CN118263764A - Packaging method, packaging device and detection equipment - Google Patents

Abstract

The application provides a packaging method, a packaging device and detection equipment, and relates to the technical field of semiconductors, wherein the method comprises the following steps: according to the packaging method provided by the embodiment of the application, a metal layer and a metal through hole between the first surface and the second surface are generated on the first surface and the second surface of the substrate; bonding a wire bonding capacitor and a driving chip on a metal layer on the first surface of the substrate; bonding the transmitting chip on the routing capacitor; electrically connecting the transmitting chip, the driving chip and the routing capacitor; sealing the optical chip according to the tube shell; and a light window is formed on the tube shell, so that the emitted light of the emitting chip is emitted out through the light window. The transmitting chip is adhered to the routing capacitor for electric connection, so that the length of the lead is reduced, and the electromagnetic interference is further reduced.

Description

Packaging method, packaging device and detection equipment

Technical Field

The present application relates to the field of semiconductor technologies, and in particular, to a packaging method, a packaging device, and a detection apparatus.

Background

The laser radar can calculate through the time of emitting emergent light and the time of receiving reflected light, and the distance between the laser radar and the detected object can be obtained. The laser radar may generate and emit outgoing light through a preset packaging device, and/or receive reflected light reflected by the detected object.

In the related art, in the process of packaging the packaging device, a driving chip, a transmitting chip and a wire bonding capacitor can be sequentially arranged on one surface of the base, and the driving chip, the transmitting chip and the wire bonding capacitor can be connected through leads.

However, parasitic inductance can be caused by leads among the driving chip, the transmitting chip and the routing capacitor, and the use precision of the device is affected.

Disclosure of Invention

The application provides a packaging method, a packaging device and detection equipment, which solve the problem that parasitic inductance is caused by leads among a driving chip, a transmitting chip and a wire bonding capacitor in the prior art, and the use precision of the device is affected.

In a first aspect, an embodiment of the present application provides a packaging method, including:

generating a metal layer on a first surface and a second surface of a substrate and a metal through hole between the first surface and the second surface;

Bonding a wire bonding capacitor and a driving chip on a metal layer on the first surface of the substrate;

Bonding the transmitting chip on the routing capacitor;

Electrically connecting the transmitting chip, the driving chip and the routing capacitor;

sealing the optical chip according to the tube shell;

and a light window is formed on the tube shell, so that the emitted light of the emitting chip is emitted out through the light window. .

Optionally, electrically connecting the transmitting chip, the driving chip and the routing capacitor includes:

connecting a first polar plate of the routing capacitor with a metal layer on the first surface of the substrate through a lead;

and connecting the driving chip with the emitting chip through a lead.

Optionally, the driving chip is a metal-oxide-semiconductor chip, and the gate of the driving chip is connected with the metal layer on the first surface of the substrate through a lead;

connecting a source electrode of the driving chip with one end of the driving chip through a lead;

And adhering the drain electrode of the driving chip to the metal layer on the first surface of the substrate.

Optionally, bonding a second plate of the routing capacitor to a metal layer of the substrate;

bonding a first end of the transmitting chip on a first polar plate of the routing capacitor;

and connecting the second end of the transmitting chip with the driving chip.

In a second aspect, an embodiment of the present application provides a packaged device, including: the device comprises a substrate, a tube shell, a wire bonding capacitor, a driving chip and a transmitting chip;

a metal layer is arranged on the surface of the substrate, and metal through holes are arranged between the surfaces;

the tube shell covers the substrate and forms a cavity;

A routing capacitor and a driving chip are arranged on the first surface of the substrate, and a transmitting chip is arranged on the routing capacitor;

the tube shell is provided with an optical window;

The transmitting chip is connected with the driving chip through a lead;

and emergent light generated by the transmitting chip is transmitted out through the light window.

Optionally, a lens assembly is disposed at the light window.

Optionally, the first polar plate of the routing capacitor is connected with the metal layer on the first surface of the substrate through a lead;

The driving chip is connected with the emitting chip through a lead.

Optionally, the driving chip is a metal-oxide-semiconductor chip, and the gate of the driving chip is connected with the metal layer on the first surface of the substrate through a lead;

The source electrode of the driving chip is connected with one end of the emitting chip through a lead;

The drain electrode of the driving chip is adhered to the metal layer on the first surface of the substrate.

Optionally, the second plate of the routing capacitor is adhered to the metal layer of the substrate;

the first end of the transmitting chip is adhered to the first polar plate of the routing capacitor;

The second end of the transmitting chip is connected with the driving chip.

In a third aspect, an embodiment of the present application provides a detection apparatus, including: the packaged device of any of the second aspects.

According to the packaging method provided by the embodiment of the application, a metal layer and a metal through hole between the first surface and the second surface are generated on the first surface and the second surface of the substrate; bonding a wire bonding capacitor and a driving chip on a metal layer on the first surface of the substrate; bonding the transmitting chip on the routing capacitor; electrically connecting the transmitting chip, the driving chip and the routing capacitor; sealing the optical chip according to the tube shell; and a light window is formed on the tube shell, so that the emitted light of the emitting chip is emitted out through the light window. The transmitting chip is adhered to the routing capacitor for electric connection, so that the length of the lead wire is reduced, and parasitic inductance is further reduced.

Drawings

FIG. 1A is a schematic diagram of a detection system according to an embodiment of the present application;

FIG. 1B is a schematic diagram of another detection system according to an embodiment of the present application;

fig. 1C is a schematic structural diagram of a detection device according to an embodiment of the present application;

fig. 2 is a schematic structural diagram of a package device according to an embodiment of the present application;

fig. 2A is a schematic diagram illustrating connection between the package and the package according to an embodiment of the present application;

Fig. 3 is a schematic flow chart of a packaging method according to an embodiment of the present application.

Detailed Description

In the following description, for purposes of explanation and not limitation, specific details are set forth such as the particular system architecture, techniques, etc., in order to provide a thorough understanding of the embodiments of the present application. It will be apparent, however, to one skilled in the art that the present application may be practiced in other embodiments that depart from these specific details. In other instances, detailed descriptions of well-known semiconductor processes, probing methods, and electronic devices are omitted so as not to obscure the description of the present application with unnecessary detail.

The terminology used in the following examples is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in the specification of the present application and the appended claims, the singular forms "a," "an," "the," and "the" are intended to include, for example, "one or more" such forms of expression, unless the context clearly indicates to the contrary.

The distance between the laser radar and the detected object can be obtained by calculating the time when the laser radar emits emergent light and the time when the laser radar receives reflected light. The laser radar may generate and emit outgoing light through a preset packaging device, and/or receive reflected light reflected by the detected object.

In the related art, in the process of packaging the packaging device, a driving chip, a transmitting chip and a wire bonding capacitor can be sequentially arranged on one surface of the base, and the driving chip, the transmitting chip and the wire bonding capacitor can be connected through leads.

However, parasitic inductance can be caused by leads among the driving chip, the transmitting chip and the routing capacitor, and the use precision of the device is affected.

Therefore, the application provides a packaging method, wherein a metal layer and a metal through hole between a first surface and a second surface of a substrate are generated on the first surface and the second surface; bonding a wire bonding capacitor and a driving chip on a metal layer on the first surface of the substrate; bonding the transmitting chip on the routing capacitor; electrically connecting the transmitting chip, the driving chip and the routing capacitor; sealing the optical chip according to the tube shell; and a light window is formed on the tube shell, so that the emitted light of the emitting chip is emitted out through the light window. The transmitting chip is adhered to the routing capacitor for electric connection, so that the length of the lead wire is reduced, and parasitic inductance is further reduced.

The following describes a packaged device obtained by the packaging method provided by the embodiment of the present application, and a related detection system. Referring to fig. 1A, fig. 1A is a schematic system diagram of a detection system according to an embodiment of the present application, as shown in fig. 1A, the detection system may include: a detection device 110 and a detected object 120.

Wherein the detection device 110 may be provided therein with a package device, so that the outgoing light may be emitted through the package device, and the detection of the detected object 120 may be accomplished by the emitted outgoing light and the received reflected light.

Moreover, the detecting device 110 and the detected object 120 are distributed at different positions, respectively. Moreover, the detection device 110 may be stationary or may be moving; similarly, the object 120 to be detected may be stationary or moving. For example, the detection device 110 may be a stationary range finder or a lidar mounted on a vehicle; the detected object 120 may be a stationary tree or a guardrail, or may be a moving vehicle or a pedestrian, and the detected device 110 and the detected object 120 are not particularly limited in the embodiment of the present application.

In the process of detecting the detected object 120 by the detecting device 110, the detecting device 110 may generate and emit outgoing light through a preset packaging device, so that the detected object 120 is irradiated with the outgoing light.

Accordingly, the object 120 to be detected may reflect the outgoing light, thereby forming reflected light. Wherein part of the reflected light may propagate along a path opposite to the outgoing light to reach the detection device 110. The detection device 110 may also receive the reflected light through the encapsulation device and determine the distance between the detection device 110 and the detected object 120 based on the reflected light and the emitted outgoing light, thereby completing the detection of the detected object 120.

Referring to fig. 1B, fig. 1B is a schematic system diagram of another detection system provided in an embodiment of the present application, as shown in fig. 1B, in practical application, the detection system may further include: the carrier 130 is moved.

The mobile carrier 130 may be a vehicle, an unmanned aerial vehicle, a robot, or other devices capable of traveling, and the embodiment of the present application does not specifically limit the mobile carrier 130.

Moreover, the detection device 110 may be provided on the moving carrier 130. While the moving carrier 130 is in motion, the detection device 110 may detect the environment around the moving carrier 130, thereby determining the distance between the detected object 120 and the moving carrier 130, as well as the speed of motion of the detected object 120.

Further, the moving carrier 130 may determine a trend of a change in the distance between the detected object 120 and the moving carrier 130, that is, determine whether the detected object 120 is moving away from the moving carrier 130 or moving close to the moving carrier 130, according to the determined movement speed of the detected object 120 in combination with the traveling speed of the moving carrier 130.

For example, the detection device 110 may be provided on a vehicle to detect pedestrians and other vehicles around the vehicle; or the detection device 110 can be arranged on the unmanned aerial vehicle, and the detection device can scan and detect the current area in the flight process of the unmanned aerial vehicle; alternatively, the detection device 110 may be provided on the robot, and a travel route may be constructed for the robot by data collected by the detection device 110.

In addition, in practical application, the detection device 110 may be not only disposed on the mobile carrier 130, but also fixed at a certain position, so that the detection device 110 may be applied to different scenes respectively.

For example, the detection device 110 may be disposed above the conveyor belt to detect material transported on the conveyor belt; the detection device 110 may also be provided at a toll booth, count vehicles passing therethrough, and detect the size of each vehicle to determine whether the vehicle can drive into a highway.

Of course, the detection device 110 may also be applied to other scenarios, and the application scenario of the detection device 110 is not specifically limited in the embodiment of the present application.

Further, referring to fig. 1C, fig. 1C is a schematic structural diagram of a detection device according to an embodiment of the present application, as shown in fig. 1C, the detection device 110 may include: a processor 1101, a driving circuit 1102, a laser 1103, a light emitting module 1104, a receiving module 1105 and a photoelectric converter 1106.

The processor 1101 is connected to the driving circuit 1102 and the photoelectric converter 1106, the laser 1103 is connected in series between the driving circuit 1102 and the light emitting module 1104, and the receiving module 1105 is connected to the photoelectric converter 1106.

Moreover, the laser 1103 may be a packaged device obtained by the packaging method provided by the embodiment of the present application.

In addition, in practical applications, the driving circuit 1102, the light emitting module 1104 and the receiving module 1105 may be packaged together in a packaged device. For example, the packaged device may have packaged therein: the components included in the package device according to the embodiments of the present application are not particularly limited, and include a plurality of components such as the driving circuit 1102, the laser 1103, the light emitting module 1104, the receiving module 1105, and the photoelectric converter 1106.

Specifically, during the process of emitting outgoing light by the detection device 110, the processor 1101 may acquire a pre-stored driving sequence signal in the storage space according to a pre-set storage path. The processor 1101 may then send the drive sequence signal to the drive circuit 1102, which drive circuit 1102 may amplify and transmit the amplified drive sequence signal to the laser 1103.

Wherein the driving sequence signal is an electrical signal (e.g. a sequence consisting of a number 0 and a number 1) which can be in a digital form, and the driving sequence signal is not particularly limited in the embodiment of the present application.

After that, the laser 1103 can receive the amplified driving sequence signal sent by the driving circuit 1102, and control the laser 1103 to emit light or to turn off according to the amplified driving sequence signal. When the laser 1103 emits light, the light emitting module 1104 can adjust the light emitted by the laser 1103, so as to form emergent light; when the laser 1103 is extinguished, no more outgoing light is generated.

Accordingly, the outgoing light may irradiate the detected object 120 to form reflected light. The reflected light may propagate along a path opposite to the outgoing light towards the detection device 110. The receiving module 1105 may receive the reflected light and irradiate the photoelectric converter 1106 with the received reflected light.

When the reflected light irradiates the photoelectric converter 1106, the photoelectric converter 1106 may output a level signal to the processor 1101, and the processor 1101 may record the time when the emitted light is received by the photoelectric converter 1106, so that the time taken for the emitted light and the reflected light to propagate is determined according to the time when the emitted light is generated and the time when the emitted light is received, and further, the distance between the detection device 110 and the detected object 120 may be calculated according to the time.

In practical applications, the processor 1101 may be a central processing unit (central processing unit, CPU), a field programmable gate array (field programmable GATE ARRAY, FPGA), a micro control unit (micro control unit, MCU) or a digital signal processor (DIGITAL SIGNAL processing, DSP), and the embodiment of the application does not limit the processor 1101 specifically.

Similarly, the laser 1103 may be a semiconductor laser, a solid state laser, or other type of laser. If the laser 1103 is a semiconductor laser, the laser 1103 may be a vertical-cavity-cavitysurface-EMITTINGLASER (VCSEL) or an edge-emitting semiconductor laser (EEL), and the embodiment of the application is not limited to the laser 1103.

In addition, the outgoing light emitted by the laser 1103 may be a laser having a certain wavelength, for example, the outgoing light may be a laser having a wavelength of 905 nanometers (nm), 950nm or 1550nm, and the wavelength of the outgoing light is not specifically limited in the embodiments of the present application.

In addition, the photoelectric converter 1106 may be an optocoupler, a photodiode, or other devices with photoelectric conversion function, for example, if the photoelectric converter 1106 is a photodiode, the photoelectric converter 1106 may be a single photon avalanche diode (single photon avalanche diode, SPAD), which is not particularly limited in the embodiment of the present application.

In practical applications, the chip integrated with the laser 1103 may be packaged as an optical chip, thereby obtaining a packaged device. Of course, in the process of packaging the optical chip, the driving circuit 1102, the light emitting module 1104 and the receiving module 1105 may also be packaged simultaneously to obtain a packaged device including a plurality of components, and the components included in the packaged device are not specifically limited in the embodiment of the present application.

The following describes a device structure of the packaged device, taking an example in which the packaged device is packaged with an emission chip corresponding to the laser 1103.

Referring to fig. 2, fig. 2 is a schematic structural diagram of a package device according to an embodiment of the present application, and as shown in fig. 2, the package device may include: a substrate 201, an emitting chip 202, a driving chip 203, a wire bonding capacitor 204, a package 205, and an optical window 206.

Wherein, the tube shell 205 covers on the substrate 201 to form a cavity with the substrate 201, the emitting chip 202, the driving chip 203 and the routing capacitor 204 are all located in the cavity formed by the tube shell 205 and the substrate 201, and the emitting chip 202, the driving chip 203 and the routing capacitor 204 can be all disposed on the substrate 201, and the tube shell 205 is provided with an optical window.

Also, the emitting chip 204 may be a laser 1103 having a function of generating and emitting light.

The above describes the overall structure of the device package, and the following describes the connection relationship inside the overall package structure, see fig. 2A. Fig. 2A is a schematic diagram illustrating connection between the package device and the package device according to an embodiment of the present application.

As shown in fig. 2A, one plate of the wire bonding capacitor 204 is adhered to the metal layer on the first surface of the substrate 201, and the other plate of the wire bonding capacitor 204 (the plate not connected to the substrate 201) is connected to the metal layer on the first surface of the substrate by a lead; one side of the transmitting chip 202 is adhered to the other electrode plate (the electrode plate which is not connected with the substrate 201) of the wire bonding capacitor 204; the driving chip 205 may be a metal-oxide-semiconductor (MOS) chip. The drain electrode of the driving chip 203 is adhered to the metal layer on the first surface of the substrate 201, and the gate electrode of the driving chip 203 is connected with the metal layer on the substrate 201 through a lead; the source of the driving chip 203 is connected to the other side of the emitting chip 202 (the side not bonded to the wiring capacitor 204) through a wire.

The second surface of the substrate 201 is also provided with a metal layer, and the metal book on the first surface and the metal layer on the second surface are connected by a through hole.

In addition, the bonding material may be any one of conductive glue, conductive adhesive film, conductive adhesive ring, conductive adhesive tape, etc., and the material of the conductive adhesive may be any one of conductive silver adhesive, copper powder conductive adhesive, nickel carbon conductive adhesive, silver copper conductive adhesive, etc., which are not particularly limited in the embodiment of the application.

The emitting chip, the driving chip, the wire bonding capacitor and other components of the packaging device can be packaged in a cavity formed by the substrate and the tube shell. In the packaging process, different packaging modes can be used for packaging the components, and the following description will be given with respect to a packaging method for obtaining the packaged device by taking the optical chip arranged on the substrate as an example.

Fig. 3 is a schematic flow chart of a packaging method according to an embodiment of the present application, which may be used to prepare the above-mentioned packaged device, and referring to fig. 3, by way of example and not limitation, the method includes:

Step 301, a metal layer and a metal via are formed on a substrate.

In packaging an optical chip, a metal layer may be first formed on both surfaces of a substrate and a metal hole may be formed between the both surfaces.

First, the ceramic base needs to be cleaned and properly surface treated to remove dirt and oxides from the surface and to increase the adhesion of the metal layer to the ceramic surface. This typically involves chemical cleaning, grinding and activation steps. Next, a metal layer is coated on the ceramic base using a specific method. This may be achieved by Physical Vapor Deposition (PVD), chemical Vapor Deposition (CVD), sputtering, or the like. These methods can form a uniform and dense metal film on the ceramic surface. After the metal layer is applied, a heat treatment is generally required to enhance the bonding force of the metal layer to the ceramic base. The temperature and time of the heat treatment depend on the characteristics of the metal material and the ceramic material.

After the metallization coating is completed, the vias may be fabricated in the ceramic base and metal layer using mechanical drilling, laser drilling, or micromachining techniques, among others. These methods enable precise control of the diameter, depth and location of the through holes. After the via is fabricated, the inner wall of the via needs to be metallized to ensure continuous current transmission. This can be achieved by electroless plating, electroplating, sputtering, or the like, with the inner walls of the vias covered with a layer of conductive metal. It should be noted that the specific method for forming the metal layer and the metal via hole may vary according to the type of metal, the characteristics of the ceramic material, and the size and shape of the via hole, and the method for forming the metal layer and the metal via hole in the embodiment of the present application is not particularly limited.

Step 302, bonding a wire bonding capacitor and a driving chip on a metal layer of a first surface of a substrate.

An adhesive, such as a conductive paste, is selected for use with the metal and chip materials. The adhesive should have sufficient adhesive strength to be able to work stably at the operating environment temperature and possess suitable weather resistance and chemical stability. A thin layer of adhesive is uniformly applied to the metal layer using a precision application tool such as a dispenser or capillary.

The wire bonding capacitor and the driver chip are precisely aligned to a predetermined position and then lightly pressed into contact with the adhesive on the metal layer. Ensuring uniform distribution of the adhesive between the chip and the metal layer without air bubbles or voids.

The necessary curing treatment is performed according to the curing requirements of the adhesive used. This may include natural curing at room temperature or thermal curing under specific temperature and time conditions. In the curing process, excessive pressure or vibration applied to the chip needs to be avoided so as not to influence the bonding effect.

After curing is completed, necessary checks are made to ensure that the chip has been firmly bonded to the metal layer. The bonding interface can be observed using a microscope or magnifying glass to ensure that there are no bubbles, cracks or other defects. And then, performing electrical performance test to ensure that the chip can work normally.

Step 303, bonding the transmitting chip on the routing capacitor.

The method of bonding the emitting chip may be the same method as that in step 302, or may be other methods, and embodiments of the present application are not limited in particular.

Step 304, connecting the transmitting chip, the driving chip and the routing capacitor.

After the transmitting chip, the driving chip and the routing capacitor are bonded, the other polar plate (the polar plate which is not bonded with the substrate 201) of the routing capacitor 204 is connected with the metal book on the first surface of the substrate through a lead; one side of the emitter chip 202 is bonded to the other plate of the wire bonding capacitor 204 (the plate that is not bonded to the substrate 201); the driving chip 205 may be a metal-oxide-semiconductor (MOS) chip. The drain electrode of the driving chip 203 is adhered to the metal layer on the first surface of the substrate 201, and the gate electrode of the driving chip 203 is connected with the metal layer on the substrate 201 through a lead; the source of the driving chip 203 is connected to the other side of the emitting chip 202 (the side not bonded to the wiring capacitor 204) through a wire.

And 305, capping the optical chip according to the tube shell.

After the optical area of the optical chip is packaged and the optical chip is subjected to wire bonding, the tube shell and the substrate can be packaged, so that the optical chip, the supporting structure and the light-transmitting component are positioned in a cavity formed by the tube shell and the substrate, and the packaging is completed.

In the packaging process, the tube shell and the base plate can be packaged in different modes based on different materials of the tube shell, so that the sealing cover of the tube shell on the optical chip is realized. For example, if the tube is made of plastic, the tube may be bonded to the substrate by a glue; if the tube shell is made of metal, the tube shell and the substrate can be packaged in a welding mode, and the packaging mode of the tube shell is not particularly limited in the embodiment of the application. .

And 306, opening a light window on the tube shell, so that the emitted light of the emitting chip is emitted out through the light window.

The light window is arranged on the tube shell, and a light transmission component can be arranged at the light window, so that the optical chip can emit light through the light window and the light transmission component.

In summary, in the packaging method provided by the embodiment of the present application, a metal layer and a metal through hole between a first surface and a second surface of a substrate are generated on the first surface and the second surface; bonding a wire bonding capacitor and a driving chip on a metal layer on the first surface of the substrate; bonding the transmitting chip on the routing capacitor; electrically connecting the transmitting chip, the driving chip and the routing capacitor; sealing the optical chip according to the tube shell; and a light window is formed on the tube shell, so that the emitted light of the emitting chip is emitted out through the light window. The transmitting chip is adhered to the routing capacitor for electric connection, so that the length of the lead wire is reduced, and parasitic inductance is further reduced.

In the foregoing embodiments, the descriptions of the embodiments are emphasized, and in part, not described or illustrated in any particular embodiment, reference is made to the related descriptions of other embodiments.

Those of ordinary skill in the art will appreciate that the various illustrative elements and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware, or combinations of computer software and electronic hardware. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the solution. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present application.

In the embodiments provided in the present application, it should be understood that the disclosed apparatus/device and method may be implemented in other manners. For example, the apparatus/device embodiments described above are merely illustrative, e.g., the division of the modules or units is merely a logical functional division, and there may be additional divisions when actually implemented, e.g., multiple units or components may be combined or integrated into another system, or some features may be omitted or not performed. Alternatively, the coupling or direct coupling or communication connection shown or discussed may be an indirect coupling or communication connection via interfaces, devices or units, which may be in electrical, mechanical or other forms.

It should be understood that the terms "comprises" and/or "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.

It should also be understood that the term "and/or" as used in the present specification and the appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes such combinations.

As used in the present description and the appended claims, the term "if" may be interpreted as "when..once" or "in response to a determination" or "in response to detection" depending on the context. Similarly, the phrase "if a determination" or "if a [ described condition or event ] is detected" may be interpreted in the context of meaning "upon determination" or "in response to determination" or "upon detection of a [ described condition or event ]" or "in response to detection of a [ described condition or event ]".

Furthermore, the terms "first," "second," "third," and the like in the description of the present specification and in the appended claims, are used for distinguishing between descriptions and not necessarily for indicating or implying a relative importance.

Reference in the specification to "one embodiment" or "some embodiments" or the like means that a particular feature, structure, or characteristic described in connection with the embodiment is included in one or more embodiments of the application. Thus, appearances of the phrases "in one embodiment," "in some embodiments," "in other embodiments," and the like in the specification are not necessarily all referring to the same embodiment, but mean "one or more but not all embodiments" unless expressly specified otherwise. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless expressly specified otherwise.

Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present application, and not for limiting the same; although the application has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the application.

Claims (10)

1. A method of packaging, the method comprising:

generating a metal layer on a first surface and a second surface of a substrate and a metal through hole between the first surface and the second surface;

Bonding a wire bonding capacitor and a driving chip on a metal layer on the first surface of the substrate;

Bonding the transmitting chip on the routing capacitor;

Electrically connecting the transmitting chip, the driving chip and the routing capacitor;

sealing the optical chip according to the tube shell;

and a light window is formed on the tube shell, so that the emitted light of the emitting chip is emitted out through the light window.

2. The method of claim 1, wherein electrically connecting the transmit chip, the drive chip, and the wire bond capacitor comprises:

connecting a first polar plate of the routing capacitor with a metal layer on the first surface of the substrate through a lead;

and connecting the driving chip with the emitting chip through a lead.

3. The method of claim 2, wherein the driver chip is a metal-oxide-semiconductor chip, and wherein the gate of the driver chip is connected to the metal layer on the first surface of the substrate by a wire;

connecting a source electrode of the driving chip with one end of the driving chip through a lead;

And adhering the drain electrode of the driving chip to the metal layer on the first surface of the substrate.

4. The method of claim 1, wherein the second plate of the wire-bond capacitor is bonded to the metal layer of the substrate;

bonding a first end of the transmitting chip on a first polar plate of the routing capacitor;

and connecting the second end of the transmitting chip with the driving chip.

5. A packaged device, the packaged device comprising: the device comprises a substrate, a tube shell, a wire bonding capacitor, a driving chip and a transmitting chip;

a metal layer is arranged on the surface of the substrate, and metal through holes are arranged between the surfaces;

the tube shell covers the substrate and forms a cavity;

A routing capacitor and a driving chip are arranged on the first surface of the substrate, and a transmitting chip is arranged on the routing capacitor;

the tube shell is provided with an optical window;

The transmitting chip is connected with the driving chip through a lead;

and emergent light generated by the transmitting chip is transmitted out through the light window.

6. The packaged device of claim 5 wherein a lens assembly is disposed at the optical window.

7. The packaged device of claim 5 wherein the first plate of the wirebond capacitor is connected to the metal layer on the first surface of the substrate by a wire;

The driving chip is connected with the emitting chip through a lead.

8. The packaged device of claim 6 wherein the driver chip is a metal-oxide-semiconductor chip, the gate of the emitter chip being connected to the metal layer on the first surface of the substrate by a wire;

The source electrode of the driving chip is connected with one end of the driving chip through a lead;

The drain electrode of the driving chip is adhered to the metal layer on the first surface of the substrate.

9. The packaged device of claim 6 wherein a second plate of said wire-bond capacitor is bonded to a metal layer of said substrate;

the first end of the transmitting chip is adhered to the first polar plate of the routing capacitor;

The second end of the transmitting chip is connected with the driving chip.

10. A detection apparatus, characterized by comprising: a packaged device according to any of claims 6 to 9.