CN118305043B - PCB (printed circuit board) dispensing equipment and using method thereof - Google Patents
PCB (printed circuit board) dispensing equipment and using method thereof Download PDFInfo
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- CN118305043B CN118305043B CN202410736798.XA CN202410736798A CN118305043B CN 118305043 B CN118305043 B CN 118305043B CN 202410736798 A CN202410736798 A CN 202410736798A CN 118305043 B CN118305043 B CN 118305043B
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- glue
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- dispensing gun
- circuit board
- paving blocks
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- 238000000034 method Methods 0.000 title claims abstract description 21
- 239000003292 glue Substances 0.000 claims abstract description 149
- 238000006073 displacement reaction Methods 0.000 claims abstract description 30
- 230000005540 biological transmission Effects 0.000 claims abstract description 28
- 238000003892 spreading Methods 0.000 abstract description 25
- 230000007480 spreading Effects 0.000 abstract description 25
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 230000008569 process Effects 0.000 description 7
- 238000009792 diffusion process Methods 0.000 description 5
- 238000001125 extrusion Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 238000004513 sizing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Abstract
The invention relates to the technical field of PCB circuit board production, and discloses a PCB circuit board dispensing device and a using method thereof, wherein the device comprises: a conveyor; a dispensing gun mounted on the assembly box; paving blocks; the three-axis displacement platform drives the glue dispensing gun to descend to the PCB circuit board on the backing plate, the spreading blocks are contacted with the PCB circuit board firstly, then the glue dispensing gun drives a plurality of spreading blocks to gather together through the transmission assembly when continuously descending, after glue dispensing, the glue dispensing gun ascends and drives a plurality of spreading blocks to spread through the transmission assembly, contaminated glue can be spread, glue is immediately and automatically spread after glue dispensing is realized, when the glue dispensing quantity is large, the problem that extruded water-drop glue is accumulated at the glue dispensing position, and glue is unevenly distributed when an electronic element is adhered is avoided, and the glue can be spread without shaking the PCB circuit board, so that the stability of clamping of the PCB circuit board is not influenced, the spread range of the glue is the spread range of a spreading block spreading path, and the glue can not flow out of the glue dispensing range.
Description
Technical Field
The invention relates to the technical field of PCB circuit board production, in particular to a PCB circuit board dispensing device and a using method thereof.
Background
A printed circuit board, also called a printed wiring board, is an important electronic component, is a support for electronic components, and is a carrier for electrical connection of the electronic components. Because it is made by adopting electronic printing technology, it is called "printed" circuit board, and in the course of actual production it is required to make the printed circuit board undergo the process of sizing treatment, on one hand, it can be used for adhering circuit, on the other hand, it can possess the goal of preventing moisture and insulating.
The PCB circuit board dispensing equipment mainly comprises a dispensing valve, a pressure tank, a pipeline system, a control system, an operation panel and the like, glue is heated in the dispensing valve and extruded on the PCB circuit board through a glue gun, but when a large amount of glue is dispensed, extruded glue is piled in a water drop shape at a dispensing position and cannot be uniformly spread, when a to-be-adhered element is placed, the glue is extruded to be piled at a glue overflow dispensing position, the area of the glue which is extruded and spread is irregular, glue at the dispensing position is unevenly distributed, and the electronic element is not firmly adhered.
Aiming at the technical problems, the applicant has searched some prior arts to realize spreading out the extruded glue, for example, the patent publication number is CN117861955A, the main technical means is that the printed circuit board is fixed by a clamping mechanism, the position of a glue gun is adjusted by numerical control, the specific position of the printed circuit board is glued, then an electric hydraulic rod is started to make the electric hydraulic rod shake around repeatedly by the sliding plate with the printed circuit board, the glue above the electric hydraulic rod is subjected to shaking-up treatment, the glue is thinned and the smearing area is increased, and the applicant analyzes that: the PCB circuit board dispensing equipment has the advantages that the clamping part and the circuit board can relatively move when the circuit board is shaken, so that the clamping is loose, the circuit board can be dropped and damaged when glue is shaken and dispersed, the shaking glue fluidity is uncontrollable, and the glue is easy to flow out of the glue dispensing position.
Disclosure of Invention
The invention aims to provide a PCB (printed Circuit Board) dispensing device and a using method thereof, aiming at the defects of the prior art, so as to solve the technical problems that the PCB is easy to fall down and the glue flows out of a dispensing range when glue is shaken and scattered.
The aim of the invention can be achieved by the following technical scheme:
A PCB circuit board dispensing apparatus comprising:
The conveyor is rotatably provided with a plurality of conveying rollers and is used for conveying a base plate, and a PCB circuit board is limited on the base plate;
The dispensing gun is arranged on the assembly box, and the assembly box is driven by a triaxial displacement table arranged on the conveyor base to perform triaxial movement; and
The paving blocks are circumferentially distributed and slidably mounted on the assembly box, the paving blocks are arranged below the dispensing gun, and the paving blocks are connected with the transmission assembly; when the glue dispensing gun descends, the paving blocks firstly contact the PCB, and when the glue dispensing gun descends continuously, the transmission assembly drives the paving blocks to gather together until the glue dispensing gun stops descending and extrudes glue, and the glue pile covers the paving blocks; when the glue dispensing gun rises after glue is extruded, the transmission assembly drives the paving blocks to spread.
As a further scheme of the invention: the transmission assembly includes:
The splicing table is sleeved outside the dispensing gun and is in sliding fit with the dispensing gun, and the splicing table is connected with the assembly box through an elastic piece;
the bottoms of the connecting rods are respectively connected with the paving blocks, the connecting rods are slidably arranged on the splicing table, and each connecting rod is provided with a groove; and
The push rods are fixed on the outer wall of the dispensing gun, the push rods penetrate through the grooves respectively, the push rods are in sliding fit with the grooves, the push rods are obliquely distributed, and the extending directions of the push rods are downwards diffused along the axial direction of the dispensing gun.
As a further scheme of the invention: the groove is provided with a first inclined plane, the push rod is provided with a second inclined plane, and the second inclined plane is clung to the first inclined plane; when the dispensing gun descends relative to the connecting rod, the push rod descends, the second inclined plane and the first inclined plane slide relatively, and the connecting rod is driven to be close to the axis of the dispensing gun.
As a further scheme of the invention: one end of the push rod is fixed on the outer wall of the dispensing gun, a gap is reserved between the other end of the push rod and the dispensing gun, a limiting block is arranged at the end, far away from the dispensing gun, of the push rod, and the position of the limiting block interferes with the moving path of the connecting rod.
As a further scheme of the invention: when a plurality of the paving blocks are gathered, a flow passage is formed between two adjacent paving blocks.
As a further scheme of the invention: and the top of each paving block is provided with a pulling block.
The application method of the PCB circuit board dispensing equipment is applied to the PCB circuit board dispensing equipment, and comprises the following steps:
Step S1: placing the PCB circuit board on the backing plate, conveying the backing plate bearing the PCB circuit board to the lower part of the dispensing gun through a conveyor, and stopping conveying by the conveyor;
step S2: the triaxial displacement platform drives the dispensing gun to descend towards the PCB circuit board on the backing plate until the paving block below the dispensing gun contacts the PCB circuit board;
step S3: the three-axis displacement table drives the dispensing gun to continuously descend, and the dispensing gun drives the plurality of paving blocks to gather through the transmission assembly until the dispensing gun descends to the dispensing height;
step S4: the glue dispensing gun extrudes water-drop-shaped glue at a glue dispensing position on the PCB, and covers a plurality of flat blocks, and glue in a runner between adjacent flat blocks flows and spreads;
Step S5: the three-axis displacement table drives the glue dispensing gun to ascend, the glue dispensing gun drives the paving blocks to spread through the transmission assembly, and the paving blocks spread glue until the glue dispensing gun ascends to drive the paving blocks to ascend away from the PCB;
Step S6: the three-axis displacement table drives the dispensing gun to continuously ascend, the paving blocks synchronously ascend, the conveyor is started simultaneously, the PCB circuit board after dispensing is sent away, the next PCB circuit board to be dispensed is conveyed to the position below the dispensing gun, and then the conveyor stops conveying.
As a further scheme of the invention: the step S3 specifically comprises the following steps:
Step S31: the triaxial displacement platform drives the dispensing gun to continuously descend, the assembly box synchronously descends and slides relatively with the splicing platform, the elastic piece stretches, the push rod synchronously descends and slides relatively with the groove, and the connecting rod is driven to be close to the axis of the dispensing gun;
Step S32: when the dispensing gun is lowered to the dispensing height, the dispensing gun stops descending, at the moment, the plurality of paving blocks are in a gathering state, and a runner is formed between the adjacent paving blocks.
The invention has the beneficial effects that:
(1) According to the invention, the three-axis displacement platform drives the glue dispensing gun to descend towards the PCB circuit board on the backing plate, the spreading blocks firstly contact the PCB circuit board, then the glue dispensing gun drives the spreading blocks to gather together through the transmission assembly when the glue dispensing gun descends continuously, the glue dispensing gun ascends and drives the spreading blocks to spread through the transmission assembly after glue dispensing, so that contaminated glue can be spread, glue can be immediately and automatically spread after glue dispensing is realized, the problem that when the glue dispensing amount is large, extruded water-drop glue is accumulated at the glue dispensing position, uneven glue distribution is caused when an electronic element is pasted is avoided, the glue can be spread without shaking the PCB circuit board, the clamping stability of the PCB circuit board is not influenced, the spread range of the glue is the spread range of the spreading block spreading path, and the glue can not flow out of the glue dispensing range;
(2) In the invention, after the glue extrusion is finished, the glue dispensing gun is lifted to drive the assembly box to lift relative to the splicing table, the plurality of connecting rods drive the plurality of paving blocks to be in a diffusion state until the distance between the splicing table and the assembly box is minimum, at the moment, the distance between the plurality of paving blocks is maximum, and the limiting block is tightly attached to the connecting rods so as to limit the diffusion ranges of the connecting rods and the paving blocks and prevent the paving blocks from diffusing electronic elements near a larger error contact glue range;
(3) According to the invention, the runners between the spreading blocks in the gathered state are utilized, so that part of glue flows in the narrow runners for a long distance during dispensing, and then the spread runners are matched with the spreading blocks to spread part of glue which is stained by the spreading blocks, so that the extruded glue is spread rapidly after bonding the dispensing during dispensing.
Drawings
The invention is further described below with reference to the accompanying drawings.
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view of the structure of the backing plate of the present invention;
FIG. 3 is a schematic view of the dispensing gun of the present invention;
FIG. 4 is a schematic view of the transmission assembly of the present invention;
FIG. 5 is a schematic diagram of the relationship between the connecting rod and the groove in the present invention;
FIG. 6 is a schematic view of a partial enlarged structure at A of FIG. 5 in accordance with the present invention;
FIG. 7 is a schematic view of a stopper according to the present invention;
FIG. 8 is a schematic view of the flow channel structure of the present invention;
fig. 9 is a schematic diagram of the structure of the tear-off block according to the present invention.
In the figure: 1. a conveyor; 2. a backing plate; 3. a triaxial displacement table; 4. assembling a box; 5. dispensing gun; 6. paving a flat block; 7. a transmission assembly; 701. a splicing table; 702. an elastic member; 703. a connecting rod; 704. a groove; 705. a push rod; 706. a first inclined surface; 707. a second inclined surface; 708. a limiting block; 8. a flow passage; 9. pulling the block; 10. and a limit column.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1-7, the present invention is a dispensing device for a PCB circuit board, comprising:
The conveyor 1 is rotatably provided with a plurality of conveying rollers for conveying a base plate 2, and a PCB circuit board is limited on the base plate 2;
A dispensing gun 5 mounted on the assembly box 4, and the assembly box 4 is driven to perform triaxial movement by a triaxial displacement table 3 mounted on the base of the conveyor 1; and
The paving blocks 6 are circumferentially distributed and slidably mounted on the assembly box 4, the paving blocks 6 are arranged below the dispensing gun 5, and the paving blocks 6 are connected with the transmission assembly 7; when the dispensing gun 5 descends, the paving blocks 6 firstly contact the PCB circuit board, and when the dispensing gun 5 continues to descend, the transmission assembly 7 drives the paving blocks 6 to gather together until the dispensing gun 5 stops descending and extrudes glue, and the glue pile covers the paving blocks 6; when the glue dispensing gun 5 rises after extruding the glue, the transmission assembly 7 drives the paving blocks 6 to spread.
The distance between the dispensing gun 5 and the PCB is the dispensing distance, namely, when the dispensing gun 5 is positioned at the dispensing height, the dispensing gun 5 stops descending; be provided with a plurality of spacing posts 10 that are used for fixing a position the PCB circuit board on backing plate 2, can make the PCB circuit board be spacing on backing plate 2.
In one case of this embodiment, the assembling box 4 is internally provided with a dispensing valve, a pressure tank, a pipeline system, a control system, an operation panel and other structures, which are all in the prior art, and the triaxial displacement table 3 is not improved, so that specific mechanical structures and circuit structures of the assembling box are not required to be disclosed, and the integrity of the assembling box is not affected; the conveyor 1 is provided with a limiting plate for limiting the placement position of the backing plates 2, so that a plurality of backing plates 2 can be conveyed along the same conveying path, which is the prior art, and the application does not improve the same, so that the specific mechanical structure and circuit structure of the conveyor are not required to be disclosed, and the integrity of the conveyor is not affected.
In practical application, the PCB circuit board is placed on the base plate 2, the base plate 2 carrying the PCB circuit board is conveyed to the lower part of the dispensing gun 5 through the conveyor 1, the conveyor 1 stops conveying, then the three-axis displacement table 3 drives the dispensing gun 5 to descend towards the PCB circuit board on the base plate 2 until the paving block 6 below the dispensing gun 5 contacts the PCB circuit board, then the three-axis displacement table 3 drives the dispensing gun 5 to continuously descend, the dispensing gun 5 drives the plurality of paving blocks 6 to gather through the transmission component 7 until the dispensing gun 5 descends to the dispensing height, and in the process, the height of the paving blocks 6 is not changed any more because the paving blocks 6 are in contact with the PCB circuit board, and the assembly box 4 and the dispensing gun 5 descend synchronously; then the glue dispensing gun 5 extrudes water-drop glue at the glue dispensing position on the PCB circuit board and covers a plurality of spreading blocks 6, after the glue extrusion is finished, the three-axis displacement table 3 drives the glue dispensing gun 5 to ascend, the glue dispensing gun 5 drives the spreading blocks 6 to spread through the transmission component 7, the glue is spread out by the spreading blocks 6 until the glue dispensing gun 5 ascends to drive the spreading blocks 6 to lift away from the PCB circuit board, the glue can be automatically spread out immediately after the glue dispensing is realized in the process, the problem that the extruded water-drop glue is accumulated at the glue dispensing position to cause uneven glue distribution when the electronic component is adhered is avoided, the glue can be spread out without shaking the PCB circuit board, the clamping stability of the PCB circuit board is not influenced, the spread range of the glue is the spread path range of the spreading blocks 6, and the glue can not flow out of the glue dispensing range; finally, the triaxial displacement platform 3 drives the dispensing gun 5 to continuously ascend, the paving blocks 6 synchronously ascend, the conveyor 1 is started simultaneously, the PCB circuit board after dispensing is sent away, the next PCB circuit board to be dispensed is conveyed to the position below the dispensing gun 5, and then the conveyor 1 stops conveying.
As shown in fig. 3 to 7, as a preferred embodiment of the present invention, the transmission assembly 7 includes:
The splicing table 701 is sleeved outside the dispensing gun 5, the dispensing gun 5 is in sliding fit with the splicing table 701, and the splicing table 701 is connected with the assembly box 4 through an elastic piece 702;
the bottoms of the connecting rods 703 are respectively connected with the paving blocks 6, the connecting rods 703 are slidably arranged on the splicing table 701, and grooves 704 are formed in each connecting rod 703; and
The push rods 705, a plurality of the push rods 705 are all fixed on the outer wall of the dispensing gun 5, and a plurality of the push rods 705 respectively penetrate through a plurality of grooves 704, the push rods 705 are in sliding fit with the grooves 704, the push rods 705 are obliquely distributed, and the extending directions of the push rods 705 are downwards diffused along the axial direction of the dispensing gun 5.
The elastic member 702 may be a spring as shown in fig. 3, or may be replaced by other elastic members, such as a silica gel column, a spring plate, etc., which are not limited in this embodiment.
In one case of the present embodiment, a first inclined surface 706 is disposed on the groove 704, a second inclined surface 707 is disposed on the push rod 705, and the second inclined surface 707 is closely attached to the first inclined surface 706; when the dispensing gun 5 descends relative to the connecting rod 703, the push rod 705 descends, and the second inclined plane 707 slides relative to the first inclined plane 706, and drives the connecting rod 703 to approach the axis of the dispensing gun 5.
In practical application, when the triaxial displacement platform 3 drives the glue dispensing gun 5 to descend and drives the flat block 6 to descend to contact with the PCB circuit board, in the process that the glue dispensing gun 5 continues to descend, the heights of the flat block 6 and the splicing platform 701 are not changed any more, the assembling box 4 and the glue dispensing gun 5 descend synchronously, relative sliding occurs between the assembling box 4 and the splicing platform 701, the elastic piece 702 stretches, the push rod 705 descends synchronously, relative sliding occurs between the second inclined plane 707 and the first inclined plane 706, and further, relative sliding between the push rod 705 and the groove 704 is realized, so that the connecting rod 703 translates in a direction close to the axis of the glue dispensing gun 5, and the flat blocks 6 move in a direction close to the axis of the glue dispensing gun 5 in a gathering state; similarly, when the glue extrusion is finished, the triaxial displacement table 3 drives the glue dispensing gun 5 to rise, the assembly box 4 is reset relative to the splicing table 701 until the elastic piece 702 returns to an initial state, in the process, the push rod 705 rises, the second inclined plane 707 and the first inclined plane 706 reversely slide relatively, the connecting rod 703 is pushed away from the axis of the glue dispensing gun 5, the plurality of paving blocks 6 move in the direction away from the axis of the glue dispensing gun 5 and are in a diffusion state, so that the contaminated glue can be piled and pulled, the glue is prevented from being accumulated at the glue dispensing position, the glue is automatically and quickly paved after the glue dispensing is realized, and the PCB circuit board does not need to be rocked; and then, when the triaxial displacement platform 3 drives the dispensing gun 5 to continuously ascend, the plurality of paving blocks 6 are driven to synchronously ascend so as to reset and wait for the next dispensing.
As shown in fig. 4 to 7, as a preferred embodiment of the present invention, one end of the push rod 705 is fixed on the outer wall of the dispensing gun 5, a gap is formed between the other end of the push rod 705 and the dispensing gun 5, a stop block 708 is disposed at the end of the push rod 705 away from the dispensing gun 5, and the position of the stop block 708 interferes with the moving path of the connecting rod 703.
In practical application, after the glue extrusion is finished, the glue dispensing gun 5 is lifted to drive the assembly box 4 to lift relative to the assembly table 701, and the plurality of connecting rods 703 drive the plurality of flat blocks 6 to be in a diffusion state until the distance between the assembly table 701 and the assembly box 4 is minimum, at this time, the distance between the plurality of flat blocks 6 is maximum, and the limiting block 708 is tightly attached to the connecting rods 703 so as to limit the diffusion range of the connecting rods 703 and the flat blocks 6 and prevent the flat blocks 6 from diffusing electronic elements near the larger error contact glue range.
As shown in fig. 7-9, as a preferred embodiment of the present invention, when a plurality of the paving blocks 6 are gathered, a flow passage 8 is formed between two adjacent paving blocks 6.
In practical application, when the glue dispensing gun 5 extrudes water-drop glue at the glue dispensing position on the PCB circuit board, part of glue covers a plurality of paving blocks 6, part of glue flows into gaps between adjacent paving blocks 6, namely, part of glue flows rapidly along the flow channel 8, compared with the mode of directly extruding glue at the glue dispensing position, the mode can prevent the extruded glue from accumulating at one point, and the extrusion process is dispersed as much as possible, the glue dispensing coverage surface is increased, then part of glue adhered to the paving blocks 6 is dispersed when the paving blocks are dispersed, the glue flows far in the flow channel 8, and after the bonding glue dispensing is realized, the extruded glue is paved rapidly.
As shown in fig. 7-9, as a preferred embodiment of the invention, the top of each of the paving blocks 6 is provided with a tear-off piece 9.
In one case of this embodiment, one end of the pull block 9 is fixed to the link 703, and the other end thereof is lower than the end; in practical application, in the process of spreading glue by spreading the paving blocks 6, the tearing blocks 9 can pull the glue higher than the top surface of the paving blocks 6, so that the uniformity of glue paving is improved.
Referring to fig. 1-9, the present invention is a method for using a dispensing device for a PCB circuit board, where the method is applied to the dispensing device for a PCB circuit board according to the foregoing embodiment, and the method includes the following steps:
Step S1: placing the PCB circuit board on the backing plate 2, conveying the backing plate 2 bearing the PCB circuit board to the lower part of the dispensing gun 5 through the conveyor 1, and stopping conveying by the conveyor 1;
step S2: the triaxial displacement platform 3 drives the dispensing gun 5 to descend towards the PCB circuit board on the backing plate 2 until the paving block 6 below the dispensing gun 5 contacts the PCB circuit board;
Step S3: the triaxial displacement platform 3 drives the dispensing gun 5 to continuously descend, and the dispensing gun 5 drives the plurality of paving blocks 6 to gather together through the transmission assembly 7 until the dispensing gun 5 descends to the dispensing height;
step S4: the glue dispensing gun 5 extrudes water-drop-shaped glue at a glue dispensing position on the PCB, and covers a plurality of paving blocks 6, and glue in a runner 8 between adjacent paving blocks 6 flows and spreads;
Step S5: the triaxial displacement platform 3 drives the dispensing gun 5 to ascend, the dispensing gun 5 drives the paving blocks 6 to spread through the transmission component 7, and the paving blocks 6 spread glue until the dispensing gun 5 ascends to drive the paving blocks 6 to ascend away from the PCB circuit board;
step S6: the triaxial displacement platform 3 drives the point gum gun 5 to continuously rise, and a plurality of paving blocks 6 rise synchronously, and simultaneously the conveyer 1 starts, and the PCB circuit board after the point gum is lifted off, and the PCB circuit board to be next point gum is conveyed to the position below the point gum gun 5, and then the conveyer 1 stops conveying.
As shown in fig. 1 to 9, as a preferred embodiment of the present invention, the step S3 specifically includes the following steps:
Step S31: the triaxial displacement platform 3 drives the dispensing gun 5 to continuously descend, so that the assembly box 4 descends synchronously, slides relatively to the splicing platform 701, stretches the elastic piece 702, descends synchronously with the push rod 705, slides relatively to the groove 704, and drives the connecting rod 703 to be close to the axis of the dispensing gun 5;
Step S32: when the dispensing gun 5 is lowered to the dispensing height, the dispensing gun stops descending, at this time, the plurality of paving blocks 6 are in a gathered state, and a runner 8 is formed between the adjacent paving blocks 6.
The working principle of the invention is as follows: according to the dispensing equipment for the PCB and the use method thereof provided by the embodiment of the invention, the three-axis displacement table 3 drives the dispensing gun 5 to descend to the PCB on the backing plate 2, the spreading blocks 6 are firstly contacted with the PCB, then the dispensing gun 5 drives the spreading blocks 6 to gather together through the transmission assembly 7 when continuously descending, the dispensing gun 5 ascends after dispensing and drives the spreading blocks 6 to spread through the transmission assembly 7, so that contaminated glue can be spread out, the glue can be automatically spread immediately after dispensing, the problem that the glue is unevenly distributed when the dispensing amount is large due to the fact that extruded water-drop glue is accumulated at the dispensing position is avoided, the glue can be spread without shaking the PCB, the clamping stability of the PCB is not influenced, the spread range of the glue is the spread path range of the spreading blocks 6, and the glue can not flow out of the dispensing range.
The foregoing describes one embodiment of the present invention in detail, but the description is only a preferred embodiment of the present invention and should not be construed as limiting the scope of the invention. All equivalent changes and modifications within the scope of the present invention are intended to be covered by the present invention.
Claims (8)
1. PCB circuit board dispensing equipment, its characterized in that includes:
the conveyor (1) is rotatably provided with a plurality of conveying rollers and is used for conveying a base plate (2), and a PCB circuit board is limited on the base plate (2);
the dispensing gun (5) is arranged on the assembly box (4), and the assembly box (4) is driven by a triaxial displacement table (3) arranged on the base of the conveyor (1) to perform triaxial movement; and
The paving blocks (6) are circumferentially distributed, and are slidably mounted on the assembly box (4), the paving blocks (6) are arranged below the dispensing gun (5), and the paving blocks (6) are connected with the transmission assembly (7); when the glue dispensing gun (5) descends, the paving blocks (6) are firstly contacted with the PCB, and when the glue dispensing gun (5) continues to descend, the plurality of paving blocks (6) are driven to gather together through the transmission assembly (7) until the glue dispensing gun (5) stops descending and extrudes glue, and the glue pile covers the paving blocks (6); when the glue dispensing gun (5) rises after extruding glue, the transmission assembly (7) drives the paving blocks (6) to spread.
2. A PCB board dispensing device according to claim 1, characterized in that the transmission assembly (7) comprises:
The splicing table (701) is sleeved outside the dispensing gun (5), the dispensing gun (5) is in sliding fit with the splicing table (701), and the splicing table (701) is connected with the assembly box (4) through an elastic piece (702);
The bottom of the connecting rods (703) is respectively connected with the paving blocks (6), the connecting rods (703) are slidably arranged on the splicing table (701), and grooves (704) are formed in each connecting rod (703); and
The push rods (705), a plurality of push rods (705) are all fixed on the outer wall of the dispensing gun (5), and a plurality of push rods (705) penetrate through a plurality of grooves (704) respectively, the push rods (705) are in sliding fit with the grooves (704), the push rods (705) are obliquely distributed, and the extending directions of the push rods (705) are downwards diffused along the axial direction of the dispensing gun (5).
3. The device for dispensing a PCB according to claim 2, wherein a first inclined surface (706) is provided on the groove (704), a second inclined surface (707) is provided on the push rod (705), and the second inclined surface (707) is closely attached to the first inclined surface (706); when the dispensing gun (5) descends relative to the connecting rod (703), the push rod (705) descends, the second inclined plane (707) and the first inclined plane (706) slide relatively, and the connecting rod (703) is driven to be close to the axis of the dispensing gun (5).
4. The device for dispensing a PCB according to claim 2, wherein one end of the push rod (705) is fixed on the outer wall of the dispensing gun (5), a gap is formed between the other end of the push rod and the dispensing gun (5), a limiting block (708) is arranged at the end of the push rod (705) far away from the dispensing gun (5), and the position of the limiting block (708) interferes with the moving path of the connecting rod (703).
5. A PCB board dispensing apparatus according to claim 1, characterized in that when several of the paving blocks (6) are gathered, a flow channel (8) is formed between two adjacent paving blocks (6).
6. A PCB board dispensing apparatus according to claim 1, characterized in that the top of each of the paving blocks (6) is provided with a tear-off block (9).
7. The application method of the PCB circuit board dispensing equipment is characterized in that the method is applied to the PCB circuit board dispensing equipment as set forth in any one of the claims 1-6, and the method comprises the following steps:
step S1: placing the PCB circuit board on the backing plate (2), conveying the backing plate (2) carrying the PCB circuit board to the lower part of the dispensing gun (5) through the conveyor (1), and stopping conveying by the conveyor (1);
step S2: the triaxial displacement platform (3) drives the dispensing gun (5) to descend towards the PCB circuit board on the backing plate (2) until the paving block (6) below the dispensing gun (5) contacts the PCB circuit board;
Step S3: the triaxial displacement platform (3) drives the dispensing gun (5) to continuously descend, and the dispensing gun (5) drives the plurality of paving blocks (6) to gather through the transmission assembly (7) until the dispensing gun (5) descends to the dispensing height;
Step S4: the glue dispensing gun (5) extrudes water-drop-shaped glue at a glue dispensing position on the PCB, and covers a plurality of paving blocks (6), and glue in a runner (8) between adjacent paving blocks (6) flows and spreads;
Step S5: the triaxial displacement table (3) drives the dispensing gun (5) to ascend, the dispensing gun (5) drives the paving blocks (6) to diffuse through the transmission assembly (7), and the paving blocks (6) spread glue until the dispensing gun (5) ascends to drive the paving blocks (6) to ascend away from the PCB circuit board;
Step S6: the triaxial displacement platform (3) drives the point gum gun (5) to continuously rise, a plurality of paving blocks (6) synchronously rise, meanwhile, the conveyor (1) is started, the PCB circuit board after the point gum is sent away, the next PCB circuit board to be point gum is conveyed to the position below the point gum gun (5), and then the conveyor (1) stops conveying.
8. The method of using a dispensing device for a PCB according to claim 7, wherein the step S3 specifically includes the steps of:
Step S31: the triaxial displacement platform (3) drives the dispensing gun (5) to continuously descend, the assembly box (4) descends synchronously and slides relatively with the splicing platform (701), the elastic piece (702) stretches, the push rod (705) descends synchronously and slides relatively with the groove (704), and the connecting rod (703) is driven to be close to the axis of the dispensing gun (5);
step S32: when the dispensing gun (5) descends to the dispensing height, the dispensing gun stops descending, at the moment, the plurality of paving blocks (6) are in a gathering state, and a flow passage (8) is formed between the adjacent paving blocks (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113617599A (en) * | 2020-05-09 | 2021-11-09 | 应永武 | Automatic glue spreader |
| CN115090480A (en) * | 2022-06-29 | 2022-09-23 | 泰州皇牌医疗器械科技有限公司 | Dispensing laminating device for mask production and technological method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| GB0805023D0 (en) * | 2008-03-18 | 2008-04-16 | Renishaw Plc | Apparatus and method for fluid dispensing |
| CN215843943U (en) * | 2021-09-28 | 2022-02-18 | 苏州俪濠智能科技有限公司 | Glue dispensing machine capable of dispensing glue uniformly |
| CN218013779U (en) * | 2022-08-11 | 2022-12-13 | 吴宇婧 | Dispensing equipment |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113617599A (en) * | 2020-05-09 | 2021-11-09 | 应永武 | Automatic glue spreader |
| CN115090480A (en) * | 2022-06-29 | 2022-09-23 | 泰州皇牌医疗器械科技有限公司 | Dispensing laminating device for mask production and technological method thereof |
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