respectively; comparing the detection data after abrasion of the grinding tool with the profile before abrasion to obtain a profile error; the average depth of the microstructured groove wear on the surface of the grinding tool is greater than 10 μm, which requires finishing to maintain good grinding performance.
Compensating and correcting the grinding wheel through a repairing tool, specifically:
the repairing tool is a cylindrical diamond grinding wheel with larger grain size, and the grain size of the repairing grinding wheel is 105 mu m; the grinding wheel of the repairing tool and the rotation axis of the grinding tool are mutually perpendicular, the grinding wheel of the repairing tool rotates at the rotating speed of 7000rpm/min, the grinding tool rotates at the rotating speed of 10000rpm/min, and meanwhile, the grinding wheel of the repairing tool finishes finishing along the feeding of the normal section profile of the grinding tool, so that the surface abrasive grain planarization and the spherical profile consistency of the tool are realized.
Combining the in-situ detection and centering error compensation of the laser displacement sensor, and controlling the outline error of the ball grinding wheel to be smaller than 3 mu m; and (3) re-structuring the tool surface by using an in-situ picosecond laser, wherein the micro grooves keep regular variable pitch arrangement. The centering error is the difference value of the distances between the grinding wheel rotating main shaft and the spherical grinding wheel rotating main shaft in the tool setting process.
The step of detecting the spherical surface shape of the grinding wheel before the groove repairing work comprises the following steps: performing in-situ measurement on the microstructured tool surface using a laser micrometer; respectively detecting the top arc part and the peripheral arc part of the grinding tool, and then performing contour splicing; fitting the measured data, wherein the output fitting radius corresponds to the real-time radius of the grinding tool; the difference between the real-time radius and the radius before abrasion of the grinding tool is used as Deltar 1 to be used as a tool compensation quantity, and the tool compensation quantity is input into a processing equipment controller to realize compensation correction of a processing path.
Iterative processing is carried out on the surface of the workpiece with large length-diameter ratio and high steepness by adopting the process routes of rough grinding, semi-finish grinding and finish grinding, the grain sizes of corresponding grinding tools in the embodiment are 35 mu m,20 mu m and 7 mu m respectively, and the selected grinding process parameters are shown in the following table 1:
TABLE 1
Based on a plastic processing mechanism, the grinding depth is controlled to be smaller than the plastic-brittle transition critical depth delta th of the material, so that the grinding depth is kept within 15nm in the fine grinding process, and low-damage processing in the grinding process is realized; the preset processing track program is called into a motion control system of processing equipment, so that a grinding tool grinds the surface of a workpiece according to the set track; repeated detection, trimming and microstructuring work for a plurality of times in the grinding process; and (5) repeating the cyclic processing procedure to finish ultra-precise processing of the surface of the workpiece with large length-diameter ratio and high steepness.
The invention establishes the functional relation between the microstructure rate of the surface of the grinding tool and the maximum undeformed chip thickness, adopts an in-situ picosecond laser to carry out microstructuring treatment on the surface of the grinding tool, and shows that the grinding method practice can achieve the effect of stabilizing the grinding force; compared with other grinding tools, the tool realizes wide plastic domain removal by thinning the chip thickness on one hand, and obviously reduces the grinding surface roughness and waviness by changing the arrangement space of the micro grooves to adapt to grinding areas with different curvatures on the other hand; in addition, the method keeps the material removal rate unchanged, and ensures that the machining efficiency of the grinding process is not reduced. The method can be popularized to ultra-precise machining of complex surfaces of various optical elements such as glass, crystals, ceramics and the like.
The present application is not limited to the above-mentioned embodiments, and any changes or substitutions that can be easily understood by those skilled in the art within the technical scope of the present application are intended to be included in the scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.
Claims (10)
1. The ultra-precise grinding tool for the complex surface with the large length-diameter ratio and the high gradient is characterized by comprising a grinding wheel, wherein the grinding wheel is of a hemispherical structure, a plurality of grooves are formed in the side surface of the grinding wheel and distributed along the circumferential direction of the grinding wheel, two ends of each groove extend to the large end and the small end of the grinding wheel respectively, and the distance between every two adjacent grooves is gradually increased along the direction away from the small end.
2. A grinding tool according to claim 1, wherein the distance between adjacent grooves becomes progressively larger in a direction away from the small end in the range of 10 μm to 42.3 μm.
3. A method of using an ultra-precise grinding tool for high aspect ratio high steepness complex surfaces, characterized in that the method comprises the following steps based on the grinding tool of claim 1 or 2:
Acquiring first wear data and second wear data of a grinding wheel, wherein the first wear data comprise grinding wheel surface contour errors, and the second wear data comprise average depth of groove wear;
repairing the grinding wheel when the first abrasion data is determined to be larger than a first preset value;
Repairing the groove when the second abrasion data is determined to be larger than a second preset value;
When it is determined that the first wear data is not greater than a first preset value and the second wear data is not greater than a second preset value, grinding the surface of the workpiece with the grinding tool according to claim 1 or 2 based on the set trajectory.
4. A method of using as claimed in claim 3, wherein the method of obtaining the first and second wear data of the grinding wheel comprises:
and acquiring the surface profile error of the grinding wheel and the average depth of the abrasion of the groove based on a laser micrometer.
5. A method of use according to claim 3, wherein the first preset value is 80 μm and the second preset value is 10 μm.
6. A method of use according to claim 3, wherein the grinding wheel comprises a first body and a second body connected, the first body being a top arcuate portion of the grinding wheel and the second body being a peripheral arcuate portion of the grinding wheel.
7. The method of claim 6, further comprising contour stitching the first body and the second body to obtain the grinding wheel prior to obtaining the first wear data.
8. The method of claim 7, wherein the method of repairing the grinding wheel when the first wear data is determined to be greater than a first predetermined value comprises:
And fitting the first abrasion data, comparing the first abrasion data with the first preset value to obtain abrasion distribution data, and compensating and correcting the surface profile of the grinding wheel through a repairing tool based on the abrasion distribution data.
9. The method of claim 8, wherein the repair tool grain size is greater than the wear tool grain size, the repair tool and the wear tool axis of rotation are perpendicular to each other, and the grinding tool has a rotational speed greater than the repair tool rotational speed.
10. A method of use according to claim 3, wherein the set trajectory comprises a course of a rough, semi-refined or refined process.
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| CN202410825206.1A CN118559556A (en) | 2024-06-25 | 2024-06-25 | Ultra-precise grinding tool for high-length-diameter-ratio high-gradient complex surface and use method thereof |
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