CN118274301A - Heat abstractor and outdoor lamp - Google Patents

Abstract

A heat abstractor and outdoor lamp relate to the technical field of lighting equipment, wherein, heat abstractor is used for outdoor lamp, include: a substrate extending along a first direction, the substrate having a heat dissipation side and a mounting side opposite to each other, the mounting side being for fixing a light source module of an outdoor lamp; the first fins extend from the surface of the substrate on the radiating side, the first fins comprise first bending parts and second bending parts, the first bending parts extend along the second direction, the second direction is perpendicular to the first direction, two ends of each first bending part are respectively connected with one second bending part, the second bending parts and the first bending parts are arranged at an obtuse angle in the direction opposite to the center of the substrate, at least one first bending part is provided with a first opening, and the first opening breaks the first bending part where the first opening is located in the second direction. Therefore, the problem of water accumulation in the heat dissipation device is improved while the heat dissipation effect and the structural strength are considered.

Description

Heat abstractor and outdoor lamp

Technical Field

The invention relates to the technical field of lighting equipment, in particular to a heat dissipation device and an outdoor lamp.

Background

The LED light source is gradually popularized to outdoor lamps, particularly to public lighting settings such as street lamps which need to work for a long time due to the advantages of long service life, environmental protection, cleanness, small power consumption, controllable light emitting color and the like, and is convenient for heat dissipation of the LED light source, and the LED light source and the LED heat dissipation device are matched for use so as to facilitate heat dissipation.

At present, the LED heat dissipation device street lamp is downward in the light-emitting projection direction, so that water and dirt are easy to accumulate in the upward LED heat dissipation device, and normal work is influenced.

Disclosure of Invention

The invention solves the technical problem of providing a heat dissipation device and an outdoor lamp so as to improve the water accumulation problem in the heat dissipation device while considering the heat dissipation effect and the structural strength.

In order to solve the technical problems, the technical scheme of the invention provides a heat dissipation device for an outdoor lamp, which comprises: a substrate extending along a first direction, the substrate having opposite heat dissipation sides and a mounting side for securing a light source module of an outdoor light fixture; the first fins extend from the surface of the substrate on the heat radiation side, the first fins comprise first bending parts and second bending parts, the first bending parts extend along the second direction, the second direction is perpendicular to the first direction, two ends of the first bending parts are respectively connected with one second bending part, the second bending parts and the first bending parts are arranged at an obtuse angle in the direction opposite to the center of the substrate, at least one first bending part is provided with a first opening, and the first opening is in the first bending part where the first opening is disconnected in the second direction.

Optionally, the first openings are formed in at least two first bending portions, and in the second direction, the first openings in adjacent first bending portions are staggered with each other.

Optionally, the first fin further includes a third bending portion extending along the second direction, and each of the second bending portions of the first fin is connected to one of the third bending portions at an obtuse angle.

Optionally, the plurality of first fins are equally divided into two groups, in the first direction, the two groups of first fins are respectively located at two sides of the center of the substrate, and the two groups of first fins are symmetrically arranged with the center of the substrate as a symmetry center.

Optionally, the method further comprises: connect the ear, the base plate is followed the outer fringe of first direction both sides each connect one connect the ear, connect the ear to include: the connecting part is used for fixing the heat radiating device and the lamp body of the outdoor lamp; the transition part is respectively connected with the substrate and the connecting part along two ends of the first direction, and the transition part and the heat radiation side of the substrate are arranged at an obtuse angle; the air duct structure comprises an air duct inlet arranged on the transition part and a peripheral wall extending from the periphery of the air duct inlet towards the heat radiation side, wherein the air duct inlet penetrates through the transition part from the mounting side towards the heat radiation side, the peripheral wall encloses to form an air duct which is communicated with the air duct inlet, one side of the peripheral wall opposite to the air duct inlet is provided with an air duct outlet which is communicated with the air duct, and at least part of the peripheral wall is inclined towards the direction of the air duct so that the air duct outlet is reduced relative to the air duct inlet.

Optionally, the top of the peripheral wall is lower than the top of the first fin; the heat dissipation device further includes: and the second fins are positioned between the air duct structure and the first fins, extend out from the surface of the substrate on the heat radiation side, and have tops higher than the top of the peripheral wall and lower than the tops of the first fins.

Optionally, the second fins extend along the second direction, and two ends of the second fins in the second direction are bent towards the air duct structure at obtuse angles; the heat dissipation device further includes: and the top of the reinforcing rib is lower than the top of the peripheral wall, the reinforcing rib extends along the first direction, one end of the reinforcing rib is connected with the outer surface of the peripheral wall, and the other end of the reinforcing rib is spaced from the adjacent second fins.

Optionally, the thickness of the top of the first fin is thinner than the thickness of the bottom of the first fin, and the thickness of the top of the second fin is thinner than the thickness of the bottom of the second fin.

Optionally, the method further comprises: the second fins are arranged along the second direction at intervals, in the first direction, the third fins are located between the two groups of first fins, the third fins extend out of the surface of the radiating side, the third fins comprise fourth bending parts and fifth bending parts, the fourth bending parts extend along the first direction, two ends of the fourth bending parts are respectively connected with one fifth bending part, the fifth bending parts and the fourth bending parts are arranged at an obtuse angle in the direction away from the center of the substrate, at least one fourth bending part is provided with a second opening, and the second opening breaks the fourth bending part where the second opening is located in the first direction.

Optionally, the number of the third fins is multiple, the second openings are formed in at least two fourth bending portions, and in the second direction, the second openings in the adjacent fourth bending portions are staggered.

Optionally, the third fin further includes a sixth bending portion extending along the second direction, and each of the fifth bending portions of the third fin is connected to one of the sixth bending portions at an obtuse angle.

Optionally, the plurality of third fins are equally divided into two groups, and in the second direction, the two groups of third fins are respectively located at two sides of the center of the substrate, and the two groups of third fins are symmetrically arranged with the center of the substrate as a symmetry center.

Optionally, a power supply through hole is formed in the central area of the substrate, the two groups of first fins are respectively located at two sides of the power supply through hole along the first direction, and the two groups of third fins are respectively located at two sides of the power supply through hole along the second direction.

Optionally, the light source module includes the PCB board, one side of PCB board is equipped with a plurality of LED light sources, the base plate is in the surface of heat dissipation side is dorsad the cambered surface of installation side arch, the base plate is in the surface of installation side is the plane, the plane is used for laminating fixedly the surface of PCB board dorsad LED light source one side.

The technical scheme of the invention also provides an outdoor lamp, which comprises: the lamp body is provided with a mounting cavity, and the mounting cavity is provided with a first lamp body opening and a second lamp body opening which are arranged in a back-to-back mode; the heat dissipation device is installed and fixed in the installation cavity, the heat dissipation side faces the first lamp body opening, and the installation side faces the second lamp body opening; and a light source module fixed to the mounting side.

Compared with the prior art, the technical scheme of the embodiment of the invention has the following beneficial effects:

In the heat dissipating device provided by the technical scheme of the invention, the first fin comprises the first bending part and the second bending part, two ends of the first bending part are respectively connected with one second bending part, and the second bending part and the first bending part are arranged at an obtuse angle in the direction opposite to the center of the substrate, so that the first fin has high structural strength and large heat dissipating area. The heat dissipating device comprises a plurality of first fins which are arranged at intervals along the first direction, so that the heat dissipating device has high structural strength and good heat dissipating effect. On the basis, because the first opening is arranged on at least one first bending part, and the first bending part where the first opening is positioned is disconnected in the second direction, on one hand, accumulated water can be guided into a runner which is easier to drain, so that the accumulated water problem in the heat dissipating device is improved, and on the other hand, because the structural strength of the first fins is high, the influence of the first opening on the structural strength of the heat dissipating device with a plurality of first fins which are arranged at intervals is small, and therefore, the heat dissipating device still has higher structural strength. Therefore, the heat dissipation device is high in structural strength, good in heat dissipation effect and not easy to accumulate water and dirt.

Drawings

Fig. 1 is a schematic perspective view of a heat dissipating device according to an embodiment of the present invention;

FIG. 2 is a top view of the heat sink side of the heat sink according to an embodiment of the present invention;

FIG. 3 is a top view of the mounting side of a heat sink according to an embodiment of the present invention;

FIG. 4 is a schematic view of a sectional structure along the direction A1-A2 in FIG. 2;

Fig. 5 is a side view along direction B in fig. 2.

Reference numerals illustrate:

100-a heat dissipation device;

10-a substrate; 11-heat radiation side; 12-mounting side;

20-a light source module; 21-an LED light source;

30-a first fin; 31-a first fold; 32 second bent portions; 33-a third fold; 301-a first opening;

40-connecting the ears; 41-a connection; 42-an air duct structure; 421-air duct inlet; 422-a peripheral wall; 423-an air duct outlet; 424-wind tunnel; 43-transition;

50-second fins;

60-reinforcing ribs;

70-third fins; 71-fourth bends; 72-a fifth fold; 73-sixth bends; 701-a second opening;

80-power vias.

Detailed Description

In order to make the above objects, features and advantages of the present invention more comprehensible, embodiments accompanied with figures are described in detail below.

Note that "surface" in this specification is used to describe a relative positional relationship in space, and is not limited to whether or not it is in direct contact.

An embodiment of the present invention provides a heat dissipating device, fig. 1 is a schematic perspective view of the heat dissipating device according to the embodiment of the present invention, fig. 2 is a top view of a heat dissipating side of the heat dissipating device according to the embodiment of the present invention, fig. 3 is a top view of a mounting side of the heat dissipating device according to the embodiment of the present invention, fig. 4 is a schematic cross-sectional view along a direction A1-A2 in fig. 2, and fig. 5 is a side view along a direction B in fig. 2. The light source module is mounted on the mounting side in fig. 3.

Referring to fig. 1 to 5, a heat dissipating device 100 includes: a substrate 10 and a plurality of first fins 30.

The heat dissipation device 100 is used for outdoor lamps. The outdoor lamp is, for example, an LED street lamp.

Wherein the substrate 10 extends along a first direction, the substrate 10 has a heat dissipation side 11 and a mounting side 12 opposite to each other, and the mounting side 12 is used for fixing a light source module 20 (as shown in fig. 3) of an outdoor lamp.

In the present embodiment, the light source module 20 includes a PCB board, and one side of the PCB board is provided with a plurality of LED light sources 21 (as shown in fig. 3).

The plurality of first fins 30 are arranged at intervals along the first direction, and the first fins 30 protrude from the surface of the substrate 10 on the heat dissipation side 11. Specifically, the first fins 30 are integrally formed with the substrate 10, and adjacent first fins 30 are spaced apart to form a heat dissipation channel and a flow channel for guiding water.

Preferably, the connection between the first fin 30 and the substrate 10 is a cambered surface.

The first fin 30 is a bent structure.

Specifically, the first fin 30 includes: a first bending portion 31 and a second bending portion 32.

The first bending portion 31 extends along a second direction, the second direction is perpendicular to the first direction, two ends of the first bending portion 31 are respectively connected with a second bending portion 32, and the second bending portion 32 and the first bending portion 31 are arranged at an obtuse angle in a direction opposite to the center of the substrate 10.

In addition, at least one first bending portion 31 is provided with a first opening 301, and the first opening 301 breaks the first bending portion 31 where it is located in the second direction. That is, the bottom of the first opening 301 exposes the surface of the substrate 10 on the heat dissipation side 11, and the first opening 301 penetrates the first bending portion 31 along the first direction.

In the heat dissipating device 100, the first fin 30 includes the first bending portion 31 and the second bending portion 32, two ends of the first bending portion 31 are respectively connected to one second bending portion 32, and the second bending portion 32 and the first bending portion 31 are disposed at an obtuse angle in a direction opposite to the center of the substrate 10, so that the first fin 30 has high structural strength and a large heat dissipating area. Since the heat dissipating device 100 includes the plurality of first fins 30 arranged at intervals along the first direction, the heat dissipating device 100 has high structural strength and good heat dissipating effect. On the basis, since the first opening 301 is formed in the at least one first bending portion 31, and the first bending portion 31 where the first opening 301 breaks in the second direction, on one hand, the accumulated water can be guided into the flow channel which is easier to drain, so that the accumulated water problem of the heat dissipating device 100 on the heat dissipating side 11 is improved, on the other hand, the structural strength of the first fins 30 is high, and on the other hand, the influence of the first opening 301 on the structural strength of the heat dissipating device 100 with the plurality of first fins 30 arranged at intervals is small, so that the heat dissipating device 100 still has higher structural strength. Therefore, the heat dissipating device 100 has high structural strength, good heat dissipating effect and difficult water accumulation and dirt accumulation.

In addition, the high structural strength of the plurality of first fins 30 arranged at intervals along the first direction makes the substrate 10 less likely to deform, so that, on one hand, the surface of the mounting side 12 may be flattened as desired to fit the light source module 20, thereby enabling the heat of the light source module 20 to be conducted more quickly, and, on the other hand, the surface of the heat dissipation side 11 may also be formed into a desired shape to improve the drainage efficiency.

In some embodiments, at least two first bends 31 are provided with first openings 301, and in the second direction, the first openings 301 on adjacent first bends 31 are offset from each other. The more first openings 301 can further accelerate the diversion of the accumulated water, thereby improving the drainage efficiency, and meanwhile, the adjacent first openings 301 are staggered, so that the overall structural strength of the heat dissipating device 100 can be better maintained.

In one embodiment, each first bending portion 31 is provided with a first opening 301, so that the efficiency of the water diversion is greatly improved.

In some embodiments, the first fin 30 further comprises: the third bent portions 33 extend in the second direction, and each of the second bent portions 32 of the first fin 30 is connected to one of the third bent portions 33 at an obtuse angle. Thereby, the structural strength of the first fin 30 is further improved, and the structural strength of the heat dissipating device 100 is correspondingly improved.

In some embodiments, the plurality of LED light sources 21 are substantially uniformly distributed on the PCB board. Correspondingly, the plurality of first fins 30 are equally divided into two groups, and in the first direction, the two groups of first fins 30 are respectively located at two sides of the center of the substrate 10, and the two groups of first fins 30 are symmetrically arranged with the center of the substrate 10 as a symmetry center. Thus, on the one hand, each position of the heat dissipating structure 100 can dissipate heat more uniformly, and at the same time, the plurality of first fins 30 can enhance the structural strength of each position of the heat dissipating structure 100 more uniformly.

In some embodiments, the thickness of the top of the first fin 30 is thinner than the thickness of the bottom thereof, thereby providing a good heat dissipation effect while allowing for cost savings.

In some embodiments, the heat dissipating device further comprises: the connection ears 40 are connected to the outer edges of the substrate 10 along the first direction, one connection ear 40 each.

Wherein the connecting ear 40 comprises: a connection 41, an air duct structure 42 and a transition 43.

The connection portion 41 is used for fixing the heat sink 100 to a lamp body of an outdoor lamp.

The transition portion 43 is connected to the substrate 10 and the connection portion 41 along both ends of the first direction, and the transition portion 43 is disposed at an obtuse angle with respect to the heat dissipation side 11 of the substrate 10. That is, the transition portion 43 is tilted from the mounting side 12 toward the heat dissipation side 11 with respect to the surface of the substrate 10 on the heat dissipation side 11.

The air duct structure 42 includes: the air duct inlet 421, the peripheral wall 422, the air duct outlet 423, and the air duct 424.

The duct inlet 421 is provided in the transition portion 43, and penetrates the transition portion 43 from the mounting side 12 toward the heat radiation side 11. The peripheral wall 422 extends from the periphery of the air channel inlet 421 toward the heat radiation side 11, the peripheral wall 422 encloses an air channel 424 communicating with the air channel inlet 421, one side of the peripheral wall 422 opposite to the air channel inlet 421 is provided with an air channel outlet 423 communicating with the air channel 424, and at least part of the peripheral wall 422 is inclined toward the air channel 424, so that the air channel outlet 423 is reduced relative to the air channel inlet 421.

Since the thermal vortex is easily formed on the side of the connecting lug 40 facing the mounting side 12, the thermal vortex can be greatly reduced and the heat dissipation performance can be improved by forming the air duct structure 42 at the transition portion 43. Specifically, the hot air on the mounting side 12 will rise to the heat dissipation side 11 through the air duct structure 42 for heat dissipation, and in addition, since at least part of the peripheral wall 422 is inclined toward the direction of the air duct 424, so that the air duct outlet 423 is reduced relative to the air duct inlet 421, a nozzle-like structure is formed, and thus, the flow of the hot air can be accelerated to further improve the heat dissipation performance.

In some embodiments, the top of the peripheral wall 422 is lower than the top of the first fins 30 to shorten the wind path of the wind channel 424, more quickly dissipating the hot air into the ambient air.

In some embodiments, the heat dissipating device 100 further comprises: a second fin 50 located between the air chute structure 42 and the first fin 30. The second fins 50 protrude from the surface of the substrate 10 on the heat radiation side 11, and the tops of the second fins 50 are higher than the tops of the peripheral walls 422, and the tops of the second fins 50 are lower than the tops of the first fins 30. Specifically, the second fins 50 are also integrally formed with the substrate 10.

Because of the provision of the air duct structure 42, the area between the first fins 30 and the air duct structure 42 generally dissipates heat well. By providing the second fins 50 between the first fins 30 and the air duct structure 42, and the top of the second fins 50 is higher than the top of the peripheral wall 422, the top of the second fins 50 is lower than the top of the first fins 30, so that the heat dissipation performance of the area between the first fins 30 and the air duct structure 42 is further improved, and the shorter second fins 50 are formed relative to the first fins 30, which can also achieve cost saving.

Preferably, the connection between the second fin 50 and the substrate 10 is an arc surface.

In some embodiments, the second fins 50 extend along the second direction, and both ends of the second fins 50 in the second direction are bent at an obtuse angle toward the air duct structure 42. Thereby, the structural strength of the second fins 50 is further improved, so as to improve the overall structural strength of the heat dissipating device 100.

In some embodiments, the thickness of the top of the second fin 50 is less than the thickness of the bottom thereof. Therefore, the heat dissipation effect is good, and meanwhile, the cost is saved.

In some embodiments, the heat dissipating device 100 further comprises: reinforcing ribs 60 protruding from the surface of the substrate 10 on the heat radiation side 11. The top of the rib 60 is lower than the top of the peripheral wall 422, the rib 60 extends in the first direction, one end of the rib 60 is connected to the outer surface of the peripheral wall 422, and the other end of the rib 60 is spaced apart from the adjacent second fin 50. Therefore, the structural strength of the heat dissipating device 100 is further enhanced by the reinforcing ribs 60, the risk of surface deformation of the substrate 10 is reduced, and meanwhile, cost saving is achieved. In addition, since the other end of the reinforcing rib 60 is spaced from the adjacent second fin 50, an opening for water to flow is correspondingly formed, so as to help to improve the water accumulation problem in the heat dissipating device.

In some embodiments, the heat dissipating device 100 further comprises: a plurality of third fins 70 spaced apart along the second direction.

In the first direction, a plurality of third fins 70 are located between the two sets of first fins 30, and the third fins 70 protrude from the surface of the heat dissipation side 11. Specifically, the third fins 70 are integrally formed with the substrate 10, and adjacent third fins 70 are spaced apart to form a heat dissipation channel and a flow channel for guiding water.

Preferably, the connection between the third fin 70 and the substrate 10 is a cambered surface.

The third fin 70 is a bent structure.

Specifically, the third fin 70 includes a fourth bent portion 71 and a fifth bent portion 72.

The fourth bending portion 71 extends along the first direction, two ends of the fourth bending portion 71 are respectively connected to one fifth bending portion 72, and the fifth bending portion 72 and the fourth bending portion 71 form an obtuse angle in a direction facing away from the center of the substrate 10.

Further, at least one fourth folded portion 71 is provided with a second opening 701, and the second opening 701 breaks the fourth folded portion 71 where it is located in the first direction. That is, the bottom of the second opening 701 exposes the surface of the substrate 10 on the heat dissipation side 11, and the second opening 701 penetrates the fourth folded portion 71 along the second direction.

Since the third fin 70 includes the fourth bending portion 71 and the fifth bending portion 72, two ends of the fourth bending portion 71 are respectively connected to one fifth bending portion 72, and the fifth bending portion 72 and the fourth bending portion 71 form an obtuse angle in a direction facing away from the center of the substrate 10. Therefore, the third fin 70 has high structural strength and a large heat dissipation area. Based on this, since the plurality of third fins 70 are located between the two groups of first fins 30 in the first direction and are arranged at intervals along the second direction, the arrangement directions, the bending directions and the extending directions of the structures are different, so that the third fins 70 can cooperate with the first fins 30 to greatly enhance the overall structural strength of the heat dissipation structure 100, and further reduce the risks of deformation and twisting of the surface of the substrate 10.

In addition, since the second opening 701 is disposed on the at least one fourth bending portion 71, and the second opening 701 breaks the fourth bending portion 71 where the second opening 701 is disposed in the first direction, on one hand, the first opening 301 may be matched to guide the accumulated water into the flow channel which is easier to drain in both vertical directions, so as to further improve the accumulated water problem of the heat dissipating device 100 on the heat dissipating side 11, on the other hand, since the structural strength of the third fin 70 is high, the influence of the second opening 701 on the structural strength of the heat dissipating device 100 with the plurality of third fins 70 arranged at intervals is small, and therefore, the heat dissipating device 100 still has a higher structural strength.

In some embodiments, the number of the third fins 70 is plural, and the second openings 701 are provided on at least two fourth bending portions 71, and the second openings 701 on adjacent fourth bending portions 71 are offset from each other in the second direction. The more second openings 701 can further accelerate the flow guiding of the accumulated water, so as to improve the drainage efficiency, and meanwhile, the adjacent second openings 701 are staggered, so that the overall structural strength of the heat dissipating device 100 can be better maintained.

In some embodiments, the third fin 70 further comprises: the sixth bent portions 73 extending in the second direction, and each fifth bent portion 72 of the third fin 70 is connected to one sixth bent portion 73 at an obtuse angle. Thereby, the structural strength of the third fin 70 is further improved, and the structural strength of the heat dissipating device 100 is correspondingly improved.

In some embodiments, the plurality of third fins 70 are divided into two groups, and in the second direction, the two groups of third fins 70 are located on two sides of the center of the substrate 10, respectively, and the two groups of third fins 70 are symmetrically disposed about the center of the substrate 10 as a symmetry center. Thus, on the one hand, each position of the heat dissipating structure 100 can dissipate heat more uniformly, and at the same time, the plurality of third fins 70 can enhance the structural strength of each position of the heat dissipating structure 100 more uniformly.

In some embodiments, the central region of the substrate 10 is formed with a power through hole 80, and two sets of first fins 30 are respectively located at two sides of the power through hole 80 along the first direction, and two sets of third fins 70 are respectively located at two sides of the power through hole 80 along the second direction. Thereby, the uniformity of heat dissipation, water accumulation and flow guide and structural strength of the heat sink 100 is further increased.

In some embodiments, the surface of the substrate 10 on the heat dissipation side 11 is a cambered surface arched away from the mounting side 12, and the surface of the substrate 10 on the mounting side 12 is a plane, and the plane is used for fitting and fixing the surface of the PCB board on the side facing away from the LED light source 21. That is, the substrate 10 is thicker in the middle and thinner at the edges.

The heat dissipating device 100 has a high structural strength, and therefore the substrate 10 is not easily deformed on the surface of the mounting side 12 and the surface of the heat dissipating side 11. Based on this, the surface of the substrate 10 on the mounting side 12 is made to be a plane, so that the PCB board can be better attached to the surface of the mounting side 12, so as to further improve the heat dissipation performance, and meanwhile, the surface of the substrate 10 on the heat dissipation side 11 is made to be an arc surface arched away from the mounting side 12, so that the heat dissipation area is increased, so that the heat dissipation performance is further improved, and the water drainage can be accelerated, so that the water accumulation problem is better improved.

Preferably, the radius of curvature R of the cambered surface is 700 mm to 800 mm. More preferably, the radius of curvature R of the arcuate surface is about 750 millimeters.

In some embodiments, the heat sink 100 is integrally formed throughout the structure, thereby again enhancing the structural strength of the heat sink 100 to reduce the risk of distortion of the surface of the substrate 10.

Correspondingly, the embodiment of the invention also provides an outdoor lamp.

The outdoor lamp is, for example, an LED street lamp or the like.

The outdoor lamp includes: the lamp body, the heat sink 100, and the light source module 20.

The lamp body is provided with an installation cavity, the installation cavity is provided with a first lamp body opening and a second lamp body opening, and the first lamp body opening and the second lamp body opening are arranged in a back-to-back mode.

The heat dissipating device 100 is mounted and fixed in the mounting cavity, the heat dissipating side 11 is open towards the first lamp body, and the mounting side 12 is open towards the second lamp body.

Please refer to the related description of the heat dissipating device 100 in the foregoing embodiment for the detailed structure of the heat dissipating device 100, which is not repeated here.

The light source module 20 is fixed to the mounting side 12.

In the present embodiment, the light source module 20 includes a PCB board, and one side of the PCB board is provided with a plurality of LED light sources 21.

Preferably, the orthographic projection of a portion of the LED light sources 21 of the plurality of LED light sources 21 at least partially coincides with the orthographic projection of the plurality of first fins 30.

Preferably, the orthographic projection of all the LED light sources 21 at least partially coincides with the orthographic projection of the plurality of first fins 30.

For the detailed structure of the light source module 20, please refer to the related description of the light source module 20 in the foregoing embodiment, and the detailed description is omitted herein.

Although the present invention is disclosed above, the present invention is not limited thereto. Various changes and modifications may be made by one skilled in the art without departing from the spirit and scope of the invention, and the scope of the invention should be assessed accordingly to that of the appended claims.

Claims (15)

1. A heat sink (100) for an outdoor light fixture, comprising:

A substrate (10) extending along a first direction, the substrate (10) having a heat dissipation side (11) and a mounting side (12) opposite to each other, the mounting side (12) being for fixing a light source module (20) of an outdoor luminaire;

The heat dissipation structure comprises a substrate (10) and a plurality of first fins (30) which are arranged at intervals along a first direction, wherein the first fins (30) extend out of the surface of the heat dissipation side (11) from the substrate (10), the first fins (30) comprise first bending parts (31) and second bending parts (32), the first bending parts (31) extend along a second direction, the second direction is perpendicular to the first direction, two ends of the first bending parts (31) are respectively connected with one second bending part (32), the second bending parts (32) and the first bending parts (31) are arranged at an obtuse angle in the direction opposite to the center of the substrate (10), at least one first bending part (31) is provided with a first opening (301), and the first opening (301) is used for disconnecting the first bending part (31) where the first opening (301) is located in the second direction.

2. The heat sink (100) according to claim 1, wherein at least two of the first bent portions (31) are provided with the first openings (301), and wherein the first openings (301) on adjacent first bent portions (31) are offset from each other in the second direction.

3. The heat sink (100) according to claim 2, wherein the first fin (30) further comprises a third bend (33) extending in the second direction, and each of the second bends (32) of the first fin (30) is connected to one of the third bends (33) at an obtuse angle.

4. A heat dissipating device (100) according to claim 3, wherein the plurality of first fins (30) are equally divided into two groups, the two groups of first fins (30) are located on both sides of the center of the substrate (10) in the first direction, respectively, and the two groups of first fins (30) are symmetrically disposed with the center of the substrate (10) as a symmetry center.

5. The heat sink (100) of claim 4, further comprising: -a connection ear (40), wherein the substrate (10) is connected to one of the connection ears (40) along the outer edges of both sides in the first direction, and the connection ear (40) comprises:

A connection part (41), wherein the connection part (41) is used for fixing the heat dissipation device (100) and a lamp body of the outdoor lamp;

A transition portion (43), wherein two ends of the transition portion (43) along the first direction are respectively connected with the substrate (10) and the connecting portion (41), and the transition portion (43) is arranged at an obtuse angle with the heat radiation side of the substrate (10);

The utility model provides an air duct structure (42), including set up in air duct entry (421) of transition portion (43), and from the periphery of air duct entry (421) towards perisporium (422) that heat dissipation side (11) stretch out, air duct entry (421) are from installation side (12) are towards heat dissipation side (11) link up transition portion (43), perisporium (422) enclose and form intercommunication air duct entry (421) wind channel (424), perisporium (422) are relative one side of air duct entry (421) has intercommunication wind channel (424) wind channel outlet (423), and at least part perisporium (422) are to wind channel (424) direction slope, so that wind channel outlet (423) are relative wind channel entry (421) shrink.

6. The heat sink (100) of claim 5, wherein a top of the peripheral wall (422) is lower than a top of the first fin (30);

The heat dissipation device (100) further includes: and a second fin (50) located between the air duct structure (42) and the first fin (30), the second fin (50) protruding from the surface of the substrate (10) on the heat radiation side (11), and the top of the second fin (50) being higher than the top of the peripheral wall (422) and lower than the top of the first fin (30).

7. The heat dissipating device (100) of claim 6, wherein the second fins (50) extend in the second direction, both ends of the second fins (50) in the second direction being bent at an obtuse angle toward the air duct structure (42);

The heat dissipation device (100) further includes: a reinforcing rib (60) extending from the surface of the substrate (10) at the heat radiation side (11), the top of the reinforcing rib (60) is lower than the top of the peripheral wall (422), the reinforcing rib (60) extends along the first direction, one end of the reinforcing rib (60) is connected with the outer surface of the peripheral wall (422), and the other end of the reinforcing rib (60) is spaced from the adjacent second fin (50).

8. The heat sink (100) of claim 7, wherein the thickness of the top of the first fin (30) is thinner than the thickness of the bottom thereof, and the thickness of the top of the second fin (50) is thinner than the thickness of the bottom thereof.

9. The heat sink (100) of claim 4, further comprising: the heat dissipation device comprises a substrate (10) and a plurality of first fins (70) which are arranged at intervals along the first direction, wherein the first fins (30) are arranged between the first fins (70), the first fins (70) extend out of the surface of the heat dissipation side (11), the first fins (70) comprise a first bending part (71) and a second bending part (72), the first bending part (71) extends along the first direction, two ends of the first bending part (71) are respectively connected with the second bending part (72), the second bending part (72) and the second bending part (71) are arranged at an obtuse angle in the direction away from the center of the substrate (10), and at least one first bending part (71) is provided with a second opening (701), and the second opening (71) breaks the first bending part (71) where the first opening is located.

10. The heat dissipating device (100) according to claim 9, wherein the number of the third fins (70) is plural, the second openings (701) are provided in at least two of the fourth bent portions (71), and the second openings (701) in adjacent fourth bent portions (71) are offset from each other in the second direction.

11. The heat sink (100) according to claim 10, wherein the third fin (70) further comprises a sixth bend (73) extending in the second direction, and each of the fifth bends (72) of the third fin (70) is connected to one of the sixth bends (73) at an obtuse angle.

12. The heat dissipating device (100) according to claim 11, wherein the plurality of third fins (70) are equally divided into two groups, the two groups of third fins (70) are located on both sides of the center of the substrate (10) in the second direction, respectively, and the two groups of third fins (70) are symmetrically disposed with the center of the substrate (10) as a symmetry center.

13. The heat dissipating device (100) of claim 12, wherein a central region of the substrate (10) is formed with a power through hole (80), two sets of the first fins (30) are respectively located at two sides of the power through hole (80) along the first direction, and two sets of the third fins (70) are respectively located at two sides of the power through hole (80) along the second direction.

14. The heat dissipating device (100) according to any one of claims 1 to 13, wherein the light source module (20) comprises a PCB board, one side of the PCB board is provided with a plurality of LED light sources (21), a surface of the substrate (10) on the heat dissipating side (11) is an arc surface arched away from the mounting side (12), a surface of the substrate (10) on the mounting side (12) is a plane, and the plane is used for attaching and fixing a surface of the PCB board on the side facing away from the LED light sources.

15. An outdoor light fixture, comprising:

the lamp body is provided with a mounting cavity, and the mounting cavity is provided with a first lamp body opening and a second lamp body opening which are arranged in a back-to-back mode;

The heat sink (100) according to any of the claims 1 to 14, the heat sink (100) being mounted and fixed in the mounting cavity, the heat sink side (11) being open towards the first lamp body and the mounting side (12) being open towards the second lamp body;

a light source module (20) fixed to the mounting side (12).