CN118234184A

CN118234184A - Runner structure, liquid cooler, heat transfer system and vehicle

Info

Publication number: CN118234184A
Application number: CN202311607689.XA
Authority: CN
Inventors: 朱亮; 蒋嗣本; 文丹华
Original assignee: BYD Co Ltd
Current assignee: BYD Co Ltd
Priority date: 2023-11-27
Filing date: 2023-11-27
Publication date: 2024-06-21

Abstract

Flow passage structure, liquid cooler, heat transfer system and vehicle, liquid cooler includes: a housing formed with a cooling chamber; the flow channel structure is arranged in the cooling cavity and comprises a first substrate, a second substrate and a third substrate, the first substrate, the second substrate and the third substrate are arranged together to form a runner in a surrounding mode, and the runner is used for cooling liquid circulation; the flow channel structure satisfies the relation: according to the technical scheme, the relation is obtained through analysis and calculation of the flow resistance and the heat dissipation factor affecting the flow channel structure, and the flow channel can obtain a better heat exchange effect under the condition that the relation is met, so that the flow resistance of the flow channel to cooling liquid is reduced, the relation between the flow resistance and heat dissipation of the flow channel structure is balanced, the vehicle energy consumption is reduced, and the service life of the flow channel structure is prolonged.

Description

Runner structure, liquid cooler, heat transfer system and vehicle

Technical Field

The invention relates to the technical field of heat dissipation, in particular to a flow channel structure, a liquid cooler, a heat exchange system and a vehicle.

Background

The liquid cooler is widely used for chip heat dissipation due to the advantages of good heat dissipation effect, low cost and the like. The liquid cooler comprises a shell and a circulating pump, the shell is in contact with the chip, a cooling cavity is formed in the shell, the cooling cavity is provided with a liquid inlet and a liquid outlet, and the liquid inlet and the liquid outlet are connected with the circulating pump. The circulating pump can drive the cooling liquid to flow in the cooling cavity, so that heat generated during the operation of the chip is taken away.

The cooling cavity is generally provided with a flow passage structure for increasing the contact area between the cooling liquid and the heat source and improving the heat dissipation effect of the liquid cooler on the heat source. However, the flow resistance in the cooling cavity is increased due to the arrangement of the flow channel structure, the energy consumption of the vehicle is increased, and the cooling liquid impacts the flow channel structure for a long time, so that the flow channel structure is damaged.

Disclosure of Invention

The invention aims to provide a flow passage structure, a liquid cooler, a heat exchange system and a vehicle, and aims to solve the problem that flow resistance and heat dissipation efficiency of the flow passage structure are difficult to balance in the related art.

In order to achieve the object of the present invention, in a first aspect, the present invention provides a flow channel structure, where the flow channel structure includes a first substrate, a second substrate, and a third substrate, the first substrate and the second substrate are disposed at intervals along a first direction, the third substrate is connected between the first substrate and the second substrate, and the first substrate, the second substrate, and the third substrate are enclosed together to form a flow channel;

the flow channel structure satisfies the relation:

Wherein D is a spacing distance between adjacent first and second substrates along the first direction;

L _W is the path length of the flow channel;

h is an average value of the height of the first substrate along the second direction and the height of the second substrate along the second direction, wherein the second direction is perpendicular to the first direction;

Is an average value of the thickness of the first substrate along the first direction, the thickness of the second substrate along the first direction, and the thickness of the third substrate along the second direction;

η is a dimensionless number, η is 0.85;

Sigma is a dimensionless quantity, and is 1.2X10 ^-3.

In one possible implementation, the value range of L _W is 1.5mm or less and L _W or less and 500mm or less;

and/or H is more than or equal to 0.5mm and less than or equal to 30mm;

And/or the number of the groups of groups, The value range of (2) is/>

And/or D is more than 0mm and less than or equal to 50mm.

In one possible implementation, D has a value in the range of 0.1 mm.ltoreq.D.ltoreq.15 mm.

In one possible implementation manner, the flow channel structure further includes a fourth substrate, and the fourth substrate and the third substrate are disposed at intervals along the second direction and are alternately connected with the third substrate between each adjacent first substrate and second substrate.

In one possible implementation, the flow channel extends in a curved manner along a third direction, and the third direction is perpendicular to the first direction and the second direction.

In one possible implementation, the first substrate and the second substrate are disposed in parallel;

the cross section of the runner perpendicular to the third direction comprises at least one of square, rectangle, trapezoid and special shape, and the third direction, the first direction and the second direction are three directions perpendicular to each other.

In one possible implementation manner, the flow channel includes a first flow channel and a plurality of second flow channels, one end of the first flow channel is used for being communicated with a liquid inlet of the liquid cooler, and the other end of the first flow channel is communicated with a plurality of second flow channels.

In a second aspect, the present invention further provides a liquid cooler, where the liquid cooler includes a flow channel structure, and the flow channel structure includes: the device comprises a first substrate, a second substrate and a third substrate, wherein the first substrate and the second substrate are arranged at intervals along a first direction, the third substrate is connected between the first substrate and the second substrate, and the first substrate, the second substrate and the third substrate are jointly surrounded to form a flow channel;

the flow channel structure satisfies the relation:

L _W is the path length of the flow channel;

η is a dimensionless number, η is 0.85;

Sigma is a dimensionless quantity, and is 1.2X10 ^-3.

In one possible implementation, the housing is formed with a cooling cavity;

The liquid cooler comprises a plurality of runner structures, and the runner structures are sequentially arranged in the cooling cavity along the first direction and/or the second direction.

In one possible implementation, at least one surface of the housing has a placement groove recessed toward the cooling cavity for placement of a heat source.

In one possible implementation, the housing has a plurality of placement slots, and the spacing between adjacent placement slots is greater than the depth of the placement slots.

In a third aspect, the present invention further provides a heat exchange system, where the heat exchange system includes a liquid cooler, the liquid cooler includes a flow channel structure, and the flow channel structure includes: the device comprises a first substrate, a second substrate and a third substrate, wherein the first substrate and the second substrate are arranged at intervals along a first direction, the third substrate is connected between the first substrate and the second substrate, and the first substrate, the second substrate and the third substrate are jointly surrounded to form a flow channel;

the flow channel structure satisfies the relation:

L _W is the path length of the flow channel;

η is a dimensionless number, η is 0.85;

Sigma is a dimensionless quantity, and is 1.2X10 ^-3.

In one possible implementation manner, the liquid coolers are mutually communicated, at least one of the liquid coolers is provided with a liquid inlet, and at least one of the liquid coolers is provided with a liquid outlet;

the cooling liquid flows in from the liquid inlet and flows out from the liquid outlet.

In one possible implementation manner, a placing groove is formed on the surface of the liquid cooler;

the liquid coolers are sequentially stacked along the second direction, and the placing grooves of the adjacent liquid coolers are mutually communicated to form a containing space which is used for containing a heat source.

In one possible implementation, the liquid cooler includes a first liquid cooler having a first housing and a second liquid cooler having a second housing;

The outer edge of the first shell is outwards protruded to form a first connecting support lug, the first connecting support lug is provided with a first connecting hole, the outer edge of the second shell is outwards protruded to form a second connecting support lug, and the second connecting support lug is provided with a second connecting hole;

The heat exchange system further comprises a threaded fastener, and the threaded fastener sequentially penetrates through the first connecting hole and the second connecting hole to connect the first liquid cooler with the second liquid cooler.

In one possible implementation, the first connection lug is integrally formed with the first housing, and the second connection lug is integrally formed with the second housing.

In a fourth aspect, the present application also provides a vehicle, the vehicle including a heat exchange system, the heat exchange system including a liquid cooler, the liquid cooler including a flow path structure, the flow path structure including: the device comprises a first substrate, a second substrate and a third substrate, wherein the first substrate and the second substrate are arranged at intervals along a first direction, the third substrate is connected between the first substrate and the second substrate, and the first substrate, the second substrate and the third substrate are jointly surrounded to form a flow channel;

the flow channel structure satisfies the relation:

L _W is the path length of the flow channel;

η is a dimensionless number, η is 0.85;

Sigma is a dimensionless quantity, and is 1.2X10 ^-3.

According to the technical scheme, the relation is obtained through analysis and calculation of the flow resistance and the heat dissipation factor affecting the flow channel structure, and the flow channel can obtain a better heat exchange effect under the condition that the relation is met, so that the flow resistance of the flow channel to cooling liquid is reduced, the relation between the flow resistance and heat dissipation of the flow channel structure is balanced, the vehicle energy consumption is reduced, the impact force of the cooling liquid to the flow channel structure is reduced, and the service life of the flow channel structure is prolonged.

Drawings

In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings which are used in the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the description below are only some embodiments of the invention, and that other drawings can be obtained from them without inventive effort for a person skilled in the art.

FIG. 1 is a top view of one embodiment of a liquid cooler provided by the present invention;

FIG. 2 is a cross-sectional view of the flow path structure of FIG. 1;

FIG. 3 is a schematic view of the flow channel in FIG. 1;

FIG. 4 is a cross-sectional view of FIG. 1 with the flow channel structure removed;

FIG. 5 is a bottom view of FIG. 1;

FIG. 6 is a cross-sectional view of an embodiment of the housing of FIG. 1;

FIG. 7 is a cross-sectional view of another embodiment of the housing of FIG. 1;

FIG. 8 is a cross-sectional view of a heat exchange system according to the present invention in a series configuration;

FIG. 9 is a cross-sectional view of a heat exchange system according to the present invention in a parallel configuration;

FIG. 10 is a schematic diagram of a heat exchange system according to another embodiment of the present invention in parallel;

FIG. 11 is a schematic diagram of a heat exchange system according to another embodiment of the present invention in parallel connection;

fig. 12 is an assembly diagram of the heat exchange system provided by the invention in a parallel connection mode.

Reference numerals illustrate:

2000 a heat exchange system;

1000 liquid coolers, 1000a first liquid cooler, 1000b second liquid cooler, 1000c third liquid cooler and 1000d fourth liquid cooler;

1a shell, 1a first shell, 1b second shell, 11 cooling cavity, 11a first cooling cavity, 11b second cooling cavity, 111 liquid inlet, 111a first liquid inlet, 111b second liquid inlet, 111c third liquid inlet, 111d fourth liquid inlet, 111e fifth liquid inlet, 112 liquid outlet, 112a first liquid outlet, 112b second liquid outlet, 112c third liquid outlet, 112d fourth liquid outlet, 112e fifth liquid outlet, 12a-12e placing groove, 121 first placing groove, 122 second placing groove, 13 main body part, 14 enclosing part, 15a first connecting support lug, 15b second connecting support lug, 16a first mounting surface, 16b second mounting surface and 17 accommodating space;

2 flow channel structure, 21 flow channel, 211 first flow channel, 212 second flow channel, 213 third flow channel, 22 first substrate, 23 second substrate, 24 third substrate, 25 fourth substrate;

3, a heat source;

4, sealing piece;

5 threaded fasteners.

Detailed Description

The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present invention without making any inventive effort, are intended to fall within the scope of the present invention.

It will be understood that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When a component is considered to be "connected" to another component, it can be directly connected to the other component or intervening components may also be present.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.

Some embodiments of the present invention are described in detail below with reference to the accompanying drawings. The following embodiments and features of the embodiments may be combined with each other without conflict.

In the related art, the flow channel structure has poor drainage capability and poor effect of reducing the flow resistance of the cooling liquid.

In order to solve the above problems, the present invention provides a vehicle, which may be a fuel vehicle, an electric vehicle, or a forklift, and the present invention is not limited thereto. The vehicle comprises a chassis and a vehicle body, wherein the vehicle body is connected with the chassis, an electric control device is arranged in the vehicle body, an electronic system is integrated in the electric control device, and the electronic system is used for controlling the vehicle.

The vehicle further comprises a heat exchange system, the heat exchange system is used for radiating heat for the electric control device, the heat exchange system comprises a plurality of liquid coolers, the liquid coolers are in contact with a heat source of the electric control device, heat of the heat source of the electric control device is further taken away, the temperature of the electric control device is reduced, and the running stability of the electric control device is improved.

The heat source can be an integrated chip of the electric control device or other heating components in the electric control device, and the invention is not limited to the above.

Referring to fig. 1 and 2, the liquid cooler 1000 includes a housing 1 and a circulation pump (not shown), the housing 1 is formed with a cooling chamber 11, the cooling chamber 11 has a liquid inlet 111 and a liquid outlet 112, and a cooling liquid flows in the cooling chamber 11. The circulation pump communicates with the liquid inlet 111 and the liquid outlet 112 to drive the cooling liquid to circulate in the cooling chamber 11. The cooling liquid may be cooling water, cooling oil, or other liquid with low viscosity, low corrosiveness, high specific heat capacity and non-inflammability, which is not limited by the invention.

The liquid cooler 1000 further includes a flow channel structure 2, where the flow channel structure 2 is used to increase the contact area between the cooling liquid and the cooling cavity 11, so as to improve the heat exchange efficiency of the liquid cooler 1000. The flow channel structure 2 includes a first substrate 22, a second substrate 23, and a third substrate 24, where the first substrate 22 and the second substrate 23 are disposed at intervals along the first direction, and the third substrate 24 is connected between the first substrate 22 and the second substrate 23, and it should be noted that the third substrate 24 may be a structure independent of the housing, that is, the first substrate 22 and the second substrate 23 are connected with the third substrate 24 first and then connected with the housing through the third substrate 24. The third substrate 24 may also be a part of the housing, that is, the first substrate 22 and the second substrate 23 are directly connected to the housing, which is not limited in the present application.

The cross-sections of the first, second and third substrates 22, 23 and 24 in the vertical third direction may be rectangular, square, or other regular or irregular shapes, which are not limited in the present application. The third direction is perpendicular to the first direction and the second direction. The first substrate 22, the second substrate 23 and the third substrate 24 are enclosed together to form a flow channel 21, the flow channel 21 extends along the third direction, the flow channel 21 may extend straight along the third direction or may extend in a curved manner along the third direction, which is not limited in the present application. In an embodiment of the present application, the flow channel 21 extends along the third direction, so as to extend the contact area between the flow channel 21 and the cooling liquid, prolong the time for the cooling liquid to flow through the flow channel 21, and improve the heat dissipation effect of the flow channel 21.

In an embodiment of the present application, the first substrate and the second substrate are disposed in parallel, and a cross-sectional shape of the flow channel perpendicular to the third direction includes at least one of square, rectangle, trapezoid, and special shape, wherein special shape refers to that the cross-sectional shape does not belong to any regular pattern such as square, rectangle trapezoid, or triangle, and the third direction and the first direction and the second direction are three directions perpendicular to each other, and through experiments, when the flow channel 21 adopts the above arrangement, the flow channel structure 2 can obtain a better heat dissipation effect and a lower flow resistance.

In an embodiment of the present application, the flow channel structure 2 is arranged along the first direction and the second direction and is disposed in the cooling cavity, so as to increase the contact area between the flow channel structure 2 and the cooling liquid, and improve the heat dissipation effect of the flow channel structure 2. It should be understood that, in other embodiments of the present application, the flow channel structures 2 may be arranged in the cooling cavity only along the first direction or only along the second direction, which may also serve the purpose of improving the heat dissipation effect of the flow channel structures 2.

The flow channel structure 2 satisfies the relation: Where D is the distance between the adjacent first substrate 22 and second substrate 23 along the first direction, L _W is the path length of the flow channel 21, and it should be explained that the path length refers to the total length of travel required for the cooling liquid to flow through the flow channel 21, and the length is mainly determined by the extending shape of the first substrate 22 and the second substrate 23, when the first substrate 22 and the second substrate 23 linearly extend along the third direction, L _W is the length of the first substrate 22 or the second substrate 23 along the third direction, and at this time L _W should be equal to the length of the flow channel 21 along the third direction. When the first substrate 22 and the second substrate 23 bend and extend along the second direction, L _W is the length of the first substrate 22 and the second substrate 23 after being unfolded along the third direction, the length of the first substrate 22 and the second substrate 23 after being unfolded along the third direction can construct a model of the first substrate 22 and the second substrate 23, and then the length of the external curve is measured by UG (Unigraphics NX, interactive CAD/CAM system) software, where L _W should be larger than the length of the runner 21 along the third direction. H is the average value of the height of the first substrate 22 along the second direction and the height of the second substrate 23 along the second direction, and the second direction is perpendicular to the first direction, and is the two directions of/> The average value of the thickness of the first substrate 22 in the first direction, the thickness of the second substrate 23 in the first direction, and the thickness of the third substrate 24 in the second direction, η is a dimensionless quantity, η is 0.85, and δ is a dimensionless quantity, and δ is 1.2x10 ^-3. According to the technical scheme, the relation is obtained through analysis and calculation of the flow resistance and the heat dissipation factor affecting the flow channel structure 2, and under the condition that the relation is met, the flow channel 21 can obtain a better heat exchange effect, meanwhile, the flow resistance of the flow channel 21 to cooling liquid is reduced, the relation between the flow resistance and heat dissipation of the flow channel structure 2 is balanced, the energy consumption of a vehicle is reduced, the impact force of the cooling liquid to the flow channel structure 2 is reduced, and the service life of the flow channel structure 2 is prolonged.

In an embodiment of the invention, the value range of L _W is 1.5 mm- _W mm-500 mm, and when L _W meets the range, the actual length of the first substrate 22 or the second substrate 23 is not too long or too short, so that the manufacturing difficulty is reduced while ensuring that the flow channel 21 has a sufficient length.

In one embodiment of the present invention, the range of H is 0.5 mm.ltoreq.h.ltoreq.30 mm, and when H satisfies this range, the first substrate 22 or the second substrate 23 is controlled within a suitable range, and the thickness of the liquid cooler 1000 is prevented from being too thick while ensuring a sufficient heat exchanging area.

In one embodiment of the present invention,The value range of (2) is/>When/>When the above range is satisfied, the average thickness of the first substrate 22 and the second substrate 23 is controlled to be within a proper orientation, so that the width of the flow path 21 can be ensured, and the manufacturing cost can be reduced.

In one embodiment of the present invention, the value range of D is 0.1mm < d.ltoreq.50 mm, and when D satisfies this range, the width of the flow channel 21 is in a suitable range, the flow rate passing through the heat exchange medium in unit time is in a suitable range, and the flow resistance of the flow channel 21 is reduced while heat exchange is efficient.

In one embodiment of the invention, the value range of D is more than or equal to 0.1mm and less than or equal to 15mm, when D meets the range, the heat exchange effect is further improved, the flow resistance is ensured to be reduced, and the molding process difficulty is better.

The runner structure 2 further includes a fourth substrate 25, where the fourth substrate 25 and the third substrate 24 are disposed at intervals along the second direction, and are alternately connected with the third substrate 24 between each adjacent first substrate 22 and second substrate 23, and the fourth substrate 25 and the first substrate 22 and the second substrate 23 also enclose to form the runners 21, so as to increase the number of the runners 21, increase the contact area between the runner structure 2 and the cooling liquid, and improve the heat dissipation effect of the runner structure 2.

Referring to fig. 3, the flow channel 21 includes a first flow channel 211 and a plurality of second flow channels 212, wherein one end of the first flow channel 211 is communicated with the liquid inlet 111, and the other end is communicated with the plurality of second flow channels 212. So set up, after the coolant flows into the first flow channel 211 through the liquid inlet 111, the coolant can continue to enter the second flow channel 212 through the first flow channel 211 and flow through the whole shell 1 through the plurality of second flow channels 212, so as to increase the contact area between the coolant and the shell 1, further increase the heat exchange amount between the coolant and the heat source 3, and increase the heat exchange efficiency of the liquid cooler 1000.

It can be appreciated that in the present embodiment, the second flow channel 212 may be further branched into a plurality of third flow channels 213, and the coverage area of the flow channels to the housing 1 is further increased by the arrangement of the third flow channels 213, so that the contact area between the cooling liquid and the housing 1 is further increased, the heat exchange amount between the cooling liquid and the heat source 3 is increased, and the heat exchange efficiency of the liquid cooler 1000 is improved.

Referring to fig. 4, the housing 1 of the liquid cooler 1000 mainly serves two purposes, and on the one hand, the housing 1 serves as a main body of the liquid cooler 1000 and can provide support for the heat source 3 or other devices of the liquid cooler 1000. On the other hand, the casing 1 serves as an intermediate medium for heat exchange between the heat source 3 and the coolant. The heat source 3 contacts with the outer surface of the shell 1, the heat of the heat source 3 can be transferred to the inner surface of the shell 1 through the outer surface of the shell 1, then transferred to the cooling liquid through the inner surface of the shell 1, and finally the heat of the heat source 3 is taken away through the cooling liquid, so that the aim of controlling the temperature of the electric control device is fulfilled.

The housing 1 may be a separate structure independent of the outside of the vehicle, or may be used as a support structure of the vehicle, to which the present invention is not limited. In an embodiment of the present invention, the housing 1 of the liquid cooler 1000 may be used as a support structure for other vehicle besides exchanging heat with the heat source 3, for example, the housing 1 may be used as a support for an electronic control device to support components of the electronic control device. The heat exchange system 2000 is adopted to exchange heat in the vehicle, so that multilayer space three-dimensional layout and stress can be realized, the structure in the vehicle is compact, the space utilization rate is high, and the heat exchange system 2000 is more convenient to install and detach in the vehicle.

The outer surface of the housing 1 has a plurality of placement grooves 12 recessed toward the cooling chamber 11, and the placement grooves 12 may be circular in shape, square in shape, or other regular or irregular shapes, which is not limited in the present invention. In an embodiment of the present invention, the shape of the placement groove 12 is fitted to the outer contour of the heat source 3, so as to increase the contact area between the placement groove 12 and the heat source 3, optimize the placement groove 12 structure, reduce the volume of the liquid cooler 1000, and increase the heat exchange density of the liquid cooler 1000.

The placement groove 12 is used for placing the heat source 3, and the placement groove 12 can increase the contact area of the heat source 3 and the shell 1, reduce the heat transfer distance between the heat source 3 and the cooling liquid, reduce the heat transfer resistance between the heat source 3 and the cooling liquid, improve the heat transfer efficiency of the heat source 3 and the cooling liquid, and improve the heat dissipation effect of the liquid cooler 1000 on the heat source 3.

The heat source 3 may be clamped in the placement groove 12, glued in the placement groove 12, or welded in the placement groove 12, which is not limited in the present invention. In an embodiment of the present invention, the heat source 3 is welded in the placement groove 12, so that on one hand, the welding can form a firm rigid connection body between the heat source 3 and the placement groove 12, and further improve the connection stability of the heat source 3 and the placement groove 12. On the other hand, the welding can generate a welding layer between the heat source 3 and the placing groove 12, and the welding layer has good heat conductivity, so that the heat resistance between the heat source 3 and the placing groove 12 can be reduced, and the heat energy transfer efficiency of the heat source 3 to the welding layer is improved.

In one embodiment of the present invention, the placement grooves 12 are provided in plurality, and the pitch of each adjacent placement groove 12 is larger than the depth of the placement groove 12 at least in one direction. In this way, the heat sources 3 in the placement grooves 12 are prevented from being affected by each other due to too close placement distance between the adjacent placement grooves 12, the heat conduction effect of the shell 1 on the heat sources 3 is reduced, and the heat dissipation effect of the liquid cooler 1000 on the heat sources 3 is reduced.

Referring to fig. 5, the housing 1 has a mounting area, the placement grooves 12 are disposed in the mounting area, preferably, when each placement groove 12 is arranged along the second direction, and the spacing between each adjacent placement groove 12 satisfies the relationship: di/h > 1; and xi is more than 0 and less than or equal to 100mm, di is more than 0 and less than or equal to 100mm, h is more than 0 and less than or equal to 100mm,In this case, the placement groove 12 can achieve a good heat conduction effect with respect to the heat source 3.

Where i is the number of sequences of the placement slots 12 in the second direction, i may be 1,2, m, xi is the length of the placement slots 12 with the number of sequences i in the second direction, di is the distance between the placement slots 12 with the number of sequences i and the placement slots 12 with the number of sequences i+1 in the second direction, L is the length of the mounting area in the second direction, and h is the depth of the placement slots 12.

For convenience of description of the formula, the number of the placement grooves 12 is three, and the three placement grooves 12 are respectively arranged along the second direction, which may be the length direction of the housing 1 or the width direction of the housing 1, which is not limited in the present invention. When the placement grooves 12 in the second direction are set to three, i takes values of 1, 2, and 3, where x1 represents the length of the placement groove 12a in the second direction, x2 represents the length of the placement groove 12b in the second direction, and x3 represents the length of the placement groove 12c in the second direction.

D1 represents the distance between the placement groove 12a and the placement groove 12b in the second direction, and d2 represents the distance between the placement groove 12b and the placement groove 12c in the second direction. It will be appreciated that when d1=d2, the distance between the placement groove 12a and the placement groove 12b is equal to the distance Δd=0 between the placement groove 12b and the placement groove 12c, i.e., each adjacent placement groove 12 is arranged at equal intervals. When d1 > d2 or d1 < d2, Δd is a variable constant, and the adjacent placement grooves 12 are not equidistantly arranged.

H represents the depth of the heat source 3 sunk into the placement groove 12. The mounting area refers to a portion for providing the placement groove 12, and its length is less than or equal to the length of the housing 1 along the second direction, and specifically in this embodiment, the length of the housing 1 along the second direction is S, and the length of the mounting area along the second direction is L, S > L.

It is represented that x1+x2+x3+d1+d2 < L, that is, the sum of the length of the placement groove 12a in the second direction, the length of the placement groove 12b in the second direction, the length of the placement groove 12c in the second direction, the distance between the placement groove 12a and the placement groove 12b in the second direction, and the distance between the placement groove 12b and the placement groove 12c in the second direction is smaller than the distance of the mounting area in the second direction.

When the value ranges of x1, x2 and x3 satisfy 0 to 100mm, the value ranges of d1 and d2 satisfy 0 to 100mm, the value range of h satisfies 0 to 100mm, d1/h is more than 1 and d2/h is more than 1, the placing groove 12 can obtain better heat conduction effect on the heat source 3.

It can be understood that, besides the second direction, the placement grooves 12 may be arranged at intervals along a third direction, where the third direction and the second direction are two directions intersecting, and an included angle between the third direction and the second direction may be 30 °, 40 °, or 60 °, which is not limited by the present invention.

In the third direction, when the pitch of each adjacent placement groove 12 satisfies the relationship: pj/h > 1; and yj is more than 0 and less than or equal to 100mm, pj is more than 0 and less than or equal to 100mm, h is more than 0 and less than or equal to 100mm, and the placing groove 12 can obtain better heat conduction effect on the heat source 3.

Wherein j is the number of sequences of placement slots 12 in the third direction, j can be 1,2,..n; yj is the length of the placement groove 12 with the sequence number j along the third direction; pj is the distance between the placement groove 12 with the sequence number j and the placement groove 12 with the sequence number j+1 along the third direction; w is the length of the mounting area along the third direction; h is the depth of the placement groove 12.

For convenience of description of the formulas, here, the placement groove 12d and the placement groove 12e are added, and the placement groove 12d and the placement groove 12e are sequentially provided on the side of the placement groove 12b in the third direction. At this time, j takes values of 1, 2 and 3, where y1 represents the length of the placement groove 12b along the third direction, y2 represents the length of the placement groove 12d along the third direction, and y3 represents the length of the placement groove 12e along the third direction.

P1 represents the distance between the placement groove 12b and the placement groove 12d in the third direction, and p2 represents the distance between the placement groove 12d and the placement groove 12e in the third direction. It will be appreciated that when p1=p2, the distance between the placement groove 12b and the placement groove 12d is equal to the distance Δp=0 between the placement groove 12d and the placement groove 12e, i.e., each adjacent placement groove 12 is arranged at equal intervals. When p1 > p2 or p1 < p2, Δp is a variable constant, and adjacent placement grooves 12 are not equidistantly arranged.

H represents the depth of the placement groove 12, or the depth of the heat source 3 sinking into the placement groove 12. The mounting area is a portion for providing the placement groove 12, and its length is less than or equal to the length of the housing 1 along the third direction, specifically, in this embodiment, the length of the housing 1 along the third direction is T, and the length of the mounting area along the third direction is W, where T > W.

It is represented that y1+y2+y3+p1+p2 < W, that is, the sum of the length of the placement groove 12b in the third direction, the length of the placement groove 12d in the third direction, the length of the placement groove 12e in the third direction, the distance between the placement groove 12b and the placement groove 12d in the second direction, and the distance between the placement groove 12d and the placement groove 12e in the third direction is smaller than the distance of the mounting area in the third direction.

When the value ranges of y1, y2 and y3 meet 0 to 100mm, the value ranges of p1 and p2 meet 0 to 100mm, the value ranges of h meet 0 to 100mm, and p1/h is more than 1 and p2/h is more than 1, the placing groove 12 can achieve good heat conduction effect on the heat source 3.

Referring to fig. 6 and 7, the housing 1 includes a main body 13 and a surrounding portion 14, the main body 13 is used as a heat source 3 and a cooling fluid exchange medium, in an embodiment of the invention, the main body 13 is configured as a plate, the main body 13 includes a first surface 13a and a second surface 13b that are opposite to each other, the placement groove 12 is disposed on the first surface 13a, and the cooling fluid flows through the second surface 13 b. The heat of the heat source 3 can be transferred into the cooling liquid along the thickness direction of the main body 13, so that the heat transfer distance between the heat source 3 and the cooling liquid is reduced, the heat transfer resistance between the heat source 3 and the cooling liquid is reduced, the heat transfer efficiency of the shell 1 to the heat source 3 is improved, and the heat dissipation efficiency of the liquid cooler 1000 is improved.

The enclosure portion 14 is used for enclosing with the main body portion 13 to form the cooling cavity 11, the structures of the enclosure portion 14 can be various, the enclosure portion 14 and the main body portion 13 can be integrally formed, and can be formed separately and then connected with each other. The structure of the enclosure part 14 may be various, the enclosure part 14 may be a plate body as shown in fig. 6, the enclosure part 14 is enclosed at the outer edge of the main body part 13, and the cooling cavity 11 is an upper opening structure. As shown in fig. 7, the enclosure portion 14 may be provided as a cover, and the enclosure portion 14 is covered on the main body portion 13, and the cooling chamber 11 at this time has a closed structure.

In the heat exchange system 2000, the liquid coolers 1000 and 1000 are mutually communicated, at least one of the liquid coolers 1000 is provided with a liquid inlet 111 for flowing in the cooling liquid, and at least one of the liquid coolers 1000 is provided with a liquid outlet 112 for flowing out the cooling liquid. The liquid inlet 111 and the liquid outlet 112 may be disposed in a plurality of liquid coolers 1000, and one liquid cooler 1000 may also be disposed with a plurality of liquid inlets 111 and liquid outlets 112.

The liquid cooler 1000 may be arranged in the heat exchange system 2000 in various manners, for convenience of description, two liquid coolers 1000 disposed adjacently in the heat exchange system 2000 are configured as a first liquid cooler 1000a and a second liquid cooler 1000b, the first liquid cooler 1000a has a first cooling cavity 11a, the first cooling cavity 11a has a first liquid inlet 111a and a second liquid inlet 111b, the second liquid cooler 1000b has a second cooling cavity 11b, and the second cooling cavity 11b has a second liquid inlet 111b and a third liquid inlet 111c.

Referring to fig. 8, in the heat exchange system 2000, the liquid coolers 1000 and 1000 may be disposed in series, specifically, in an embodiment of the present invention, the liquid cooler 1000 includes a first liquid cooler 1000a and a second liquid cooler 1000b, a first liquid outlet 112a of the first liquid cooler 1000a is communicated with a second liquid inlet 111b of the second liquid cooler 1000b, and a cooling liquid may flow into the first cooling cavity 11a from the first liquid inlet 111a, then flow into the second cooling cavity 11b through the first liquid outlet 112a and the second liquid inlet 111b, finally flow out from the second cooling cavity 11b through the second liquid outlet 112b, and finally circulate in the first cooling cavity 11a and the second cooling cavity 11 b.

Referring to fig. 9, in other embodiments of the present invention, the liquid cooler 1000 and the liquid cooler 1000 may be connected in parallel, and in particular, in one embodiment of the present invention, the liquid cooler 1000 includes a first liquid cooler 1000a and a second liquid cooler 1000b, a first liquid inlet 111a of the first liquid cooler 1000a is communicated with a second liquid inlet 111b of the second liquid cooler 1000b, and a first liquid outlet 112a of the first liquid cooler 1000a is communicated with a second liquid outlet 112b of the second liquid cooler 1000 b. The liquid cooler 1000 further includes a third liquid inlet 111c and a third liquid outlet 112c, and the third liquid inlet 111c may be disposed in the first liquid cooler 1000a and be in communication with the first cooling chamber, or may be disposed in the second liquid cooler 1000b and be in communication with the second cooling chamber 11 b. The third liquid outlet 112c may be provided in the first liquid cooler 1000a and communicate with the first cooling chamber, or may be provided in the second liquid cooler 1000b and communicate with the second cooling chamber 11b, which is not limited in the present invention. In this embodiment, the third liquid inlet 111c and the third liquid outlet 112c are disposed on the first liquid cooler 1000a, as shown in fig. 9, the cooling liquid may flow into the first cooling cavity 11a from the third liquid inlet 111c, enter the cooling liquid in the first cooling cavity 11a, partially flow out of the first cooling cavity 11a from the third liquid outlet 112c, partially flow into the second cooling cavity 11b through the first liquid inlet 111a and the second liquid inlet 111b, flow back into the first cooling cavity 11a from the second liquid outlet 112b and the first liquid outlet 112a, finally flow out of the first cooling cavity 11a through the third liquid outlet 112c, and finally realize circulation of the cooling liquid.

It will be appreciated that in other embodiments of the present application, the first liquid cooler 1000a may further be provided with a fourth liquid inlet 111d and a fourth liquid outlet 112d, the second liquid cooler 1000b may further be provided with a fifth liquid inlet 111e and a fifth liquid outlet 112e, and the cooling liquid may flow into the first cooling chamber 11a from the third liquid inlet 111c and the fourth liquid inlet 111d and flow into the second cooling chamber 11b from the fifth liquid inlet 111e as shown in fig. 10. The part of the cooling liquid flowing into the first cooling cavity 11a can flow out of the first cooling cavity 11a from the third liquid outlet 112c or the fourth liquid outlet 112d, and the part can flow into the second cooling cavity 11b through the first liquid inlet 111a and the second liquid inlet 111 b. Part of the liquid in the second cooling cavity 11b can flow out of the second cooling cavity 11b through the fifth liquid outlet 112e, and the other part can flow back to the first cooling cavity 11a through the second liquid outlet 112b and the first liquid outlet 112a and then flow out of the first cooling cavity 11a through the third liquid outlet 112c or the fourth liquid outlet 112 d.

Referring to fig. 9, in an embodiment of the present application, the liquid cooler system further includes a sealing member 4, where the sealing member 4 is disposed between the first liquid inlet 111a and the second liquid inlet 111b and between the first liquid outlet 112a and the second liquid outlet 112b, and the sealing member 4 is configured to provide sealing for the cooling liquid flowing through the first liquid inlet 111a and the second liquid inlet 111b or the first liquid outlet 112a and the second liquid outlet 112b, so as to prevent the cooling liquid from overflowing from the joint between the first liquid inlet 111a and the second liquid inlet 111b or the first liquid outlet 112a and the second liquid outlet 112b, and improve the heat exchange effect of the liquid cooler 1000.

Referring to fig. 9, in an embodiment of the present invention, a first liquid cooler 1000a and a second liquid cooler 1000b are disposed in parallel, and the first liquid cooler 1000a has a first mounting surface 16a, and the second liquid cooler 1000b has a second mounting surface 16b disposed opposite to the first mounting surface 16 a. The placement groove 12 includes a first placement groove 121 and a second placement groove 122, the first placement groove 121 is provided on the first mounting surface 16a, and the second placement groove 122 is provided with the second mounting surface 16b and corresponds to the first placement groove 121 one by one. The first placing groove 121 and the second placing groove 122 are surrounded to form a containing space 17, the thickness of the heat source 3 is larger than the depths of the first placing groove 121 and the second placing groove 122, the heat source 3 is contained in the containing space 17, and two ends of the heat source 3 are respectively contacted with the first placing groove 121 and the second placing groove 122. In this way, the heat dissipation of the heat source 3 is realized on both sides, the heat exchange area between the heat source 3 and the liquid cooler 1000 is increased, and the heat dissipation efficiency of the liquid cooler for the heat source 3 is improved.

Referring to fig. 11, it can be understood that in other embodiments, the liquid cooler 1000 may further include a third liquid cooler 1000c and a fourth liquid cooler 1000d, where the third liquid cooler 1000c and the fourth liquid cooler 1000d are sequentially stacked on the first liquid cooler 1000a and the second liquid cooler 1000b along the second direction, and the heat source 3 is separately disposed between the first liquid cooler 1000a and the second liquid cooler 1000b, between the second liquid cooler 1000b and the third liquid cooler 1000c, and between the third liquid cooler 1000c and the fourth liquid cooler 1000d, so as to achieve multi-stage three-dimensional cooling for the vehicle and improve the cooling effect of the heat dissipation system.

Referring to fig. 12, in an embodiment of the invention, the first liquid cooler 1000a has a first housing 1a, the second liquid cooler 1000b has a second housing 1b, the outer edge of the first housing 1a is protruded outwardly to form a first connection lug 15a, the first connection lug 15a has a first connection hole, the outer edge of the second housing 1b is protruded outwardly to form a second connection lug 15b, the second connection lug 15b has a second connection hole, the heat exchange system 2000 further includes a threaded fastener 5, and the threaded fastener 5 sequentially passes through the first connection hole and the second connection hole to connect the first liquid cooler 1000a and the second liquid cooler 1000b, the first connection lug 15a and the first housing 1a are integrally formed, and the second connection lug 15b and the second housing 1b are integrally formed. In this embodiment, the first liquid cooler 1000a and the second liquid cooler 1000b are connected to each other through the first connection lug 15a and the second connection lug 15b, the first connection lug 15a is integrally formed with the first housing 1a, and the second connection lug 15b is integrally formed with the second housing 1b, so that on the one hand, the difficulty in forming the first connection lug 15a and the first housing 1a, and the second connection lug 15b and the second housing 1b can be reduced. On the other hand, compared with the connection by adopting other adapter pieces, the first connection lug 15a and the first shell 1a are integrally formed, the second connection lug 15b and the second shell 1b are integrally formed, so that the first connection lug 15a and the first shell 1a are in direct contact, the second connection lug 15b and the second shell 1b are in direct contact, the heat energy transfer efficiency of the first shell 1a to the first connection lug 15a is further improved, the heat energy transfer efficiency of the second shell 1b to the second connection lug 15b is improved, and the heat energy transfer efficiency of the liquid cooler is finally improved.

Different from the traditional single-plane heat exchange mode, the invention forms a three-dimensional heat exchange system through the plurality of liquid coolers 1000, can realize the omnibearing multi-space heat exchange, truly realize the omnibearing embedded cladding heat exchange mode, and the heat exchange system 2000 realizes the omnibearing coverage of a heat source, thereby not only increasing the heat exchange area, but also improving the heat dissipation efficiency and having better uniform heat exchange effect.

Hereinafter, the advantageous effects of the flow structure arrangement will be specifically described with reference to the embodiments.

Example 1

Relation formula:

d=1.1 > 0.75, satisfying the relational expression.

Example 2

Relation formula:

D=8 > 1.07, satisfying the relational expression.

Example 3

Relation formula:

D=2.5 > 1.63, satisfying the relational expression.

Example 4

Relation formula:

d=10 > 6.77, satisfying the relational expression.

Example 5

Relation formula:

d=1.1 > 0.75, satisfying the relational expression.

Example 6

Relation formula:

d=1.1 > 0.75, satisfying the relational expression.

Example 7

Relation formula:

D=1.1 > 0.18, satisfying the relational expression.

Example 8

Relation formula:

D=2 > 0.08, satisfying the relational expression.

Example 9

Relation formula:

D=15 > 0.52, satisfying the relational expression.

Example 10

Relation formula:

d=15 > 1.01, satisfying the relational expression.

Example 11

Relation formula:

D=50 > 12.86, satisfying the relational expression.

Comparative example 1

Relation formula:

D=0.3 < 5.76, and does not satisfy the relational expression.

Comparative example 2

Relation formula:

D=0.2 < 0.72, and does not satisfy the relational expression.

Performance testing

The following performance tests are performed on the liquid coolers provided by the embodiments and the comparative examples, and after the liquid coolers obtained by the embodiments and the comparative examples are started, the flow resistance of the flow channel structure is tested after the liquid cooling system is stably operated, so that the following test results are obtained:

as is clear from the above examples and comparative examples, the flow path structure satisfying the formula is smaller in flow resistance.

Hereinafter, the advantageous effects of the placement groove pitch arrangement will be specifically described with reference to the embodiments.

Example 12

The embodiment is used for explaining the liquid cooler disclosed by the invention, wherein the liquid cooler meets the following conditions:

in the above examples, di/h=30 > 1 and pj/h=30 > 1.

Example 13

In this example, di/h=10 > 1, pj/h=10 > 1.

Example 14

In this example, di/h=1.2 >1 and pj/h=1.2 > 1.

Comparative example 3

This comparative example is different from example 1 in that no placement groove is provided.

Comparative example 4

In this comparative example, di/h=0.2 < 1, pj/h=0.2 < 1.

Performance testing

The liquid coolers provided in the above examples and comparative examples were subjected to the following performance tests. And installing chips with the same power on the liquid coolers obtained in the examples and the comparative examples, and detecting the center temperature of the chips after the liquid coolers obtained in the examples and the comparative examples are started to operate for 2 hours. The detection results are as follows:

Sample of	Chip temperature/. Degree.C
		Example 12	94.723
Example 13	94.059
		Example 14	94.946
Comparative example 3	96.511
		Comparative example 4	96.911

According to the structure, the temperature of the placing groove chip meeting the relation is lower, and the cooling effect is better.

In the description of the embodiments of the present invention, it should be noted that, the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," "outer," and the like refer to the orientation or positional relationship described based on the drawings, which are merely for convenience of description and simplification of the description, and do not indicate or imply that the apparatus or element in question must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention.

The above disclosure is only a preferred embodiment of the present invention, and it should be understood that the scope of the invention is not limited thereto, but all or part of the procedures for implementing the above embodiments can be modified by one skilled in the art according to the scope of the appended claims.

Claims

1. The runner structure is characterized by comprising a first substrate, a second substrate and a third substrate, wherein the first substrate and the second substrate are arranged at intervals along a first direction, the third substrate is connected between the first substrate and the second substrate, and the first substrate, the second substrate and the third substrate are jointly enclosed to form a runner;

the flow channel structure satisfies the relation:

LW is the path length of the runner;

Delta is an average value of the thickness of the first substrate along the first direction, the thickness of the second substrate along the first direction, and the thickness of the third substrate along the second direction;

η is a dimensionless number, η is 0.85;

Sigma is a dimensionless quantity, and is 1.2X10 ^-3.

2. The flow channel structure according to claim 1, wherein LW has a value range of 1.5 mm-500 mm LW;

and/or H is more than or equal to 0.5mm and less than or equal to 30mm;

and/or, the value range of delta is 0.05mm or more and delta is 15mm or less;

and/or D is more than 0mm and less than or equal to 50mm.

3. The flow channel structure according to claim 2, wherein D has a value ranging from 0.1mm to 15mm.

4. The flow channel structure of claim 1, further comprising a fourth substrate spaced apart from the third substrate along the second direction and alternately connected with the third substrate between each adjacent first and second substrates.

5. The flow channel structure of claim 1, wherein the flow channel extends in a curved manner along a third direction, the third direction being three directions perpendicular to the first direction and the second direction.

6. The flow channel structure of claim 1, wherein the first substrate and the second substrate are disposed in parallel;

7. The flow path structure of claim 1, wherein said flow path comprises a first flow path and a plurality of second flow paths, said first flow path having one end for communication with a liquid inlet of a liquid cooler and another end for communication with a plurality of said second flow paths.

8. A liquid cooler comprising a flow path structure according to any one of claims 1 to 7.

9. The liquid cooler of claim 8, wherein said liquid cooler has a housing, said housing defining a cooling cavity;

10. The liquid cooler of claim 9, wherein at least one surface of said housing has a placement groove recessed toward said cooling cavity, said placement groove for placement of a heat source.

11. The liquid cooler of claim 10, wherein said housing has a plurality of slots, each adjacent slot having a spacing greater than a depth of said slot.

12. A heat exchange system comprising a plurality of liquid coolers as claimed in any one of claims 8 to 11.

13. The heat exchange system of claim 12 wherein each of the liquid coolers is in communication with each other and wherein at least one of the liquid coolers has a liquid inlet and at least one of the liquid coolers has a liquid outlet;

14. The heat exchange system of claim 12, wherein a surface of the liquid cooler is provided with a placement groove;

15. The heat exchange system of claim 12 wherein the liquid cooler comprises a first liquid cooler having a first housing and a second liquid cooler having a second housing;

16. The heat exchange system of claim 15, wherein the first connection lugs are integrally formed with the first housing and the second connection lugs are integrally formed with the second housing.

17. A vehicle comprising a heat exchange system according to any one of claims 12 to 16.