CN118267630A - Cosmetic appearance heat radiation structure and cosmetic appearance - Google Patents

Cosmetic appearance heat radiation structure and cosmetic appearance Download PDF

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Publication number
CN118267630A
CN118267630A CN202410379034.XA CN202410379034A CN118267630A CN 118267630 A CN118267630 A CN 118267630A CN 202410379034 A CN202410379034 A CN 202410379034A CN 118267630 A CN118267630 A CN 118267630A
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China
Prior art keywords
cooling
light
light reflecting
assembly
heat dissipation
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CN202410379034.XA
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Chinese (zh)
Inventor
李振琦
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Pushis Guangzhou Technology Co ltd
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Pushis Guangzhou Technology Co ltd
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Priority to CN202410379034.XA priority Critical patent/CN118267630A/en
Publication of CN118267630A publication Critical patent/CN118267630A/en
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Abstract

The invention provides a radiating structure of a beauty instrument and the beauty instrument. Wherein, beauty instrument heat radiation structure includes: cooling channels, light reflecting components and semiconductor cooling components. The end part of the cooling channel is provided with a light-emitting component; the end part of the cooling channel is also provided with a light guide block, and the light-emitting component can be abutted on the light guide block; cooling air flows through the cooling channel. The reflecting component is wound outside the light-emitting component. The semiconductor cooling assembly is arranged in the cooling channel, and the end part of the semiconductor cooling assembly is abutted on the light guide block and is close to the light reflecting assembly. The heat radiation structure of the beauty instrument can improve the heating condition of the beauty instrument through the cooperation of the multi-medium cooling components, so that the beauty instrument can operate for a long time. Meanwhile, the temperature of the light guide block can be controlled, and the touch feeling comfort of a user is improved.

Description

Cosmetic appearance heat radiation structure and cosmetic appearance
Technical Field
The invention relates to the field of beauty instruments, in particular to a heat dissipation structure of a beauty instrument and a beauty instrument.
Background
The infrared tungsten lamp tube can emit a spectrum of 900-1800nm, and the spectrum acts on skin to play roles in whitening, color lifting, pore shrinking, spot fading and the like, so that the prior cosmetic instrument is often provided with a light guide block, and light generated by the infrared tungsten lamp tube passes through the light guide block, and then the light guide block is attached to the skin of a human body to play a cosmetic role. However, the infrared tungsten lamp tube has serious heating condition, and if the heat is not timely radiated, the use experience can be affected, and even the potential safety hazard of injuring a user can exist.
In the related art, the cosmetic instrument generally radiates heat by adopting simple air cooling, but the radiating effect is poor, and in the radiating process, the cosmetic instrument can continuously generate heat, so that the burden of a radiating structure is increased, and finally, the cosmetic instrument is required to stop radiating after being used for a period of time, so that the cosmetic instrument is inconvenient to use.
Disclosure of Invention
In order to overcome the defects in the related art, the invention provides a radiating structure of a beauty instrument and the beauty instrument. Simultaneously, a cosmetic instrument applying the heat radiation structure of the cosmetic instrument is provided.
Embodiments of the present invention are implemented as follows:
A cosmetic instrument heat dissipation structure comprising: cooling channels, light reflecting components and semiconductor cooling components. The end part of the cooling channel is provided with a light-emitting component; the end part of the cooling channel is also provided with a light guide block, and the light-emitting component can be abutted against the light guide block; and cooling air circulates in the cooling channel. The light reflecting component is wound outside the light emitting component. The semiconductor cooling assembly is arranged in the cooling channel, and the end part of the semiconductor cooling assembly is abutted on the light guide block and is close to the light reflecting assembly.
Further, the light reflecting assembly comprises a first light reflecting piece and a second light reflecting piece, the first light reflecting piece is wound outside the light emitting assembly, and an opening is formed in the first light reflecting piece; the second reflecting piece is arranged at the opening of the first reflecting piece.
Further, the first reflecting piece is arranged in a semi-cylinder shape, and the axis of the first reflecting piece coincides with the axis of the light emitting component.
Further, the second light reflecting piece is arranged in a cylindrical shape, the end part of the second light reflecting piece is abutted to the opening of the first light reflecting piece, and the end part, far away from the first light reflecting piece, of the second light reflecting piece is abutted to the light guide block.
Further, the first reflecting piece and the second reflecting piece are internally provided with reflecting coatings.
Further, the light guide block comprises sapphire and an optical filter, the optical filter is arranged on the sapphire and is attached to the side face, close to the light-emitting component, of the sapphire, and the side face, far away from the light-emitting component, of the sapphire is arranged to be a curved surface.
Further, the semiconductor cooling assembly comprises a TEC refrigerating sheet and a liquid cooling module, wherein the TEC refrigerating sheet is attached to the light guide block, and the liquid cooling module can cool and dissipate heat of the TEC.
Further, the liquid cooling module comprises a heat dissipation piece and a liquid cooling pipeline, and the heat dissipation piece is arranged in the cooling channel; the liquid cooling pipeline sequentially passes through the heat radiating piece and the TEC refrigerating sheet to form a circulation loop, and a liquid cooling medium flows in the liquid cooling pipeline.
Further, a power piece is arranged on the liquid cooling pipeline, and the power piece can drive the liquid cooling medium to flow along the liquid cooling pipeline.
A cosmetic device comprising a housing and a cosmetic device heat dissipating structure as described in any of the above embodiments; the cooling channel is arranged in the shell, an air inlet and an air outlet which are communicated with the outside are formed in the shell, and the reflecting component and the semiconductor cooling component can exchange heat with cooling air flowing in the cooling channel.
Further, an air cooling assembly is further arranged in the cooling channel, the air cooling assembly comprises a fan, and the fan can drive cooling air to flow along the cooling channel.
The embodiment of the invention has the beneficial effects that:
The invention provides a heat dissipation structure of a beauty instrument, which comprises: cooling channels, light reflecting components and semiconductor cooling components. The end part of the cooling channel is provided with a light-emitting component; the end part of the cooling channel is also provided with a light guide block, and the light-emitting component can be abutted against the light guide block; and cooling air circulates in the cooling channel. The light reflecting component is wound outside the light emitting component. The semiconductor cooling assembly is arranged in the cooling channel, and the end part of the semiconductor cooling assembly is abutted on the light guide block and is close to the light reflecting assembly. Like this, when the beauty instrument carries out the operation, the luminous subassembly is luminous and produce heat, and the reflection of light subassembly can be effectively with the light guide that luminous subassembly produced to the light guide piece, avoids other structures to absorb light and generates heat, reduces the calorific capacity of beauty instrument from the root. Secondly, the semiconductor cooling assembly can radiate the light guide block, so that the overheat of the light guide block is avoided, and the use experience of the beauty instrument is influenced. The cooling air flowing in the cooling channel can radiate the semiconductor cooling component and the reflecting component in the cooling channel, so that the cooling radiating effect of the radiating structure is further improved.
Compared with the prior art, the radiating structure of the beauty instrument can improve the heating condition of the beauty instrument through the cooperation of the multi-medium cooling components, so that the beauty instrument can operate for a long time. Meanwhile, the temperature of the light guide block can be controlled, so that the temperature of the light guide block is proper in the use process of the beauty instrument, and the touch feeling of a user is comfortable.
In addition, the invention also relates to a beauty instrument, because the heat dissipation structure has the technical effects, the beauty instrument comprising the heat dissipation structure has the same technical effects, and the description is omitted herein.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic perspective view of a heat dissipation structure of a cosmetic device according to an embodiment of the present invention;
FIG. 2 is a schematic view of a heat dissipation structure of a cosmetic device according to an embodiment of the present invention;
FIG. 3 is a schematic view of a heat dissipation structure of a cosmetic device according to another embodiment of the present invention;
Fig. 4 is a schematic perspective view of a heat dissipation structure of a cosmetic device according to another embodiment of the present invention;
FIG. 5 is a schematic view of a heat dissipation structure of a cosmetic device according to an embodiment of the present invention;
FIG. 6 is a schematic view of an air cooling assembly and a semiconductor cooling assembly according to an embodiment of the present invention;
Fig. 7 is a schematic view illustrating a structure of a semiconductor cooling device and a reflector according to an embodiment of the invention.
Icon:
100-a housing; 110-a light guide block; 120-cooling channels; 200-a light reflecting component; 210-a first reflector; 220-a second reflector; 300-a semiconductor cooling assembly; 310-TEC refrigerating sheets; 320-heat sink; 330-a liquid cooling pipeline; 400-air cooling assembly; 410-a fan; 500-light emitting assembly.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments of the present invention. The components of the embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the invention, as presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.
In the description of the present invention, it should be noted that, directions or positional relationships indicated by terms such as "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., are directions or positional relationships based on those shown in the drawings, or are directions or positional relationships conventionally put in use of the inventive product, are merely for convenience of describing the present invention and simplifying the description, and are not indicative or implying that the apparatus or element to be referred to must have a specific direction, be constructed and operated in a specific direction, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used merely to distinguish between descriptions and should not be construed as indicating or implying relative importance.
Furthermore, the terms "horizontal," "vertical," and the like do not denote a requirement that the component be absolutely horizontal or overhang, but rather may be slightly inclined. As "horizontal" merely means that its direction is more horizontal than "vertical", and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.
In the description of the present invention, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
Example 1
The embodiment provides a heat dissipation structure of a beauty instrument, which is used for solving the problems of serious heating, poor heat dissipation capability and influence on use experience of the beauty instrument in the related technology.
Referring to fig. 1 to 3, a heat dissipation structure of a cosmetic apparatus includes: cooling channel 120, reflector assembly 200, and semiconductor cooling assembly 300. The end of the cooling channel 120 is provided with a light emitting assembly 500; the end part of the cooling channel 120 is also provided with a light guide block 110, and the light emitting component 500 can be abutted against the light guide block 110; cooling air flows through the cooling duct 120. The light reflecting assembly 200 is wound around the outside of the light emitting assembly 500. The semiconductor cooling assembly 300 is disposed in the cooling channel 120, and an end of the semiconductor cooling assembly 300 abuts against the light guide block 110 and is disposed near the light reflecting assembly 200.
Specifically, the heat dissipation structure of the beauty instrument of the embodiment can effectively cool and dissipate heat of the beauty instrument. The light emitting component 500 in the cosmetic instrument is usually a tungsten filament lamp, and the tungsten filament lamp emits light with a wide spectrum when in operation, and carries infrared radiation heat, so that the heat of the tungsten filament lamp and the surrounding is very high, that is, the main heat source in the cosmetic instrument is the light emitting component 500.
After the light emitting assembly 500 starts to operate, since the light reflecting assembly 200 is wound outside the light emitting assembly 500, the light reflecting assembly 200 can effectively isolate the light emitted by the light emitting assembly 500, so that most of the light is reflected to a designated direction under the guidance of the light reflecting assembly 200, namely, is reflected to the light guiding block 110, thereby reducing the contact between other structures and the light, avoiding the heat generated by other structures under the irradiation of the light, and reducing the heat productivity of the beauty instrument from the root.
The semiconductor cooling assembly 300 is abutted to the light guide block 110, and can cool and dissipate heat of the light guide block 110 synchronously when the light guide block 110 is irradiated by light to generate heat, so that the light can penetrate through the light guide block 110 and irradiate the skin of a user to stimulate the skin, and the beautifying effect is realized. The light guide block 110 is cooled by the semiconductor cooling assembly 300, so that the temperature of the light guide block 110 is kept appropriate, the light guide block 110 is convenient to be attached to the skin of a user, the use experience of the user is improved, and meanwhile, the beauty instrument can be continuously used without worrying about heating.
Furthermore, the light reflecting component 200 and the semiconductor cooling component 300 are both disposed in the cooling channel 120, and the cooling air flowing in the cooling channel 120 can continuously exchange heat between the light reflecting component 200 and the semiconductor cooling component 300, cool and dissipate heat, so as to improve the heat dissipation capability of the heat dissipation structure of the beauty instrument of the embodiment. When cooling air flows through the cooling channel 120, the cooling air can also flow through the light emitting module 500 and the light guide block 110, and thus, the cooling air is matched with the light reflecting module 200 and the semiconductor cooling module 300 to cool and dissipate heat, so that the heat dissipation capacity of the embodiment is improved.
It should be noted that, the light emitting component 500 in the beauty instrument is generally configured as a tungsten filament lamp, and the tungsten filament lamp can emit milk light, i.e. light with a near infrared spectrum (peak 1300 nm) of 900-1800mm, and such light acts on water in the middle-deep dermis of the skin. When the surface layer of water is irradiated with milk, the distance between each water molecule increases, making the liquid "more fluid". Mitochondria are energized by an enzyme that binds to their cell membrane. The enzyme rotates like a molecular turbine, and being surrounded by more fluid water can make it easier to turn, thereby producing more ATP.
ATP (adenosine triphosphate) promote the repair and regeneration of organism cells, ATP, adenosine triphosphate, belongs to a coenzyme, is a direct source of energy required by all vital activities of tissue cells in the body, can promote the repair and regeneration of cells in the body, promote the enhancement of the bioactivity of collagen fibers, redistribute dermis layers, repair damaged skin and enable the skin to be an excellent reflector, thereby indirectly increasing the refractive index of the surface of the skin, and further enabling the skin to whiten and tender.
The photothermal effect promotes pigment metabolism and decomposition, the photothermal effect generated by milk light can enhance blood vessel function, expand micro blood vessels, accelerate blood circulation, increase oxygen content of blood, accelerate metabolite removal, and realize cosmetic effect by the way.
In one embodiment, as shown in fig. 6 and 7, the light reflecting component 200 includes a first light reflecting member 210 and a second light reflecting member 220, wherein the first light reflecting member 210 is wound around the outside of the light emitting component 500, and an opening is provided on the first light reflecting member 210; the second light reflecting member 220 is disposed at the opening of the first light reflecting member 210. The first reflecting member 210 is disposed outside the light emitting assembly 500, so that the light generated by the light emitting assembly 500 can be prevented from being irradiated onto other structures, which results in heating of the main body of the beauty instrument. In addition, be provided with the opening on the first reflection of light piece 210 to be provided with the second reflection of light piece 220 in the opening part, can pass through first reflection of light piece 210, the cooperation of second reflection of light piece 220, lead the light that luminous subassembly 500 produced to appointed direction, when realizing the cooling function, can also concentrate the light that luminous subassembly 500 produced, improve the result of use of beauty instrument.
In one embodiment, as illustrated in fig. 6 and 7, the first light reflecting member 210 is provided in a semi-cylindrical shape, and an axis of the first light reflecting member 210 coincides with an axis of the light emitting assembly 500. The coaxiality of the first reflecting piece 210 and the light emitting assembly 500 is controlled, so that the direction of the first reflecting piece 210 to the light generated by the light emitting assembly 500 can be controlled, the first reflecting piece 210 and the light emitting assembly 500 are coaxially arranged, the light generated by the light emitting assembly 500 can be uniformly reflected, and the light is emitted from the opening of the first reflecting piece 210.
In one embodiment, as shown in fig. 6 and 7, the second light reflecting member 220 is illustratively provided in a cylindrical shape, an end of the second light reflecting member 220 abuts against the opening of the first light reflecting member 210, and an end of the second light reflecting member 220 far from the first light reflecting member 210 abuts against the light guiding block 110. The light emitted from the first light reflecting member 210 may enter the second light reflecting member 220, the second light reflecting member 220 is configured in a cylindrical shape, and the light entering the second light reflecting member 220 may be guided by the second light reflecting member 220 to be emitted into the light guiding block 110 and emitted from the light guiding block 110. Thus, the light is effectively prevented from leaking to the outside of the second reflecting member 220, not only the heating of the external structure can be avoided, but also the light can be concentrated, and the beautifying effect is ensured.
It can be appreciated that, in actual production, the first light reflecting member 210 and the second light reflecting member 220 can be set to any shape according to the actual shape of the light emitting assembly 500 and the condition of the internal space of the beauty treatment apparatus, so long as the light generated by the light emitting assembly 500 can be prevented from leaking and the light generated by the light emitting assembly 500 can be guided. In the present embodiment, the first light reflecting member 210 is configured to be semi-cylindrical, and the second light reflecting member 220 is configured to be cylindrical, so that the processing is facilitated, and the production cost is reduced.
In one embodiment, the first and second reflectors 210 and 220 are each provided with a reflective coating inside, for example. The reflective coating is arranged in the first reflective member 210 and the second reflective member 220, so that the reflective capability of the inner walls of the first reflective member 210 and the second reflective member 220 to light is improved, the light is prevented from directly passing through the inner walls and irradiating the external structure, and meanwhile, the light can be guided through the reflective capability, so that the light is irradiated to the target position. The reflective coating can be selected, and materials with different materials can be flexibly selected as the reflective coating according to different light rays. In the embodiment, aiming at milk light with the wavelength of 900-1800mm, the aluminum-based silver-plated reflecting film is selected as the reflecting coating, so that the optical efficiency of light reflected on the reflecting surface each time can be improved, and the heat generation is reduced.
It is worth mentioning that the efficacy of skin care is mainly determined by the energy density, and the greater the energy density, the better the effect within the safe range of values. The energy density is affected by the energy and the spot size, the larger the energy density, and the smaller the spot size, the larger the energy density. Therefore, the embodiment of changing the energy density is to change the intensity of the energy and the size of the light spot area, and the reduction of the size of the opening of the light reflecting component 200 is the most important change on the premise of ensuring the heat dissipation capability of the light guiding component. The minimum limit value of the spot size is the cross-sectional size of the reflector 200 tangential to the outer diameter of the lamp tube by the reflection of the light by the reflector 200, and such light can pass through the light guide to act on the skin, thereby improving the cosmetic effect of the present embodiment.
In one embodiment, as illustrated in fig. 4-6, the semiconductor cooling assembly 300 includes a TEC cooling plate 310 and a liquid cooling module, where the TEC cooling plate 310 is attached to the light guide block 110, and the liquid cooling module is capable of cooling the TEC. The TEC cooling plate 310, i.e. the semiconductor cooling plate, is characterized in that when the TEC cooling plate 310 works, one side surface refrigerates, and the other side surface heats. In this embodiment, the side surface cooled by the TEC cooling plate 310 is attached to the light guide block 110, and the liquid cooling module cools and dissipates heat to the side surface heated by the TEC cooling plate 310. Like this, through TEC refrigeration piece 310, make light guide block 110 keep suitable temperature, when the user is in use, can directly laminate light guide block 110 on skin, improve the cooling heat dissipation ability of this embodiment, and then improve the use experience of beauty instrument.
It should be noted that the cooling capacity of the TEC cooling plate 310 is affected by the supply voltage, i.e., the greater the voltage supplied to the TEC cooling plate 310, the greater the cooling capacity of the TEC cooling plate 310. On this basis, in this embodiment, a control element can be further provided, and the voltage of the TEC refrigerating plate 310 is controlled by the control element, so that when the temperature of the light guide block 110 is high, the voltage is increased, the refrigerating capacity of the TEC refrigerating plate 310 is improved, and otherwise, the voltage is reduced. Through the control to TEC refrigeration piece 310 for light guide block 110 can keep at suitable temperature, further improves the heat dispersion of this embodiment, improves the use experience of beauty instrument.
It should be noted that, the heat dissipation effect of the heated surface of the TEC refrigeration sheet 310 will affect the refrigeration effect of the refrigerated side surface in a reverse way, in this embodiment, since the heat dissipation structure of the tungsten filament lamp tube is disposed adjacent to the TEC refrigeration sheet 310, in order to prevent the heat generated by the heat dissipation of the tungsten filament lamp tube from interfering with the heat dissipation effect of the TEC refrigeration sheet 310, the heat dissipation structure and the heat dissipation structure are separated by a space isolation and heat insulation way, so that they are not affected each other, and each run, thereby ensuring that the sapphire contacted with the skin of the user obtains a good refrigeration effect.
In one embodiment, as illustrated in fig. 4 to 6, the liquid cooling module includes a heat sink 320 and a liquid cooling pipe 330, the heat sink 320 being disposed in the cooling passage 120; the liquid cooling pipeline 330 sequentially passes through the heat sink 320 and the TEC refrigerating plate 310 and forms a circulation loop, and a liquid cooling medium flows through the liquid cooling pipeline 330. Thus, when the liquid cooling pipeline 330 passes through the TEC refrigerating piece 310, heat exchange is performed on the heat generating part of the TEC refrigerating piece 310, the temperature of the liquid cooling pipeline 330 is low, and the temperature of the TEC refrigerating piece 310 is absorbed to cool the same. When the liquid cooling pipe 330 passes through the heat dissipating member 320, the heat dissipating member 320 dissipates heat of the warmed liquid cooling pipe 330, so as to dissipate heat carried by the fluid in the liquid cooling pipe 330 after flowing through the TEC cooling plate 310. By repeating the cycle, the TEC cooling fin 310 is cooled and dissipated.
It is understood that the heat sink 320 may be configured in any structure as long as the liquid cooling pipe 330 can be cooled. Illustratively, the heat sink 320 is configured as a heat sink fin, such that when the liquid cooling tube 330 contacts the heat sink fin, heat is transferred from the liquid cooling tube 330 to the heat sink fin, which has a larger surface area and dissipates heat faster, thereby providing a heat dissipation effect. Furthermore, the heat dissipation fins are also arranged in the cooling channel 120, and cooling air flowing in the cooling channel 120 is matched with the larger surface area of the heat dissipation fins, so that the heat dissipation fins can dissipate heat rapidly.
In one embodiment, the liquid cooling conduit 330 is illustratively provided with a power member capable of driving a liquid cooling medium along the liquid cooling conduit 330. The liquid cooling medium is driven to flow along the liquid cooling pipeline 330 through the power piece, so that the heat dissipation capacity of the liquid cooling pipeline 330 is improved. The power piece can be set as a water pump, so that the flow speed of the liquid cooling medium is improved, the heat dissipation capacity is improved, and the operation is stable and reliable.
Example 2
The present embodiment provides a cosmetic apparatus, including a housing 100 and the cosmetic apparatus heat dissipation structure of any one of the above embodiments; the cooling channel 120 is disposed in the housing 100, and the cooling channel 120 is formed with an air inlet and an air outlet communicating with the outside on the housing 100, and the light reflecting component 200 and the semiconductor cooling component 300 can exchange heat with the cooling air flowing in the cooling channel 120.
It should be noted that, at least a part of the structures of the light reflecting component 200 and the semiconductor cooling component 300 are located in the cooling channel 120, and when the cooling air in the cooling channel 120 circulates, the light reflecting component 200 and the semiconductor cooling component 300 can be cooled down secondarily. The casing 100 is provided with an air inlet and an air outlet which are communicated with the outside, so that the temperature of the cooling air flowing in the cooling channel 120 can not rise along with the increase of the working time, and the cooling air in the cooling channel 120 is kept to be fresh air flowing in from the outside.
In one embodiment, the housing 100 of the beauty instrument has opposite upper and lower ends, and the light guide block 110, the light emitting assembly 500, the light reflecting assembly 200, and the semiconductor cooling assembly 300 are sequentially disposed in a direction from the upper end to the lower end of the housing 100, and the cooling channel 120 is disposed to extend from the upper end to the lower end of the housing 100. Accordingly, the air inlet is formed at the connection position between the cooling channel 120 and the upper end of the housing 100, and the air outlet is formed at the connection position between the cooling channel 120 and the lower end of the housing 100, so that when cooling air flows from the cooling channel 120, the cooling air can flow from the upper end of the housing 100 to the lower end of the housing 100, and the cooling and heat dissipation of each part can be sequentially performed from the light emitting assembly 500 with serious heat generation.
Of course, the beauty instrument is used as a handheld device, and the flow direction of the cooling air in the cooling channel 120 can also be set to flow from the handheld portion to the non-handheld portion, so that the handheld portion of the beauty instrument can maintain a proper and proper temperature, and the use experience of a user is prevented from being influenced by the overhigh temperature of the handheld portion.
In one embodiment, and by way of example, an air cooling assembly 400 is also disposed within the cooling gallery 120, the air cooling assembly 400 including a fan 410, the fan 410 being capable of driving cooling air along the cooling gallery 120. The fan 410 can keep the cooling air flowing in the cooling passage 120 stably for a long time, and further, the heat exchange efficiency of the reflector 200 and the semiconductor cooling module 300 can be improved by the cooling air flowing stably.
In one embodiment, the light guide block 110 includes sapphire and an optical filter, the optical filter is disposed on the sapphire and is attached to a side of the sapphire near the light emitting assembly 500, and a side of the sapphire far from the light emitting assembly 500 is disposed as a curved surface. The light emitted by the light emitting component 500 is in the near infrared spectrum with the wavelength of 900-1800mm, and the infrared light can generate 5-7% loss when passing through one lens surface. In this embodiment, the sapphire and the optical filter are attached to each other, and the clutter light can be absorbed by the optical filter, so that the loss of the light passing through the sapphire and the optical filter is reduced. In addition, set up the curved surface on the sapphire, can make the sapphire laminate skin more, accomplish to slide not fretwork, tightly not leak light, conduction cold volume cooling, further improve the use experience of beauty instrument.
The above description is only of the preferred embodiments of the present invention and is not intended to limit the present invention, but various modifications and variations can be made to the present invention by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (10)

1. A cosmetic instrument heat dissipation structure, comprising:
a cooling channel (120), an end of the cooling channel (120) being provided with a light emitting assembly (500); the end part of the cooling channel (120) is also provided with a light guide block (110), and the light-emitting component (500) can be abutted on the light guide block (110); cooling air flows through the cooling channel (120);
The light reflecting component (200), the said light reflecting component (200) winds the outside of the said light-emitting component (500);
The semiconductor cooling assembly (300) is arranged in the cooling channel (120), and the end part of the semiconductor cooling assembly (300) is abutted on the light guide block (110) and is arranged close to the light reflecting assembly (200).
2. The heat dissipation structure of a beauty treatment instrument according to claim 1, wherein the light reflecting component (200) comprises a first light reflecting member (210) and a second light reflecting member (220), the first light reflecting member (210) is wound outside the light emitting component (500), and an opening is provided on the first light reflecting member (210); the second light reflecting piece (220) is arranged at the opening of the first light reflecting piece (210).
3. The heat radiation structure of beauty instrument according to claim 2, characterized in that the first light reflecting member (210) is provided in a semi-cylindrical shape, and an axis of the first light reflecting member (210) coincides with an axis of the light emitting assembly (500).
4. The heat dissipation structure of a beauty instrument according to claim 2, wherein the second light reflecting member (220) is configured as a tube, an end of the second light reflecting member (220) abuts against an opening of the first light reflecting member (210), and an end of the second light reflecting member (220) far from the first light reflecting member (210) abuts against the light guiding block (110).
5. The heat dissipation structure of a beauty instrument according to claim 1, wherein the light guide block (110) comprises a sapphire and a light filter, the light filter is disposed on the sapphire and is attached to a side surface of the sapphire, which is close to the light emitting component (500), and a side surface of the sapphire, which is far from the light emitting component (500), is disposed as a curved surface.
6. The heat dissipation structure of a beauty apparatus according to claim 1, wherein the semiconductor cooling assembly (300) includes a TEC cooling plate (310) and a liquid cooling module, the TEC cooling plate (310) is attached to the light guide block (110), and the liquid cooling module can cool and dissipate heat of the TEC.
7. The cosmetic device heat dissipation structure according to claim 6, wherein the liquid cooling module comprises a heat sink (320) and a liquid cooling pipe (330), the heat sink (320) being disposed within the cooling channel (120); the liquid cooling pipeline (330) sequentially passes through the heat radiating piece (320) and the TEC refrigerating piece to form a circulation loop, and a liquid cooling medium flows in the liquid cooling pipeline (330).
8. The heat dissipation structure of a beauty apparatus according to claim 7, wherein the liquid cooling pipe (330) is provided with a power member, and the power member can drive the liquid cooling medium to flow along the liquid cooling pipe (330).
9. A cosmetic device comprising a housing and a cosmetic device heat dissipation structure as claimed in any one of claims 1 to 8; the cooling channel is arranged in the shell, the cooling channel (120) is provided with an air inlet and an air outlet communicated with the outside, and the reflecting component (200) and the semiconductor cooling component (300) can exchange heat with cooling air flowing in the cooling channel (120).
10. The cosmetic apparatus heat dissipation structure according to claim 9, wherein an air cooling assembly (400) is further disposed in the cooling channel, the air cooling assembly (400) comprises a fan (410), and the fan (410) is capable of driving cooling air to flow along the cooling channel (120).
CN202410379034.XA 2024-03-29 2024-03-29 Cosmetic appearance heat radiation structure and cosmetic appearance Pending CN118267630A (en)

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CN202410379034.XA CN118267630A (en) 2024-03-29 2024-03-29 Cosmetic appearance heat radiation structure and cosmetic appearance

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