CN118215880A

CN118215880A - Display device

Info

Publication number: CN118215880A
Application number: CN202380014494.6A
Authority: CN
Inventors: 张楠楠; 王汉永; 李富琳
Original assignee: Hisense Visual Technology Co Ltd
Current assignee: Hisense Visual Technology Co Ltd
Priority date: 2022-02-23
Filing date: 2023-01-19
Publication date: 2024-06-18
Also published as: CN116679480A

Abstract

A display device, comprising: a display panel (200) for displaying an image; the backlight module (100) is positioned on the light incident side of the display panel (200) and is used for providing backlight; the backlight module (100) comprises a lamp panel (1), wherein a flexible circuit board (f) is bound on the lamp panel (1), and the flexible circuit board (f) is used for connecting adjacent lamp panels (1), control panels of a display device or adapter plates of the display device.

Description

Display device

Cross Reference to Related Applications

The application is required to be submitted in 2022, 01 and 20 days, and the application number is 202220161941.3; submitted at 20/01/2022 with application number 202220165053.9; priority of chinese patent application number 202210168788.1 filed on month 23 2022, incorporated herein by reference in its entirety.

Technical Field

The application relates to the technical field of display, in particular to a display device.

Background

The liquid crystal display device mainly comprises a backlight module and a liquid crystal display panel. The liquid crystal display panel does not emit light and needs to realize brightness display by means of a light source provided by the backlight module.

The direct type backlight module adopting the light emitting Diode (LIGHT EMITTING Diode, short for LED) as the backlight source can dynamically control the light source in multiple areas, thereby remarkably improving the dynamic contrast of the liquid crystal display device and improving the display effect.

The micro light emitting Diode (MINI LIGHT EMITTING Diode, abbreviated as Mini LED) chip is miniaturized, and the Mini LED is used as a backlight light source in liquid crystal display, so that not only can the thinning of the backlight module be realized, but also more refined dynamic control can be realized, the dynamic contrast of the liquid crystal display can be improved, and a better High dynamic range (High-DYNAMIC RANGE, abbreviated as HDR) display effect can be achieved.

Disclosure of Invention

An embodiment of the present application provides a display device including: a display panel for displaying an image; the backlight module is positioned on the light incident side of the display panel and is used for providing backlight; the backlight module comprises a lamp panel, wherein a flexible circuit board is bound on the light emitting side of the lamp panel, and the flexible circuit board is used for connecting adjacent lamp panels, control panels of a display device or adapter plates of the display device.

The embodiment of the application also provides a display device, which comprises: a display panel for displaying an image; the backlight module is positioned on the light incident side of the display panel; the backlight module comprises a lamp panel; the lamp panel includes: a substrate; the first circuit layer is positioned on one side of the substrate facing the display panel; the second circuit layer is positioned on one side of the substrate, which is away from the display panel; the front projection range of the circuit area of the first circuit layer on the substrate is larger than the front projection range of the circuit area of the second circuit layer on the substrate, and the front projection of the circuit area of the first circuit layer on the substrate completely covers the front projection of the circuit area of the second circuit layer on the substrate; the circuit of the first circuit layer and the circuit of the second circuit layer are electrically connected through the through hole of the substrate.

The embodiment of the application also provides a manufacturing method of the display device, which comprises the following steps: coating imprinting glue on the surfaces of two sides of the substrate to form a first imprinting layer and a second imprinting layer; embossing the first embossing layer to form a first concave part, and embossing the second embossing layer to form a second concave part; filling conductive material in the first concave part to form a first circuit layer, and filling conductive material in the second concave part to form a second circuit layer; and welding a light source on the first circuit layer to form a lamp panel.

Drawings

Fig. 1 is a schematic cross-sectional structure of a display device according to an embodiment of the present application;

FIG. 2 is a schematic perspective view of a display device according to the related art;

FIG. 3 is a schematic plan view of a lamp panel according to the related art;

FIG. 4 is a schematic side view of the lamp panel of FIG. 3;

FIG. 5 is a schematic diagram of a second planar structure of a lamp panel according to the related art;

FIG. 6 is a schematic side view of the lamp panel of FIG. 5;

FIG. 7 is a schematic plan view of a spliced lamp panel according to the related art;

FIG. 8 is a schematic diagram of a planar structure of a lamp panel according to an embodiment of the present application;

FIG. 9 is a schematic side view of the lamp panel of FIG. 8;

FIG. 10 is a schematic cross-sectional view of a lamp panel according to an embodiment of the present application;

FIG. 11 is a schematic diagram of a cross-sectional structure of a lamp panel according to an embodiment of the application;

FIG. 12 is a schematic diagram of a second planar structure of a lamp panel according to an embodiment of the present application;

Fig. 13 is a schematic plan view of a flexible circuit board according to an embodiment of the present application;

FIG. 14 is a schematic diagram showing a planar structure of a flexible printed circuit board according to an embodiment of the present application;

FIG. 15 is a third schematic plan view of a flexible printed circuit board according to an embodiment of the present application;

FIG. 16 is a schematic diagram of a planar structure of a flexible printed circuit board according to an embodiment of the present application;

FIG. 17 is a third schematic plan view of a lamp panel according to an embodiment of the present application;

FIG. 18 is a schematic diagram of a planar structure of a lamp panel according to an embodiment of the present application;

FIG. 19 is a schematic plan view of a spliced lamp panel according to an embodiment of the present application;

FIG. 20 is a schematic cross-sectional view taken along the direction I-I' in FIG. 19;

FIG. 21 is a second schematic plan view of a spliced lamp panel according to an embodiment of the present application;

FIG. 22 is a schematic perspective view of a display device according to an embodiment of the present application;

Fig. 23 is a schematic cross-sectional structure of a spliced lamp panel according to an embodiment of the present application;

FIG. 24 is a third schematic plan view of a spliced lamp panel according to an embodiment of the present application;

FIG. 25 is a schematic cross-sectional view taken along the direction I-I' in FIG. 24;

FIG. 26 is a schematic plan view of a spliced lamp panel according to an embodiment of the present application;

FIG. 27 is a second perspective view of a display device according to an embodiment of the application;

FIG. 28 is a schematic cross-sectional view of a single-layer circuit lamp panel;

FIG. 29 is a schematic cross-sectional view of a double-layer circuit lamp panel;

FIG. 30 is a third schematic cross-sectional view of a lamp panel according to an embodiment of the present application;

FIG. 31 is a schematic diagram of a cross-sectional structure of a lamp panel according to an embodiment of the present application;

FIG. 32 is a schematic diagram of a cross-sectional structure of a lamp panel according to an embodiment of the present application;

FIG. 33 is a schematic diagram of a connection between a lamp panel and an adapter board according to an embodiment of the present application;

FIG. 34 is a third perspective view of a display device according to an embodiment of the application;

FIG. 35 is a second schematic diagram of connection between a lamp panel and an adapter plate according to an embodiment of the present application;

FIG. 36 is a schematic diagram showing a planar structure of a lamp panel according to an embodiment of the present application;

FIG. 37 is a schematic view of a planar structure of a lamp panel according to an embodiment of the present application;

FIG. 38 is a schematic diagram of a planar structure of a lamp panel according to an embodiment of the present application;

FIG. 39 is a flowchart of a method for fabricating a display device according to an embodiment of the present application;

Fig. 40 is a schematic structural diagram of a manufacturing process of a display device according to an embodiment of the application.

Detailed Description

In order that the above objects, features and advantages of the application will be readily understood, a further description of the application will be rendered by reference to specific embodiments thereof which are illustrated in the appended drawings. However, the example embodiments may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

The display principle of the liquid crystal display device is to place liquid crystal between two pieces of conductive glass, and drive the electric field between two electrodes to cause the electric field effect of liquid crystal molecule distortion so as to control the transmission or shielding function of the backlight source, thereby displaying the image. If a color filter is added, a color image can be displayed.

Fig. 1 is a schematic cross-sectional structure of a display device according to an embodiment of the present application.

As shown in fig. 1, the display device includes: the backlight module 100 and the display panel 200, the backlight module 100 is used for providing backlight to the display panel 200, and the display panel 200 is used for displaying images.

The backlight module 100 is generally located at the bottom of the display device, and its shape and size are adapted to those of the display device. When applied to the fields of televisions, mobile terminals and the like, the backlight module generally adopts a rectangular shape.

The backlight module in the embodiment of the application adopts the direct type backlight module and is used for uniformly emitting light in the whole light-emitting surface and providing light with sufficient brightness and uniform distribution for the display panel so that the display panel can normally display images.

The display panel 200 is located on the light emitting side of the backlight module 100, and the shape and size of the display panel are generally matched with those of the backlight module. The display panel 200 may be generally configured in a rectangular shape including a top side, a bottom side, a left side and a right side, wherein the top side is opposite to the bottom side, the left side is opposite to the right side, the top side is connected to one end of the left side and one side of the right side, and the bottom side is connected to the other end of the left side and the other end of the right side, respectively.

The display panel 200 is a transmissive display panel, and is capable of modulating the transmittance of light, but does not emit light itself. The display panel 200 has a plurality of pixel units arranged in an array, and each pixel unit can independently control the transmittance and color of the light incident on the pixel unit by the backlight module 100, so that the light transmitted by all the pixel units forms a displayed image.

Fig. 2 is a perspective schematic view of a display device in the related art.

As shown in fig. 2, the backlight module 100 includes: a lamp panel 1, a back plate 2, a diffusion plate 3 and an optical film 4.

The backboard 2 is positioned at the bottom of the backlight module and has the functions of supporting and bearing. The back plate 2 is typically a square structure, the shape of which is adapted to the shape of the display device when applied to a shaped display device. The back plate 2 includes a top side, a bottom side, a left side, and a right side. Wherein the sky side is relative with the earth side, and left side is relative with the right side, and the sky side links to each other with one end of left side and one side of right side respectively, and the earth side links to each other with the other end of left side and the other end of right side respectively.

The backboard 2 is made of aluminum, iron, aluminum alloy or iron alloy and the like. The back plate 2 is used for supporting the lamp panel 1, supporting and fixing the edge positions of the diffusion plate 3, the optical membrane 4 and other parts, and the back plate 2 also plays a role in heat dissipation of the lamp panel 1.

In the embodiment of the application, the backlight module is a direct type backlight module, and the lamp panel 1 is located on the back plate 2. In general, the lamp panel 1 can be square or rectangular overall, and has a length of 200mm-1200mm and a width of 100mm-600mm.

A plurality of lamp panels 1 may be provided according to the size of the display device, and backlight is commonly provided between the lamp panels 1 by a splicing manner. For example, a 65 inch display device requires at least 2x 4 light panels 1 to be tiled. In order to avoid the optical problem caused by the splicing of the lamp panels 1, the splice between the adjacent lamp panels 1 is smaller as much as possible, and even seamless splicing is realized.

The lamp panel 1 is used as a backlight source, and compared with the lamp strip used as the backlight source in the side-in backlight module, the lamp panel 1 has higher brightness, and the dynamic contrast ratio of the display device can be improved by matching with the dynamic control of the subareas.

The diffusion plate 3 is located at the light emitting side of the lamp panel and is spaced from the lamp panel by a certain distance. The distance is set so that the light sources on the lamp panel can be fully mixed. The diffusion plate 3 is used for scattering incident light, so that the light passing through the diffusion plate 3 is more uniform.

The diffusion plate 3 is provided with scattering particle materials, and light rays are incident on the scattering particle materials and are continuously refracted and reflected, so that the effect of scattering the light rays is achieved, and the effect of homogenizing the light is achieved. The thickness of the diffusion plate is generally set to 1.5mm-3mm, and the larger the thickness of the diffusion plate is, the larger the haze is, and the better the uniformity effect is.

The diffusion plate 3 may be generally manufactured by an extrusion process, and the material used for the diffusion plate 3 is generally at least one selected from polymethyl methacrylate (Polymethyl Methacrylate, abbreviated as PMMA), polycarbonate (abbreviated as PC), polystyrene material (Polystyrene, abbreviated as PS), polypropylene (abbreviated as PP).

In the embodiment of the present application, the lamp panel 1 may be used for emitting blue light. At this time, the diffusion plate 3 may be a quantum dot diffusion plate for realizing color conversion and diffusion functions.

The optical film 4 is located on the side of the diffusion plate facing away from the lamp panel 1. The optical film 4 is sized to fit the display device and is slightly smaller than the display device, and is typically rectangular or square.

In specific implementation, the optical film 4 includes one or a combination of several of a fluorescent film, a quantum film, a prism sheet, a brightness enhancement film, and the like, and is configured according to specific needs.

As shown in fig. 2, the light panels 1 are typically connected to a control board (not shown) of the display device, which can control each light panel 1. The lamp panel 1 and the control panel are connected by a flexible flat cable (Flexible Flat Cable, abbreviated as FFC). At present, the lamp panel 1 needs to be connected with the FFC by adopting a connection terminal 12, in some cases, holes need to be punched in the lamp panel 1 for sinking a socket for connecting with the FFC, and the connection terminal 12 is a sinking terminal. Accordingly, as shown in fig. 2, it is also necessary to provide a back plate opening 21 for outgoing lines at a position of the back plate 2 corresponding to the sinking terminal.

Fig. 3 is a schematic plan view of a lamp panel according to the related art, and fig. 4 is a schematic side view of the lamp panel shown in fig. 3.

In some embodiments, as shown in fig. 3 and fig. 4, the cost can be effectively reduced when the lamp panel adopts a single-layer circuit, and the lamp panel of the single-layer circuit needs to be connected with the control board by adopting a sinking terminal (a connecting terminal 12) to connect with the FFC, and then the lamp panel needs to be perforated, which causes that the lamp panel cannot be used for wiring at the opening position, and limits the lamp panel to realize more partitions.

Fig. 5 is a schematic plan view of a second related art lamp panel, and fig. 6 is a schematic side view of the lamp panel shown in fig. 5.

In some embodiments, as shown in fig. 5 and 6, when the lamp panel adopts a double-layer circuit, since the circuit is disposed on both sides of the lamp panel, the connection terminal 12 may be disposed on the back of the lamp panel, and then the FFC may be connected to the control board using a chip terminal (connection terminal 12). The chip terminals are located on the back of the lamp panel, so that the back plate 2 needs to be perforated at the corresponding positions.

Fig. 7 is a schematic plan view of a spliced lamp panel in the related art.

As shown in fig. 7, when the light panel is applied to a large-sized display device, problems such as serious expansion and shrinkage of the panel, low accuracy of the bonding pad and the like occur due to the oversized light panel, and a scheme of mutually splicing a plurality of light panels is generally adopted. Since each lamp panel 1 needs to be connected to the control board through an FFC, a large number of FFC wires are required, and the wiring positions of the FFCs are required to be laid out on the back of each area of the back plate, which is not beneficial to the thinning of the backlight module.

In view of this, the present application provides a display device, fig. 8 is a schematic plan view of a lamp panel according to an embodiment of the present application, and fig. 9 is a schematic side view of the lamp panel shown in fig. 8.

As shown in fig. 8 and 9, the backlight module in the embodiment of the application includes a lamp panel, and a flexible circuit board (Flexible Printed Circuit, abbreviated as FPC) f is bound to the lamp panel 1, where the flexible circuit board f is used to connect adjacent lamp panels, control boards of display devices, or adapter boards of display devices.

In specific implementation, the lamp panel may not be provided with a driving chip, and after the lamp panel is connected with the control panel, the control panel can drive the lamp panel, and at this time, the control panel can also be a driving board. Or the lamp panel can be provided with a driving chip to form a lamp panel with a lamp driving function, and after the lamp panel is connected with the control panel, the control panel can provide driving control signals for the driving chip, and the driving chip can further drive the lamp panel. If the circuit between the lamp panel and the control panel is too long, an adapter plate can be arranged between the lamp panel and the control panel, the lamp panel is connected to the adapter plate first, and then the adapter plate is connected with the control panel.

In some embodiments, if the light panel is a single layer circuit board, the sinking terminals are replaced by binding FPCs for circuit transmission. Compared with a sinking terminal mode, the periphery of the binding FPC position is allowed to be designed in a walking way, so that the number of partitions which can be realized by adopting a lamp panel with a single-layer circuit can be increased.

In some embodiments, the light panel may be directly connected to the control board of the display device by binding the flexible circuit board f so that the light panel may be controlled by the control board to be lighted. Therefore, the FFC wire is used for connecting the control panel instead, and punching of the backboard is avoided.

In some embodiments, if the circuit between the lamp panel and the control board is long, the lamp panel may be connected to the adapter board through the binding flexible circuit board f, and then the adapter board is connected to the control board through a flexible flat cable (Flexible Flat Cable, abbreviated as FFC).

In some embodiments, the large-size display device may include a plurality of light panels, where the light panels are spliced with each other, and then at least two adjacent light panels may be interconnected by binding the flexible circuit board, where one of the two light panels is connected to the control board. At this time, the lamp panel can still be connected with the control board by adopting the binding flexible circuit board, so that the lamp panel can be prevented from being perforated, and the circuit connected to the control board can be simplified.

In practical application, the circuit design can be performed according to practical specific situations.

Fig. 10 is a schematic cross-sectional view of a lamp panel according to an embodiment of the application.

As shown in fig. 10, the lamp panel includes: a light source 11 and a circuit board 13.

The circuit board 13 is located above the back plate 2, and the shape of the circuit board 13 is the same as the overall shape of the lamp panel 1. In general, the circuit board 13 has a plate shape, and is rectangular or square in its entirety. The length of the circuit board 13 is 200mm-1200mm and the width is 100mm-600mm.

The circuit board 13 may be a printed circuit board (Printed Circuit Board, abbreviated as PCB). The circuit board 13 may be a single-layer board, a double-layer board or a multi-layer board, and is selected according to practical needs.

In some embodiments, as shown in fig. 10, the circuit board is a single layer board, and a single layer circuit board is advantageous in cost control. The circuit board 13 includes: a substrate 131, a wiring layer 132, and a solder resist layer 133.

The substrate 131 has a load-bearing function, and its shape and size are the same as those of the circuit board, and may be generally rectangular or square. The substrate 131 may be BT, FR4, aluminum, glass, flexible material, or the like, and is selected according to the application scenario.

The circuit layer 132 is disposed on the substrate and is used for transmitting the driving signal. The circuit layer 132 may be formed by patterning after copper is coated on the substrate 131. The single-layer circuit board generally forms the wiring layer 132 on only one side of the substrate 131, which is less costly than the double-layer board and the multi-layer board.

The solder mask layer 133 is located on a side of the circuit layer 132 away from the substrate 131, and is used for insulating and protecting the circuit layer 132. The solder mask layer 133 is typically an insulating material and is coated on the surface of the circuit layer 132.

The wiring layer 132 may be fabricated by simultaneously forming pads for connecting electrical components in the lamp panel, etching the solder mask layer 133 to form a plurality of windows, which may expose the pads in the wiring layer, which may be used for soldering components such as light sources, driving chips, capacitors, resistors, etc.

The light source 11 is located on the circuit board 13, and the light source 11 may employ a Mini LED, which is different from a general LED, and specifically refers to a micro light emitting diode chip. Because the Mini LED has small size, the dynamic light emission of the backlight module is controlled to be smaller in area, and the dynamic contrast of pictures is improved. In the embodiment of the application, at least one side of the single Mini LED chip is smaller than 500 mu m.

In practical applications, the light panel 1 may include only Mini LEDs of one color, or may include Mini LEDs of multiple colors.

Fig. 11 is a schematic diagram of a cross-sectional structure of a lamp panel according to an embodiment of the application.

In some embodiments, as shown in fig. 11, the lamp panel may also employ at least a circuit board with double-layer wiring. The circuit board is provided with circuit layers at least on two sides of the substrate 131 respectively, the circuit layer on the light emitting side of the lamp panel is a first circuit layer 132x, and the circuit layer on the back light emitting side of the lamp panel is a second circuit layer 132y. The solder mask covering the first circuit layer 132x is a first solder mask 133x, and the solder mask covering the second circuit layer 132y is a second solder mask 133y. Wherein the light source 11 is located at a side of the first solder mask layer 133x facing away from the first circuit layer 132 x.

Because the back of the lamp panel is also provided with the circuit layer, if elements such as a driving chip and the like are arranged, the driving chip can be arranged on the back of the lamp panel, and the space of the light emitting side of the lamp panel is not required to be occupied.

As shown in fig. 10 and 11, pads for connecting the light source 11 and the flexible circuit board f are provided on the circuit board, and the pads include at least a first pad s1 and a second pad s2. Wherein the first bonding pad s1 is used for soldering the light source 11, and the second bonding pad s2 is used for binding the flexible circuit board f.

The light source 11 is located at a side of the solder mask layer 133 away from the circuit layer 132, and the light source 11 is electrically connected to the first pad s1 through the window of the solder mask layer 133.

As shown in fig. 10, for a single-layer circuit board, components such as a driving chip, a capacitor, and a resistor, and a light source 11 are all located on the light emitting side of the lamp panel. The flexible circuit board f is also arranged on the light emitting side of the lamp panel and is bound with the second bonding pad s2 on the lamp panel 1.

In specific implementation, the flexible circuit board f can be bound to the edge position of the lamp panel 1, and at this time, the second bonding pad s2 is arranged at the edge of the lamp panel 1, so that the problem of shielding the light source can be avoided.

With the increase of the number of the light sources, the space between the light sources is reduced, the width of the edge of the light board is only half of the space between the light sources, and at this time, the space at the edge of the light board may not be enough for arranging the second bonding pads s2, so that the second bonding pads s2 can be located at the interval between the light sources of the light board for maximally increasing the line routing range near the line outgoing position of the flexible circuit board, thereby binding the flexible circuit board f inside the light board 1.

As shown in fig. 11, since the circuit layer is also provided on the back surface of the lamp panel, if there are components such as a driving chip, the circuit layer can be provided on the back surface of the lamp panel, and the space on the light emitting side of the lamp panel is not required. At this time, the second bonding pad s2 may be disposed on the surface of the light board facing away from the light emitting side, so that the second bonding pad s2 is connected with the second circuit layer 132y, and accordingly, the flexible circuit board f may be bound to the back surface of the light board, so as to avoid the position interference between the flexible circuit board and the light source on the light emitting side of the light board.

Of course, the second bonding pads s2 may be disposed on the surface of the light emitting side of the lamp panel according to the structure shown in fig. 10, so that the flexible circuit board f is bonded on the light emitting side of the lamp panel. Likewise, when the flexible circuit board f is bound to the light emitting side of the lamp panel, the second pads s2 may be disposed at the edges of the lamp panel or at spaced positions between adjacent light sources. Meanwhile, if the element of the driving chip exists, the driving chip can be arranged on the back surface of the lamp panel and connected through the circuit layer on the back surface of the lamp panel, so that the space on the light emitting side is prevented from being occupied.

Fig. 12 is a second schematic plan view of a light panel according to an embodiment of the present application, and fig. 13 is a first schematic plan view of a flexible circuit board according to an embodiment of the present application.

In some embodiments, as shown in fig. 12, the second bonding pads s2 are disposed at spaced positions between the light sources 11 of the lamp panel, and the second bonding pads s2 may be made of conductive materials such as copper, tin, and the like. As shown in fig. 13, the flexible circuit board f is provided with the gold fingers x at both ends, and after the gold fingers x at one end of the flexible circuit board are bound with the second bonding pads s2, the electrical connection between the flexible circuit board f and the lamp panel 1 can be achieved. The binding connection between the golden finger x and the second bonding pad s2 of the flexible circuit board can be realized by adopting anisotropic conductive adhesive. In addition, other binding modes with the same functions can be adopted.

When the second bonding pad s2 is located at a spaced position between the adjacent light sources, after the flexible circuit board f is bonded, the area where the flexible circuit board f is located covers part of the light sources 11 in the orthographic projection of the lamp panel. In order to avoid the flexible circuit board from shielding the light source 11 from emitting light, as shown in fig. 13, an opening k1 is provided at a position of the flexible circuit board f corresponding to the light source, and the opening k1 can expose the light source to make the light source emit light smoothly.

At least a partial region between the flexible circuit board f and the lamp panel 1 is provided with an adhesive layer (not shown in the figure) for bonding the flexible circuit board and the lamp panel. In the specific implementation, except the binding position, partial or all back glue of the contact area of the FPC and the lamp panel is attached to the surface of the lamp panel, so that the phenomenon that the FPC is uneven or tilted to shield a light source is avoided.

In the embodiment of the present application, the opening k1 of the flexible circuit board f may be provided in various forms. In some embodiments, as shown in fig. 9, the openings k1 of the flexible circuit board f are in one-to-one correspondence with the light sources 11, and one light source 11 is disposed in one opening k 1. The openings k1 of the flexible circuit board f are in one-to-one correspondence with the light sources 11, and the flexible circuit board can be utilized for wiring to the maximum extent. Normally, the opening k1 of the flexible circuit board may be slightly larger than the size of the light source 11, and when the light source 11 is packaged and protected by adopting the Mini LED package structure, the size of the light source 11 needs to be slightly larger than the size of the Mini LED package, so that the flexible circuit board f is prevented from shielding the light source 11.

As shown in fig. 12, the light sources 11 on the lamp panel 1 may be generally arranged in an array along a first direction and a second direction, and the first direction and the second direction intersect. The first direction may be a row direction of the light source array, and the second direction may be a column direction of the light source array. In some embodiments, one opening k1 of the flexible circuit board f may also correspond to at least two light sources, and at least two light sources 11 are disposed in one opening k 1.

Fig. 14 is a second schematic plan view of a flexible circuit board according to an embodiment of the present application, and fig. 15 is a third schematic plan view of the flexible circuit board according to an embodiment of the present application.

As shown in fig. 14, the opening k1 of the flexible circuit board is a strip-shaped opening extending in the first direction (horizontal direction in fig. 14), and a plurality of light sources arranged in a row are provided in one strip-shaped opening; or as shown in fig. 15, the opening k1 of the flexible circuit board is a bar-shaped opening extending in the second direction (vertical direction in fig. 15), and a plurality of light sources arranged in a row are disposed in one bar-shaped opening. The strip-shaped openings are formed in the flexible circuit board f along the set direction, so that the light sources arranged along the set direction can be exposed, the flexible circuit board adopts the shape of the opening k1, the number of the openings can be reduced, and the manufacturing process is simplified.

Fig. 16 is a schematic plan view of a flexible circuit board according to an embodiment of the present application.

In some embodiments, as shown in fig. 16, the flexible circuit board f may include only one opening k1, where all the light sources corresponding to the area where the flexible circuit board is disposed are disposed in the opening k 1. The flexible circuit board is only provided with one opening, so that the manufacturing difficulty of the flexible circuit board can be furthest simplified, and meanwhile, shielding of the flexible circuit board to a light source can be furthest avoided.

In practical implementation, the shape of the opening k1 in the flexible circuit board f for exposing the light source may be designed according to practical situations, and the structures shown in fig. 9 to 12 proposed in the embodiments of the present application are only for illustration, and in practical application, the shape of the opening k1 may be designed according to the line design and the arrangement rule of the light source.

In the backlight module, a reflective layer or a reflective sheet is generally arranged on the surface of the circuit board, so that light emitted from the light source to one side of the lamp panel and light reflected by other elements can be reflected to one side of the light emitting source, and the utilization rate of the light source is improved.

Fig. 17 is a third schematic plan view of a lamp panel according to an embodiment of the application.

In some embodiments, as shown in fig. 17, the solder mask layer on the surface of the circuit board may be made of a reflective material, so that the light-emitting surface of the lamp panel has a reflective property, but the material on the surface of the flexible circuit board cannot reflect light, so that in the embodiment of the application, the surface of the flexible circuit board f on the side facing away from the lamp panel 1 is provided with a reflective material layer w1, and the reflective material layer may be a reflective layer or a reflective sheet. The reflective material on the surface of the circuit board is usually white ink, abbreviated as white oil, and then the surface of the flexible circuit board f can be coated with a layer of white oil with the same or similar reflectivity to form the reflective material layer w1, so that the reflective effect of each position of the lamp panel is consistent. Or a reflecting sheet with the same or similar reflectivity as the white oil can be arranged on the surface of the flexible circuit board f, and the reflecting sheet is perforated to expose the light source 11, so that the reflecting effect of each position of the lamp panel is consistent.

It should be noted that, if the size of the opening of the reflective sheet disposed on the surface of the flexible circuit board f is larger than the size of the opening k1 of the flexible circuit board f, the edge of the opening of the flexible circuit board may be exposed, and in order to make the reflection effect uniform, white oil may be coated on the surface of the flexible circuit board exposed by the opening of the reflective sheet, or white oil may be coated on the entire surface of the flexible circuit board, so as to make the reflection effect uniform at each position.

Fig. 18 is a schematic plan view of a lamp panel according to an embodiment of the application.

In some embodiments, as shown in fig. 18, the backlight module further includes: the reflecting sheet 5 is positioned on the light emergent surface of the lamp panel, and the reflecting sheet 5 is arranged to cover the lamp panel 1 and the flexible circuit board f on the lamp panel; the reflection sheet 5 includes a plurality of openings k2 for exposing the light source. Because the thickness of the flexible circuit board f is very small, the reflecting sheets can be arranged on the surfaces of the lamp panel 1 and the flexible circuit board f, and the reflecting sheets are perforated to expose the light source, so that the utilization rate of the light source is improved.

Similarly, if the size of the opening k2 of the reflective sheet is larger than the size of the opening k1 of the flexible circuit board f, the edge of the opening of the flexible circuit board may be exposed, and in order to make the reflective effect uniform, the surface of the flexible circuit board exposed by the opening k2 of the reflective sheet or the whole surface of the flexible circuit board may be coated with white oil having the same or similar reflectivity as that of the reflective sheet to form the reflective material layer w1, so that the reflective effect at each position is uniform.

In a specific implementation, the main component of the white oil is titanium dioxide, so that the reflectivity is improved, the reflectivity of the white oil coated on the surface of the flexible circuit board is as close as possible to that of the white oil coated on the surface of the lamp panel, and the reflectivity of the white oil is generally greater than or equal to 85%.

Embodiments of the bonded flexible circuit board f will be specifically described below with respect to the use of single-layer boards and double-layer boards for distinguishing circuit boards.

Fig. 19 is a schematic plan view of a spliced lamp panel according to an embodiment of the present application.

In some embodiments, as shown in fig. 19, the backlight module includes at least two light panels, and the adjacent light panels are spliced; at least two adjacent lamp panels are connected with each other through the binding flexible circuit board f.

In the embodiment of the present application, two interconnected light panels are taken as an example for illustration, as shown in fig. 19, two adjacent light panels are a first light panel 1a and a second light panel 1b, and the first light panel 1a and the second light panel 1b are connected with each other by binding a flexible circuit board f, so that circuit intercommunication can be implemented between the first light panel 1a and the second light panel 1b, one of the two light panels can be connected with a control board, for example, the second light panel 1b can be connected with the control board. Thus, the back plate does not need to be perforated at the position where the FFC is not needed, so that the number of the holes of the back plate is reduced, and the firmness of the back plate is improved. Meanwhile, the using quantity of FFC wires can be reduced, the cost is reduced, and the thin design of the backlight module is facilitated.

FIG. 20 is a schematic cross-sectional view taken along the direction I-I' in FIG. 19.

In some embodiments, as shown in fig. 20, the lamp panel specifically includes: a light source 11, a connection terminal 12, and a circuit board 13.

For a single-layer circuit board, the second bonding pad s2 and the light source 11 are located on the same side of the lamp panel, the second bonding pad s2 is exposed through windowing of the solder mask layer 133, and the second bonding pad s2 is part of the circuit layer 132, and is formed simultaneously when the circuit layer is patterned, and the second bonding pad s2 is arranged on the lamp panel 1 for binding the flexible circuit board f.

The flexible circuit board is generally provided with gold fingers at both ends, and after the gold fingers of the flexible circuit board are bound with the second bonding pads s2, the electrical connection between the flexible circuit board f and the lamp panel 1 can be realized.

In some embodiments, the second bonding pads s2 may be disposed on at least two adjacent light boards 1, so that the golden fingers at two ends of the flexible circuit board f may be respectively bound with the second bonding pads s2 on the two light boards, and the flexible circuit board f is bound between the two light boards for signal transmission between the two light boards, thereby implementing interconnection between the two light boards. The two lamp panels connected with each other only need to connect one of the lamp panels with the control panel, so that FFC of the control panel can be reduced at least. Meanwhile, the back plate can be provided with at least one opening, so that the firmness of the back plate is improved.

As shown in fig. 20, for a circuit board of a single-layer wiring, the FFC may be connected using the connection terminal 12. Specifically, the connection terminal 12 may employ a sinking terminal. At this time, it is necessary to open the lamp panel to form an opening penetrating the lamp panel. The connection terminals 12 include solder pins and sockets, and the circuit board 13 is typically provided with pads at the edges of the openings for connecting the solder pins, which pads are connected to the wiring layer. The bonding pins are bonded to the wiring layer 132 at the edges of the lamp panel openings by bonding with bonding pads. The socket is arranged in the opening of the lamp panel and sunk to the back surface of the lamp panel. The socket is internally provided with a circuit connection welding pin, and the socket is provided with a socket at one end of the lamp panel, which is away from the light emitting side, for connecting the FFC.

Because sinking terminal needs to punch the lamp plate, when adopting flexible circuit board to connect between two at least adjacent lamp plates, can reduce to punch at least one lamp plate, and at the same time the backplate can reduce at least one trompil, is favorable to saving FFC wire rod and reinforcing backplate's fastness.

Fig. 21 is a second schematic plan view of a spliced lamp panel according to an embodiment of the application.

As shown in fig. 21, each light panel in the backlight module is arranged in an array along a first direction x and a second direction y, wherein the first direction x and the second direction y intersect. In a specific implementation, the first direction x may be a row direction, the second direction y may be a column direction, or the first direction x may be a column direction, and the second direction y may be a row direction.

Adjacent lamp panels arranged along the first direction x or the second direction y are connected with each other through the binding flexible circuit board f. Only one of the lamp panels is required to be connected with the control panel. The lamp panel connecting control board which is positioned at the edge of one end of each lamp panel and is connected with each other through the binding flexible circuit board f can be used for connecting FFC (flexible printed circuit) by arranging an opening at the edge of one side of the backboard, so that other areas of the backboard are prevented from being opened, and the firmness of the backboard is enhanced. Meanwhile, FFC can be avoided being arranged in other areas of the backlight module, and the thin design of the backlight module is realized while the cost is reduced.

Taking the structure shown in fig. 21 as an example, adjacent lamp panels arranged along the second direction y are connected to each other by binding flexible circuit boards f. When the lamp panel adopts the lamp panel of the single-layer circuit, only the lamp panel positioned at the edge in the second direction y may be perforated to form an opening, and the connection terminal 12 is provided at the position of the opening to connect the FFC.

Fig. 22 is a schematic perspective view of a display device according to an embodiment of the application.

As shown in fig. 22, when the lamp panels 1 arranged in the backlight module are all connected to each other by binding the flexible circuit boards along the same direction, only the lamp panels 1 located at the edge of the backlight module can be perforated, so that the number of holes on the lamp panels is reduced. Correspondingly, only the edge of the backboard 2 is required to be perforated, so that the number of holes of the backboard is reduced, and the firmness of the backboard is enhanced. The edge of the backboard 2 is provided with holes, and the wires are only required to be led out from the edge of the backlight module, so that the thin design of the backlight module can be realized, and FFC wires are saved.

Fig. 23 is a schematic cross-sectional structure of a spliced lamp panel according to an embodiment of the present application.

In some embodiments, as shown in fig. 23, when the circuit board employs a double-layer board or a multi-layer board, the connection terminals 12 connected to the FFC may employ chip terminals, the connection terminals 12 may be located at a side of the lamp panel away from the light emitting side, the connection terminals 12 are used to connect the FFC, and the FFC is still routed at the back surface of the lamp panel.

When the sheet type terminal is adopted, the lamp panel is not required to be perforated, more partitions can be realized through reasonable circuit design, and the display device is driven to realize high dynamic range image display. When the lamp panels arranged along the set direction are connected with each other through the flexible circuit board, the connecting terminal 12 can be arranged on the back of the lamp panel positioned at one end edge of the lamp panels connected with each other through the binding flexible circuit board, so that the FFC is connected with the FFC only by arranging the opening at one side edge of the backboard, thereby avoiding opening other areas of the backboard and enhancing the firmness of the backboard. Meanwhile, FFC can be avoided being arranged in other areas of the backlight module, and the thin design of the backlight module is realized while the cost is reduced.

When the FFC is used to connect the lamp panel and the control board, the back plate needs to be provided with an opening, and the position of the opening corresponds to the position of the connection terminal 12 provided by the lamp panel. After the lamp panels arranged along the set direction are connected with each other by adopting the flexible circuit board, the connecting terminals 12 can be arranged on the lamp panels positioned on the same side of the backlight module, and the back plate can be provided with holes only at one side edge, so that the firmness of the back plate is improved, the quantity of FFC wires outside the back plate is reduced, and the backlight module is thin.

Fig. 24 is a third schematic plan view of a spliced lamp panel according to an embodiment of the application.

In some embodiments, as shown in fig. 24, the lamp panel is connected to the control board by binding a flexible circuit board (second flexible circuit board f 2). The difference from the embodiment shown in fig. 19 is that this embodiment does not require connection terminals on the lamp panel, but is directly connected to the control board using a flexible circuit board. This eliminates the need to provide openings in the back plate for FFC wires.

Fig. 25 is a schematic cross-sectional structure along the direction I-I' in fig. 24.

As shown in fig. 25, the second pads on the lamp panel for bonding the flexible circuit board may be divided into a first sub-pad s21 and a second sub-pad s22. The flexible circuit board may also be divided into a first flexible circuit board f1 and a second flexible circuit board f2. The first sub-bonding pad s21 is used for binding a first flexible circuit board f1, and the first flexible circuit board f1 is used for connecting adjacent lamp panels; the second sub-pad s22 is used to bind the second flexible circuit board f2, and the second flexible circuit board f2 is used to connect the lamp board and the control board (or the interposer).

Fig. 26 is a schematic plan view of a spliced lamp panel according to an embodiment of the application.

As shown in fig. 26, when the backlight module includes a plurality of light panels, the light panels are arranged in an array along a first direction x and a second direction y, and adjacent light panels arranged along the first direction x or the second direction y are all connected to each other by binding the first flexible circuit board f 1. Then only the lamp panel at the edge of one end of the lamp panels connected with each other by binding the first flexible circuit board f1 is required to be connected with the control board (or the adapter board) by binding the second flexible circuit board f 2.

Taking the structure shown in fig. 26 as an example, adjacent lamp panels arranged along the second direction y are connected to each other by binding the first flexible circuit board f 1. And the lamp panels at the edge of one end of the lamp panels which are connected with each other by binding the first flexible circuit board f1 are connected with the control board (or the adapter board) by binding the second flexible circuit board f 2.

Fig. 27 is a second perspective view of a display device according to an embodiment of the application.

As shown in fig. 27, since the adjacent lamp panels 1 and the lamp panels and the control board (or the adapter board) are connected by the flexible circuit board, it is no longer necessary to provide connection terminals on the lamp panels 1, and it is no longer necessary to use FFC wires. Accordingly, the back plate 2 does not need to be provided with holes, the firmness of the back plate 2 can be greatly enhanced, and the back surface of the back plate does not need to be provided with a travelling wire, so that the thinning of the backlight module can be realized.

It should be noted that, in the embodiment of the present application, only two adjacent lamp panels are connected by using a flexible circuit board for illustration, and in a specific implementation, more lamp panels may be connected by using flexible circuit boards according to the arrangement condition, the arrangement number and the circuit design condition of the lamp panels in the backlight module.

The light panel arrangement structure shown in fig. 7, 21 and 26 is specifically described with reference to a 65-inch display device, and the light panels arranged in the second direction y are connected to each other by a binding flexible circuit board. In practical applications, the light panels arranged along the first direction x or other directions may be connected to each other by binding the flexible circuit board as needed.

The number of flexible circuit boards bound between adjacent light panels shown in fig. 19 and 24 is one, and in practice, two or more flexible circuit boards may be bound between adjacent light panels according to the partition condition of the light panels. Similarly, when the flexible circuit board is used to connect the lamp panel and the control panel, the number of the flexible circuit boards can be one or more according to actual needs.

The circuit of each lamp panel in the backlight module can be the same or different. When the same circuit design is adopted, the lamp panel which is not connected with the FFC can be manufactured without welding the connecting terminal, so that the material cost is reduced. The FFCs to which the light panel is connected may be one or more, and when a plurality of FFCs need to be connected, a plurality of connection terminals need to be provided accordingly.

When the lamp panel and the control panel are connected in a mode of binding the flexible circuit board, no connecting terminal exists in the lamp panel, if the circuit between the lamp panel and the control panel is too long, an adapter plate can be arranged between the lamp panel and the control panel, the lamp panel is connected to the adapter plate through the flexible circuit board, and then the adapter plate is connected with the control panel through the FFC. In practical application, the connection of the lines can be set according to practical specific conditions.

For the lamp panel of lamp driver body, along with the increase of lamp panel subregion quantity, drive chip quantity increases, and the circuit on the lamp panel is walked the line very complicated. At present, a PCB is generally adopted as a circuit board in a lamp panel, and two conditions of a single-layer circuit board and a double-layer circuit board are adopted in the lamp panel applied to multiple partitions.

FIG. 28 is a schematic cross-sectional view of a single-layer circuit lamp panel; fig. 29 is a schematic cross-sectional structure of a lamp panel of a double-layer circuit.

As shown in fig. 28 and 29, the lamp panel includes: a light source 11, a connection terminal 12, a circuit board 13, and a driving chip C.

When a circuit board with a single-layer circuit is used, as shown in fig. 28, a circuit layer 132 is disposed on only one side of a substrate 131 of the lamp panel, and in this embodiment, all electrical components such as a driving chip C, a light source 11, a capacitor, and a resistor (not shown in the figure) need to be disposed on the side of the lamp panel with the circuit layer 132, and are electrically connected to the circuit layer 132 through windowing of a solder mask 133 on the surface of the circuit layer 132.

The lamp panel adopting the single-layer circuit needs to be perforated on the lamp panel for arranging the connecting terminal 12, and the connecting terminal 12 can adopt a sinking terminal. When the partition of the lamp panel increases, the circuit board 13 of the single-layer circuit cannot realize complex circuit design, so that cascading between a plurality of driving chips C cannot be realized, corresponding connecting terminals 12 are required to be arranged for each driving chip C and connected with the control board, so that a large number of holes are required to be formed in the lamp panel 1 and the back panel 2, and a large number of FFC wires are required to be arranged, so that the difficulty of design and manufacture is increased, and the thinning of the backlight module is not facilitated.

When a circuit board with double-layer circuit is used, as shown in fig. 29, the substrate 131 of the lamp panel is provided with circuit layers (a first circuit layer 132x and a second circuit layer 132y respectively) on opposite sides, and the surfaces of the circuit layers on the two sides are covered with solder resists (a first solder resist layer 133x covering the first circuit layer 132x and a second solder resist layer 132y covering the second circuit layer 133y respectively).

The light source 11 is disposed on one side of the circuit board 13, and components such as a driving chip C, a capacitor, and a resistor (not shown in the figure) are disposed on the opposite side of the circuit board 13, and the two circuit layers are connected through the through holes of the substrate 131. The circuit board is provided with double-layer circuits, cascading between the driving chips C is easy to achieve, sinking type connecting terminals are not needed, and sheet type terminals can be adopted, so that the number of holes in the lamp panel can be reduced, but the cost of the circuit board with the double-layer circuits is high.

Therefore, the embodiment of the application provides a display device and a manufacturing method of the display device, which can remarkably reduce the difficulty of designing and manufacturing a lamp panel and reduce the manufacturing cost.

Fig. 30 is a third schematic cross-sectional view of a lamp panel according to an embodiment of the application.

As shown in fig. 30, the lamp panel includes: a plurality of light sources 11, a substrate 131, a first wiring layer 132x, a second wiring layer 132y, and a driving chip C.

The substrate 131 is located between the first circuit layer 132x and the second circuit layer 132y, and is used for supporting and carrying the first circuit layer 132x and the second circuit layer 132y. The shape and size of the substrate 131 are adapted to those of the backlight module.

The first circuit layer 132x is located on a side of the substrate 131 facing the display panel, and is mainly used for connecting the light source 11, the driving chip C and the auxiliary device.

The light source 11 is located on a side of the first circuit layer 132x facing the display panel, and is electrically connected to the first circuit layer 132 x.

In some embodiments, the light source 11 may use an LED, and in particular, a white LED, a blue LED, or an ultraviolet LED may be used. When the blue light LED or the ultraviolet light LED is adopted, the quantum dot film is required to be matched, red light and green light are emitted by the quantum dot film under the excitation of the blue light LED, or red light, green light and blue light are emitted by the quantum dot film under the excitation of the ultraviolet light LED, so that a wider color gamut can be obtained. The light source 11 may also use three-color LEDs of red, green and blue, and the three-color LEDs of red, green and blue are arranged on the lamp panel in an array according to the requirement, and the light of the three colors is mixed to obtain white light.

In some embodiments, the light source 11 may use Mini LEDs, which have smaller size than common LEDs, meaning that more light sources may be disposed on the same area of the light panel, providing higher backlight brightness, and providing finer zone control effects.

The driving chip C is located at a side of the first circuit layer 132x facing the display panel, and is electrically connected to the light source 11 through a circuit of the first circuit layer 132 x. In the embodiment of the application, the lamp panel is provided with a plurality of driving chips C, so that the partition control of the light source 11 can be realized.

The second circuit layer 132y is located on a side of the substrate 131 facing away from the display panel. The first circuit layer 132x and the second circuit layer 132y are electrically connected through a via hole on the substrate 131.

Be provided with a plurality of driver chip C on the multi-partition lamp plate, adopt the circuit board of individual layer circuit, be difficult to realize cascading between a plurality of driver chip C, consequently need carry out extensive trompil on circuit board and backplate to every driver chip C for set up connecting terminal and control panel and be connected, the design and the manufacturing degree of difficulty of lamp plate are great. In the embodiment of the application, the plurality of driving chips C may be all disposed on one side of the first circuit layer 132x, the first circuit layer 132x is connected with the second circuit layer 132y through the through hole on the substrate 131, the cascade connection between the plurality of driving chips C is realized through the circuit routing of the second circuit layer 132y, the plurality of driving chips C that are mutually cascade connected may only be provided with one connection terminal and connected with the control board, the number of connection terminals is reduced, the holes for the lamp panel and the back panel are reduced, the difficulty in designing and manufacturing the lamp panel is reduced, and the cost is reduced.

In some embodiments, the substrate 131 may be made of a flexible insulating material, specifically, a polymer material such as polyimide or mylar, or a flexible glass material, and the circuit patterns of the first circuit layer 132x and the second circuit layer 132y are printed on both sides of the substrate 131 in combination with a Roll-to-Roll (Roll) process. In specific implementation, circuit design can be performed in a targeted manner, and for the first circuit layer 132x and the second circuit layer 132y, the circuit layer can be manufactured only by filling conductive materials in grooves of the stamped circuit patterns, the whole process has no etching process, the circuit patterns are needed to be etched on the copper-clad layer of the substrate by the traditional circuit board, the etched copper-clad layer causes great waste, the cost is high, and industrial waste liquid such as developing solution, etching solution and the like in the circuit board manufacturing process is difficult to treat, so that the circuit board has great environmental protection problem. This problem is particularly pronounced for circuit boards with double-layer wiring.

In addition, the processing technology of the flexible substrate by adopting the Roll-to-Roll coordination is simple, the processing speed can exceed 5m/min, and the manufacturing efficiency is greatly improved. Meanwhile, the Roll-to-Roll process can realize large-size circuit manufacture, and no splicing is needed for small-size backlight modules (for example, 32 inches).

Of course, when applied to a rigid screen, the substrate 131 may be made of a rigid material or other suitable materials.

As shown in fig. 30, the first wiring layer 132x includes: a first imprint layer 151, and a first conductive portion 152.

The first imprinting layer 151 is positioned at a side of the substrate 131 facing the display panel; the first imprint layer 151 includes a first recess 153 recessed toward the substrate 131, and the first recess 153 forms a circuit pattern of the first circuit layer 132 x.

The material of the first imprint layer 151 may be selected from photo-curable resins, and after the first imprint layer 151 is imprinted, the first imprint layer is cured under irradiation of ultraviolet light to form a pattern of the first circuit layer 132 x. The material of the first imprint layer 151 may also be selected to be a thermally curable material or other curable material.

The first conductive portion 152 is located in the first recess 153 and serves as a line of the first line layer 132 x. As a material of the first conductive portion 152, a material having excellent conductivity such as metallic copper can be used.

Similarly, the second wiring layer 132y includes: a first imprint layer 161, and a first conductive portion 162.

The second imprinting layer 161 is positioned on one side of the substrate 131 away from the display panel; the second imprinting layer 161 includes a second recess 163 recessed toward the substrate 131 side, and the second recess 163 forms a wiring pattern of the second wiring layer 132 y.

The material of the second imprint layer 161 may be selected from photo-curable resins, and after the second imprint layer 161 is imprinted, the second imprint layer is cured under the irradiation of ultraviolet light to form a pattern of the second circuit layer 132 y. The material of the second imprint layer 161 may also be selected to be a thermally curable material or other curable material.

The second conductive portion 162 is located in the second recess 163 and serves as a line of the second line layer 132 y. As a material of the second conductive portion 162, a material having excellent conductivity such as metallic copper can be used.

In the embodiment of the present application, the first circuit layer 132x is mainly used for connecting the light source 11, the driving chip C and the auxiliary element, and the second circuit layer 132y is mainly used for cascading a plurality of driving chips C. The region of the first wiring layer 132x where the wiring is located includes substantially the entire surface of the side of the substrate 131 facing the display panel; the lines of the second line layer 132y only need to be disposed in the areas corresponding to the plurality of driving chips C that are cascaded with each other.

In the implementation, the circuit of the first circuit layer 132x and the circuit of the second circuit layer 132y can be formed only by filling the conductive material in the circuit pattern formed by the first concave portion 153 and the second concave portion 163, and etching of the whole metal is not required, so that the consumption of the conductive material can be effectively reduced, and the manufacturing cost is greatly reduced.

Since the wires of the second circuit layer 132y are only used for cascading driving chips, the orthographic projection range of the area of the wires of the first circuit layer 132x on the substrate 131 is larger than the orthographic projection range of the area of the wires of the second circuit layer 132y on the substrate 131, and the orthographic projection of the area of the wires of the first circuit layer 132x on the substrate 131 completely covers the orthographic projection of the area of the wires of the second circuit layer 132y on the substrate 131.

At the position where the connection between the first circuit layer 132x and the second circuit layer 132y is required, a plurality of hole sites may be designed at the position where the punching of the substrate 131 is required in advance during circuit design, and the first circuit layer 132x and the second circuit layer 132y may be connected through the through holes of the region, thereby reducing the requirement on the embossing precision of the first circuit layer 132x and the second circuit layer 132y during the embossing process.

In some embodiments, the lamp panel may be provided with a connection terminal, and the connection between the lamp panel and the control board is achieved by connecting the FFC through the connection terminal and then connecting the control board through the FFC.

In some embodiments, the flexible circuit board is bonded to the lamp panel and connected to the control board via the flexible circuit board.

FIG. 31 is a schematic diagram of a cross-sectional structure of a lamp panel according to an embodiment of the present application; fig. 32 is a schematic cross-sectional view of a lamp panel according to an embodiment of the application.

In some embodiments, as shown in fig. 31, one end of the flexible circuit board f is bound to the first circuit layer 132 x. Bind flexible circuit board f on first circuit layer 132x, second circuit layer 132y is used for forming the wiring of connecting wire between a plurality of driver chip C, guarantees the planarization of second circuit layer 132y deviating from base plate 131 one side surface, when carrying out the installation of lamp plate and backplate, can make lamp plate and backplate laminating more inseparable.

In some embodiments, as shown in fig. 32, one end of the flexible circuit board f is bound to the second wiring layer 132 y. Binding the flexible circuit board f on the second circuit layer 132y can save more wiring space for the first circuit layer 132x and reduce the difficulty of binding.

Fig. 33 is a schematic connection diagram of a lamp panel and a control board according to an embodiment of the present application.

As shown in fig. 33, the display device further includes: and the adapter plate T. The lamp panel 1 is connected with the adapter plate T through the binding flexible circuit board f, and is further connected with the control board through the adapter plate T. The adapter plate T and the control board can be connected through a flexible flat cable. The flexible circuit board f has higher cost, and when the circuit between the lamp panel and the control panel is shorter, the circuit can be directly connected through the flexible circuit board f; when the circuit between the lamp panel and the control panel is longer, the adapter plate T can be connected with the control panel by arranging the adapter plate T and adopting the FFC, so that the cost is reduced.

As shown in fig. 33, the connection terminal 12 is disposed on the adapter board T, and one end of the flexible circuit board f is tied to the lamp panel 1, and the other end is connected with the connection terminal 12 of the adapter board T, thereby reducing the difficulty of connection and detachment. A chip terminal may be provided on the conversion board T for connection with the flexible circuit board f.

Fig. 34 is a third perspective view of a display device according to an embodiment of the application.

As shown in fig. 34, the back plate 2 is used for supporting the edges of the lamp panel 1, the diffusion plate 3, and the like. The connecting wire of the lamp panel 1 needs to pass through the back plate to be connected with a control board outside the backlight module, and the flexible circuit board f is usually bound at the edge position of the lamp panel 1, so that the flexible circuit board f can be used as an outlet of the flexible circuit board f only by punching at the position corresponding to the flexible circuit board f at the edge of the back plate 2. The middle area of the lamp panel 1 does not need to be provided with a terminal or bind the flexible circuit board f, so that the middle area of the backboard 2 does not need to be perforated, the lamp panel can be suitable for the design of a small rear shell, and the appearance of the whole lamp panel is optimized.

Fig. 35 is a second schematic diagram of connection between a lamp panel and an adapter board according to an embodiment of the present application.

In some embodiments, as shown in fig. 35, the backlight module further includes: auxiliary element a.

The auxiliary element a may include an electrical element such as a resistor, a capacitor, etc. provided to satisfy a specific function, and in a specific implementation, the auxiliary element a may be directly provided on a side of the first wiring layer 132x facing the display panel to be connected to the wiring of the first wiring layer 132 x.

Or as shown in fig. 35, at least part of the auxiliary components a may be disposed on the adapter board T, and connected with the lamp panel 1 through the lines of the adapter board T and the flexible circuit board f, so as to reduce the number of electrical components on the first circuit layer 132x and reduce the design difficulty.

Fig. 36 is a schematic plan view of a lamp panel according to an embodiment of the application.

In some implementations, as shown in fig. 36, the lamp panel 1 is provided with a routing area of the second circuit layer 132y, where only one flexible circuit board f and one interposer T may be provided for connection with the lamp panel 1. This situation can be used in situations where the backlight module has fewer zones and the lines are relatively simple.

FIG. 37 is a schematic view of a planar structure of a lamp panel according to an embodiment of the present application; fig. 38 is a schematic plan view of a lamp panel according to an embodiment of the application.

As shown in fig. 37 and 38, the lamp panel 1 is provided with a plurality of wiring areas of the second circuit layer 132y separated from each other, and a plurality of flexible circuit boards f may be provided in one-to-one correspondence with the plurality of areas separated from each other.

In some embodiments, as shown in fig. 37, the display device includes an interposer T, where the interposer T includes a plurality of connection terminals 12, and the number of connection terminals 12 is adapted to the number of flexible circuit boards f, and one connection terminal 12 is correspondingly connected to one flexible circuit board f.

In some embodiments, as shown in fig. 38, the display device includes a plurality of patch panels T, the number of which is the same as the number of flexible circuit boards f, and one flexible circuit board f is correspondingly connected to the connection terminals 12 on one patch panel T.

In the implementation, the number and the arrangement mode of the adapter plates T can be adaptively designed according to the partition requirement of the backlight module.

In another aspect of the embodiments of the present application, a method for manufacturing a display device is provided. FIG. 39 is a flowchart of a method for fabricating a display device according to an embodiment of the present application; fig. 40 is a schematic structural diagram of a manufacturing process of a display device according to an embodiment of the application.

As shown in fig. 39, the manufacturing method of the display device provided by the embodiment of the application includes the following steps:

s11: coating imprinting glue on the surfaces of two sides of the substrate to form a first imprinting layer and a second imprinting layer;

S12: embossing the first embossing layer to form a first concave part, and embossing the second embossing layer to form a second concave part;

s13: filling a conductive material in the first concave part to form a first circuit layer, and filling a conductive material in the second concave part to form a second circuit layer;

S14: and welding a light source on the first circuit layer to form the lamp panel.

As shown in fig. 39 and 40, an imprint paste may be coated on both side surfaces of the substrate 131 to form a first imprint layer 151 and a second imprint layer 161, respectively; then, the first concave portion 153 is printed on the first printed layer 151 through a printing process to form a circuit pattern of a first circuit layer, and the second concave portion 163 is printed on the second printed layer 161 to form a circuit pattern of a second circuit layer; forming a plurality of through holes H for connecting the first circuit layer and the second circuit layer at corresponding positions of the first imprinting layer 151 and the second imprinting layer 161 by means of laser drilling, mechanical drilling and the like; next, the first and second recesses 153 and 163 and the through holes are filled with a conductive material to form the first and second circuit layers 132x and 132y, and the conductive material may be a material having excellent conductivity such as metallic copper; finally, the light source 11 is mounted at a corresponding position on the first circuit layer 132x through a welding process and the like to form a lamp panel. After the lamp panel is manufactured, components such as a driving chip, a capacitor, a resistor and the like can be welded on the lamp panel continuously.

Wherein, the through hole H between the first circuit layer 132x and the second circuit layer 132y may be perforated and filled with a conductive material after the first circuit layer 132x and the second circuit layer 132y are formed; corresponding holes can be formed in the corresponding positions of the substrate, and through holes of the imprinting layer can be directly imprinted in the corresponding positions of the imprinting layer in the imprinting process, so that re-punching is avoided.

The foregoing description, for purposes of explanation, has been presented in conjunction with specific embodiments. The illustrative discussions above are not intended to be exhaustive or to limit the embodiments to the precise forms disclosed above. Many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles and the practical application, to thereby enable others skilled in the art to best utilize the embodiments and various embodiments with various modifications as are suited to the particular use contemplated.

Claims

A display device, comprising:

A display panel for displaying an image; and

The backlight module is positioned on the light incident side of the display panel and is used for providing backlight;

The backlight module comprises a lamp panel, wherein a flexible circuit board is bound on the lamp panel and used for connecting adjacent lamp panels, control panels of display devices or adapter plates of the display devices.
The display device of claim 1, the light panel comprising:

A substrate;

The circuit layer is positioned on at least one side of the substrate;

the solder mask layer is positioned on one side of the circuit layer, which is away from the substrate; and

The light source is positioned at one side of the solder mask layer, which is away from the circuit layer; the light source is a Mini LED;

The circuit layer comprises a first bonding pad and a second bonding pad, wherein the first bonding pad is used for welding the light source, and the second bonding pad is used for binding the flexible circuit board; the solder mask layer includes a plurality of windows for exposing the first pads and the second pads.
The display device of claim 2, wherein the side of the light source is a light emitting side of the light panel; the circuit layer is arranged on the substrate at the light emergent side of the lamp panel;

The first bonding pad and the second bonding pad are positioned on the surface of the light emitting side of the lamp panel; the second bonding pads are positioned at the edges of the lamp panel or at intervals between the light sources.
The display device of claim 3, wherein the backlight module comprises at least two lamp panels, and adjacent lamp panels are spliced; at least two adjacent lamp panels are connected with each other by binding the flexible circuit board.
The display device of claim 4, wherein each of the light panels is arranged in an array along a first direction and a second direction, the first direction and the second direction intersecting;

Adjacent lamp panels arranged along the first direction or the second direction are connected with each other by binding the flexible circuit board;

the lamp panels at one end of the lamp panels connected with each other by binding the flexible circuit board also comprise an opening penetrating through the lamp panels, and a connecting terminal is arranged at the opening;

The connecting terminal comprises a welding pin and a socket; the welding pins are connected with the circuit layer on the light emitting side of the lamp panel at the edge of the opening; the socket is located in the opening, one side of the socket, which deviates from the light emitting side, protrudes out of the surface of the lamp panel, a circuit is arranged inside the socket to connect the welding pins, and a socket is arranged on one side of the lamp panel, which deviates from the light emitting side, for connecting the flexible flat cable.
The display device of claim 2, wherein the side of the light source is a light emitting side of the light panel; the circuit layers are arranged on the substrate of the light-emitting side and the substrate deviating from the light-emitting side of the lamp panel;

The first bonding pad is positioned on the surface of the light emitting side of the lamp panel;

The second bonding pad is positioned at the edge on the surface of the light emitting side of the lamp panel or at the interval position between the light sources; or the second bonding pad is positioned on the surface of the lamp panel facing away from the light emitting side.
The display device of claim 6, wherein the backlight module comprises at least two lamp panels, and adjacent lamp panels are spliced; at least two adjacent lamp panels are connected with each other by binding the flexible circuit board.
The display device of claim 7, wherein each of the light panels is arranged in an array along a first direction and a second direction, the first direction and the second direction intersecting;

Adjacent lamp panels arranged along the first direction or the second direction are connected with each other by binding the flexible circuit board;

The lamp panels which are mutually connected through binding the flexible circuit boards are located at the edge of one end of the lamp panels, the lamp panels further comprise connecting terminals located at the side, away from the light emergent side, of the lamp panels, the connecting terminals are connected with the circuit layer, away from the light emergent side, and the connecting terminals are used for connecting flexible flat cables.
The display device of claim 5 or 8, the backlight module further comprising a back plate, each of the light panels being located on the back plate; each lamp panel provided with the connecting terminal is arranged close to the same side of the backlight module;

The backboard comprises a plurality of openings, and the openings are arranged at positions corresponding to the connecting terminals of the lamp panel;

the display device further comprises a control board, and the flexible flat cable is connected with the lamp panel and the control board through the opening of the backboard;

Or the display device further comprises an adapter plate, and the flexible flat cable is connected with the lamp panel and the adapter plate through the opening of the back plate.
The display device according to claim 3 or 6, further comprising a control board, the light panel being connected to the control board by binding the flexible circuit board;

or the display device further comprises an adapter plate, and the lamp panel is connected with the adapter plate by binding the flexible circuit board.
The display device of claim 3 or 6, the second pads being located at spaced apart positions between the light sources of the light panel;

the area where the flexible circuit board is located covers part of the light source in the orthographic projection of the lamp panel; the flexible circuit board is provided with an opening corresponding to the light source, and the opening is used for exposing the light source; and an adhesive layer is arranged in at least part of the area between the flexible circuit board and the lamp panel and used for adhering the flexible circuit board and the lamp panel.
The display device of claim 11, wherein the openings of the flexible circuit board are in one-to-one correspondence with the light sources, and one of the light sources is disposed in one of the openings.
The display device of claim 11, at least two of said light sources being disposed within one of said openings of said flexible circuit board.
The display device of claim 13, the light sources being arranged in an array along a first direction and a second direction, the first direction and the second direction intersecting;

The openings of the flexible circuit board are strip-shaped openings extending along the first direction, and a plurality of light sources arranged in a row are arranged in one strip-shaped opening;

Or the opening of the flexible circuit board is a strip-shaped opening extending along the second direction, and a plurality of light sources arranged in a row are arranged in one strip-shaped opening.
The display device of claim 13, wherein the flexible circuit board comprises only one opening, and all the light sources corresponding to the area of the flexible circuit board are disposed in the opening.
The display device of any one of claims 11 to 15, the backlight module further comprising:

the reflecting sheet is positioned on the light emitting surface of the lamp panel and is arranged to cover the flexible circuit board; the reflector sheet includes a plurality of openings for exposing the light source;

Wherein, the surface of the flexible circuit board exposed by the opening is provided with a reflecting layer; or the whole surface of the side of the flexible circuit board facing the reflecting sheet is provided with a reflecting layer.
The display device according to any one of claims 11 to 15, wherein the solder resist layer is made of a light reflecting material;

And a reflecting layer or a reflecting sheet is arranged on the surface of one side of the flexible circuit board, which is away from the solder mask layer.