CN1182702C - Stereopicture camera device - Google Patents
Stereopicture camera device Download PDFInfo
- Publication number
- CN1182702C CN1182702C CNB031054838A CN03105483A CN1182702C CN 1182702 C CN1182702 C CN 1182702C CN B031054838 A CNB031054838 A CN B031054838A CN 03105483 A CN03105483 A CN 03105483A CN 1182702 C CN1182702 C CN 1182702C
- Authority
- CN
- China
- Prior art keywords
- stereo image
- selecting element
- image selecting
- lens
- lens mount
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000006059 cover glass Substances 0.000 abstract description 11
- 239000000758 substrate Substances 0.000 abstract 2
- 230000003287 optical effect Effects 0.000 abstract 1
- 239000000203 mixture Substances 0.000 description 7
- 238000005538 encapsulation Methods 0.000 description 6
- 239000007767 bonding agent Substances 0.000 description 4
- 230000031700 light absorption Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 230000004224 protection Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 210000000078 claw Anatomy 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 229910052752 metalloid Inorganic materials 0.000 description 1
- 150000002738 metalloids Chemical class 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Studio Devices (AREA)
Abstract
In order to easily and correctly align a lens with a solid-state image pickup element, Provided is a laminated chip 6, in which the image pickup element 13 is sandwiched between cover glasses 14, 15, is mounted on a substrate 4, and projections 8b, 8c are allowed to directly abut on two sides 13b, 13c on the periphery of the element 13 to fix a lens holder 8 on a substrate 4. Since the reference for positioning the holder 8 is the element 13, an optical axis of a lens 7 can be aligned with a light-receiving surface of the element 13.
Description
Technical field
The present invention relates to a kind of stereo image shooting device.
Background technology
Existing common stereo image shooting device is disclosed in, for example JP-A-10-23340.As shown in Figure 5, according to common stereo image selecting element, stereo image selecting element 42 is arranged in the encapsulation 41, and in order to protecting this element, and one group of splicing ear 43 is provided for by encapsulation 41 conduction to the outside.In addition, the location of stereo image selecting element 42 is two side a ' that are provided with by at lens mount 44, b ' and two side a that encapsulate 41, and b contacts and realizes.
Stereo image selecting element 42 is placed into and is used for protection in the encapsulation 41.Therefore, between encapsulation 41 and stereo image selecting element 42, produce a position error in the fabrication stage, and, even when lens mount 44 is by setting up a benchmark and locate by encapsulation 41, the optic axis of lens can not overlap necessarily with the center of the optics receiving surface of stereo image selecting element 42.
Summary of the invention
Has a stereo image selecting element according to stereo image shooting device of the present invention; a flat board that is used to adhere to stereo image selecting element; and lens mount; be equipped with lens and be used for the conglomeration volume image at stereo image selecting element; wherein stereo image selecting element is to be bonded on two surface and the back with baffle; and lens mount is made for and has a rectangular cylinder part; be used for centering on to contain stereo image selecting element; and stereo image selecting element is installed in above the flat board, and two sides of the neighboring of stereo image selecting element are contacted with two sides of the inner rim of rectangular cylinder part.In addition, the rectangular cylinder part can be made and have contact portion, contacts on its thickness direction with baffle.
Description of drawings
Fig. 1 is to use the profile of the camera that mancarried device of the present invention uses;
Fig. 2 is the composition diagram of laminated chips;
Fig. 3 is laminated chips and a bearing state of contact figure;
Fig. 4 is the profile of another embodiment; And
Fig. 5 is the profile of the common camera used of mancarried device.
Embodiment
One embodiment of the present of invention will be illustrated in conjunction with the accompanying drawings.
Fig. 1 illustrates whole stereo image shooting device.A socket 2 is set,, is used to control the main body of a portable phone or similar device to conduct to the motherboard 1 that circuit or similar device are installed.Socket 2 is made by plastic material.Socket 2 is provided with a lock part 2a, is used to lock a flat board 4 that camera uses portion within it, and the claw part 2a1 that the flat board 4 used of camera is set on the 2a of lock part locks non-dismountablely.The flat board of using when camera 4 is during by socket 2 lockings, a splicing ear (not shown) that is arranged on a splicing ear (not shown) on the socket 2 and is arranged on the flat board that camera uses is conducted, therefore can transmitted image picked-up information to motherboard 1.Dull and stereotyped 4 upper surface (upper side of figure) is upward gone up the central layer 6 that lamination is installed by protuberance 6c, sees aftermentioned for details, and lens mount 8 is installed, to center on laminated chips 6.Moreover, on dull and stereotyped 4 the lower surface various integrated circuits are set, with the stereo image selecting element (not shown) of control figure signal processor (DSP), it is the signal processing integrated circuit of the timing generator of laminated chips 6 and the being used to various driving timing signals that produce laminated chips 6 or similar device.
Lens mount 8 is made for cylindrical shape, and an one inner rim is provided with a negative thread part 8a, and it can twist a male screw portion 9a who closes lens mount 9, thereby fixes lens 7 between lens mount 8 and lens mount 9.
Lens mount 8 is to be made for cylindrical shape with plastic material, and is coated with layer of metal film 10e by plating, hydatogenesis or similar approach on its neighboring, in order to shielding electromagnetic wave.In addition, the radome made from aluminium or metalloid material 11 is arranged on dull and stereotyped 4, in order to shielding electromagnetic wave.Radome 11 conducts to the ground wire (not shown) on dull and stereotyped 4.Stretch out a contact chip 11a by the part of radome 11, and contact chip 11a contacts with metal film 10e on bearing 10 neighborings, thereby make metal film 10e conduct to ground wire (not shown)s above dull and stereotyped 4 by radome 11.
The internal fixation of lens mount 8 be connected to its middle part an infrared ray cut filter 12 engaging, thereby prevent to be radiated to unwanted infrared ray on the laminated chips 6 by infrared ray cut filter 12.Moreover the bottom of lens mount 8 is made for the rectangular cylinder shape, and rectangular cylinder part 8c is made for and has contact portion 8d, and it contacts with the surface of laminated chips 6, thereby positioning lens 7 and laminated chips 6 are on the optic axis direction.In other words, flat board 4 is made for and has trench portions 4a, and in order to the whole periphery of reception rectangular cylinder part 8c end, and rectangular cylinder part 8c is bonded to dull and stereotyped 4 by bonding agent 5, under this kind state, its contact portion 8d contacts with the upper surface of laminated chips 6.Therefore, lens 7 and the positioning relation of laminated chips 6 on the optic axis direction can be aimed at by self and be realized, exempted focusing, and positioning action can carry out simply and accurately.
Though the bonding agent 5 that is used for bonding lens mount 8 and dull and stereotyped 4 is coated in the whole periphery of the bottom of lens mount 8, the bonding agent 5 of part reaches gap between laminated chips 6 and dull and stereotyped 4 by the gap that is inserted between lens mount 8 and dull and stereotyped 4, it is also between laminated chips 6 and dull and stereotyped 4, be used to carry out the fixing of lens mount 8, and laminated chips 6 is installed to flat board 4, so that strengthen.
Below, the detailed composition of laminated chips 6 is illustrated.As shown in Figure 2; according to this laminated chips 6; transparent cover glass 14,15 is as the surface and back (the CCD-charge coupled device of the bonding regularly stereo image selecting element of baffle; CMOS-CMOS (Complementary Metal Oxide Semiconductor) or similar device); and an electrode 16 is set; with the surface that extends across stereo image selecting element 13 and the back of cover glass 15; and flat board 4 is installed in electrode 16; conduct to flat board 4 by a protuberance 16a, thereby can export the circuit element of a picture signal of stereo image selecting element 13 to other.14,15 protections of stereo image selecting element 13 usefulness cover glasses, so it does not need as placing stereo image selecting element 13 common stereo image selecting element in encapsulation.Cover glass 14,15 has dull and stereotyped shape, and its size is identical with the stereo image selecting element 13 of use, or is greater than or less than it.In other words, the state of Chu Xianing is here, the end face of stereo image selecting element 13, and the end face with cover glass 14,15 perhaps is greater than or less than it.
As shown in Figure 3, flange 8e, 8f contact with two side 13b, 13c of stereo image selecting element 13, adjoin each other in the inside of the laminated chips 6 that is installed in flat board 4.Therefore, realize the location of lens mount 8 and stereo image selecting element 13, and the optic axis of lens 7 overlaps with the center of the light absorption face 13a of stereo image selecting element 13.The positioning relation of the side of the neighboring of stereo image selecting element 13 and light absorption face 13a can accurately be determined, and the optic axis of lens 7 accurately overlaps with light absorption face 13a.
According to above-mentioned composition, the location of lens mount 8 is adjoining each other of the flange 8e, the 8f that are provided with on two sides by lens mount 8, and the adjoining each other of two side 13b, 13c of stereo image selecting element 13, and therefore, the optic axis of lens 7 can be easily and is accurately aimed at the light absorption face 13a of stereo image selecting element 13.Moreover, the contact portion 8d of lens mount 8 is contacted with the surface of laminated chips 6, in other words, cover glass 14, can be aimed at by self and realize on the direction of optic axis by its thickness direction positioning lens 7, and focus steps or mechanism can cancel.
Moreover, focus on composition though be configured to cancellation here, and make lens mount 8 not only contact two sides of stereo image selecting element 13, and on the thickness direction of cover glass 14, contact, the present invention should not be limited to this composition, but as shown in Figure 4, can connect a focusing mechanism.In such cases, do not need to make lens mount 8 on thickness direction, to contact with cover glass 14.Construct a kind of lens mount with composition of Fig. 4, it has second bearing 18 and first bearing 10.Inner rim in the bottom of second bearing 18 is provided with a negative thread part 18a, and the male screw portion 9a on the neighboring of it and lens mount 9 twists and closes, thereby fixed lens 7 is between second bearing 18 and lens mount 9.Neighboring in the bottom of second bearing 18 is provided with a male screw portion 18b, and it can be screwed into the negative thread part 10a of first bearing 10, in order to keeping second bearing 18, thereby fixes second bearing, 18 to first bearings 10.Segment distance between stereo image selecting element 13 and lens 7 finally regulate by the adjusting of the amount of being screwed into of second bearing 18 and first bearing 10, and after focusing on, second bearing 18 is fixed to first bearing 10 by bonding agent 20.Other composition is identical with Fig. 1's, so its explanation is omitted.
In addition, though an embodiment middle finger goes out to use cover glass 14,15 as baffle, the present invention should not be limited to this, but cover glass 14,15 can make with resin or plastic components, and this resin components should be a transparent element.
As mentioned above, be by two contacts side surfaces that make lens mount and stereo image selecting element according to the location of lens mount of the present invention, adjoin each other, therefore, the optic axis of lens can be easily and is accurately aimed at the light receiving surface of stereo image selecting element.Moreover, lens mount is contacted by thickness direction with baffle, the location on the direction of optic axis can aim at by self and realize, and focus steps or mechanism can cancel.
Claims (2)
1. stereo image shooting device, it has a stereo image selecting element, a flat board that is used to adhere to stereo image selecting element, and lens mount, it is equipped with lens and is used for the conglomeration volume image at stereo image selecting element, it is characterized in that described stereo image selecting element bonds together with baffle on one surface and a back; And lens mount is made for and has a rectangular cylinder part, be used for centering on to contain stereo image selecting element, and stereo image selecting element is installed in above the flat board, and two adjacent side of the neighboring of stereo image selecting element are contacted with two adjacent side of the inner rim of rectangular cylinder part.
2. according to the stereo image shooting device of claim 1, it is characterized in that rectangular cylinder partly is made for and has contact portion, with baffle by contacting on its thickness direction.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP044946/2002 | 2002-02-21 | ||
| JP2002044946A JP2003244559A (en) | 2002-02-21 | 2002-02-21 | Solid-state image pickup device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1440191A CN1440191A (en) | 2003-09-03 |
| CN1182702C true CN1182702C (en) | 2004-12-29 |
Family
ID=27784118
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB031054838A Expired - Fee Related CN1182702C (en) | 2002-02-21 | 2003-02-21 | Stereopicture camera device |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2003244559A (en) |
| KR (1) | KR100483721B1 (en) |
| CN (1) | CN1182702C (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005215369A (en) * | 2004-01-30 | 2005-08-11 | Miyota Kk | Solid-state imaging device |
| JP2006126800A (en) * | 2004-09-30 | 2006-05-18 | Mitsumi Electric Co Ltd | Camera module |
| JP4562566B2 (en) * | 2005-03-24 | 2010-10-13 | マミヤ・デジタル・イメージング株式会社 | Image sensor unit assembly method, image sensor unit, and digital camera |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63155648A (en) * | 1986-12-18 | 1988-06-28 | Toshiba Corp | Ceramic package for solid-state image sensor |
| JP2607542B2 (en) * | 1987-01-20 | 1997-05-07 | オリンパス光学工業株式会社 | Solid-state imaging device |
| JP2800290B2 (en) * | 1989-08-01 | 1998-09-21 | オリンパス光学工業株式会社 | Solid-state imaging device |
| JPH0384685U (en) * | 1989-12-19 | 1991-08-28 | ||
| JP3510277B2 (en) * | 1992-08-19 | 2004-03-22 | オリンパス株式会社 | Imaging unit |
| JPH0865579A (en) * | 1994-08-23 | 1996-03-08 | Olympus Optical Co Ltd | Solid state image pickup device |
| JP3498775B2 (en) * | 1995-05-31 | 2004-02-16 | ソニー株式会社 | Imaging device |
| JP3380949B2 (en) * | 1995-10-25 | 2003-02-24 | ソニー株式会社 | Semiconductor optical device |
| JP3932565B2 (en) * | 1995-11-06 | 2007-06-20 | コニカミノルタホールディングス株式会社 | Imaging device |
| JPH09312809A (en) * | 1996-05-24 | 1997-12-02 | Sony Corp | Ccd chip and its formation |
| JPH09322075A (en) * | 1996-05-29 | 1997-12-12 | Sony Corp | Lens mount device |
| JP3735163B2 (en) * | 1996-08-02 | 2006-01-18 | オリンパス株式会社 | Solid-state imaging device |
| JPH10227962A (en) * | 1997-02-14 | 1998-08-25 | Toshiba Corp | Optical device for electronic camera incorporating solid-state image pickup element |
| JPH11261861A (en) * | 1998-03-11 | 1999-09-24 | Olympus Optical Co Ltd | Image pickup unit for lens mirror frame |
| JP2000295503A (en) * | 1999-04-08 | 2000-10-20 | Olympus Optical Co Ltd | Image pickup unit for endoscope |
| JP3715834B2 (en) * | 1999-06-21 | 2005-11-16 | 京セラ株式会社 | Image sensor element storage package |
-
2002
- 2002-02-21 JP JP2002044946A patent/JP2003244559A/en not_active Abandoned
-
2003
- 2003-02-05 KR KR10-2003-0007095A patent/KR100483721B1/en not_active IP Right Cessation
- 2003-02-21 CN CNB031054838A patent/CN1182702C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN1440191A (en) | 2003-09-03 |
| JP2003244559A (en) | 2003-08-29 |
| KR100483721B1 (en) | 2005-04-18 |
| KR20030069812A (en) | 2003-08-27 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20041229 |