CN118233005A - Optical signal transmission device - Google Patents
Optical signal transmission device Download PDFInfo
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- CN118233005A CN118233005A CN202410393478.9A CN202410393478A CN118233005A CN 118233005 A CN118233005 A CN 118233005A CN 202410393478 A CN202410393478 A CN 202410393478A CN 118233005 A CN118233005 A CN 118233005A
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- 230000003287 optical effect Effects 0.000 title claims abstract description 300
- 230000008054 signal transmission Effects 0.000 title claims abstract description 71
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/25—Arrangements specific to fibre transmission
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/40—Transceivers
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/50—Transmitters
- H04B10/501—Structural aspects
- H04B10/503—Laser transmitters
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/50—Transmitters
- H04B10/516—Details of coding or modulation
- H04B10/54—Intensity modulation
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Abstract
The present application relates to an optical signal transmission device. The optical signal transmission device includes: an optical transmitter and an optical receiver; the light emitter comprises a laser and a silicon optical chip, and the silicon optical chip is arranged between the laser and the light receiver; the laser is used for outputting an optical signal to be transmitted; the silicon optical chip is used for carrying out amplitude modulation on the optical signal to be transmitted and transmitting the optical signal subjected to the amplitude modulation to the optical receiver; and the optical receiver is used for carrying out photoelectric conversion on the optical signal after the amplitude modulation and generating an electric signal corresponding to the optical signal to be transmitted. Because the silicon optical chip is adopted for amplitude modulation instead of the semiconductor chips such as the EML laser chip and the like, and compared with the semiconductor chips, the silicon optical chip has the advantages of higher integration level, lower cost, better waveguide transmission characteristic and the like, the optical signal transmission device adopting the silicon optical chip for amplitude modulation can improve the optical signal transmission performance.
Description
Technical Field
The present application relates to the field of communications technologies, and in particular, to an optical signal transmission device.
Background
With the development of communication technology, optical communication technology is widely used in various fields due to its characteristics of large communication capacity, low loss, etc. When information is transmitted through an optical fiber, various types of optical transmission modules, such as an optical transceiver module, are produced, and the optical transceiver module includes a transmitting end for converting an electrical signal into an optical signal and a receiving end for converting the optical signal into an electrical signal.
In the related art, an 800G optical module is generally used to realize optical signal transmission, however, the 800G optical module is an 800G module of an eight-wave EML laser (Electlro-absorption Modulated Laser, electro-absorption modulated laser) chip, so this type of optical module has a problem of poor optical signal transmission performance.
Disclosure of Invention
In view of the above, it is desirable to provide an optical signal transmission device capable of improving optical signal transmission performance.
In a first aspect, the present application provides an optical signal transmission apparatus comprising: an optical transmitter and an optical receiver; the optical transmitter comprises a laser and a silicon optical chip, and the silicon optical chip is arranged between the laser and the optical receiver;
The laser is used for outputting an optical signal to be transmitted;
the silicon optical chip is used for carrying out amplitude modulation on the optical signal to be transmitted and transmitting the optical signal subjected to the amplitude modulation to the optical receiver;
The optical receiver is configured to perform photoelectric conversion on the amplitude-modulated optical signal, and generate an electrical signal corresponding to the optical signal to be transmitted.
In one embodiment, the laser includes: at least one continuous wave laser; and the output end of the continuous wave laser is connected with the input end of the silicon optical chip.
In one embodiment, the optical signal transmission device further includes: a signal source; the signal source is connected with a driver, and the driver is connected with the silicon optical chip;
The signal source is used for providing a driving signal for the driver.
In one embodiment, the optical signal transmission device further includes: a digital signal processor; the first input end of the digital signal processor is connected with the signal source, and the first output end of the digital signal processor is connected with the driver;
And the digital signal processor is used for processing the initial electric signal output by the signal source to obtain the driving signal.
In one embodiment, the optical signal transmission device further includes: an electrical signal receiver; the second output end of the digital signal processor is connected with the electric signal receiver, and the second input end of the digital signal processor is connected with the optical receiver;
the digital signal processor is further configured to process the electrical signal output by the optical receiver, obtain a processed signal, and output the processed signal to the electrical signal receiver.
In one embodiment, the optical receiver includes: a photodiode; the input end of the photodiode is connected with the silicon optical chip.
In one embodiment, the optical receiver further comprises: and the output end of the photodiode is connected with the signal amplifier.
In one embodiment, the optical signal transmission device further includes: a photonic integrated control circuit; the photon integrated control circuit is used for performing voltage locking on the silicon optical chip and monitoring an output current signal of the photodiode.
In one embodiment, the optical signal transmission device further includes: a micro control unit; the micro control unit is used for controlling at least one of a digital signal processor, a photon integrated control circuit, a signal amplifier and a continuous wave laser which are included in the signal transmission device.
In one embodiment, the optical signal transmission device further comprises a multi-fiber connector disposed between the silicon optical chip and the optical receiver; the multi-fiber connector is used for transmitting the optical signals output by the silicon optical chip to the optical receiver.
In the above optical signal transmission device, the optical signal transmission device includes: an optical transmitter and an optical receiver; the light emitter comprises a laser and a silicon optical chip, and the silicon optical chip is arranged between the laser and the light receiver; the laser is used for outputting an optical signal to be transmitted; the silicon optical chip is used for carrying out amplitude modulation on the optical signal to be transmitted and transmitting the optical signal subjected to the amplitude modulation to the optical receiver; and the optical receiver is used for carrying out photoelectric conversion on the optical signal after the amplitude modulation and generating an electric signal corresponding to the optical signal to be transmitted. Because the silicon optical chip is adopted for amplitude modulation instead of the semiconductor chips such as the EML laser chip and the like, and compared with the semiconductor chips, the silicon optical chip has the advantages of higher integration level, lower cost, better waveguide transmission characteristic and the like, the optical signal transmission device adopting the silicon optical chip for amplitude modulation can improve the optical signal transmission performance.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the related art, the drawings that are required to be used in the embodiments or the related technical descriptions will be briefly described, and it is apparent that the drawings in the following description are only some embodiments of the present application, and other drawings may be obtained according to the drawings without inventive effort for those skilled in the art.
FIG. 1 is a schematic diagram of an optical signal transmission device according to an embodiment;
FIG. 2 is a schematic diagram of an optical signal transmission device including a signal source in one embodiment;
FIG. 3 is a schematic diagram of an optical signal transmission device including a digital signal processor in one embodiment;
FIG. 4 is a schematic diagram of an optical signal transmission device including an electrical signal receiver in one embodiment;
FIG. 5 is a schematic diagram of an optical signal transmission device including a signal amplifier in one embodiment;
fig. 6 is a schematic structural diagram of an optical signal transmission device including a micro control unit according to an embodiment.
Detailed Description
The present application will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present application more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the application.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application; the terms "comprising" and "having" and any variations thereof in the description of the application and the claims and the description of the drawings above are intended to cover a non-exclusive inclusion.
In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present invention.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present invention, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.
In the present invention, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
In the present invention, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.
It will be understood that when an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like are used herein for illustrative purposes only and are not meant to be the only embodiment.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the application. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of skill in the art will explicitly and implicitly appreciate that the embodiments described herein may be combined with other embodiments.
With the rapid development of the fields of 5G, big data, blockchain, cloud computing, internet of things, artificial intelligence and the like, more and more ultra-large data centers are appeared, and the transmission of larger and denser information is required to be realized when the ultra-large data centers are interconnected, so that the switching equipment is required to have the characteristics of higher speed, lower power consumption and miniaturization. With the development of communication technology, optical communication technology is widely used in various fields due to its characteristics of large communication capacity, low loss, etc. When information is transmitted through an optical fiber, in order to cope with the data transmission requirements of high speed, large capacity and low delay in an ultra-large data center, various types of optical transmission modules, such as an optical transceiver module, are generated, and the optical transceiver module includes a transmitting end for converting an electrical signal into an optical signal and a receiving end for converting the optical signal into an electrical signal.
In the related art, an 800G optical module is generally used to realize optical signal transmission, however, the 800G optical module is an 800G module of an eight-wave EML laser (Electlro-absorption Modulated Laser, electro-absorption modulated laser) chip, so this type of optical module has a problem of poor optical signal transmission performance.
In one embodiment, as shown in fig. 1, there is provided an optical signal transmission apparatus including: a light emitter and a light receiver 13, the light emitter including a laser 11 and a silicon optical chip 12, the silicon optical chip 12 being disposed between the laser 11 and the light receiver 13;
A laser 11 for outputting an optical signal to be transmitted;
A silicon optical chip 12 for amplitude modulating an optical signal to be transmitted and transmitting the amplitude modulated optical signal to an optical receiver 13;
The optical receiver 13 is configured to perform photoelectric conversion on the optical signal after amplitude modulation, and generate an electrical signal corresponding to the optical signal to be transmitted.
In the embodiment of the application, the optical signal transmission device comprises an optical transmitter and an optical receiver 13, the optical transmitter comprises a laser 11 and a silicon optical chip 12, and the silicon optical chip 12 is arranged between the laser 11 and the optical receiver 13. The laser 11 is configured to emit a laser beam, that is, output an optical signal to be transmitted, the silicon optical chip 12 is configured to amplitude modulate the optical signal to be transmitted, and transmit the amplitude modulated optical signal to the optical receiver 13, and the optical receiver 13 is configured to photoelectrically convert the amplitude modulated optical signal to generate an electrical signal corresponding to the optical signal to be transmitted. It should be noted that, in the embodiment of the present application, the amplitude modulation is performed by using a silicon optical chip, instead of using semiconductor chips such as an EML laser chip, where the silicon optical chip includes the following advantages compared with the EML laser chip: firstly, compared with a III-V semiconductor chip, the silicon optical chip has higher integration level and more embedded functions, the silicon optical chip takes silicon as a substrate of the integrated chip, the silicon-based material has low cost and good ductility, and a mature silicon CMOS process can be utilized to manufacture optical devices; secondly, the conventional GaAs/InP substrate has the defects of low cost and large-size manufacturing compared with the III-V semiconductor chip because the growth of the III-V wafer material is limited and the production cost is high, so that the cost of the silicon optical chip can be greatly reduced; third, silicon is transparent to a communication band of 1.1 to 1.6 μm (typical wavelength 1.31 μm/1.55 μm) compared to a III-V semiconductor chip, so that the silicon optical chip has excellent waveguide transmission characteristics; in addition, silicon has a refractive index as high as 3.42, and a large refractive index difference with silicon dioxide can be formed, so that it is ensured that the silicon waveguide can have a small waveguide bending radius.
In the above optical signal transmission device, the optical signal transmission device includes: an optical transmitter and an optical receiver; the light emitter comprises a laser and a silicon optical chip, and the silicon optical chip is arranged between the laser and the light receiver; the laser is used for outputting an optical signal to be transmitted; the silicon optical chip is used for carrying out amplitude modulation on the optical signal to be transmitted and transmitting the optical signal subjected to the amplitude modulation to the optical receiver; and the optical receiver is used for carrying out photoelectric conversion on the optical signal after the amplitude modulation and generating an electric signal corresponding to the optical signal to be transmitted. Because the silicon optical chip is adopted for amplitude modulation instead of the semiconductor chips such as the EML laser chip and the like, and compared with the semiconductor chips, the silicon optical chip has the advantages of higher integration level, lower cost, better waveguide transmission characteristic and the like, the optical signal transmission device adopting the silicon optical chip for amplitude modulation can improve the optical signal transmission performance. Through tests, the optical signal transmission device breaks through long-distance transmission performance and parallel distribution application, and can prolong the transmission distance of optical signals to 10km (kilometers).
In one embodiment, a laser includes: at least one continuous wave laser; the output end of the continuous wave laser is connected with the input end of the silicon optical chip.
In the embodiment of the present application, the laser 11 may include at least one Continuous wave laser (CW laser, continuous WAVE LASER), alternatively, the laser 11 may include four Continuous wave lasers, or the laser 11 may also include two Continuous wave lasers, or the laser 11 may also include a single Continuous wave laser, where the number of Continuous wave lasers is less than eight. If the laser 11 comprises a continuous wave laser, the output end of the continuous wave laser is connected with the input end of the silicon optical chip 12; if the laser 11 includes a plurality of continuous wave lasers, the output end of each continuous wave laser is connected to the input end of the silicon optical chip 12.
In this embodiment, the laser includes: at least one continuous wave laser; the output end of the continuous wave laser is connected with the input end of the silicon optical chip. Since eight EML lasers are required in the related art, and the present application can emit laser beams using a smaller number of lasers, the optical signal transmission device of the present application has a higher package integration level.
In one embodiment, the optical signal transmission device further includes: a signal source; the signal source is connected with the driver, and the driver is connected with the silicon optical chip;
and the signal source is used for providing a drive signal for the driver.
In the embodiment of the present application, as shown in fig. 2, fig. 2 is a schematic structural diagram of an optical signal transmission device including a signal source in an embodiment, where the optical signal transmission device further includes a signal source 14 and a driver (not shown in fig. 2), the signal source 14 is connected to the driver, the signal source 14 is used for providing a driving signal for the driver, the driver is connected to the silicon optical chip, the driver and the silicon optical chip 12 are separately arranged, and the driver is used for sending the driving signal to the silicon optical chip 12 to drive the silicon optical chip 12 to work. Based on this, the signal in the signal source 14 can be sent to the silicon photonics chip 12 through the driver.
By way of example, the signal source 14 may include a Load Switch (Load Switch) and a DC-DC (Direct Current to Direct Current) conversion circuit, and may connect the Load Switch and the DC-DC conversion circuit with the driver through an OSFP/QSFPDD interface to supply power to the driver by using an OSFP/QSFPDD interface power supply pin, and may control the power supply of the transmitting and receiving portions through a soft start circuit and a filtering circuit of each stage, respectively, to improve Current Load capability and power stability. In addition, in order to meet the sensitivity requirement of the receiving end, the layout design of the power supply and the PCB (Printed Circuit Board ) needs to be optimized in terms of hardware design, and meanwhile, the quality of a PAM4 (4-Level Pulse Amplitude Modulation, four-level pulse amplitude modulation) eye diagram is improved as much as possible, and the signal quality of the receiving end is improved, so that the functional complexity of the digital signal processor is reduced, and the purpose of reducing the operation power consumption of the digital signal processor is achieved.
In this embodiment, the optical signal transmission device further includes a signal source; the signal source is connected with the driver, and the driver is connected with the silicon optical chip, and the signal source is used for providing driving signals for the driver, so that the silicon optical chip can be controlled to work through the driver.
In one embodiment, the optical signal transmission device further includes: a digital signal processor; the first input end of the digital signal processor is connected with the signal source, and the first output end of the digital signal processor is connected with the driver;
and the digital signal processor is used for processing the initial electric signal output by the signal source to obtain a driving signal.
In an embodiment of the present application, as shown in fig. 3, fig. 3 is a schematic structural diagram of an optical signal transmission device including a digital signal Processor in an embodiment, where the optical signal transmission device further includes a digital signal Processor 15 (DIGITAL SIGNAL Processor, DSP), a first input end of the digital signal Processor 15 is connected to a signal source 14, a first output end of the digital signal Processor 15 is connected to a driver, and the digital signal Processor 15 is configured to process an initial electrical signal output by the signal source 14 to obtain a driving signal, and send the driving signal to the driver. Alternatively, the driver may be integrated inside the digital signal processor 15, or the driver may be provided between the digital signal processor 15 and the silicon photo chip 12.
For example, an 8×100g PAM4 electric signal may be input from the OSFP/QSFPDD interface through the signal source 14, and the electric signal satisfies the ieee802.3ck protocol standard, then the 8×100g PAM4 electric signal is transmitted into the digital signal processor 15, and the 8×100g PAM4 electric signal is signal-amplified and non-linearly equalized through the VGA (Variable GAIN AMPLIFIER ) and the DFE (Decision Feedback Equalier, decision feedback equalizer) in the digital signal processor 15, then the 8×100g PAM4 electric signal amplified and non-linearly equalized is decoded through the Decoder (Decoder), and the decoded 8×100g PAM4 electric signal is PAM4 format encoded through the pulse amplitude modulation encoder (pam_encoder), and the encoded 8×100g PAM4 electric signal is signal optimized, to obtain a processed 8×100g PAM4 electric signal, i.e., a driving signal, and the driving signal is transmitted to the driver, so that the driving signal is transmitted to the silicon optical chip 12 through the driver. Thus, in the case where the laser 11 outputs an optical signal to be transmitted to the silicon optical chip 12, the driver may drive the silicon optical chip 12 to amplitude modulate the optical signal to be transmitted by an MZM (Mach-Zehnder Modulator ) modulator to obtain an 8×100g PAM4 optical signal after amplitude modulation, and may transmit the 8×100g PAM4 optical signal after amplitude modulation to the optical receiver 13. Wherein, 8×100G PAM4 optical signal can be 8 paths of 1310nm wavelength optical signal, and the wavelength range of the optical signal is 1304.5 to 1317.5nm.
In this embodiment, the optical signal transmission device further includes a digital signal processor, where a first input end of the digital signal processor is connected to the signal source, and a first output end of the digital signal processor is connected to the driver, so that an initial electrical signal output by the signal source can be processed by the digital signal processor, and a more stable driving signal is obtained.
In one embodiment, as shown in fig. 4, fig. 4 is a schematic structural diagram of an optical signal transmission device including an electrical signal receiver in one embodiment, where the optical signal transmission device further includes: an electric signal receiver 16; a second output end of the digital signal processor 15 is connected with the electric signal receiver 16, and a second input end of the digital signal processor 15 is connected with the optical receiver 13;
The digital signal processor 15 is further configured to process the electrical signal output by the optical receiver 13, obtain a processed signal, and output the processed signal to the electrical signal receiver 16.
The electrical signal receiver 16 may be a receiver connected to the OSFP/QSFPDD interface, where the electrical signal receiver 16 is configured to receive a processed signal, and the processed signal is a high-quality electrical signal.
In one embodiment, an optical receiver includes: a photodiode; the input end of the photodiode is connected with the silicon optical chip.
In the embodiment of the application, the optical receiver comprises a photodiode, and optionally, the input end of the photodiode can be directly connected with the silicon optical chip; or the input end of the photodiode can be indirectly connected with the silicon optical chip, and the connection mode between the photodiode and the silicon optical chip is not limited in the embodiment of the application.
In one embodiment, the optical receiver further comprises: and the output end of the photodiode is connected with the signal amplifier.
In the embodiment of the present application, as shown in fig. 5, fig. 5 is a schematic structural diagram of an optical signal transmission device including a signal amplifier in one embodiment, the optical receiver 13 includes a photodiode 17 (PIN PD, P-I-N Photo-Diode) and a signal amplifier 18, where an input end of the photodiode 17 is connected to the silicon optical chip 12, an output end of the photodiode 17 is connected to an input end of the signal amplifier 18, an output end of the signal amplifier 18 is connected to a second input end of the digital signal processor 15, and a second output end of the digital signal processor 15 is connected to the electrical signal receiver 16. The signal amplifier 18 may include, but is not limited to, a transimpedance amplifier (TIA, transimpedance Amplifier) or the like.
The silicon optical chip 12 may transmit the amplitude-modulated 8×100g PAM4 optical signal to the photodiode 17, convert the amplitude-modulated 8×100g PAM4 optical signal to a smaller photocurrent signal through the photodiode 17, then transmit the photocurrent signal to the signal amplifier 18, then convert and amplify the photocurrent signal to a voltage signal with a certain swing through automatic gain control in the signal amplifier 18, then transmit the voltage signal (i.e., 8×100g PAM4 electric signal) to the digital signal processor 15, and perform signal amplification and equalization on the 8×100g PAM4 electric signal through the digital signal processor 15, then decode the 8×100g PAM4 electric signal after signal amplification and nonlinear equalization through the Decoder, then encode the decoded 8×100g PAM4 electric signal in a4 format through the pulse amplitude modulation encoder (pam_encoder), and perform signal optimization on the encoded 8×100g PAM4 electric signal, so as to obtain a processed 8×100g PAM4 electric signal, and then transmit the processed 8×100g PAM4 electric signal to the high-quality PAM4 electric signal (i.e., high-quality PAM 16/high-quality signal is achieved by the high-to-quality transmission interface of the optical signal which is required to be transmitted to the high-quality of the optical amplifier 5716, and the signal is achieved after the transmission of the high-quality signal is achieved by the signal has been processed by the high-quality signal interface.
In this embodiment, the optical signal transmission device further includes an electrical signal receiver, and the optical receiver includes a photodiode and a signal amplifier, and the electrical signal output by the signal amplifier can be processed by the digital signal processor, so that a high-quality electrical signal can be output to the electrical signal receiver.
In one embodiment, the optical signal transmission device further includes: a photonic integrated control circuit; the photon integrated control circuit is used for carrying out voltage locking on the silicon optical chip and monitoring the output current signal of the photodiode.
The photonic integrated control circuit refers to a control circuit of a photonic integrated circuit (PIC, photonics Integrated Circuit), which is abbreviated as PIC control circuit. In the embodiment of the present application, the optical signal transmission device further includes a photonic integrated control circuit, where the photonic integrated control circuit is connected to the silicon optical chip and the photodiode, and of course, a specific connection mode of the photonic integrated control circuit is not limited in the embodiment of the present application. The photon integrated control circuit is used for monitoring the output current signal of the MPD (Monitor Photo Diode, monitoring the photo diode) and the change condition of the output photocurrent through scanning and adjusting the voltage value, so as to ensure that the voltage of the silicon optical chip PIC is locked at a normal working point, and further perform voltage locking on the silicon optical chip.
In this embodiment, the optical signal transmission device further includes a photonic integrated control circuit, where the photonic integrated control circuit is configured to perform voltage locking on the silicon optical chip and monitor an output current signal of the photodiode, so as to ensure that the voltage locking of the PIC of the silicon optical chip is at a normal operating point and ensure that the output current signal of the MPD (Monitor Photo Diode, monitor the photodiode) is in a normal state.
In one embodiment, the optical signal transmission device further includes: a micro control unit; the micro control unit is used for controlling at least one of a digital signal processor, a photon integrated control circuit, a signal amplifier and a continuous wave laser which are included in the signal transmission device.
In an embodiment of the present application, as shown in fig. 6, fig. 6 is a schematic structural diagram of an optical signal transmission device including a micro control unit in an embodiment, where the optical signal transmission device specifically includes a Load Switch (Load Switch) and a DC-DC (Direct Current to Direct Current) conversion circuit, an OSFP/QSFPDD interface, an optical transmitter, a digital signal Processor (DIGITAL SIGNAL Processor, DSP), a silicon optical chip, an optical receiver, a PIC control circuit, and a micro control unit (MCU, microcontroller Unit), where voltages of the Load Switch and the DC-DC conversion circuit may be 3.3V; the digital signal processor can be an 8:8 PAM4 DSP, the DSP can be connected with an EEPROM (Electrically erasable programmable read-Only Memory) through an SPI interface (SERIAL PERIPHERAL INTERFACE, a serial peripheral interface), and the DSP can also generate a 156.25MHz clock signal (CLOCk); the connection between the light emitter and the silicon photo-chip is not shown in fig. 6, and the connection between the PIC control circuit and the silicon photo-chip and the photodiode is not shown in fig. 6; the micro control unit MCU is used for controlling at least one of a digital signal processor DSP, a photonic integrated control circuit (i.e., PIC control circuit), a signal amplifier in an optical receiver, and a continuous wave laser in an optical transmitter included in the signal transmission device.
Illustratively, the MCU may perform digital diagnostic and monitoring functions of a management interface (IIC) and be connected to the OSFP/QSFPDD interface and the optical receiver through the IIC (Inter-INTEGRATED CIRCUIT, integrated circuit bus); the MCU is used as a main device of the DSP, and can finish the initialization operation of the DSP through the MDIO communication interface and control the coordination work among the units; the MCU can realize intelligent control of the transmitting part and the receiving part through an internal communication interface; the MCU can be connected with the PIC control circuit through a DAC (digital-to-analog converter, digital to analog converter) or an ADC (analog-to-digital converter, analog to Digital Converter), and the automatic locking function of the PIC working point of the silicon optical chip is finished through the PIC control circuit; the MCU may be connected to the light emitter through IDAC (Current digital to analog conversion, current output digital-analog converter); the MCU can complete the functions of module state reporting, DDM (Digital Diagnostics Monitoring, digital diagnostic monitoring) reporting, FAWS (Fault, alarm, WARNING AND Status), fault, alarm, warning and Status reporting, etc. The transmitting portion may include, but is not limited to, an optical transmitter, a silicon optical chip, and the like, the receiving portion may include, but is not limited to, an optical receiver, and the like, and the internal communication interface may include, but is not limited to, LPMODE (Low Power Mode), RESETL (Reset Low level), INTL, MODSELL, and the like.
For example, the MCU host chip may perform support for CMIS (Common MANAGEMENT INTERFACE Specification) management Specification protocol, and may perform control for devices such as signal source, DSP, PIC, TIA, etc., and may perform functions such as DDM data sampling and reporting, for example, the MCU implementation functions may include but are not limited to: 1) Control functions such as software and hardware Tx disable (transmission disabled)/LPMODE/RESETL; 2) Supporting an IIC communication interface, wherein the address of the corresponding IIC communication device is 0xA0 (10100000 b), and the default communication rate needs to be supported to 400kHz (1 MHz is optionally supported); 3) Communication control is carried out on the DSP/TIA; 4) Peripheral circuit ADC/DAC control; 5) The CW laser of the silicon light source is controllable, and the MZM Quad working point (Mach-Zehnder modulator quadrature working point) is automatically locked; 6) DDM monitoring; 7) FAWS alarm processing; 8) Debugging factory parameters; 9) The code writing information is supported, so that the writable and storable functions are facilitated; 10 Supporting the upgrading of software code functions in an IIC mode; 11 Supporting a convenient way to upgrade EEPROM profiles of the DSP, etc.
In this embodiment, the optical signal transmission device is an 800G DR8 silicon optical module, the 800G silicon optical module may adopt an OSFP or QSFPDD package structure, and based on 7nm DSP development, a DSP combined Driver (Driver) and COB (chip on Board) scheme combined with a silicon optical chip is adopted, which can satisfy a working range of Shang Wen-70 degrees, and the 800G silicon optical module is an 8-channel full duplex optical module, and a single channel data rate supports 106.25Gbps at the highest, so that cost and power consumption can be reduced.
In one embodiment, the optical signal transmission device further includes a multi-fiber connector, and the multi-fiber connector is disposed between the silicon optical chip and the optical receiver; the multi-fiber connector is used for transmitting the optical signals output by the silicon optical chip to the optical receiver.
In an embodiment of the present application, the optical signal transmission device further includes a multi-fiber connector, where the multi-fiber connector is disposed between the silicon optical chip and the optical receiver, and the multi-fiber connector is used for transmitting an optical signal output by the silicon optical chip to the optical receiver. Among other things, the Multi-fiber connector may be a Multi-fiber push-in connector (MPO, multi-Fiber Push On connector) that may include an optical module launch port and an optical module receive port. The silicon optical chip may transmit the amplitude-modulated 8×100g PAM4 optical signal to the optical module transmitting port corresponding to the multi-fiber connector, and transmit the amplitude-modulated 8×100g PAM4 optical signal from the optical module transmitting port to the optical module receiving port corresponding to the multi-fiber connector, and then transmit the amplitude-modulated 8×100g PAM4 optical signal from the optical module receiving port to the optical receiver.
In this embodiment, stable transmission of the amplitude-modulated optical signal can be ensured by the multi-fiber connector provided between the silicon optical chip and the optical receiver.
The technical features of the above embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The foregoing examples illustrate only a few embodiments of the application, which are described in detail and are not to be construed as limiting the scope of the application. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the application, which are all within the scope of the application. Accordingly, the scope of the application should be assessed as that of the appended claims.
Claims (10)
1. An optical signal transmission device, characterized in that the optical signal transmission device comprises: an optical transmitter and an optical receiver; the optical transmitter comprises a laser and a silicon optical chip, and the silicon optical chip is arranged between the laser and the optical receiver;
The laser is used for outputting an optical signal to be transmitted;
the silicon optical chip is used for carrying out amplitude modulation on the optical signal to be transmitted and transmitting the optical signal subjected to the amplitude modulation to the optical receiver;
The optical receiver is configured to perform photoelectric conversion on the amplitude-modulated optical signal, and generate an electrical signal corresponding to the optical signal to be transmitted.
2. The apparatus of claim 1, wherein the laser comprises: at least one continuous wave laser; and the output end of the continuous wave laser is connected with the input end of the silicon optical chip.
3. The apparatus of claim 1, wherein the optical signal transmission apparatus further comprises: a signal source; the signal source is connected with a driver, and the driver is connected with the silicon optical chip;
The signal source is used for providing a driving signal for the driver.
4. The apparatus of claim 3, wherein the optical signal transmission apparatus further comprises: a digital signal processor; the first input end of the digital signal processor is connected with the signal source, and the first output end of the digital signal processor is connected with the driver;
And the digital signal processor is used for processing the initial electric signal output by the signal source to obtain the driving signal.
5. The apparatus of claim 4, wherein the optical signal transmission apparatus further comprises: an electrical signal receiver; the second output end of the digital signal processor is connected with the electric signal receiver, and the second input end of the digital signal processor is connected with the optical receiver;
the digital signal processor is further configured to process the electrical signal output by the optical receiver, obtain a processed signal, and output the processed signal to the electrical signal receiver.
6. The apparatus of claim 1, wherein the optical receiver comprises: a photodiode; the input end of the photodiode is connected with the silicon optical chip.
7. The apparatus of claim 6, wherein the optical receiver further comprises: and the output end of the photodiode is connected with the signal amplifier.
8. The apparatus according to claim 6 or 7, wherein the optical signal transmission apparatus further comprises: a photonic integrated control circuit; the photon integrated control circuit is used for performing voltage locking on the silicon optical chip and monitoring an output current signal of the photodiode.
9. The apparatus according to any one of claims 1 to 7, wherein the optical signal transmission apparatus further comprises: a micro control unit; the micro control unit is used for controlling at least one of a digital signal processor, a photon integrated control circuit, a signal amplifier and a continuous wave laser which are included in the signal transmission device.
10. The apparatus of any one of claims 1 to 7, wherein the optical signal transmission apparatus further comprises a multi-fiber connector disposed between the silicon optical chip and the optical receiver; the multi-fiber connector is used for transmitting the optical signals output by the silicon optical chip to the optical receiver.
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| CN202410393478.9A CN118233005A (en) | 2024-04-02 | 2024-04-02 | Optical signal transmission device |
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| CN202410393478.9A CN118233005A (en) | 2024-04-02 | 2024-04-02 | Optical signal transmission device |
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