CN118486629A - Alignment method and alignment system of huge amount of transfer equipment - Google Patents
Alignment method and alignment system of huge amount of transfer equipment Download PDFInfo
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Abstract
The invention discloses a aligning method and aligning system of huge amount transfer equipment, the aligning system is provided with an upper aligning camera, a lower aligning camera and a calibration piece for calibration, the aligning method comprises the steps of determining a mechanical origin, determining laser vibrating mirror coordinates, processing alignment, calibrating the upper aligning camera and the lower aligning camera, when the wafer workpiece is aligned, the lower aligning camera directly shoots the lower surface of the wafer workpiece from bottom to top, the lower alignment camera can be directly close to the lower surface of the wafer workpiece to focus, and the upper loading table can not interfere with the lower alignment camera during shooting, so that the problem that the size and the hollowness of the upper loading table are enlarged to accommodate the extension of the alignment camera is not needed to be considered.
Description
Technical Field
The application relates to the technical field of display screen production equipment, in particular to a positioning method and a positioning system of a huge amount of transfer equipment.
Background
In the precision machining field, in order to achieve the machining precision of the micron or even submicron level, a real-time measuring system is required to be introduced, and real-time and accurate references are provided for precision machining whether various process real-time measuring systems in the machining industry such as contact type measuring methods and non-contact type measuring methods or various precise visual systems in the wafer industry.
The mass transfer technology is one of key technologies needed to be overcome in MicroLED industries, and is attracting attention in China in recent years. In order to realize extremely high yield of mass transfer, a plurality of technical indexes are required to be achieved, the problem of accurate alignment of an upper wafer plate and a lower substrate is focused at present, and the subsequent processing cannot be performed without accurate alignment. The alignment system of the prior huge amount transfer equipment comprises an alignment camera arranged on a beam, the alignment camera is connected with a lifting driver, and the camera is used for respectively carrying out visual positioning on an upper wafer plate and a lower substrate.
In huge transfer equipment, including last platform and the download platform that is used for loading last wafer board and lower base plate respectively, go up the platform and be hollow annular structure, go up the wafer board clamping in the bottom surface of uploading the platform, the lower base plate clamping is in the top surface of download platform, has following drawback when utilizing the counterpoint camera to go up the alignment of wafer board: 1. when the alignment camera adopts a long-focus lens, the alignment camera can directly focus on an upper wafer plate at the bottom side of the uploading table, but the long-focus lens has larger diameter, and the distance between the center of the lens and the center of the laser is larger, so that the final processing precision is influenced; 2. as shown in fig. 1, the alignment camera 1 'adopts a short focus lens, the alignment camera 1' needs to move downwards to the middle hole of the upper stage 2 'to approach the upper wafer plate 3' for focusing, in order to observe the edge of the upper wafer plate 3', the size of the upper stage 2' needs to be enlarged to enlarge the hollowness of the upper stage 2', so that the alignment camera 1' can have enough movable space in the middle hole of the upper stage 2', and finally, the load of the upper stage 2' is increased and the precision is reduced.
Disclosure of Invention
The aim of the embodiment of the invention is that: a method and a system for aligning a mass transfer device are provided, which can solve the above problems in the prior art.
In order to achieve the above purpose, the application adopts the following technical scheme:
In one aspect, a method for aligning a mass transfer device is provided, comprising the steps of:
Determining a mechanical origin: when the equipment is started initially, aligning and overlapping the visual field center of the lower alignment camera, the visual field center of the upper alignment camera and the correction mark points on the calibration piece, and recording the positions of the upper motion system and the lower motion system as mechanical origins;
And (3) determining laser galvanometer coordinates: when the positions of the upper motion system and the lower motion system are at the mechanical origin, the visual field center of the upper alignment camera is used as the origin of an upper camera coordinate system, the visual field center of the lower alignment camera is used as the origin of a lower camera coordinate system, and the coordinates of the laser galvanometer in the upper camera coordinate system and the lower camera coordinate system are respectively determined;
And (3) processing and aligning: searching a first positioning mark point on a substrate workpiece on a downloading table by using the upper alignment camera, searching a second positioning mark point on a wafer workpiece on the uploading table by using the lower alignment camera, and adjusting the positions of the uploading table and the downloading table according to the coordinates of a laser galvanometer after the positions of the first positioning mark point and the second positioning mark point are determined, so that the laser galvanometer, the first positioning mark point and the second positioning mark point are overlapped in a z-axis;
Calibrating an upper alignment camera and a lower alignment camera: and after the working time length or the finishing workload of the equipment reaches a set value, driving the upper motion system and the lower motion system to return to a mechanical origin, respectively recording the relative positions of the visual field centers of the upper alignment camera and the lower alignment camera and the correction mark point on the calibration piece, calculating the offset of the upper alignment camera and the offset of the lower alignment camera, compensating the offset to a control system, and continuing the processing alignment and processing operation.
Optionally, the step of determining the mechanical origin includes: when the device is started initially, the upper motion system is driven to enable the correction mark point to coincide with the visual field center of the upper alignment camera, and then the lower motion system is driven to enable the visual field center of the lower alignment camera to coincide with the correction mark point.
Optionally, the step of determining the coordinates of the laser galvanometer includes: setting a first marking sheet on the lower motion system, and starting the laser galvanometer to mark a first marking point on the first marking sheet; and then driving the lower motion system to enable the first mark point to coincide with the center of the visual field of the upper alignment camera, recording the moving distance of the motion system, and further calculating the coordinates of the laser galvanometer in the upper camera coordinate system.
Optionally, the first marking sheet is paper attached to a downloading table of the lower motion system.
Optionally, the step of determining the coordinates of the laser galvanometer includes: setting a second marking sheet on the upper motion system, and starting the laser galvanometer to mark a second marking point on the second marking sheet; and then driving an upper motion system to enable the second mark point to coincide with the center of the visual field of the lower alignment camera, recording the moving distance of the upper motion system, and further calculating the coordinates of the laser galvanometer in the lower camera coordinate system.
Optionally, the second marking sheet is clamped on the uploading table of the upper motion system, and the second marking sheet is a glass sheet with a gallium nitride layer.
Optionally, in the step of calibrating the coordinates of the upper alignment camera and the lower alignment camera, after the upper motion system and the lower motion system are driven to return to the mechanical origin, calculating the distance between the correction mark point and the image center point by using the image acquired by the upper alignment camera through the pixel ratio, and further calculating the offset of the upper alignment camera; and calculating the distance between the correction mark point and the center point of the image through the pixel ratio by utilizing the image acquired by the lower alignment camera, so as to calculate the offset of the lower alignment camera.
Optionally, after the coordinates of the first positioning mark point and the second positioning mark point are respectively determined, driving the lower motion system to align the laser galvanometer with the first positioning mark point, wherein the moving distance of the lower motion system is calculated and determined based on the coordinates of the first positioning mark point, the coordinates of the laser galvanometer in an upper camera coordinate system and the offset of the upper alignment camera; and driving the upper motion system to align the laser galvanometer with the second positioning mark point, wherein the moving distance of the upper motion system is calculated and determined based on the coordinate of the second positioning mark point, the coordinate of the laser galvanometer in the lower camera coordinate system and the offset of the lower alignment camera.
In another aspect, an alignment system for performing the above alignment method is provided, and the alignment system is installed in a mass transfer device, where the mass transfer device includes a machine, and a lower motion system, an upper motion system and a supporting beam that are disposed on the machine, where the lower motion system includes a downloading table, and the upper motion system includes an uploading table;
The alignment system comprises:
the upper alignment camera is arranged on the supporting beam and positioned above the uploading platform and is used for positioning and clamping the substrate workpiece on the downloading platform;
The lower alignment camera is arranged on the lower motion system and is used for positioning and clamping the wafer workpiece at the bottom side of the uploading table;
and the calibration piece is arranged on the upper motion system and used for calibrating the coordinate systems of the upper alignment camera and the lower alignment camera.
Optionally, the calibration piece includes installation piece and transparent calibration piece, the installation piece install in go up the motion system, the installation piece has the light hole, transparent calibration piece install in the installation piece is aimed at the light hole, be equipped with correction mark point on the transparent calibration piece.
The beneficial effects of the application are as follows: the application provides a method and a system for aligning a huge amount of transfer equipment, wherein the system for aligning comprises an upper alignment camera and a lower alignment camera which are respectively arranged on a supporting beam and a lower motion system, when a wafer workpiece is aligned, the lower alignment camera directly shoots the lower surface of the wafer workpiece from bottom to top, the lower alignment camera can directly approach the lower surface of the wafer workpiece to focus, and an uploading table does not interfere the lower alignment camera during shooting, so that the problems of enlarging the size and the hollowness of the uploading table to accommodate the extension of the alignment camera are not needed, and the problems of increasing the load of the uploading table, reducing the precision, high manufacturing cost and the like are avoided.
In addition, the upper alignment camera and the lower alignment camera are two different positioning coordinate systems, in order to avoid temperature drift affecting alignment precision, in the alignment method of the scheme, after a certain working time or a certain working amount, the upper alignment camera and the lower alignment camera can be automatically calibrated, so that the alignment accuracy of the wafer workpiece and the substrate workpiece is ensured.
Drawings
The application is described in further detail below with reference to the drawings and examples.
FIG. 1 is a schematic diagram of a conventional alignment system of a mass transfer device;
FIG. 2 is a schematic diagram of a mass transfer device according to an embodiment of the present application;
FIG. 3 is a schematic structural view of a calibration member according to an embodiment of the present application;
FIG. 4 is a flow chart of a method for aligning a macro-transfer apparatus according to an embodiment of the present application;
Fig. 5 is a schematic diagram of a picture taken when the upper alignment camera is aligned with coordinates according to an embodiment of the present application.
In the figure:
1', an alignment camera; 2', an uploading table; 3', an upper wafer plate;
1. A machine table; 2. a support beam; 3. a laser galvanometer; 4. a lower motion system; 41. a downloading table; 5. an upper motion system; 51. an uploading table; 6. a lower alignment camera; 7. an upper alignment camera; 8. a calibration member; 81. a mounting block; 82. a transparent calibration block; 821. the mark points are corrected.
Detailed Description
In order to make the technical problems solved by the present application, the technical solutions adopted and the technical effects achieved more clear, the technical solutions of the embodiments of the present application are described in further detail below, and it is obvious that the described embodiments are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
In the description of the present application, unless explicitly stated and limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present application will be understood in specific cases by those of ordinary skill in the art.
In the present application, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.
In traditional huge transfer equipment, including last platform and the downloading table that is used for loading wafer board and lower base plate respectively, go up the platform and be hollow annular structure, go up the wafer board clamping in the bottom surface of uploading the platform, the lower base plate clamping is in the top surface of downloading the platform, has following drawback when utilizing the counterpoint camera to go up the counterpoint of wafer board: 1. when the alignment camera adopts a long-focus lens, the alignment camera can directly focus on an upper wafer plate at the bottom side of the uploading table, but the long-focus lens has larger diameter, and the distance between the center of the lens and the center of the laser is larger, so that the final processing precision is influenced; 2. as shown in fig. 1, the alignment camera 1 'adopts a short focus lens, the alignment camera 1' needs to move downwards to the middle hole of the upper stage 2 'to approach the upper wafer plate 3' for focusing, in order to observe the edge of the upper wafer plate 3', the size of the upper stage 2' needs to be enlarged to enlarge the hollowness of the upper stage 2', so that the alignment camera 1' can have enough movable space in the middle hole of the upper stage 2', and finally, the load of the upper stage 2' is increased and the precision is reduced.
Therefore, the present embodiment provides a method and a system for aligning a bulk transfer device, which overcomes the above-mentioned drawbacks of the conventional alignment camera when aligning a wafer plate by improving the positioning method of a substrate workpiece and a wafer workpiece before bulk transfer.
Because the alignment method of the bulk transfer device of the present embodiment is implemented based on the new alignment system provided in the present embodiment, for convenience of understanding, the structure of the alignment system implementing the alignment method of the bulk transfer device of the present embodiment will be described herein:
The alignment system of the embodiment is installed in a huge amount transfer device, referring to fig. 2, the huge amount transfer device comprises a machine table 1, a lower motion system 4, an upper motion system 5 and a supporting beam 2, wherein the lower motion system 4, the upper motion system 5 and the supporting beam 2 are arranged on the machine table 1, the supporting beam 2 is provided with a laser vibrating mirror 3, the lower motion system 4 comprises a downloading table 41, and the upper motion system 5 comprises an uploading table 51; when the laser oscillator works, a substrate workpiece is fixed on the top surface of the downloading table 41, a wafer workpiece is fixed on the top surface of the uploading table 51, the downloading table 41 and the uploading table 51 can be driven by the lower motion system 4 and the upper motion system 5 to move along the x direction and the y direction respectively, the relative positions of the wafer workpiece and the substrate workpiece are adjusted through the driving of the lower motion system 4 and the upper motion system 5, so that the wafer workpiece and the substrate workpiece are accurately aligned, and core particles on a wafer are peeled, transferred and fixed on the substrate workpiece through the laser oscillator 3.
The alignment system of the embodiment includes an upper alignment camera 7 and a lower alignment camera 6, wherein the upper alignment camera 7 is mounted on the supporting beam 2 and located on the upper stage 51, and is used for positioning and clamping the substrate workpiece on the lower stage 41; the lower alignment camera 6 is mounted on the lower motion system 4, and is used for positioning and clamping the wafer workpiece at the bottom side of the loading table 51.
When aligning the substrate workpiece, the lower motion system 4 drives the downloading table 41 and the substrate workpiece thereon to move below the upper alignment camera 7 according to the determined coordinates of the first positioning mark point on the substrate workpiece until the visual field center of the upper alignment camera 7 is aligned with the first positioning mark point on the substrate workpiece, and then drives the lower motion system 4 to move according to the position coordinates of the laser galvanometer 3 in the upper camera coordinate system, so that the center of the laser galvanometer 3 and the first positioning mark point coincide in the z-axis direction.
When aligning the wafer workpiece, according to the determined coordinates of the second positioning mark point on the wafer workpiece, the upper motion system 5 drives the loading table 51 and the wafer workpiece thereon to move until the center of the field of view of the lower alignment camera 6 is aligned with the second positioning mark point on the wafer workpiece, and then according to the position coordinates of the laser galvanometer 3 in the lower camera coordinate system, the upper motion system 5 is driven to move, so that the center of the laser galvanometer 3, the first positioning mark point and the second positioning mark point are overlapped in the z-axis direction, and the alignment work of the wafer workpiece and the substrate workpiece is completed. Then the laser vibrating mirror is started to perform orderly transfer operation.
The alignment work of the wafer workpiece of this scheme is accomplished by lower counterpoint camera 6, lower counterpoint camera 6 is direct from down upwards to shoot the lower surface of wafer workpiece, lower counterpoint camera 6 can be directly near the lower surface of wafer workpiece in order to focus, and uploading platform 51 can not cause the interference to lower counterpoint camera 6 when shooing, consequently need not to consider the problem that expands the size and the hollowness of uploading platform 51 in order to hold stretching into of counterpoint camera, and then avoided uploading platform 51 load increase, the precision reduces, manufacturing cost is high scheduling problem.
However, the inventor found that in the practical process, the camera coordinate system generates micrometer-level offset due to working heating, and the offset is larger than the motion precision of the mechanical system, which causes deviation and failure of alignment of the wafer workpiece and the substrate workpiece. Especially in this scheme, wafer work piece and base plate work piece are located through last counterpoint camera 7 and lower counterpoint camera 6 respectively, and two cameras are very big probably because the skew of different directions, different sizes takes place for the difference of generating heat, structural difference, and then enlarge the influence to wafer work piece and base plate work piece counterpoint precision.
In order to overcome the above technical problems, the alignment system of the present embodiment further includes a calibration member 8, where the calibration member 8 is mounted on the upper motion system 5 for calibrating the upper alignment camera 7 and the lower alignment camera 6.
Specifically, the calibration piece 8 is mounted on the upper motion system 5 and can move along with the upper motion system 5, and when the upper alignment camera 7 needs to be calibrated because the upper alignment camera 7 is mounted on the supporting beam 2 and is not moved, the calibration piece 8 can be driven to move below the upper alignment camera 7 through the upper motion system 5. In addition, when the lower alignment camera 6 needs to be calibrated, the lower motion system 4 can drive the lower alignment camera 6 to move below the calibration member 8, so as to realize the function of calibrating the upper alignment camera 7 and the lower alignment camera 6 by the calibration member 8.
In this embodiment, although the upper alignment camera 7 and the lower alignment camera 6 are two different positioning coordinate systems, in order to avoid the influence of temperature drift on alignment accuracy, a calibration piece 8 that can be used to calibrate the upper alignment camera 7 and the lower alignment camera 6 is provided, and after a certain working time or a certain working load, the upper alignment camera 7 and the lower alignment camera 6 can be calibrated to ensure the alignment accuracy of the wafer workpiece and the substrate workpiece.
In one embodiment, referring to fig. 3, the calibration member 8 includes a mounting block 81 and a transparent calibration block 82, the mounting block 81 is mounted on the upper motion system 5, the mounting block 81 has a light passing hole, the transparent calibration block 82 is mounted on the mounting block 81 and aligned with the light passing hole, and a correction mark point 821 is provided on the transparent calibration block 82.
The mounting block 81 may provide support for the transparent calibration block 82 to facilitate connection with the upload stage 51. The transparent calibration block 82 is provided with a correction mark point 821, and during correction, the upper alignment camera 7 and the lower alignment camera 6 can both shoot the correction mark point 821, so that the upper alignment camera 7 and the lower alignment camera 6 can be calibrated.
The pattern of the calibration mark points 821 provided on the transparent calibration block 82 may be a grid type, a cross type, a dot type, or the like. Preferably, a groove corresponding to the transparent calibration block is arranged on one side of the mounting block 81, the transparent calibration block 82 is embedded in the groove, and the mounting reliability is better.
Based on the above alignment system, referring to fig. 4, the alignment method of the present embodiment includes the steps of:
S1, determining a mechanical origin: when the equipment is started initially, aligning and overlapping the visual field center of the lower alignment camera 6, the visual field center of the upper alignment camera 7 and the correction mark point 821 on the calibration piece 8, and recording the positions of the upper motion system 5 and the lower motion system 4 as mechanical origins at the moment;
S2, determining the coordinates of a laser galvanometer 3: when the positions of the upper motion system and the lower motion system are at the mechanical origin, the center of the visual field of the upper alignment camera 7 is the origin of an upper camera coordinate system, the center of the visual field of the lower alignment camera 6 is the origin of a lower camera coordinate system, and the coordinates of the laser galvanometer 3 in the upper camera coordinate system and the lower camera coordinate system are respectively determined;
S3, processing alignment: searching a first positioning mark point on a substrate workpiece on a downloading table 41 by using the upper alignment camera 7, searching a second positioning mark point on a wafer workpiece on an uploading table 51 by using the lower alignment camera 6, and after determining the positions of the first positioning mark point and the second positioning mark point, adjusting the positions of the uploading table 51 and the downloading table 41 according to the coordinates of the laser galvanometer 3 to enable the laser galvanometer 3, the first positioning mark point and the second positioning mark point to coincide in a z-axis;
S4, calibrating an upper alignment camera 7 and a lower alignment camera 6: after the working time length or the finishing workload of the equipment reaches a set value, the upper motion system 5 and the lower motion system 4 are driven to return to a mechanical origin, the relative positions of the visual field centers of the upper alignment camera 7 and the lower alignment camera 6 and the correction mark point 821 on the calibration piece 8 are respectively recorded, the offset of the upper alignment camera 7 and the offset of the lower alignment camera 6 are calculated, the offset is compensated to a control system, and then the processing alignment and the processing operation are continued.
When the device is initially started, step S1 is executed, and when step S1 is executed, the visual field centers of the lower alignment camera 6 and the upper alignment camera 7 and the calibration mark point 821 on the calibration piece 8 are aligned in the z-axis direction, and at this time, the system records the positions of the upper motion system 5 and the lower motion system 4 as the mechanical origin, so that when the upper alignment camera 7 and the lower alignment camera 6 are calibrated subsequently, the two can synchronously return to the mechanical origin, and the calibration mark point 821 can be synchronously shot to finish the calibration operation at the same time.
Since the center of the laser galvanometer 3 needs to be aligned with the first positioning mark point on the substrate workpiece and the second positioning mark point on the wafer workpiece when the transfer operation is actually performed, before the actual operation is performed, the coordinates of the center point of the laser galvanometer 3 in the upper camera coordinate system and the lower camera coordinate system need to be confirmed, that is, the step S2 is performed to determine the coordinates of the laser galvanometer 3.
After the reference coordinate system and the position of the laser galvanometer 3 are determined, the normal processing operation can be performed in step S3. In step S3, the substrate workpiece and the wafer workpiece are clamped, and then the coordinates of the first positioning mark point on the substrate workpiece and the second positioning mark point on the wafer workpiece are determined by using the upper alignment camera 7 and the lower alignment camera 6, and the system can calculate the direction and distance required to drive the upper motion system 5 and the lower motion system 4 to move when aligning the laser galvanometer 3, the first positioning mark point and the second positioning mark point according to the recorded coordinates of the laser galvanometer 3.
Assuming that the coordinates of the laser galvanometer 3 are (x 0, y 0) in step S2, after aligning the first positioning mark point with the center point of the field of view of the upper alignment camera 7, the lower motion system 4 can align the first positioning mark point with the center of the laser galvanometer 3 by moving only x0 in the x direction and y0 in the y direction. The alignment method of the second positioning mark point is the same.
After working for a certain period of time or finishing a certain workload, the temperature change of the upper alignment camera 7 and the lower alignment camera 6 is larger, and the temperature change affects the temperature change, so that a certain offset can be generated in a camera coordinate system, and the accuracy of subsequent alignment is further affected.
In order to overcome the technical problems, a set value of a timing or quantitative calibration camera is set in the system of the scheme, namely, after a set working time is up or a certain workload is completed, the system automatically performs calibration work of the upper alignment camera 7 and the lower alignment camera 6, and then performs conventional work alignment work.
In step S4, both the upper motion system 5 and the lower motion system 4 return to the mechanical origin, and in theory, assuming that the upper alignment camera 7 and the lower alignment camera 6 do not drift, the visual field centers of the upper alignment camera 7 and the lower alignment camera 6 coincide with the calibration mark point 821 in the z-axis direction. However, when the temperature drift occurs, the visual field centers of the upper alignment camera 7 and the lower alignment camera 6 deviate from the correction mark point 821, for example, referring to fig. 5, after returning to the mechanical origin, the visual field center of the upper alignment camera 7 is taken as the origin, the coordinates of the correction mark point 821 are (x 1, y 1) in the image shot by the upper alignment camera 7, which represents that the upper alignment camera 7 respectively undergoes the temperature drift-x 1, -y1 in the x and y directions, and the centers of the first positioning mark point and the laser galvanometer 3 can be aligned by compensating the drift amount into the lower motion system 4 in the subsequent processing alignment work. The calibration and compensation of the lower alignment camera 6 is in principle the same as the alignment camera 7, and reference is made to the implementation.
Wherein, optionally, the set value is a coordinate system calibrated once every 6-8 hours of working or a coordinate system calibrated once every 80-120 products processed.
In summary, in the alignment method of the present disclosure, after a certain period of time or a certain workload, the upper alignment camera 7 and the lower alignment camera 6 can be automatically calibrated, so as to ensure accuracy of alignment of the wafer workpiece and the substrate workpiece.
In one embodiment, the step of determining the mechanical origin includes: when the device is started up, the upper motion system 5 is driven to enable the correction mark point 821 to be overlapped with the visual field center of the upper alignment camera 7, and the lower motion system 4 is driven to enable the visual field center of the lower alignment camera 6 to be overlapped with the correction mark point 821.
The upper alignment camera 7 is mounted on the supporting beam 2, and is fixed in the x and y directions, the upper motion system 5 is driven to enable the correction mark point 821 to coincide with the center of the visual field of the upper alignment camera 7, the upper motion system 5 can be kept still, the lower motion system 4 is driven to align with the lower alignment camera 6, alignment work is completed through two driving, and the alignment method has the advantages of being simple and rapid in alignment process.
In one embodiment, the step of determining the coordinates of the laser galvanometer 3 includes: a first marking sheet is arranged on the lower motion system 4, and the laser galvanometer 3 is started to mark a first marking point on the marking sheet; and then driving the lower motion system 4 to enable the first mark point to coincide with the center of the visual field of the upper alignment camera 7, recording the moving distance of the motion system 4, and further calculating the coordinates of the laser galvanometer 3 in the upper camera coordinate system.
Specifically, after step S1 is completed, the visual field centers of the upper alignment camera 7 and the lower alignment camera 6 are both located at the origin in the upper camera coordinate system, and the coordinate of the laser galvanometer 3 in the upper camera coordinate system can be directly calculated by using the first mark point marked by the first mark sheet on the lower motion system 4 of the laser galvanometer 3 as a reference and moving the lower motion system 4 to make the first mark point coincide with the visual field center of the upper alignment camera 7, and recording the moving direction and distance of the motion system 4.
In one embodiment, the first marking sheet is a paper attached to the downloading table 41 of the lower motion system 4.
The paper is attached to the downloading table 41 for marking the first mark point, the downloading table 41 can provide reliable support, the reliability of the paper attaching can be ensured, and further the measuring precision can be ensured. And the attached paper is used for marking, so that the cost is low.
In one embodiment, the step of determining the coordinates of the laser galvanometer 3 includes: a second marking sheet is arranged on the upper motion system 5, and the laser galvanometer 3 is started to mark a second marking point on the second marking sheet; and then driving the upper moving system 5 to enable the second mark point to coincide with the center of the visual field of the lower alignment camera 6, recording the moving distance of the upper moving system 5, and further calculating the coordinates of the laser galvanometer 3 in the lower camera coordinate system.
Similarly, the second marking sheet is arranged on the upper motion system 5, and the position of the second marking point marked on the marking sheet is shot by the lower alignment camera 6, so that the purpose of simply and quickly calculating the coordinates of the laser galvanometer 3 in the lower camera coordinate system can be realized.
In one embodiment, the second marking sheet is clamped on the upper stage 51 of the upper motion system 5, and the second marking sheet is a glass sheet with a gallium nitride layer.
Because the loading platform 51 is a hollow annular platform, the marking sheet is required to be clamped at the bottom side of the loading platform 51 during clamping, and the glass sheet with the gallium nitride layer is adopted, so that the laser vibrating mirror has the advantages of stable and reliable structure, easiness in clamping and easiness in marking by the laser vibrating mirror 3.
In an embodiment, in the step of calibrating the upper alignment camera 7 and the lower alignment camera 6, after the upper motion system 5 and the lower motion system 4 are driven to return to the mechanical origin, the distance between the correction mark point 821 and the image center point is calculated by using the image acquired by the upper alignment camera 7 through the pixel ratio, so as to calculate the offset of the upper alignment camera; the distance between the correction mark point 821 and the center point of the image is calculated by the pixel ratio by using the image acquired by the lower alignment camera 6, and the offset of the lower alignment camera 6 is calculated.
The offset of the upper alignment camera 7 and the lower alignment camera 6 is calculated by means of the pixel ratio, and the method has the advantages of high precision and accuracy and simplifying the mechanical movement of the upper movement system 5 and the lower movement system 4.
In an embodiment, in the processing alignment step, after the coordinates of the first positioning mark point and the second positioning mark point are respectively determined, the lower motion system 4 is driven to align the laser galvanometer 3 with the first positioning mark point, and the moving distance of the lower motion system 4 is determined by calculating based on the coordinates of the first positioning mark point, the coordinates of the laser galvanometer 3 in an upper camera coordinate system, and the offset of the upper alignment camera; and driving the upper motion system 5 to align the laser galvanometer 3 with the second positioning mark point, wherein the moving distance of the upper motion system 5 is calculated and determined based on the coordinates of the second positioning mark point, the coordinates of the laser galvanometer 3 in a lower camera coordinate system and the offset of a lower alignment camera.
The calculation mode is adopted to compensate the movement amounts of the upper movement system 5 and the lower movement system 4, so that the accuracy of alignment of the laser galvanometer 3, the first positioning mark point and the second positioning mark point in the subsequent processing alignment process can be ensured.
In the specific implementation, the sequence of aligning the second positioning mark point and then aligning the first positioning mark point is preferably adopted, and the method specifically comprises the following steps: a. driving the lower motion system to return to a mechanical origin, and driving the upper motion system to move according to the coordinates of the laser galvanometer and the offset of the lower alignment camera so as to align the laser galvanometer with the second positioning mark point; b. the lower motion system is driven to align the first positioning mark point with the center of the visual field of the upper alignment camera, and then the lower motion system is driven to move according to the coordinates of the laser galvanometer and the offset of the upper alignment camera, so that the laser galvanometer is aligned with the first positioning mark point.
Specifically, in step a, the lower motion system returns to the mechanical origin first, which is equivalent to returning the lower alignment camera to the origin, and the coordinates of the field of view center of the upper and lower alignment cameras are (0, 0) in theory under the condition of not considering the temperature drift of the cameras, so that after the upper motion system is moved to the second positioning mark point to be aligned with the center of the lower alignment camera, only the displacement of the upper motion system in the xy direction is required to be the same as the coordinate values of the laser galvanometer in the lower camera coordinate system. In combination with consideration of the camera temperature drift, it is sufficient to directly compensate the offset of the lower alignment camera to the displacement of the upper motion system in the xy direction. After aligning the second positioning mark point, the upward movement system can be kept still.
In step b, since the upper alignment camera 7 is mounted on the supporting beam 2, the relative position between the upper alignment camera 7 and the laser galvanometer 3 is always inconvenient, and in the same way, the lower motion system 4 is driven to align the first positioning mark point with the center of the upper alignment camera, which is equivalent to returning the first positioning mark point to the origin of the upper camera coordinate system, and then only the offset compensation of the upper alignment camera is combined according to the coordinate value of the laser galvanometer 3 in the upper camera coordinate system, so that the lower motion system 4 is moved to align the first positioning mark point with the center of the laser galvanometer 3.
In summary, the scheme adopts a mode of aligning the second positioning mark point firstly and aligning the first positioning mark point later, after the lower motion system 4 returns to the mechanical origin, the alignment work of the first positioning mark point and the second positioning mark point can be completed only by driving the upper motion system 5 twice and driving the lower motion system 4 twice, the operation of the upper motion system 5 and the lower motion system 4 does not need to be frequently switched, the mechanical motion mode can be simplified, and the alignment operation is quickened.
In the description herein, it should be understood that the terms "upper," "lower," "left," "right," and the like are merely for convenience of description and to simplify the operation, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the application. Furthermore, the terms "first," "second," and the like, are used merely for distinguishing between descriptions and not for providing a special meaning.
In the description herein, reference to the term "one embodiment," "an example," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples.
Furthermore, it should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is provided for clarity only, and that the disclosure is not limited to the embodiments described in the foregoing embodiments, and that the embodiments described in the foregoing embodiments may be combined appropriately to form other embodiments that will be understood by those skilled in the art.
The technical principle of the present application is described above in connection with the specific embodiments. The description is made for the purpose of illustrating the general principles of the application and should not be taken in any way as limiting the scope of the application. Other embodiments of the application will be apparent to those skilled in the art from consideration of this specification without undue burden.
Claims (10)
1. A method of aligning a mass transfer device, comprising the steps of:
Determining a mechanical origin: when the equipment is started initially, aligning and overlapping the visual field center of the lower alignment camera, the visual field center of the upper alignment camera and the correction mark points on the calibration piece, and recording the positions of the upper motion system and the lower motion system as mechanical origins;
And (3) determining laser galvanometer coordinates: when the positions of the upper motion system and the lower motion system are at the mechanical origin, the visual field center of the upper alignment camera is the origin of an upper camera coordinate system, the visual field center of the lower alignment camera is the origin of a lower camera coordinate system, and the coordinates of the laser galvanometer in the upper camera coordinate system and the lower camera coordinate system are respectively determined;
And (3) processing and aligning: searching a first positioning mark point on a substrate workpiece on a downloading table by using the upper alignment camera, searching a second positioning mark point on a wafer workpiece on the uploading table by using the lower alignment camera, and adjusting the positions of the uploading table and the downloading table according to the coordinates of a laser galvanometer after the positions of the first positioning mark point and the second positioning mark point are determined, so that the laser galvanometer, the first positioning mark point and the second positioning mark point are overlapped in a z-axis;
Calibrating an upper alignment camera and a lower alignment camera: and after the working time length or the finishing workload of the equipment reaches a set value, driving the upper motion system and the lower motion system to return to a mechanical origin, respectively recording the relative positions of the visual field centers of the upper alignment camera and the lower alignment camera and the correction mark point on the calibration piece, calculating the offset of the upper alignment camera and the offset of the lower alignment camera, compensating the offset to a control system, and continuing the processing alignment and processing operation.
2. The method of aligning a mass transfer device of claim 1 wherein said determining a mechanical origin step comprises: when the device is started initially, the upper motion system is driven to enable the correction mark point to coincide with the visual field center of the upper alignment camera, and then the lower motion system is driven to enable the visual field center of the lower alignment camera to coincide with the correction mark point.
3. The method of aligning a mass transfer device of claim 1 wherein said determining laser galvanometer coordinates step comprises: setting a first marking sheet on the lower motion system, and starting the laser galvanometer to mark a first marking point on the first marking sheet; and then driving the lower motion system to enable the first mark point to coincide with the center of the visual field of the upper alignment camera, recording the moving distance of the motion system, and further calculating the coordinates of the laser galvanometer in the upper camera coordinate system.
4. The method of aligning a mass transfer device of claim 3 wherein said first marking sheet is a sheet of paper attached to a download table of said lower motion system.
5. The method of aligning a mass transfer device of claim 1 wherein said determining laser galvanometer coordinates step comprises: setting a second marking sheet on the upper motion system, and starting the laser galvanometer to mark a second marking point on the second marking sheet; and then driving an upper motion system to enable the second mark point to coincide with the center of the visual field of the lower alignment camera, recording the moving distance of the upper motion system, and further calculating the coordinates of the laser galvanometer in the lower camera coordinate system.
6. The method of aligning a mass transfer device of claim 5 wherein said second marker is clamped to said upper motion stage and said second marker is a glass sheet with a gallium nitride layer.
7. The method according to claim 1, wherein in the step of calibrating the coordinates of the upper and lower alignment cameras, after driving the upper and lower motion systems back to the mechanical origin, the distance between the correction mark point and the image center point is calculated by the pixel ratio using the image acquired by the upper alignment camera, and the offset of the upper alignment camera is calculated; and calculating the distance between the correction mark point and the center point of the image through the pixel ratio by utilizing the image acquired by the lower alignment camera, so as to calculate the offset of the lower alignment camera.
8. The alignment method of the mass transfer device according to claim 1, wherein in the processing alignment step, after the coordinates of the first positioning mark point and the second positioning mark point are respectively determined, the lower motion system is driven to align the laser galvanometer with the first positioning mark point, and the moving distance of the lower motion system is calculated and determined based on the coordinates of the first positioning mark point, the coordinates of the laser galvanometer in an upper camera coordinate system, and the offset of the upper alignment camera; and driving the upper motion system to align the laser galvanometer with the second positioning mark point, wherein the moving distance of the upper motion system is calculated and determined based on the coordinate of the second positioning mark point, the coordinate of the laser galvanometer in the lower camera coordinate system and the offset of the lower alignment camera.
9. An alignment system for performing the alignment method of any of claims 1-8, installed in a mass transfer device comprising a machine (1) and a lower kinematic system (4), an upper kinematic system (5) and a support beam (2) arranged on the machine (1), the lower kinematic system (4) comprising a downloading table (41), the upper kinematic system (5) comprising an uploading table (51);
The alignment system is characterized by comprising:
An upper alignment camera (7) which is arranged on the supporting beam (2) and is positioned on the uploading table (51) and used for positioning and clamping the substrate workpiece on the downloading table (41);
A lower alignment camera (6) which is arranged on the lower motion system (4) and is used for positioning and clamping a wafer workpiece at the bottom side of the uploading table (51);
and the calibration piece (8) is arranged on the upper motion system (5) and is used for calibrating the coordinate systems of the upper alignment camera (7) and the lower alignment camera (6).
10. The alignment system according to claim 9, wherein the calibration member (8) comprises a mounting block (81) and a transparent calibration block (82), the mounting block (81) is mounted on the upper motion system (5), the mounting block (81) has a light-transmitting hole, the transparent calibration block (82) is mounted on the mounting block (81) and aligned with the light-transmitting hole, and a correction mark point (821) is provided on the transparent calibration block (82).
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| CN116352251A (en) * | 2023-02-28 | 2023-06-30 | 京东方科技集团股份有限公司 | Laser processing method and system, computer equipment and medium |
| CN117607647A (en) * | 2023-11-06 | 2024-02-27 | 杭州中安电子股份有限公司 | Wafer blanking machine and calibration method |
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|---|---|---|---|---|
| CN113245712A (en) * | 2021-06-28 | 2021-08-13 | 苏州赛腾精密电子股份有限公司 | Laser spot position correction method and chip scale wafer level marking equipment |
| CN116352251A (en) * | 2023-02-28 | 2023-06-30 | 京东方科技集团股份有限公司 | Laser processing method and system, computer equipment and medium |
| CN117607647A (en) * | 2023-11-06 | 2024-02-27 | 杭州中安电子股份有限公司 | Wafer blanking machine and calibration method |
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