CN118216713A - Electronic atomization device, atomizer and atomization core thereof - Google Patents
Electronic atomization device, atomizer and atomization core thereof Download PDFInfo
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- CN118216713A CN118216713A CN202211649172.2A CN202211649172A CN118216713A CN 118216713 A CN118216713 A CN 118216713A CN 202211649172 A CN202211649172 A CN 202211649172A CN 118216713 A CN118216713 A CN 118216713A
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- 229910002601 GaN Inorganic materials 0.000 claims description 3
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
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- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 3
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 3
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- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 claims description 3
- 229910052451 lead zirconate titanate Inorganic materials 0.000 claims description 3
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 claims description 3
- 238000001755 magnetron sputter deposition Methods 0.000 claims description 3
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 claims description 3
- 238000001451 molecular beam epitaxy Methods 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 claims description 3
- -1 polydimethylsiloxane Polymers 0.000 claims description 3
- UKDIAJWKFXFVFG-UHFFFAOYSA-N potassium;oxido(dioxo)niobium Chemical compound [K+].[O-][Nb](=O)=O UKDIAJWKFXFVFG-UHFFFAOYSA-N 0.000 claims description 3
- 238000004549 pulsed laser deposition Methods 0.000 claims description 3
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Classifications
-
- A—HUMAN NECESSITIES
- A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
- A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
- A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
- A24F40/40—Constructional details, e.g. connection of cartridges and battery parts
-
- A—HUMAN NECESSITIES
- A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
- A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
- A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
- A24F40/10—Devices using liquid inhalable precursors
-
- A—HUMAN NECESSITIES
- A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
- A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
- A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
- A24F40/40—Constructional details, e.g. connection of cartridges and battery parts
- A24F40/42—Cartridges or containers for inhalable precursors
-
- A—HUMAN NECESSITIES
- A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
- A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
- A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
- A24F40/50—Control or monitoring
Landscapes
- Special Spraying Apparatus (AREA)
Abstract
The invention relates to an electronic atomization device, an atomizer and an atomization core thereof, wherein the atomization core comprises a substrate layer; a piezoelectric thin film layer disposed on the substrate layer; the piezoelectric film layer comprises a first surface and a second surface opposite to the first surface, and the first surface is combined with the surface of the substrate layer; and an interdigital transducer disposed on the second surface. The atomizer comprises an atomization shell, an atomization seat and the atomization core; the atomization shell is arranged on the atomization seat, a liquid storage cavity and an air flow channel communicated with the outside are arranged in the atomization shell, and the liquid storage cavity is communicated with a liquid supply channel; the atomizing core is arranged in the atomizing shell and is communicated with the liquid supply channel. The electronic atomization device comprises a power supply assembly and the atomizer, and the power supply assembly is connected with the atomizer and supplies power to the atomizer. The invention atomizes the atomized liquid at low temperature, so that the safety is high and the electric energy utilization rate is high; the aerosol generated by atomization is small and uniform in particle size, so that the aerosol has high taste reduction degree, and the suction experience of a user can be improved.
Description
Technical Field
The invention relates to the technical field of atomization, in particular to an electronic atomization device, an atomizer and an atomization core thereof.
Background
The related atomization technology mainly adopts two atomization modes, one of which is an electric heating type electronic atomization device, and the electronic atomization device adopts porous ceramics or porous mediums such as porous cotton and the like to be combined with heating components such as resistance wires/films and the like for heating and atomization. On the one hand, the electric heating type atomization technology is higher in heating temperature: the atomized liquid is easy to crack, denature or dry burn carbon deposition on the surface of heating components such as resistance wires/films; the special essence and spice systems of different atomized liquids can be destroyed, even burnt smell is generated, so that the taste is affected; harmful substances such as aldehyde, ketone, carbon monoxide and the like are easy to generate, and potential safety hazards exist. On the one hand, the high temperature of the electric heating type atomization technology can volatilize heavy metals/cancerogenic substances with relatively high toxicity in porous medium materials such as porous ceramics or porous cotton, and the direct contact of atomized liquid and heating components such as resistance wires/films can dissolve out the heavy metals, and the dosage of the substances is very small, but the substances have a great threat to human health. On the other hand, the electric heating type and ultrasonic electronic atomizing devices have low electric energy utilization rate.
The other type is a surface acoustic wave electronic atomization device, and piezoelectric substrate materials used for processing surface acoustic wave atomization devices in the related art are mostly piezoelectric single crystals and piezoelectric ceramics. The piezoelectric single crystal material has the advantages of good uniformity, good repeatability, high reliability, small propagation loss of the surface acoustic wave and the like, but has the defects of high price, large electromechanical coupling coefficient K 2 and small temperature coefficient contradiction (difficult to simultaneously meet) caused by the limitation of the single crystal growth technology. The atomization core manufactured by the piezoelectric single crystal is used in the atomization process of the electronic atomization device, the atomization liquid has high viscosity (more than 100 cp), the power required by atomization is high, however, the piezoelectric single crystal substrate working under a high-power signal is easy to crack due to the contradiction between the electromechanical coupling coefficient and the temperature coefficient. The piezoelectric ceramic material has high electromechanical coupling coefficient, high temperature stability, convenient shaping and low cost, but the piezoelectric ceramic material has low repeatability and uniformity and large relative dielectric constant. The relative dielectric constant of the piezoelectric ceramic is large, so that the working frequency of the device is not high, the frequency influences the particle size of atomized aerosol, and the aerosol with overlarge particle size influences the sucking taste of consumers.
Disclosure of Invention
The invention aims to solve the technical problem of providing an improved electronic atomization device, an atomizer and an atomization core thereof.
The technical scheme adopted for solving the technical problems is as follows: a method of constructing an atomizing core, comprising:
a substrate layer;
A piezoelectric thin film layer disposed on the substrate layer; the piezoelectric film layer includes a first surface and a second surface opposite the first surface, the first surface being bonded to a surface of the substrate layer; and
An interdigital transducer disposed on the second surface.
In some embodiments, the material of the substrate layer comprises a hard material or a flexible material.
In some embodiments, the hard material comprises at least one of sapphire, glass, quartz, single crystal silicon, and diamond.
In some embodiments, the material of the substrate layer comprises glass having a thickness of 0.2mm to 3mm.
In some embodiments, the material of the substrate layer comprises single crystal silicon having a thickness of 0.2mm to 1mm.
In some embodiments, the flexible material comprises at least one of polyimide, aluminum foil, stainless steel with a thickness on the order of microns, and polydimethylsiloxane.
In some embodiments, the material of the piezoelectric thin film layer includes at least one of zinc oxide, aluminum nitride, gallium nitride, lithium niobate, lithium tantalate, potassium niobate, tantalum pentoxide, lead zirconate titanate, manganese, cobalt, and nickel.
In some embodiments, the piezoelectric thin film layer has a thickness of 1nm to 10 μm.
In some embodiments, the piezoelectric thin film layer is fabricated using a magnetron sputtering method, a pulsed laser deposition method, a molecular beam epitaxy valve, a metal organic chemical vapor deposition method, or a sol-gel method.
The invention also constructs an atomizer which comprises an atomization shell, an atomization seat and the atomization core; the atomization shell is arranged on the atomization seat, a liquid storage cavity for storing atomized liquid and an air flow channel communicated with the outside are arranged in the atomization shell, and the liquid storage cavity is communicated with a liquid supply channel; the atomizing core is arranged in the atomizing shell and is communicated with the liquid supply channel.
In some embodiments, the atomized liquid in the liquid storage cavity is supplied to the atomized core in a dripping manner.
In some embodiments, the atomized liquid in the liquid storage cavity is supplied to the atomized core through a drainage mode.
The invention also constructs an electronic atomization device which comprises a power supply assembly and the atomizer, wherein the power supply assembly is connected with the atomizer and supplies power to the atomizer.
The implementation of the invention has the following beneficial effects: the atomizing core comprises a substrate layer, a piezoelectric film layer arranged on the substrate layer and an interdigital transducer arranged on the piezoelectric film layer, and atomized liquid is atomized at low temperature, so that the safety is high and the electric energy utilization rate is high; the aerosol generated by atomization is small and uniform in particle size, so that the aerosol has high taste reduction degree, and the suction experience of a user can be improved.
Drawings
The invention will be further described with reference to the accompanying drawings and examples, in which:
FIG. 1 is a cross-sectional view of one embodiment of the atomizer of the present invention;
FIG. 2 is a cross-sectional view of another embodiment of the atomizer of the present invention;
FIG. 3 is a schematic view of the structure of one embodiment of the atomizing core of the present invention;
fig. 4 is a cross-sectional view of one embodiment of an atomizing core of the present disclosure.
Detailed Description
For a clearer understanding of technical features, objects and effects of the present invention, a detailed description of embodiments of the present invention will be made with reference to the accompanying drawings. In the following description, it should be understood that the directions or positional relationships indicated by "front", "rear", "upper", "lower", "left", "right", "longitudinal", "transverse", "vertical", "horizontal", "top", "bottom", "inner", "outer", "head", "tail", etc. are configured and operated in specific directions based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present invention, and do not indicate that the apparatus or element to be referred to must have specific directions, and thus should not be construed as limiting the present invention.
It should also be noted that unless explicitly stated or limited otherwise, terms such as "mounted," "connected," "secured," "disposed," and the like are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. When an element is referred to as being "on" or "under" another element, it can be "directly" or "indirectly" on the other element or one or more intervening elements may also be present. The terms "first," "second," "third," and the like are used merely for convenience in describing the present invention and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated, whereby features defining "first," "second," "third," etc. may explicitly or implicitly include one or more such features. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
In the following description, for purposes of explanation and not limitation, specific details are set forth such as the particular system architecture, techniques, etc., in order to provide a thorough understanding of the embodiments of the present invention. It will be apparent, however, to one skilled in the art that the present invention may be practiced in other embodiments that depart from these specific details. In other instances, detailed descriptions of well-known systems, devices, circuits, and methods are omitted so as not to obscure the description of the present invention with unnecessary detail.
The invention constructs an electronic atomization device which comprises a power supply component and an atomizer, wherein the power supply component is connected with the atomizer and supplies power to the atomizer.
Fig. 1 and 2 show an atomizer in an embodiment of the invention, comprising an atomizing housing 1, an atomizing core 2 and an atomizing base 3; the atomization shell 1 is arranged on the atomization seat 3, a liquid storage cavity 11 for storing atomized liquid and an air flow channel 16 communicated with the outside are arranged in the atomization shell 1, and the liquid storage cavity 11 is communicated with a liquid supply channel 13; the atomizing core 2 is disposed in the atomizing housing 1 and communicates with the liquid supply passage 13. Specifically, the atomized liquid may be a liquid aerosol-generating substrate, a cosmetic liquid, a medicinal liquid, or the like.
As shown in fig. 1, in some embodiments, the atomized liquid on the atomizing core 2 is supplied in a drop-type manner, and a baffle is disposed along the liquid outlet 12 and extends vertically downward to form a liquid supply channel 13, and the atomized liquid enters the atomizing core through the liquid supply channel 13 for atomization.
The chip support 14 is horizontally arranged below the liquid storage cavity 11, and the atomizing core 2 can be placed on the chip support 14 for supporting the atomizing core 2, so that the atomizing core 2 is horizontally arranged below the liquid storage cavity 11, the chip support 14 is arranged on the inner side of the bottom wall of the atomizing shell 1, one end of the chip support 14 is fixed on the inner wall surface of one side of the atomizing shell 1, and the other end of the chip support is spaced from the inner wall surface of the opposite side, so that the air inlet channel 15 is arranged. The atomizer still includes atomizing seat 3 and suction nozzle 4, and atomizing seat 3 is used for bearing atomizing subassembly 2, and atomizing seat 3 links to each other with atomizing casing 1 bottom, and the opening has been seted up to atomizing casing 1 bottom, has seted up inlet port 31 on the atomizing seat 3 lateral wall to let external air get into. The opening communicates with the intake hole 31 to form the intake passage 15. The suction nozzle 4 is arranged at the top end of the atomization shell 1 and penetrates through the top wall of the atomization shell 1 to output aerosol for a user to suck; the air inlet hole 31 is communicated with an air inlet channel 15 in the atomization shell 1, and the air inlet channel 15 is communicated with an air flow channel 16 to the suction nozzle 4 at the top end of the atomization shell 1. The liquid storage cavity 11 is positioned in the atomization shell 1, a conducting air flow channel 16 is reserved between the liquid storage cavity 11 and the wall surface of the atomization shell 1, the air flow channel 16 is communicated with an air inlet channel 15, aerosol obtained after atomization through the atomization core 2 is communicated to a suction nozzle 4 arranged at the top end of the atomization shell 1, and when a user sucks, the aerosol flows into the suction nozzle 4 under the action of pressure difference in the air flow channel 16 to enter the mouth of the user. The bottom wall of the atomization shell 1 is connected with a conductive spring gasket 32 for realizing the electric connection between the atomizer and the power supply assembly; specifically, the spring spacer 32 is arranged in the atomizing base 3, the first end of the spring spacer 32 is connected with the bottom wall of the atomizing housing 1, and the second end of the spring spacer 32 is connected with the power supply assembly so as to realize that the power supply assembly supplies power to the atomizer.
In other embodiments, as shown in fig. 2, the atomized liquid on the atomizing core 2 may be supplied in a drainage type. The chip support 14 can be arranged in the atomization shell 1 along the vertical direction and parallel to the side wall of the atomization shell 1, and is fixed on the inner wall surface on one side opposite to the position of the liquid storage cavity 11, the chip support 14 is fixed on the inner wall surface and is used for limiting the position of the atomization core 2 relatively, the atomization core 2 can be arranged on the chip support 14, and due to the fact that the atomization core 2 in the embodiment is limited in installation, an oil guide is required to be arranged to guide atomized liquid in the liquid storage cavity 11 into the atomization core 2 for atomization, therefore, the atomization assembly 2 further comprises a porous oil guide block 17, a partition plate is arranged below the liquid storage cavity 11 and extends to the position of the porous oil guide block 17 to form a liquid supply channel 13, the porous oil guide block 17 is arranged between the liquid supply channel 13 and the atomization core 2, and in particular, the porous oil guide block 17 is arranged between the liquid supply channel 13 and the atomization core 2, and atomized liquid in the liquid supply channel 13 is guided into the atomization core 2 through capillary force so as to realize accurate liquid supply. Specifically, the porous oil guiding block 17 may be any one of oil guiding materials such as cotton core, fiber, paper strip, ceramic, porous glass, etc.
The bottom of the atomization shell 1 can be connected with an atomization seat 3, an opening is formed in the bottom of the atomization shell 1, and an air inlet hole 31 is formed in the atomization seat 3 so as to allow outside air to enter; the opening communicates with the intake hole 31 to form the intake passage 15. The liquid storage cavity 11 is located in the atomization shell 1, a conducting air flow channel 16 is reserved between the liquid storage cavity 11 and the wall surface of the atomization shell 1, the air flow channel 16 is communicated with an air inlet channel 15, aerosol obtained after atomization through the atomization core 2 is communicated to a suction nozzle 4 arranged at the top end of the atomizer, the suction nozzle 4 penetrates through the atomization shell 1 and is used for outputting the aerosol for a user to inhale, and when the user inhales, the aerosol flows into the suction nozzle 4 to enter a user mouth under the action of a pressure difference in the air flow channel 16. The atomizer is connected with a conductive spring gasket 32 for realizing the electric connection between the atomizer and the power supply assembly; specifically, the spring spacer 32 sets up in atomizing seat 3 below, and spring spacer 32 first end is connected with atomizing seat 3, and spring spacer 32 second end is connected with power supply unit to realize that power supply unit supplies power to the atomizer.
It is understood that the liquid supply method of the atomized liquid on the atomizing core 2 is not limited to the above-described drip type and drainage type, and other liquid supply methods can be adopted.
Fig. 3 and 4 show an atomizing core 2 according to an embodiment of the present invention, the atomizing core 2 comprising a substrate layer 21, a piezoelectric film layer 22 and an interdigital transducer 23. A piezoelectric thin film layer 22 is disposed on the substrate layer 21 for converting electrical energy into mechanical energy; an interdigital transducer 23 is disposed on the piezoelectric film layer 22. The interdigital transducer 23 has the main function of exciting a surface acoustic wave, realizing the mutual conversion between an electric signal and mechanical vibration, and the structural parameters of the interdigital transducer directly affect the performance of the surface acoustic wave device.
The substrate layer 21 is a carrier for attaching the piezoelectric thin film layer 22, and the material of the substrate layer 21 may include a hard material or a flexible material. In some embodiments, the substrate layer 21 may comprise at least one of a rigid substrate material such as sapphire, glass, quartz, single crystal silicon, diamond, and hard stainless steel. In order to ensure the flatness and smoothness of the piezoelectric thin film layer 22, the material of the substrate layer 21 must be ground and polished for use. While selecting substrate materials with different characteristics as the substrate can manufacture the atomizing core 2 with different characteristics, for example, when it is required to manufacture the atomizing core 2 with high temperature characteristics, quartz can be selected as the material of the substrate layer 21. The substrate layer 21 with different thickness can be selected according to different materials and different application scenes, for example, when glass is selected as the material of the substrate layer 21, the thickness of the glass can be 0.2 mm-3 mm, and when monocrystalline silicon is selected as the material of the substrate layer 21, the thickness of the monocrystalline silicon can be 0.2 mm-1 mm.
In some embodiments, the substrate layer 21 may include at least one of Polyimide (PI), aluminum foil, stainless steel with a thickness of micrometer scale, and Polydimethylsiloxane (PDMS) and other flexible materials.
The piezoelectric thin film layer 22 includes a first surface bonded to a surface of the substrate layer 21 and a second surface opposite to the first surface.
The energy of this atomizing core 2 is mainly concentrated in the surface layer of the substrate layer 21, and the thickness is about one wavelength of a surface acoustic wave. Therefore, if the thickness of the substrate layer 21 is set to one wavelength, it is not necessary to use a piezoelectric single crystal or piezoelectric ceramic as the material of the substrate layer 21, but a material having no piezoelectric property and low cost such as glass or stainless steel can be used as the substrate layer 21, and the piezoelectric thin film layer 22 having a thickness of about one wavelength is covered on the substrate layer 21, thereby obtaining the atomizing core 2. The atomizing core 2 made of the piezoelectric film material and the substrate does not need to use expensive piezoelectric monocrystal materials, and has the characteristics of economy and material saving; the piezoelectric film can be deposited according to a certain orientation, so that the processes such as polarization orientation, cutting and the like are not needed; the piezoelectric device has the advantages of wide application frequency range, simple manufacture, high energy conversion efficiency, integration with a semiconductor process and accordance with the development trend of miniaturization and integration of the piezoelectric device.
Therefore, the characteristics of the piezoelectric thin film layer 22 need to be as good as those of a piezoelectric crystal, and a polycrystalline piezoelectric thin film or an epitaxial single crystal piezoelectric thin film having orientation is generally used. In some embodiments, the material of the piezoelectric thin film layer 22 may include at least one of zinc oxide, aluminum nitride, gallium nitride, lithium niobate, lithium tantalate, potassium niobate, tantalum pentoxide, lead zirconate titanate, or a piezoelectric thin film material doped with a small amount of impurities such as manganese, cobalt, and nickel.
In such an atomizing core 2, one important factor determining the acoustic wave characteristics is the positions of the interdigital transducer 23 and the counter electrode. If a suitable piezoelectric film material and thickness are chosen, the electromechanical coupling coefficient of the piezoelectric film is sometimes greater than that of the piezoelectric monocrystalline substrate, because the surface acoustic waves can be designed to be concentrated within the piezoelectric film and the interdigital transducer 23 can be placed in a suitable position to effectively excite the surface acoustic waves.
The thickness of the piezoelectric film directly affects the performance of the atomizing core 2, and in some embodiments, the thickness of the piezoelectric film layer 22 may be 1nm to 10 μm.
The piezoelectric thin film materials may vary in their orientation and may vary widely in their piezoelectric properties. In some embodiments, the method of fabricating the piezoelectric thin film layer 22 may include a magnetron sputtering method, a pulsed laser deposition method, a molecular beam epitaxy valve, a metal organic chemical vapor deposition method, a sol-gel method, or the like.
When the sound wave on the atomizing core 2 encounters the liquid on the propagation path, due to the difference of the propagation speeds of the sound wave in the substrate and the liquid drop, one part of the sound wave continuously propagates along the substrate-liquid interface, and the other part of the sound surface wave is radiated into the liquid at a Rayleigh angle theta R, and interacts with the liquid to generate a volume force F s to drive the liquid to move. Wherein the horizontal force drives the liquid to move along the surface of the substrate to form a liquid film, and the vertical vibration acceleration of up to 10 8 m/s forms a surface tension wave on the surface of the liquid. When the gas-liquid interface is unstable and the amplitude of the surface tension wave is large enough, the liquid drops are broken and atomization occurs.
As shown in fig. 3, an interdigital transducer 23 is provided on the second surface of the piezoelectric thin film layer 22, and the interdigital transducer 23 includes a bus electrode 231 and an interdigital electrode 232. In some embodiments, the interdigital transducers 23 can be provided in a group number to generate a traveling wave surface acoustic wave. In other embodiments, the interdigital transducers 23 may be arranged in two groups, and the interdigital transducers 23 of the two groups may be symmetrically distributed to generate standing wave surface acoustic waves. The design parameters of the interdigital transducer 23 mainly include electrode material, interdigital width a and interdigital pitch b, interdigital logarithm N, aperture W, and the like. The interdigital transducer 23 can be manufactured by using micro-nano manufacturing technology through processes such as spin coating, photoetching, developing, coating, stripping and the like, and two groups of mutually staggered and periodically distributed metal racks (interdigital electrodes 232) are manufactured on the second surface, such as a series of mutually crossed metal electrodes of fingers, and each finger is connected with the corresponding bus electrode 231.
When an ac electrical signal is applied to the bus electrode 231 of the interdigital transducer 23, the piezoelectric material between the interdigital electrodes 232 converts the ac electrical signal into mechanical vibration under the action of the inverse piezoelectric effect, i.e., the process of converting the ac electrical signal into mechanical vibration that alternately stretches and contracts, and the mechanical vibration propagates along the surface of the piezoelectric film layer 22 within the length (i.e., the acoustic aperture) of the finger to form a surface acoustic wave.
The invention also constructs a method for manufacturing the atomizing core, which comprises the following steps: first, a layer of piezoelectric film is deposited on the surface of the substrate layer 21, and then, an interdigital transducer 23 is fabricated on the surface of the piezoelectric film layer 22 by wet etching, lift-off or mask deposition.
The atomizing core 2 comprises a substrate layer 21, a piezoelectric film layer 22 arranged on the substrate layer 21 and an interdigital transducer 23 arranged on the piezoelectric film layer 22, and atomized liquid is atomized at a low temperature, so that the safety is high and the electric energy utilization rate is high; solves the problems of poor taste caused by burnt smell caused by a porous medium high-temperature heating atomization mode, carcinogenic substances generated by molecular decomposition/denaturation caused by high temperature, heavy metal dissolution risk caused by direct contact of a metal electrode and tobacco tar, low electric energy utilization rate and the like in the prior electric heating atomization technology. Compared with an acoustic wave atomizing core made of piezoelectric monocrystal materials, the atomizing core 2 is not easy to crack under the same working power. Compared with an acoustic wave atomizing core made of a piezoelectric ceramic material, the aerosol generated by atomizing the atomizing core 2 is small and uniform in particle size, so that the aerosol is high in taste reduction degree, and the suction experience of a user can be improved.
It is to be understood that the above examples only represent preferred embodiments of the present invention, which are described in more detail and are not to be construed as limiting the scope of the invention; it should be noted that, for a person skilled in the art, the above technical features can be freely combined, and several variations and modifications can be made without departing from the scope of the invention; therefore, all changes and modifications that come within the meaning and range of equivalency of the claims are to be embraced within their scope.
Claims (13)
1. An atomizing core, comprising:
a substrate layer;
A piezoelectric thin film layer disposed on the substrate layer; the piezoelectric film layer includes a first surface and a second surface opposite the first surface, the first surface being bonded to a surface of the substrate layer; and
An interdigital transducer disposed on the second surface.
2. The atomizing core of claim 1, wherein the material of the substrate layer comprises a hard material or a flexible material.
3. The atomizing core of claim 2, wherein the hard material comprises at least one of sapphire, glass, quartz, monocrystalline silicon, and diamond.
4. A atomizing core as set forth in claim 3, wherein said substrate layer material comprises glass having a thickness of from 0.2mm to 3mm.
5. A atomizing core as set forth in claim 3, wherein said substrate layer material comprises single crystal silicon having a thickness of 0.2mm to 1mm.
6. The atomizing core of claim 2, wherein the flexible material comprises at least one of polyimide, aluminum foil, stainless steel having a thickness on the order of microns, and polydimethylsiloxane.
7. The atomizing core of claim 1, wherein the material of the piezoelectric film layer includes at least one of zinc oxide, aluminum nitride, gallium nitride, lithium niobate, lithium tantalate, potassium niobate, tantalum pentoxide, lead zirconate titanate, manganese, cobalt, and nickel.
8. The atomizing core of claim 1, wherein the piezoelectric film layer has a thickness of 1nm to 10 μm.
9. The atomizing core of claim 1, wherein the piezoelectric thin film layer is formed by a magnetron sputtering method, a pulsed laser deposition method, a molecular beam epitaxy valve, a metal organic chemical vapor deposition method, or a sol-gel method.
10. An atomizer comprising an atomizing housing, an atomizing base, and an atomizing core according to any one of claims 1-9; the atomization shell is arranged on the atomization seat, a liquid storage cavity for storing atomized liquid and an air flow channel communicated with the outside are arranged in the atomization shell, and the liquid storage cavity is communicated with a liquid supply channel; the atomizing core is arranged in the atomizing shell and is communicated with the liquid supply channel.
11. The atomizer of claim 10 wherein atomized liquid in said liquid reservoir is supplied to said atomizing wick by means of droplets.
12. The atomizer of claim 10 wherein atomized liquid in said liquid reservoir is supplied to said atomizing wick by drainage.
13. An electronic atomising device comprising a power supply assembly and a nebuliser as claimed in any one of claims 10 to 12, the power supply assembly being connected to and supplying power to the nebuliser.
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| CN202211649172.2A CN118216713A (en) | 2022-12-21 | 2022-12-21 | Electronic atomization device, atomizer and atomization core thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202211649172.2A CN118216713A (en) | 2022-12-21 | 2022-12-21 | Electronic atomization device, atomizer and atomization core thereof |
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| CN202211649172.2A Pending CN118216713A (en) | 2022-12-21 | 2022-12-21 | Electronic atomization device, atomizer and atomization core thereof |
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| CN (1) | CN118216713A (en) |
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