CN118175877A

CN118175877A - Display substrate, preparation method thereof and display device

Info

Publication number: CN118175877A
Application number: CN202410295485.5A
Authority: CN
Inventors: 屈财玉; 郝艳军; 陈登云; 张慧娟; 刘利宾; 刘政
Original assignee: BOE Technology Group Co Ltd
Current assignee: BOE Technology Group Co Ltd
Priority date: 2024-03-14
Filing date: 2024-03-14
Publication date: 2024-06-11

Abstract

The disclosure relates to the technical field of display, in particular to a display substrate, a preparation method thereof and a display device, and is used for improving the packaging effect of the display substrate. In the display substrate, the orthographic projection of a first opening of the pixel defining layer is located within the orthographic projection range of a second opening of the isolation structure. The light-emitting layer comprises a first light-emitting part and a second light-emitting part which are disconnected from each other; the cathode layer comprises a first cathode part and a second cathode part which are disconnected with each other; the first light-emitting part and the first cathode part are at least positioned in each first opening; the first cathode part is contacted with the isolation structure; the second light-emitting part and the second cathode part are positioned on the isolation structure; the packaging layer comprises a first packaging part, a second packaging part and a third packaging part which are connected with each other; the first packaging part is positioned on the first cathode part; the second packaging part is positioned on the second cathode part and the side surface of the second cathode part and the second light-emitting part. The third packaging part is contacted with the side wall of the second opening. Display substrate, preparation method thereof and display device are used for image display.

Description

Display substrate, preparation method thereof and display device

Technical Field

The disclosure relates to the technical field of display, in particular to a display substrate, a preparation method thereof and a display device.

Background

An OLED (Organic LIGHT EMITTING Diode) display device is a display device made using an Organic white light emitting Diode. The OLED display device has excellent characteristics of no backlight source, high contrast ratio, thin thickness, wide viewing angle, fast reaction speed, being applicable to flexible panels, wide use temperature range, simple structure and manufacturing process, and the like, and is currently widely used.

Disclosure of Invention

An embodiment of the disclosure provides a display substrate, a manufacturing method thereof and a display device, which are used for improving packaging effects of the display substrate and the display device.

In order to achieve the above object, the embodiments of the present disclosure provide the following technical solutions:

Some embodiments of the present disclosure provide a display substrate including: the pixel comprises a back plate, a plurality of anodes, a pixel defining layer, an isolation structure, a light emitting layer, a cathode layer and an encapsulation layer. A plurality of anode, pixel defining layers are disposed on one side of the back plate. The pixel defining layer defines a plurality of first openings. One of the first openings exposes at least a portion of one of the anodes. Isolation structures are disposed on a side of the pixel defining layer remote from the backplate. The isolation structure defines a plurality of second openings. An orthographic projection of one of the first openings on the back plate is located within an orthographic projection of one of the second openings on the back plate. The light emitting layer includes a first light emitting portion and a second light emitting portion that are disconnected from each other. The first light-emitting parts are at least positioned in the first openings, and the second light-emitting parts are positioned on one side of the isolation structure away from the backboard. The cathode layer includes a first cathode portion and a second cathode portion that are disconnected from each other. A portion of the first cathode portion is located in a region corresponding to the second opening, and another portion of the first cathode portion is in contact with the isolation structure. The second cathode part is positioned at one side of the second light-emitting part far away from the isolation structure. The encapsulation layer includes a first encapsulation portion, a second encapsulation portion, and a third encapsulation portion. The first packaging part is positioned at one side of the first cathode part away from the first light-emitting part. The second packaging part is positioned on one side of the second cathode part away from the second light-emitting part, the side surface of the second cathode part and the side surface of the second light-emitting part. The third packaging part is contacted with the side wall of the second opening. The third packaging part is connected with the first packaging part and the second packaging part.

Some embodiments of the present disclosure provide a display substrate, where the display substrate includes a back plate, a plurality of anodes, a pixel defining layer, an isolation structure, a light emitting layer, a cathode layer, and an encapsulation layer, where one of a plurality of first openings defined by the pixel defining layer exposes at least a portion of one anode, the isolation structure defines a plurality of second openings, an orthographic projection of one first opening on the back plate is located within an orthographic projection range of one second opening on the back plate, the isolation structure separates the light emitting layer into a first light emitting portion and a second light emitting portion that are disconnected, the first light emitting portion is located at least in each first opening, and the second light emitting portion is located on a side of the isolation structure away from the back plate; the separator structure separates the cathode layer into a first cathode portion and a second cathode portion that are disconnected. A part of the first cathode part is positioned in a region corresponding to the second opening, and the other part of the first cathode part is in contact with the isolation structure, so that interconnection between different parts of the first cathode part is realized. The second cathode part is positioned at one side of the second light-emitting part far away from the isolation structure; the encapsulation layer comprises a first encapsulation part, a second encapsulation part and a third encapsulation part. The first encapsulation part is positioned at one side of the first cathode part far away from the first light-emitting part. The second packaging part is positioned on one side of the second cathode part away from the second light-emitting part, the side surface of the second cathode part and the side surface of the second light-emitting part. The third packaging part is contacted with the side wall of the second opening. The third packaging part is connected with the first packaging part and the second packaging part. Therefore, the first packaging part, the second packaging part and the third packaging part form a continuous and uninterrupted packaging layer, the packaging layer is used for packaging the light-emitting layer and the cathode layer, so that the packaging effect of the packaging layer is good, the light-emitting effect and the service life of the light-emitting device are improved, and the discontinuous part of the packaging layer is avoided, so that water vapor and the like easily invade into the light-emitting device from the discontinuous part to influence the light-emitting performance of the light-emitting device.

In some embodiments, a connection between a surface of the second encapsulation portion on a side of the second cathode portion remote from the second light emitting portion and a surface of the second encapsulation portion on a side remote from the second cathode portion is curved.

In some embodiments, the first encapsulation portion is connected with the second encapsulation portion.

In some embodiments, the isolation structure comprises: a plurality of sub-isolation structures, one of said sub-isolation structures defining one of said second openings; the sub isolation structures are arranged at intervals, or the adjacent sub isolation structures are connected, and partial side walls of two second openings defined by the adjacent two sub isolation structures are shared.

In some embodiments, the isolation structure comprises: and the first sub-layer, the second sub-layer and the third sub-layer are sequentially laminated along the direction vertical to and far away from the back plate. The first cathode portion is in contact with the first sub-layer, or the first cathode portion is in contact with the first sub-layer and the second sub-layer. The first sub-layer defines a plurality of third openings. The second sub-layer defines a plurality of fourth openings. The third sub-layer defines a plurality of fifth openings. The front projection of the third opening on the backboard and the front projection of the fifth opening on the backboard are both positioned in the front projection range of the fourth opening on the backboard. The corresponding third opening, fourth opening and fifth opening form a second opening.

In some embodiments, a first gap is provided between a sidewall of the second opening and the first cathode portion. The third packaging part is filled in the first gap, and the thickness H ₁ of the first packaging part and the thickness H ₂ of the second sub-layer meet the following conditions: h ₁≥0.5H₂.

In some embodiments, a first gap is provided between a sidewall of the second opening and the first cathode portion. The third encapsulation fills a portion of the first gap, and the thickness H ₁ of the first encapsulation and the thickness H ₂ of the second sub-layer satisfy: h ₁＜0.5H₂.

In some embodiments, the included angle α between the side surface of the second light emitting portion and the plane where the back plate is located satisfies: alpha is more than or equal to 45 degrees and less than or equal to 60 degrees.

In some embodiments, a second gap is provided between the first light emitting portion and the isolation structure.

In some embodiments, a portion of the first light emitting portion adjacent to the second gap is a stepped structure; the height of the step-like structure gradually decreases along the direction in which the first light emitting portion is directed toward the second gap.

In some embodiments, the thickness H ₃ of the isolation structure and the thickness H ₄ of the light emitting layer satisfy: h ₃＞H₄.

In some embodiments, a dimension L of a contact portion of the first cathode portion with the separator structure in a first direction satisfies: l is more than or equal to 200nm. The first direction is a direction pointing from a center of the first opening toward a side wall of the first opening.

In some embodiments, the thickness H ₅ of the cathode layer satisfies: h ₅ nm to 20nm.

In some embodiments, the display substrate further comprises: and a dimming layer positioned between the cathode layer and the encapsulation layer. The dimming layer comprises a first sub-part and a second sub-part which are sequentially stacked. The refractive index of the second sub-portion is smaller than the refractive index of the first sub-portion. And/or, the refractive index of the second sub-part is smaller than that of the packaging layer.

In some embodiments, the thickness H ₆ of the dimming layer is less than or equal to the thickness H ₁ of the first encapsulation portion.

In some embodiments, the sum of the thickness H ₁ of the first encapsulation, the thickness H ₆ of the dimming layer, the thickness H ₅ of the cathode layer, and the thickness H ₄ of the light emitting layer is greater than or equal to the thickness H ₃ of the isolation structure.

Some embodiments of the present disclosure further provide a method for manufacturing a display substrate, including: a back plate is provided. A plurality of anodes, a pixel defining layer, and an isolation structure are sequentially formed on the back plate. The pixel defining layer defines a plurality of first openings. One of the first openings exposes at least a portion of one of the anodes. The isolation structure defines a plurality of second openings. An orthographic projection of one of the first openings on the back plate is located within an orthographic projection of one of the second openings on the back plate. And forming a light-emitting layer, a cathode layer and an encapsulation layer on the isolation structure and the pixel defining layer in sequence. The light emitting layer includes a first light emitting portion and a second light emitting portion that are disconnected from each other. The first light-emitting parts are at least positioned in the first openings, and the second light-emitting parts are positioned on one side of the isolation structure away from the backboard. The cathode layer includes a first cathode portion and a second cathode portion that are disconnected from each other. The first cathode part is at least positioned in a region corresponding to the second opening, and the first cathode part is in contact with the isolation structure. The second cathode part is positioned at one side of the second light-emitting part far away from the isolation structure. The encapsulation layer includes a first encapsulation portion, a second encapsulation portion, and a third encapsulation portion. The first packaging part is positioned at one side of the first cathode part away from the first light-emitting part. The second packaging part is positioned on one side of the second cathode part away from the second light-emitting part, the side surface of the second cathode part and the side surface of the second light-emitting part. The third packaging part is contacted with the side wall of the second opening. The third packaging part is connected with the first packaging part and the second packaging part.

The beneficial effects achieved by the preparation method of the display substrate provided by some embodiments of the present disclosure are the same as those achieved by the display substrate provided by some embodiments, and are not described herein.

In some embodiments, the plurality of first openings comprises at least: a plurality of first sub-ports, a plurality of second sub-ports, and a plurality of third sub-ports. Forming a light emitting layer and a cathode layer on the isolation structure and the pixel defining layer in sequence, including: and forming a first stripping pattern, wherein one part of the first stripping pattern is filled in the second sub-opening and the corresponding second opening thereof and extends to the part of the isolation structure around the second sub-opening, and the other part of the first stripping pattern is filled in the third sub-opening and the corresponding second opening thereof and extends to the part of the isolation structure around the third sub-opening. A first luminescent film is formed. The first luminescent film is at least positioned in the first sub-opening, on a portion of the isolation structure adjacent to the first sub-opening, and on the first lift-off pattern. And forming a first cathode film on the first light-emitting film. The first cathode film covers the first light emitting film. The first cathode film is in contact with the isolation structure. And removing the first stripping pattern, the part of the first luminescent film positioned on the first stripping pattern and the part of the first cathode film positioned on the first stripping pattern by adopting a stripping process, and reserving the part of the first luminescent film positioned in the first sub-opening to form a first luminescent layer, wherein the first luminescent layer forms a part of the first luminescent part. And reserving a part corresponding to the first sub-opening and a part contacted with the isolation structure in the first cathode film to form a first cathode layer, wherein the first cathode layer forms a part of the first cathode part.

In some embodiments, the forming a first lift-off pattern includes: and sequentially forming a first sacrificial pattern and a first photoetching pattern on the second sub-opening and a part of the isolation structure around the second sub-opening and the third sub-opening. The first sacrificial pattern is filled in the second sub-opening and the corresponding second opening, and the third sub-opening and the corresponding second opening, and the first sacrificial pattern also covers a part of the isolation structure. And the orthographic projection of the first sacrificial pattern on the backboard is positioned in the orthographic projection range of the first photoetching pattern on the backboard.

In some embodiments, the forming a first cathode film on the first light emitting film includes: and forming a first cathode film by adopting an evaporation process. In the evaporation process of the first cathode film, the range of evaporation angles of the display substrate to be evaporated includes: 0-30 deg.

In some embodiments, a second gap is formed between the part of the first light-emitting film located in the first opening and the isolation structure; the part of the first luminous film, which is positioned in the first opening and is close to the second gap, is of a ladder-shaped structure; the height of the step-shaped structure gradually decreases along the direction that the second opening corresponding to the first opening points to the second gap.

In some embodiments, the forming a light emitting layer, a cathode layer on the isolation structure and the pixel defining layer in this order further comprises: a second lift-off pattern is formed. And one part of the second stripping pattern is filled in the third sub-opening and the corresponding second opening thereof and extends to the part of the isolation structure around the third sub-opening, and the other part of the second stripping pattern covers the first cathode layer and is filled in the second opening corresponding to the first sub-opening and extends to the part of the isolation structure around the first sub-opening. Forming a second light-emitting film. The second luminescent film is at least positioned in the second sub-opening, on a portion of the isolation structure adjacent to the second sub-opening, and on the second peeling pattern. And forming a second cathode film on the second light emitting film. The second cathode film covers the second light emitting film. The second cathode film is in contact with the isolation structure. And removing the second stripping pattern, the part of the second luminescent film positioned on the second stripping pattern and the part of the second cathode layer positioned on the second stripping pattern by adopting a stripping process, and reserving the part of the second luminescent film positioned in the second sub-opening to form a second luminescent layer, wherein the second luminescent layer forms a part of the first luminescent part. And reserving a part corresponding to the second sub-opening and a part contacted with the isolation structure in the second cathode film to form a second cathode layer, wherein the second cathode layer forms a part of the first cathode part.

In some embodiments, the forming the encapsulation layer includes: an encapsulation layer is formed over the cathode layer. And the orthographic projection of the cathode layer on the backboard is positioned in the orthographic projection range of the packaging layer on the backboard.

Some embodiments of the present disclosure also provide a display apparatus including: the display substrate described in any one of the above embodiments, or a display substrate prepared by using the preparation method of the display substrate described in any one of the above embodiments.

The beneficial effects that the display device provided in some embodiments of the present disclosure can achieve are the same as those that the display substrate provided in some embodiments can achieve, and are not described here again.

Drawings

In order to more clearly illustrate the technical solutions of the present disclosure, the drawings that need to be used in some embodiments of the present disclosure will be briefly described below, and it is apparent that the drawings in the following description are only drawings of some embodiments of the present disclosure, and other drawings may be obtained according to these drawings to those of ordinary skill in the art. Furthermore, the drawings in the following description may be regarded as schematic illustrations, and are not limiting of the actual size of the products, the actual flow of the methods, etc. according to the embodiments of the present disclosure.

FIG. 1 is a block diagram of a display device according to some embodiments of the present disclosure;

FIG. 2 is a block diagram of a display substrate according to some embodiments of the present disclosure;

FIG. 3 is a block diagram of another display substrate according to some embodiments of the present disclosure;

FIG. 4A is a partial block diagram of a display substrate according to some embodiments of the present disclosure;

FIG. 4B is another partial block diagram of a display substrate in accordance with some embodiments of the present disclosure;

FIG. 5 is yet another partial block diagram of a display substrate in accordance with some embodiments of the present disclosure;

FIG. 6 is yet another partial block diagram of a display substrate in accordance with some embodiments of the present disclosure;

FIG. 7A is yet another partial block diagram of a display substrate in accordance with some embodiments of the present disclosure;

FIG. 7B is yet another partial block diagram of a display substrate in accordance with some embodiments of the present disclosure;

FIG. 8A is yet another partial block diagram of a display substrate in accordance with some embodiments of the present disclosure;

FIG. 8B is yet another partial block diagram of a display substrate in accordance with some embodiments of the present disclosure;

FIG. 9 is a flow chart of a method for fabricating a display substrate according to some embodiments of the present disclosure;

Fig. 10 to 15 are block diagrams illustrating some of the preparation processes of the display substrate according to some embodiments of the present disclosure;

FIG. 16 is a diagram of a corresponding structure in a manufacturing flow of a display substrate according to one implementation;

FIG. 17 is a block diagram of a display substrate and an evaporation source during formation of a first cathode film according to some embodiments of the present disclosure;

Fig. 18 to 20 are block diagrams illustrating other preparation processes among the preparation processes of the substrate according to some embodiments of the present disclosure.

Detailed Description

The following description of the embodiments of the present disclosure will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present disclosure. All other embodiments obtained by one of ordinary skill in the art based on the embodiments provided by the present disclosure are within the scope of the present disclosure.

Throughout the specification and claims, the term "comprising" is to be interpreted as an open, inclusive meaning, i.e. "comprising, but not limited to, unless the context requires otherwise. In the description of the present specification, the terms "one embodiment," "some embodiments," "example embodiments," "examples," or "some examples," etc., are intended to indicate that a particular feature, structure, material, or characteristic associated with the embodiment or example is included in at least one embodiment or example of the present disclosure. The schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.

The terms "first" and "second" are used below for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the embodiments of the present disclosure, unless otherwise indicated, the meaning of "a plurality" is two or more.

In describing some embodiments, the expression "connected" and its derivatives may be used. The term "coupled" is to be interpreted broadly, as referring to, for example, a fixed connection, a removable connection, or a combination thereof; can be directly connected or indirectly connected through an intermediate medium. The embodiments disclosed herein are not necessarily limited to the disclosure herein.

"A and/or B" includes the following three combinations: only a, only B, and combinations of a and B.

In addition, the use of "based on" is intended to be open and inclusive in that a process, step, calculation, or other action "based on" one or more of the stated conditions or values may be based on additional conditions or beyond the stated values in practice.

As used herein, "about," "approximately" or "approximately" includes the stated values as well as average values within an acceptable deviation range of the particular values as determined by one of ordinary skill in the art in view of the measurement in question and the errors associated with the measurement of the particular quantity (i.e., limitations of the measurement system).

As used herein, "perpendicular", "equal" includes the stated case as well as the case that is similar to the stated case, the range of which is within an acceptable deviation range as determined by one of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the particular quantity (i.e., limitations of the measurement system). For example, "vertical" includes absolute vertical and near vertical, where the acceptable deviation range for near vertical may also be, for example, deviations within 5 °. "equal" includes absolute equal and approximately equal, where the difference between the two, which may be equal, for example, is less than or equal to 5% of either of them within an acceptable deviation of approximately equal.

It will be understood that when a layer or element is referred to as being "on" another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may also be present between the layer or element and the other layer or substrate.

Exemplary embodiments are described herein with reference to cross-sectional and/or plan views as idealized exemplary figures. In the drawings, the thickness of layers and the area of regions are exaggerated for clarity. Thus, variations from the shape of the drawings due to, for example, manufacturing techniques and/or tolerances, are to be expected. Thus, the exemplary embodiments should not be construed as limited to the shapes of regions illustrated herein but are to include deviations in shapes that result, for example, from manufacturing. For example, an etched region shown as a rectangle will typically have curved features. Thus, the regions illustrated in the figures are schematic in nature and their shapes are not intended to illustrate the actual shape of a region of a device and are not intended to limit the scope of example embodiments.

As shown in fig. 1, some embodiments of the present disclosure provide a display device 1000.

In some examples, the display device 1000 described above may be in any display device that displays both motion (e.g., video) and stationary (e.g., still image) and text or images. More particularly, it is contemplated that the display device of the embodiments may be implemented in or associated with a variety of electronics such as, but not limited to, mobile phones, wireless devices, personal Data Assistants (PDAs), handheld or portable computers, GPS receivers/navigators, cameras, MP4 video players, video cameras, game consoles, wrist watches, clocks, calculators, television monitors, flat panel displays, computer monitors, automotive displays (e.g., odometer display, etc.), navigators, cabin controllers and/or displays, displays of camera views (e.g., displays of a rear view camera in a vehicle), electronic photographs, electronic billboards or signs, projectors, architectural structures, packaging, and aesthetic structures (e.g., displays of images on a piece of jewelry), and the like.

Exemplary, the display device 1000 includes: frames, driver chips, and other electronic components, etc.

In some examples, as shown in fig. 1, the display device 1000 further includes: a display substrate 100.

For example, the display substrate 100 is located in the frame and electrically connected to the driving chip, and performs a display function under a signal provided by the driving chip.

The display substrate 100 may be an OLED (Organic LIGHT EMITTING Diode) display substrate, for example.

In some examples, as shown in fig. 2, the display substrate 100 includes a back plate 10.

The back plate 10 includes a substrate 11 and a circuit structure layer 12 stacked in this order.

The types of the above-mentioned substrate 11 include various ones, and the arrangement may be selected according to actual needs.

The substrate 11 may be a rigid substrate, for example. The rigid substrate may be a glass substrate, a PMMA (polymethyl methacrylate) substrate, or the like.

The substrate 11 may be a flexible substrate, for example. The flexible substrate may be a PET (Polyethyleneterephthalate ) substrate, a PEN (Polyethylenenaphthalatetwoformicacidglycolester, polyethylene naphthalate) substrate, a PI (Polyimide) substrate, or the like. In this case, the display substrate 100 can realize flexible display, for example.

Illustratively, the circuit structure layer 12 is disposed on one side of the substrate 11. The circuit structure layer 12 may include a plurality of pixel driving circuits 13.

The structure of the pixel driving circuit 13 may include various kinds, which is not limited by the present disclosure, for example. For example, the pixel driving circuit 13 may have a structure of "6T1C", "7T1C", "6T2C", "7T2C", or the like; where "T" denotes a transistor, a number preceding "T" denotes the number of transistors, "C" denotes a storage capacitor, and a number preceding "C" denotes the number of storage capacitors. In the drawings of some embodiments of the present disclosure, one transistor is exemplified as the pixel driving circuit 13.

In some examples, referring to fig. 2, the display substrate 100 further includes a pixel defining layer 20. The pixel defining layer 20 is disposed on a side of the circuit structure layer 12 remote from the substrate 11.

Illustratively, the pixel defining layer 20 defines a plurality of first openings 21. The pixel defining layer 20 has a grid-like top view structure, and the plurality of first openings 21 form a grid-like mesh.

By way of example, the shape of the plurality of first openings 21 may be various, such as a circle, a quadrangle, a pentagon, a hexagon, etc., and the embodiment of the present disclosure is not limited thereto.

In some examples, as shown in fig. 2, the display substrate 100 further includes: an anode layer 30 disposed between the pixel defining layer 20 and the back plate 10. The anode layer 30 includes a plurality of anodes 31 disposed at intervals.

The anode 31 is connected to the pixel driving circuit 13 in the back plate 10, and receives an electric signal supplied from the pixel driving circuit 13.

A first opening 21 exposes at least a portion of an anode 31. The surface of the anode 31, which is far from the back plate, may be fully exposed through the first opening 21, or may be partially exposed, and partially covered by the pixel defining layer 20.

As shown in fig. 3, the display substrate 100 further includes: an isolation structure 40 disposed on a side of the pixel defining layer 20 remote from the backplate 10.

Illustratively, the material of the isolation structure 40 may include a conductive material, with the isolation structure 40 having a conductive function. For example, the material of the isolation structure 40 includes at least one of aluminum, copper, silver, titanium, molybdenum.

Illustratively, the isolation structure 40 defines a plurality of second openings 41. One first opening 21 is provided corresponding to one second opening 41. The front projection of a first opening 21 onto the back plate 10 is located within the front projection of a second opening 41 onto the back plate 10.

For example, the boundary line of the orthographic projection of one first opening 21 on the back plate 10 is located within the boundary line of the orthographic projection of the corresponding second opening 41 on the back plate 10. The boundary line of the orthographic projection of the first opening 21 on the back plate 10 may partially coincide with the boundary line of the orthographic projection of the corresponding second opening 41 on the back plate 10.

As shown in fig. 3, the display substrate 100 further includes: the light emitting layer 50, the cathode layer 60, and the encapsulation layer 70, which are disposed on the side of the isolation structure 40 away from the pixel defining layer 20, are stacked.

Illustratively, the light emitting layer 50 may include: the light emitting sub-layer 51.

The light emitting layer 50 may further include: at least one light-emitting functional layer FL. The light emitting functional layer FL may be a hole injection layer (Hole Inject Layer, HIL for short), a hole transport layer (Hole Transport Layer, HTL for short), an electron blocking layer (Electron Blocking Layer, EBL for short), a hole blocking layer (Hole Blocking Layer, HBL for short), an electron transport layer (Electron Transport Layer, ETL for short), or an electron injection layer (Electron Inject Layer, EIL for short).

In the case where the light-emitting layer 50 includes a hole injection layer 52, a hole transport layer 53, and an electron blocking layer (not shown), the hole injection layer 52, the hole transport layer 53, and the electron blocking layer are sequentially stacked between the anode 31 layer and the light-emitting sublayer 51, as shown in fig. 4A. In the case where the light-emitting layer 50 includes a hole blocking layer, an electron transport layer 54, and an electron injection layer 55, the hole blocking layer (not shown), the electron transport layer 54, and the electron injection layer 55 are sequentially stacked between the light-emitting sublayer 51 and the cathode layer 60.

Specifically, the hole injection layer 52 serves to lower the potential barrier for hole injection and to improve the efficiency of hole injection. The hole transport layer 53 is for transporting holes. The electron blocking layer may transfer holes to the light emitting layer 50 and may also block electrons and excitons. The hole blocking layer serves to transport electrons to the light emitting sub-layer 51, blocking holes and excitons. The electron transport layer 54 is used to transport electrons. The electron injection layer 55 is used to reduce the potential barrier of electron injection, and to improve the efficiency of electron injection, and thus to improve the light extraction efficiency of the light emitting layer 50 and the display substrate 100.

It is to be understood that, in fig. 4A, only the relative positional relationship of the hole injection layer 52, the hole transport layer 53, the light emitting sublayer 51, the electron transport layer 54, and the electron injection layer 55 in the light emitting layer 50 is illustrated, and the relative thickness relationship is not represented, and the specific thickness may be set according to practical requirements.

In some examples, as shown in fig. 3, the light emitting layer 50 includes a first light emitting portion 501 and a second light emitting portion 502 that are disconnected from each other. The first light emitting portions 501 are at least located in the first openings 21, and the second light emitting portions 502 are located at a side of the isolation structure 40 away from the back plate 10.

For example, the plurality of first openings 21 at least include a plurality of first sub-openings 211, a plurality of second sub-openings 212, and a plurality of third sub-openings 213 that are disposed at intervals.

As illustrated in fig. 3, the first light emitting portion 501 includes at least a plurality of first light emitting layers 5011, a plurality of second light emitting layers 5012, and a plurality of third light emitting layers 5013. The colors of light emitted from the first light-emitting layer 5011, the second light-emitting layer 5012, and the third light-emitting layer 5013 are different. For example, the first light-emitting layer 5011 may emit red light, the second light-emitting layer 5012 may emit green light, and the third light-emitting layer 5013 may emit blue light.

The plurality of first light-emitting layers 5011, the plurality of second light-emitting layers 5012, and the plurality of third light-emitting layers 5013 are provided with an interval therebetween. Each first light-emitting layer 5011 is continuous and uninterrupted. Each second light-emitting layer 5012 is continuous and uninterrupted. Each third light-emitting layer 5013 is continuous and uninterrupted.

A first light-emitting layer 5011 is provided corresponding to the one first sub-aperture 211, and is in contact with the anode corresponding to the first sub-aperture 211. A second light-emitting layer 5012 is provided corresponding to one of the second sub-openings 212 and is in contact with the anode corresponding to the second sub-opening 212. A third light-emitting layer 5013 is provided corresponding to one third sub-aperture 213 and is in contact with the anode corresponding to the third sub-aperture 213.

For example, the first light emitting portions 501 are located in the respective first openings 21. Specifically, one first light emitting layer 5011 is located in one first sub-aperture 211, one second light emitting layer 5012 is located in one second sub-aperture 212, and one third light emitting layer 5013 is located in one third sub-aperture 213.

As another example, a portion of the first light emitting portion 501 is located in the first opening 21, and another portion of the first light emitting portion 501 contacts with a sidewall of the first opening 21 and overlaps onto the pixel defining layer 20. Specifically, a first light emitting layer 5011 extends from within the first sub-aperture 211, along the sidewall of the first sub-aperture 211, and onto the pixel defining layer 20. A second light-emitting layer 5012 extends from within the second sub-aperture 212 along the side wall of the second sub-aperture 212 onto the pixel defining layer 20. A third light-emitting layer 5013 extends from within the third sub-aperture 213 along the side wall of the third sub-aperture 213 onto the pixel defining layer 20.

As another example, the plurality of first light emitting layers 5011 of the plurality of first light emitting layers 5011, the plurality of second light emitting layers 5012, and the plurality of third light emitting layers 5013 are located within the respective first sub-openings 211; and the plurality of second light emitting layers 5012 and the plurality of third light emitting layers 5013 extend onto the pixel defining layer 20 in addition to being located in the respective first openings 21.

Illustratively, a portion of the first light emitting part 501 located within the first opening 21 may be in contact with a portion of the anode 31 exposed through the first opening 21, so that an electrical signal transmitted by the anode 31 may be received.

The second light emitting portion 502 may have a top view shape similar to a mesh structure. Along the thickness direction of the back sheet 10, one first opening 21 is provided corresponding to one second opening 41, and each of the first light-emitting layers 5011, each of the second light-emitting layers 5012, and each of the third light-emitting layers 5013 is provided corresponding to each of the second openings 41.

Each first light-emitting layer 5011 is disconnected from the adjacent second light-emitting portion 502, each second light-emitting layer 5012 is disconnected from the adjacent second light-emitting portion 502, and each third light-emitting layer 5013 is disconnected from the adjacent second light-emitting portion 502. The second light emitting portion 502 does not emit light.

In some examples, cathode layer 60 is used to transmit electrical signals to light emitting layer 50. As shown in fig. 3, the cathode layer 60 includes a first cathode portion 601 and a second cathode portion 602 that are disconnected from each other. A portion of the first cathode portion 601 is located in a region corresponding to the second opening 41, and another portion of the first cathode portion 601 is in contact with the isolation structure 40. The second cathode portion 602 is located at a side of the second light emitting portion 502 away from the isolation structure 40.

For example, the first cathode portion 601 includes at least: a plurality of first cathode layers 6011, a plurality of second cathode layers 6012, and a plurality of third cathode layers 6013.

The plurality of first cathode layers 6011, the plurality of second cathode layers 6012, and the plurality of third cathode layers 6013 are disposed at intervals therebetween. Each first cathode layer 6011 is continuous, uninterrupted. Each second cathode layer 6012 is continuous, uninterrupted. Each third cathode layer 6013 is continuous, uninterrupted.

One first cathode layer 6011 is provided corresponding to the one first sub-aperture 211 and contacts the first light-emitting layer 5011. A second cathode layer 6012 is provided corresponding to the second sub-aperture 212 and contacts the second light-emitting layer 5012. A third cathode layer 6013 is provided corresponding to the third sub-aperture 213 and contacts the third light-emitting layer 5013.

The second cathode portion 602 may have a top view shape similar to a mesh structure having mesh openings corresponding to the plurality of second openings 41. Each of the first cathode layer 6011, each of the second cathode layer 6012, and each of the third cathode layer 6013 described above is provided corresponding to each of the second openings 41 (or each of the first openings 21).

Each first cathode layer 6011 is disconnected from the adjacent portions of the second cathode portion 602 and contacts the adjacent separator 40. Each second cathode layer 6012 is disconnected from the portion of its adjacent second cathode portion 602 and contacts its adjacent separator 40. Each third cathode layer 6013 is disconnected from the portions of its adjacent second cathode portions 602 and contacts its adjacent separator structure 40.

Thus, the cathode layer 60 may be in contact with the separator structure 40 through the first cathode portion 601 such that the separator structure 40 functions as an auxiliary electrode, enabling connection between different portions of the first cathode portion 601 (herein, different portions refer to respective first cathode layers 6011, respective second cathode layers 6012, and respective third cathode layers 6013).

The anode 31, the first light-emitting layer 5011, and the first cathode layer 6011 corresponding to the first sub-aperture 211 constitute a first light-emitting device of the display substrate 100. For example, the first light emitting layer 5011 of the first light emitting device emits red light by the electric signals supplied from the first cathode layer 6011 and the anode 31.

The anode 31, the second light-emitting layer 5012, and the second cathode layer 6012 corresponding to the second sub-aperture 212 constitute a first light-emitting device of the display substrate 100. For example, the second light emitting layer 5012 of the second light emitting device emits green light by the electric signals supplied from the second cathode layer 6012 and the anode 31.

The anode 31, the third light-emitting layer 5013, and the third cathode layer 6013 corresponding to the third sub-aperture 213 constitute a third light-emitting device of the display substrate 100. For example, the third light emitting layer 5013 of the third light emitting device emits blue light by the electric signals supplied from the third cathode layer 6013 and the anode 31.

As can be seen from the above, the isolation structure 40 can separate the light emitting layer 50 into the first light emitting part 501 and the second light emitting part 502 which are disconnected, and separate the cathode layer 60 into the first cathode part 601 and the second cathode part 602 which are disconnected, so that, in the case that the display substrate 100 includes an encapsulation layer, the isolation structure 40 easily separates the encapsulation layer, so that the encapsulation layer includes a plurality of discontinuous and disconnected parts, and thus, external moisture easily invades into the light emitting layer from the disconnected parts of the encapsulation layer, so that the encapsulation layer is difficult to realize effective encapsulation of the light emitting device and the display substrate, and the light emission of the light emitting device is affected.

Based on this, as shown in fig. 3, in some examples, the encapsulation layer 70 includes a first encapsulation part 701, a second encapsulation part 702, and a third encapsulation part 703.

The first encapsulation part 701 is located at a side of the first cathode part 601 remote from the first light emitting part 501.

For example, the first encapsulation portion 701 covers each of the first cathode layers 6011.

Thus, the first light emitting portion 501 and the first cathode portion 601 can be protected by the first package portion 701.

The second encapsulation portion 702 is located on a side of the second cathode portion 602 away from the second light emitting portion 502, a side of the second cathode portion 602, and a side of the second light emitting portion 502. Thus, the second package 702 can protect the second light emitting unit 502 and the second cathode unit 602.

As shown in fig. 3, the third encapsulation portion 703 is in contact with the sidewall of the second opening 41. For example, the third packaging portion 703 wraps a portion of the sidewall of the second opening 41, and the remaining sidewall of the second opening 41 contacts the first cathode portion 601, so as to contact the first cathode portion 601 with the isolation structure 40.

The third package 703 is connected to the second package 702 and the first package 701. Therefore, the first package portion 701, the second package portion 702 and the third package portion 703 form a continuous and uninterrupted package layer 70, and the package layer 70 is used to package the light emitting layer 50 and the cathode layer 60, so that the package effect of the package layer 70 is better, the light emitting effect and the service life of the light emitting device are improved, and the problem that water vapor and the like easily invade into the light emitting device from the discontinuous portions to affect the light emitting performance of the light emitting device due to the discontinuous portions of the package layer 70 is avoided.

In some examples, as shown in fig. 4A, the second package portion 702 and the first package portion 701 are connected.

For example, the third package portion 703, the second package portion 702, and the first package portion 701 are connected to each other at the same position.

This can further ensure that the first package 701, the second package 702, and the third package 703 form the continuous and uninterrupted package layer 70, thereby effectively improving the package effect of the package layer 70 on the light emitting device and the display substrate 100.

In some examples, as shown in fig. 4A, the connection between the surface of the second encapsulation portion 702 on the side of the second cathode portion 602 away from the second light emitting portion 502 and the surface of the second encapsulation portion 702 on the side away from the second cathode portion 602 is curved. The arc shape protrudes in a direction away from the second light emitting portion 502.

Therefore, the transition between the different surfaces of the second encapsulation portion 702 is gentle or smooth, so that the stress suffered by the transition regions of the different surfaces of the second encapsulation portion 702 can be dispersed, the risk of cracking of the second encapsulation portion 702 and the encapsulation layer 70 at the joint can be reduced, the encapsulation protection effect of the encapsulation layer 70 can be improved, and the problem that the cracks are easy to occur due to the sharp right angle or sharp angle transition of the connection between the different surfaces is avoided.

It will be appreciated that the isolation structure 40 may be configured in a variety of ways, and may be selectively configured as desired, as embodiments of the present disclosure are not limited in this respect.

As shown in fig. 8A and 8B, the isolation structure 40 includes: a plurality of sub-isolation structures 42, one sub-isolation structure 42 defining one second opening 41.

One sub-isolation structure 42 corresponds to one second opening 41.

For clarity, fig. 8A and 8B illustrate only the first light emitting portion 501 of the light emitting layer 50 corresponding to the second opening 41 and the adjacent five sub-isolation structures 42 of the isolation structures 40, and the portion of the light emitting layer 50 located on the isolation structures 40 is not illustrated.

In some examples, as shown in fig. 8A, a plurality of sub-isolation structures 42 are disposed in a spaced apart relationship.

The plurality of sub-isolation structures 42 are independently arranged, and gaps are formed between adjacent sub-isolation structures 42.

In other examples, as shown in fig. 8B, adjacent plural sub-isolation structures 42 are connected, and part of the sidewalls of two second openings 41 defined by adjacent two sub-isolation structures 42 are shared.

Thus, the plurality of sub-isolation structures 42 form a unitary structure, facilitating the fabrication of the isolation structure 40.

In some examples, as shown in fig. 4A, isolation structure 40 includes: the first sub-layer 401, the second sub-layer 402, and the third sub-layer 403 are sequentially stacked in a direction perpendicular to and away from the back plate 10.

For example, the first sub-layer 401, the second sub-layer 402, and the third sub-layer 403 each have a certain thickness. The thickness of the second sub-layer 402 is relatively large, greater than the thickness of the first sub-layer 401, and greater than the thickness of the third sub-layer 403.

The thickness of the first sub-layer 401 may or may not be equal to the thickness of the third sub-layer 403.

Illustratively, the first cathode portion 601 is in contact with the first sub-layer 401.

For example, the first cathode portion 601 is overlapped on a side surface of the first sub-layer 401 remote from the back plate 10.

Illustratively, the first cathode portion 601 may also be in contact with both the first sub-layer 401 and the second sub-layer 402.

Illustratively, as shown in FIG. 5, the first sub-layer 401 defines a plurality of third openings 4011. The second sub-layer 402 defines a plurality of fourth openings 4021. The third sub-layer 403 defines a plurality of fifth openings 4031. A third opening 4011 is provided corresponding to the fourth opening 4021 and the fifth opening 4031.

It will be appreciated that, for convenience of illustration, only a portion of the light emitting layer 50, a portion of the cathode layer 60, and a portion of the encapsulation layer 70 are illustrated in fig. 4A and 5.

The front projection of a third opening 4011 on the back plate 10 and the front projection of a fifth opening 4031 on the back plate 10 are both within the front projection of a fourth opening 4021 on the back plate 10. The area of the fourth opening 4021 is larger than the area of the third opening 4011 and larger than the area of the fifth opening 4031. Thus, the cross-sectional shape of the isolation structure 40 may be approximately "I" shaped.

The corresponding third opening 4011, fourth opening 4021 and fifth opening 4031 are vertically communicated, and the corresponding third opening 4011, fourth opening 4021 and fifth opening 4031 form one of the second openings 41.

With the above arrangement, the first light emitting portion 501 and the second light emitting portion 502 of the light emitting layer 50 can be separated from each other by the isolation structure 40, and the first cathode portion 601 and the second cathode portion 602 of the cathode layer 60 can be separated from each other, so that different light emitting devices (for example, the first light emitting device, the second light emitting device, and the third light emitting device) can be independently and separately arranged, and connection between portions of the light emitting layer 50 constituting different light emitting devices can be avoided. The above-mentioned arrangement of the isolation structure 40 is beneficial to realizing the mutual contact and connection between the first cathode portion 601 and the first sub-layer 401, so as to ensure that the parts (for example, the first cathode layer 6011, the second cathode layer 6012 and the third cathode layer 6013) of the first cathode portion 601 located in different first openings 21 are mutually connected through the isolation structure 40, ensure that the parts (for example, the first light-emitting layer 5011, the second light-emitting layer 5012 and the third light-emitting layer 5013) of the first light-emitting portion 501 located in each first opening 21 can receive the substantially same electric signals transmitted by the first cathode portion 601, and further facilitate to improve the accuracy of the electric signals received by the parts of the first light-emitting portion 501 located in each first opening 21, so as to facilitate to improve the display uniformity of the display substrate 100.

In some examples, as shown in fig. 4A and 6, an angle β1 between a sidewall of the fourth opening 4021 and the first sub-layer 401 is greater than or equal to an angle β2 between the sidewall of the fourth opening 4021 and the third sub-layer 403.

For example, the angle β1 between the sidewall of the fourth opening 4021 and the first sub-layer 401 is equal to the angle β2 between the sidewall of the fourth opening 4021 and the third sub-layer 403, and the angle is 90 °. Based on this, as shown in fig. 3, the cross-sectional view of the second sub-layer 402 is rectangular or substantially rectangular in shape.

For another example, an angle β1 between a sidewall of the fourth opening 4021 and the first sub-layer 401 is greater than an angle β2 between the sidewall of the fourth opening 4021 and the third sub-layer 403. The included angle β1 between the sidewall of the fourth opening 4021 and the first sub-layer 401 is an obtuse angle, and the included angle β2 between the sidewall of the fourth opening 4021 and the third sub-layer 403 is an acute angle. Based on this, as shown in fig. 4A, the cross-sectional view of the second sub-layer 402 is substantially in the shape of a right trapezoid.

Therefore, the isolation structure 40 has better structural stability, and the light-emitting layer 50, the cathode layer 60 and the like can be conveniently prepared on the isolation structure 40 later. And the contact area between the first cathode portion 601 and the first sub-layer 401 is increased, which is beneficial to realizing effective contact between the first cathode portion 601 and the first sub-layer 401 and improving the display uniformity of the display substrate 100.

In other examples, as shown in fig. 4B, the angle β1 between the sidewall of the fourth opening 4021 and the first sub-layer 401 is smaller than the angle β2 between the sidewall of the fourth opening 4021 and the third sub-layer 403.

For example, the included angle β1 between the sidewall of the fourth opening 4021 and the first sub-layer 401 is an acute angle, and the included angle β2 between the sidewall of the fourth opening 4021 and the third sub-layer 403 is an obtuse angle. Based on this, as shown in fig. 4B, the cross-sectional view of the second sub-layer 402 is approximately inverted trapezoidal in shape.

In some examples, as shown in fig. 6, an orthographic projection of a third opening 4011 on the back plate 10 is located within an orthographic projection of a fifth opening 4031 on the back plate 10.

For example, the area of the fifth opening 4031 is greater than or equal to the area of the third opening 4011, so that the area of the first sub-layer 401 is relatively greater, which is beneficial to realizing overlap contact between the first sub-layer 401 and the first cathode portion 601, and avoiding that the first cathode cannot be contacted with the first sub-layer 401 due to the smaller area of the first sub-layer 401.

In other examples, an orthographic projection of a fifth opening 4031 onto the back plate 10 is within an orthographic projection of a third opening 4011 onto the back plate 10.

For example, the area of the fifth opening 4031 is smaller or slightly smaller than the area of the third opening 4011.

Thus, the light emitting layer 50 is easily partitioned by the isolation structure 40 and the third sub-layer 403, and the plurality of light emitting devices are separated from each other.

In some examples, as shown in fig. 4A to 6, a first gap G1 is provided between the side wall of the second opening 41 and the first cathode portion 601. The side wall of the second opening 41 is constituted by the side wall of the corresponding third opening 4011, the side wall of the fourth opening 4021, and the side wall of the fifth opening 4031.

In some examples, as shown in fig. 4A, the first light emitting portion 501 has a second gap G2 between the isolation structure 40. The first light emitting portion 501 is not in contact with the isolation structure 40. For example, a part of the first cathode portion 601 is filled in the second gap G2.

Thereby, the display effect of the display substrate 100 can be improved, the first light emitting portion 501 is prevented from being overlapped on the isolation structure 40, the first light emitting portion 501 is prevented from being overlapped on the first sub-layer 401, the area of the portion corresponding to each first opening 21 in the first light emitting portion 501 (the portion corresponding to each first opening 21 in the first light emitting portion 501 refers to the first light emitting layer, the second light emitting layer or the third light emitting layer here) is prevented from being larger, and therefore the interval between two adjacent light emitting devices can be prevented from being smaller, and the crosstalk of light rays emitted by the two adjacent light emitting devices is prevented.

The third package 703 may be disposed according to actual needs in various ways with respect to the first gap G1, and the embodiments of the present disclosure are not limited thereto.

It will be appreciated that the thickness of the encapsulation layer 70 is uniform or substantially uniform. For example, the thickness of the first package part 701 is equal to or substantially equal to the thickness of the second package part 702 and the thickness of the third package part 703. The thickness of the encapsulation layer 70 may be approximately regarded as the thickness of the first encapsulation part 701 or the thickness of the second encapsulation part 702.

In some examples, the thickness of the encapsulation layer 70 or the thickness of the first encapsulation 701 is H ₁. As shown in fig. 6, the third package 703 fills a portion of the first gap G1, and the thickness H ₁ of the first package 701 and the thickness H ₂ of the second sub-layer satisfy: h ₁＜0.5H₂.

For example, H ₁＝0.45H₂, or H ₁＝0.40H₂, or H ₁＝0.30H₂.

On this basis, since the third packaging part 703 contacts with the side wall of the second opening 41, the packaging layer 70 can realize effective packaging, the thickness of the packaging layer 70 is relatively smaller, and the surface of the packaging layer 70 far away from the back plate side is relatively flat, so that the preparation cost of the packaging layer 70 is smaller, the preparation period is shorter, the preparation cost of the display substrate 100 is reduced, and the preparation period is shortened.

In other examples, as shown in fig. 4A and 5, the third encapsulation portion 703 fills the first gap G1, and fills the first gap G1.

Illustratively, the thickness H ₁ of the first encapsulation portion and the thickness H ₂ of the second sub-layer satisfy: h ₁≥0.5H₂.

For example, H ₂＝2H₁, or H ₂＝1.5H₁, or H ₂＝H₁.

Thus, the thicknesses of the first package portion 701 and the package layer 70 can be made larger, so that the third package portion 703 is ensured to fill the first gap between the sidewall of the second opening 41 and the first cathode portion 601, and the adverse effect caused by the external moisture entering the light emitting layer 50 and the cathode layer 60 from the first gap is avoided, thereby improving the package effect of the package layer 70.

In addition, as shown in fig. 4A, the thickness of the first package portion 701 and the thickness of the package layer 70 are larger, so that the connection between the surface of the second package portion 702, which is located on the side of the second cathode portion 602 away from the second light emitting portion 502, and the surface of the second package portion 702, which is located on the side of the second cathode portion 602 away from the second cathode portion, can be ensured to be arc-shaped, so that the package effect of the package layer 70 is further enhanced.

In some examples, as shown in fig. 7A, an included angle α between a side surface of the second light emitting portion 502 and a plane of the back plate satisfies: the angle alpha is more than or equal to 60 degrees and more than or equal to 45 degrees.

Exemplary, the included angle α between the side surface of the second light emitting portion 502 and the plane of the back plate satisfies: alpha is more than or equal to 45 degrees and less than or equal to 50 degrees, alpha is more than or equal to 45 degrees and less than or equal to 55 degrees, alpha is more than or equal to 50 degrees and less than or equal to 55 degrees or alpha is more than or equal to 55 degrees and less than or equal to 60 degrees.

For example, the included angle α between the side surface of the second light emitting portion 502 and the plane of the back plate is 45 °, 48 °, 52 °, 55 °, 57 °, or 60 °.

Thereby, the transition between the side surface of the second light emitting portion 502 and the surface of the isolation structure 40 on the side away from the back plate can be made gentle.

In some examples, as shown in fig. 7A and 7B, a portion of the first light emitting portion 501 near the second gap G2 is a stepped structure (refer to a broken line in fig. 7A). The height of the stepped structure gradually decreases in a direction in which the first light emitting portion 501 is directed toward the second gap G2.

The stepped structure includes at least two steps. The embodiment of the disclosure does not limit the number of steps included in the step-shaped structure, and can be set according to actual needs. For example, the stepped structure includes two steps, three steps, four steps, or the like.

For example, in the case where the first light emitting portion 501 includes the hole injection layer 52, the hole transport layer 53, the light emitting sublayer 51, the electron transport layer 54, and the electron injection layer 55, the hole injection layer 52, the hole transport layer 53 are close to the edge of the second gap G2, and the edge of the light emitting sublayer 51, the electron transport layer 54, and the electron injection layer 55 close to the second gap G2 is beyond the above-described stepped structure in the first light emitting portion 501.

For example, in the case where the first light emitting portion 501 includes the hole injection layer 52, the hole transport layer 53, the light emitting sub-layer 51, the electron transport layer 54, and the electron injection layer 55, the hole injection layer 52, the hole transport layer 53, and the light emitting sub-layer 51 are located near the edge of the second gap G2, beyond the edge of the electron transport layer 54 and the electron injection layer 55 near the second gap G2 in the first light emitting portion 501, and the stepped structure is formed.

Based on this, in the stepped structure, the sum of thicknesses of the hole injection layer 52, the hole transport layer 53, the light-emitting sublayer 51, the electron transport layer 54, and the electron injection layer 55 is between 200nm and 300nm, and the sum of thicknesses of the hole injection layer 52, the hole transport layer 53, and the light-emitting sublayer 51 is between 150nm and 250nm. For example, the sum of thicknesses of the hole injection layer 52, the hole transport layer 53, the light emitting sub-layer 51, the electron transport layer 54, and the electron injection layer 55 is 200nm, 220nm, 250nm, 280nm, or 300nm; the sum of the thicknesses of the hole injection layer 52, the hole transport layer 53, and the light-emitting sublayer 51 is 150nm, 170nm, 190nm, 220nm, or 250nm. In the step structure, the hole injection layer 52, the hole transport layer 53 and the light emitting sub-layer 51 are close to the edge of the second gap G2, and the distance between the electron transport layer 54 and the electron injection layer 55 is between 100nm and 200nm from the first sub-layer 401 of the isolation structure 40, and the distance between the first sub-layer 401 of the isolation structure 40 and the edge of the second gap G2 is between 50nm and 100 nm. For example, the hole injection layer 52, the hole transport layer 53, and the light emitting sub-layer 51 are near the edge of the second gap G2, and the distance between the first sub-layer 401 of the isolation structure 40 is 50nm, 75nm, 82nm, 90nm, or 100nm; the distance between the electron transport layer 54, the edge of the electron injection layer 55 near the second gap G2 and the first sub-layer 401 of the isolation structure 40 is 100nm, 125nm, 150nm, 180nm or 200nm.

It will be appreciated that the portion of the first cathode portion 601 that is located on the stepped structure has the same or similar morphology as the stepped structure.

In some examples, as shown in fig. 4A, a dimension L of a contact portion of the first cathode portion 601 with the isolation structure 40 in the first direction satisfies: l is more than or equal to 200nm. The first direction is a direction directed from the center of the first opening 21 toward the side wall of the first opening 21.

Illustratively, the dimension L in the first direction of the contact portion of the first cathode portion 601 with the separator 40 satisfies: the L is more than or equal to 400nm and more than or equal to 300nm or more than or equal to 400nm and more than or equal to 200nm.

For example, the dimension L of the contact portion of the first cathode portion 601 with the isolation structure 40 in the first direction is 200nm, 250nm, 300nm, 360nm, or 400nm.

Therefore, the contact area between the first cathode 601 and the isolation structure 40 is larger, so that the first cathode 601 and the isolation structure 40 are effectively contacted, the resistance of the contact portion between the first cathode 601 and the isolation structure 40 is reduced to a certain extent, the voltage drop loss of the electric signal transmitted by the cathode layer 60 in the transmission process is reduced, the accuracy of the cathode electric signal received by the light emitting layer 50 is improved, and the display uniformity of the display substrate 100 is further improved.

In some examples, as shown in fig. 4A-6, the thickness H ₅ of the cathode layer 60 satisfies: h ₅ nm to 10nm.

It will be appreciated that the thickness of the cathode layer 60 is uniform, and that the thickness of the first cathode portion 601 and the thickness of the second cathode portion 602 are equal or substantially equal.

For example, the thickness H ₅ of the cathode layer 60 may be 10nm, 13nm, 16nm, 18nm, or 20nm.

Therefore, the light transmittance of the cathode layer 60 is higher, the loss of the light emitted by the light emitting layer 50 in the process of passing through the cathode layer 60 is reduced, and the light emitting efficiency of the light emitting device and the display substrate 100 is improved.

For example, in the case where the thickness of the cathode layer 60 satisfies the above condition, the light transmittance of the cathode layer 60 at 550nm is greater than or equal to 55%, whereby it is possible to ensure that the cathode layer 60 has a high light transmittance.

In some examples, as shown in fig. 4A, the thickness H ₃ of the isolation structure 40 and the thickness H ₄ of the light emitting layer 50 satisfy: h ₃＞H₄.

As shown in fig. 4A, in the case where a portion of the first light emitting portion 501 is overlapped on the pixel defining layer 20, the above arrangement can ensure that the thickness of the isolation structure 40 is larger, so that after the second light emitting portion 502 is formed to the area corresponding to the first opening 21, the height of the surface of the first light emitting portion 501 away from the pixel defining layer 20 is smaller than the height of the surface of the isolation structure 40 away from the pixel defining layer 20, so that a step difference exists between the isolation structure 40 and the first light emitting portion 501, and the isolation structure 40 is ensured to separate the first light emitting portion 501 and the second light emitting portion 502 of the light emitting layer 50, so that the first cathode portion 601 and the second cathode portion 602 of the cathode layer 60 can be further separated, and further, the separation arrangement of each light emitting device is realized.

In some examples, as shown in fig. 4A, the display substrate 100 further includes: a dimming layer 80 located between the cathode layer 60 and the encapsulation layer 70.

For example, the dimming layer 80 covers the first cathode portion 601 and the second cathode portion 602.

Illustratively, the dimming layer 80 includes a first sub-portion and a second sub-portion sequentially stacked on the cathode layer 60.

For example, the refractive index of the second sub-portion is smaller than the refractive index of the first sub-portion.

Therefore, the refractive indexes of the adjacent second sub-parts and the first sub-parts are mutually matched, the light transmittance of light is improved, and the light emitting efficiency of the light emitting device is further improved.

As another example, the refractive index of the second sub-portion is less than the refractive index of the encapsulation layer 70.

Therefore, the refractive indexes of the adjacent second sub-portions and the encapsulation layer 70 can be matched, the light transmittance of the light modulation layer 80 and the encapsulation layer 70 is improved, and the light emitting efficiency of the light emitting device is further improved.

As another example, the refractive index of the second sub-portion 82 is smaller than the refractive index of the first sub-portion 81. And, the refractive index of the second sub-portion 82 is smaller than that of the encapsulation layer 70. Thus, the refractive indexes of the adjacent first sub-portion 81, second sub-portion 82 and encapsulation layer 70 can be matched with each other, the light transmittance of the light modulation layer 80 can be improved, and the light emitting efficiency of the light emitting device can be further improved.

In some examples, the refractive index of the encapsulation layer 70 is greater than the refractive index of the first sub-portion.

For example, the refractive index of the first sub-portion is greater than or equal to 1.9 and less than or equal to 2.2. The refractive index of the second sub-portion is greater than or equal to 1.4 and less than or equal to 1.6. The refractive index of the encapsulation layer 70 is greater than or equal to 1.8 and less than or equal to 2.0.

In some examples, as shown in fig. 4A, a thickness H ₆ of the dimming layer 80 is less than or equal to a thickness H ₁ of the first encapsulation portion 701.

For example, the thickness of the dimming layer 80 is equal to the thickness of the first encapsulation part 701.

As another example, the thickness of the dimming layer 80 is greater than the thickness of the first encapsulation part 701.

For example, the thickness of the first sub-portion 81 is greater than or equal to 50nm and less than or equal to 100nm. The thickness of the second sub-portion 82 is greater than or equal to 50nm and less than or equal to 100nm. The thickness of the first encapsulation part 701 or the encapsulation layer 70 is greater than or equal to 200nm and less than or equal to 500nm.

Thus, the thickness of the dimming layer 80 can be matched with the thickness of the first encapsulation part 701, and the light emitting efficiency of the light emitting device can be improved.

In some examples, as shown in fig. 4A, the sum of the thickness H ₁ of the first encapsulation portion 701, the thickness H ₆ of the dimming layer 80, the thickness H ₅ of the cathode layer 60, and the thickness H ₄ of the light emitting layer 50 is greater than or equal to the thickness H ₃ of the isolation structure 40.

For example, the sum of the thickness H ₁ of the first encapsulation portion 701, the thickness H ₆ of the dimming layer 80, the thickness H ₅ of the cathode layer 60, and the thickness H ₄ of the light emitting layer 50 is equal to the thickness H ₃ of the isolation structure 40, i.e., H ₁+H₆+H₅+H₄＝H₃.

As another example, the sum of the thickness H ₁ of the first encapsulation portion 701, the thickness H ₆ of the dimming layer 80, the thickness H ₅ of the cathode layer 60, and the thickness H ₄ of the light emitting layer 50 is greater than the thickness H ₃ of the isolation structure 40, i.e., H ₁+H₆+H₅+H₄＞H₃.

Therefore, the packaging layer 70 can be ensured to be of a continuous and uninterrupted whole-layer structure, the packaging effect of the packaging layer 70 on the light-emitting device and the display substrate 100 is ensured, and the invasion of external water vapor caused by the breakage of the packaging layer 70 is avoided.

It is understood that, as shown in fig. 6, the sum of the thickness H ₁ of the first encapsulation portion 701, the thickness H ₆ of the dimming layer 80, the thickness H ₅ of the cathode layer 60, and the thickness H ₄ of the light emitting layer 50 may be smaller than the thickness H ₃ of the isolation structure 40.

The embodiment of the disclosure also provides a preparation method of the display substrate 100, which is used for preparing the display substrate 100. As shown in fig. 9, the preparation method includes: s100 to S300.

S100, as shown in fig. 10, a back plate 10 is provided.

For the description of the back plate 10, reference may be made to the description of some of the above embodiments of the present disclosure, and the description is omitted here.

S200, as shown in fig. 11, a plurality of anodes 31, a pixel defining layer 20, and an isolation structure 40 are sequentially formed on the back plate 10. The pixel defining layer 20 defines a plurality of first openings 21. A first opening 21 exposes at least a portion of an anode 31. The isolation structure 40 defines a plurality of second openings 41. The front projection of a first opening 21 onto the back plate 10 is located within the front projection of a second opening 41 onto the back plate 10.

For example, an anode film may be formed using a sputtering process, and then the anode film may be subjected to a patterning process to form the anode layer 30 including the plurality of anodes 31 disposed at intervals. For example, the material of the anode 31 may be an Oxide such as ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide ), or the like, and the material of the anode 31 may also be a composite material such as a composite material composed of a metal material and an Oxide material such as Ag (Argentum, silver)/ITO, al (Aluminum)/ITO, ag/IZO, al/IZO, or the like.

Illustratively, a pixel defining film is formed on the anode layer 30, and the pixel defining film is patterned to form the pixel defining layer 20 defining the plurality of first openings 21. For example, the pixel defining layer 20 has a certain thickness, and the first opening 21 has a certain depth.

For example, the material of the pixel defining layer 20 may include an organic material.

Illustratively, the isolation film may be formed using a sputtering process, and the isolation film may be patterned, e.g., etched, to form the isolation structure 40 defining the plurality of second openings 41.

For example, a first sub-film, a second sub-film, and a third sub-film are sequentially formed, and then the first sub-film, the second sub-film, and the third sub-film are etched to form a first sub-layer 401 defining a plurality of third openings 4011, a second sub-layer 402 defining a plurality of fourth openings 4021, and a third sub-layer 403 defining a plurality of fifth openings 4031. The first sub-layer 401, the second sub-layer 402 and the third sub-layer 403 constitute the isolation structure 40.

Illustratively, the material of the isolation structure 40 includes a metallic material. For example, the first sub-layer 401 and the third sub-layer 403 are made of the same material and are both Ti (Titanium), and the second sub-layer 402 may be made of Al. Therefore, the first sub-film, the second sub-film and the third sub-film can be etched by using a suitable etching material, and the etching rate of the etching material to the material of the second sub-film is relatively higher than that of the etching material to the material of the first sub-film and the material of the third sub-film, so that the cross-sectional shape of the isolation structure 40 is approximately in an "I" shape, the difficulty of the first cathode 601 and the first sub-layer 401 contacting each other is further reduced, the effective connection between the parts of the first cathode 601 corresponding to different first openings 21 is ensured, and the improvement of the display uniformity of the display substrate 100 is facilitated.

The material of the isolation structure 40 may, of course, be other conductive materials, may be selected as desired, and embodiments of the present disclosure are not limited in this respect,

S300, as shown in fig. 12, a light emitting layer 50, a cathode layer 60 and an encapsulation layer 70 are sequentially formed on the isolation structure 40 and the pixel defining layer 20. The light emitting layer 50 includes a first light emitting portion 501 and a second light emitting portion 502 that are disconnected from each other. The first light emitting portions 501 are at least located in the first openings 21, and the second light emitting portions 502 are located at a side of the isolation structure 40 away from the back plate 10. The cathode layer 60 includes a first cathode portion 601 and a second cathode portion 602 that are disconnected from each other. The first cathode portion 601 is located at least in a region corresponding to the second opening 41, and the first cathode portion 601 is in contact with the isolation structure 40. The second cathode portion 602 is located at a side of the second light emitting portion 502 away from the isolation structure 40. The encapsulation layer 70 includes a first encapsulation part 701, a second encapsulation part 702, and a third encapsulation part 703. The first encapsulation part 701 is located at a side of the first cathode part 601 remote from the first light emitting part 501. The second encapsulation portion 702 is located on a side of the second cathode portion 602 away from the second light emitting portion 502, a side of the second cathode portion 602, and a side of the second light emitting portion 502. The third encapsulation portion 703 is in contact with the sidewall of the second opening 41. The third package portion 703 is connected to the first package portion 701 and the second package portion 702, and the first package portion 701 is connected to the second package portion 702.

For example, the light emitting layer 50 and the cathode layer 60 may be sequentially formed using an evaporation process.

For example, the material of the light emitting layer 50 includes an organic material.

For example, the material of the cathode layer 60 includes a metal material such as Al, ag, mg (Magnesium), or the like. As another example, the material of the cathode may also include an alloy material.

Illustratively, the encapsulation layer 70 includes at least one inorganic encapsulation layer, and the material of the inorganic encapsulation layer is an inorganic material having a water-oxygen barrier property, so that the inorganic encapsulation layer or the encapsulation layer 70 can increase the water-oxygen barrier property of the display substrate 100. Specifically, the inorganic material may be one or more of silicon oxide, silicon nitride, silicon oxynitride, and the like. The inorganic encapsulation layer or layers 70 may be formed using a CVD (Chemical Vapor Deposion, chemical vapor deposition) process.

In this way, in the display substrate 100 formed by the above-mentioned preparation method, the first package portion 701, the second package portion 702 and the third package portion 703 form the continuous and uninterrupted package layer 70, and the package layer 70 is used to package the light emitting layer 50 and the cathode layer 60, so that the package effect of the package layer 70 is better, which is beneficial to improving the light emitting effect and the service life of the light emitting device, and avoiding that water vapor and the like easily invade into the light emitting device from the intermittent portion to affect the light emitting performance of the light emitting device due to the intermittent portion of the package layer 70.

It will be appreciated that the structure of the isolation structure 40 may refer to the description of some embodiments of the disclosure, and will not be repeated herein.

In the following, a case where the isolation structure 40 includes a plurality of sub-isolation structures 42, adjacent sub-isolation structures 42 are connected, and part of sidewalls of two second openings 41 defined by adjacent sub-isolation structures 42 are shared will be described as an example.

In some examples, as shown in fig. 12, the plurality of first openings 21 at least includes: a plurality of first sub-ports 211, a plurality of second sub-ports 212, and a plurality of third sub-ports 213.

In S300, the light-emitting layer 50 and the cathode layer 60 are sequentially formed on the isolation structure 40 and the pixel defining layer 20, and the method includes: s310 to S340.

As shown in fig. 13, a first lift-off pattern 90 is formed, and a portion of the first lift-off pattern 90 fills the second sub-opening 212 and the corresponding second opening 41 and extends to a portion of the isolation structure 40 around the second sub-opening 212, and another portion of the first lift-off pattern 90 fills the third sub-opening 213 and the corresponding second opening 41 and extends to a portion of the isolation structure 40 around the third sub-opening 213.

Illustratively, the first release layer is formed and then patterned to form the first release pattern 90.

S320, as shown in fig. 14, a first light emitting film 503 is formed. The first light emitting film 503 is at least located in the first sub-aperture 211, on a portion of the isolation structure 40 adjacent to the first sub-aperture 211, and on the first lift-off pattern 90.

For example, the first light emitting film 503 is further in contact with the sidewall of the first sub-opening 211 and extends onto a portion of the pixel defining layer 20 adjacent to the first sub-opening 211.

Since there is a level difference between the isolation structure 40 and the first sub-aperture 211, a level difference between the first sub-aperture 211 and the first peeling pattern 90 in the thickness direction of the back plate 10, a portion of the first light emitting film 503 located within the first sub-aperture 211, a portion of the first light emitting film 503 located on the first peeling pattern 90, and a portion of the first light emitting film 503 located on a portion of the isolation structure 40 adjacent to the first sub-aperture 211 are disconnected.

Therefore, the first peeling pattern 90 can be used to block the second sub-opening 212 and the corresponding second opening 41, the third sub-opening 213 and the corresponding second opening 41, so as to prevent the material of the first light emitting film 503 from falling into the second sub-opening 212 and the corresponding second sub-opening 212, the third sub-opening 213 and the corresponding second opening 41, thereby facilitating the subsequent formation of the first light emitting portion 501 of the light emitting layer 50.

Illustratively, the portion of the first light-emitting film 503 located in the first opening 21 has a second gap G2 with the isolation structure 40.

The portion of the first light emitting film 503 located in the first opening 21 and close to the second gap G2 is a stepped structure. The height of the stepped structure gradually decreases in a direction in which the second opening 41 corresponding to the first opening 21 is directed toward the second gap G2.

Thereby, it is possible to secure a stepped structure (refer to broken lines in fig. 7A) of the first light emitting portion 501 formed near the second gap G2. The height of the stepped structure gradually decreases in a direction in which the first light emitting portion 501 is directed toward the second gap G2.

For example, the first light emitting film 503 may be formed using an evaporation process.

In the case where the light-emitting layer 50 includes the light-emitting sub-layer 51 and at least one light-emitting functional layer FL, for example, the light-emitting layer 50 includes a hole transport layer, a light-emitting sub-layer 51, and an electron transport layer which are sequentially stacked on an anode, and the first light-emitting thin film 503 includes: a hole transporting film, a light emitting sub film, and an electron transporting film.

Sequentially evaporating the material of the hole transport layer, the material of the luminescent sub-layer and the material of the electron transport layer to form a hole transport film, a luminescent sub-film and an electron transport film. For example, the vapor deposition angle of the display substrate to be vapor deposited in the vapor deposition process of the hole transport film is equal to or substantially equal to the vapor deposition angle of the display substrate to be vapor deposited in the vapor deposition process of the light emitting sub-film. The vapor deposition angle of the display substrate to be vapor deposited in the vapor deposition process of the light-emitting sub-film is larger than or slightly larger than the vapor deposition angle of the display substrate to be vapor deposited in the vapor deposition process of the electron transport film, so that the vapor deposition area of the electron transport layer material is slightly smaller than the vapor deposition area of the material of the light-emitting sub-layer, thereby being convenient for forming the stepped structure of the first light-emitting film 503.

The vapor deposition angle of the display substrate 100 to be vapor deposited refers to an angle between the plane of the display substrate 100 to be vapor deposited and the reference plane CP.

S330, as shown in fig. 14, a first cathode film 603 is formed on the first light emitting film 503. The first cathode film 603 covers the first light emitting film 503. The first cathode film 603 is in contact with the isolation structure 40.

For example, the front projection of the first light emitting film 503 on the back plate 10 is located within the front projection range of the first cathode film 603 on the back plate 10.

For example, a portion of the first cathode film 603 is located in a region opposite to the first sub-opening 211, and the portion further extends onto the first sub-layer 401 of the isolation structure 40 along the sidewall direction of the first sub-opening 211, so as to contact the isolation structure 40.

It can be understood that the portion of the first cathode film 603 facing the first sub-opening 211, the portion of the first cathode film 603 facing the isolation structure 40, and the portion of the first cathode film 603 facing the first peeling pattern 90 are separated from each other in the thickness direction of the back plate 10.

Thus, the first peeling pattern 90 can be used to block the second sub-opening 212 and the second sub-opening 212 corresponding thereto, and the third sub-opening 213 and the second sub-opening 212 corresponding thereto, thereby preventing the material of the first cathode film 603 from falling into the second sub-opening 212 corresponding to the second sub-opening 212 and the second opening 41 corresponding to the third sub-opening 213, and facilitating the subsequent formation of the first cathode portion 601 of the cathode layer 60.

As shown in fig. 15, the first peeling pattern 90, the portion of the first light emitting film 503 located on the first peeling pattern 90, and the portion of the first cathode film 603 located on the first peeling pattern 90 are removed by a peeling process, and the portion of the first light emitting film 503 located in the first sub-aperture 211 remains to form a first light emitting layer 5011, and the first light emitting layer 5011 forms a part of the first light emitting portion 501. The first cathode layer 6011 is formed while leaving the portion of the first cathode film 603 corresponding to the first sub-opening 211 and the portion in contact with the isolation structure 40, and the first cathode layer 6011 constitutes a part of the first cathode portion 601.

Thus, the preparation of the first light emitting device is completed. As can be seen from the above, the first cathode layer 6011, the first light-emitting layer 5011, and the corresponding anode 31 constitute a first light-emitting device.

For example, the display substrate 100 to be peeled is placed in a peeling liquid, and the first peeling pattern 90, the portion of the first light emitting film 503 located on the first peeling pattern 90, and the portion of the first cathode film 603 located on the first peeling pattern 90 are removed.

It is understood that the portion of the first light emitting film 503 disposed on the portion of the isolation structure 40 adjacent to the first sub-aperture 211 is also reserved to form a part of the second light emitting portion 502. The portion of the first cathode film 603 located on the second light-emitting portion 502 is also left, and constitutes a part of the second cathode portion 602.

In addition, since the first light emitting film 503 is disconnected from the first light emitting film 503 at the portion located in the first sub-opening 211, the portion located on the first peeling pattern 90 of the first light emitting film 503, and the portion located on the portion adjacent to the first sub-opening 211 of the isolation structure 40, the portion located in the first sub-opening 211 of the first light emitting film 503 and the portion located on the portion adjacent to the first sub-opening 211 of the first light emitting film 503 of the isolation structure 40 are not affected during the process of removing the portion located on the first peeling pattern 90 of the first light emitting film 503, and thus the preparation of the first light emitting layer 5011 and the first light emitting portion 501 are not affected, and the structural integrity of the first light emitting layer 5011 and the first light emitting portion 501 is ensured. And the first cathode film 603 is disconnected from the first sub-opening 211, the first cathode film 603 is disconnected from the isolation structure 40, and the first cathode film 603 is disconnected from the first peeling pattern 90. In the process of removing the portion of the first cathode film 603 located on the first lift-off pattern 90, the portion of the first cathode film 603 opposite to the first sub-opening 211 and the portion of the first cathode film 603 opposite to the isolation structure 40 are not affected, and thus the preparation of the first cathode layer 6011 and the first cathode portion 601 is not affected, and the structural integrity of the first cathode layer 6011 and the first cathode portion 601 is ensured.

In one implementation, as shown in fig. 16, in the process of the preparation method of the display substrate 100, sequentially forming the light emitting layer 50 and the cathode layer 60 on the isolation structure 40 and the pixel defining layer 20 includes: a first light emitting film 503, a first cathode film 603, and a first encapsulation film 704 are formed on the pixel defining layer 20 and the isolation structure 40, a portion of the first light emitting film 503 is located on the isolation structure 40, another portion of the first light emitting film 503 is located at least in the first sub-opening 211, the second sub-opening 212, and the third sub-opening 213, the first cathode film 603 covers the first light emitting film 503, and the first encapsulation film 704 covers a portion of the sides of the first light emitting film 503 and the isolation structure 40 (refer to (a) in fig. 16). Removing the part of the first light-emitting film 503 located in the second sub-opening 212 and the part of the first light-emitting film 503 located in the third sub-opening 213 by adopting an etching process, and reserving the part of the first light-emitting film 503 located in the first sub-opening 211 to form a first light-emitting layer 5011; removing the portion of the first cathode film 603 corresponding to the second sub-opening 212 and the portion of the first cathode film 603 corresponding to the third sub-opening 213, and reserving the portion of the first cathode film 603 corresponding to the first sub-opening 211 to form a first cathode layer 6011; the portion of the first encapsulation film 704 corresponding to the second sub-opening 212 and the portion corresponding to the third sub-opening 213 are removed, and the portion of the first encapsulation film 704 corresponding to the first sub-opening 211 is left, thereby forming a first encapsulation layer 705 (see fig. 16 (b) and 16 (c)). Thus, the first light emitting layer 5011 and the corresponding anode 31 and first cathode layer 6011 constitute a first light emitting device. However, during the process of forming the first light emitting layer 5011 by using the etching process, the exposed anode surfaces of the second sub-opening 212 and the third sub-opening 213 may be damaged, resulting in uneven surface of the anode 31 or incomplete structure of the anode 31, thereby affecting the light emitting effect of the light emitting device including the anode 31. In addition, in the etching process of the first light-emitting film 503 and the first cathode film 603, oxygen can be generally used for dry etching, however, the first cathode film can generate byproducts in the etching process, and the byproducts are not easy to volatilize and easily pollute the cavity of the etching equipment, so that the service life of the etching equipment is not prolonged.

The embodiment of the disclosure adopts the stripping process to form the first light emitting device, and the stripping process does not damage the anode 31, so as to ensure the surface flatness and structural integrity of the anode 31 and ensure the light emitting effect of the light emitting device. And in addition, gas pollutants can not be generated in the preparation process, so that the pollution to the cavity of the etching equipment is avoided, and the service life of the preparation equipment is prolonged.

In some examples, in S310, as shown in fig. 14, forming the first lift-off pattern 90 includes: a first sacrificial pattern 91 and a first photolithography pattern 92 are sequentially formed on the region corresponding to the second sub-opening 212 and the third sub-opening 213 and a portion of the isolation structure 40 around the same. The first sacrificial pattern 91 fills the second sub-opening 212 and the corresponding second opening 41 thereof, and fills the third sub-opening 213 and the corresponding second opening 41 thereof, and the first sacrificial pattern 91 also covers a portion of the isolation structure 40. The orthographic projection of the first sacrificial pattern 91 on the back plate 10 is located within the orthographic projection range of the first lithographic pattern 92 on the back plate 10.

The first sacrificial pattern 91 and the first photolithography pattern 92 constitute the first lift-off pattern 90 described above. The first sacrificial pattern 91 may be dissolved in the stripping solution, so as to achieve the effect of removing the first sacrificial pattern 91 and the first photolithography pattern 92 thereon.

For example, the material of the first sacrificial pattern 91 includes an organic material. The material of the first photolithography pattern 92 includes a photoresist material.

For example, a first sacrificial film and a first photolithography film are formed by a coating process, and the first sacrificial film and the first photolithography film are exposed and developed to form a first sacrificial pattern 91 and a first photolithography pattern 92.

Illustratively, the thickness of the first sacrificial pattern 91 is relatively large, greater than the thickness of the first photolithographic pattern 92.

For example, the surface of the first sacrificial pattern 91 on the side away from the back plate 10 is higher than the surface of the isolation structure 40 on the side away from the back plate 10.

The area of the orthographic projection of the first photolithographic pattern 92 on the back plate 10 is larger than the area of the orthographic projection of the first sacrificial pattern 91 on the back plate 10.

In some examples, in S330, as shown in fig. 14, forming a first cathode film 603 on the first light emitting film 503 includes: the first cathode film 603 is formed using an evaporation process. As shown in fig. 17, in the vapor deposition process of the first cathode film 603, the range of the vapor deposition angle γ of the display substrate 100 to be vapor deposited includes: 0-30 deg.

The vapor deposition angle of the display substrate 100 to be vapor deposited refers to an angle between the plane of the display substrate 100 to be vapor deposited and the reference plane CP. The reference plane CP here may be a horizontal plane. For example, the vapor deposition angle of the display substrate 100 to be vapor deposited is 0 °, which means that the plane of the display substrate 100 to be vapor deposited is a horizontal plane. For another example, the evaporation angle of the display substrate 100 to be evaporated is 0 °, which means that the included angle between the plane of the display substrate 100 to be evaporated and the horizontal plane is 30 °.

For example, in the vapor deposition process of the first cathode film 603, the display substrate 100 to be vapor deposited is rotated at a certain speed, and in the process of rotation, the vapor deposition angle of the display substrate 100 to be vapor deposited is varied in the range of 0 ° to 30 °.

It is understood that, in the vapor deposition process, the vapor deposition source vapor-deposits the vapor deposition material to the display substrate 100 to be vapor deposited. For example, the vapor deposition source evaporates the material of the cathode layer to the display substrate 100 to be evaporated. In the case where the evaporation angle range of the display substrate 100 to be evaporated includes 0 ° to 30 °, it may be ensured that the material of the cathode layer 60 can be evaporated onto the first sub-layer 401 of the isolation structure 40, so as to ensure that the formed first cathode layer 6011 or the first cathode portion 601 contacts the first sub-layer 401, further ensure that the first cathode portion 601 in the cathode layer 60 is effectively electrically connected with the first sub-layer 401, which is beneficial to reducing the difference of voltages transmitted by portions corresponding to different first openings 21 in the first cathode portion 601, and improving the display uniformity of the display substrate 100.

In some examples, in S300, the light emitting layer 50 and the cathode layer 60 are sequentially formed on the isolation structure 40 and the pixel defining layer 20, and further includes: S350-S380.

S350, as shown in fig. 18, a second lift-off pattern 93 is formed. A portion of the second lift-off pattern 93 fills the third sub-opening 213 and the corresponding second opening 41 thereof, and extends onto a portion of the isolation structure 40 around the third sub-opening 213, and another portion of the second lift-off pattern 93 covers the first cathode layer 6011 and fills the corresponding second opening 41 of the first sub-opening 211, and extends onto a portion of the isolation structure 40 around the first sub-opening 211.

For example, the second lift-off pattern 93 includes a second sacrificial pattern 94 and a second photolithography pattern 95. The material and the forming process of the second sacrificial pattern 94 may be the same as those of the first sacrificial pattern 91 in the above-described embodiment. Also, the materials and formation processes of the second lithographic pattern 95 may be referred to in some of the embodiments described above with respect to the first lithographic pattern 92.

S360, as shown in fig. 19, a second light emitting film 504 is formed. The second light emitting film 504 is at least located in the second sub-aperture 212, on a portion of the isolation structure 40 adjacent to the second sub-aperture 212, and on the second lift-off pattern 93.

For example, the second light emitting film 504 is also in contact with the sidewall of the second sub-aperture 212 and extends onto a portion of the pixel defining layer 20 adjacent to the second sub-aperture 212.

Since there is a step between the isolation structure 40 and the second sub-aperture 212, a step between the second sub-aperture 212 and the second peeling pattern 93 in the thickness direction of the back plate 10, a portion of the second light emitting film 504 located within the second sub-aperture 212, a portion of the second light emitting film 504 located on the second peeling pattern 93, and a portion of the second light emitting film 504 located on a portion of the isolation structure 40 adjacent to the second sub-aperture 212 are separated.

In this way, the second peeling pattern 93 can be used to block the third sub-opening 213 and the second opening 41 corresponding to the second sub-opening 41 and the second opening 41 corresponding to the first sub-opening 211 and the first cathode layer 6011, so as to prevent the material of the second light emitting film 504 from falling into the third sub-opening 213 and the second opening 41 corresponding to the third sub-opening and onto the first cathode layer 6011, thereby facilitating the subsequent formation of the first light emitting portion 501 of the light emitting layer 50.

S370, as shown in fig. 19, a second cathode film 604 is formed on the second light emitting film 504. The second cathode film 604 covers the second light emitting film 504. The second cathode film 604 is in contact with the isolation structure 40.

For example, the front projection of the second luminescent film 504 onto the back plate 10 is within the front projection of the second cathode film 604 onto the back plate 10.

For example, a portion of the second cathode film 604 is located in a region opposite to the second sub-opening 212, and the portion also extends onto the first sub-layer 401 of the isolation structure 40 in the direction of the sidewall of the second sub-opening 212, so as to make contact with the isolation structure 40.

It is understood that the portion of the second cathode film 604 facing the second sub-opening 212, the portion of the second cathode film 604 facing the isolation structure 40, and the portion of the second cathode film 604 facing the second peeling pattern 93 are separated from each other in the thickness direction of the back plate 10.

In this way, the second peeling pattern 93 can be used to block the third sub-opening 213, the second sub-opening 212 corresponding thereto, and the first cathode layer 6011, so as to prevent the material of the second cathode film 604 from falling onto the second sub-opening 212 corresponding to the third sub-opening 213 and the first cathode layer 6011, thereby facilitating the subsequent formation of the first cathode portion 601 of the cathode layer 60.

As shown in fig. 20, the second light-emitting layer 5012 is formed by removing the second lift-off pattern 93, the portion of the second light-emitting film 504 located on the second lift-off pattern 93, and the portion of the second cathode film 604 located on the second lift-off pattern 93 by a lift-off process, leaving the portion of the second light-emitting film 504 located in the second sub-aperture 212, and the second light-emitting layer 5012 constitutes a part of the first light-emitting portion 501. The second cathode layer 6012 is formed while leaving the portion of the second cathode film 604 corresponding to the second sub-opening 212 and the portion in contact with the isolation structure 40, and the second cathode layer 6012 constitutes a part of the first cathode portion 601.

Thus, the preparation of the second light emitting device is completed. As can be seen from the above, the second cathode layer 6012, the second light-emitting layer 5012, and the corresponding anode 31 constitute a second light-emitting device.

For example, the display substrate 100 to be peeled is placed in a peeling liquid, and the first peeling pattern 90, the portion of the second light emitting film 504 located on the first peeling pattern 90, and the portion of the second cathode film 604 located on the second peeling pattern 93 are removed.

It is understood that the portion of the second light emitting film 504 disposed on the portion of the isolation structure 40 adjacent to the second sub-aperture 212 is also reserved, and forms a part of the second light emitting portion 502. The portion of the second cathode film 604 located on the second light-emitting portion 502 is also left, constituting a part of the second cathode portion 602.

In addition, since the portion of the second light emitting film 504 located in the second sub-aperture 212, the portion of the first light emitting film located on the second lift-off pattern 93, and the portion of the second light emitting film 504 located on the portion of the isolation structure 40 adjacent to the second sub-aperture 212 are separated from each other, the portion of the second light emitting film 504 located in the second sub-aperture 212 and the portion of the second light emitting film 504 located on the portion of the isolation structure 40 adjacent to the second sub-aperture 212 are not affected during the process of removing the portion of the second light emitting film 504 located on the second lift-off pattern 93, and thus the preparation of the second light emitting layer 5012 and the first light emitting portion 501 are not affected, and the structural integrity of the second light emitting layer 5012 and the first light emitting portion 501 is ensured.

And the part of the second cathode film 604 facing the second sub-opening 212, the part of the second cathode film 604 facing the isolation structure 40, and the part of the second cathode film 604 facing the second peeling pattern 93 are disconnected. In the process of removing the portion of the second cathode film 604 facing the second lift-off pattern 93, the portion of the second cathode film 604 facing the isolation structure 40 and the portion of the second cathode film 604 facing the second lift-off pattern 93 are not affected, and thus the preparation of the second cathode layer 6012 and the first cathode portion 601 is not affected, and the structural integrity of the second cathode layer 6012 and the first cathode portion 601 is ensured.

The embodiment of the disclosure adopts the stripping process to form the second light-emitting device, so that the anode 31 is not damaged, the surface flatness and the structural integrity of the anode 31 are further ensured, and the light-emitting effect of the light-emitting device is ensured. Avoiding pollution to the cavity of etching equipment.

It is understood that the display substrate 100 further includes a third light emitting device, the first light emitting portion 501 further includes a third light emitting layer 5013, the first cathode portion 601 further includes a third cathode layer 6013, and regarding the preparation method of the third light emitting layer 5013, reference may be made to the preparation methods of the first light emitting layer 5011 and the second light emitting layer 5012 in the above embodiments, which are not repeated here. For the preparation method of the third cathode layer 6013, reference may be made to the preparation methods of the first cathode layer 6011 and the second cathode layer 6012 in the above embodiments, and the description thereof will not be repeated here.

In some examples, as shown in fig. 12, in S300, forming the encapsulation layer 70 includes: an encapsulation layer 70 is formed on the cathode layer 60. The front projection of the cathode layer 60 onto the back plate 10 is within the front projection of the encapsulation layer 70 onto the back plate 10.

For the structure of the encapsulation layer 70, reference may be made to the description of some embodiments of the disclosure described above, and the description is omitted here.

In some examples, prior to forming encapsulation layer 70, the method of making further comprises: on the cathode layer 60, a dimming layer 80 is formed. The dimming layer 80 covers at least a portion of the first cathode portion 601.

For example, the dimming layer 80 also covers the second cathode portion 602. The dimming layer 80 is disconnected between the portion located on the first cathode portion 601 and the portion located on the second cathode portion 602.

For example, the dimming layer 80 includes a first sub-portion 81 and a second sub-portion 82 stacked in order.

For example, the material of the first sub-portion 81 includes an organic material. The material of the second sub-portion 82 includes lithium fluoride (LiF).

The foregoing is merely a specific embodiment of the disclosure, but the protection scope of the disclosure is not limited thereto, and any person skilled in the art who is skilled in the art will recognize that changes or substitutions are within the technical scope of the disclosure. Therefore, the protection scope of the present disclosure shall be subject to the protection scope of the claims.

Claims

1. A display substrate, characterized in that the display substrate comprises:

A back plate;

a plurality of anodes and a pixel defining layer disposed on one side of the back plate, the pixel defining layer defining a plurality of first openings; one of the first openings exposes at least a portion of one of the anodes;

an isolation structure arranged on one side of the pixel defining layer away from the backboard; the isolation structure defines a plurality of second openings; the orthographic projection of one first opening on the backboard is positioned in the orthographic projection range of one second opening on the backboard;

a light emitting layer including a first light emitting portion and a second light emitting portion that are disconnected from each other; the first light-emitting parts are at least positioned in the first openings, and the second light-emitting parts are positioned at one side of the isolation structure away from the backboard;

A cathode layer including a first cathode portion and a second cathode portion disconnected from each other; a part of the first cathode part is positioned in a region corresponding to the second opening, and the other part of the first cathode part is in contact with the isolation structure; the second cathode part is positioned at one side of the second light-emitting part far away from the isolation structure;

The packaging layer comprises a first packaging part, a second packaging part and a third packaging part; the first packaging part is positioned at one side of the first cathode part far away from the first light-emitting part; the second packaging part is positioned on one side of the second cathode part away from the second light-emitting part, the side surface of the second cathode part and the side surface of the second light-emitting part; the third packaging part is contacted with the side wall of the second opening; the third packaging part is connected with the first packaging part and the second packaging part.

2. The display substrate according to claim 1, wherein a connection between a surface of the second encapsulation portion on a side of the second cathode portion remote from the second light emitting portion and a surface of the second encapsulation portion on a side remote from the second cathode portion is arc-shaped.

3. The display substrate of claim 1, wherein the first encapsulation portion is connected to the second encapsulation portion.

4. The display substrate of claim 1, wherein the isolation structure comprises: a plurality of sub-isolation structures, one of said sub-isolation structures defining one of said second openings; the sub isolation structures are arranged at intervals, or the adjacent sub isolation structures are connected, and partial side walls of two second openings defined by the adjacent two sub isolation structures are shared.

5. The display substrate of claim 1, wherein the isolation structure comprises: the first sub-layer, the second sub-layer and the third sub-layer are sequentially stacked along the direction perpendicular to and far away from the back plate;

The first cathode part is in contact with the first sub-layer, or the first cathode part is in contact with the first sub-layer and the second sub-layer;

The first sub-layer defines a plurality of third openings; the second sub-layer defines a plurality of fourth openings; the third sub-layer defines a plurality of fifth openings; the front projection of the third opening on the backboard and the front projection of the fifth opening on the backboard are both positioned in the front projection range of the fourth opening on the backboard; the corresponding third opening, fourth opening and fifth opening form a second opening.

6. The display substrate according to claim 5, wherein a first gap is provided between a sidewall of the second opening and the first cathode portion; the third packaging part is filled in the first gap, and the thickness H ₁ of the first packaging part and the thickness H ₂ of the second sub-layer meet the following conditions: h ₁≥0.5H₂.

7. The display substrate according to claim 5, wherein a first gap is provided between a sidewall of the second opening and the first cathode portion; the third encapsulation fills a portion of the first gap, and the thickness H ₁ of the first encapsulation and the thickness H ₂ of the second sub-layer satisfy: h ₁＜0.5H₂.

8. The display substrate according to claim 5, wherein an included angle α between a side surface of the second light emitting portion and a plane in which the back plate is located satisfies: alpha is more than or equal to 45 degrees and less than or equal to 60 degrees.

9. The display substrate according to claim 1, wherein a second gap is provided between the first light emitting portion and the isolation structure.

10. The display substrate according to claim 1, wherein a portion of the first light-emitting portion adjacent to the second gap is a stepped structure; the height of the step-like structure gradually decreases along the direction in which the first light emitting portion is directed toward the second gap.

11. The display substrate according to claim 1, wherein a thickness H ₃ of the isolation structure and a thickness H ₄ of the light emitting layer satisfy: h ₃＞H₄.

12. The display substrate according to claim 1, wherein a dimension L of a contact portion of the first cathode portion and the isolation structure in the first direction satisfies: l is more than or equal to 200nm; the first direction is a direction pointing from a center of the first opening toward a side wall of the first opening.

13. The display substrate according to claim 1, wherein a thickness H ₅ of the cathode layer satisfies: h ₅ nm to 20nm.

14. The display substrate of claim 1, wherein the display substrate further comprises: a dimming layer located between the cathode layer and the encapsulation layer; the dimming layer comprises a first sub-part and a second sub-part which are sequentially stacked;

the refractive index of the second sub-portion is smaller than that of the first sub-portion; and/or, the refractive index of the second sub-part is smaller than that of the packaging layer.

15. The display substrate according to claim 14, wherein a thickness H ₆ of the dimming layer is less than or equal to a thickness H ₁ of the first encapsulation portion.

16. The display substrate according to claim 14, wherein a sum of a thickness H ₁ of the first encapsulation portion, a thickness H ₆ of the light modulation layer, a thickness H ₅ of the cathode layer, and a thickness H ₄ of the light emitting layer is greater than or equal to a thickness H ₃ of the isolation structure.

17. A method for manufacturing a display substrate, the method comprising:

Providing a back plate;

sequentially forming a plurality of anodes, pixel defining layers and isolation structures on the backboard; the pixel defining layer defines a plurality of first openings; one of the first openings exposes at least a portion of one of the anodes; the isolation structure defines a plurality of second openings; the orthographic projection of one first opening on the backboard is positioned in the orthographic projection range of one second opening on the backboard;

Forming a light-emitting layer, a cathode layer and a packaging layer on the isolation structure and the pixel defining layer in sequence; the light-emitting layer comprises a first light-emitting part and a second light-emitting part which are disconnected from each other; the first light-emitting parts are at least positioned in the first openings, and the second light-emitting parts are positioned at one side of the isolation structure away from the backboard; the cathode layer comprises a first cathode part and a second cathode part which are disconnected with each other; the first cathode part is at least positioned in a region corresponding to the second opening, and the first cathode part is in contact with the isolation structure; the second cathode part is positioned at one side of the second light-emitting part far away from the isolation structure; the packaging layer comprises a first packaging part, a second packaging part and a third packaging part; the first packaging part is positioned at one side of the first cathode part far away from the first light-emitting part; the second packaging part is positioned on one side of the second cathode part away from the second light-emitting part, the side surface of the second cathode part and the side surface of the second light-emitting part; the third packaging part is contacted with the side wall of the second opening; the third packaging part is connected with the first packaging part and the second packaging part.

18. The method of manufacturing of claim 17, wherein the first encapsulation is connected to the second encapsulation.

19. The method of manufacturing of claim 17, wherein the plurality of first openings comprises at least: a plurality of first sub-ports, a plurality of second sub-ports, and a plurality of third sub-ports;

forming a light emitting layer and a cathode layer on the isolation structure and the pixel defining layer in sequence, including:

forming a first stripping pattern, wherein one part of the first stripping pattern is filled in the second sub-opening and the corresponding second opening thereof and extends to a part of the isolation structure around the second sub-opening, and the other part of the first stripping pattern is filled in the third sub-opening and the corresponding second opening thereof and extends to a part of the isolation structure around the third sub-opening;

Forming a first light-emitting film; the first luminous film is at least positioned in the first sub-opening, on the part, adjacent to the first sub-opening, of the isolation structure and on the first stripping pattern;

Forming a first cathode film on the first light-emitting film; the first cathode film covers the first light-emitting film; the first cathode film is in contact with the isolation structure;

Removing the first stripping pattern, the part of the first luminescent film positioned on the first stripping pattern and the part of the first cathode film positioned on the first stripping pattern by adopting a stripping process, and reserving the part of the first luminescent film positioned in the first sub-opening to form a first luminescent layer, wherein the first luminescent layer forms a part of the first luminescent part; and reserving a part corresponding to the first sub-opening and a part contacted with the isolation structure in the first cathode film to form a first cathode layer, wherein the first cathode layer forms a part of the first cathode part.

20. The method of preparing according to claim 19, wherein the forming the first lift-off pattern comprises:

Sequentially forming a first sacrificial pattern and a first photoetching pattern on a part of the isolation structure around and in the area corresponding to the second sub-opening and the third sub-opening; the first sacrificial pattern is filled in the second sub-opening and the corresponding second opening, and is filled in the third sub-opening and the corresponding second opening, and the first sacrificial pattern also covers a part of the isolation structure; and the orthographic projection of the first sacrificial pattern on the backboard is positioned in the orthographic projection range of the first photoetching pattern on the backboard.

21. The method of claim 19, wherein forming a first cathode film on the first luminescent film comprises:

forming a first cathode film by adopting an evaporation process; in the evaporation process of the first cathode film, the range of evaporation angles of the display substrate to be evaporated includes: 0-30 deg.

22. The method of claim 19, wherein a second gap is provided between the portion of the first luminescent film located within the first opening and the isolation structure;

the part of the first luminous film, which is positioned in the first opening and is close to the second gap, is of a ladder-shaped structure; the height of the step-shaped structure gradually decreases along the direction that the second opening corresponding to the first opening points to the second gap.

23. The method of claim 19, wherein forming a light emitting layer and a cathode layer on the isolation structure and the pixel defining layer sequentially, further comprises:

Forming a second lift-off pattern; a part of the second stripping pattern is filled in the third sub-opening and the corresponding second opening thereof and extends to a part of the isolation structure around the third sub-opening, and the other part of the second stripping pattern covers the first cathode layer and is filled in the second opening corresponding to the first sub-opening and extends to a part of the isolation structure around the first sub-opening;

forming a second light-emitting film; the second luminous film is at least positioned in the second sub-opening, on the part, adjacent to the second sub-opening, of the isolation structure and on the second stripping pattern;

forming a second cathode film on the second light emitting film; the second cathode film covers the second light-emitting film; the second cathode film is in contact with the isolation structure;

Removing the second stripping pattern, the part of the second luminescent film positioned on the second stripping pattern and the part of the second cathode layer positioned on the second stripping pattern by adopting a stripping process, and reserving the part of the second luminescent film positioned in the second sub-opening to form a second luminescent layer, wherein the second luminescent layer forms a part of the first luminescent part; and reserving a part corresponding to the second sub-opening and a part contacted with the isolation structure in the second cathode film to form a second cathode layer, wherein the second cathode layer forms a part of the first cathode part.

24. The method of manufacturing of claim 17, wherein forming the encapsulation layer comprises:

Forming an encapsulation layer on the cathode layer; and the orthographic projection of the cathode layer on the backboard is positioned in the orthographic projection range of the packaging layer on the backboard.

25. A display device, comprising: the display substrate according to any one of claims 1 to 16, or a display substrate produced by the production method of the display substrate according to any one of claims 17 to 24.