CN118218277A - High-voltage retest sorting device for integrated circuit chip and working method - Google Patents
High-voltage retest sorting device for integrated circuit chip and working method Download PDFInfo
- Publication number
- CN118218277A CN118218277A CN202410542451.1A CN202410542451A CN118218277A CN 118218277 A CN118218277 A CN 118218277A CN 202410542451 A CN202410542451 A CN 202410542451A CN 118218277 A CN118218277 A CN 118218277A
- Authority
- CN
- China
- Prior art keywords
- track
- retest
- chips
- sorting
- cylinder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000013102 re-test Methods 0.000 title claims abstract description 70
- 238000000034 method Methods 0.000 title claims abstract description 9
- 238000001514 detection method Methods 0.000 claims abstract description 48
- 238000012360 testing method Methods 0.000 claims abstract description 24
- 210000000078 claw Anatomy 0.000 claims abstract description 18
- 230000005484 gravity Effects 0.000 claims abstract description 18
- 210000001503 joint Anatomy 0.000 claims description 36
- 239000013307 optical fiber Substances 0.000 claims description 21
- 238000007664 blowing Methods 0.000 claims description 20
- 239000008187 granular material Substances 0.000 claims description 18
- 238000007906 compression Methods 0.000 claims description 14
- 230000006835 compression Effects 0.000 claims description 13
- 230000003287 optical effect Effects 0.000 claims description 10
- 230000000903 blocking effect Effects 0.000 claims description 5
- 230000000149 penetrating effect Effects 0.000 claims description 4
- 230000001174 ascending effect Effects 0.000 claims description 3
- 230000002349 favourable effect Effects 0.000 claims description 3
- 230000001360 synchronised effect Effects 0.000 claims description 3
- 230000002146 bilateral effect Effects 0.000 abstract description 2
- 230000002950 deficient Effects 0.000 abstract description 2
- 230000006698 induction Effects 0.000 description 10
- 238000005192 partition Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 238000000926 separation method Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention relates to a high-pressure retest sorting device of integrated circuit chips and a working method thereof, comprising a gravity conveying line which is obliquely arranged, wherein a pushing component, a detecting component, a collecting component, a retest component and a sorting collecting component are sequentially arranged along the conveying direction of the gravity conveying line; the retest subassembly includes the spacing cylinder of vertical setting, spacing cylinder bottom end has linked firmly the baffle in order to restrict the chip gliding, gravity transfer chain bilateral symmetry is equipped with retest cylinder, two retest cylinder opposite ends all are equipped with the high-pressure test row claw that is used for the photocoupler pin in top grafting chip both sides, can both accomplish the barrier-free transport of the good product chip of batch through the cooperation of collecting the subassembly and retest subassembly, also can carry out the retest of single chip in order and select separately in the defective product batch, guarantee the high-efficient collection of good product, stable convenient and high-efficient detection.
Description
Technical Field
The invention relates to a high-voltage retest sorting device for integrated circuit chips and a working method thereof.
Background
Optocouplers (opticalcoupler equipment, abbreviated OCEP) are also known as optoisolators or optocouplers, abbreviated optocouplers. It is a device that transmits electrical signals over an optical medium. The coupler transmits an electrical signal via light as a medium. It has good isolation effect on input and output electric signals, so that it can be extensively used in various circuits.
The optocoupler needs to be matched with a high-voltage instrument to detect the voltage resistance value, and the traditional detection mode is mostly manually operated, so that the efficiency is low. The currently disclosed [ CN ] optocoupler high-voltage testing mechanism-CN 214669404U can be matched with a high-voltage instrument to test the withstand voltage value of the optocoupler, but if an unqualified optocoupler appears after the test, the optocoupler of the batch needs to be entirely introduced into an unqualified channel or taken out and then subjected to single retest again, the operation is complex, the labor is consumed, the efficiency is low, and a high-efficiency detection and sorting device integrating detection and retest is needed.
Disclosure of Invention
In view of the defects of the prior art, the technical problem to be solved by the invention is to provide the integrated circuit chip high-voltage retest sorting device and the working method, which are reasonable in structure, convenient and efficient.
In order to solve the technical problems, the technical scheme of the invention is as follows: the device comprises a gravity conveying line which is obliquely arranged, a pushing assembly, a detection assembly, a collecting assembly, a retest assembly and a sorting collecting assembly are sequentially arranged along the conveying direction of the gravity conveying line, the collecting assembly comprises a vertically arranged collecting cylinder and a pressing cylinder, a push rod for blocking chips from entering the retest assembly is fixedly connected to the telescopic end at the top of the collecting cylinder, and a compression rod for limiting secondary chips blocked by the push rod is fixedly connected to the telescopic end at the bottom of the pressing cylinder; the retest subassembly includes the spacing cylinder of vertical setting, spacing cylinder bottom end links firmly the baffle in order to restrict the chip gliding, gravity transfer chain both sides symmetry is equipped with retest cylinder, and two retest cylinders opposite ends all are equipped with the high-pressure test row claw that is used for the top to connect the opto-coupler pin of chip both sides.
Further, gravity transfer chain is including the push track, the detection track of concatenation in proper order, collect track, retest track and collection track, collect the track and include the track seat, the two sliding ways that are used for cooperation chip both sides opto-coupler pin to slide have been seted up to the symmetry on the track seat, two spacing briquetting have set firmly to track seat top symmetry, and two spacing briquetting extend in opposite directions and the ladder groove that is used for cooperation chip has all been seted up to the bottom.
Further, all vertically run through on the spacing briquetting and seted up the gas vent, spacing briquetting bottom slant has been seted up in order to be favorable to blowing the gas tank of chip, this gas tank and ladder groove intercommunication, gas vent top external air pump.
Furthermore, the detection track and the collection track are consistent in structure and comprise an upper guide plate and a lower guide plate, a straight groove for embedding and sliding the top of the chip is formed in the bottom of the upper guide plate, a sliding channel of the chip is formed between the straight groove and the lower guide plate, detection cylinders are symmetrically arranged on two sides of the detection track, and high-voltage test row claws for propping up pins of optical couplers on two sides of the chip are arranged at opposite ends of the two detection cylinders; the detection assembly further comprises two baffle air cylinders, the bottom telescopic ends of the two baffle air cylinders are respectively connected with the front insulating baffle and the rear insulating baffle, and telescopic grooves for the front insulating baffle, the rear insulating baffle and the baffle to pass through are vertically formed in the upper guide plate.
Further, the optical fiber induction seats are arranged above and below the detection track and the collecting track, a plurality of induction holes for vertically inserting the optical fiber inductors are arranged on the optical fiber induction seats at intervals, and through holes corresponding to the induction holes one by one are formed in the upper guide plate and the lower guide plate in a penetrating mode.
Further, push assembly includes pneumatic finger, two flat clamp fingers of pneumatic finger are connected with classification baffle and classification depression bar respectively, pneumatic finger side articulates has the classification to strike the board, the classification is struck the board tip and is linked firmly and is struck the pole and should strike the pole and be located between classification baffle and the classification depression bar and be used for avoiding the chip dislocation, the classification is struck the board top and is provided with the classification cylinder with the push down the classification and strikes the board, and the classification cylinder is vertical to be fixed on pneumatic finger, be provided with the spring that is favorable to the classification to strike the board reset between pneumatic finger and the classification, the propelling movement is gone up to set firmly the auxiliary air pipe that is used for blowing the chip along direction of delivery.
Further, select separately and collect the subassembly including being located between retest track and the collection track and with the perpendicular separation track of chip direction of delivery, collect the track including collecting the inferior product track of the qualified track of qualified chip and unqualified chip respectively, sliding connection has butt joint track piece on the separation track in order to dock qualified track and inferior product track, be provided with the dog that blocks the chip on the butt joint track piece, the dog is gone up and down through the vertical cylinder drive that links firmly on the butt joint track piece, and this butt joint track piece slides on selecting separately the track through motor and belt drive.
Furthermore, all be provided with the baffle between detection component and the subassembly that gathers, collect the subassembly and retest the subassembly, all offer the opening that supplies the chip to pass through on the baffle, press position cylinder, spacing cylinder, separation blade cylinder all link firmly on the baffle.
Further, the pushing track, the detecting track, the collecting track, the retesting track and the bottom of the collecting track are all fixedly arranged on the same bottom plate.
The working method of the integrated circuit chip high-voltage retest sorting device comprises the following steps: and (3) classifying and conveying: firstly, chips are arranged on a pushing track and slide under the action of gravity, the chips are blocked by a granule baffle plate in a descending way, the granule baffle plate in an ascending way during working, a granule compression bar in a synchronous descending way, and then a granule cylinder in a descending way is matched for resetting to finish the split conveying of the granule knocking plate to single-granule chips, so that the adhesion is avoided; the chips are conveyed onto a detection track and move downwards under the action of a baffle cylinder through a front insulating baffle to block the chips from continuing to move downwards, the quantity of the chips which are arranged is sensed by an optical fiber sensor to be matched with a high-voltage test row claw, the baffle cylinder drives the rear insulating baffle to move downwards to block the chips from continuing to move downwards, at the moment, the detection cylinders on two sides extend out to push and prop the high-voltage test row claws on two sides to be connected onto pins of an optical coupler of the chips to finish high-voltage detection, the baffle cylinder drives the front insulating baffle to reset after the detection is finished, a plurality of chips after the detection slide into a collecting assembly, and then the cycle is performed, a top rod is blocked upwards under the action of the collecting cylinder, if the chips collected on a track seat are qualified, the collecting cylinder resets and is obliquely conveyed downwards to directly pass through a retesting assembly to enter a sorting collecting assembly under the action of blowing slot, a butt joint track block is in a sliding butt joint mode to receive the chips on the retesting track, the chips are blocked by a stop block, the butt joint track block directly butt joint an output end is in a qualified track, and the stop block moves upwards to finish collection of qualified chips; if the chips with problems are collected on the track seat, the compression bar is pressed down and connected onto the secondary chip blocked by the ejector rod under the action of the cylinder of the position pressing cylinder, the ejector rod moves down, the first chip slides onto the retest track, the baffle is blocked on the front side of the chip by the downward movement of the limiting cylinder, the retest cylinder is driven to push and connect the high-voltage test row claws on two sides on the pins of the optical coupler of the chip to finish high-voltage retest after the chips are sensed by the optical fiber sensor, the limiting cylinder moves up to convey the chips with problems after retest to the sorting and collecting assembly after the test, the butt joint track block is in sliding butt joint with the retest track and the inferior product track, and the chips are conveyed onto the inferior product track by the butt joint track block in a sliding manner to finish the collection of unqualified chips.
Compared with the prior art, the invention has the following beneficial effects: the assembly and the retest assembly are matched, so that barrier-free conveying of batches of good chips can be completed, retests of single chips can be orderly carried out in defective batches and sorting can be carried out, efficient collection of good products is guaranteed, and stable, convenient and efficient detection is realized.
The invention will be described in further detail with reference to the drawings and the detailed description.
Drawings
FIG. 1 is a schematic view of a construction of an embodiment of the present invention;
FIG. 2 is a schematic diagram of the structure of the detecting assembly, the collecting assembly and the retesting assembly according to the embodiment of the present invention;
FIG. 3 is a schematic top view of the FIG. 2 construction;
FIG. 4 is a cross-sectional view of A-A of FIG. 3;
FIG. 5 is a side view schematic of FIG. 2;
FIG. 6 is an enlarged schematic view of B in FIG. 5;
FIG. 7 is a schematic diagram of a detection assembly according to an embodiment of the present invention;
FIG. 8 is a schematic diagram of a pushing assembly according to an embodiment of the present invention;
fig. 9 is a schematic view of a structure of a limit pressing block in the embodiment of the invention.
In the figure: 1-gravity conveying line, 2-detecting component, 3-collecting component, 4-retesting component, 5-collecting cylinder, 6-pressing cylinder, 7-ejector pin, 8-compression bar, 9-limit cylinder, 10-baffle, 11-retesting cylinder, 12-chip, 13-optocoupler pin, 14-high-voltage test row claw, 15-detecting track, 16-collecting track, 17-retesting track, 18-track seat, 19-chute, 20-limit pressing block, 21-step groove, 22-blowing hole, 23-blowing groove, 24-blowing pipe, 25-upper guide plate, 26-lower guide plate, 27-straight groove, 28-detecting cylinder, 29-movable block and 30-guide rail, the device comprises a 31-baffle cylinder, a 32-front insulating baffle, a 33-rear insulating baffle, a 34-telescopic groove, a 35-optical fiber sensor seat, a 36-sensor hole, a 37-through hole, a 38-baffle, a 39-through hole, a 40-optical fiber sensor, a 41-bottom plate, a 42-pneumatic finger, a 43-sorting baffle, a 44-sorting press rod, a 45-sorting knock plate, a 46-knock rod, a 47-sorting cylinder, a 48-spring, a 49-auxiliary air pipe, a 50-sorting track, a 51-inferior track, a 52-qualified track, a 53-butt joint track block, a 54-baffle, a 55-vertical cylinder, a 56-sorting collection assembly, a 57-pushing assembly and a 58-pushing track.
Detailed Description
In order to make the above features and advantages of the present invention more comprehensible, embodiments accompanied with figures are described in detail below.
As shown in fig. 1-9, the integrated circuit chip high-pressure retest sorting device comprises a gravity conveying line 1 which is obliquely arranged, a pushing component 57, a detection component 2, a collecting component 3, a retest component 4 and a sorting collecting component 56 are sequentially arranged along the conveying direction of the gravity conveying line, the collecting component comprises a vertically arranged collecting cylinder 5 and a pressing cylinder 6, a push rod 7 for blocking chips from entering the retest component is fixedly connected to the telescopic end at the top of the collecting cylinder, and a compression rod 8 for limiting secondary chips (namely chips arranged at a second position) blocked by the push rod is fixedly connected to the telescopic end at the bottom of the pressing cylinder; the retest subassembly includes the spacing cylinder 9 of vertical setting (the schematic diagram does not mark 9), spacing cylinder bottom end links firmly baffle 10 in order to restrict the chip gliding, gravity transfer chain bilateral symmetry is equipped with retest cylinder 11, and two retest cylinders all are equipped with the high-pressure test row claw 14 that is used for the top to connect chip 12 both sides opto-coupler pin 13 in opposite ends.
In the embodiment of the invention, the gravity conveying line comprises a pushing track 58, a detecting track 15, a collecting track 16, a retesting track 17 and a collecting track which are sequentially spliced, wherein the collecting track comprises a track seat 18, two sliding grooves 19 for matching with pins of an optocoupler on two sides of a chip to slide are symmetrically formed in the track seat, a bulge for receiving a chip main body is formed between the two sliding grooves, two limiting pressing blocks 20 are symmetrically and fixedly arranged on the top of the track seat, and the two limiting pressing blocks extend oppositely and the bottoms of the two limiting pressing blocks are respectively provided with a stepped groove 21 for matching with the chip.
In the embodiment of the invention, the limiting pressing blocks are vertically and penetratingly provided with air blowing holes 22, the bottoms of the limiting pressing blocks are obliquely provided with air blowing grooves 23 which are beneficial to blowing the chips, the air blowing grooves are communicated with the step grooves, and the tops of the air blowing holes are externally connected with an air pump through air blowing pipes 24.
In the embodiment of the invention, the detection track and the collection track are consistent in structure and comprise an upper guide plate 25 and a lower guide plate 26, wherein a straight groove 27 for embedding and sliding the top of a chip is arranged at the bottom of the upper guide plate, a sliding channel of the chip is formed between the straight groove and the lower guide plate, detection cylinders 28 are symmetrically arranged at two sides of the detection track, and high-voltage test row claws for propping up pins of an optical coupler at two sides of the chip are arranged at opposite ends of the two detection cylinders; the detection cylinder and the retest cylinder are connected with the high-voltage test row claw through a movable block 29, and the bottoms of the movable blocks slide on the bottom plate through a guide rail 30.
In the embodiment of the invention, the detection assembly further comprises two baffle air cylinders 31, the bottom telescopic ends of the two baffle air cylinders are respectively connected with a front insulation baffle 32 and a rear insulation baffle 33, and telescopic grooves 34 for the front insulation baffle, the rear insulation baffle and the baffle to pass through are vertically formed in the upper guide plate.
In the embodiment of the invention, the upper and lower sides of the detection track and the collection track are respectively provided with an optical fiber induction seat 35, a plurality of induction holes 36 for vertically inserting optical fiber inductors 40 are respectively arranged on the optical fiber induction seats at intervals, through holes 37 corresponding to the induction holes one by one are respectively formed in the upper guide plate and the lower guide plate in a penetrating manner, the optical fiber induction seats positioned above are respectively fixed on the partition plate, the optical fiber induction seats positioned below are respectively fixedly connected on the bottom plate, and opposite optical fiber inductors are also arranged at the two ends of the separation track to judge the number of chips in the butt joint track blocks.
In the embodiment of the invention, the pushing assembly comprises a pneumatic finger 42, two flat clamping fingers of the pneumatic finger are respectively connected with a sorting baffle 43 and a sorting compression bar 44, a sorting striking plate 45 is hinged at the side of the pneumatic finger, the sorting striking plate is fixedly connected with a striking bar 46 at one end far away from the hinge, the striking bar is positioned between the sorting baffle and the sorting compression bar and is used for preventing a chip from dislocating along with the sorting baffle, a sorting cylinder 47 used for pressing down the sorting striking plate is arranged above the sorting striking plate, the sorting cylinder is vertically fixed on the pneumatic finger, a spring 48 used for facilitating the return of the sorting striking plate is arranged between the pneumatic finger and the sorting striking plate, an auxiliary air pipe 49 used for blowing the chip along the conveying direction is fixedly arranged on the pushing track, and the auxiliary air pipe is externally connected with an air pump.
In the embodiment of the invention, the sorting and collecting assembly comprises a sorting track 50 which is positioned between a retest track and a collecting track and is perpendicular to the chip conveying direction, the collecting track comprises a qualified track 52 for respectively collecting qualified chips and a disadvantaged product track 51 for disadvantaged chips, a butt joint track block 53 is connected on the sorting track in a sliding way to butt joint the qualified track and the disadvantaged product track, a stop block 54 for blocking the chips is arranged on the butt joint track block, the stop block is driven to lift by a vertical cylinder 55 fixedly connected on the butt joint track block, and the butt joint track block is driven to slide on the sorting track by a motor and a belt.
In the embodiment of the invention, a partition 38 is arranged between the detection assembly and the collection assembly, between the collection assembly and the retest assembly, through holes 39 for the chip to pass through are formed in the partition, and the position pressing cylinder, the limiting cylinder and the baffle cylinder are fixedly connected to the partition.
In the embodiment of the invention, the detection track, the collection track and the retest track are all fixedly arranged on the same bottom plate 41, the bottom of the partition plate is fixedly connected to the bottom plate, the collection cylinder is embedded in the bottom of the bottom plate, and the lower guide plate is fixedly connected to the upper surface of the bottom plate.
The working method of the integrated circuit chip high-voltage retest sorting device comprises the following steps: and (3) classifying and conveying: firstly, chips are arranged on a pushing track and slide under the action of gravity, the chips are blocked by a granule baffle plate in a descending way, the granule baffle plate in an ascending way during working, a granule compression bar in a synchronous descending way, and then a granule cylinder in a descending way is matched for resetting to finish the split conveying of the granule knocking plate to single-granule chips, so that the adhesion is avoided; the chips are conveyed onto a detection track and move downwards under the action of a baffle cylinder through a front insulating baffle to block the chips from continuing to move downwards, the quantity of the chips which are arranged is sensed by an optical fiber sensor to be matched with a high-voltage test row claw, the baffle cylinder drives the rear insulating baffle to move downwards to block the chips from continuing to move downwards, at the moment, the detection cylinders on two sides extend out to push and prop the high-voltage test row claws on two sides to be connected onto pins of an optical coupler of the chips to finish high-voltage detection, the baffle cylinder drives the front insulating baffle to reset after the detection is finished, a plurality of chips after the detection slide into a collecting assembly, and then the cycle is performed, a top rod is blocked upwards under the action of the collecting cylinder, if the chips collected on a track seat are qualified, the collecting cylinder resets and is obliquely conveyed downwards to directly pass through a retesting assembly to enter a sorting collecting assembly under the action of blowing slot, a butt joint track block is in a sliding butt joint mode to receive the chips on the retesting track, the chips are blocked by a stop block, the butt joint track block directly butt joint an output end is in a qualified track, and the stop block moves upwards to finish collection of qualified chips; if the chips with problems are collected on the track seat, the compression bar is pressed down and connected onto the secondary chip blocked by the ejector rod under the action of the cylinder of the position pressing cylinder, the ejector rod moves down, the first chip slides onto the retest track, the baffle is blocked on the front side of the chip by the downward movement of the limiting cylinder, the retest cylinder is driven to push and connect the high-voltage test row claws on two sides on the pins of the optical coupler of the chip to finish high-voltage retest after the chips are sensed by the optical fiber sensor, the limiting cylinder moves up to convey the chips with problems after retest to the sorting and collecting assembly after the test, the butt joint track block is in sliding butt joint with the retest track and the inferior product track, and the chips are conveyed onto the inferior product track by the butt joint track block in a sliding manner to finish the collection of unqualified chips.
The invention is not limited to the above-mentioned best mode, any person can obtain other various types of integrated circuit chip high-voltage retest sorting device and working method thereof under the teaching of the invention. All equivalent changes and modifications made according to the claims of the present invention shall fall within the scope of the present invention.
Claims (10)
1. The integrated circuit chip high-voltage retest sorting device is characterized in that: the device comprises a gravity conveying line which is obliquely arranged, a pushing assembly, a detection assembly, a collecting assembly, a retest assembly and a sorting collecting assembly are sequentially arranged along the conveying direction of the gravity conveying line, the collecting assembly comprises a vertically arranged collecting cylinder and a pressing cylinder, a push rod for blocking chips from entering the retest assembly is fixedly connected to the telescopic end at the top of the collecting cylinder, and a compression rod for limiting secondary chips blocked by the push rod is fixedly connected to the telescopic end at the bottom of the pressing cylinder; the retest subassembly includes the spacing cylinder of vertical setting, spacing cylinder bottom end links firmly the baffle in order to restrict the chip gliding, gravity transfer chain both sides symmetry is equipped with retest cylinder, and two retest cylinders opposite ends all are equipped with the high-pressure test row claw that is used for the top to connect the opto-coupler pin of chip both sides.
2. The integrated circuit chip high-voltage retest sorting device according to claim 1, wherein: the gravity conveying line comprises a pushing track, a detecting track, a collecting track, a retest track and a collecting track which are spliced in sequence, wherein the collecting track comprises a track seat, sliding grooves which are symmetrically formed in the track seat and used for matching with pins of optical couplers on two sides of a chip are symmetrically formed in the track seat, two limiting pressing blocks are symmetrically and fixedly arranged at the top of the track seat, and stepped grooves which are used for matching with the chip are formed in the bottoms of the two limiting pressing blocks and extend in opposite directions.
3. The integrated circuit chip high-voltage retest sorting apparatus according to claim 2, wherein: the limiting pressing block is vertically provided with a blowing hole in a penetrating mode, the bottom of the limiting pressing block is obliquely provided with a blowing groove which is favorable for blowing the chip, the blowing groove is communicated with the stepped groove, and the top of the blowing hole is externally connected with an air pump.
4. The integrated circuit chip high-voltage retest sorting apparatus according to claim 2, wherein: the detection track is consistent with the collection track in structure and comprises an upper guide plate and a lower guide plate, wherein a straight groove for embedding and sliding the top of a chip is formed in the bottom of the upper guide plate, a sliding channel of the chip is formed between the straight groove and the lower guide plate, detection cylinders are symmetrically arranged on two sides of the detection track, and high-voltage test row claws for propping against pins of optocouplers on two sides of the chip are arranged at opposite ends of the two detection cylinders; the detection assembly further comprises two baffle air cylinders, the bottom telescopic ends of the two baffle air cylinders are respectively connected with the front insulating baffle and the rear insulating baffle, and telescopic grooves for the front insulating baffle, the rear insulating baffle and the baffle to pass through are vertically formed in the upper guide plate.
5. The integrated circuit chip high-voltage retest sorting apparatus according to claim 4, wherein: the optical fiber sensor is characterized in that optical fiber sensor seats are arranged above and below the detection track and the collecting track, a plurality of sensor holes for vertically inserting optical fiber sensors are formed in the optical fiber sensor seats at intervals, and through holes corresponding to the sensor holes one by one are formed in the upper guide plate and the lower guide plate in a penetrating mode.
6. The integrated circuit chip high-voltage retest sorting apparatus according to claim 2, wherein: the pushing assembly comprises a pneumatic finger, two flat clamping fingers of the pneumatic finger are respectively connected with a sorting baffle and a sorting compression bar, a sorting knocking plate is hinged to the side of the pneumatic finger, the end part of the sorting knocking plate is fixedly connected with a knocking rod, the knocking rod is located between the sorting baffle and the sorting compression bar and used for avoiding chip dislocation, a sorting cylinder used for downwards pressing the sorting knocking plate is arranged above the sorting knocking plate, the sorting cylinder is vertically fixed on the pneumatic finger, and a spring which is used for facilitating the sorting knocking plate to reset is arranged between the pneumatic finger and the sorting knocking plate.
7. The integrated circuit chip high-voltage retest sorting device according to claim 1, wherein: the sorting and collecting assembly comprises a sorting track which is positioned between the retest track and the collecting track and is perpendicular to the chip conveying direction, the collecting track comprises a qualified track for respectively collecting qualified chips and a disadvantaged product track for disadvantaged chips, a butt joint track block is connected to the sorting track in a sliding manner so as to butt joint the qualified track and the disadvantaged product track, a stop block for blocking the chips is arranged on the butt joint track block, and the stop block is driven to lift through a vertical cylinder fixedly connected to the butt joint track block.
8. The integrated circuit chip high-voltage retest sorting device according to claim 1, wherein: the detection assembly and the collection assembly, the collection assembly and the retest assembly are respectively provided with a baffle, the baffle is provided with a through hole for the chip to pass through, and the pressing cylinder, the limiting cylinder and the baffle cylinder are fixedly connected to the baffle.
9. The integrated circuit chip high-voltage retest sorting apparatus according to claim 2, wherein: the pushing track, the detecting track, the collecting track, the retesting track and the bottom of the collecting track are all fixedly arranged on the same bottom plate.
10. A method for operating a high-voltage retest sorting device for integrated circuit chips, characterized in that the high-voltage retest sorting device for integrated circuit chips according to any one of claims 1 to 9 is used and is carried out as follows: and (3) classifying and conveying: firstly, chips are arranged on a pushing track and slide under the action of gravity, the chips are blocked by a granule baffle plate in a descending way, the granule baffle plate in an ascending way during working, a granule compression bar in a synchronous descending way, and then a granule cylinder in a descending way is matched for resetting to finish the split conveying of the granule knocking plate to single-granule chips, so that the adhesion is avoided; the chips are conveyed onto a detection track and move downwards under the action of a baffle cylinder through a front insulating baffle to block the chips from continuing to move downwards, the quantity of the chips which are arranged is sensed by an optical fiber sensor to be matched with a high-voltage test row claw, the baffle cylinder drives the rear insulating baffle to move downwards to block the chips from continuing to move downwards, at the moment, the detection cylinders on two sides extend out to push and prop the high-voltage test row claws on two sides to be connected onto pins of an optical coupler of the chips to finish high-voltage detection, the baffle cylinder drives the front insulating baffle to reset after the detection is finished, a plurality of chips after the detection slide into a collecting assembly, and then the cycle is performed, a top rod is blocked upwards under the action of the collecting cylinder, if the chips collected on a track seat are qualified, the collecting cylinder resets and is obliquely conveyed downwards to directly pass through a retesting assembly to enter a sorting collecting assembly under the action of blowing slot, a butt joint track block is in a sliding butt joint mode to receive the chips on the retesting track, the chips are blocked by a stop block, the butt joint track block directly butt joint an output end is in a qualified track, and the stop block moves upwards to finish collection of qualified chips; if the chips with problems are collected on the track seat, the compression bar is pressed down and connected onto the secondary chip blocked by the ejector rod under the action of the cylinder of the position pressing cylinder, the ejector rod moves down, the first chip slides onto the retest track, the baffle is blocked on the front side of the chip by the downward movement of the limiting cylinder, the retest cylinder is driven to push and connect the high-voltage test row claws on two sides on the pins of the optical coupler of the chip to finish high-voltage retest after the chips are sensed by the optical fiber sensor, the limiting cylinder moves up to convey the chips with problems after retest to the sorting and collecting assembly after the test, the butt joint track block is in sliding butt joint with the retest track and the inferior product track, and the chips are conveyed onto the inferior product track by the butt joint track block in a sliding manner to finish the collection of unqualified chips.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410542451.1A CN118218277A (en) | 2024-04-30 | 2024-04-30 | High-voltage retest sorting device for integrated circuit chip and working method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410542451.1A CN118218277A (en) | 2024-04-30 | 2024-04-30 | High-voltage retest sorting device for integrated circuit chip and working method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN118218277A true CN118218277A (en) | 2024-06-21 |
Family
ID=91506686
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410542451.1A Pending CN118218277A (en) | 2024-04-30 | 2024-04-30 | High-voltage retest sorting device for integrated circuit chip and working method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN118218277A (en) |
-
2024
- 2024-04-30 CN CN202410542451.1A patent/CN118218277A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106311633A (en) | Multi-station series-connection labeling, testing and sorting device for integrated circuit chips | |
| CN110085931A (en) | A kind of automatic partial volume production line of battery and operating method | |
| CN210253168U (en) | Network transformer pin detects and orthotic devices | |
| CN106568990B (en) | A kind of probe tester of electronics module | |
| CN217888749U (en) | Withstand voltage detection device of circuit breaker | |
| CN118218277A (en) | High-voltage retest sorting device for integrated circuit chip and working method | |
| CN211602334U (en) | Multi-station radiator leak detection equipment | |
| CN202837490U (en) | Automatic function testing device for printed circuit board assembly (PCBA) | |
| CN209658346U (en) | A kind of automatic partial volume production line of battery | |
| CN109391100A (en) | A kind of electric motor of automobile core lamination stack automatic straightening mechanism and antidote | |
| CN210038107U (en) | LED lamp detection jig | |
| CN209803316U (en) | Withstand voltage testing device for electric energy meter | |
| CN106269587A (en) | IC chip cliff cut style testing, sorting machine automatic collecting device | |
| CN214638343U (en) | Sorting and knocking device of optical coupling test sorting machine | |
| CN109212390A (en) | A kind of voltage-withstand test sorting equipment of rectifier bridge | |
| CN214669404U (en) | Optical coupler high-voltage testing mechanism | |
| CN112775035A (en) | High-voltage testing device of optocoupler testing separator and working method thereof | |
| CN212856701U (en) | Testing machine for testing French socket | |
| CN212350999U (en) | Connecting piece processing equipment | |
| CN113857080A (en) | Integrated chip PIN detection and defective product classification equipment and detection and classification method | |
| CN108344940A (en) | A kind of intelligent detection equipment for leakage circuit breakers | |
| CN108594087B (en) | Material receiving device and method of semiconductor plastic sealing strip high-voltage insulation test system | |
| CN109541449B (en) | Relay automatic assembly testing arrangement | |
| CN106477283B (en) | Integrated circuit feeding reversing arrangement and feeding commutation method | |
| CN108080294B (en) | Bridge rectifier testing and sorting machine |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination |