CN118317468A - Heating film patterning method with uniform far infrared radiation - Google Patents
Heating film patterning method with uniform far infrared radiation Download PDFInfo
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- CN118317468A CN118317468A CN202410650938.1A CN202410650938A CN118317468A CN 118317468 A CN118317468 A CN 118317468A CN 202410650938 A CN202410650938 A CN 202410650938A CN 118317468 A CN118317468 A CN 118317468A
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Abstract
The invention provides a patterning method of a heating film with uniform far infrared radiation. The preparation method provided by the invention can be used for rapidly preparing a large number of heating sheets at low cost, and the purpose of roll-to-roll patterning can be achieved by utilizing the thermal transfer adhesive through simple silk screen printing. The conductive layer and the radiation layer can exert the capability of uniform heat and thermal stability of the conductive layer, and simultaneously can radiate far infrared rays through the radiation layer. The infrared radiation type infrared radiation device has the capability of radiating far infrared band light waves, can uniformly heat in the special-shaped piece, and is simple in method. The circuit pattern occupies 10% -90% of the heating film area, and uniform heating can be realized.
Description
Technical Field
The application relates to the technical field of heating films, in particular to a patterning method of a heating film with uniform far infrared radiation.
Background
Heating films are now widely used in a variety of heating applications, such as physiotherapy heating appliances, heating wear, heating pads, warming chopping boards, and the like. For some physiotherapy and heating products of human body, such as neck-protecting knee-protecting waist-protecting, the heating film needs to have a certain far infrared wave band radiation to penetrate through cloth to reach the interior of the human body, so that the local body temperature is improved, the muscle pain is relieved, the blood circulation is promoted, and the human body is enhanced. The market demands for such heating films are inexpensive, uniformly heated.
In the heating field, flexible heating films are important core components. The flexible heating film at the present stage mainly comprises a metal etching heating film and a carbon coating heating film, but has the defects: 1. the metal etching heating film has no radiation of far infrared wave band, the physiotherapy effect is poor, and the solution of wet etching can cause certain environmental pollution, so the method is not ideal. 2. The carbon-based coating heating film such as a graphene coating, a carbon nanotube coating, etc. realizes a far infrared radiation function, but the method is difficult to realize uniform heating in a set area. The existing carbon coating heating film has the problem that the curve part heats unevenly if the area is fully arranged in a curve special-shaped mode; if the heating is to be uniform, only rectangular square block stacking mode can be adopted, so that the heating area cannot be paved, and large heating areas cannot be realized on special-shaped pieces such as eyeshade foot pad gloves. Therefore, the heating fineness of the existing carbon-based coating heating film cannot meet the requirement, and the requirements of heating power and heating uniformity are difficult to meet. The processing characteristics of easy scratch, easy falling and easy failure of the carbon coating heating film are overcome, a reliable method is provided to meet the requirements of heating power and heating uniformity, and the method is a necessary path for further improving the application of the flexible heating film.
Disclosure of Invention
In view of the above, the present application provides a heating film patterning method with uniform far-infrared radiation, capable of processing a reliable flexible heating film with specific heat resistance, uniform heat generation, and far-infrared radiation.
The heating film patterning method provided by the invention is simple, and the prepared heating film can be used on a special-shaped piece, has uniform heating temperature and has the radiation characteristic of a far infrared band.
The invention provides a heating film patterning method with uniform far infrared radiation, which comprises the following steps:
A) Coating a conductive layer on a low-viscosity substrate film, coating far infrared radiation material slurry on the surface of the conductive layer, and drying to obtain a composite film of the low-viscosity substrate film/the conductive layer/the far infrared radiation layer;
B) The composite film obtained in the step A) comprises a circuit pattern and an area outside the circuit pattern, heat transfer glue is covered on the area outside the circuit pattern of the composite film, and then the circuit pattern is die-cut on the surface of the composite film;
C) Coating a plastic film on the surface of the composite film obtained in the step B), and removing the plastic film and the area outside the circuit pattern corresponding to the conducting layer and the far infrared radiation layer adhered on the plastic film to obtain the circuit pattern formed by compounding the conducting layer and the far infrared radiation layer, which is coated on the surface of the low-adhesion base film;
d) Preparing an electrode transition layer on the circuit pattern obtained in the step C), and compounding a plastic film with electrode holes;
e) And (3) removing the low-viscosity substrate film, covering a plastic film, cutting, and connecting a wire outlet to obtain the heating film.
The invention also provides a heating film patterning method with uniform far infrared radiation, which comprises the following steps:
a) Coating a conductive layer on a low-viscosity substrate film, coating far infrared radiation material slurry on the surface of the conductive layer, and drying to obtain a composite film of the low-viscosity substrate film/the conductive layer/the far infrared radiation layer;
b) The composite film obtained in the step a) comprises a circuit pattern area and an area except the circuit pattern, heat transfer glue is covered on the circuit pattern area of the composite film, and then the circuit pattern is die-cut;
c) Coating a plastic film on the surface of the composite film obtained in the step b), removing the low-viscosity base film, and discarding the area except the circuit pattern corresponding to the conducting layer and the far infrared radiation layer to obtain the circuit pattern formed by compounding the conducting layer and the far infrared radiation layer, which is coated on the surface of the plastic film;
d) And c) preparing an electrode transition layer on the circuit pattern obtained in the step c), compounding a plastic film with electrode holes, cutting, and connecting outgoing lines to obtain the heating film.
Preferably, the conductive layer is selected from a metallic conductive layer or a non-metallic conductive layer.
Preferably, the metal conductive layer is selected from aluminum foil, iron-chromium-aluminum alloy foil or stainless steel foil;
The nonmetallic conductive layer is selected from carbon paper or graphene paper.
Preferably, the far infrared radiation material slurry is selected from graphene slurry, carbon nanotube slurry, carbon slurry or far infrared ceramic slurry.
Preferably, the low-viscosity substrate film is a plastic film with an adhesive layer, and the plastic film is selected from a PI film, a PET film, a PEN film, a PC film or a PVC film; the adhesive layer is selected from acrylic adhesive or silica gel adhesive.
Preferably, the thermal transfer glue is selected from EVA or TPU.
Preferably, the electrode transition layer is prepared by coating conductive paste and/or conductive adhesive tape on the surface of the circuit pattern, wherein the conductive paste is selected from silver paste, copper paste, carbon paste or nickel paste; the conductive adhesive tape is selected from conductive copper adhesive tape or conductive aluminum adhesive tape.
Preferably, the plastic film is a plastic film with a glue layer, and the plastic film is selected from a PI film, a PET film, a PEN film, a PC film or a PVC film; the adhesive layer is selected from acrylic adhesive, silica gel adhesive, hot melt adhesive or thermosetting adhesive layer.
Preferably, the hot melt adhesive is selected from EVA or TPU, and the thermosetting adhesive is selected from acrylic thermosetting adhesive or epoxy thermosetting adhesive.
The invention provides a heating film patterning method with uniform far infrared radiation, which comprises the following steps: a) Coating a conductive layer on a low-viscosity substrate film, coating far infrared radiation material slurry on the surface of the conductive layer, and drying to obtain a composite film of the low-viscosity substrate film/the conductive layer/the far infrared radiation layer; b) The composite film comprises a circuit pattern area and an area outside the circuit pattern, wherein the area outside the circuit pattern of the composite film is covered with heat transfer glue, and then the circuit pattern is die-cut on the surface of the composite film; c) Coating a plastic film on the surface of the composite film, removing the plastic film, and discarding the area outside the circuit pattern corresponding to the conducting layer and the far infrared radiation layer to obtain a circuit pattern formed by compounding the conducting layer and the far infrared radiation layer, which is coated on the surface of the low-viscosity substrate film; d) Preparing an electrode transition layer on the circuit pattern, and compounding a plastic film with electrode holes; e) And (3) removing the low-viscosity substrate film, covering a plastic film, cutting, and connecting a wire outlet to obtain the heating film. The preparation method provided by the invention can be used for rapidly preparing a large number of heating sheets at low cost, and the purpose of roll-to-roll patterning can be achieved by utilizing the thermal transfer adhesive through simple silk screen printing. The conductive layer and the radiation layer can exert the capability of uniform heat and thermal stability of the conductive layer, and simultaneously can radiate far infrared rays through the radiation layer. The infrared radiation type infrared radiation device has the capability of radiating far infrared band light waves, can uniformly heat in the special-shaped piece, and is simple in method. The circuit pattern occupies 10% -90% of the heating film area, and uniform heating can be realized.
Drawings
The above and other features, advantages, and aspects of embodiments of the present disclosure will become more apparent by reference to the following detailed description when taken in conjunction with the accompanying drawings. The same or similar reference numbers will be used throughout the drawings to refer to the same or like elements. It should be understood that the figures are schematic and that elements and components are not necessarily drawn to scale.
FIG. 1 is a schematic diagram of a heating film with uniform far-infrared radiation according to the present invention;
FIG. 2 is a schematic diagram of a heating film with uniform far-infrared radiation according to the present invention;
FIG. 3 is a schematic structural view of the high temperature heating film prepared in example 1;
fig. 4 is a schematic structural view of the heating eyeshade prepared in example 2;
Fig. 5 is a flow chart of a patterning method of a heating film with uniform far-infrared radiation provided by the invention.
Detailed Description
Embodiments of the present application will be described below with reference to the accompanying drawings in the embodiments of the present application. The terminology used in the description of the embodiments of the application herein is for the purpose of describing particular embodiments of the application only and is not intended to be limiting of the application.
The invention provides a heating film patterning method with uniform far infrared radiation, which comprises the following steps:
A) Coating a conductive layer on a low-viscosity substrate film, coating far infrared radiation material slurry on the surface of the conductive layer, and drying to obtain a composite film of the low-viscosity substrate film/the conductive layer/the far infrared radiation layer;
B) The composite film comprises a circuit pattern area and an area outside the circuit pattern, wherein the area outside the circuit pattern of the composite film is covered with heat transfer glue, and then the circuit pattern is die-cut on the surface of the composite film;
C) Coating a plastic film on the surface of the composite film, removing the plastic film, and discarding the area outside the circuit pattern corresponding to the conducting layer and the far infrared radiation layer to obtain a circuit pattern formed by compounding the conducting layer and the far infrared radiation layer, which is coated on the surface of the low-viscosity substrate film;
D) Preparing an electrode transition layer on the circuit pattern, and compounding a plastic film with electrode holes;
e) And (3) removing the low-viscosity substrate film, covering a plastic film, cutting, and connecting a wire outlet to obtain the heating film.
The invention first covers a conductive layer onto a low-adhesion base film, in which the conductive layer is selected from metallic conductive layers or non-metallic conductive layers.
Preferably, the metal conductive layer is selected from aluminum foil, iron-chromium-aluminum alloy foil or stainless steel foil; the nonmetallic conductive layer is selected from carbon paper or graphene paper.
In the present invention, the thickness of the conductive layer is 1 to 1000 micrometers, may be 1, 5, 10, 15, 20, 25, 30, 35, 40, 45, 50, 60, 70, 80, 100, 200, 300, 400, 500, 600, 700, 800, 900, 1000, or any value between 1 to 1000 micrometers, and is preferably 5 to 500 micrometers.
The low-viscosity substrate film is a plastic film with an adhesive layer, and the plastic film is selected from a PI film, a PET film, a PEN film, a PC film or a PVC film; the adhesive layer is selected from acrylic adhesive sticker or silica gel adhesive sticker.
The present invention is not particularly limited in the lamination manner, and preferably a roll-to-roll manner of laminating the metal conductive layer onto the low-adhesion base film.
Then, the surface of the conducting layer is coated with far infrared radiation material sizing agent, and the composite film of the low-viscosity substrate film/the conducting layer/the far infrared radiation layer is obtained after drying.
Wherein the far infrared radiation material slurry is selected from graphene slurry, carbon nanotube slurry, carbon slurry or far infrared ceramic slurry. Preferably a graphene slurry.
The thickness of the obtained far infrared radiation layer is 5-100 micrometers, and can be any value between 5, 10, 15, 20, 25, 30, 35, 40, 45, 50, 55, 60, 65, 70, 75, 80, 85, 90, 95, 100 or 5-100 micrometers. Preferably 10 to 30 microns.
The method of drying is not particularly limited, and the drying method known to those skilled in the art may be used. In the present invention, drying in a drying tunnel is preferably used. The drying temperature is 60-150 ℃, and can be any value between 60, 70, 80, 90, 100, 110, 120, 130, 140, 150 or 60-150 ℃. Preferably 80 to 100 ℃.
The composite film comprises a circuit pattern area and an area outside the circuit pattern, wherein the area outside the circuit pattern of the composite film is covered with heat transfer glue, and then the circuit pattern is die-cut on the surface of the composite film;
wherein the thermal transfer adhesive is selected from EVA or TPU. The mode of coating the heat transfer adhesive is preferably a mode of roll-to-roll silk printing. The die cutting is preferably performed by a laser or a cutting die.
The specific shape of the circuit pattern is not particularly limited, in order to ensure that the heating film is a flexible heating film and is used for heating in the special-shaped heating body, a composite circuit formed by a strip-type conducting layer and a far infrared radiation layer is preferably adopted, and the strip is arranged in a mode of a back-shape, a square grid shape, an S shape or a spiral, or the strip is coiled according to the shape of the heating film, or a plurality of circuit patterns are arranged in series or in parallel.
In the present invention, the width of the strip is 0.1 to 20mm, may be any value between 0.1, 0.5, 1,2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, or 0.1 to 20mm, preferably 1 to 10mm, and the strip occupies 10% to 90% of the area of the heating film, may be any value between 10%, 20%, 30%, 40%, 50%, 60%, 70%, 80%, 90%, or 30% to 90%, preferably 40% to 70%. Preferably, to ensure uniformity, the strips are distributed as uniformly as possible in the heated film.
Then, coating a plastic film on the surface of the composite film, adhering the plastic film to the thermal transfer adhesive of the composite film, removing the plastic film, and discarding the area except the circuit pattern corresponding to the conducting layer and the far infrared radiation layer to obtain the circuit pattern formed by compounding the conducting layer and the far infrared radiation layer, which is coated on the surface of the low-viscosity substrate film;
When the plastic film is covered on the surface of the composite film, the plastic film is adhered with the heat transfer glue of the area except the circuit pattern, and when the plastic film is removed, the area except the circuit pattern corresponding to the conductive layer and the far infrared radiation layer is removed together with the plastic film.
Then, preparing an electrode transition layer on the circuit pattern, wherein the electrode transition layer is an electrode connection point and is used for connecting a heat conduction layer with a wire, the electrode transition layer is prepared by covering the surface of the circuit pattern with conductive paste and/or conductive adhesive tape, and the conductive paste is selected from silver paste, copper paste, carbon paste or nickel paste; the conductive adhesive tape is selected from conductive copper adhesive tape or conductive aluminum adhesive tape. In some embodiments of the invention, the electrode transition layers are disposed at both ends of the strip of the circuit pattern.
Then, a plastic film with electrode holes is compounded on one side of the electrode transition layer; the electrode holes correspond to the positions of the electrode transition layers. The plastic film is a plastic film with an adhesive layer, and the plastic film is selected from a PI film, a PET film, a PEN film, a PC film or a PVC film; the adhesive layer is selected from acrylic adhesive sticker, silica gel adhesive sticker or thermosetting adhesive layer. The thermosetting glue is selected from acrylic thermosetting glue or epoxy thermosetting glue.
And finally, removing the low-viscosity substrate film, covering a plastic film, cutting, and connecting a wire outlet to obtain the heating film. The connection mode is not particularly limited, and may be welding or riveting. The plastic film is as described above, and is not described herein.
In the present invention, the thickness of the plastic film on both sides of the heating film is 5 to 1000 micrometers, which may be 5, 10, 25, 50, 100, 150, 200, 250, 300, 350, 400, 450, 500, 600, 700, 800, 900, 1000, or any value between 5 to 1000 micrometers, preferably 50 to 200 micrometers.
The heating film prepared by the method provided by the invention has the application temperature of more than or equal to 100 ℃, and the structure of the heating film comprises the following components:
a circuit pattern formed by compounding the conductive layer and the far infrared radiation layer;
sealing insulating layers arranged on two sides of the circuit pattern;
The electrode transition layer is arranged between the infrared radiation layer and the sealing insulating layer, and electrode holes are formed in the surface of the sealing insulating layer arranged on one side of the infrared radiation layer and correspond to the positions of the electrode transition layer.
Specifically, the heating film structure provided by the invention comprises a conductive layer, wherein the conductive layer is selected from a metal conductive layer or a nonmetal conductive layer.
Preferably, the metal conductive layer is selected from aluminum foil, iron-chromium-aluminum alloy foil or stainless steel foil; the nonmetallic conductive layer is selected from carbon paper or graphene paper.
In the present invention, the thickness of the conductive layer is 1 to 1000 micrometers, may be 1, 5, 10, 15, 20, 25, 30, 35, 40, 45, 50, 60, 70, 80, 100, 200, 300, 400, 500, 600, 700, 800, 900, 1000, or any value between 1 to 1000 micrometers, and is preferably 5 to 500 micrometers.
The far infrared radiation layer is selected from a graphene layer, a carbon nano tube layer, a carbon layer or a far infrared ceramic layer. Preferably a graphene layer.
The thickness of the far infrared radiation layer is 5-100 micrometers, and can be 5, 10, 15, 20, 25, 30, 35, 40, 45, 50, 55, 60, 65, 70, 75, 80, 85, 90, 95, 100, or any value between 5-100 micrometers. Preferably 10 to 30 microns.
The specific shape of the circuit pattern is not particularly limited, and in order to ensure that the heating film is a flexible heating film and is used for heating in the special-shaped heating body, a composite circuit formed by a strip-type conductive layer and a far infrared radiation layer is preferably adopted, and the strip is arranged in a mode of a back-shape, a square lattice shape, an S shape or a spiral shape, or the strip is coiled according to the shape of the heating film, or a plurality of circuit patterns are arranged in series or in parallel.
In the present invention, the width of the strip is 0.1 to 20mm, may be any value between 0.1, 0.5, 1,2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, or 0.1 to 20mm, preferably 1 to 10mm, and the strip occupies 10% to 90% of the area of the heating film, may be any value between 10%, 20%, 30%, 40%, 50%, 60%, 70%, 80%, 90%, or 30% to 90%, preferably 40% to 70%. Preferably, to ensure uniformity, the strips are distributed as uniformly as possible in the heated film.
The heating film structure provided by the invention further comprises sealing insulating layers arranged on two sides of the circuit pattern; in the invention, the sealing insulating layer is selected from plastic films, the plastic films are plastic films with glue layers, and the plastic films are selected from PI films, PET films, PEN films, PC films or PVC films; the adhesive layer is selected from acrylic adhesive sticker, silica gel adhesive sticker or thermosetting adhesive layer. The thermosetting glue is selected from acrylic thermosetting glue or epoxy thermosetting glue. In the present invention, the thickness of the plastic film on both sides of the heating film is 5 to 1000 micrometers, which may be 5, 10, 25, 50, 100, 150, 200, 250, 300, 350, 400, 450, 500, 600, 700, 800, 900, 1000, or any value between 5 to 1000 micrometers, preferably 50 to 200 micrometers.
The heating film structure provided by the invention further comprises an electrode transition layer arranged between the infrared radiation layer and the sealing insulating layer, wherein the electrode transition layer is made of conductive materials, and can be silver, copper, nickel or carbon, or conductive copper adhesive tape or conductive aluminum adhesive tape. The thickness of the electrode transition layer is 1 to 1000 micrometers, and may be 1,5, 10, 15, 20, 25, 30, 35, 40, 45, 50, 60, 70, 80, 100, 200, 300, 400, 500, 600, 700, 800, 900, 1000, or any value between 1 to 1000 micrometers, preferably 10 to 500 micrometers, and more preferably 30 to 200 micrometers.
In the invention, the surface of the sealing insulating layer arranged on one side of the infrared radiation layer is provided with electrode holes, and the electrode holes correspond to the positions of the electrode transition layers. The lead is connected with the electrode transition layer through an electrode hole.
Referring to fig. 1, fig. 1 is a schematic structural view of a heating film with uniform far-infrared radiation according to the present invention. In fig. 1, 1 is a plastic film, 2 is a conductive layer, 3 is a far infrared radiation layer, 4 is an electrode transition layer, and 5 is an electrode hole.
The invention also provides a heating film patterning method with uniform far infrared radiation, which comprises the following steps:
a) Coating a conductive layer on a low-viscosity substrate film, coating far infrared radiation material slurry on the surface of the conductive layer, and drying to obtain a composite film of the low-viscosity substrate film/the conductive layer/the far infrared radiation layer;
b) The composite film comprises a circuit pattern area and an area except the circuit pattern, wherein the circuit pattern area of the composite film is covered with heat transfer glue, and then the circuit pattern is die-cut;
c) Coating a plastic film on the surface of the composite film, removing the low-viscosity base film, and discarding the area except the circuit pattern corresponding to the conducting layer and the far infrared radiation layer to obtain the circuit pattern formed by compounding the conducting layer and the far infrared radiation layer, which is coated on the surface of the plastic film;
d) And preparing an electrode transition layer on the circuit pattern, compounding a plastic film with electrode holes, cutting, and connecting outgoing lines to obtain the heating film.
The invention first covers a conductive layer onto a low-adhesion base film, in which the conductive layer is selected from metallic conductive layers or non-metallic conductive layers.
Preferably, the metal conductive layer is selected from aluminum foil, iron-chromium-aluminum alloy foil or stainless steel foil; the nonmetallic conductive layer is selected from carbon paper or graphene paper.
In the present invention, the thickness of the conductive layer is 1 to 1000 micrometers, may be 1, 5, 10, 15, 20, 25, 30, 35, 40, 45, 50, 60, 70, 80, 100, 200, 300, 400, 500, 600, 700, 800, 900, 1000, or any value between 1 to 1000 micrometers, and is preferably 5 to 500 micrometers.
The low-viscosity substrate film is a plastic film with an adhesive layer, and the plastic film is selected from a PI film, a PET film, a PEN film, a PC film or a PVC film; the adhesive layer is selected from acrylic adhesive sticker or silica gel adhesive sticker.
The present invention is not particularly limited in the lamination manner, and preferably a roll-to-roll manner of laminating the metal conductive layer onto the low-adhesion base film.
Then, the surface of the conducting layer is coated with far infrared radiation material sizing agent, and the composite film of the low-viscosity substrate film/the conducting layer/the far infrared radiation layer is obtained after drying.
Wherein the far infrared radiation material slurry is selected from graphene slurry, carbon nanotube slurry, carbon slurry or far infrared ceramic slurry. Preferably a graphene slurry.
The thickness of the obtained far infrared radiation layer is 5-100 micrometers, and can be any value between 5, 10, 15, 20, 25, 30, 35, 40, 45, 50, 55, 60, 65, 70, 75, 80, 85, 90, 95, 100 or 5-100 micrometers. Preferably 10 to 30 microns.
The method of drying is not particularly limited, and the drying method known to those skilled in the art may be used. In the present invention, drying in a drying tunnel is preferably used. The drying temperature is 60-150 ℃, and can be any value between 60, 70, 80, 90, 100, 110, 120, 130, 140, 150 or 60-150 ℃. Preferably 80 to 100 ℃.
The composite film comprises a circuit pattern area and an area outside the circuit pattern, wherein the surface of a far infrared radiation layer of the circuit pattern area of the composite film is covered with heat transfer glue, and then the circuit pattern is die-cut;
wherein the thermal transfer adhesive is selected from EVA or TPU. The mode of coating the heat transfer adhesive is preferably a mode of roll-to-roll silk printing. The die cutting is preferably performed by a laser or a cutting die.
The specific shape of the circuit pattern is not particularly limited, in order to ensure that the heating film is a flexible heating film and is used for heating in the special-shaped heating body, a composite circuit formed by a strip-type conducting layer and a far infrared radiation layer is preferably adopted, and the strip is arranged in a mode of a back-shape, a square grid shape, an S shape or a spiral, or the strip is coiled according to the shape of the heating film, or a plurality of circuit patterns are arranged in series or in parallel.
In the present invention, the width of the strip is 0.1 to 20 mm, may be any value between 0.1, 0.5, 1,2,3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, or 0.1 to 20 mm, and the strip occupies 10% to 90% of the area of the heating film, may be any value between 10%, 20%, 30%, 40%, 50%, 60%, 70%, 80%, 90%, or 30% to 90%, and preferably 40% to 70%. Preferably, to ensure uniformity, the strips are distributed as uniformly as possible in the heated film.
Then, coating a plastic film on the surface of the composite film, removing the low-viscosity base film, and discarding the area except the circuit pattern corresponding to the conducting layer and the far infrared radiation layer to obtain the circuit pattern formed by compounding the conducting layer and the far infrared radiation layer, which is coated on the surface of the plastic film;
Wherein the plastic film is selected from PI film, PET film, PEN film, PC film or PVC film. The plastic film is adhered to the circuit pattern by the heat transfer adhesive on the surface of the far infrared radiation layer.
At the same time of removing the low-viscosity base film, the area outside the circuit pattern corresponding to the conductive layer and the far infrared radiation layer is removed.
And preparing an electrode transition layer on the circuit pattern, compounding a plastic film with electrode holes, cutting, and connecting outgoing lines to obtain the heating film.
Preparing an electrode transition layer on the circuit pattern, wherein the electrode transition layer is an electrode connection position and is used for connecting a heat conduction layer with a wire, the electrode transition layer is prepared by covering the surface of the circuit pattern with conductive paste and/or conductive adhesive tape, and the conductive paste is selected from silver paste, copper paste, carbon paste or nickel paste; the conductive adhesive tape is selected from conductive copper adhesive tape or conductive aluminum adhesive tape. In some embodiments of the invention, the electrode transition layers are disposed at both ends of the strip of the circuit pattern.
Then, a plastic film with electrode holes is compounded on one side of the electrode transition layer; the electrode holes correspond to the positions of the electrode transition layers. The plastic film is as described above, and is not described herein. The plastic film is a plastic film with an adhesive layer, and the plastic film is selected from a PI film, a PET film, a PEN film, a PC film or a PVC film; the adhesive layer is selected from acrylic adhesive, silica gel adhesive and hot melt adhesive. The hot melt adhesive is selected from EVA or TPU. The glue layer is preferably a hot melt glue layer.
In the present invention, the thickness of the plastic film on both sides of the heating film is 5 to 1000 micrometers, which may be 5, 10, 25, 50, 100, 150, 200, 250, 300, 350, 400, 450, 500, 600, 700, 800, 900, 1000, or any value between 5 to 1000 micrometers, preferably 50 to 200 micrometers.
And finally, cutting the obtained composite film, and connecting an outgoing line to obtain the heating film. The connection mode is not particularly limited, and may be welding or riveting.
The application temperature of the heating film prepared by the method provided by the invention is less than 100 ℃, and the structure of the heating film comprises the following components:
a circuit pattern formed by compounding the conductive layer and the far infrared radiation layer;
A sealing insulating layer arranged on one side of the conductive layer;
the electrode transition layer is arranged between the conducting layer and the sealing insulating layer, and an electrode hole is formed in the surface of the sealing insulating layer arranged on one side of the conducting layer, and corresponds to the position of the electrode transition layer;
The plastic film is arranged on one side of the far infrared radiation layer, and a glue layer is arranged between the far infrared radiation layer and the plastic film.
Specifically, the heating film structure provided by the invention comprises a conductive layer, wherein the conductive layer is selected from a metal conductive layer or a nonmetal conductive layer.
Preferably, the metal conductive layer is selected from aluminum foil, iron-chromium-aluminum alloy foil or stainless steel foil; the nonmetallic conductive layer is selected from carbon paper or graphene paper.
In the present invention, the thickness of the conductive layer is 1 to 1000 micrometers, may be 1, 5, 10, 15, 20, 25, 30, 35, 40, 45, 50, 60, 70, 80, 100, 200, 300, 400, 500, 600, 700, 800, 900, 1000, or any value between 1 to 1000 micrometers, and is preferably 5 to 500 micrometers.
The far infrared radiation layer is selected from a graphene layer, a carbon nano tube layer, a carbon layer or a far infrared ceramic layer. Preferably a graphene layer.
The thickness of the far infrared radiation layer is 5-100 micrometers, and can be 5, 10, 15, 20, 25, 30, 35, 40, 45, 50, 55, 60, 65, 70, 75, 80, 85, 90, 95, 100, or any value between 5-100 micrometers. Preferably 10 to 30 microns.
The specific shape of the circuit pattern is not particularly limited, and in order to ensure that the heating film is a flexible heating film and is used for heating in the special-shaped heating body, a composite circuit formed by a strip-type conductive layer and a far infrared radiation layer is preferably adopted, and the strip is arranged in a mode of a back-shape, a square lattice shape, an S shape or a spiral shape, or the strip is coiled according to the shape of the heating film, or a plurality of circuit patterns are arranged in series or in parallel.
In the present invention, the width of the strip is 0.1 to 20 mm, may be any value between 0.1, 0.5, 1,2,3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, or 0.1 to 20 mm, and the strip occupies 10% to 90% of the area of the heating film, may be any value between 10%, 20%, 30%, 40%, 50%, 60%, 70%, 80%, 90%, or 30% to 90%, and preferably 40% to 70%. Preferably, to ensure uniformity, the strips are distributed as uniformly as possible in the heated film.
The heating film structure provided by the invention further comprises a sealing insulating layer arranged on one side of the conducting layer. In the invention, the sealing insulating layer is selected from plastic films, the plastic films are plastic films with glue layers, and the plastic films are selected from PI films, PET films, PEN films, PC films or PVC films; the adhesive layer is selected from acrylic adhesive sticker, silica gel adhesive sticker or thermosetting adhesive layer. The hot melt adhesive is selected from EVA or TPU. In the present invention, the thickness of the plastic film on both sides of the heating film is 5 to 1000 micrometers, which may be 5, 10, 25, 50, 100, 150, 200, 250, 300, 350, 400, 450, 500, 600, 700, 800, 900, 1000, or any value between 5 to 1000 micrometers, preferably 50 to 200 micrometers.
The heating film structure provided by the invention further comprises an electrode transition layer arranged between the conductive layer and the sealing insulating layer, wherein the electrode transition layer is made of conductive materials, and can be silver, copper, nickel or carbon, or conductive copper adhesive tape or conductive aluminum adhesive tape. The thickness of the electrode transition layer is 1 to 1000 micrometers, may be 1,5, 10, 15, 20, 25, 30, 35, 40, 45, 50, 60, 70, 80, 100, 200, 300, 400, 500, 600, 700, 800, 900, 1000, or any value between 1 to 1000 micrometers, preferably 10 to 500 micrometers, and more preferably 30 to 200 micrometers.
In the invention, the surface of the sealing insulating layer arranged on one side of the conducting layer is provided with electrode holes, and the electrode holes correspond to the positions of the electrode transition layers. The lead is connected with the electrode transition layer through an electrode hole.
The heating film structure provided by the invention further comprises a plastic film arranged on one side of the far infrared radiation layer, and a glue layer is arranged between the far infrared radiation layer and the plastic film. The plastic film is selected from PI film, PET film, PEN film, PC film or PVC film; the adhesive layer is preferably a hot melt adhesive layer selected from EVA or TPU.
Referring to fig. 2, fig. 2 is a schematic structural view of a heating film with uniform far-infrared radiation according to the present invention. In fig. 2, 1 is a plastic film, 2 is a conductive layer, 3 is a far infrared radiation layer, 4 is an electrode transition layer, 5 is an electrode hole, 6 is a glue layer, and 7 is a hot melt adhesive film.
The sealing insulating layer in the product is the plastic film in the preparation method.
In the present invention, the circuit patterns are uniformly arranged in the heating film, and the entire circuit pattern is electrically conducted.
In the present invention, the design of the circuit pattern is specifically: after the heating resistance is determined according to the product requirement, the ratio of the width to the length of the heating strip can be obtained through the ratio of the heating resistance to the sheet resistance of the material. And the shape and pattern of the material are designed into corresponding widths and gaps of the heating strips.
The invention uses the method of coating the far infrared heating coating on the conductive metal or nonmetal, and the die-cutting patterning means is adopted to ensure that the conductive metal or nonmetal has proper resistance and is uniformly distributed in the double-layer plastic film so as to uniformly heat the double-layer plastic film. The conductive metal or nonmetal plays a role of conducting a circuit and heating, and far infrared radiation slurry such as graphene and the like coated on the upper surface is used for radiating far infrared rays, so that the heat radiation capability of the product is enhanced and the far infrared rays are radiated. Enhancing the heat radiation capability of the product. And the heating layer is packaged in the plastic film, so that the heating layer can be protected from being scratched and oxidized.
The processing method of the heating film provided by the invention can correspond to the heating films with different use temperatures, and the metal heating film without far infrared radiation can also have the capability of patterning the special-shaped piece under the method, so that the heating film can generate heat uniformly, and can adapt to the requirements of various special-shaped pieces.
In order to further understand the present invention, the patterning method of the heating film with uniform far-infrared radiation provided by the present invention is described below with reference to examples, and the scope of the present invention is not limited by the following examples.
Example 1 heating film use temperature greater than 100℃
1. Preparation method
(1) Laminating a 10-micrometer-thick aluminum foil roll-to-roll on a PET silica gel 5g adhesive low-viscosity PET adhesive film;
(2) Coating graphene slurry on an aluminum foil, and drying to form a graphene film with the thickness of 12 micrometers;
(3) Silk-screen printing white heat transfer printing slurry on the aluminum foil part without circuit pattern by using a silk-screen printer;
(4) The required heating circuit pattern is cut by laser die cutting, so that the printing area and the non-printing area of the thermal transfer printing glue are separated;
(5) Silk screen printing silver paste and conducting copper tape are stuck on the electrode as an electrode transition layer;
(6) Roll-to-roll heat-sealing the aluminum foil printed with the heat transfer printing onto a 50-micrometer-thick PET plastic film at 100 ℃;
(7) Tearing the PET plastic film to take away waste materials, and leaving the electrode patterns on the PET silica gel low-viscosity adhesive film;
(8) A PI acrylic acid thermosetting adhesive film with electrode holes is formed by hot-pressing 120-degree single face of an aluminum foil electrode pattern;
(9) Tearing off the PET silica gel low-viscosity adhesive film, and then covering a 100-micrometer PI acrylic thermosetting film on the other surface;
(10) Cutting out the shape;
(11) And (5) riveting a wire outlet.
2. Heating film structure
Referring to fig. 3, fig. 3 is a schematic structural view of the high temperature heating film prepared in example 1. In fig. 3, 1 is PI thermosetting adhesive, 2 is aluminum foil, 3 is graphene far-infrared radiation layer, 4 is conductive silver paste+conductive copper tape, and 5 is electrode hole.
The pattern of the heating circuit is formed by coiling electrode strips with the width of 3mm according to an S shape, the distance between the adjacent electrode strips is 3mm, the resistance of the electrode strips is 4.23 ohms, the electrode strips occupy 55% of the area of the heating film, and the final stable temperature of the heating film is 150 ℃. Temperature is measured on the curve part and the straight line of the inner line and the outer line, the measured temperature is stabilized at about 150 ℃, and the temperature difference of a heating area is not more than 5 ℃.
Example 2-heating film use temperature less than 100℃
1. Preparation method
(1) Wrapping a graphene paper roll pair with a sheet resistance of 20 ohms and a thickness of 23 micrometers on a PET acrylic 5g adhesive force low-adhesive film;
(2) Coating graphene slurry on graphene paper, and drying to form a graphene far infrared radiation layer with the thickness of 10 micrometers;
(3) Roll-to-roll screen printing thermal transfer paste (hot melt adhesive) on a part of the surface of the graphene far infrared radiation layer, which needs electrode patterns;
(4) Cutting the needed heating filament pattern by using a cutting die;
(5) Thermally laminating the conductive material printed with the thermal transfer printing on the PET plastic film from roll to roll;
(6) Tearing the plastic film leaves the desired circuit pattern while the low-adhesive film takes away the waste (i.e., the portion outside the circuit pattern);
(7) Silk screen printing silver paste at two ends of a strip of the electrode pattern as an electrode transition layer;
(8) A 125-micrometer PET plastic hot melt adhesive film with electrode holes formed in a single-sided hot pressing mode, wherein the electrode holes correspond to the positions of the electrode transition layers;
(9) Cutting out the shape;
(10) And (5) welding the outgoing line.
2. Heating film structure
Referring to fig. 4, fig. 4 is a schematic structural view of the heating eyeshade prepared in example 2. In fig. 4, 1 is a PET hot melt adhesive film, 2 is graphene paper, 3 is a graphene far infrared radiation layer, 4 is conductive silver paste, and 5 is an electrode hole.
The outer dimension of the eyeshade is 165 x 62mm, the width of the electrode strips of the heating circuit is 4.4mm, the distance between the adjacent electrode strips is 3.6mm, the heating area occupies 50% of the total area, and the total resistance is 7 ohms. And measuring the temperature on the curve part and the straight line of the inner line and the outer line, wherein the final stable temperature is 60 ℃, and the temperature difference of a heating area is not more than 2 ℃.
Comparative example
The graphene heating eyeshade produced by Rowa-way intelligent clothing graphene in Taobao net is driven by 5V under the suspension condition, the temperature of the inner edge of an arc is 48 ℃, the temperature of the outer edge of the arc is 37 ℃, and the temperature difference between heating areas is 11 ℃.
The existing carbon graphene heating films basically use silver paste electrodes or copper electrodes as conductive electrodes, and graphene or carbon nanotubes and other materials as heating areas, so that the technology can uniformly heat in rectangular heating areas, but special-shaped pieces can only be stacked in rectangular mode or in arc electrode mode. However, the arc electrode cannot generate heat uniformly, the outer edge of the arc is cooler than the inner edge of the arc electrode, and the temperature difference can even reach 11 ℃.
Claims (10)
1. A heating film patterning method with uniform far-infrared radiation, comprising the steps of:
A) Coating a conductive layer on a low-viscosity substrate film, coating far infrared radiation material slurry on the surface of the conductive layer, and drying to obtain a composite film of the low-viscosity substrate film/the conductive layer/the far infrared radiation layer;
B) The composite film obtained in the step A) comprises a circuit pattern and an area outside the circuit pattern, heat transfer glue is covered on the area outside the circuit pattern of the composite film, and then the circuit pattern is die-cut on the surface of the composite film;
C) Coating a plastic film on the surface of the composite film obtained in the step B), and removing the plastic film and the area outside the circuit pattern corresponding to the conducting layer and the far infrared radiation layer adhered on the plastic film to obtain the circuit pattern formed by compounding the conducting layer and the far infrared radiation layer, which is coated on the surface of the low-adhesion base film;
d) Preparing an electrode transition layer on the circuit pattern obtained in the step C), and compounding a plastic film with electrode holes;
e) And (3) removing the low-viscosity substrate film, covering a plastic film, cutting, and connecting a wire outlet to obtain the heating film.
2. A heating film patterning method with uniform far-infrared radiation, comprising the steps of:
a) Coating a conductive layer on a low-viscosity substrate film, coating far infrared radiation material slurry on the surface of the conductive layer, and drying to obtain a composite film of the low-viscosity substrate film/the conductive layer/the far infrared radiation layer;
b) The composite film obtained in the step a) comprises a circuit pattern area and an area except the circuit pattern, heat transfer glue is covered on the circuit pattern area of the composite film, and then the circuit pattern is die-cut;
c) Coating a plastic film on the surface of the composite film obtained in the step b), removing the low-viscosity base film, and discarding the area except the circuit pattern corresponding to the conducting layer and the far infrared radiation layer to obtain the circuit pattern formed by compounding the conducting layer and the far infrared radiation layer, which is coated on the surface of the plastic film;
d) And c) preparing an electrode transition layer on the circuit pattern obtained in the step c), compounding a plastic film with electrode holes, cutting, and connecting outgoing lines to obtain the heating film.
3. The method according to claim 1 or 2, wherein the conductive layer is selected from a metallic conductive layer or a non-metallic conductive layer.
4. A method according to claim 3, wherein the metallic conductive layer is selected from aluminium foil, iron chromium aluminium alloy foil or stainless steel foil;
The nonmetallic conductive layer is selected from carbon paper or graphene paper.
5. The method according to claim 1 or 2, wherein the far-infrared radiation material slurry is selected from a graphene slurry, a carbon nanotube slurry, a carbon slurry or a far-infrared ceramic slurry.
6. The method according to claim 1 or 2, wherein the low-adhesion base film is a plastic film with a glue layer, the plastic film being selected from PI film, PET film, PEN film, PC film or PVC film; the adhesive layer is selected from acrylic adhesive or silica gel adhesive.
7. The method according to claim 1 or 2, wherein the thermal transfer glue is selected from EVA or TPU.
8. The method according to claim 1 or 2, wherein the electrode transition layer is prepared by coating a circuit pattern surface with a conductive paste and/or a conductive tape, the conductive paste being selected from silver paste, copper paste, carbon paste or nickel paste; the conductive adhesive tape is selected from conductive copper adhesive tape or conductive aluminum adhesive tape.
9. The method according to claim 1 or 2, wherein the plastic film is a plastic film with a glue layer, the plastic film being selected from PI film, PET film, PEN film, PC film or PVC film; the adhesive layer is selected from acrylic adhesive, silica gel adhesive, hot melt adhesive or thermosetting adhesive layer.
10. The method of claim 9, wherein the hot melt adhesive is selected from EVA or TPU and the thermoset adhesive is selected from an acrylic thermoset adhesive or an epoxy thermoset adhesive.
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