CN118282407A - Temperature digital-to-analog conversion method, device, equipment and multichannel temperature sampling device - Google Patents
Temperature digital-to-analog conversion method, device, equipment and multichannel temperature sampling device Download PDFInfo
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Abstract
The invention discloses a temperature digital-to-analog conversion method, a temperature digital-to-analog conversion device, temperature digital-to-analog conversion equipment and a multichannel temperature sampling device. The method comprises the following steps: acquiring a plurality of digital voltage temperature information and a plurality of temperature information; performing element changing processing on the digital voltage temperature information to output digital voltage temperature processing information; wherein the magnitude of the digital voltage temperature processing information is one magnitude; establishing a temperature-voltage model according to a plurality of digital voltage temperature processing information and a plurality of temperature information; carrying out Taylor expansion processing on the temperature-voltage model to determine a temperature-voltage optimization model; and determining real-time temperature information according to the real-time digital voltage temperature information and the reference analog voltage based on the temperature-voltage optimization model. The scheme realizes the improvement of the operation speed and the precision of temperature digital-to-analog conversion.
Description
Technical Field
The present invention relates to the field of temperature acquisition technologies, and in particular, to a temperature digital-to-analog conversion method, a device, an apparatus, and a multichannel temperature sampling device.
Background
With the arrival of the Internet of things age, various sensors play important roles in different fields. Taking a temperature sensor as an example, in the living of the home, the temperature in the room can be controlled well, so that the living is more comfortable; the temperature sampling is not separated from the industries in the industrial field, and the equipment failure can be caused by too high or too low temperature.
At present, each temperature sensor is distributed at different positions to be monitored, converts temperature information into an electric signal, and then transmits the electric signal to an information processor, and finally displays the electric signal in a digital form; because of the need of multi-path temperature sampling in most scenes, higher requirements are put on the speed and the accuracy of temperature information processing of an information processor.
The temperature processing speed refers to the speed of analyzing and responding to the acquired temperature information by the system. At present, when the temperature of an information processor is used for temperature information processing, the problems of low sampling speed and sampling precision and large occupied register space exist.
Disclosure of Invention
The invention provides a temperature digital-to-analog conversion method, a device, equipment and a multichannel temperature sampling device, which are used for improving the operation speed and the accuracy of temperature digital-to-analog conversion.
In a first aspect, an embodiment of the present invention provides a temperature digital-to-analog conversion method, including:
acquiring a plurality of digital voltage temperature information and a plurality of temperature information;
performing element changing processing on the digital voltage temperature information to output digital voltage temperature processing information; wherein the magnitude of the digital voltage temperature processing information is one magnitude;
Establishing a temperature-voltage model according to a plurality of digital voltage temperature processing information and a plurality of temperature information;
Carrying out Taylor expansion processing on the temperature-voltage model to determine a temperature-voltage optimization model;
And determining real-time temperature information according to the real-time digital voltage temperature information and the reference analog voltage based on the temperature-voltage optimization model.
In a second aspect, an embodiment of the present invention further provides a temperature digital-to-analog conversion device, where the chip includes:
The acquisition module is used for acquiring a plurality of digital voltage temperature information and a plurality of temperature information;
The processing module is used for performing element conversion processing on the digital voltage temperature information to output digital voltage temperature processing information; wherein the magnitude of the digital voltage temperature processing information is one magnitude;
The model building module is used for building a temperature-voltage model according to the plurality of digital voltage temperature processing information and the plurality of temperature information;
The optimization model building module is used for carrying out Taylor expansion processing on the temperature-voltage model to determine a temperature-voltage optimization model;
And the real-time temperature determining module is used for determining real-time temperature information according to the real-time digital voltage temperature information and the reference analog voltage based on the temperature-voltage optimizing model.
In a third aspect, an embodiment of the present invention further provides an electronic device, including:
at least one processor; and a memory communicatively coupled to the at least one processor; wherein,
The memory stores a computer program executable by the at least one processor to enable the at least one processor to perform the temperature digital-to-analog conversion method of the first aspect.
In a fourth aspect, an embodiment of the present invention further provides a multi-channel temperature sampling apparatus, including: at least one temperature acquisition module, at least one multi-way check module and the electronic equipment of the third aspect; each temperature acquisition module is arranged in one-to-one correspondence with the multi-path check module; the temperature acquisition module comprises at least one temperature acquisition unit;
Each temperature acquisition unit is electrically connected with each input end of the multi-path check module; the output end of the multi-way check module is electrically connected with any input end of the electronic equipment; the output ends of the multiple check modules are in one-to-one correspondence with the input ends of the electronic equipment;
The temperature acquisition unit is used for acquiring an analog temperature voltage signal of an object to be measured; the temperature acquisition module is used for sending each analog temperature and voltage signal to the multi-path check module;
The multi-path check module is used for controlling each analog temperature and voltage signal to be sequentially output to any input end of the electronic equipment through a single output end according to a switching channel control instruction;
The electronic equipment is used for converting each analog temperature voltage signal output by the single output end of the multi-path check module and outputting a real-time temperature signal.
Optionally, the multiple check module comprises a check switch chip;
each input end of the check switch chip is electrically connected with each output end of the temperature acquisition unit; the switching channel control end of the check switch chip is used for receiving a switching channel control instruction; the output end of the check switch chip is electrically connected with any input end of the electronic equipment.
Optionally, the multiple check module further includes a voltage adapting unit;
The output end of the check switch chip is electrically connected with the first input end of the voltage adapting unit; the second input end of the voltage adapting unit is electrically connected with the output end of the voltage adapting unit; the output end of the voltage adapting unit is electrically connected with any input end of the electronic equipment.
Optionally, the voltage adapting unit includes a voltage follower, a first current limiting resistor and a first filter capacitor;
The first input end of the voltage follower is electrically connected with the output end of the check switch chip; the second input end of the voltage follower is electrically connected with the output end of the voltage follower; the output end of the voltage follower is electrically connected with the first end of the first current limiting resistor; the second end of the first current limiting resistor is electrically connected with the first end of the first filter capacitor and any input end of the electronic equipment; the second end of the first filter capacitor is grounded.
Optionally, the temperature acquisition unit comprises an NTC resistor, a first voltage dividing resistor and a second voltage dividing resistor;
The first end of the NTC resistor is electrically connected with the first end of the first voltage dividing resistor and the first end of the second voltage dividing resistor; the second end of the first voltage dividing resistor is electrically connected with a voltage source; the second end of the second voltage dividing resistor is electrically connected with any input end of the check switch chip.
According to the embodiment of the invention, a plurality of digital voltage temperature information and a plurality of temperature information are obtained; performing element changing processing on the digital voltage temperature information to output digital voltage temperature processing information; establishing a temperature-voltage model according to a plurality of digital voltage temperature processing information and a plurality of temperature information; carrying out Taylor expansion processing on the temperature-voltage model to determine a temperature-voltage optimization model; based on the temperature-voltage optimization model, real-time temperature information is determined according to real-time digital voltage temperature information and reference analog voltage, so that the operation speed and the accuracy of temperature digital-analog conversion are improved through the temperature-voltage optimization model.
Drawings
Fig. 1 is a flowchart of a temperature digital-to-analog conversion method according to an embodiment of the present invention;
FIG. 2 is a data table of a plurality of digital voltage temperature information (AD values) corresponding to a plurality of temperature ranges (-40 ℃ -105 ℃) of temperature measurement of the NTC thermistor with 12-bit sampling precision and 3V reference analog voltage;
FIG. 3 is a data table of a plurality of digital voltage temperature information (AD values) corresponding to a plurality of temperature ranges (-40 ℃ -105 ℃) of temperature measurement of the NTC thermistor with the sampling precision of 16 bits and the reference analog voltage of 3V;
FIG. 4 is a data table of a plurality of digital voltage temperature processing information corresponding to a plurality of temperature ranges (-40 ℃ -105 ℃) of temperature measurement of the NTC thermistor with 12-bit sampling precision and 3V reference analog voltage;
FIG. 5 is a data table of a plurality of digital voltage temperature processing information corresponding to a plurality of temperature ranges (-40 ℃ -105 ℃) of temperature measurement of the NTC thermistor with the sampling precision of 16 bits and the reference analog voltage of 3V;
Fig. 6 is a schematic structural diagram of a temperature digital-to-analog conversion device according to an embodiment of the present invention;
Fig. 7 is a schematic structural diagram of an electronic device according to an embodiment of the present invention;
Fig. 8 is a schematic structural diagram of a multi-channel temperature sampling device according to an embodiment of the present invention;
fig. 9 is a schematic diagram of a specific structure of a multi-channel temperature sampling apparatus according to an embodiment of the present invention;
Fig. 10 is a schematic diagram of a part of a circuit structure of a multi-channel temperature sampling device according to an embodiment of the present invention.
Detailed Description
The invention is described in further detail below with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting thereof. It should be further noted that, for convenience of description, only some, but not all of the structures related to the present invention are shown in the drawings.
Fig. 1 is a flowchart of a temperature digital-to-analog conversion method provided in an embodiment of the present invention, where the embodiment is applicable to determining a real-time analog temperature condition, and the method may be performed by a temperature digital-to-analog conversion device, and specifically includes the following steps:
s110, acquiring a plurality of digital voltage temperature information and a plurality of temperature information;
Wherein the plurality of temperature information are all temperature information in a temperature range of the NTC thermistor; the NTC temperature measuring temperature ranges from-40 ℃ to 105 ℃; the digital voltage temperature information is digital voltage temperature information corresponding to the analog voltage temperature information output by the NTC thermistor through voltage conversion; the digital voltage temperature information is determined according to sampling precision, reference analog voltage and output analog voltage temperature information of the NTC thermistor through voltage conversion; in some embodiments, FIG. 2 is a data table of a plurality of digital voltage temperature information (AD values) corresponding to a plurality of temperature ranges (-40 ℃ -105 ℃) for NTC thermistor temperature measurement with a sampling precision of 12 bits and a reference analog voltage of 3V; as shown in fig. 2, the sampling precision is 12 bits, the reference analog voltage is 3V, and then the plurality of digital voltage temperature information is the specific digital quantity voltage temperature information in 0-4096;
In other embodiments, FIG. 3 is a data table of a plurality of digital voltage temperature information (AD values) corresponding to a plurality of temperature ranges (-40 ℃ -105 ℃) for temperature measurement of the NTC thermistor with a sampling precision of 16 bits and a reference analog voltage of 3V; as shown in fig. 3, when the sampling precision is 16 bits and the reference analog voltage is 3V, the plurality of digital voltage temperature information is the specific digital quantity voltage temperature information within 0-65536.
S120, performing element changing processing on the plurality of digital voltage temperature information to output a plurality of digital voltage temperature processing information; wherein the digital voltage temperature process information is on the order of one order of magnitude.
The method comprises the steps of performing element replacement processing on a plurality of digital voltage temperature information, so that the magnitude of the digital voltage temperature processing information is one magnitude, the temperature-voltage model parameter weight established by the digital voltage temperature processing information and the temperature information can be further reduced, and less storage space is occupied;
Specifically, in some embodiments, fig. 4 is a data table of a plurality of digital voltage temperature processing information corresponding to a plurality of temperature ranges (-40 ℃ -105 ℃) in which the sampling precision is 12 bits, the reference analog voltage is 3v, and the ntc thermistor is used for measuring temperature; as shown in fig. 4, the plurality of digital voltage processing information is data information obtained by performing a conversion process on the plurality of digital voltage information, that is, dividing each digital voltage information by 1000 to obtain each digital voltage processing information, so that the magnitude of each digital voltage processing information is one magnitude;
In other embodiments, FIG. 5 is a data table of a plurality of digital voltage temperature processing information corresponding to a plurality of temperature ranges (-40 ℃ -105 ℃) for temperature measurement of the NTC thermistor with a sampling precision of 16 bits and a reference analog voltage of 3V; as shown in fig. 5, the plurality of digital voltage processing information is data information obtained by performing a meta-conversion process on the plurality of digital voltage information, that is, dividing each digital voltage information by 10000 to obtain each digital voltage processing information, so that the magnitude of each digital voltage processing information is one magnitude.
S130, a temperature-voltage model is built according to the digital voltage temperature processing information and the temperature information.
The method comprises the steps of carrying out point drawing fitting on a curve according to a plurality of digital voltage temperature processing information and a plurality of temperature information, so as to establish a temperature-voltage model; the temperature-voltage model is a mathematical model, which may be a multiple function, or a discrete function, as examples; compared with the prior art, the temperature-voltage model is directly built according to the plurality of digital voltage temperature information and the plurality of temperature information; the parameter weight in the temperature-voltage model established according to the digital voltage temperature processing information and the temperature information is smaller, less storage space is occupied, and the precision is higher.
Specifically, in some embodiments, with continued reference to fig. 4, when the sampling precision is 12 bits and the reference analog voltage is 3V, a temperature-voltage model may be established according to the plurality of digital voltage temperature processing information and the plurality of temperature information, where:
Specifically, in other embodiments, with continued reference to fig. 5, when the sampling precision is 16 bits and the reference analog voltage is 3V, a temperature-voltage model may be established according to the plurality of digital voltage temperature processing information and the plurality of temperature information, where:
s140, carrying out Taylor expansion processing on the temperature-voltage model to determine a temperature-voltage optimization model;
Wherein the taylor expansion process is a mathematical tool, and taylor expansion is used to simplify complex dynamic system models; by means of the Taylor expansion process, parameters in the temperature-voltage model are further reduced, the complexity of the mathematical model is further reduced, and therefore the temperature-voltage model is simplified to determine a temperature-voltage optimization model, so that less storage space is further occupied, and the accuracy is further higher;
Specifically, in some embodiments, fig. 4 further illustrates a temperature-voltage optimization model (a) with a sampling precision of 12 bits and a reference analog voltage of 3V, and with continued reference to fig. 4, the temperature-voltage optimization model (a) is a model for taylor expansion of the above formula (1), where a general procedure of taylor expansion is:
the temperature-voltage optimization model (a) obtained by taylor expansion of the above formula (1) is:
Obviously, the original temperature-voltage optimization model is determined by performing taylor expansion on the original temperature-voltage model according to the plurality of digital voltage temperature information and the plurality of temperature information (see model b in fig. 2), and the original temperature-voltage optimization model is as follows:
the mathematical model (a) is further reduced in complexity compared to;
In other embodiments, fig. 5 further illustrates a temperature-voltage optimization model (c) with a sampling accuracy of 16 bits and a reference analog voltage of 3V, and with continued reference to fig. 5, the temperature-voltage optimization model (c) is a model for taylor expansion of the above formula (2), and the general procedure of taylor expansion is as follows:
the temperature-voltage optimization model (c) obtained by taylor expansion of the above equation (2) is:
Obviously, the original temperature-voltage optimization model is determined by performing taylor expansion on the original temperature-voltage model according to the plurality of digital voltage temperature information and the plurality of temperature information (see model d in fig. 3), and the original temperature-voltage optimization model is as follows:
the mathematical model (c) is further reduced in complexity compared to the prior art.
S150, determining real-time temperature information according to the real-time digital voltage temperature information based on the temperature-voltage optimization model.
The real-time digital voltage temperature information is determined according to the reference analog voltage, the real-time acquired analog voltage temperature information and the sampling precision, and then the real-time temperature information is determined according to the real-time digital voltage temperature information based on a temperature-voltage optimization model; because parameters in the temperature-voltage optimization model are fewer, the mathematical model is lower in complexity, so that the speed of determining the real-time temperature information according to the real-time digital voltage temperature information and the reference analog voltage is improved, and the operation precision of temperature digital-analog conversion is also improved.
The embodiment of the invention also provides a temperature digital-to-analog conversion device, and the temperature digital-to-analog conversion device can execute the temperature digital-to-analog conversion method provided by any embodiment of the invention, and has the corresponding functional modules and beneficial effects of the execution method. Fig. 6 is a schematic structural diagram of a temperature digital-to-analog conversion device according to an embodiment of the present invention; as shown in fig. 6, the temperature digital-to-analog conversion includes:
The acquisition module 01 is used for acquiring a plurality of digital voltage temperature information and a plurality of temperature information;
The processing module 02 is used for performing element conversion processing on the plurality of digital voltage temperature information to output a plurality of digital voltage temperature processing information; wherein the magnitude of the digital voltage temperature processing information is one magnitude;
A model building module 03, configured to build a temperature-voltage model according to the plurality of digital voltage temperature processing information and the plurality of temperature information;
the optimizing model establishing module 04 is used for carrying out Taylor expansion processing on the temperature-voltage model to determine a temperature-voltage optimizing model;
The real-time temperature determining module 05 is used for determining real-time temperature information according to the real-time digital voltage temperature information based on the temperature-voltage optimizing model.
Based on the same inventive concept, embodiments of the present invention further provide an electronic device, and fig. 7 is a schematic structural diagram of an electronic device provided by embodiments of the present invention, and fig. 7 shows a schematic structural diagram of an electronic device 001 that may be used to implement embodiments of the present invention, the electronic device is intended to represent various forms of digital computers, such as a laptop computer, a desktop computer, a workstation, a personal digital assistant, a server, a blade server, a mainframe computer, and other suitable computers. Electronic equipment may also represent various forms of mobile devices, such as personal digital processing, cellular telephones, smartphones, wearable devices (e.g., helmets, glasses, watches, etc.), and other similar computing devices. The components shown herein, their connections and relationships, and their functions, are meant to be exemplary only, and are not meant to limit implementations of the inventions described and/or claimed herein.
As shown in fig. 7, the electronic device 001 includes at least one processor 11, and a memory such as a Read Only Memory (ROM) 12, a Random Access Memory (RAM) 13, etc. communicatively connected to the at least one processor 11, wherein the memory stores a computer program executable by the at least one processor, and the processor 11 can perform various appropriate actions and processes according to the computer program stored in the Read Only Memory (ROM) 12 or the computer program loaded from the storage unit 18 into the Random Access Memory (RAM) 13. In the Random Access Memory (RAM) 13, various programs and data required for the operation of the electronic device 001 can also be stored. The processor 11, read Only Memory (ROM) 12 and Random Access Memory (RAM) 13 are connected to each other by a bus 14. An input/output (I/O) interface 15 is also connected to bus 14.
A plurality of components in the electronic device 001 are connected to an input/output (I/O) interface 15, including: an input unit 16 such as a keyboard, a mouse, etc.; an output unit 17 such as various types of displays and the like; a storage unit 18 such as a magnetic disk, an optical disk, or the like; and a communication unit 19 such as a network card, modem, wireless communication transceiver, etc. The communication unit 19 allows the electronic device 001 to exchange information/data with other devices via a computer network such as the internet and/or various telecommunication networks.
The processor 11 may be a variety of general and/or special purpose processing components having processing and computing capabilities. Some examples of processor 11 include, but are not limited to, a Central Processing Unit (CPU), a Graphics Processing Unit (GPU), various specialized Artificial Intelligence (AI) computing chips, various processors running machine learning model algorithms, digital Signal Processors (DSPs), and any suitable processor, controller, microcontroller, etc. The processor 11 performs the various methods and processes described above, such as the temperature digital-to-analog conversion method.
In some embodiments, the temperature digital-to-analog conversion method may be implemented as a computer program tangibly embodied on a computer-readable storage medium, such as the storage unit 18. In some embodiments, part or all of the computer program may be loaded and/or installed onto the electronic device 001 via Read Only Memory (ROM) 12 and/or communication unit 19. When the computer program is loaded into Random Access Memory (RAM) 13 and executed by processor 11, one or more steps of the temperature digital-to-analog conversion method described above may be performed. Alternatively, in other embodiments, the processor 11 may be configured to perform the temperature calculation method in any other suitable way (e.g., by means of firmware).
Various implementations of the systems and techniques described here above may be implemented in digital electronic circuitry, integrated circuit systems, field Programmable Gate Arrays (FPGAs), application Specific Integrated Circuits (ASICs), application Specific Standard Products (ASSPs), systems On Chip (SOCs), load programmable logic devices (CPLDs), computer hardware, firmware, software, and/or combinations thereof. These various embodiments may include: implemented in one or more computer programs, the one or more computer programs may be executed and/or interpreted on a programmable system including at least one programmable processor, which may be a special purpose or general-purpose programmable processor, that may receive data and instructions from, and transmit data and instructions to, a storage system, at least one input device, and at least one output device.
The embodiment of the invention also provides a multi-channel temperature sampling device, and fig. 8 is a schematic structural diagram of the multi-channel temperature sampling device provided by the embodiment of the invention, as shown in fig. 8, the device comprises: at least one temperature acquisition module 10, at least one multiple check module 20, and an electronic device 001 performing the above-described embodiments; each temperature acquisition module 10 is arranged in one-to-one correspondence with each multi-path check module 20; the temperature acquisition module 10 comprises at least one temperature acquisition unit 100;
Each temperature acquisition unit 100 is electrically connected with each input end of the multi-way check module 20; the output end of the multi-way check module 20 is electrically connected with any input end of the electronic equipment 001; the output ends of the multiple check modules 20 are in one-to-one correspondence with the input ends of the electronic equipment 001;
The temperature acquisition unit 100 is used for acquiring an analog temperature voltage signal of an object to be measured; the temperature acquisition module 10 is used for sending each analog temperature and voltage signal to the multi-path check module 20;
The multiple check module 20 is configured to control each analog temperature voltage signal to be sequentially output to any input end of the electronic device 001 through a single output end according to the switching channel control instruction;
The electronic device 001 is configured to convert each analog temperature voltage signal output by a single output terminal of the multiple check module to output each digital temperature voltage signal, and output a real-time temperature signal based on each digital temperature voltage signal.
The switching channel control instruction is a signal for controlling the switching channel; the multiple check module 20 can integrate multiple analog temperature and voltage signals into a single output end to be output to any input end of the electronic device 001 according to the control instruction of the switching channel, so that the amplification of the number of channels can be realized by controlling the switching channel.
In addition, when the period of the control switching channel is larger than the conversion period of each analog temperature voltage signal, the voltage output by a single output end can be ensured to be stable and reliable; the electronic device 001 comprises a plurality of inputs, i.e. a plurality of sampling channels; this embodiment is not particularly limited.
In this embodiment, the amplification of the channel number is implemented by each level of multiple check module 20, so that each analog temperature and voltage signal at each single output end of each level of multiple check module 20 is output to multiple input ends of the electronic device 001, and thus, the temperature sampling of the whole multiple channels is implemented by the multiple check module 20 and the electronic device 001; in addition, the electronic device 001 can execute the temperature digital-to-analog conversion method of the above embodiment, which has the effect of the above embodiment, and when each analog temperature voltage signal is converted into each digital temperature voltage signal, the speed and accuracy of converting each digital temperature voltage signal into real-time temperature information can be improved.
Optionally, on the basis of the foregoing embodiment, each module is further thinned, and fig. 9 is a schematic specific structural diagram of a multi-channel temperature sampling device provided by the embodiment of the present invention; as shown in fig. 9, the multiple check module 20 includes a check switch chip 21; each input end of the check switch chip 21 is electrically connected with each output end of the temperature acquisition unit 100; a switching channel control end CD of the check switch chip 21 for receiving a switching channel control instruction; the output of the check switch chip 21 is electrically connected to any one of the inputs of the electronic device 001. The check switch chip 21 can integrate multiple analog temperature voltage signals into a single output terminal to be output to any input terminal of the electronic device 001 according to the switching channel control command. The check switch chip 21 may be of the type SN74LV4051AD.
Optionally, as shown in fig. 9, the multiple check module 20 further includes a voltage adapting unit 22; the output end of the check switch chip 21 is electrically connected with the first input end of the voltage adapting unit 22; a second input terminal of the voltage adaptation unit 22 is electrically connected to an output terminal of the voltage adaptation unit 22; the output of the voltage adaptation unit 22 is electrically connected to any one of the inputs of the electronic device 001. The multiple check module 20 further includes a voltage adapting unit 22, where the voltage adapting unit 22 may perform impedance matching, so as to improve the load capacity.
Optionally, fig. 10 is a schematic diagram of a part of a circuit structure of a multi-channel temperature sampling device according to an embodiment of the present invention; as shown in fig. 10, the voltage adapting unit 22 includes a voltage follower U1, a first current limiting resistor R1, and a first filter capacitor C1; a first input end of the voltage follower U1 is electrically connected with an output end of the check switch chip 21; the second input end of the voltage follower U1 is electrically connected with the output end of the voltage follower U1; the output end of the voltage follower U1 is electrically connected with the first end of the first current limiting resistor R1; the second end of the first current limiting resistor R1 is electrically connected with the first end of the first filter capacitor C1 and any input end of the electronic equipment 001; the second end of the first filter capacitor C1 is grounded. The voltage follower U1 can be OPA4202IDR, and the voltage follower U1 can perform impedance matching; the first current limiting resistor R1 and the first filter capacitor C1 can play a role of filtering, so that the reliability of the output analog voltage signal is improved.
Optionally, with continued reference to fig. 10, the temperature acquisition unit 100 includes an NTC resistor Rt, a first voltage dividing resistor R11, and a second voltage dividing resistor R12; the first end of the NTC resistor Rt is electrically connected with the first end of the first voltage dividing resistor R11 and the first end of the second voltage dividing resistor R12; the second end of the first voltage dividing resistor R11 is electrically connected with a voltage source; a second terminal of the second voltage dividing resistor R12 is electrically connected to any one of the input terminals of the check switch chip 21. Wherein, the NTC resistor Rt is a resistor with negative temperature coefficient; the resistance value thereof decreases with the increase of the temperature; the analog voltage signal output from the NTC resistor Rt can be divided by the first dividing resistor R11 and the second dividing resistor R12, so that the voltage processing range of the input terminal of the check switch chip 21 is satisfied. It is to be understood that the number of the temperature acquisition units 100 may be determined according to the sampling points of actual temperature measurement, which is not particularly limited in this embodiment.
Note that the above is only a preferred embodiment of the present invention and the technical principle applied. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, while the invention has been described in connection with the above embodiments, the invention is not limited to the embodiments, but may be embodied in many other equivalent forms without departing from the spirit or scope of the invention, which is set forth in the following claims.
Claims (8)
1. A temperature digital-to-analog conversion method, comprising:
acquiring a plurality of digital voltage temperature information and a plurality of temperature information;
performing element changing processing on the digital voltage temperature information to output digital voltage temperature processing information; wherein the magnitude of the digital voltage temperature processing information is one magnitude;
Establishing a temperature-voltage model according to a plurality of digital voltage temperature processing information and a plurality of temperature information;
Carrying out Taylor expansion processing on the temperature-voltage model to determine a temperature-voltage optimization model;
And determining real-time temperature information according to the real-time digital voltage temperature information and the reference analog voltage based on the temperature-voltage optimization model.
2. A temperature digital-to-analog conversion apparatus, comprising:
The acquisition module is used for acquiring a plurality of digital voltage temperature information and a plurality of temperature information;
The processing module is used for performing element conversion processing on the digital voltage temperature information to output digital voltage temperature processing information; wherein the magnitude of the digital voltage temperature processing information is one magnitude;
The model building module is used for building a temperature-voltage model according to the plurality of digital voltage temperature processing information and the plurality of temperature information;
The optimization model building module is used for carrying out Taylor expansion processing on the temperature-voltage model to determine a temperature-voltage optimization model;
And the real-time temperature determining module is used for determining real-time temperature information according to the real-time digital voltage temperature information and the reference analog voltage based on the temperature-voltage optimizing model.
3. An electronic device, the electronic device comprising:
at least one processor; and a memory communicatively coupled to the at least one processor; wherein,
The memory stores a computer program executable by the at least one processor to enable the at least one processor to perform the temperature digital-to-analog conversion method of claim 1.
4. A multi-channel temperature sampling device, comprising: at least one temperature acquisition module, at least one multiple check module and the electronic device according to claim 3; each temperature acquisition module is arranged in one-to-one correspondence with the multi-path check module; the temperature acquisition module comprises at least one temperature acquisition unit;
Each temperature acquisition unit is electrically connected with each input end of the multi-path check module; the output end of the multi-way check module is electrically connected with any input end of the electronic equipment; the output ends of the multiple check modules are in one-to-one correspondence with the input ends of the electronic equipment;
The temperature acquisition unit is used for acquiring an analog temperature voltage signal of an object to be measured; the temperature acquisition module is used for sending each analog temperature and voltage signal to the multi-path check module;
The multi-path check module is used for controlling each analog temperature and voltage signal to be sequentially output to any input end of the electronic equipment through a single output end according to a switching channel control instruction;
The electronic equipment is used for converting each analog temperature voltage signal output by the single output end of the multi-path check module and outputting a real-time temperature signal.
5. The multi-channel temperature sampling device of claim 4, wherein the multi-channel check module comprises a check switch chip;
each input end of the check switch chip is electrically connected with each output end of the temperature acquisition unit; the switching channel control end of the check switch chip is used for receiving a switching channel control instruction; the output end of the check switch chip is electrically connected with any input end of the electronic equipment.
6. The multi-channel temperature sampling device of claim 5, wherein the multi-channel check module further comprises a voltage adaptation unit;
The output end of the check switch chip is electrically connected with the first input end of the voltage adapting unit; the second input end of the voltage adapting unit is electrically connected with the output end of the voltage adapting unit; the output end of the voltage adapting unit is electrically connected with any input end of the electronic equipment.
7. The multi-channel temperature sampling device of claim 6, wherein the voltage adaptation unit comprises a voltage follower, a first current limiting resistor and a first filter capacitor;
The first input end of the voltage follower is electrically connected with the output end of the check switch chip; the second input end of the voltage follower is electrically connected with the output end of the voltage follower; the output end of the voltage follower is electrically connected with the first end of the first current limiting resistor; the second end of the first current limiting resistor is electrically connected with the first end of the first filter capacitor and any input end of the electronic equipment; the second end of the first filter capacitor is grounded.
8. The multi-channel temperature sampling device of claim 5, wherein the temperature acquisition unit comprises an NTC resistor, a first voltage dividing resistor, and a second voltage dividing resistor;
The first end of the NTC resistor is electrically connected with the first end of the first voltage dividing resistor and the first end of the second voltage dividing resistor; the second end of the first voltage dividing resistor is electrically connected with a voltage source; the second end of the second voltage dividing resistor is electrically connected with any input end of the check switch chip.
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