CN118386141A - Dressing wheel for polishing pad and dressing method thereof - Google Patents
Dressing wheel for polishing pad and dressing method thereof Download PDFInfo
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- CN118386141A CN118386141A CN202410682829.8A CN202410682829A CN118386141A CN 118386141 A CN118386141 A CN 118386141A CN 202410682829 A CN202410682829 A CN 202410682829A CN 118386141 A CN118386141 A CN 118386141A
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- polishing pad
- dressing
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- conditioning
- polishing
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- 238000005498 polishing Methods 0.000 title claims abstract description 214
- 238000000034 method Methods 0.000 title claims abstract description 40
- 239000002245 particle Substances 0.000 claims abstract description 21
- 230000003750 conditioning effect Effects 0.000 claims description 35
- 239000000919 ceramic Substances 0.000 claims description 29
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 15
- 238000011010 flushing procedure Methods 0.000 claims description 10
- 229910003460 diamond Inorganic materials 0.000 claims description 8
- 239000010432 diamond Substances 0.000 claims description 8
- 238000004140 cleaning Methods 0.000 claims description 4
- 239000006061 abrasive grain Substances 0.000 claims description 2
- 230000000694 effects Effects 0.000 description 15
- 230000008569 process Effects 0.000 description 12
- 239000004576 sand Substances 0.000 description 9
- 235000012431 wafers Nutrition 0.000 description 6
- 230000001680 brushing effect Effects 0.000 description 5
- 238000007517 polishing process Methods 0.000 description 5
- 239000010865 sewage Substances 0.000 description 5
- 238000009966 trimming Methods 0.000 description 5
- 229910052594 sapphire Inorganic materials 0.000 description 4
- 239000010980 sapphire Substances 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 230000010485 coping Effects 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 244000144992 flock Species 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 238000005056 compaction Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007730 finishing process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000003562 lightweight material Substances 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Landscapes
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The present disclosure relates to a dressing wheel for a polishing pad and a dressing method thereof, the dressing wheel for a polishing pad including a dressing wheel body and a plurality of dressing members, a plurality of the dressing members being disposed at intervals on a surface of the dressing wheel body, the dressing member surface having dressing particles. Through the technical scheme, the dressing wheel provided by the disclosure can enable the surface of the polishing pad to be well dressed.
Description
Technical Field
The disclosure relates to the technical field of auxiliary material processing of sapphire wafers, in particular to a dressing wheel for a polishing pad and a dressing method thereof.
Background
The sapphire wafer is formed by processing a sapphire crystal bar through multiple procedures of orientation, slicing, double-sided grinding, single-sided polishing and the like. The polishing process can remove scratches and damaged layers on the surface of the sapphire wafer, and simultaneously, the flatness and the warping degree of the wafer are trimmed, and the properties of the polishing pad directly influence the surface quality and the polishing rate of the wafer. Therefore, how to achieve good dressing of the polishing pad is a problem that is currently in need of solution.
Disclosure of Invention
An object of the present disclosure is to provide a dressing wheel for a polishing pad capable of well dressing a surface of the polishing pad, and a dressing method thereof.
In order to achieve the above object, the present disclosure provides a conditioning wheel for a polishing pad, including a conditioning wheel body and a plurality of abrasive members provided at intervals on a surface of the conditioning wheel body, the abrasive member surface having abrasive grains.
Optionally, the dressing wheel body is configured as a ring body, and the plurality of dressing pieces are arranged on the ring body along the circumferential direction of the ring body.
Optionally, the dressing member includes a plurality of dressing sheets, a plurality of the dressing sheets being arranged in a circumferential array, the dressing sheets having the dressing particles on a surface thereof.
Optionally, the interval between two adjacent grinding sand sheets is 0.5 cm-1.5 cm.
Optionally, the abrasive finishing sheet is configured as a fan-shaped abrasive finishing sheet, and an apex of a central angle of the fan-shaped abrasive finishing sheet is directed toward a center of the circumferential array.
Optionally, the grinding particles are diamond particles, and the density of the diamond particles is 70-90 meshes.
Optionally, the dressing wheel further comprises a suction plate, wherein the suction plate is arranged at the hollow part of the circular ring body and is connected with the circular ring body.
On the basis of the technical scheme, the present disclosure further provides a dressing method of a polishing pad, the dressing method is applied to the dressing wheel for the polishing pad, and the dressing method comprises:
Pasting and pressing the polishing pad;
securing the conditioner wheel such that a dressing member of the conditioner wheel contacts the polishing pad;
manipulating the conditioner wheel relative to the polishing pad; and
Cleaning the polishing pad.
Optionally, the securing the conditioner wheel to bring the abrasive article of the conditioner wheel into contact with the polishing pad comprises:
placing the conditioning wheel on the surface of the polishing pad;
fixing the finishing wheel through a limit clamp; and
The control ram descends to press the conditioning wheel.
Optionally, the pressing pressure of the pressing head is 80 kg-150 kg.
Optionally, the manipulating the conditioner wheel motion relative to the polishing pad comprises:
controlling the dressing wheel to rotate around the center of the polishing pad at a first rotation speed, and flushing the dressing wheel and the polishing pad;
controlling the polishing pad to rotate around the center of the polishing pad at a second rotating speed, and flushing the dressing wheel and the polishing pad;
wherein the dressing wheel and the polishing pad rotate in the same direction, and the first rotational speed is greater than the second rotational speed.
Optionally, the conditioner wheel and the polishing pad are rinsed with water, and the flow rate of the water is 8L/min-12L/min.
Optionally, the first rotation speed is 30 rpm-35 rpm, and the second rotation speed is 22 rpm-27 rpm.
Optionally, the attaching and pressing the polishing pad includes:
Adhering the polishing pad to the surface of the millstone;
Placing and fixing a ceramic disc on the surface of the polishing pad; and
The ceramic disk is manipulated to move relative to the polishing pad.
Optionally, the placing and fixing the ceramic disc on the polishing pad surface comprises:
The ceramic disc is fixed through a limit clamp; and
The operating ram descends to press the ceramic disc.
Optionally, the ceramic disc is removed after the manipulating the ceramic disc relative to the polishing pad.
Optionally, brushing the polishing pad with a brush.
Through the technical scheme, in the dressing wheel for the polishing pad, the plurality of polishing pieces with polishing particles are arranged on the surface of the dressing wheel body at intervals, so that when the polishing pad is dressed through the dressing wheel, the polishing pad is dressed through the cooperation of the polishing particles on the surfaces of the plurality of polishing pieces and the surface of the polishing pad. Wherein, the setting of a plurality of coping pieces can improve coping efficiency. In addition, a plurality of polishing pieces can form the clearance between adjacent polishing pieces through the arrangement mode that the interval set up, and the formation of these clearances makes the polishing pad in the timely outflow of the produced sewage of polishing in-process, avoids causing the pollution to polishing pad surface, consequently can further improve polishing pad surface's repair effect.
Additional features and advantages of the present disclosure will be set forth in the detailed description which follows.
Drawings
The accompanying drawings are included to provide a further understanding of the disclosure, and are incorporated in and constitute a part of this specification, illustrate the disclosure and together with the description serve to explain, but do not limit the disclosure. In the drawings:
FIG. 1 is a schematic illustration of the configuration of a conditioning wheel in an exemplary embodiment provided by the present disclosure;
FIG. 2 is a schematic illustration of the construction of a sanding sheet in an exemplary embodiment provided by the present disclosure;
Fig. 3 is a flow diagram of a method of dressing in an exemplary embodiment provided by the present disclosure.
Description of the reference numerals
1-A dressing wheel body; 2-grinding the part; 21-grinding sand sheets; 211-grinding particles; 3-suction plate.
Detailed Description
Specific embodiments of the present disclosure are described in detail below with reference to the accompanying drawings. It should be understood that the detailed description and specific examples, while indicating and illustrating the disclosure, are not intended to limit the disclosure.
In the present disclosure, unless otherwise stated, terms such as "upper and lower" refer to upper and lower in the direction of gravity in actual use. Furthermore, in the following description, when referring to the drawings, the same reference numerals in different drawings denote the same or similar elements unless otherwise explained. The foregoing definitions are provided for the purpose of illustrating and explaining the present disclosure and should not be construed as limiting the present disclosure.
The present disclosure provides a conditioner disk for a polishing pad, which includes a conditioner disk body 1 and a plurality of conditioner members 2, the plurality of conditioner members 2 being disposed at intervals on a surface of the conditioner disk body 1, the surface of the conditioner member 2 having conditioner particles 211, as shown with reference to fig. 1 and 2.
Through the above technical solution, in the dressing wheel for polishing pad provided in the present disclosure, by disposing the plurality of dressing members 2 having the dressing particles 211 at intervals on the surface of the dressing wheel body 1, it is achieved that the polishing pad is dressed by the dressing particles 211 on the surface of the plurality of dressing members 2 acting together with the surface of the polishing pad when the polishing pad is dressed by the dressing wheel. Wherein the arrangement of a plurality of grinding members 2 can improve the grinding efficiency. In addition, a plurality of polishing pieces 2 can form the clearance between adjacent polishing pieces 2 through the arrangement mode that the interval set up, and the formation of these clearances makes the sewage that the polishing pad produced in the polishing process can in time flow out, avoids causing the pollution to the polishing pad surface, consequently can further improve the trimming effect on polishing pad surface.
In the exemplary embodiment provided in the present disclosure, the conditioning wheel body 1 may be configured in any suitable structure, which is not limited by the present disclosure. Alternatively, referring to fig. 1, the dresser wheel body 1 may be configured as a ring body to which a plurality of dressing members 2 are arranged in the circumferential direction of the ring body, and by such arrangement, the weight of the dresser wheel body 1 can be reduced, so that even if the apparatus malfunctions, the labor intensity of workers can be reduced, facilitating the handling of the dresser wheel by hand. In order to avoid corrosion caused by contact of the dressing wheel body 1 with water during dressing, the dressing wheel body 1 may be made of stainless steel.
In the exemplary embodiment provided in the present disclosure, referring to fig. 1, the dressing member 2 may include a plurality of dressing sheets 21, the plurality of dressing sheets 21 being arranged in a circumferential array, and the dressing sheets 21 having the dressing particles 211 on the surface thereof, so that, on one hand, the area of the dressing sheets 21 per unit circular arc in the circumferential direction of the ring body may be increased to increase the dressing effect, and on the other hand, gaps may be formed between adjacent dressing sheets 21 to facilitate the discharge of sewage generated during the dressing process. The grinding sand sheet 21 may be made of silicon carbide.
Wherein, in order to ensure that the sewage smoothly flows out through the gap formed between the two adjacent grinding sand sheets 21, the interval between the two adjacent grinding sand sheets 21 can be set to be 0.5 cm-1.5 cm. Illustratively, the distance between two adjacent grinding sand sheets 21 may be 0.5cm, 0.6cm, 0.7cm, 0.8cm, 0.9cm, 1cm, 1.1cm, 1.2cm, 1.3cm, 1.4cm or 1.5cm, or any suitable size within the numerical range of 0.5cm to 1.5cm, which may be flexibly selected according to practical situations, and the present disclosure is not limited thereto.
In the exemplary embodiment provided by the present disclosure, the coping sand sheet 21 may be provided in any suitable structure, such as circular or oval, without limitation to the present disclosure. Alternatively, referring to fig. 1 and 2, the polishing pad 21 may be configured as a sector-shaped polishing pad 21, and the apex of the central angle of the sector-shaped polishing pad 21 is directed to the center of the circumferential array, so that each polishing member 2 may be composed of four polishing pads 21 as shown, and when the polishing pad is polished by the polishing pad having such a structure, the polishing pad and the polishing pad are relatively rotated, and during this process, the portion of the polishing pad 21 for contacting the area to be polished of the polishing pad is always the circular arc surface of the sector-shaped polishing pad, so that the contact between the polishing pad 21 and the area to be polished on the polishing pad is made more gentle, and damage to the polishing pad caused by the relative rotation of the polishing pad and the polishing pad can be reduced or even avoided, thereby improving the polishing effect.
Wherein, when the dressing member 2 includes four sector-shaped dressing abrasive sheets 21 arranged in a circumferential array, in order to further enhance the dressing effect of the polishing cloth, one of the cross-shaped gaps formed between the dressing abrasive sheets 21 may also be arranged in the radial direction of the ring body of the dressing wheel, so that the discharge of the sewage at the center of the ring body during the dressing process may be facilitated.
In the exemplary embodiment provided in the present disclosure, in order to secure the dressing effect of the polishing pad, the dressing particles 211 may be provided as diamond particles, and the density of the diamond particles is 70 mesh to 90 mesh. The density of the diamond particles may be 70 mesh, 80 mesh or 90 mesh, or any suitable density within the numerical range of 70 mesh to 90 mesh, and may be flexibly selected according to practical situations, which is not limited in the present disclosure.
In the exemplary embodiment provided by the present disclosure, referring to fig. 1, in order to improve the degree of mechanization in the polishing cloth dressing process, a dressing wheel may be provided and further include a suction plate 3, where the suction plate 3 may be disposed at a hollow portion of the circular ring body and connected to the circular ring body, so that when the polishing cloth dressing wheel is carried, the dressing wheel may be transferred by adsorbing the suction plate 3 by a suction cup installed on a manipulator or the like, thereby greatly improving the working efficiency. In order to further reduce the weight of the dresser wheel, the suction plate 3 may be made of a lightweight material such as a plastic plate.
On the basis of the technical scheme, the present disclosure further provides a dressing method of a polishing pad, referring to fig. 3, the dressing method includes: pasting and pressing the polishing pad; fixing the dresser wheel so that the dresser 2 of the dresser wheel contacts the polishing pad; controlling the dressing wheel to move relative to the polishing pad; and cleaning the polishing pad.
According to the technical scheme, in the dressing method provided by the disclosure, the polishing pad is reliably fixed by being stuck and pressed, so that the polishing pad is prevented from sliding in the dressing process, and the polishing process is prevented from being influenced; the dressing member 2 of the dressing wheel is used for dressing the surface of the polishing pad in the moving process by fixing the dressing wheel so that the dressing member 2 of the dressing wheel contacts the polishing pad and controlling the dressing wheel to move relative to the polishing pad; dirt generated in the polishing process is prevented from remaining on the surface of the polishing pad by cleaning the polishing pad, so that the polishing effect is affected.
In the exemplary embodiment provided in the present disclosure, in order to reliably fix the conditioning wheel so as to enable the polishing pad to have a good conditioning effect in the conditioning process, fixing the conditioning wheel so that the dressing member 2 of the conditioning wheel contacts the polishing pad may include: placing a conditioning wheel on the surface of the polishing pad; fixing the finishing wheel through a limit clamp; and controlling the pressure head to descend so as to press the finishing wheel, so that the finishing wheel can be reliably fixed under the combined action of the limit clamp and the pressure head, and the finishing effect of the polishing pad is prevented from being influenced by sliding of the finishing wheel in the finishing process. The limiting clamps can comprise two limiting clamps, and the two limiting clamps fix the finishing wheel in the horizontal direction along the radial direction.
Wherein, in order to enable the pressing head to reliably fix the finishing wheel in the vertical direction, the pressing pressure of the pressing head can be set to be 80 kg-150 kg. The pressing pressure of the pressing head may be 80kg, 90kg, 100kg, 110kg, 120kg, 130kg, 140kg or 150kg, or any suitable pressure within a numerical range of 80kg to 150kg, which may be flexibly selected according to practical situations, and the present disclosure is not limited thereto.
In an exemplary embodiment provided by the present disclosure, to provide a good dressing effect for a polishing pad, manipulating the movement of the dressing wheel relative to the polishing pad may be provided including: controlling the dressing wheel to rotate around the center of the polishing pad at a first rotation speed, and flushing the dressing wheel and the polishing pad; controlling the polishing pad to rotate around the center of the polishing pad at a second rotating speed, and flushing the finishing wheel and the polishing pad; wherein the rotation direction of the dressing wheel is the same as that of the polishing pad, and the first rotation speed is larger than the second rotation speed, by the arrangement, the polishing process in the polishing pad dressing process can be carried out in two steps, thus the polishing pad can be primarily roughly polished by controlling the dressing wheel to rotate around the center of the polishing pad at the first rotation speed with higher rotation speed, and the polishing pad is controlled to rotate around the center of the polishing pad at a second rotating speed with a lower rotating speed to finely grind the roughly ground polishing pad, so that the grinding efficiency of the polishing pad can be improved, and the grinding frequency of the polishing pad is increased, so that the grinding effect of the surface of the polishing pad can be considered.
It should be noted that, in the above embodiment, when the primary polishing (i.e., controlling the polishing pad to rotate around the center of the polishing pad at the first rotational speed) can already achieve the polishing effect required for the polishing pad, the secondary polishing (i.e., controlling the polishing pad to rotate around the center of the polishing pad at the second rotational speed) is not required.
In the exemplary embodiments provided by the present disclosure, in order to prevent contaminants from remaining on the surfaces of the polishing pad and the conditioning wheel during the conditioning, the conditioning wheel and the polishing pad may be rinsed with water, and the flow rate of water may be set to 8 to 12L/min. The flow rate of water may be set to 8L/min, 9L/min, 10L/min, 11L/min or 12L/min, or any suitable flow rate within a numerical range of 8L/min to 12L/min, which may be flexibly selected according to practical situations, and the disclosure is not limited thereto.
In the exemplary embodiment provided in the present disclosure, in order to achieve both the dressing efficiency and the dressing effect of the polishing pad, the first rotation speed may be set to 30rpm to 35rpm and the second rotation speed may be set to 22rpm to 27rpm. The first rotation speed may be 30rpm, 31rpm, 32rpm, 33rpm, 34rpm or 35rpm, or any suitable rotation speed within a numerical range of 30rpm to 35rpm, which may be flexibly selected according to practical situations, and the present disclosure is not limited thereto. The second rotation speed may be 22rpm, 23rpm, 24rpm, 25rpm, 26rpm or 27rpm, or any suitable rotation speed within the numerical range of 22rpm to 27rpm, which may be flexibly selected according to practical situations, and the present disclosure is not limited thereto.
In an exemplary embodiment provided by the present disclosure, for reliable fixing of the polishing pad, it may be provided that attaching and pressing the polishing pad includes: adhering a polishing pad on the surface of a millstone; placing and fixing a ceramic disc on the surface of a polishing pad; and controlling the ceramic disc to move relative to the polishing pad, and by the arrangement, the back glue of the polishing pad can be adhered and fixed with the surface of the grinding disc more uniformly and reliably under the action of the ceramic disc.
In an exemplary embodiment provided by the present disclosure, to avoid slippage of the ceramic disk during movement, placing and fixing the ceramic disk on the polishing pad surface may be provided including: fixing the ceramic disc through a limit clamp; and controlling the pressure head to descend so as to press the ceramic disc, thus reliably fixing the ceramic disc through the combined action of the limit clamp and the pressure head and avoiding the ceramic disc from sliding in the trimming process to influence the compaction effect of the polishing pad. Wherein, limit clamp can include two, and two limit clamp carry out the fixed of horizontal direction to the ceramic dish along radial.
Wherein, because the ceramic disc needs to be replaced by a dressing wheel to dress the surface of the polishing pad after the fixing of the polishing pad is finished, the ceramic disc needs to be removed after the ceramic disc is controlled to move relative to the polishing pad.
In the exemplary embodiments provided by the present disclosure, in order to secure the dressing effect of the polishing pad, the polishing pad may be brushed with a brush, so that, on one hand, flocks generated by the polishing pad during polishing may be brushed off, and, on the other hand, the flock brush, in which the surface of the polishing pad is collapsed, may be erected, thereby improving the polishing effect of the surface of the polishing pad.
It should be noted that, the polishing pad dressing method provided by the present disclosure not only can be used for dressing a brand new polishing pad, but also can be used for dressing a used polishing pad.
The dressing wheel and dressing method of the present disclosure will be described below with reference to specific embodiments. Referring to fig. 1 to 3, the dressing method of the polishing pad includes the following operation steps:
Example 1, new pad conditioning:
And pasting a polishing pad and fixing the polishing pad. Specifically, setting the pressure of a pressure head to be 500kg through a program, placing a ceramic disc with the diameter of 520mm on the surface of a polishing pad, controlling the pressure head to descend to the back surface of the ceramic disc, starting the program to rotate the pressing pad for 10-15 min;
A new polishing pad is subjected to a first dressing. Specifically, the surface of a new polishing pad is soaked and wetted, a dressing wheel is placed on the polishing pad and fixed by a limit clamp and a pressure head, and then the first dressing is started. In the dressing, the thickness of the dressing wheel body 1 in the dressing wheel used was 75mm, the thickness of the dressing abrasive sheet 21 was 15mm, diamond particles plated on the surface of the dressing abrasive sheet were 80 mesh, the first dressing pressure was set to 150kg, the time was 5min to 10min, the upper plate (i.e., the dressing wheel) was rotated clockwise at 30rpm, the lower plate (i.e., the grinding plate for fixing the polishing pad) was rotated clockwise at 25rpm, and the flow rate of pure water was 10L/min. After finishing the first finishing, flushing fluff residues trimmed from the surface of the polishing pad by adopting high pressure, wherein the pressure of the high pressure flushing is 100mpa, and the time is 5-10 min;
a second dressing is performed on the new polishing pad. Specifically, the dressing is continuously performed by using the same dressing wheel as that used for the first dressing, the second dressing pressure is set to 80kg for 10-15 min, the upper disc (i.e., the dressing wheel) rotates clockwise at a rotation speed of 35rpm, the lower disc (i.e., the grinding disc for fixing the polishing pad) rotates clockwise at a rotation speed of 25rpm, and the pure water flow rate is 10L/min. After finishing the second finishing, high-pressure flushing is carried out on fluff residues after finishing the surface of the polishing pad, wherein the high-pressure flushing pressure is 100mpa, and the time is 5min;
Brushing the surface of the polishing pad with a brush. Specifically, the pressure during brush brushing was set to 200kg for 5min to 10min, the upper plate (i.e., brush) was rotated clockwise at 40rpm, the pure water flow rate was 10L/min, the lower plate (i.e., the abrasive plate for fixing the polishing pad) was rotated clockwise at 35rpm, and the pure water flow rate was 15L/min.
Example 2, used old pad dressing:
And (5) trimming the old pad. Specifically, since reaction products are continuously accumulated on the surface of the polishing pad during the use process of the polishing pad, and at the same time, the surface fluff of the polishing pad is continuously bent to reduce the surface roughness, the polishing pad needs to be subjected to intermediate finishing during the wafer processing process so that the surface roughness of the polishing pad meets the requirements. In the repairing process, the thickness of the dressing wheel body 1 of the used dressing wheel is 75mm, the thickness of the dressing sand sheet is 15mm, diamond particles plated on the surface of the dressing sand sheet are 80 meshes, the middle dressing pressure is set to 120kg, the time is 2min, the upper disc (namely the dressing wheel) rotates clockwise at the rotating speed of 30rpm, the lower disc (namely the grinding disc for fixing the polishing pad) rotates clockwise at the rotating speed of 25rpm, and the pure water flow rate is 10L/min;
Brushing the surface of the polishing pad with a brush. Specifically, the pressure during brush brushing is set to be 200kg for 5-10 min, the upper disc (i.e., the brush) rotates clockwise at 40rpm, the pure water flow rate is 10L/min, the lower disc (i.e., the grinding disc for fixing the polishing pad) rotates clockwise at 35rpm, and the pure water flow rate is 15L/min.
After the polishing pad is trimmed by adopting the trimming wheel and the trimming method, the surface of the polishing pad can be smoother, and abnormal residues on the surface of the polishing pad can be better removed, so that the product quality is improved, and the use efficiency of the polishing pad is improved.
The preferred embodiments of the present disclosure have been described in detail above with reference to the accompanying drawings, but the present disclosure is not limited to the specific details of the embodiments described above, and various simple modifications may be made to the technical solutions of the present disclosure within the scope of the technical concept of the present disclosure, and all the simple modifications belong to the protection scope of the present disclosure.
In addition, the specific features described in the foregoing embodiments may be combined in any suitable manner, and in order to avoid unnecessary repetition, the present disclosure does not further describe various possible combinations.
Moreover, any combination between the various embodiments of the present disclosure is possible as long as it does not depart from the spirit of the present disclosure, which should also be construed as the disclosure of the present disclosure.
Claims (17)
1. A conditioning wheel for a polishing pad, comprising a conditioning wheel body and a plurality of abrasive members, wherein a plurality of abrasive members are disposed on the surface of the conditioning wheel body at intervals, and the surface of the abrasive members has abrasive grains.
2. The dressing wheel for a polishing pad as claimed in claim 1, wherein the dressing wheel body is configured as a ring body, and a plurality of the dressing members are arranged on the ring body in a circumferential direction of the ring body.
3. The conditioning wheel for a polishing pad of claim 2, wherein the dressing member comprises a plurality of dressing abrasive sheets, a plurality of the dressing abrasive sheets being arranged in a circumferential array, the dressing abrasive sheet surface having the dressing particles.
4. A conditioning wheel for a polishing pad according to claim 3, wherein a spacing between adjacent two of the polishing abrasive sheets is 0.5cm to 1.5cm.
5. The conditioner disk for a polishing pad of claim 3, wherein the conditioner abrasive sheet is configured as a fan-shaped conditioner abrasive sheet, the apex of the central angle of the fan-shaped conditioner abrasive sheet pointing toward the center of the circumferential array.
6. The dressing wheel for a polishing pad as claimed in claim 1, wherein the dressing particles are diamond particles having a density of 70 mesh to 90 mesh.
7. The conditioning wheel for a polishing pad according to any one of claims 2 to 5, further comprising a suction plate provided at a hollow portion of the ring body and connected to the ring body.
8. A dressing method for a polishing pad, characterized by applying the dressing wheel for a polishing pad according to any one of claims 1 to 7, comprising:
Pasting and pressing the polishing pad;
securing the conditioner wheel such that a dressing member of the conditioner wheel contacts the polishing pad;
manipulating the conditioner wheel relative to the polishing pad; and
Cleaning the polishing pad.
9. The method of conditioning a polishing pad according to claim 8, wherein the fixing the conditioning wheel to bring the dressing member of the conditioning wheel into contact with the polishing pad comprises:
placing the conditioning wheel on the surface of the polishing pad;
fixing the finishing wheel through a limit clamp; and
The control ram descends to press the conditioning wheel.
10. The dressing method for a polishing pad according to claim 9, wherein the pressing pressure of the pressing head is 80kg to 150kg.
11. The method of conditioning a polishing pad of claim 8, wherein the manipulating the conditioning wheel motion relative to the polishing pad comprises:
controlling the dressing wheel to rotate around the center of the polishing pad at a first rotation speed, and flushing the dressing wheel and the polishing pad; and
Controlling the polishing pad to rotate around the center of the polishing pad at a second rotating speed, and flushing the dressing wheel and the polishing pad;
wherein the dressing wheel and the polishing pad rotate in the same direction, and the first rotational speed is greater than the second rotational speed.
12. The method of dressing a polishing pad according to claim 11, wherein the dressing wheel and the polishing pad are rinsed with water, and the flow rate of the water is 8L/min to 12L/min.
13. The method of conditioning a polishing pad according to claim 11, wherein the first rotational speed is 30rpm to 35rpm and the second rotational speed is 22rpm to 27rpm.
14. The method of conditioning a polishing pad according to claim 8, wherein the attaching and pressing the polishing pad comprises:
Adhering the polishing pad to the surface of the millstone;
Placing and fixing a ceramic disc on the surface of the polishing pad; and
The ceramic disk is manipulated to move relative to the polishing pad.
15. The method of conditioning a polishing pad according to claim 14, wherein said placing and securing a ceramic disc on the surface of the polishing pad comprises:
The ceramic disc is fixed through a limit clamp; and
The operating ram descends to press the ceramic disc.
16. The method of conditioning a polishing pad of claim 14, wherein the ceramic disc is removed after the manipulating the ceramic disc with respect to the polishing pad.
17. The method of conditioning a polishing pad according to claim 8, wherein the polishing pad is brushed with a brush.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410682829.8A CN118386141A (en) | 2024-05-29 | 2024-05-29 | Dressing wheel for polishing pad and dressing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410682829.8A CN118386141A (en) | 2024-05-29 | 2024-05-29 | Dressing wheel for polishing pad and dressing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN118386141A true CN118386141A (en) | 2024-07-26 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410682829.8A Pending CN118386141A (en) | 2024-05-29 | 2024-05-29 | Dressing wheel for polishing pad and dressing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN118386141A (en) |
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2024
- 2024-05-29 CN CN202410682829.8A patent/CN118386141A/en active Pending
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