CN118339935A

CN118339935A - System and method for cooling

Info

Publication number: CN118339935A
Application number: CN202280060490.7A
Authority: CN
Inventors: 马泰奥·布奇; 雷扎·阿齐齐安
Original assignee: Feverett Co
Current assignee: Feverett Co
Priority date: 2021-07-07
Filing date: 2022-07-06
Publication date: 2024-07-12

Abstract

The present disclosure provides systems and methods for cooling a heat source. The system may include: a vessel comprising a vessel wall and a heat source, a baffle disposed between the heat source and the vessel wall, and one or more heat exchangers or recirculation loops. The heat exchanger may be a liquid-liquid heat exchanger configured to remove heat from a liquid contacting the heat source. The recirculation loop may be configured to flow a liquid contacting the heat source to cool the heat source. The method may use the system described herein to cool a heat source.

Description

System and method for cooling

Cross reference

The present application claims priority from U.S. provisional patent application Ser. No. 63/219,057, U.S. provisional patent application Ser. No. 63/324,965, U.S. provisional patent application Ser. No. 63/345,647, U.S. provisional patent application Ser. No. 63/965, U.S. provisional patent application Ser. No. 25, U.S. 5, 2022, filed 7, 2021, each of which is incorporated herein by reference in its entirety.

Background

An increase in computing demand and performance may result in an increase in the amount of heat generated by the computing system. Thermal regulation of electronic systems may be critical to maintaining performance and lifetime of electronic systems. Thus, improvements in thermal conditioning and heat dissipation of electronic systems may in turn reduce the cost of and increase the efficiency of electronic device cooling.

Electrical faults may lead to unplanned downtime and reduce the life of electrical components coupled to the electrical network. When the electrical component is operated at a temperature higher than the temperature limit of the electrical component, the lifetime of the electrical component may be significantly shortened.

When reactive maintenance is applied, no action is taken until an electrical fault is detected. This can compromise the life of the electrical components of the system and lead to unexpected downtime and costly maintenance. In contrast, when preventive maintenance is applied, the number of operating hours, the time elapsed since the last maintenance, and the like are considered. Preventative maintenance may be triggered periodically to prevent electrical failure. However, existing preventative maintenance mechanisms may not take into account the actual real-time conditions of the electrical components, which may result in maintenance being performed earlier than necessary. This may lead to excessive maintenance that is not cost effective. In some cases, preventative maintenance may be scheduled at a point in time that is too late if some components of the electrical network fail accidentally and prematurely.

Disclosure of Invention

Systems and methods are provided herein that may be used to cool one or more components of various electronic systems. The systems and methods described herein may allow for cooling electronic components, such as computer servers, with increased efficiency and improved functionality compared to other systems for electronic cooling.

The predictive maintenance mechanisms described herein can monitor real-time conditions of electrical components, wires, and other components coupled to an electrical network. Predictive maintenance herein may be triggered by the monitored state of the electrical network to perform corrective actions, which helps to extend the life of the system without experiencing significant failure and downtime.

Individual electrical components on the same electrical network can affect each other's state due to the flow of electrical current, generated heat, electromagnetic field effects, vibrations, noise, and the like. In addition, switches within the network may change the topology between electrical components at any given time. Thus, the application of a predetermined rule set may not be optimal for detecting and predicting electrical faults due to the dynamic nature of the electrical network.

As described herein, intelligent algorithms (e.g., artificial intelligence, machine learning, etc.) may be used to simulate an electrical network environment to provide a solution for predictive maintenance based on real-time status monitoring data. Various sensors may be installed on the electrical network to provide real-time condition monitoring data to one or more intelligent algorithms. Continuous measurement of real-time condition data provided to the intelligent algorithm may allow simulation of the monitored electrical network and generate operational insights about the health of the electrical network and the individual electrical components associated with the electrical network.

The current generates heat through the electrical components. The continuous measurement and monitoring of the temperature associated with the electrical component may provide another data set that the intelligent algorithm may use to predict the probability and remaining time of the next expected electrical fault, thereby facilitating early corrective action.

In one aspect, the present disclosure provides a cooling system comprising: a container comprising a container wall, wherein the container is configured to hold a heat source submerged in a first liquid, wherein during use the first liquid is in thermal communication with the heat source and is configured to remove thermal energy from the heat source; a baffle in the vessel, wherein, during use, the baffle is disposed between the heat source and the vessel wall and configured to direct a flow of the first liquid during transfer of thermal energy away from the heat source; and a heat exchanger disposed in the vessel, wherein during use, the heat exchanger is in thermal communication with and is completely submerged in the first liquid and configured to flow a second liquid configured to remove thermal energy from the first liquid, thereby cooling the heat source.

In another aspect, the present disclosure provides a cooling system comprising: a container comprising a container wall, wherein the container comprises a heat source submerged in a first liquid, wherein the first liquid is in thermal communication with the heat source and configured to remove thermal energy from the heat source; a baffle disposed between the heat source and the vessel wall, wherein the baffle is configured to direct a flow of the first liquid during transfer of thermal energy away from the heat source; and a heat exchanger in thermal communication with and completely submerged in the first liquid, wherein the heat exchanger is configured to flow a second liquid configured to remove thermal energy from the first liquid, thereby cooling the heat source.

In some embodiments, the heat exchanger is disposed between the baffle and the vessel wall. In some embodiments, the cooling system further comprises an additional vessel, so the additional vessel comprises a heat exchanger, wherein the additional vessel is in fluid communication with the vessel such that, during use, the first liquid flows between the vessel and the additional vessel. In some embodiments, the heat exchanger includes a plurality of tubes configured to flow the second liquid. In some embodiments, the cooling system further comprises a blower configured to cool at least a portion of the first liquid. In some embodiments, the baffle is configured to direct the flow of the first liquid toward the heat exchanger. In some embodiments, the first liquid remains separate from the second liquid such that the first liquid does not contact the second liquid. In some embodiments, the first liquid is a dielectric liquid. In some embodiments, the first liquid directly contacts the heat source.

In some embodiments, the cooling system further comprises a recirculation loop configured to provide forced convection of the first liquid. In some embodiments, the baffle supports a heat source. In some embodiments, the baffle comprises a floor comprising perforations configured to allow the first liquid to flow through the floor. In some embodiments, the baffle comprises a baffle wall, and wherein the baffle wall comprises perforations configured to allow the first liquid to flow through the baffle wall. In some embodiments, the baffle includes a flow diverter configured to direct the flow of the first liquid around the heat source.

In some embodiments, the system further comprises a lid configured to seal the container. In some embodiments, the system further comprises a liquid cap disposed adjacent to and above the first liquid, wherein the liquid cap is configured to seal the container. In some embodiments, the system may further comprise a float configured to reduce the volume of the liquid cap. In some embodiments, the container includes a relief valve configured to maintain the pressure of the container below a threshold. In some embodiments, the system further comprises a gasket configured to seal the first liquid within the container. In some embodiments, the cushion is a rigid cushion. In some embodiments, the pad is a deformable pad. In some embodiments, the cooling system further comprises one or more processors coupled to the heat exchanger, wherein the one or more processors are configured to regulate the flow of the second liquid through the heat exchanger. In some embodiments, the cooling system further comprises a cable outlet configured to allow a portion of the cable to be disposed inside the container and another portion of the cable to be disposed outside the container, wherein the cable outlet is configured to seal the container. In some embodiments, the cable outlet comprises a conduit comprising at least a portion of the cable and a third liquid configured to seal the cable outlet. In some embodiments, the cooling system further comprises a displacement volume configured to reduce the volume of the first liquid compared to a system without the displacement volume. In some embodiments, the cooling system may be integrated with a renewable energy source. In some embodiments, the heat source is an electronic component. In some embodiments, the electronic component includes a wireless handle. In some embodiments, the wireless handle includes a wireless transmitter.

In another aspect, the present disclosure provides a cooling system comprising: a container comprising a container wall, wherein the container is configured to hold a heat source submerged in a first liquid, wherein during use the first liquid is in thermal communication with the heat source and is configured to remove thermal energy from the heat source; a baffle in the vessel, wherein, during use, the baffle is disposed between the heat source and the vessel wall and configured to direct a flow of the first liquid during transfer of thermal energy away from the heat source; and a recirculation loop configured to flow the first liquid, wherein the recirculation loop comprises (i) a channel comprising a converging structure and (ii) a pump configured to direct the first liquid through the converging structure of the channel, wherein during use the channel is disposed between the baffle and the vessel wall and the pump directs the first liquid through the converging structure to generate a suction force that pulls the first liquid through the converging structure to generate a flow of the first liquid between the baffle and the vessel wall, thereby cooling the heat source.

In another aspect, the present disclosure provides a cooling system comprising: a container comprising a container wall, wherein the container comprises a heat source submerged in a first liquid, wherein the first liquid is in thermal communication with the heat source and configured to remove thermal energy from the heat source; a baffle disposed between the heat source and the vessel wall, wherein the baffle is configured to direct a flow of the first liquid during transfer of thermal energy away from the heat source; and a recirculation loop configured to flow the first liquid, wherein the recirculation loop includes (i) a channel including a converging structure disposed between the baffle and the vessel wall and (ii) a pump configured to direct the first liquid through the converging structure of the channel to generate a suction force that pulls the first liquid through the converging structure to generate a flow of the first liquid between the baffle and the vessel wall, thereby cooling the heat source.

In some embodiments, the baffle is configured to direct the flow of the first liquid toward the vessel wall. In some embodiments, the cooling system further comprises a blower configured to cool at least a portion of the first liquid. In some embodiments, the first liquid is a dielectric liquid. In some embodiments, the first liquid directly contacts the heat source. In some embodiments, the cooling system further comprises one or more processors coupled to the recirculation loop, wherein the one or more processors are configured to regulate the flow of the first liquid through the recirculation loop. In some embodiments, the baffle supports a heat source. In some embodiments, the baffle comprises a floor comprising perforations configured to allow flow of the first liquid through the floor. In some embodiments, the baffle comprises a baffle wall, and wherein the baffle wall comprises perforations configured to allow flow of the first liquid through the baffle wall. In some embodiments, the baffle includes a flow diverter configured to direct the flow of the first liquid around the heat source.

In some embodiments, the cooling system further comprises a lid configured to seal the container. In some embodiments, the cooling system further comprises a liquid cap disposed adjacent to and above the first liquid, wherein the liquid cap is configured to seal the container. In some embodiments, the cooling system further comprises a float configured to reduce the volume of the liquid cap. In some embodiments, the container includes a relief valve configured to maintain the pressure of the container below a threshold. In some embodiments, the cooling system further comprises a liner configured to seal the first liquid within the container. In some embodiments, the cushion is a rigid cushion. In some embodiments, the pad is a deformable pad. In some embodiments, the cooling system further comprises a cable outlet configured to allow a portion of the cable to be disposed inside the container and another portion of the cable to be disposed outside the container, wherein the cable outlet is configured to seal the container. In some embodiments, the cable outlet comprises a conduit comprising at least a portion of the cable and a third liquid configured to seal the cable outlet. In some embodiments, the cooling system further comprises a displacement volume configured to reduce the volume of the first liquid compared to a system without the displacement volume. In some embodiments, the cooling system may be integrated with a renewable energy source. In some embodiments, the heat source is an electronic component. In some embodiments, the electronic component includes a wireless handle. In some embodiments, the wireless handle includes a wireless transmitter.

In another aspect, the present disclosure provides a method for cooling a heat source, comprising: (a) Providing a cooling system in thermal communication with a heat source, wherein the cooling system comprises (i) a vessel comprising a vessel wall, wherein the vessel comprises a heat source submerged in a first liquid, (ii) a baffle disposed between the heat source and the vessel wall, and (iii) a heat exchanger in thermal communication with the first liquid and completely submerged in the first liquid, wherein the first liquid is in thermal communication with the heat source; (b) Transferring thermal energy from the heat source to the first liquid, and during the transferring, directing the first liquid to flow away from the heat source using a baffle; and (c) flowing a second liquid using a heat exchanger, wherein the second liquid removes thermal energy from the first liquid, thereby cooling the heat source.

In some embodiments, the method further comprises flowing the first liquid to maintain the first liquid in a subcooled state. In some embodiments, the heat exchanger is disposed between the baffle and the vessel wall. In some embodiments, the method further comprises flowing the first liquid to an additional vessel in fluid communication with the vessel, wherein the heat exchanger is disposed in the additional vessel. In some embodiments, the heat exchanger includes a plurality of tubes for flowing the second liquid. In some embodiments, the method further comprises cooling at least a portion of the first liquid using a blower. In some embodiments, the baffle directs the first liquid toward the heat exchanger. In some embodiments, the method further comprises using a pump coupled to the heat exchanger, wherein the pump directs the second liquid through the heat exchanger. In some embodiments, the method further comprises controlling a flow rate of the second liquid through the heat exchanger using one or more processors coupled to the pump.

In some embodiments, the first liquid is a dielectric liquid. In some embodiments, the first liquid directly contacts the heat source. In some embodiments, the baffle supports a heat source. In some embodiments, the baffle comprises a floor comprising perforations that allow the first liquid to flow through the floor. In some embodiments, the baffle comprises a baffle wall, and wherein the baffle wall comprises perforations that allow the first liquid to flow through the baffle wall. In some embodiments, the baffle includes a flow diverter that directs the flow of the first liquid around the heat source.

In some embodiments, the container comprises a lid that seals the container. In some embodiments, the cooling system includes a liquid cap disposed adjacent to and above the first liquid. In some embodiments, the system further comprises a float configured to reduce the volume of the liquid cap. In some embodiments, the container includes a relief valve that maintains the pressure of the container below a threshold value. In some embodiments, the container includes a liner that seals the first liquid within the container. In some embodiments, the cushion is a rigid cushion. In some embodiments, the pad is a deformable pad. In some embodiments, the method further comprises integrating the cooling system with a renewable energy source. In some embodiments, the method further comprises performing a secondary heating using a second liquid. In some embodiments, the heat source is an electronic component. In some embodiments, the electronic component includes a wireless handle. In some embodiments, the wireless handle includes a wireless transmitter.

In another aspect, the present disclosure provides a method for cooling a heat source, comprising: (a) Providing a cooling system in thermal communication with the heat source, wherein the cooling system comprises (i) a vessel comprising a vessel wall, wherein the vessel comprises the heat source submerged in a first liquid, (ii) a baffle disposed between the heat source and the vessel wall, and (iii) a recirculation loop comprising (a) a channel comprising a converging structure disposed between the baffle and the vessel wall, and (B) a pump directing the flow of the first liquid through the converging structure, wherein the first liquid is in thermal communication with the heat source; (b) Transferring thermal energy from the heat source to the first liquid, and during the transferring, directing the first liquid to flow away from the heat source using the baffle; and (c) directing the first liquid through the converging structure of the passageway using the pump of the recirculation loop to generate a suction force that pulls the first liquid through the converging structure and generates a flow of the first liquid between the baffle and the vessel wall, thereby cooling the heat source.

In some embodiments, the method further comprises flowing the first liquid such that the first liquid is maintained in a subcooled state. In some embodiments, the baffle directs the first liquid toward the vessel wall. In some embodiments, the first liquid is a dielectric liquid. In some embodiments, the first liquid directly contacts the heat source. In some embodiments, the method further comprises cooling at least a portion of the first liquid using a blower.

In some embodiments, the baffle supports a heat source. In some embodiments, the baffle comprises a floor comprising perforations that allow the first liquid to flow through the floor. In some embodiments, the baffle comprises a baffle wall, and wherein the baffle wall comprises perforations that allow the first liquid to flow through the baffle wall. In some embodiments, the baffle includes a flow diverter that directs the flow of the first liquid around the heat source.

In some embodiments, the container comprises a lid that seals the container. In some embodiments, the cooling system includes a liquid cap disposed adjacent to and above the first liquid. In some embodiments, the system further comprises a float configured to reduce the volume of the liquid cap. In some embodiments, the container includes a relief valve that maintains the pressure of the container below a threshold value. In some embodiments, the container includes a gasket configured to seal the first liquid within the container. In some embodiments, the cushion is a rigid cushion. In some embodiments, the pad is a deformable pad. In some embodiments, the method further comprises controlling the flow of the first liquid through the converging structure using one or more processors coupled to the pump. In some embodiments, the method further comprises integrating the cooling system with a renewable energy source. In some embodiments, the method further comprises performing a secondary heating using the first liquid. In some embodiments, the heat source is an electronic component. In some embodiments, the electronic component includes a wireless handle. In some embodiments, the wireless handle includes a wireless transmitter.

In another aspect, the present disclosure provides a kit comprising a cooling system as described herein and a single container comprising a first liquid and a liquid cap. In some embodiments, the first liquid and the liquid cap are configured to separate when added to the cooling system.

In another aspect, the present disclosure provides a method for predicting an overheating event to aid in cooling a heat source, the method comprising: (a) Receiving a plurality of parameters associated with a plurality of electrical components of an electrical network from a plurality of sensors, wherein one of the plurality of sensors is a temperature sensor; and (b) the computer processing the plurality of parameters with a predictive model to generate an output indicative of the overheating event, wherein the predictive model is trained on a training dataset comprising a plurality of historical data for the plurality of parameters across different points in time, and wherein the plurality of historical data is marked as originating or not originating from an electrical component experiencing the overheating event.

In some implementations, the predictive model is a binary predictive model, and wherein the output is a binary output indicating whether one of the plurality of electrical components will experience an overheating event. In some implementations, the predictive model is a multi-class predictive model, and wherein the output includes probability distributions over multiple levels or urgency of the overheating event. In some embodiments, the plurality of sensors includes an electrical characteristic sensor. In some embodiments, the training data set includes a plurality of historical data regarding thermal measurements received from the temperature sensor and electrical property measurements from the electrical property sensor. In some implementations, the training data set includes a topological relationship between the plurality of electrical components. In some embodiments, the temperature sensor is an infrared thermometer.

The above-described systems and methods may provide accurate real-time electrical network condition monitoring, predicting impending failure and overheating events, and taking corrective action in time. The systems and methods herein may increase the overall efficiency of the electrical network and the lifetime of the electrical components, and reduce the unplanned downtime of the system, resulting in lower operating costs. The owner of the facility may receive early warning of the overall health of the electrical network and may make informed decisions based on predictions of electrical faults and overheating events.

Additional aspects and advantages of the present invention will become readily apparent to those skilled in this art from the following detailed description, wherein only illustrative embodiments of the invention are shown and described. As will be realized, the present disclosure is capable of other and different embodiments and its several details are capable of modification in various obvious respects, all without departing from the present disclosure. Accordingly, the drawings and description are to be regarded as illustrative in nature, and not as restrictive.

Incorporation by reference

All publications, patents, and patent applications mentioned in this specification are herein incorporated by reference to the same extent as if each individual publication, patent, or patent application was specifically and individually indicated to be incorporated by reference. To the extent publications and patents or patent applications incorporated by reference contradict the disclosure contained in this specification, this specification is intended to supercede and/or take precedence over any such contradictory material.

Drawings

The novel features of the invention are set forth with particularity in the appended claims. A better understanding of the features and advantages of the present invention will be obtained by reference to the following detailed description and drawings (also referred to herein as the "figures") that set forth illustrative embodiments in which the principles of the invention are utilized, in which:

FIG. 1 schematically illustrates an example cooling system having an internal liquid-to-liquid heat exchanger;

FIG. 2 schematically illustrates an example cooling system having an external liquid-to-liquid heat exchanger;

FIG. 3 schematically illustrates an example cooling system having a blower;

FIGS. 4A-4D schematically illustrate example baffle arrangements; FIG. 4A schematically illustrates an example baffle structure having an open bottom; FIG. 4B schematically illustrates an example baffle structure having a perforated bottom; FIG. 4C schematically illustrates an example baffle structure having perforated baffle walls; FIG. 4D schematically illustrates an example baffle structure with a flow redirector;

FIG. 5 schematically illustrates an example container with a rigid liner and an example container with a deformable liner;

FIG. 6 schematically illustrates an example liquid displacement volume;

FIG. 7 schematically illustrates an example cooling system having a cable outlet;

FIG. 8 schematically illustrates an example single-phase cooling system;

FIG. 9 schematically illustrates an example single-phase cooling system using forced convection conditions;

FIG. 10 schematically illustrates an example dual-phase cooling system;

FIG. 11 schematically illustrates an example dual-phase cooling system using forced convection conditions;

FIG. 12 shows a block diagram depicting an example system including a client-server architecture and network configured to perform the various methods described herein;

FIG. 13 shows a flowchart depicting an example process for intelligently cooling a computing system, in accordance with one embodiment;

FIG. 14 shows a flowchart depicting an example process for intelligently cooling a computing system, in accordance with an embodiment;

FIG. 15 illustrates a computer system programmed or otherwise configured to implement the methods provided herein;

FIG. 16 shows an example cooling system without a cover;

FIG. 17 shows an example cooling system including an airtight cover;

FIG. 18 shows an example dielectric fluid covered by an immiscible liquid cap;

FIG. 19 shows an example cooling system including a liquid cover;

FIG. 20 illustrates another example cooling system including a liquid cap;

FIG. 21 shows an example simplified cooling system including a liquid cover;

FIG. 22 shows an example cooling system including a liquid cap and a float;

FIG. 23 shows an exemplary wireless handle for a heat source;

FIGS. 24A-24D show various views of an example wireless handle; FIG. 24A shows a side view of an example wireless handle; FIG. 24B shows a front view of an example wireless handle; FIG. 24C shows a side view (LATERAL VIEW) of an example wireless handle; FIG. 24D shows a perspective view of an example wireless handle;

FIG. 25 shows an example heat source including a cable (e.g., a network cable);

FIG. 26 shows an example heat source integrated with a wireless handle; and

FIG. 27 shows an example system that integrates a cooling system with a renewable energy source for energy storage.

Detailed Description

While various embodiments of the present invention have been shown and described herein, it will be obvious to those skilled in the art that such embodiments are provided by way of example only. Numerous variations, changes, and substitutions will now occur to those skilled in the art without departing from the invention. It should be understood that various alternatives to the embodiments of the invention described herein may be employed.

The term "at least," "greater than," or "greater than or equal to" when used in reference to a first value appearing in a series of two or more values applies to each value in the series. For example, 1, 2, or 3 or more corresponds to 1 or more, 2 or 3 or more.

The term "no greater than," "less than," or "less than or equal to" when appearing before a first value in a series of two or more values applies to each value in the series. For example, less than or equal to 3, 2, or 1 corresponds to less than or equal to 3, less than or equal to 2, or less than or equal to 1.

The term "heat source" as used herein generally refers to any component that generates heat and may benefit from heat dissipation or cooling. The heat source may be an electronic component. The electronic component may be a computer server, a battery, a personal computer, or other electronic component. The heat source may comprise a single electronic component or a plurality of electronic components.

The term "baffle" as used herein generally refers to a structure configured to restrict, regulate, or direct the flow of a fluid (e.g., a liquid or a gas). The baffle may include one or more walls, a floor, a ceiling, or any combination thereof. The baffle may additionally include additional flow diverting or conditioning features such as perforations, flow diverters, flow restricting plugs, or any combination thereof.

The term "dielectric liquid" as used herein generally refers to a dielectric material in a liquid state. The dielectric liquid may prevent or rapidly extinguish the discharge. The dielectric liquid may serve as an electrical insulator and may prevent electrical communication between electronic components.

The term "recirculation loop" as used herein generally refers to a structure or feature that generates movement of a fluid (e.g., liquid or gas) within a system. The recirculation loop may pull fluid from one portion of the system and direct fluid to another portion of the system. The recirculation loop may include piping, pumps, structures for directing fluid flow, or any combination thereof. The recirculation loop may be disposed within a vessel that includes a heat source. Alternatively, or in addition, the recirculation loop may be disposed outside of the vessel including the heat source.

The term "flow diverter" as used herein generally refers to a structure configured to divert or direct the flow of a fluid (e.g., liquid or gas) in a system. The flow redirector may include a conduit, pipe, converging or diverging structure, or other structure that diverts, controls, or directs the flow of a fluid. The flow redirector may be a stand-alone structure or may be coupled to or integrated with auxiliary structures within the system (e.g., baffles, recirculation loops, etc.).

The term "displacement volume" as used herein generally refers to the volume added to a container to displace a volume of fluid. For example, the container may be configured to hold or retain a number of heat sources (e.g., computer servers). The container may include a number of slots, each configured to hold a heat source. In one example, not all of the cells are filled with a heat source, and additional liquid may be used to fill the container. Alternatively, the displacement volume may be used to displace liquid such that no additional liquid is added to fill the container. The displaced volume may increase the efficiency of the system by reducing the amount of liquid used for cooling by avoiding transfer of liquid into empty slots or areas of the vessel or any combination thereof. The displacement volume may be a structure filled with air, liquid, solid material, or any combination thereof.

The term "liquid cap" as used herein generally refers to an immiscible fluid that floats on or is located above another liquid (e.g., a first liquid). The liquid cover may span an opening of a tank of the cooling system. The liquid cap may include a non-volatile fluid. The liquid cap may be configured to prevent or reduce or may prevent or reduce evaporation of the first liquid (e.g., the cooling liquid). The liquid cover may allow cables, wires or other components to pass from the tank of the cooling system to the external environment while preventing evaporation of the first liquid (e.g., the cooling liquid). The liquid cover may include at least one, two, three, four, five, six, seven, eight, nine, ten, or more layers of different non-volatile fluids.

System for cooling a heat source

In one aspect, the present disclosure provides a cooling system including a vessel, a baffle, and a heat exchanger. The container may include a container wall, a heat source, and a first liquid. The heat source may be disposed in the first liquid or submerged in the first liquid. The first liquid may be configured to remove thermal energy from the heat source or may remove thermal energy from the heat source. The baffle may be disposed between the heat source and the vessel wall. The baffle may be configured to direct the flow of the first liquid during transfer of thermal energy away from the heat source or may direct the flow of the first liquid. The heat exchanger may be in thermal communication with the first liquid. The heat exchanger may be completely submerged in the first liquid. The heat exchanger may be configured to flow the second liquid or may flow the second liquid. The second liquid may be configured to remove thermal energy from the first liquid or may remove thermal energy from the first liquid, thereby cooling the heat source.

In another aspect, the present disclosure provides a cooling system including a vessel, a baffle, and a recirculation loop. The container may include a container wall, a heat source, and a first liquid. The heat source may be disposed in the first liquid or submerged in the first liquid. The first liquid may be configured to remove thermal energy from the heat source or may remove thermal energy from the heat source. The baffle may be disposed between the heat source and the vessel wall. The baffle may be configured to direct the flow of the first liquid during transfer of thermal energy away from the heat source or may direct the flow of the first liquid. The recirculation loop may be configured to flow the first liquid or may flow the first liquid. The recirculation loop may include a passage and a pump. The channel may include a converging structure and may be disposed between the baffle and the vessel wall. The pump may be configured to direct or may direct the first liquid through the converging structure of the passage to generate a suction force that pulls the first liquid through the converging structure. The suction force may generate a flow of a first liquid between the baffle and the vessel wall to cool the heat source.

The system may be configured to allow or allow single phase or dual phase heat transfer. The system may be configured to allow or allow natural circulation of the first liquid (e.g., due to natural convection of the first liquid), forced circulation, or a combination of natural and forced circulation to cool the heat source. The system may be used to cool a heat source. The heat source may include heat-generating electronic components (e.g., a central processing unit). Alternatively or additionally, the heat source may be a non-electronic component. The heat source may be disposed within the baffle structure. The heat source may be a single electronic component or may be a plurality of electronic components. The electronic components may include, but are not limited to, a Central Processing Unit (CPU), a Graphics Processing Unit (GPU), a circuit board, a chipset, a memory driver, a battery, or any combination thereof. The electronic components may be used in any application including, but not limited to, data storage, computer processing, electronic money acquisition, or any combination thereof. In one example, the heat source includes a plurality of computer servers. The heat sources may include at least 1,2, 3, 4, 5, 6, 8, 10, 12, 15, 20, 40, 60, 80, 100, or more computer servers. The container may be configured to hold a plurality of rack units (U). In one example, the rack unit may be the height of the rack frame. The rack frame may have dimensions of about 19 inches by 23 inches by 1 inch rack units (U). The rack unit may be 1.75 inches or 4.4 centimeters. In one example, the container may be configured to hold and cool greater than or equal to about 1U, 2U, 3U, 4U, 5U, 6U, 8U, 10U, 12U, 15U, 20U, 30U, 40U, 60U, 80U, 100U, or more. In one example, the container is configured to hold and cool greater than or equal to 96U. The heat source may be submerged or immersed in the first liquid. The heat source may be completely or entirely submerged in the heat source.

FIG. 1 schematically illustrates an example cooling system. The system may include a heat source 101 (e.g., a computer server) disposed in a container 103. The system may also include a baffle 102 disposed in the container 103. The baffle 102 may be disposed between the heat source 101 and the wall of the container 103. The baffle 102 may be configured to support or supportable the heat source 101. For example, the heat source 101 may include a overhang or lip that abuts against the top surface of the baffle 102 to support the heat source 101. The container 103 may include a first liquid 104. The first liquid 104 may be a dielectric liquid. The heat source may include one or more heat generating components 105. The heat generating component 105 may be an electronic component. The baffle 102 may include an open bottom or floor 106. In one example, the baffle 102 includes a floor 106 with perforations. The baffle 102 may also include a static suction pump. The static suction pump may comprise a converging structure 107, the converging structure 107 generating a suction force when the first liquid 104 flows through the converging structure 107. The converging structure 107 may be coupled to a recirculation loop 109. The recirculation loop 109 may include a pump 108. The pump 108 may be a variable speed pump. In some embodiments, the speed of the pump 108 may be controlled by commands sent from a remote platform. The cooling system may also include a heat exchanger 110. The heat exchanger 110 may include heat exchange tubes that flow a second fluid. The container 103 may also include a lid 111 that seals the container 103. The container 103 may include a headspace 112 above the first liquid 104. The headspace 112 may include air.

The system may include a container. The container may be sealed to hold the liquid. Alternatively, the container may not be sealed. The container may comprise metal, plastic, wood, glass, or any other material used to form the container. The container may comprise a single material or a combination of materials. In one example, the container comprises metal. In another example, the container comprises plastic. The container may comprise any shape, for example, a cube, rectangle, or cylinder. The container may have a first dimension (e.g., width), a second dimension (e.g., length), and a third dimension (e.g., height). The first dimension of the container may be greater than or equal to about 5 inches (in), 10in, 15in, 20in, 30in, 40in, 60in, 80in, 100in, 150in, 200in, 250in, 300in, 400in, 500in, or more. The first dimension of the container may be less than or equal to about 500in, 400in, 300in, 250in, 200in, 150in, 100in, 80in, 60in, 40in, 30in, 20in, 15in, 10in, 5in, or less. The second dimension of the container may be greater than or equal to about 5in, 10in, 15in, 20in, 30in, 40in, 60in, 80in, 100in, 150in, 200in, 250in, 300in, 400in, 500in, or more. The second dimension of the container may be less than or equal to about 500in, 400in, 300in, 250in, 200in, 150in, 100in, 80in, 60in, 40in, 30in, 20in, 15in, 10in, 5in, or less. The third dimension of the container may be greater than or equal to about 5 inches (in), 10in, 15in, 20in, 30in, 40in, 60in, 80in, 100in, 150in, 200in, 250in, 300in, 400in, 500in, or more. The third dimension of the container may be less than or equal to about 500in, 400in, 300in, 250in, 200in, 150in, 100in, 80in, 60in, 40in, 30in, 20in, 15in, 10in, 5in, or less. In one example, the container may have a first size greater than or equal to about 10 inches, a second size greater than or equal to about 30 inches, and a third size greater than or equal to about 20 inches. In another example, the container can have a first size greater than or equal to about 25 inches, a second size greater than or equal to about 60 inches, and a third size greater than or equal to about 40 inches. In another example, the container can have a first size greater than or equal to about 50 inches, a second size greater than or equal to about 120 inches, and a third size greater than or equal to about 80 inches.

The vessel may include one or more first liquids (e.g., dielectric liquids), baffle structures, heat exchangers, one or more circulation loops, or any combination thereof. The container may also include a lid. The container may or may not include a lid. The first liquid may be a volatile liquid. For example, the first liquid may be a dielectric liquid that receives thermal energy from a heat source. The thermal energy may evaporate a portion of the first liquid to generate a vapor phase of the first liquid. Evaporation of the first liquid may result in loss of the first liquid from the cooling system. FIG. 16 shows an example of an example cooling system experiencing a first fluid loss due to the lack of a cover member. The cooling system may include a computer server 1601 submerged in a fluid 1604. The computer server may include a heat generating component (e.g., CPU) 1605. The transfer of thermal energy from the heat-generating component 1605 to the first liquid may cause the first liquid to evaporate and escape the cooling system through the air layer 1612 that covers the first liquid. The evaporation and loss of the first liquid may increase the capital cost of the cooling system. The cover may comprise a solid material (e.g., metal, plastic, wood, etc.). In one example, the lid comprises the same material as the container. The cap may provide a hermetic seal (e.g., a hermetic seal) to prevent or reduce evaporation and loss of the first liquid. Fig. 17 shows an example cooling system sealed (e.g., hermetically sealed) with a cover 1711. The cooling system may include a computer server 1701 disposed in a first fluid 1704 (e.g., a dielectric). The cap 1711 can include a solid material (e.g., plastic, metal, etc.) disposed over the first liquid 1704 or over a gaseous headspace 1712 (e.g., air) disposed over the first fluid 1704. The first fluid 1704 may receive thermal energy from the heat source 1705. The thermal energy may cause the first liquid to undergo a phase change to generate vapor 1713 of the first fluid. The steam may contact the cover 1711 and remain within the cooling system. Alternatively, or in addition, the cover may comprise a liquid layer. The lid may be configured to seal or may seal the container. The cover may be temporarily sealed (e.g., via one or more fasteners or latches). Alternatively, the cover may be permanently sealed. For example, the cover may be sealed via adhesive, welding, brazing, or other permanent fasteners. The cap may be configured to contact or may contact the first liquid. Alternatively, or in addition, the container may comprise a gaseous headspace, and the gaseous headspace may contact the lid. The gaseous headspace may comprise an inert gas. The inert gas may be nitrogen, argon, helium or any other inert gas. In one example, the gaseous headspace includes air.

In one example, the cooling system includes a cover. Sealing cooling systems can be challenging due to the presence of electronic cables (e.g., power cables, network cables, etc.) that are connected to the electronic components. The cable may enter the container of the cooling system by hermetically sealing the seal of the container or via a conduit comprising a third liquid configured to provide a seal around the cable, see for example fig. 7. Alternatively or additionally, the cooling system may comprise a liquid cover sealing the container. The liquid cap may provide a seal, or may seal the container, may provide a seal around one or more cables, or both. Fig. 18 shows an example system including a first liquid 1804 (e.g., a cooling liquid or a dielectric liquid), a liquid cap 1811, and a headspace or air 1812 above the liquid cap. For example, the liquid cap 1811 may be sandwiched between the first liquid 1804 and the air 1812. The liquid cap may include a non-volatile or low-volatile fluid. The density of the liquid cap may be less than the density of the first liquid. The first liquid may have a density of greater than or equal to about 800 kilograms per cubic meter (kg/m³)、1000kg/m³、1200kg/m³、1400kg/m³、1600kg/m³、1800kg/m³、2000kg/m³、2200kg/m³ or greater at 25 ℃. The first liquid may have a density of about 800kg/m ³ to 1000kg/m ³、800kg/m³ to 1200kg/m ³、800kg/m³ to 1400kg/m ³、800kg/m³ to 1600kg/m ³、800kg/m³ to 1800kg/m ³、800kg/m³ to 2000kg/m ³、800kg/m³ to 2200kg/m ³、800kg/m³ to 1200kg/m ³、800kg/m³ to 1400kg/m ³、800kg/m³ to 1600kg/m ³、800kg/m³ to 1800kg/m ³、800kg/m³ to 2000kg/m ³、800kg/m³ to 2200kg/m ³、800kg/m³ to 1600kg/m ³、800kg/m³ to 1800kg/m ³、800kg/m³ to 2000kg/m ³、800kg/m³ to 1800kg/m ³、800kg/m³ to 2000kg/m ³、800kg/m³ to 2200kg/m ³、800kg/m³ or 2000kg/m ³、800kg/m³ to 2200kg/m ³、800kg/m³ at 25 ℃. In one example, the first liquid may have a density of about 1000kg/m ³ to 2000kg/m ³ at 25 ℃. The density of the liquid cap may be less than or equal to 1200kg/m ³、1000kg/m³、800kg/m³、600kg/m³ or less at 25 ℃. the density of the liquid cap may be 600kg/m ³ to 800kg/m ³、600kg/m³ to 1000kg/m ³、600kg/m³ to 1200kg/m ³、800kg/m³ to 1000kg/m ³、800kg/m³ to 1200kg/m ³ or 1000kg/m ³ to 1200kg/m ³ at 25 ℃. The first liquid may have a density at least about 1.05, 1.1, 1.15, 1.2, 1.25, 1.3, 1.35, 1.4, 1.5, 1.6, 1.7, 1.8, 1.9, 2.0 or more times greater than the liquid cap. In one example, the density of the first liquid is greater than the density of the liquid cap. The liquid cap may include a liquid that is immiscible with the first liquid. The liquid cap may include oil, water, a dielectric fluid, a single-phase cooling fluid, or any combination thereof. The oil may comprise mineral oil, silicone oil, corn oil or any other oil that is not miscible with the first liquid.

The liquid layer may be disposed on top of the first liquid such that the liquid cover floats on the first liquid as a discrete layer. The liquid layer may have a density less than the first liquid density such that the liquid cap forms a layer on a top surface of the first liquid (e.g., dielectric fluid). The layer of the liquid cover disposed on the top surface of the first liquid may be a continuous layer. The liquid cap may form or provide a physical barrier to prevent or reduce the release of vapor from the first liquid. The liquid layer (e.g., liquid cover) may have a thickness greater than or equal to about 0.75 millimeters (mm), 1mm, 1.5mm, 2mm, 3mm, 4mm, 6mm, 8mm, 10mm, 15mm, or more. The thickness of the liquid cover may be about 0.75mm to 1mm, 0.75mm to 1.5mm, 0.75mm to 2mm, 0.75mm to 3mm, 0.75mm to 4mm, 0.75mm to 6mm, 0.75mm to 8mm, 0.75mm to 10mm, 0.75mm to 12mm, 1mm to 1.5mm, 1mm to 2mm, 1mm to 3mm, 1mm to 4mm, 1mm to 6mm, 1mm to 8mm, 1mm to 10mm, 1mm to 12mm, 1.5mm to 2mm, 1.5mm to 3mm, 1.5mm to 4mm 1.5mm to 6mm, 1.5mm to 8mm, 1.5mm to 10mm, 1.5mm to 12mm, 2mm to 3mm, 2mm to 4mm, 2mm to 6mm, 2mm to 8mm, 2mm to 10mm, 2mm to 12mm, 3mm to 4mm, 3mm to 6mm, 3mm to 8mm, 3mm to 10mm, 3mm to 12mm, 4mm to 6mm, 4mm to 8mm, 4mm to 10mm, 4mm to 12mm, 6mm to 8mm, 6mm to 10mm, 6mm to 12mm, 8mm to 10mm, 8mm to 12mm or 10 to 12mm.

The liquid cap may comprise one or more different liquids. One or more different liquids may be mixed to produce a single liquid composition. Alternatively, or in addition, the liquid cover may comprise one or more different liquids that phase separate to form one or more discrete layers. The liquid cap may include at least one, two, three, four, five, six, seven, eight, nine, ten or more different liquids that form a gradient of liquids having different densities. The liquid cap may include different liquids that generate a gradient of liquids having different densities from a first liquid (e.g., dielectric liquid) to a gaseous headspace (e.g., air). For example, the liquid cap may include a first density adjacent to a first liquid (e.g., a dielectric liquid) and a second density adjacent to a gaseous headspace (e.g., air). The first density may be greater than the second density. The first density may be at least about 1.05, 1.1, 1.15, 1.2, 1.25, 1.3, 1.35, 1.4, 1.5, 1.6, 1.7, 1.8, 1.9, 2.0, or more times greater than the second density.

Fig. 19 shows an example cooling system including a liquid cover 1911. The cooling system may include an electronic component 1901 that includes a heat generating component 1905. The electronic component may be a computer server, a special purpose computer, a computing unit for artificial intelligence or autopilot, or any other electronic component. The computer server may be submerged or submerged in the first liquid 1904. Thermal energy is transferred from the heat source 1905 to the first liquid 1904 to generate a lower density first fluid that moves toward the liquid cover 1911. The liquid cap 1911 may prevent the first fluid from being released from the cooling system into the gaseous headspace 1912. fig. 20 shows another example cooling system that includes a liquid cover (e.g., a cover that includes a liquid layer). In one example, the cooling system may include a computer server or other electronic component 2001, which includes a heat source 2005. The cooling system may also include a first liquid 2004 configured to transfer thermal energy from the heat source 2005 to the first liquid 2004 and away from the heat source 2005. The transfer of thermal energy to the first liquid 2004 may cause the first liquid 2004 to undergo a phase change and evaporate (e.g., boil) to generate the bubbles 2013. The bubbles may rise through the first liquid 2004 to contact the liquid cap 2011. The liquid cap 2011 may prevent bubbles 2013 from exiting the cooling system and contacting the gaseous headspace 2012. The gas bubbles 2013 may contact the liquid cap 2011 and condense or recondense at an interface between the first fluid 2004 and the liquid cap 2011 in the layer of the liquid cap 2011, at an interface between the layer of the liquid cap 2011 and the gaseous headspace 2012, or any combination thereof. The condensed first liquid 2004 may fall back into the tank of the cooling system. In this way, the liquid cap 2011 may be actively cooled by condensation of the first liquid 2004. The cover comprising the liquid layer may simplify the design of the cooling system. For example, the cooling system may include a first liquid having a high volatility (e.g., some dielectric fluid such as the NOVEC ^TM fluid of 3M ^TM). Sealing such cooling systems can be difficult due to the presence of cables and other electronic components disposed outside the cooling system. The use of a cap that includes a liquid (e.g., a liquid cap) may allow the use of a volatile first liquid without the need for a hermetically sealed solid cap. The liquid cover may also allow cables and other electronic devices to protrude or extend through the liquid cover to the external environment of the cooling system's tank without losing volatile first liquid. For example, as shown in fig. 21, the cooling system may include a first liquid 2104 having a non-volatile liquid cap 2111. The liquid cap 2111 may include a liquid that is immiscible with and less dense than the first liquid 2104 such that it floats on top of the first liquid 2104. Upon contact with the heat source, the first liquid 2104 may undergo a phase change to generate bubbles 2113 of the first liquid. The bubbles 2113 of the first liquid 2104 may move upward and possibly through the liquid cover 2111. Upon contacting the liquid cap 2111, at least a portion of the bubbles 2113 may condense and move downward 2115 back to the first liquid 2104.

The cover of the cooling system may comprise a solid material (e.g., may be a metal, plastic, wood, or other solid material cover), a liquid (e.g., a non-volatile liquid cover), or a combination thereof. In one example, the cover of the cooling system may include a liquid material and a solid material. The liquid portion of the cap may be as described elsewhere herein. The solid portion of the cap may include a solid buoyant object or perforated float (e.g., such as cork or other buoyant perforated material). Alternatively, or in addition, the solid portion of the cover may comprise a plurality of solid floats. For example, the solid portion of the cap may include at least one, two, three, four, five, six, seven, eight, nine, ten, or more solid floats. The solid float may comprise metal, plastic, wood, or any combination thereof. The use of solid floats may allow for the use of a liquid cover that is smaller in volume than a cooling system without the solid floats. The liquid cap may create a continuous layer of layers across the first liquid, and the float may float on top of the liquid cap. Alternatively, or in addition, the solid float may float on the first liquid, and the liquid cover may fill any gap between the solid float and the side wall of the tank, as shown in fig. 22. The cooling system may include a computer server or other electronic component 2201. The computer system may include a heat generating component 2205. The cooling system may include a first liquid 2204 configured to remove thermal energy from the heat-generating component 2205. Thermal energy transfer from the heat generating component 2205 to the first liquid 2204 may generate air bubbles 2213 as the first liquid 2204 evaporates. The cooling system may also include a liquid cap 2211 and a solid float 2214 configured to reduce the volume of the liquid cap 2211. A solid float 2214 may be disposed between the first liquid 2204 and the gaseous headspace 2212. The density of the float may be greater than, equal to, or less than the density of the liquid cap. In one example, the density of the solid float is less than the density of the liquid cap. In another example, the density of the solid float is approximately equal to the density of the liquid cap. In another example, the density of the solid float is greater than the density of the liquid cap. in another example, the density of the solid float is between the density of the liquid cap and the density of the first liquid. The density of the solid float may be about 800kg/m ³ to 1000kg/m ³、800kg/m³ to 1200kg/m ³、800kg/m³ to 1400kg/m ³、1000kg/m³ to 1200kg/m ³、1000kg/m³ to 1400kg/m ³ or 1200kg/m ³ to 1400kg/m ³ at 25 ℃. The density ratio of the solid float may be at least about 1.05, 1.1, 1.15, 1.2, 1.25, 1.3, 1.4, 1.5 or more times the density of the liquid cap. The density of the solid float may be less than 0.95, 0.9, 0.85, 0.8, 0.75 or less than the density of the first liquid.

The system may comprise a heat exchanger or a plurality of heat exchangers. The system may include at least 1, 2,3, 4, 6, 8, 10, or more heat exchangers. In one example, the system includes a single heat exchanger that spans the width of the vessel. In another example, the system includes at least two heat exchangers, each heat exchanger disposed between the baffle wall and the vessel wall. The heat exchanger may collect thermal energy from the first liquid, transfer the thermal energy to the second fluid, and discharge the thermal energy to an external environment of the system. The heat exchanger may be disposed at or near the top of the vessel. The heat exchanger may be at least partially submerged in the first liquid. In one example, the heat exchanger is completely submerged in the first liquid. The heat exchanger may be arranged between the vessel wall and the baffle (e.g. outside the baffle). In one example, the heat exchanger is disposed above the suction pump or converging structure of the suction pump. Alternatively, or in addition, the heat exchanger may not be provided in the vessel. For example, the heat exchanger may be provided in an additional vessel separate from the vessel comprising the heat source. Fig. 2 schematically illustrates an example heat exchanger configuration. In one example, the heat exchanger is disposed inside the vessel 201. In another example, the heat exchanger 203 is disposed in the additional vessel 202. The additional containers may be in fluid communication with the container via one or more pipes or tubes (tube). The additional containers may be coupled to the container by at least 2, 4, 6, 8, 10, 12, or more pipes or tubes. In one example, the additional container is coupled to the container via two tubes, one tube directing the first liquid from the container to the additional container and the other tube directing the first liquid from the additional container back to the container. The additional vessel may comprise a heat exchanger. The heat exchanger may be completely submerged within the first liquid in the additional vessel. During use, the first liquid may flow between the container and the additional container.

The heat exchanger may comprise a plurality of tubes. The heat exchanger tubes may be the same shape or different shapes. The heat exchanger tube may be any shape including, but not limited to, circular, square, rectangular, or any combination thereof. The plurality of tubes may be configured to flow the second liquid or may flow the second liquid. The heat exchanger may comprise at least 1,2,4, 6, 8, 10, 12, 15, 20 or more tubes. The outside of the tube may be in contact with the first liquid. The tube may be configured to circulate a secondary fluid. For example, the outer surface of the tube may be in contact with a first liquid and thermal energy may be transferred from the first liquid through the tube wall into a second liquid for removal from the system. The heat exchanger may separate the first liquid from the second liquid such that the first liquid and the second liquid do not contact each other.

The system may further comprise a blower. The blower may be configured to cool or may cool a portion of the first liquid. Fig. 3 schematically illustrates an example blower configuration. The system may include a heat exchanger 301 without a blower, a blower 302 without a heat exchanger, or both a blower and a heat exchanger. The system may include one or more circuits configured to remove and circulate a portion of the first liquid. Blower 303 may be configured to pass air through or may pass air through a loop of tubing to remove heat from the first liquid. In some embodiments, blower 303 may be controlled by a remote platform. The first liquid may be warmer at the top of the container than at the bottom of the container. Blower 303 may be positioned toward or near the top of the container where the fluid temperature is higher.

The first liquid may be a coolant. The first liquid may be in direct contact with the heat source. In one example, the first liquid is a dielectric liquid. The dielectric liquid may have high dielectric strength (e.g., be an effective dielectric), high thermal stability, be inert to components of the system, nonflammable, low toxicity, and have good heat transfer properties. In another example, the first liquid is a dielectric liquid that directly contacts the heat source. The second liquid may be a coolant. In one example, the second liquid is water. The first liquid and the second liquid may be the same liquid or may be different liquids. In one example, the first liquid and the second liquid are the same liquid. In another example, the first liquid and the second liquid are different liquids. In one example, the first liquid is a dielectric liquid and the second liquid is water. The first liquid, the second liquid, or both may comprise a dielectric liquid. The dielectric liquid may be mineral oil, hexane, heptane, castor oil, silicone oil, polychlorinated biphenyl, benzene, an engineering fluid such as methoxy-nonafluorobutane or ethoxy-nonafluorobutane, or any combination thereof. The first liquid or the second liquid may comprise a coolant. The coolant may be water, deionized water, glycol, ethylene glycol, nanofluids (e.g., suspensions of nanoparticles in a fluid), refrigerants, or any combination thereof. The first liquid or the second liquid may be part of a refrigeration cycle. The refrigeration cycle may include a compressor, a condenser, an evaporator, an expansion chamber, a flow metering device, or any combination thereof. The refrigeration cycle may be configured to allow or allow the first liquid or the second liquid to reach a lower temperature and enhance cooling. For example, the second liquid and heat exchanger may be part of a refrigeration cycle to allow the second liquid to reach a temperature below ambient temperature (e.g., below about 20 ℃).

The system may further comprise a baffle. Fig. 4A-4D illustrate example baffle arrangements. The heat source may be disposed within the baffle structure. For example, the baffle structure may include one or more walls and the heat source may be disposed within or between the one or more walls. The baffle may be configured to direct the first liquid to flow through the heat source and toward the heat exchanger. The baffle may support a heat source. The heat source may include a lip or overhang. The lip or overhang may be configured to be located on top of the wall of the deflector structure. The baffle structure may have an open bottom (e.g., may not include a floor or other structural feature), as shown in fig. 4A. The open bottom 401 may allow the first liquid to flow freely between the baffle walls. Alternatively, or in addition, the deflector structure may comprise a bottom plate. The bottom plate may be a solid plate or may be a perforated plate, as shown in fig. 4B. In one example, the baffle structure does not include a floor. In another example, the bottom structure includes a perforated plate 402. The perforations may be configured to allow or may allow the first liquid to flow through the bottom plate. The bottom panel may have greater than or equal to 5, 10, 15, 20, 30, 40, 50, 60, 80, 100, 150, 200, 300, 500, or more perforations. The number of perforations may depend on the size of the base plate. For example, a larger base plate may have a larger number of perforations. The base plate may include perforations of uniform size, or the size of the perforations may vary across the base plate. The perforations may be circular, oval, square, triangular, slit or any other shape. The perforations may have dimensions greater than or equal to about 0.5 millimeters (mm), 1mm, 2mm, 3mm, 4mm, 5mm, 6mm, 8mm, 10mm, 15mm, 20mm, 30mm, 40mm, 50mm, or more. The perforations may have dimensions of less than or equal to about 50mm, 40mm, 30mm, 20mm, 15mm, 10mm, 8mm, 6mm, 5mm, 4mm, 3mm, 2mm, 1mm, 0.5mm, or less. The size of the perforations may be about 0.5mm to 1mm, 0.5mm to 2mm, 0.5mm to 3mm, 0.5mm to 4mm, 0.5mm to 5mm, 0.5mm to 6mm, 0.5mm to 8mm, 0.5mm to 10mm, 0.5mm to 15mm, 0.5mm to 20mm, 0.5mm to 30mm, 0.5mm to 40mm, 0.5mm to 50mm, 1mm to 2mm, 1mm to 3mm, 1mm to 4mm, 1mm to 5mm, 1mm to 6mm, 1mm to 8mm, 1mm to 10mm, 1mm to 15mm, 1mm to 20mm, 1mm to 30mm, 1mm to 40mm, 1mm to 50mm, 2mm to 3mm, 2mm to 4mm, 2mm to 5mm, 2mm to 6mm, 2mm to 8mm, 2mm to 10mm, 2mm to 15mm, 2mm to 20mm, 2mm to 30mm, 2mm to 40mm, 2mm to 50mm, 3mm to 4mm, 3mm to 5mm, 3mm to 6mm, 3mm to 8mm, 3mm to 10mm, 3mm to 15mm, 3mm to 20mm, 3mm to 30mm, 3mm to 40mm, 3mm to 50mm, 4mm to 5mm, 4mm to 6mm, 4mm to 8mm, 4mm to 10mm, 4mm to 15mm, 4mm to 20mm, 4mm to 30mm, 4mm to 40mm, 4mm to 50mm, 5mm to 6mm, 5mm to 8mm, 5mm to 10mm, 5mm to 15mm, 5mm to 20mm, 5mm to 30mm, 5mm to 40mm, 5mm to 50mm, 6mm to 8mm, 6mm to 10mm, 6mm to 15mm, 6mm to 20mm, and, 6mm to 30mm, 6mm to 40mm, 6mm to 50mm, 8mm to 10mm, 8mm to 15mm, 8mm to 20mm, 8mm to 30mm, 8mm to 40mm, 8mm to 50mm, 10mm to 15mm, 10mm to 20mm, 10mm to 30mm, 10mm to 40mm, 10mm to 50mm, 15mm to 20mm, 15mm to 30mm, 15mm to 40mm, 15mm to 50mm, 20mm to 30mm, 20mm to 40mm, 20mm to 50mm, 30mm to 40mm, 30mm to 50mm or 40mm to 50mm. the perforations in the base plate may be openings. Alternatively, or in addition, some or all of the perforations may include a choke plug. The choke plug may partially or completely block the perforations. For selected heat source (e.g., server) configurations (e.g., location or size of heat generating components), the location of the choke plug may be used to optimize the flow distribution of the first liquid.

The baffle may include a baffle wall as shown in fig. 4C. The baffle wall may include perforations 403 configured to allow or not allow the first liquid to flow through the baffle wall. Perforations may be provided across the entire size of the baffle wall. Alternatively, the baffle wall may comprise perforations provided in an upper portion of the baffle wall. For example, the perforations may be located at the top 75%, 60%, 50%, 40%, 30%, 25%, 20%, 15%, 10% or 5% of the baffle wall. The baffle wall may have greater than or equal to 5, 10, 15, 20, 30, 40, 50, 60, 80, 100, 150, 200, 300, 500, or more perforations. The number of perforations may depend on the size of the baffle wall. For example, a larger baffle wall may have a larger number of perforations. The baffle wall may include perforations of uniform size, or the size of the perforations may vary across the baffle wall. The perforations may be circular, oval, square, triangular, slit or any other shape. The perforations may have dimensions greater than or equal to about 0.5 millimeters (mm), 1mm, 2mm, 3mm, 4mm, 5mm, 6mm, 8mm, 10mm, 15mm, 20mm, 30mm, 40mm, 50mm, or more. The perforations may have dimensions of less than or equal to about 50mm, 40mm, 30mm, 20mm, 15mm, 10mm, 8mm, 6mm, 5mm, 4mm, 3mm, 2mm, 1mm, 0.5mm, or less. The size of the perforations may be about 0.5mm to 1mm, 0.5mm to 2mm, 0.5mm to 3mm, 0.5mm to 4mm, 0.5mm to 5mm, 0.5mm to 6mm, 0.5mm to 8mm, 0.5mm to 10mm, 0.5mm to 15mm, 0.5mm to 20mm, 0.5mm to 30mm, 0.5mm to 40mm, 0.5mm to 50mm, 1mm to 2mm, 1mm to 3mm, 1mm to 4mm, 1mm to 5mm, 1mm to 6mm, 1mm to 8mm, 1mm to 10mm, 1mm to 15mm, 1mm to 20mm, 1mm to 30mm, 1mm to 40mm, 1mm to 50mm, 2mm to 3mm, 2mm to 4mm, 2mm to 5mm, 2mm to 6mm, 2mm to 8mm, 2mm to 10mm, 2mm to 15mm, 2mm to 20mm, 2mm to 30mm, 2mm to 40mm, 2mm to 50mm, 3mm to 4mm, 3mm to 5mm, 3mm to 6mm, 3mm to 8mm, 3mm to 10mm, 3mm to 15mm, 3mm to 20mm, 3mm to 30mm, 3mm to 40mm, 3mm to 50mm, 4mm to 5mm, 4mm to 6mm, 4mm to 8mm, 4mm to 10mm, 4mm to 15mm, 4mm to 20mm, 4mm to 30mm, 4mm to 40mm, 4mm to 50mm, 5mm to 6mm, 5mm to 8mm, 5mm to 10mm, 5mm to 15mm, 5mm to 20mm, 5mm to 30mm, 5mm to 40mm, 5mm to 50mm, 6mm to 8mm, 6mm to 10mm, 6mm to 15mm, 6mm to 20mm, and, 6mm to 30mm, 6mm to 40mm, 6mm to 50mm, 8mm to 10mm, 8mm to 15mm, 8mm to 20mm, 8mm to 30mm, 8mm to 40mm, 8mm to 50mm, 10mm to 15mm, 10mm to 20mm, 10mm to 30mm, 10mm to 40mm, 10mm to 50mm, 15mm to 20mm, 15mm to 30mm, 15mm to 40mm, 15mm to 50mm, 20mm to 30mm, 20mm to 40mm, 20mm to 50mm, 30mm to 40mm, 30mm to 50mm or 40mm to 50mm. The perforations in the guide wall may be openings. Alternatively, or in addition, some or all of the perforations may include a choke plug. The choke plug may partially or completely block the perforations. For selected heat source (e.g., server) configurations (e.g., location or size of heat generating components), the location of the restrictor plugs may be used to optimize the flow distribution of the first liquid.

The baffle may include a flow diverter as described in fig. 4D. The flow redirector may be configured to direct or may direct the flow of the first liquid around the heat source. The flow redirector may include channels, tubes, pipes, or other structures that route the flow of the first liquid in a selected direction or flow pattern. The flow redirector may be a three-dimensional (3D) printed part. The 3D printed part may be adapted or designed for the particular heat source or electronic component to be cooled. The system may include at least 1,2, 3, 4, 5, 6, 8, 10, or more flow diverters. The flow diverters may be the same or different. For example, the flow redirector may vary in height, width, flow channel size, or any other dimension. The flow redirector may be located anywhere within the container or an additional container. In one example, one or more flow diverters are disposed between the baffle walls. In another example, the flow redirector may be coupled to a floor of the deflector.

The system may further comprise one or more static suction pumps. The static suction pump may be located anywhere within the container. The container may comprise at least 1, 2,3, 4, 6, 8, 10 or more static suction pumps. In one example, a static suction pump is disposed between the baffle wall and the vessel wall. In another example, the vessel includes two static suction pumps, each disposed between a different baffle wall and vessel wall (e.g., on opposite sides of the vessel). In another example, the vessel comprises four static suction pumps, each static suction pump being disposed between the baffle wall and the vessel wall on each side of the vessel. The static suction pump may comprise a converging configuration. The converging structure may be a fixed structure (e.g., excluding moving parts) coupled to the baffle wall. Alternatively, or in addition, the converging structure may be coupled to the vessel wall. The converging structure may be coupled to the outer, bottom portion of the baffle wall. The converging structure may comprise a nozzle-like structure. The converging structure may include one or more fluid flow paths. The one or more fluid flow paths may be circular, elliptical or elongate. The converging structure may extend the entire length of the baffle (e.g., in a direction parallel to the length or width of the vessel). Alternatively, or in addition, the converging structure may extend across a portion of the baffle. The converging structures may have points of the narrowest or smallest dimension. The narrowest or smallest dimension of the converging structures may be less than or equal to about 50 centimeters (cm), 40cm, 30cm, 20cm, 10cm, 8cm, 6cm, 5cm, 4cm, 3cm, 2cm, 1cm, or less. The narrowest or smallest dimension of the converging structures may be greater than or equal to about 1cm, 2cm, 3cm, 4cm, 5cm, 6cm, 8cm, 10cm, 20cm, 30cm, 40cm, 50cm, or more. The narrowest or smallest dimension of the converging structures may be about 1cm to 2cm, 1cm to 3cm, 1cm to 4cm, 1cm to 5cm, 1cm to 6cm, 1cm to 8cm, 1cm to 10cm, 1cm to 20cm, 1cm to 30cm, 1cm to 40cm, 1cm to 50cm, 2cm to 3cm, 2cm to 4cm, 2cm to 5cm, 2cm to 6cm, 2cm to 8cm, 2cm to 10cm, 2cm to 20cm, 2cm to 30cm, 2cm to 40cm, 2cm to 50cm, 3cm to 4cm, 3cm to 5cm, 3cm to 6cm, 3cm to 8cm, 3cm to 10cm, 3cm to 20cm, 3cm to 30cm, 3cm to 40cm, 3cm to 50cm, 4cm to 5cm, 4cm to 6cm, 4cm to 8cm, 4cm to 10cm, 4cm to 20cm, 4cm to 30cm, 4cm to 40cm, 4cm to 50cm, 5cm to 6cm, 5cm to 8cm, 5cm to 10cm, 5cm to 20cm, 5cm to 30cm, 5cm to 40cm, 5cm to 50cm, 6cm to 8cm, 6cm to 10cm, 6cm to 20cm, 6cm to 30cm,6cm to 40cm, 6cm to 50cm, 8cm to 10cm, 8cm to 20cm, 8cm to 30cm, 8cm to 40cm, 8cm to 50cm, 10cm to 20cm, 10cm to 30cm, 10cm to 40cm, 10cm to 50cm, 20cm to 30cm, 20cm to 40cm, 20cm to 50cm, 30cm to 40cm, 30cm to 50cm, or 40cm to 50cm. The flow of the first liquid through the converging structure may generate a suction force that pulls the liquid from the top of the container and generates a forced fluid flow.

The system may further include one or more recirculation loops. The system may include at least 1,2,3,4, 6, 8, 10, or more recirculation loops. In one example, the system includes a recirculation loop. In another example, the system includes two recirculation loops. The recirculation loop may be configured to provide or may provide forced convection of the first liquid. The recirculation loop may include piping, a variable speed recirculation pump, or both piping and recirculation pumps. The recirculation loop may be disposed inside the vessel, outside the vessel, or both inside and outside the vessel. In one example, a portion of the recirculation loop (e.g., a conduit) may be disposed inside the vessel and another portion of the recirculation loop (e.g., a conduit or pump) may be disposed outside the vessel.

The vessel may further comprise one or more relief valves or pressure regulators. The relief valve or pressure regulator may be configured to maintain or maintain the pressure in the vessel below a threshold or within a given pressure range. The relief valve or pressure regulator may be provided in the lid, in the wall of the container, on the bottom of the container, or any combination thereof. In one example, the system includes one or more safety valves. In another example, the system includes one or more pressure regulators. In another example, the system includes both a relief valve and a pressure regulator. The relief valve may be coupled or fluidly connected to the secondary expansion tank. Alternatively, the safety valve is opened to the atmosphere outside the tank. The safety valve or pressure relief valve may be configured to prevent or prevent over pressurization of the container. The relief valve may maintain the pressure within the container (e.g., maintain the headspace pressure or fluid pressure) below a threshold. The threshold may be less than or equal to 5 bar, 4 bar, 3 bar, 2 bar, 1 bar, 0.9 bar, 0.8 bar, 0.7 bar, 0.6 bar, 0.5 bar, or less. The pressure regulator may maintain the pressure within a given pressure range. The pressure regulator may maintain about 0.5 bar to about 0.6 bar, 0.5 bar to about 0.7 bar, 0.5 bar to about 0.8 bar, 0.5 bar to about 0.9 bar, 0.5 bar to about 1 bar, 0.5 bar to about 2 bar, 0.5 bar to about 3 bar, 0.5 bar to about 4 bar, 0.5 bar to about 5 bar, 0.6 bar to about 0.7 bar, 0.6 bar to about 0.8 bar, 0.6 bar to about 0.9 bar, 0.6 bar to about 1 bar, 0.6 bar to about 2 bar, 0.6 bar to about 3 bar, 0.6 bar to about 4 bar, 0.6 bar to about 5 bar, 0.7 bar to about 0.8 bar, 0.7 bar to about 0.9 bar, 0.7 bar to about 1 bar, 0.7 bar to about 2 bar, 0.7 bar to about 3 bar, 0.7 bar to about 4 bar, 0.7 bar to about 5 bar, 0.8 to about 8, 0.8 to about 3 bar to about 8, 0.8 bar to about 1 bar, 0.8 to about 3 bar to about 2 bar, 0.5 bar to about 3 bar, 0.8 bar to about 1 bar, 0.8 bar to about 2 bar, 0.5 bar to about 3 bar, 0.5 bar to about 1 bar, 2 bar to about 3 bar, 0.8 bar to about 3 bar or about 1 to about 3 bar. In one example, the pressure regulator maintains the pressure at about 0.9 bar to 1.1 bar.

As shown in fig. 5, the container may further include a liner. The pad may be a rigid pad 501 or a deformable pad 503. In one example, the pad is a rigid pad 501. In another example, the pad is a deformable pad 503. The liner may be removable or may be integral with the container 502. In some embodiments, the removal or integration of the liner may be controlled by commands from a remote platform. In one example, the liner is removable. In another example, the liner is integrated with the container. The liner may be made of any material compatible with the first liquid. The liner may be a first liquid compatible rubber or plastic material. The liner may be configured to seal or sealable the container. The liner may further be configured to avoid spillage of the liquid. The use of a gasket may provide several advantages, for example, the gasket may allow for the use of a non-sealed container (e.g., a metal container without a liquid-tight weld or connection).

The system may further include a displacement volume, as shown in fig. 6. The container may be configured to hold or may hold a plurality of electronic components (e.g., servers). Each electronic component may displace a volume of the first liquid. In one example, the container may include one or more empty slots, and the empty slots may include additional first liquid volumes. Alternatively, the empty slots may be filled with displacement volumes. The shape of the displacement volume may be substantially the same as a heat source (e.g., a computer server) such that the heat source may be exchanged with the displacement volume. The displacement volume may be formed of a metal or rigid plastic that is compatible with the first liquid. The displacement volume may comprise an internal material, such as a liquid or solid portion. The internal material may add weight to the displaced volume and counteract any buoyancy. The displacement volume may be configured to reduce the volume of the first liquid or may reduce the volume of the first liquid as compared to a system without the displacement volume. The displacement volume may be further configured to avoid or reduce diversion of the first liquid flow to the void region. Diversion of flow to void areas (e.g., areas without heat sources) may reduce cooling efficiency. Reducing the volume of the first liquid may reduce the cost of the system, increase the cooling efficiency, or both.

The container may further comprise one or more cable outlets, as shown in fig. 7. The cable outlet may be configured to allow or allow the cable 703 connected to the heat source to exit the container while maintaining a seal of the container. In some embodiments, the cable 703 may be controlled/given permission to connect to a heat source by commands from a remote platform. The cable may include an electrical connection, an ethernet connection, or any other cable. The cable outlet may be configured to allow multiple cables to span the interior and exterior of the container. The cable outlet may be disposed in the headspace 702 of the container such that the first liquid 701 does not contact the cable outlet and does not overflow or flow out of the container. The cable outlet may be configured to allow a portion of the cable or cables 703 to be disposed inside the container while another portion of the cable or cables 703 is disposed outside the container. In some embodiments, the selection of a cable or portion of a cable 703 to be disposed outside the container may be controlled by commands from a remote platform. The cable outlet may be configured as a sealed or sealable container. The cable outlet may comprise a conduit. The cable may be disposed in the conduit. The conduit may further include a third liquid 704 configured to seal or unseal the cable outlet. The conduit may include a shape configured to prevent fluid from escaping the container or conduit. For example, the conduit may include a row or u-shape to prevent fluid disposed at the bottom of the row or u-shape from exiting the conduit.

The system further includes one or more processors. One or more processors may be coupled to the heat exchanger. The one or more processors may be configured to regulate or adjust the flow of the second liquid through the heat exchanger. One or more processors may be coupled to the recirculation loop. The one or more processors may be configured to regulate or adjust the flow of the first liquid through the recirculation loop.

The cooling system may be used to cool one or more electronic components including or using an Application Specific Integrated Circuit (ASIC). The electronic components may generate thermal energy that may be dissipated via cooling fans that utilize a large amount of energy. Alternatively, electronic components may be cooled using the immersion cooling systems and methods described herein. The use of immersion cooling for electronic components may reduce energy consumption compared to cooling using cooling fans. The electronic component may or may not include a cooling fan. The fan may be removed prior to cooling the electronic components using the immersion cooling system. In one example, the electronic components may be positioned in a vertical configuration in an immersion cooling system as described herein, e.g., with the cooling fan positioned facing upward (e.g., toward a cover of the cooling system). Alternatively, or in addition, the electronic components may be placed horizontally such that the fan position is disposed facing one or more side walls of the cooling system case. In a vertical configuration, placing the electronic components in the cooling system and removing the electronic components from the cooling system can be challenging. As shown in fig. 23, the wireless handle may be mounted at the location of one or more fans of the electronic component. Wireless handle 2316 may be configured for direct replacement by a cooling fan (e.g., using the same screws, screw holes, locations, or any combination thereof as the cooling fan). Alternatively, or in addition, the wireless handle may be mounted at a location different from the location of the cooling fan. The wireless handle 2316 may be configured to balance the weight of the electronic component and the electronic component power source so that the electronic component may be lifted directly off the cooling system. Fig. 24A-24D illustrate various views of the wireless handle 2316 of fig. 23. Fig. 24A shows a side view of an example wireless handle. Fig. 24B shows a front view of an example wireless handle. Fig. 24C shows a side view of an example wireless handle. Fig. 24D shows a perspective view of an example wireless handle.

The electronic components may be connected to the network by cables (e.g., network cables such as ethernet cables). Fig. 25 shows example electronic components including a fan 2517 attached to a network via an ethernet cable 2518. It can be challenging to pass cables (e.g., ethernet cables, power cables, etc.) from the cabinet of the cooling system to the external environment. For example, in a dual-phase immersion cooling system, hermetically sealing the cooling system can be challenging, and if not hermetically sealed, the cooling liquid can be lost due to evaporation. To avoid passing the cable from the electronic component to the external environment, the wireless handle may include a wireless transmitter connected to a controller of the electronic component, as shown in fig. 26. The wireless transmitter 2619 may be located anywhere on the wireless handle. The wireless transmitter 2619 may be connected to a controller of the electronic component via a cable (e.g., ethernet cable) 2620. The use of the wireless transmitter 2619 may reduce the number of cables or eliminate cables passing from the cooling system's tank to the external environment to allow for sealing of the cooling system.

The cooling systems described herein may be used with or integrated with renewable energy systems. The use of renewable energy sources can be challenging due to the cost and difficulty of energy storage. Electrical energy batteries may be used for energy storage, but may be limited in storage capacity and efficiency. Additionally, selling additional power back to the electrical network may not be efficient or possible at all energy generation sites. Alternatively, or in addition, a cooling system may be used as the energy storage system. For example, immersion cooling electronic components may be used as energy storage systems. The use of air to cool electronic components as an energy storage system may not be possible or may be challenging because of the energy used to run the fans, excessive or objectionable noise, and/or cooling of the electronic components. Alternatively, immersion cooling electronic components may have the advantage of using less energy and being quieter than air-cooled counterparts. FIG. 27 shows an example system that integrates renewable energy generation with an immersion cooling system for energy storage. Energy from renewable resources sites or home renewable energy sources (1) (e.g., from wind farms, solar farms, home solar systems, etc.) may be used to power electronic components (2). Powering the electronic components with unused power may generate additional revenue from the additional energy (3). The additional energy (3) can be additionally converted into thermal energy by powering the electronic component (2). The fluid used for cooling the electronic component (2) may be heated by the electronic component. The cooling system may include an inlet and an outlet to circulate a cooling fluid within the cooling system. The cooling fluid exiting the cooling system may be heated. The heated cooling fluid may be used for secondary heating (4) (e.g., heating or warming a building, warming personal water, warming a swimming pool, or any other warming application). As used herein, secondary heating may include using heat generated from a cooling system to supplement another heating system or as a separate heating system. Integrating renewable energy sources with immersion cooling electronic components may increase sustainability and accessibility based on blockchain technology. In turn, increasing the sustainability and reachability based on blockchain techniques may allow or increase network decentralization.

The systems described elsewhere herein may be provided as a kit. The kit may include a container configured to cool the heat source. The container may be configured to hold or otherwise be in contact with a heat source. The kit may further comprise a first liquid, a second liquid, a liquid cap, a float, or any combination thereof. The liquid component may be dispensed into a specific volume for use in the system. Alternatively, or in addition, a liquid component exceeding the volume used by the system may be provided. The liquid components may be dispensed and provided separately such that each liquid component is provided separately. Alternatively, or in addition, the liquid components of the system may be dispensed and provided in a single container (e.g., the liquid components may be pre-mixed). Alternatively, or in addition, selected liquid components (e.g., the first liquid and the liquid cap) may be provided together in a single container, and other liquid components (e.g., the second liquid) may be provided in separate containers. The liquid components provided together may be a milky mixed fluid configured to phase separate upon addition to the system. Alternatively, the liquid components provided together may be a multi-layer, phase separated composition.

Method for cooling a heat source

In another aspect, the present disclosure provides a method for cooling a heat source. The method may include providing a cooling system including a vessel, a baffle, a heat exchanger, or any combination thereof. The container may include a container wall, a first liquid, and a heat source submerged in the first liquid. The baffle may be disposed between the heat source and the vessel wall. The heat exchanger may be in thermal communication with and completely submerged in the first liquid. The first liquid may be in thermal communication with a heat source. The method may further include transferring thermal energy from the heat source to the first liquid. The baffle may be used to direct the flow of the first liquid away from the heat source during transfer of thermal energy. The method may further comprise flowing the second liquid using a heat exchanger. The second liquid may remove thermal energy from the first liquid to cool the heat source.

In another aspect, the present disclosure provides a method for cooling a heat source. The method may include providing a cooling system including a vessel, a baffle, a recirculation loop, or any combination thereof. The container may include a container wall, a first liquid, and a heat source submerged in the first liquid. The first liquid may be in thermal communication with a heat source. The baffle may be disposed between the heat source and the vessel wall. The recirculation loop may include a passage and a pump. The channel may comprise a converging structure disposed between the baffle and the vessel wall. The pump may direct the flow of the first liquid through the converging structure. The method may further include transferring thermal energy from the heat source to the first liquid. During transfer, the baffle may be used to direct the flow of the first liquid away from the heat source. The method may further include directing the first liquid through the converging structure of the passage using a pump to generate a flow of the first liquid between the baffle and the vessel wall to cool the heat source.

The methods of the present disclosure may be used in conjunction with any of the systems described elsewhere herein.

The method may include immersing the heat source in the first liquid. The heat source may be completely submerged or immersed in the first liquid. Alternatively, the heat source may be partially submerged in the first liquid. The system may operate in a single phase mode as shown in fig. 8. During single phase operation, the first liquid may not undergo a phase change from liquid to gas. During operation, a heat source (e.g., a heat generating component such as a computer processing unit) 802 may generate and release thermal energy. Thermal energy may be dissipated by the cooling system via thermal energy transfer from the heat source 802 to the first liquid 801. Thermal energy transfer from heat source 802 to first liquid 801 may increase the local temperature of first liquid 801, decrease the density of first liquid 801, and cause the warmer portion of first liquid 801 to rise to the top of the container due to buoyancy. The warm first liquid may contact the heat exchanger and transfer thermal energy from the first liquid to the heat exchanger. Transferring thermal energy to the heat exchanger may decrease the temperature of the first liquid proximate the heat exchanger, increase the density of the first liquid, and cause the cooled first liquid to flow downward and toward the bottom of the vessel. The circulation of the heating and cooling of the first liquid may generate a circulation loop generated by natural convection of the first liquid.

During heating and cooling of the first liquid, the baffle may direct the rising fluid to the heat exchanger. The heat exchanger may comprise a plurality of tubes and the method may comprise flowing the second fluid through the plurality of tubes. The heat exchanger may be coupled to a pump. The method may further use a pump to direct the flow of the second liquid through the heat exchanger. In one example, the heat exchanger may be disposed between the baffle and the vessel wall. Alternatively, or in addition, the heat exchanger may be disposed at any location near the top of the vessel. Alternatively, or in addition, the method may further comprise flowing the first liquid through an additional vessel comprising a heat exchanger. The additional vessel may be in fluid communication with the vessel via a tube or pipe. The system may include one or more additional pumps that direct the flow of heated first liquid from the upper region of the vessel to the additional vessel and direct the flow of cooled first liquid from the additional vessel back to the vessel. The location, size, and shape of the heat exchanger may be determined and depend on the shape and heat generating capacity of the heat source (e.g., server). The heat exchanger may be completely submerged in the first liquid. Completely submerging the heat exchanger within the first liquid may increase the efficiency of transferring thermal energy from the first liquid to the second liquid.

The method may further comprise guiding the first liquid around the container using a baffle. The baffle may direct the first liquid to and across the heat source. The baffle may further direct the rising heated first liquid to the heat exchanger. Additionally, the baffle may direct the first liquid that has been cooled by the heat exchanger along the wall of the vessel, through the converging structure of the static suction pump, and toward the bottom of the vessel. The baffle may include a floor. The bottom plate may include perforations. The perforations may allow flow of the first liquid through the base plate and toward the heat source. The baffle may further comprise a wall. The wall may comprise perforations allowing the flow of the first liquid through the baffle wall in a lateral movement. The baffle may further comprise a flow diverter. The flow diverter may be used to direct the flow of the first liquid around the heat source. Additionally, baffles may be used to support the heat source. The heat source may include a lip or overhang that hooks or is provided on the upper edge of the baffle, allowing the heat source to hang from the baffle.

One or more recirculation loops may be used to facilitate or improve the flow of the first liquid, as shown in fig. 9. The recirculation loop may include a variable speed pump to provide an adjustable flow rate. The variable speed pump may allow tuning the flow rate of the first liquid across the heat source and toward the heat exchanger. Tuning the flow rate of the first liquid may allow for control or modulation of the temperature of the heat source. The recirculation loop may include a recirculation loop inlet 904. The recirculation loop inlet 904 may pull the first liquid 901 from outside the converging configuration of the static suction pump. The recirculation loop may further comprise a recirculation loop outlet 903, the recirculation loop outlet 903 directing the first liquid 901 into a converging configuration of the static suction pump. In some embodiments, the recirculation loop outlet 903 may direct the first liquid 901 based on commands from a remote platform. Pushing the fluid into the converging structure of the static suction pump may create a suction effect that pulls the first liquid from the top of the container toward the bottom of the container and to the heat source 902. The magnitude of the suction force may be increased by increasing the flow rate of the first liquid to the converging structure. As the heat source generates heat, the temperature of the heat source may increase. To prevent the temperature rise, or to reduce the magnitude of the temperature rise, the flow rate of the first liquid may be increased by increasing the flow rate of the recirculation pump. Increasing the flow rate of the first liquid may improve or increase the rate of heat transfer between the heat source and the first liquid. Further, increasing the flow rate of the first liquid may increase the rate of heat transfer from the first liquid to the heat exchanger or heat exchanger tubes. The method may further comprise cooling or controlling the temperature of the first liquid or at least a portion of the first liquid using a blower. The dynamic relationship between the amount of thermal energy generated by the heat source and the flow rate of the first liquid may generate a stable feedback mechanism to allow control and stabilization of the heat source over a given temperature range. Maintaining the temperature of the heat source within a given temperature range may maximize the efficiency and reliability of the heat generating component.

Alternatively, the system may operate in a biphase mode. Similar control mechanisms may be used for both monophasic and biphasic modes of operation. For example, as shown in fig. 10, a heat source 1001 may include a heat generating component 1005 submerged or immersed in a first liquid 1004 within a container 1003, and upon contact with the heat source 1001, the first liquid 1004 may undergo a phase change from liquid to vapor. The phase change may generate vapor bubbles 1013 on the surface of the heat source. The generation of vapor bubbles 1013 may allow for efficient heat dissipation of the heat generated by heat source 1001. The generated vapor bubble 1013 may be directed from the heat source 1001 to the heat exchanger 1010 through the baffle 1002. The system may further include a recirculation loop 1009, the recirculation loop 1009 including a variable speed recirculation pump 1008. In some embodiments, the speed of variable speed recirculation pump 1008 may be controlled by commands from a remote platform. The recirculation loop 1009 may direct the first liquid cooled and condensed by the heat exchanger 1010 to a transition structure of the static suction pump 1007. The system may further comprise a lid 1011 for sealing the container 1003. The cover 1011 may be in contact with the first liquid 1004. Alternatively, the container 1003 may include air or inert gas 1012, and the air or inert gas 1012 may be in contact with the cover 1011.

The dual phase cooling mode may use sub-cooled nucleate boiling or saturated boiling. In the saturated boiling mode, the first liquid may contact the heat source and undergo a phase change to the vapor phase. The generated vapor bubbles may rise in the vessel and merge with an upper vapor plenum where the vapor contacts a cold wall (e.g., a cold wall of a condenser unit) and recondenses. In systems employing saturated boiling conditions, the temperature of the liquid may be the liquid boiling temperature. Alternatively, the dual-phase cooling mode may use sub-cooled nucleate boiling to cool the heat source. The sub-cooled fluid may be a fluid having a temperature below the boiling temperature of the first liquid. The surface of the heat source may exceed the boiling temperature of the first liquid such that, when the first liquid is in contact with the heat source, a vapor bubble may be generated on the surface of the heat source. The vapor bubbles may recondense within the first liquid rather than in the headspace above the first liquid. Conversely, as the vapor bubble is generated and recondensed, the temperature of the first liquid increases. The dual phase cooling using sub-cooled nucleate boiling may be further aided by a recirculation loop, as shown in fig. 11. Vapor bubbles 1103 may be directed from heat source 1102 to the heat exchanger by a baffle. The heat exchanger may cool the first liquid 1101 in a region proximate the heat exchanger. The cooled first liquid may allow vapor bubbles to recondense in the first liquid rather than in the headspace 1105. The cooled first liquid may contact or flow near the heat exchanger and down towards the converging structure of the static suction pump. The recirculation loop may include a recirculation loop inlet 1104, and the recirculation loop inlet 1104 may pull the first liquid 1101 from outside of the converging configuration of the static suction pump. The recirculation loop may further include a recirculation loop outlet 1106, the recirculation loop outlet 1106 directing the first liquid 1101 into a converging configuration of the static suction pump. In some embodiments, recirculation loop outlet 1106 may direct first liquid 1101 based on commands from a remote platform. Pushing the fluid into the converging structure of the static suction pump may create a suction effect that pulls the first liquid from the top of the container toward the bottom of the container and toward the heat source 1102. The method may further comprise cooling or controlling the temperature of the first liquid or at least a portion of the first liquid using a blower.

Supercooled nucleate boiling and the use of the described flow control method may have various advantages over saturated two-phase immersion cooling systems. For example, the use of sub-cooled nucleate boiling may allow the system to reach a higher heat flux limit, thereby increasing the cooling efficiency of the system. Increasing the cooling efficiency of the system may allow for the use of more powerful heat generating components (e.g., central processing units). The efficiency improvement may be further enhanced by modifying the surface of the heat source, for example by etching or coating heat generating components with micro-or nanostructures to increase bubble nucleation. The structure may comprise a microcolumn or any other 3D microfeature. The 3D structure may be created by ion etching, laser etching, sandblasting, or any other process to create a structure on the surface of the electronic component. Alternatively or additionally, the electronic component may include a coating that enhances bubble nucleation on the surface of the electronic component. The 3D structure or coating may increase the areal density of bubble nucleation and surface wettability with the first liquid. Increasing bubble nucleation in turn may increase the heat dissipation efficiency of the subcooled first liquid. Additionally, the use of sub-cooled nucleate boiling may allow for the regulation of the temperature of the heat source. For example, the flow rate of the first liquid may be adjusted to control the temperature of the first liquid. Controlling the temperature of the first liquid may in turn control the temperature of the heat source. Controlling the temperature of the heat source may provide various benefits, such as increasing the performance and lifetime of the heat source by maintaining the temperature of the heat source within a given range. Additionally, the adjustability of the flow rate of the first liquid may allow tuning the temperature of the heat source. The use of sub-cooled nucleate boiling may further reduce or mitigate the loss of the first liquid during system start-up and operation as compared to systems using saturated boiling.

The flow rate of the first liquid may be controlled or adjusted such that the temperature of the first liquid is less than or equal to 100 ℃, 90 ℃, 80 ℃, 70 ℃, 60 ℃, 50 ℃, 40 ℃, 30 ℃, 25 ℃,20 ℃,15 ℃,10 ℃,8 ℃,6 ℃,4 ℃,2 ℃,0 ℃, -2 ℃, -4 ℃, -6 ℃, -8 ℃, -10 ℃, -15 ℃, -20 ℃ or lower. The flow rate of the first liquid may be controlled or adjusted to maintain the temperature of the first liquid at about-20 ℃ to-15 ℃, -20 ℃ to-10 ℃, -20 ℃ to-5 ℃, -20 ℃ to 0 ℃, -20 ℃ to 5 ℃, -20 ℃ to 10 ℃, -20 ℃ to 20 ℃, -20 ℃ to 30 ℃, -20 ℃ to 40 ℃, -20 ℃ to 50 ℃, -20 ℃ to 60 ℃, -20 ℃ to 70 ℃, -20 ℃ to 80 ℃, -20 ℃ to 90 ℃, -20 ℃ to 100 ℃, -15 ℃ to-10 ℃, -15 ℃ to-5 ℃, -15 ℃ to 0 ℃, -15 ℃ to 5 ℃, -15 ℃ to 10 ℃, -, -15 to 20 ℃, -15 to 30 ℃, -15 to 40 ℃, -15 to 50 ℃, -15 to 60 ℃, -15 to 70 ℃, -15 to 80 ℃, -15 to 90 ℃, -15 to 100 ℃, -10 to 5 ℃, -10 to 0 ℃, -10 to 5 ℃, -10 to 10 ℃, -10 to 20 ℃, -10 to 30 ℃, -10 to 40 ℃, -10 to 50 ℃, -10 to 60 ℃, -10 to 70 ℃, -10 to 80 ℃, -10 to 90 ℃, -10 to 100 ℃, -5 to 0 ℃, and-5 to 0 ℃, -10 to 100 ℃, -5 to 0 ℃, -5 to 100 ℃, -100 to 100 ℃, -5 to 100 ℃, -, -5 ℃ to5 ℃, -5 ℃ to 10 ℃, -5 ℃ to 20 ℃, -5 ℃ to 30 ℃, -5 ℃ to 40 ℃, -5 ℃ to 50 ℃, -5 ℃ to 60 ℃, -5 ℃ to 70 ℃, -5 ℃ to 80 ℃, -5 ℃ to 90 ℃, -5 ℃ to 100 ℃, 0 ℃ to5 ℃, 0 ℃ to 10 ℃, 0 ℃ to 20 ℃, 0 ℃ to 30 ℃, 0 ℃ to 40 ℃, 0 ℃ to 50 ℃, 0 ℃ to 60 ℃, 0 ℃ to 70 ℃, 0 ℃ to 80 ℃, 0 ℃ to 90 ℃, 0 ℃ to 100 ℃,5 ℃ to 10 ℃,5 ℃ to 20 ℃,5 ℃ to 30 ℃, 10 ℃ to 50 ℃, 10 ℃ to 60 DEG, 10 ℃ to 70 ℃,10 ℃ to 80 ℃,10 ℃ to 90 ℃,10 ℃ to 100 ℃,20 ℃ to 30 ℃,20 ℃ to 40 ℃,20 ℃ to 50 ℃,20 ℃ to 60 ℃,20 ℃ to 70 ℃,20 ℃ to 80 ℃,20 ℃ to 90 ℃,20 ℃ to 100 ℃, 30 ℃ to 40 ℃, 30 ℃ to 50 ℃, 30 ℃ to 60 ℃, 30 ℃ to 70 ℃, 30 ℃ to 80 ℃, 30 ℃ to 90 ℃, 30 ℃ to 100 ℃, 40 ℃ to 50 ℃, 40 ℃ to 60 ℃, 40 ℃ to 70 ℃, 40 ℃ to 80 ℃, 40 ℃ to 90 ℃, 40 ℃ to 100 ℃, 40 ℃ to 40 ℃, and, 50 ℃ to 60 ℃, 50 ℃ to 70 ℃, 50 ℃ to 80 ℃, 50 ℃ to 90 ℃, 50 ℃ to 100 ℃, 60 ℃ to 70 ℃, 60 ℃ to 80 ℃, 60 ℃ to 90 ℃, 60 ℃ to 100 ℃, 70 ℃ to 80 ℃, 70 ℃ to 90 ℃, 70 ℃ to 100 ℃, 80 ℃ to 90 ℃, 80 ℃ to 100 ℃, or 90 ℃ to 100 ℃. the flow rate of the first liquid may be controlled or adjusted such that the temperature of the heat source is less than or equal to about 100 ℃, 90 ℃, 80 ℃,70 ℃, 60 ℃,50 ℃, 40 ℃, 30 ℃, 25 ℃,20 ℃, 15 ℃,10 ℃,8 ℃, 6 ℃,4 ℃,2 ℃,0 ℃, -2 ℃, -4 ℃, -6 ℃, -8 ℃, -10 ℃, -15 ℃, -20 ℃ or less. The flow rate of the first liquid may be controlled or adjusted to maintain the temperature of the heat source at about 0 ℃ to 5 ℃,0 ℃ to 10 ℃,0 ℃ to 20 ℃,0 ℃ to 30 ℃,0 ℃ to 40 ℃,0 ℃ to 50 ℃,0 ℃ to 60 ℃,0 ℃ to 70 ℃,0 ℃ to 80 ℃,0 ℃ to 90 ℃,0 ℃ to 100 ℃,5 ℃ to 10 ℃,5 ℃ to 20 ℃,5 ℃ to 30 ℃,5 ℃ to 40 ℃,5 ℃ to 50 ℃,5 ℃ to 60 ℃,5 ℃ to 70 ℃,5 ℃ to 80 ℃,5 ℃ to 90 ℃,5 ℃ to 100 ℃, 10 ℃ to 20 ℃, 10 ℃ to 30 ℃, 10 ℃ to 40 ℃, 10 ℃ to 50 DEG, 10 ℃ to 60 ℃,10 ℃ to 70 ℃,10 ℃ to 80 ℃,10 ℃ to 90 ℃,10 ℃ to 100 ℃, 20 ℃ to 30 ℃, 20 ℃ to 40 ℃, 20 ℃ to 50 ℃, 20 ℃ to 60 ℃, 20 ℃ to 70 ℃, 20 ℃ to 80 ℃, 20 ℃ to 90 ℃, 20 ℃ to 100 ℃, 30 ℃ to 40 ℃, 30 ℃ to 50 ℃, 30 ℃ to 60 ℃, 30 ℃ to 70 ℃, 30 ℃ to 80 ℃, 30 ℃ to 90 ℃, 30 ℃ to 100 ℃, 40 ℃ to 50 ℃, 40 ℃ to 60 ℃, 40 ℃ to 70 ℃, 40 ℃ to 80 ℃, 40 ℃ to 90 ℃, 40 ℃ to 100 ℃, and, 40 ℃ to 100 ℃,50 ℃ to 60 ℃,50 ℃ to 70 ℃,50 ℃ to 80 ℃,50 ℃ to 90 ℃,50 ℃ to 100 ℃, 60 ℃ to 70 ℃, 60 ℃ to 80 ℃, 60 ℃ to 90 ℃, 60 ℃ to 100 ℃, 70 ℃ to 80 ℃, 70 ℃ to 90 ℃, 70 ℃ to 100 ℃, 80 ℃ to 90 ℃, 80 ℃ to 100 ℃, or 90 ℃ to 100 ℃. The flow rate of the first liquid may be controlled or adjusted to maintain a temperature difference between the first liquid and the heat source greater than or equal to about 1 ℃,2 ℃,4 ℃, 6 ℃, 8 ℃, 10 ℃, 12 ℃, 15 ℃, 20 ℃, 25 ℃,30 ℃, 40 ℃, 50 ℃ or more. The flow rate of the first liquid may be controlled or adjusted to maintain a temperature difference between the first liquid and the heat source of less than or equal to about 50 ℃, 40 ℃,30 ℃, 25 ℃, 20 ℃, 15 ℃, 12 ℃, 10 ℃, 8 ℃, 6 ℃,4 ℃,2 ℃,1 ℃ or less. In one example, the method may further include using a refrigeration cycle to maintain the fluid temperature below ambient temperature (e.g., below about 20 ℃).

The container may include a lid. The cover may comprise a solid material (e.g., metal, plastic, wood, etc.). Alternatively, or in addition, the cap may comprise a liquid, such as a non-volatile liquid. The cover may be as described elsewhere herein. The method may further include inserting a heat source into the container, adding a first liquid, and applying a cap to the container. The lid may seal the container during cooling. The cover may be sealed by one or more fasteners. Alternatively, or in addition, the lid may be sealed by welding or otherwise adhering the lid to the container. The container may further comprise a liner. The pad may be a rigid pad or a deformable pad. The vessel may further comprise one or more relief valves or pressure regulators. The relief valve or pressure regulator may be configured to maintain or maintain the pressure in the vessel below a threshold or within a given pressure range. The relief valve or pressure regulator may be provided in the cap, in the wall of the container, on the bottom of the container, or any combination thereof. In one example, the system includes one or more safety valves. In another example, the system includes one or more pressure regulators. In another example, the system includes both a relief valve and a pressure regulator. The relief valve may be coupled or fluidly connected to the secondary expansion tank. Alternatively, the safety valve is opened to the atmosphere outside the tank. The safety valve or pressure relief valve may be configured to prevent or prevent over pressurization of the container. The relief valve may maintain the pressure within the container (e.g., maintain the headspace pressure or fluid pressure) below a threshold. The threshold may be less than or equal to 5 bar, 4 bar, 3 bar, 2 bar, 1 bar, 0.9 bar, 0.8 bar, 0.7 bar, 0.6 bar, 0.5 bar, or less. The pressure regulator may maintain the pressure within a given pressure range. The pressure regulator may maintain about 0.5 bar to about 0.6 bar, 0.5 bar to about 0.7 bar, 0.5 bar to about 0.8 bar, 0.5 bar to about 0.9 bar, 0.5 bar to about 1 bar, 0.5 bar to about 2 bar, 0.5 bar to about 3 bar, 0.5 bar to about 4 bar, 0.5 bar to about 5 bar, 0.6 bar to about 0.7 bar, 0.6 bar to about 0.8 bar, 0.6 bar to about 0.9 bar, 0.6 bar to about 1 bar, 0.6 bar to about 2 bar, 0.6 bar to about 3 bar, 0.6 bar to about 4 bar, 0.6 bar to about 5 bar, 0.7 bar to about 0.8 bar, 0.7 bar to about 0.9 bar, 0.7 bar to about 1 bar, 0.7 bar to about 2 bar, 0.7 to about 3 bar, 0.7 bar to about 4, 0.7 bar to about 5, 0.8 to about 8, 0.5 bar to about 1 bar, 0.3 to about 3 bar, 0.5 bar to about 1 bar, 0.8 bar to about 2 bar, 0.6 bar to about 3 bar, 0.6 bar to about 1 bar, 0.7 bar to about 2 bar, 0.8 bar to about 2 bar, 0.7 bar to about 3 bar or about 1 to about 3 bar. In one example, the pressure regulator maintains the pressure at about 0.9 bar to 1.1 bar.

The method may further comprise controlling one or more aspects of the method or system using one or more processors. One or more processors may be coupled to the heat exchanger pump. One or more processors may be used to direct the pump to control the flow of the second liquid through the heat exchanger. One or more processors may be coupled to the recirculation loop. One or more processors may be coupled to the pump of the recirculation loop. The one or more processors may direct the pump to control the flow of the first liquid through the converging structure of the static suction pump.

Fig. 12 shows a block diagram depicting an example system 1200, the example system 1200 comprising a client-server architecture and network configured to perform the various methods described herein. A platform in the form of a server platform 1220 (e.g., hardware and software that may interoperate via a series of network connections, protocols, application-layer interfaces, etc.) provides server-side functionality to one or more of the sensors 1202 and 1206 via a communications network 1214 (e.g., the internet or other type of Wide Area Network (WAN), such as a wireless network or a private network with additional security appropriate for the data being transferred.

For example, fig. 12 illustrates a sensor 1202, the sensor 1202 including or being operably coupled to a communication module 1204 to allow the sensor 1202 to transmit data to a server platform 1220 and/or to receive commands from the server platform 1220. In some implementations, the sensor 1202 may be an electrical property sensor that may be configured to detect one or more particular parameters, such as voltage, current, resistance, reactance, charge, partial discharge, power, magnetic flux, magnetic field, and the like. Various types of sensors may be used to measure electrical characteristics of different components and their associated components in an electrical network, such as electricity meters, electrometers, hall effect sensors, and the like. Components associated with the electrical network may include, but are not limited to, a Central Processing Unit (CPU), a Graphics Processing Unit (GPU), a circuit board, a chipset, a memory driver, a battery, or any combination thereof. The electronic components may be used in any application including, but not limited to, data storage, computer processing, electronic money acquisition, or any combination thereof. In one example, the heat source includes a plurality of computer servers.

In some implementations, the sensor 1202 may be a liquid level sensor, which may be configured to monitor and measure a liquid level. For example, the level sensor 1202 may monitor and measure the level of the first liquid 104, the second liquid held by the container 103, as shown in fig. 1. Various types of sensors may be utilized to measure the liquid level, such as point level sensors, continuous level sensors, and the like. The point level sensor may provide a measurement indicating whether the liquid 104 has reached a particular point in the container 103. The continuous level sensor may provide a measurement indicative of an accurate level measurement. In some embodiments, level sensor 1202 may include invasive and non-contact level sensors. Invasive sensors are in direct contact with the liquid being measured, and non-contact sensors may use sound or microwaves to provide measurements.

In some implementations, the sensor 1202 may be a pressure sensor that may be configured to monitor and measure the pressure of gases and liquids. For example, as described elsewhere herein, the vessel 103 includes one or more relief valves or pressure regulators. To regulate the pressure of the vessel 103, the pressure sensor 1202 may be utilized to provide a measurement of the current pressure in the vessel 103, and various types of sensors may be utilized to measure pressure, such as absolute pressure sensors, gauge pressure sensors, vacuum pressure sensors, differential pressure sensors, seal pressure sensors, and the like.

In some embodiments, sensor 1202 may be a flow rate sensor that may be configured to monitor and measure the flow rate of a liquid. For example, as described elsewhere herein, the recirculation loop may include a variable speed pump (e.g., pump 108 as shown in fig. 1) to provide an adjustable flow rate. In order to provide accurate control of the flow rate by the variable speed pump, a flow rate sensor 1202 may be utilized to provide a measurement of the current flow rate of the liquid. The flow rate may be measured using various types of sensors, such as a piston/rotary piston, elliptical gear, helical gear, nutating disk, turbine, volleyball, single nozzle, paddle wheel, multi-nozzle, venturi, laminar, variable area, optical, open channel flow, acoustic doppler velocimetry, thermal mass, MAF sensor, vortex, magnetic, etc.

Further, for example, fig. 12 illustrates another sensor 1206 that includes or is operatively coupled to a communication module 1208 to allow the sensor 1206 to transmit data to the server platform 1220 and/or to receive commands from the server platform 1220. The sensor 1206 may be a temperature sensor that may be configured to measure a temperature of the electrical component and/or a temperature at a location proximate to the electrical component. In some embodiments, the temperature sensor may measure a temperature gradient of the electrical component, and/or a temperature gradient at a location adjacent to the electrical component. Various types of temperature sensors may be utilized to measure temperatures in an electrical network, such as thermometers, infrared thermometers, thermocouples, glass mercury thermometers, and the like. By continuously monitoring the temperature in the electrical network, the system 1200 provides real-time thermal data and more accurate measurements of current or impending electrical conditions may be made to facilitate downstream operations. It should be appreciated that these examples of sensors 1202, 1206 are presented as examples only; other types of sensors may be utilized.

The term "real-time" as used herein generally refers to the occurrence of a first event or action at the same time or substantially the same time as the occurrence of a second event or action. The real-time action or event may be performed in a response time that is less than one or more of the following relative to at least another event or action: ten seconds, five seconds, one second, one tenth of a second, one hundredth of a second, one millisecond, or less. The real-time actions may be performed by one or more computer processors. As used herein, "real-time" generally refers to a response time that does not exhibit substantial delay to a user when a graphical element is pushed to the user via a user interface. In some implementations, the response time may be associated with data processing, such as by a computer processor, and may be less than 2 seconds, 1 second, one tenth of a second, one hundredth of a second, one millisecond, or less. Real-time may also refer to the occurrence of a first event relative to the occurrence of a second event at or substantially at the same time.

In at least some examples, the server platform 1220 can be one or more computing devices or systems, storage devices, and other components that include or facilitate the operation of the various execution modules depicted in fig. 12. These modules may include, for example, a data aggregation/normalization module 1224, an Artificial Intelligence (AI) engine 1226, and a data store 1250. Each of these modules is described in more detail below. Server platform 1220 may facilitate remote processing of received sensor data, which may improve the overall efficiency of system 1200.

In some implementations, the server platform 1220 may facilitate parallel data processing using a multi-core processor. The received sensor data may also be processed using a cloud computing mechanism.

The data aggregation/normalization module 1224 may aggregate sensor data received from the sensors 1202 and 1206. Additionally, or alternatively, the data aggregation/normalization module 1224 may normalize sensor data received from the sensors 1202 and 1206. The data aggregation/normalization module 1224 is deployed when the received sensor data is in a custom format and requires normalization. In these cases, the data aggregation/normalization module 1224 may be configured to convert the received sensor data from a source format to a target format. For example, the fingerprint of temperature sensor O indicates that the data format is in celsius and swiss date format, so the temperature data of sensor O is 27 ℃. The fingerprint of the other temperature sensor P indicates that the data formats are fahrenheit and united states date formats, so the temperature data of sensor P is 80.6°f (mm.dd.yyyy). The data aggregation/normalization module 1224 may obtain fingerprints of two temperature sensors and convert them to an ontology having a celsius data format and a country date format (i.e., YYYY-MM-DD). By converting the two sets of data into both celsius and country date formats, the data aggregation/normalization module 1224 may generate a data set that can provide better visibility and operational insight, as well as provide a unified data set for downstream operations. In some implementations, the data aggregation/normalization module 1224 optionally includes a Machine Learning (ML) model to normalize the sensor data. The ML model is trained from historical training examples, showing the formatting mechanism from the source data format to the target data format. By way of example, example ML models include conventional or deep neural networks, support vector machines, bayesian models, linear regression, logistic regression, K-means clustering, and the like.

The data aggregation/normalization module 1224 may store sensor data to the data storage 1250. Examples of data storage 1250 include, but are not limited to, one or more data storage components such as magnetic disk drives, optical disk drives, solid State Disk (SSD) drives, and other forms of non-volatile and volatile memory components. Data store 1250 may deploy a relational database mechanism. Additionally or alternatively, data store 1250 can deploy a combination of relational database and time-series database mechanisms. The time series database may reflect data changes in sensor data over time. The relational database can have the advantages of strong secondary index support, complex predicates, rich query languages and the like. However, when data changes rapidly with time, the amount of data may increase greatly. Thus, having a separate time series database working with the relational database may improve scalability.

In another embodiment, data storage 1250 utilizes a graphical database to store sensor data. A graph database is a database that uses graph structures for semantic queries, with nodes (note that "nodes" and "vertices" are used interchangeably in this application), edges, and attributes to represent and store data. The data storage component of the present application provides a data structure in which each vertex (node) in the graph also has time series storage to capture data changes over time. The time series store may be a separate database or may be defined as attributes of vertices (nodes). For example, temperature data extracted from temperature sensor O at 8 pm at 1 month 27 of 2022 may be stored in a graphical database. The node in the figure may represent sensor O, with a value of 27 ℃. The 8 th night time stamp of 2022, 1, 27 is stored as an attribute of the node in the graph of the graph database. The time series store may be associated with a node, and it may reflect data changes over time and provide the user with an operational insight. Relationships between different nodes are stored by edges. For example, the relationship between the measurement of the temperature sensor O associated with the panel a and the measurement of the voltmeter of the same panel a may be defined by the edges therebetween. As described above, because the sensor data is stored with the time series stored in the database, the resulting data contains a dynamic representation of the monitored electrical network rather than a static view. In subsequent operations, the evolving and evolving vertices (nodes) in the graph may provide both the origin and history associated with them, and thus enable an Artificial Intelligence (AI) engine 1226 to simulate the monitored electrical network and provide predictions of electrical fault conditions.

An Artificial Intelligence (AI) engine 1226 can be communicatively coupled to the data store 1250. In some implementations, multiple AI engines (e.g., customer AI engines, advisor AI engines, product AI engines) can run in parallel, with these engines running and reacting to actions of other engines at any given time and/or over time, which actions can be based on detected interrelationships dynamics and other factors that result in more efficient operational value. In some implementations, one or more AI engines can be deployed using cloud computing resources, which can be physical or virtual computing resources (e.g., virtual machines). In some implementations, the cloud computing resource may be a storage resource (e.g., a Storage Area Network (SAN), network File System (NFS), or Amazon s3. Rtm), a network resource (e.g., a firewall, load balancer, or proxy server), an internal dedicated resource, an external dedicated resource, a secure public resource, an infrastructure as a service (IaaS) resource, a platform as a service (PaaS) resource, or a software as a service (SaaS) resource. Thus, in some implementations, the provided cloud computing services may include IaaS, paaS, or SaaS provided by private or commercial (e.g., public) cloud service providers.

The AI engine 1226 may query the data store 1250 for historical sensor data and train a Machine Learning (ML) model (or other predictive model). The ML model may generate an output indicative of the actions required to maintain the desired temperature of the electrical components and systems.

In some implementations, the ML model can query the data store 1250 for historical blueprint data or sensor data to generate digital twinning of the computing system and associated cooling system. Digital twinning is a virtual representation of a real-time digital counterpart that is a physical object or process. For example, digital twinning for a computing system and associated cooling system may be a virtual representation of the topological relationship between each electrical component, heat source (e.g., computer server), baffle (e.g., baffle 102 in fig. 1), container (e.g., container 103 in fig. 1), liquid (e.g., first liquid 104 in fig. 1), heat generating component (e.g., heat generating component 105 in fig. 1), open bottom or floor (e.g., open bottom or floor 106 in fig. 1), converging structure (e.g., converging structure 107 in fig. 1), pump (e.g., pump 108 in fig. 1), recirculation loop (e.g., recirculation loop 109 in fig. 1), heat exchanger (e.g., heat exchanger 110 in fig. 1), cover (e.g., cover 111 in fig. 1), and so forth. Digital twinning may provide insight as to what components may provide what amount of cooling effect to what other components at a given flow rate, etc., over a given period of time. Digital twinning may also predict the temperature associated with a certain electrical component if the liquid is directed to flow at a given flow rate.

The ML model may provide predictions indicative of future temperature changes and may be used to actively make measurements. For example, as described elsewhere herein, electrical components (e.g., central Processing Units (CPUs), graphics Processing Units (GPUs), circuit boards, chipsets, memory drivers, batteries, etc.) may be associated with temperature limits, i.e., the electrical components are designed to operate at specified temperature ranges having upper and sometimes lower limits. When operating outside of the temperature range, it may result in reduced life or failure of the electrical components. The ML model may predict future temperature changes and may change the user when the temperature falls outside the temperature limits of the electrical component.

In some implementations, the ML model may predict potential overheat events from real-time thermal signals received from one or more sensors 1206. By continuously measuring and monitoring the temperature associated with the electrical component, the system 1200 provides a set of data utilized by the AI engine 1226 to predict the probability and time remaining of taking action to facilitate corrective action. In this case, the ML model may be pre-trained by a training example of the marking, such as a set of thermal measurements and the results of the marking (e.g., overheat/not overheat). The ML model may generate an output indicating whether there is/will be an overheating event associated with the electrical component. The output is a binary output. In some implementations, the ML model can generate an output that includes probability distributions over multiple levels and the urgency of the overheating event. The output is a multi-class output. For example, the output may indicate that component a will incur a 75% probability of an overheat event, and/or it may occur within 3 days.

In some implementations, the ML model may be pre-trained through a set of labeled training examples that take into account thermal measurements, electrical property measurements, level sensor data, pressure sensor data, flow sensor data stored in data memory 1250. In this case, the ML model is trained using interactions between thermal data, electrical property data, level sensor data, pressure sensor data, flow rate sensor data. As described elsewhere herein, the graph database provides a data structure that captures data changes over time, as well as relationships and interactions between data from different sensors (captured by edges of the graph database). The data structure may be further used in a training process of the ML model to provide predictions of overheat events.

Once trained, the ML model may generate an output indicative of an impending overheat event based on real-time thermal and/or electrical property measurements, level sensor data, pressure sensor data, flow rate sensor data, and the like. In some implementations, examples of outputs are: because the temperature of electrical component a is 76°f, component a will soon experience an overheating event (i.e., exceeding 80°f, which is the upper limit of the temperature limit for component a). This example shows an output indicating an impending overheating event based on real-time thermal measurements. Another example of an output is: because the temperature of electrical component a is 76°f and the liquid flow rate of liquid cooled component a is adjusted to 80°f, component a will experience an overheating event in excess of 80°f. This example shows an output indicating an impending overheating event based on real-time thermal measurements and real-time liquid flow rate.

Yet another example of an output is: because the temperature of electrical component a is 76°f, the voltage of component a is 200 volts (i.e., component a rapidly heats up), and the liquid flow rate of liquid cooled component a is adjusted to 80°f, component a will experience an overheating event. This example shows an output indicating an impending overheat event based on real-time thermal measurements, electrical property measurements, and real-time liquid flow rates.

Another example of an output is: because the temperature of electrical component a is 76°f, the voltage of component a is 200 volts (i.e., component a heats up quickly), and component a will experience an overheating event within 5 days. This example shows an output indicating an impending overheat event and the urgency of the impending overheat event based on real-time thermal and electrical characteristic measurements. Yet another example of an output is: because the temperature of component a is 76°f and the voltage of component a is 200 volts, component a has a 75% chance of experiencing an overheating event. This example shows an output indicating an impending overheat event and a probability of the impending overheat event. In some embodiments, the output is: because the temperature of component a is 75°f and the voltage of component a is 200 volts, component a has a 75% chance of experiencing an overheating event within 5 days. The output indicates an impending overheat event and the likelihood and urgency of the impending overheat event.

In some embodiments, inference data indicative of spatial and/or geographic adjacency between electrical and other components of the cooling system with the aid of digital twinning may also be used to train the ML model. In other words, the topology of the electrical network and associated cooling system is used to train the ML model, as well as continuously measured thermal indicators, electrical property measurements, level sensor data, pressure sensor data, flow sensor data, and the like. The spatial and/or geographical adjacency between the electrical component and the other components of the cooling system includes a distance between the two components of less than 0.9、0.8、0.7、0.6、0.5、0.4、0.3、0.2、0.1、0.09、0.08、0.07、0.06、0.05、0.04、0.03、0.02、0.01、0.009、0.008、0.007、0.006、0.005、0.004、0.003、0.002 or 0.001 meters.

In some cases, the spatial and/or geographic adjacency between the electrical component and the other component of the cooling system includes a distance between the two components of less than 0.9, 0.8, 0.7, 0.6, 0.5, 0.4, 0.3, 0.2, 0.1, 0.09, 0.08, 0.07, 0.06, 0.05, 0.04, 0.03, 0.02, or 0.01 centimeters. In some cases, the spatial and/or geographic adjacency between the electrical component and other components of the cooling system includes two components located in the same building, the same campus, the same group of buildings. In some cases, the spatial and/or geographic adjacency between the electrical component and other components of the cooling system includes two components located in the same city, the same county, and the like.

As described elsewhere herein, individual electrical components on the same electrical network can affect each other's state because of the current passing through them, the heat they generate, the magnetization effect of some components, the vibration and noise they generate, and so forth. Thus, the topological relation between the different electrical components provides another data set for the training data set.

For example, in terms of geographic adjacency, the ML model may be trained to understand that the temperature rise in zone S may be caused by an on event associated with HVAC in zone S, and that its meaning should be limited to only the electrical health associated with component B (also located in zone S). In another example, the ML model may be trained in terms of adjacencies over connections to understand: in the scenario where component P and component Q are electrically coupled to each other, the current spark induced by component P to component Q should have limited significance for the electrical health of component Q. Once trained, the ML model may generate an output that is indicative of not only the impending overheat event based on the real-time thermal and/or electrical characteristic measurements, but also that the impending overheat event may have an impact on other electrical components that are connected or geographically adjacent to the electrical component experiencing the overheat event. In some implementations, the ML model may train itself, i.e., receive incoming real-time sensor data at a low data rate, when the AI engine 1226 is idle or in low demand. The ML model may identify patterns by querying random nodes and discover potential relationships from stored data in data store 1250.

In some implementations, the output of the ML model can be presented to the end user via a User Interface (UI) (not shown in fig. 12). The maintenance team may utilize the output to take other corrective actions. Alternatively or additionally, the relationship between the sensor and the monitored electrical component may be visualized and displayed on the UI. In another embodiment, the start-up-run duration of the electrical network, the overall health of the electrical network, and the next recommended maintenance, etc. may be displayed on the UI. In yet another embodiment, the system 1200 may make further suggestions as to what corrective action to take to ensure the health and safety of the electrical network based on the output of a predictive model (e.g., an ML model as described elsewhere herein).

In some implementations, the ML model can generate a command set that provides corrective actions and sends to the remote controllable cooling component 1260. As shown in fig. 12, a remotely controllable cooling component 1260 may be directly coupled to the server platform 1220, bypassing the network 1214. For example, a remotely controllable cooling component 1260 may be co-located with the server platform 1220, coupled to the server platform 1220 via a local network interface. In another example, the remote controllable cooling component 1260 can communicate with the server platform 1220 via a private or public network system, such as the network 1214.

In some embodiments, the remotely controllable cooling component 1260 may be directly coupled to the sensors 1202 and 1206, wherein the remotely controllable cooling component 1260 may obtain sensor data directly from the sensors 1202 and 1206. In some implementations, the sensors 1202 and 1206 may include sensors embedded with one or more electrical components (e.g., CPU, GPU, circuit board, chipset, memory driver, battery, etc.), and provide measurements directly to the remotely controllable cooling component 1260, bypassing the server platform 1220.

The remotely controllable cooling component 1260 may comprise a heat source (e.g., a computer server), a baffle (e.g., baffle 102 in fig. 1), a container (e.g., container 103 in fig. 1), a liquid (e.g., first liquid 104 in fig. 1), a heat generating component (e.g., heat generating component 105 in fig. 1), an open bottom or floor (e.g., open bottom or floor 106 in fig. 1), a converging structure (e.g., converging structure 107 in fig. 1), a pump (e.g., pump 108 in fig. 1), a recirculation loop (e.g., recirculation loop 109 in fig. 1), a heat exchanger (e.g., heat exchanger 110 in fig. 1), a cover (e.g., cover 111 in fig. 1), and so forth. These remotely controllable cooling components 1260 may be turned on/off remotely by command without human intervention. In some embodiments, parameters associated with the remotely controllable cooling component 1260 may be adjusted by command without human intervention, such as adjusting the pump speed of the pump 108 as shown in fig. 1, adjusting the supply speed of the blower 301 as shown in fig. 3, and so forth.

In some implementations, the AI engine 1226 can query the data store 1250 for computing and cooling systems, digital twinning of historical sensors, and retrieve/receive real-time sensor data to provide predictions of impending overheat events, as described elsewhere herein. The ML model is trained to provide predictions of impending overheat events for one or more electrical components, as described elsewhere herein. In some implementations, these predictions can be fed back to the ML model to generate suggestions for corrective actions. In some other implementations, these predictions may be fed back to the ML model to generate commands that control the remote controllable cooling component 1260 to take corrective action. For example, if there is a predicted output indicating that component a will experience an overheating event soon, the ML model may be trained to send commands to increase the liquid flow rate near electrical component a. Corrective actions may include, but are not limited to, increasing the liquid flow rate, decreasing the liquid temperature, initiating a dual phase cooling mode (as shown with reference to fig. 10), directing or redirecting the liquid flow through the recirculation loop outlet 1106, and the like. By utilizing preset rules (e.g., best practice guidelines), digital twinning of the system, or other analog, historical sensor data, the ML model can be trained to automatically generate these commands without human intervention.

FIG. 13 shows a flowchart depicting an example process 1300 for intelligently cooling a computing system, according to one embodiment. As shown in fig. 13, once the platform and system of the present disclosure are initialized, process 1300 begins with operation 1310, wherein system 1200 receives and collects parameters associated with one or more components from one or more sensors. Parameters may include, but are not limited to, thermal measurements, electrical property measurements, level sensor data, pressure sensor data, flow sensor data, and the like. Next, process 1300 may continue with operation 1320, where system 1200 may process the received parameters with a predictive model (e.g., an ML model as described elsewhere herein) to generate an output indicative of the event. Events may include, but are not limited to, overheating events, early failure events, and similar events associated with electrical components. Next, process 1300 may continue with operation 1330, where system 1200 may display an output indicating an event. In some implementations, the output can be presented to the user via a User Interface (UI).

FIG. 14 shows a flowchart depicting an example process 1400 for intelligently cooling a computing system, according to one embodiment. As shown in fig. 14, once the platform and system of the present disclosure are initialized, process 1400 begins with operation 1410, where system 1200 may obtain historical sensor data. In some implementations, the AI engine 1226 can query the data store 1250 for historical sensor data. Next, process 1400 may continue with operation 1420, where system 1200 may detect activity by parsing and analyzing the historical sensor data. Activities may include, but are not limited to, an increase in temperature associated with component a at a given point in time, a decrease in liquid flow rate near component B at a given point in time, and so forth. In some implementations, the system 1200 can detect these changes in parameters and mark them as active. Next, process 1400 may continue with operation 1430, where the system may determine correlations between different components based on the activities. In some implementations, a Machine Learning (ML) model (or other predictive model) may be utilized to determine correlations between different components. In some implementations, the system 1200 will explore the activities that occur at the same time or during a short time window to determine if there is a correlation between two or more components. For example, if the temperature of the component a increases by 4 degrees at O and the liquid flow rate decreases at the same point in time O, there may be a correlation between the temperature of the component a and the liquid flow rate. The ML model may be trained to recognize these correlations. Next, process 1400 may proceed to operation 1440, where system 1200 may identify relationships between different components based on the correlations. This can be achieved by determining the correlation across different points in time. For example, if the temperature reading of component a rises each time the liquid flow rate decreases, system 1200 can identify that a relationship exists between component a and the pump controlling the liquid flow rate. Next, process 1400 may continue with operation 1450, where system 1200 may generate a digital twin based on the relationship. For example, system 1200 can aggregate relationships into virtual representations between different components. The digital twinning may be stored using a graph database, where each component may be represented by a "node" or "vertex" and the relationship between two components may be represented by an "edge" linking two nodes representing the two components. In some implementations, digital twinning may be stored in data memory 1250.

Computer system

The present disclosure provides a computer system programmed to perform the methods of the present disclosure. Fig. 15 shows a computer system 1501, the computer system 1501 being programmed or otherwise configured to implement the methods described elsewhere herein. The computer system 1501 may regulate various aspects of the electronic device cooling of the present disclosure, such as maintaining and controlling the flow rate of the cooling fluid, the temperature of the heat source, and the flow rate of the heat exchange fluid. The computer system 1501 may be a user's electronic device or a computer system remotely located from the electronic device. The electronic device may be a mobile electronic device.

The computer system 1501 includes a central processing unit (CPU, also referred to herein as "processor" and "computer processor") 1505, which may be a single-core or multi-core processor, or multiple processors for parallel processing. The computer system 1501 also includes memory or memory locations 1510 (e.g., random access memory, read only memory, flash memory), an electronic storage unit 1515 (e.g., hard disk), a communication interface 1520 (e.g., network adapter) for communicating with one or more other systems, and peripheral devices 1525 such as cache, other memory, data storage, and/or electronic display adapters. The memory 1510, the storage unit 1515, the interface 1520, and the peripheral device 1525 communicate with the CPU 1505 through a communication bus (solid line) such as a motherboard. Storage unit 1515 may be a data storage unit (or data repository) for storing data. The computer system 1501 may be operatively coupled to a computer network ("network") 1530 with the aid of a communication interface 1520. The network 1530 may be the Internet, the Internet and/or an extranet, or an intranet and/or an extranet in communication with the Internet. In some cases, network 1530 is a telecommunications and/or data network. Network 1530 may include one or more computer servers, which may implement distributed computing, such as cloud computing. In some cases, with the aid of computer system 1501, network 1530 may implement a peer-to-peer network that may enable devices coupled to computer system 1501 to function as clients or servers.

The CPU 1505 may execute a sequence of machine-readable instructions that may be embodied in a program or software. The instructions may be stored in a memory location, such as memory 1510. An instruction may be directed to the CPU 1505, the CPU 1505 may then program or otherwise configure the CPU 1505 to implement the methods of the present disclosure. Examples of operations performed by the CPU 1505 may include fetching, decoding, executing, and writing back.

The CPU 1505 may be part of a circuit such as an integrated circuit. One or more other components of system 1501 may be included in the circuit. In some cases, the circuit is an Application Specific Integrated Circuit (ASIC).

The storage unit 1515 may store files such as drivers, libraries, and saved programs. The storage unit 1515 may store user data, such as user preferences and user programs. In some cases, computer system 1501 may include one or more additional data storage units external to computer system 1501, such as on a remote server in communication with computer system 1501 via an intranet or the internet.

The computer system 1501 may communicate with one or more remote computer systems over a network 1530. For example, the computer system 1501 may communicate with a user's remote computer system (e.g., a mobile phone, notebook computer, tablet computer, desktop computer, or any combination thereof). Examples of remote computer systems include personal computers (e.g., portable PCs), tablet PCs (e.g.,iPad、Galaxy Tab), phone, smart phone (e.g.,IPhone, android supporting device,) Or a personal digital assistant. A user may access computer system 1501 via network 1530.

The methods described herein may be implemented by machine (e.g., a computer processor) executable code stored on an electronic storage location (e.g., memory 1510 or electronic storage unit 1515) of computer system 1501. The machine-executable or machine-readable code may be provided in the form of software. During use, code may be executed by processor 1505. In some cases, code may be retrieved from storage unit 1215 and stored on memory 1510 for ready access by processor 1505. In some cases, electronic storage 1515 may be eliminated and machine executable instructions stored on memory 1510.

The code may be pre-compiled and configured for use with a machine having a processor adapted to execute the code, or may be compiled at runtime. The code may be provided in a programming language that is selectable to enable the code to be executed in a pre-compiled or compiled manner.

Various aspects of the systems and methods provided herein, such as computer system 1501, may be embodied in programming. Aspects of the technology may be considered an "article of manufacture" or "article of manufacture" in the form of machine (or processor) executable code and/or associated data generally carried or embodied on one type of machine readable medium. The machine executable code may be stored on an electronic storage unit such as a memory (e.g., read only memory, random access memory, flash memory) or a hard disk. A "storage" type medium may include any or all of the tangible memory of a computer, processor, etc., or its associated modules, such as various semiconductor memories, tape drives, disk drives, etc., which may provide non-transitory storage for software programming at any time. All or part of the software may sometimes communicate over the internet or various other telecommunications networks. Such communication may enable, for example, loading of software from one computer or processor into another computer or processor, such as from a management server or host computer into a computer platform of an application server. Thus, another type of medium that can carry software elements includes optical, electrical, and electromagnetic waves, such as those used across physical interfaces between local devices through wired and optical landline networks, and through various air links. Physical elements carrying such waves, such as wired or wireless links, optical links, etc., may also be considered as media carrying software. As used herein, unless limited to a non-transitory tangible "storage" medium, terms such as computer or machine "readable medium" refer to any medium that participates in providing instructions to a processor for execution.

Thus, a machine-readable medium, such as computer-executable code, may take many forms, including but not limited to, tangible storage media, carrier wave media, or physical transmission media. Nonvolatile storage media includes, for example, optical or magnetic disks, such as any storage devices in any computer or the like, such as might be used to implement a database or the like, as shown in the figures. Volatile storage media include dynamic memory, such as the main memory of such a computer platform. Tangible transmission media include coaxial cables; copper wire and fiber optics, including the wires that comprise a bus within a computer system. Carrier wave transmission media can take the form of electrical or electromagnetic signals, or acoustic or light waves, such as those generated during Radio Frequency (RF) and Infrared (IR) data communications. Thus, common forms of computer-readable media include, for example: a floppy disk, a flexible disk, hard disk, magnetic tape, any other magnetic medium, a CD-ROM, DVD, or DVD-ROM, any other optical medium, punch cards paper tape, any other physical storage medium with patterns of holes, RAM, ROM, PROM and EPROMs, FLASH-EPROMs, any other memory chip or cartridge, a carrier wave transporting data or instructions, a cable or link transporting such a carrier wave, or any other medium from which a computer can read programming code and/or data. Many of these forms of computer readable media may be involved in carrying one or more sequences of one or more instructions to a processor for execution.

The computer system 1501 may include or be in communication with an electronic display 1535, the electronic display 1535 including a User Interface (UI) 1540 for providing, for example, a status of a cooling system, a fluid flow rate, a system temperature, or any combination thereof. Examples of UIs include, but are not limited to, graphical User Interfaces (GUIs) and web-based user interfaces.

The methods and systems of the present disclosure may be implemented by one or more algorithms. The algorithm, when executed by the central processing unit 1505, may be implemented in software. For example, the algorithm may direct the system to maintain the temperature of the heat generating components, adjust the flow of the recirculation pump, adjust the flow through the heat exchanger, or any combination thereof.

While preferred embodiments of the present invention have been shown and described herein, it will be obvious to those skilled in the art that such embodiments are provided by way of example only. The invention is not limited by the specific examples provided in the specification. While the invention has been described with reference to the above description, the description and illustration of the embodiments herein are not meant to be limiting. Numerous variations, changes, and substitutions will now occur to those skilled in the art without departing from the invention. Furthermore, it should be understood that all aspects of the invention are not limited to the specific descriptions, configurations, or relative proportions set forth herein, depending on various conditions and variables. It should be understood that various alternatives to the embodiments of the invention described herein may be employed in practicing the invention. It is therefore contemplated that the present invention also encompasses any such alternatives, modifications, variations, or equivalents. The following claims are intended to define the scope of the invention and the method and structure within the scope of these claims and their equivalents are covered thereby.

Claims

1. A cooling system, comprising:

A container comprising a container wall, wherein the container is configured to hold a heat source submerged in a first liquid, wherein during use the first liquid is in thermal communication with the heat source and is configured to remove thermal energy from the heat source;

a baffle disposed in the vessel, wherein, during use, the baffle is disposed between the heat source and the vessel wall and is configured to direct the flow of the first liquid during transfer of thermal energy away from the heat source; and

A heat exchanger disposed in the vessel, wherein during use, the heat exchanger is in thermal communication with and is completely submerged in the first liquid and is configured to flow a second liquid configured to remove thermal energy from the first liquid, thereby cooling the heat source.

2. The cooling system of claim 1, wherein the heat exchanger is disposed between the baffle and the vessel wall.

3. The cooling system of claim 1 or claim 2, further comprising an additional vessel comprising the heat exchanger, wherein the additional vessel is in fluid communication with the vessel such that during use the first liquid flows between the vessel and the additional vessel.

4. A cooling system according to any one of claims 1-3, wherein the heat exchanger comprises a plurality of tubes configured to flow the second liquid.

5. The cooling system of any one of claims 1-4, further comprising a blower configured to cool at least a portion of the first liquid.

6. The cooling system of any one of claims 1-5, wherein the baffle is configured to direct the first liquid to flow toward the heat exchanger.

7. The cooling system of any one of claims 1-6, wherein the first liquid is maintained separate from the second liquid such that the first liquid does not contact the second liquid.

8. The cooling system of any one of claims 1-7, wherein the first liquid is a dielectric liquid.

9. The cooling system of claim 8, wherein the first liquid directly contacts the heat source.

10. The cooling system of any one of claims 1-9, further comprising a recirculation loop configured to provide forced convection of the first liquid.

11. The cooling system of any one of claims 1-10, wherein the baffle supports the heat source.

12. The cooling system of any one of claims 1-11, wherein the baffle comprises a floor comprising perforations configured to allow the first liquid to flow through the floor.

13. The cooling system of any one of claims 1-12, wherein the baffle comprises a baffle wall, and wherein the baffle wall comprises perforations configured to allow the first liquid to flow through the baffle wall.

14. The cooling system of any one of claims 1-13, wherein the baffle comprises a flow diverter configured to direct the flow of the first liquid around the heat source.

15. The cooling system of any one of claims 1-14, further comprising a lid configured to seal the container.

16. The cooling system of any one of claims 1-15, further comprising a liquid cap disposed adjacent to and above the first liquid, wherein the liquid cap is configured to seal the container.

17. The cooling system of claim 16, further comprising a float configured to reduce a volume of the liquid cap.

18. The cooling system of any one of claims 1-17, wherein the container comprises a safety valve configured to maintain a pressure of the container below a threshold.

19. The cooling system of any one of claims 1-18, further comprising a gasket configured to seal the first liquid within the container.

20. The cooling system of claim 19, wherein the liner is a rigid liner.

21. The cooling system of claim 19, wherein the liner is a deformable liner.

22. The cooling system of any one of claims 1-21, further comprising one or more processors coupled to the heat exchanger, wherein the one or more processors are configured to regulate the flow of the second liquid through the heat exchanger.

23. The cooling system of any one of claims 1-22, further comprising a cable outlet configured to allow a portion of a cable to be disposed inside the container and another portion of the cable to be disposed outside the container, wherein the cable outlet is configured to seal the container.

24. The cooling system of claim 23, wherein the cable outlet comprises a conduit comprising at least a portion of the cable and a third liquid configured to seal the cable outlet.

25. The cooling system of any one of claims 1-24, further comprising a displacement volume configured to reduce a volume of the first liquid as compared to a system without the displacement volume.

26. The cooling system of any one of claims 1-25, wherein the cooling system is integrated with a renewable energy source.

27. The cooling system of any one of claims 1-26, wherein the heat source is an electronic component, and wherein the electronic component comprises a wireless handle.

28. The cooling system of claim 27, wherein the wireless handle comprises a wireless transmitter.

29. A kit comprising the cooling system of any one of claims 1-28 and a single container comprising the first liquid and a liquid cap, wherein the first liquid and the liquid cap are configured to separate when added to the cooling system.

30. A cooling system, comprising:

A recirculation loop configured to flow the first liquid, wherein the recirculation loop comprises (i) a channel comprising a converging structure and (ii) a pump configured to direct the first liquid through the converging structure of the channel, wherein during use the channel is disposed between the baffle and the vessel wall and the pump directs the first liquid through the converging structure to generate a suction force that pulls the first liquid through the converging structure to generate a flow of the first liquid between the baffle and the vessel wall, thereby cooling the heat source.

31. The cooling system of claim 30, wherein the baffle is configured to direct the first liquid to flow toward the vessel wall.

32. The cooling system of claim 30 or claim 31, further comprising a blower configured to cool at least a portion of the first liquid.

33. The cooling system of any one of claims 30-32, wherein the first liquid is a dielectric liquid.

34. The cooling system of claim 33, wherein the first liquid directly contacts the heat source.

35. The cooling system of any one of claims 30-34, further comprising one or more processors coupled to the recirculation loop, wherein the one or more processors are configured to regulate the flow of the first liquid through the recirculation loop.

36. The cooling system of any one of claims 30-35, wherein the baffle supports the heat source.

37. The cooling system of any one of claims 30-36, wherein the baffle comprises a floor comprising perforations configured to allow the first liquid to flow through the floor.

38. The cooling system of any one of claims 30-37, wherein the baffle comprises a baffle wall, and wherein the baffle wall comprises perforations configured to allow the first liquid to flow through the baffle wall.

39. The cooling system of any one of claims 30-38, wherein the baffle comprises a flow diverter configured to direct the flow of the first liquid around the heat source.

40. The cooling system of any one of claims 30-39 further comprising a lid configured to seal the container.

41. The cooling system of any one of claims 30-40 further comprising a liquid cap disposed adjacent to and above the first liquid, wherein the liquid cap is configured to seal the container.

42. The cooling system of claim 41, further comprising a float configured to reduce the volume of the liquid cap.

43. The cooling system of any one of claims 30-42 wherein the vessel comprises a safety valve configured to maintain the pressure of the vessel below a threshold.

44. The cooling system of any one of claims 30-43, further comprising a gasket configured to seal the first liquid within the container.

45. The cooling system of claim 44, wherein the liner is a rigid liner.

46. The cooling system of claim 44, wherein the liner is a deformable liner.

47. The cooling system of any one of claims 30-46, further comprising a cable outlet configured to allow a portion of a cable to be disposed inside the container and another portion of the cable to be disposed outside the container, wherein the cable outlet is configured to seal the container.

48. The cooling system of claim 47, wherein the cable outlet comprises a conduit comprising at least a portion of the cable and a third liquid configured to seal the cable outlet.

49. The cooling system of any one of claims 30-48, further comprising a displacement volume configured to reduce a volume of the first liquid as compared to a system without the displacement volume.

50. The cooling system of any one of claims 30-49 wherein the cooling system is integrated with a renewable energy source.

51. The cooling system of any one of claims 30-50 wherein the heat source is an electronic component, and wherein the electronic component comprises a wireless handle.

52. The cooling system of claim 51, wherein the wireless handle comprises a wireless transmitter.

53. A kit comprising the cooling system of any one of claims 30-52 and a single container comprising the first liquid and a liquid cap, wherein the first liquid and the liquid cap are configured to separate when added to the cooling system.

54. A method for cooling a heat source, the method comprising:

(a) Providing a cooling system in thermal communication with the heat source, wherein the cooling system comprises (i) a vessel comprising a vessel wall, wherein the vessel comprises the heat source submerged in a first liquid, (ii) a baffle disposed between the heat source and the vessel wall, and (iii) a heat exchanger in thermal communication with the first liquid and completely submerged in the first liquid, wherein the first liquid is in thermal communication with the heat source;

(b) Transferring thermal energy from the heat source to the first liquid, and during the transferring, directing the first liquid to flow away from the heat source using the baffle; and

(C) A second liquid is flowed using the heat exchanger, wherein the second liquid removes thermal energy from the first liquid, thereby cooling the heat source.

55. The method of claim 54, further comprising flowing the first liquid to maintain the first liquid in a subcooled state.

56. The method of claim 54 or claim 55, wherein the heat exchanger is disposed between the baffle and the vessel wall.

57. The method of any of claims 54-56, further comprising flowing the first liquid to an additional vessel in fluid communication with the vessel, wherein the heat exchanger is disposed in the additional vessel.

58. The method of any of claims 54-57, wherein the heat exchanger comprises a plurality of tubes that flow the second liquid.

59. The method of any of claims 54-58, further comprising cooling at least a portion of the first liquid using a blower.

60. The method of any of claims 54-59, wherein the baffle directs the first liquid toward the heat exchanger.

61. The method of any of claims 54-60, further comprising using a pump coupled to the heat exchanger, wherein the pump directs the second liquid through the heat exchanger.

62. The method of claim 61, further comprising controlling the flow of the second liquid through the heat exchanger using one or more processors coupled to the pump.

63. The method of any one of claims 54-62, wherein the first liquid is a dielectric liquid.

64. The method of claim 63, wherein the first liquid directly contacts the heat source.

65. The method of any of claims 54-64, wherein the baffle supports the heat source.

66. The method of any of claims 54-65, wherein the baffle comprises a floor comprising perforations that allow the first liquid to flow through the floor.

67. The method of any of claims 54-66, wherein the baffle comprises a baffle wall, and wherein the baffle wall comprises perforations that allow the first liquid to flow through the baffle wall.

68. The method of any of claims 54-67, wherein the baffle comprises a flow diverter that directs the flow of the first liquid around the heat source.

69. The method of any of claims 54-68, wherein the container comprises a lid that seals the container.

70. The method of any of claims 54-69, wherein the container comprises a liquid cap disposed adjacent to and above the first liquid.

71. The method of claim 70, wherein the container comprises a float that displaces the volume of the liquid cap.

72. The method of any of claims 54-71, wherein the container comprises a safety valve that maintains the pressure of the container below a threshold.

73. The method of any of claims 54-72, wherein the container comprises a gasket sealing the first liquid within the container.

74. The method of claim 73, wherein the liner is a rigid liner.

75. The method of claim 73, wherein the cushion is a deformable cushion.

76. The method of any one of claims 54-75, further comprising integrating the cooling system with a renewable energy source.

77. The method of any one of claims 54-76, further comprising performing a secondary heating using the second liquid.

78. The method of any of claims 54-77, wherein the heat source is an electronic component, and wherein the electronic component comprises a wireless handle.

79. The method of claim 78, wherein the wireless handle comprises a wireless transmitter.

80. A method for cooling a heat source, the method comprising:

(a) Providing a cooling system in thermal communication with the heat source, wherein the cooling system comprises (i) a vessel comprising a vessel wall, wherein the vessel comprises the heat source submerged in a first liquid, (ii) a baffle disposed between the heat source and the vessel wall, and (iii) a recirculation loop comprising (a) a channel comprising a converging structure disposed between the baffle and the vessel wall, and (B) a pump directing the flow of the first liquid through the converging structure, wherein the first liquid is in thermal communication with the heat source;

(C) The pump of the recirculation loop is used to direct the first liquid through the converging structure of the passageway to generate a suction force that pulls the first liquid through the converging structure and generates a flow of the first liquid between the baffle and the vessel wall, thereby cooling the heat source.

81. The method of claim 80, further comprising flowing the first liquid such that the first liquid is maintained in a subcooled state.

82. The method of claim 80 or claim 81, wherein the baffle directs the first liquid toward the vessel wall.

83. The method of any one of claims 80-82, wherein the first liquid is a dielectric liquid.

84. The method of claim 83, wherein the first liquid directly contacts the heat source.

85. The method of any one of claims 80-84, further comprising cooling at least a portion of the first liquid using a blower.

86. The method of any of claims 80-85, wherein the baffle supports the heat source.

87. The method of any of claims 80-86, wherein the baffle comprises a floor comprising perforations that allow the first liquid to flow through the floor.

88. The method of any of claims 80-87, wherein the baffle comprises a baffle wall, and wherein the baffle wall comprises perforations that allow the first liquid to flow through the baffle wall.

89. The method of any of claims 80-88, wherein the baffle comprises a flow diverter that directs the flow of the first liquid around the heat source.

90. The method of any of claims 80-89, wherein the container comprises a lid that seals the container.

91. The method of any of claims 80-90, wherein the container comprises a liquid cap disposed adjacent to and above the first liquid.

92. The method of claim 91, wherein the container comprises a float that displaces the volume of the liquid cap.

93. The method of any of claims 80-92, wherein the container comprises a safety valve that maintains the pressure of the container below a threshold.

94. The method of any of claims 80-93, wherein the container comprises a gasket configured to seal the first liquid within the container.

95. The method of claim 94, wherein the pad is a rigid pad.

96. The method of claim 94, wherein the pad is a deformable pad.

97. The method of any one of claims 80-96, further comprising controlling the flow of the first liquid through the converging structure using one or more processors coupled to the pump.

98. The method of any of claims 80-97, further comprising integrating the cooling system with a renewable energy source.

99. The method of any of claims 80-98, further comprising performing a secondary heating using the first liquid.

100. The method of any of claims 80-99, wherein the heat source is an electronic component, and wherein the electronic component comprises a wireless handle.

101. The method of claim 100, wherein the wireless handle comprises a wireless transmitter.

102. A method for predicting an overheating event to aid in cooling a heat source, the method comprising:

(a) Receiving a plurality of parameters associated with a plurality of electrical components of an electrical network from a plurality of sensors, wherein one of the plurality of sensors is a temperature sensor; and

(B) The computer processes the plurality of parameters with a predictive model to generate an output indicative of the overheating event, wherein the predictive model is trained on a training dataset comprising a plurality of historical data for the plurality of parameters across different points in time, and wherein the plurality of historical data is marked as originating or not originating from an electrical component experiencing an overheating event.

103. The method of claim 102, wherein the predictive model is a binary predictive model, and wherein the output is a binary output indicating whether one of the plurality of electrical components will experience the overheat event.

104. The method of claim 102 or claim 103, wherein the predictive model is a multi-class predictive model, and wherein the output includes probability distributions over multiple levels or urgency of the overheating event.

105. The method of any of claims 102-104, wherein the plurality of sensors includes an electrical characteristic sensor.

106. The method of claim 105, wherein the training data set includes a plurality of historical data regarding thermal measurements received from the temperature sensor and electrical property measurements from the electrical property sensor.

107. The method of any of claims 102-106, wherein the training dataset comprises topological relationships between the plurality of electrical components.

108. The method of any of claims 102-107, wherein the temperature sensor is an infrared thermometer.