CN118168383A - Heat exchange equipment and thermal management system - Google Patents

Abstract

The application discloses heat exchange equipment, which comprises a plurality of plates, wherein the plates are stacked to form a supercooling part and an evaporating part; the supercooling part has a first flow passage and a second flow passage isolated from each other, the evaporating part has a third flow passage and a fourth flow passage isolated from each other, and an outlet of the first flow passage can communicate with an inlet of the third flow passage. According to the application, the supercooling part and the evaporating part are formed by stacking the plates, so that the structure is compact, and the occupied space of the heat exchange equipment can be reduced. The application also discloses a thermal management system with less occupied space.

Description

Heat exchange equipment and thermal management system

Technical Field

The application relates to the technical field of heat exchange, in particular to heat exchange equipment and a heat management system.

Background

In the related art, the subcooler and the evaporator are both fixed on the flow passage plate, and communication is realized through the internal channels of the flow passage plate. The arrangement of the flow channel plate makes the communication between the subcooler and the evaporator simpler, but because the flow channel plate needs to be provided with an internal channel and needs to have certain pressure resistance, the volume of the flow channel plate is larger, so that the occupied space of the heat exchange equipment is larger.

Disclosure of Invention

The application aims to provide heat exchange equipment and a heat management system with reduced occupied space.

In order to achieve the above purpose, the present application adopts the following technical scheme:

In a first aspect, a heat exchange apparatus, comprising: a plurality of plates stacked to form a supercooling portion and an evaporating portion; the supercooling part has a first flow passage and a second flow passage isolated from each other, the evaporating part has a third flow passage and a fourth flow passage isolated from each other, and an outlet of the first flow passage can communicate with an inlet of the third flow passage.

According to the application, the supercooling part and the evaporating part are formed by stacking the plates, so that the structure is compact, and the occupied space of the heat exchange equipment can be reduced.

In a second aspect, a thermal management system includes a compressor and the heat exchange device described above, where an inlet of the compressor is in communication with an outlet of the third flow passage when the thermal management system is in an operational state.

In the application, each part is formed by stacking the plates, the outlet of each part is communicated with the inlet of other parts, the inlet of the compressor is communicated with the outlet of the third flow passage, and the heat exchange equipment occupies smaller space, so that the heat management system occupies smaller space.

Drawings

FIG. 1 is a schematic diagram illustrating the connection of one embodiment of a thermal management system of the present application;

FIG. 2 is a schematic view of an embodiment of a heat exchange apparatus of the present application;

FIG. 3 is an exploded schematic view of an embodiment of the heat exchange apparatus of the present application;

FIG. 4 is an exploded schematic view of another embodiment of the heat exchange apparatus of the present application;

FIG. 5 is a schematic illustration in cross-section of an embodiment of the heat exchange apparatus of the present application;

FIG. 6 is a schematic view in cross-section of another embodiment of the heat exchange apparatus of the present application;

FIG. 7 is a schematic illustration in cross-section of yet another embodiment of the heat exchange apparatus of the present application;

FIG. 8 is an enlarged view of FIG. 7 at circle Q;

FIG. 9 is a schematic view in cross-section of yet another embodiment of the heat exchange apparatus of the present application;

Fig. 10 is a schematic view in cross-section of a further embodiment of the heat exchange device of the present application.

Detailed Description

Reference will now be made in detail to exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numbers in different drawings refer to the same or similar elements, unless otherwise indicated. The implementations described in the following exemplary examples do not represent all implementations consistent with the application. Rather, they are merely examples of apparatus and methods consistent with aspects of the application as detailed in the accompanying claims.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in this specification and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

It should be understood that the terms first, second and the like used in the description and the claims do not denote any order, quantity or importance, but rather are used to distinguish one element from another. Likewise, the terms "a" or "an" and the like do not denote a limitation of quantity, but rather denote the presence of at least one; "plurality" means two and more than two. Unless otherwise indicated, the terms "front," "rear," "lower," and/or "upper" and the like are merely for convenience of description and are not limited to one location or one spatial orientation. The word "comprising" or "comprises", and the like, means that elements or items appearing before "comprising" or "comprising" are encompassed by the element or item recited after "comprising" or "comprising" and equivalents thereof, and that other elements or items are not excluded.

The heat exchange apparatus according to an exemplary embodiment of the present application will be described in detail with reference to the accompanying drawings. The features of the examples and embodiments described below may be supplemented or combined with one another without conflict.

According to a specific embodiment of the heat exchange device 7 according to the application, as shown in fig. 1 to 10, the heat exchange device 7 comprises a plurality of plates stacked in the thickness direction of the heat exchange device 7, each plate being substantially sheet-shaped, each plate being substantially rectangular in shape, and the heat exchange device 7 may be a plate heat exchanger. Alternatively, the projected profiles of all plates coincide, i.e. the outer profile dimensions of all plates are the same, on a plane perpendicular to the thickness direction of the heat exchanger device 7. After all the plates are stacked according to a preset rule, the welding can be completed at one time, the process can be simplified, and the appearance is neat. The length direction of the heat exchange device 7 is perpendicular to the stacking direction of the plates, namely the thickness direction of the heat exchange device 7.

In the present embodiment, the heat exchange apparatus 7 includes the supercooling portion 8 and the evaporating portion 3, the supercooling portion 8 has a first flow passage S7 and a second flow passage S8 isolated from each other, the first flow passage S7 is for circulating the refrigerant, the second flow passage S8 is for circulating the cooling liquid, and in the supercooling portion 8, the refrigerant in the first flow passage S7 exchanges heat with the cooling liquid in the second flow passage S8.

The first flow channel S7 includes a first channel 81, a second channel 82 and a plurality of first inter-plate channels (not shown), the second flow channel S8 includes a third channel 83, a fourth channel 84 and a plurality of second inter-plate channels (not shown), the first channel 81 and the second channel 82 are respectively communicated with two sides of the first inter-plate channels, the third channel 83 and the fourth channel 84 are respectively communicated with two sides of the second inter-plate channels, and the first inter-plate channels and the second inter-plate channels are isolated from each other.

The evaporation unit 3 has a third flow path S3 and a fourth flow path S4, and the third flow path S3 and the fourth flow path S4 are isolated from each other. The third flow path S3 is used for circulating a refrigerant, the fourth flow path S4 is used for circulating a coolant, and the refrigerant can exchange heat with the coolant in the evaporator 3, and the refrigerant absorbs heat from the coolant.

The third flow path S3 includes a twelfth orifice 31, a thirteenth orifice 32, and a plurality of seventh inter-plate passages (not shown), the fourth flow path S4 includes a fourteenth orifice 33, a fifteenth orifice 34, and a plurality of eighth inter-plate passages (not shown), the twelfth orifice 31 and the thirteenth orifice 32 are respectively communicated with both sides of the seventh inter-plate passages, the fourteenth orifice 33 and the fifteenth orifice 34 are respectively communicated with both sides of the eighth inter-plate passages, and the seventh inter-plate passages and the eighth inter-plate passages are isolated from each other.

The plurality of plates of the heat exchange device 7 comprises a plurality of first plates a, a plurality of second plates B, a plurality of third plates C, a plurality of fourth plates D, a top plate E and a first intermediate plate M. In the thickness direction of the heat exchange device 7, the first plates a and the second plates B are alternately stacked, the third plates C and the fourth plates D are alternately stacked, the first plates a and the second plates B are positioned at one side of the first intermediate plate M, the third plates C and the fourth plates D are positioned at the other side of the first intermediate plate M, and the plurality of first plates a and the plurality of second plates B are positioned between the top plate E and the first intermediate plate M. The projected outer contours of the first plate a, the second plate B, the third plate C, the fourth plate D, the top plate E and the first intermediate plate M coincide on a plane perpendicular to the thickness direction of the heat exchange device 7.

The top plate E, the first middle plate M, the first plate a, the second plate B, the third plate C, and the fourth plate D each include a first plate portion P3, and the first plate portion P3 of the first plate a, the first plate portion P3 of the second plate B, the first plate portion P3 of the third plate C, the first plate portion P3 of the fourth plate D, the first plate portion P3 of the top plate E, and the first plate portion P3 of the first middle plate M are stacked to form the evaporation portion 3. The third plate C and the fourth plate D each include a second plate portion P4, and the second plate portion P4 of the third plate C and the second plate portion P4 of the fourth plate D are stacked to form the supercooling portion 8. The third plate C and the fourth plate D each include a first bead T3, the first bead T3 being located between the evaporation portion 3 and the supercooling portion 8. The second plate portion P4 and the first plate portion P3 are connected by a first bead T3, and the first bead T3 extends to both side edges in the width direction of the heat exchange device 7.

The front face of each third plate C is opposite to the back face of the adjacent fourth plate D, the back face of the same third plate C is opposite to the front face of the other adjacent fourth plate D, the direction from the back face of the third plate C to the front face of the third plate C is defined as a first direction X, and the direction from the front face of the third plate C to the back face of the third plate C is defined as a second direction Y.

The first convex rib T3 of the third plate C protrudes from the front surface of the third plate C along the first direction X, the first convex rib T3 of the fourth plate D protrudes from the front surface of the fourth plate D along the first direction X, the front surface of the first convex rib T3 of the fourth plate D is in sealing connection with the back surface of the first convex rib T3 of the adjacent third plate C, and the back surface of the first convex rib T3 of the fourth plate D is in sealing connection with the front surface of the first convex rib T3 of the other adjacent third plate C.

The heat exchange device 7 further comprises a reservoir 2, the reservoir 2 having a reservoir chamber 21, the reservoir chamber 21 being capable of communicating with the inlet of the first flow channel S7. The outlet of the reservoir 2 and the inlet of the first flow channel S7 are located on the same side of the plurality of plates. Roof E, first intermediate lamella M, a plurality of first board A and a plurality of second board B pile up formation stock solution portion 2, and stock solution portion 2 and supercooling portion 8 are adjacent to be set up, and stock solution chamber 21 is located between roof E and the first intermediate lamella M, and according to the difference of heat transfer apparatus 7's design, the export of stock solution portion 2 can be located first intermediate lamella M and the region that fretwork hole H8 corresponds, or locates the region that roof E corresponds with fretwork hole H8. Specifically, the area of the top plate E corresponding to the hollowed-out hole H8 is a solid plate, the area of the first middle plate M corresponding to the hollowed-out hole H8 is a solid plate, except for the outlet of the liquid storage part 2, the top plate E seals one side of the liquid storage cavity 21, and the first middle plate M seals the other side of the liquid storage cavity 21. The top plate E and the first middle plate M comprise a third plate part P2, and the hollowed-out hole H8 of the first plate A, the hollowed-out hole H8 of the second plate B, the third plate part P2 of the top plate E and the third plate part P2 of the first middle plate M are stacked to form a liquid storage part 2. The first plate A, the second plate B, the top plate E and the first middle plate M all comprise second convex ribs T2, the second convex ribs T2 are positioned between the liquid storage part 2 and the evaporation part 3, and the third plate part P2 is connected with the first plate part P3 through the second convex ribs T2.

The heat exchange device 7 further comprises a condensation part 1, the condensation part 1 and the liquid storage part 2 are located on the same side of the supercooling part 8 along the thickness direction of the heat exchange device 7, the condensation part 1, the liquid storage part 2 and the supercooling part 8 are located on the same side of the evaporation part 3 along the length direction of the heat exchange device 7, and the heat exchange device 7 is compact in structure due to reasonable arrangement of the condensation part 1, the liquid storage part 2, the evaporation part 3 and the supercooling part 8. The top plate E, the first middle plate M, the plurality of first plates a and the plurality of second plates B are stacked to form a condensing part 1, the condensing part 1 has a fifth flow passage S1 and a sixth flow passage S2, the fifth flow passage S1 and the sixth flow passage S2 are isolated from each other, an outlet 23 of the fifth flow passage S1 is communicated with the liquid storage chamber 21, and the sixth flow passage S2 and the liquid storage chamber 21 are isolated from each other. The fifth flow path S1 and the liquid storage chamber 21 are both used for circulating a refrigerant, the sixth flow path S2 is used for circulating a coolant, and the refrigerant can exchange heat with the coolant in the condensation unit 1, and the coolant is heated by the refrigerant.

The first middle plate M has a fourth through hole M1, a fifth through hole M2, and a sixth through hole M3, the fourth through hole M1 communicates with the inlet of the sixth flow channel S2, the fifth through hole M2 communicates with the outlet of the sixth flow channel S2, and the sixth through hole M3 communicates with the liquid storage chamber 21 and the inlet of the first flow channel S7.

The fifth flow channel S1 includes a ninth orifice 11 and a plurality of fifth inter-plate passages (not shown), the sixth flow channel S2 includes a tenth orifice 12, an eleventh orifice 13 and a plurality of sixth inter-plate passages (not shown), the ninth orifice 11 communicates with the fifth inter-plate passages, the tenth orifice 12 and the eleventh orifice 13 communicate with both sides of the sixth inter-plate passages, respectively, and the fifth inter-plate passages and the sixth inter-plate passages are isolated from each other.

The top plate E, the first middle plate M, the first plate a, and the second plate B each include a fourth plate portion P1, and the fourth plate portion P1 of the first plate a, the fourth plate portion P1 of the second plate B, the fourth plate portion P1 of the top plate E, and the fourth plate portion P1 of the first middle plate M are stacked to form the condensation portion 1. The first plate A, the second plate B, the top plate E and the first middle plate M all comprise a third convex rib T1, and the third convex rib T1 is positioned between the condensing part 1 and the liquid storage part 2. The top plate E and the first middle plate M are connected through a third convex rib T1 between the fourth plate part P1 and the third plate part P2, the hollowed-out hole H8 is positioned between the third convex rib T1 and the second convex rib T2, one side, far away from the second convex rib T2, of the third convex rib T1 is connected with the fourth plate part P1, and one side, far away from the third convex rib T1, of the second convex rib T2 is connected with the first plate part P3.

The heat exchange device 7 further comprises an intermediate heat exchange part 4, and the condensing part 1, the liquid storage part 2, the supercooling part 8 and the evaporating part 3 are positioned on the same side of the intermediate heat exchange part 4 in the thickness direction. Referring to fig. 1 to 5, the intermediate heat exchange portion 4 has a seventh flow passage S5 and an eighth flow passage S6, the seventh flow passage S5 and the eighth flow passage S6 being isolated from each other in the intermediate heat exchange portion 4, an outlet of the first flow passage S7 being capable of communicating with an inlet of the seventh flow passage S5, an outlet of the seventh flow passage S5 communicating with an inlet of the third flow passage S3, an outlet of the third flow passage S3 communicating with an inlet of the eighth flow passage S6, an outlet of the eighth flow passage S6 communicating with an external space of the heat exchange apparatus 7. The seventh flow path S5 and the eighth flow path S6 are both configured to circulate the refrigerant, the refrigerant in the seventh flow path S5 and the refrigerant in the eighth flow path S6 are each configured to flow in the same circuit in different sections, and the refrigerant in the seventh flow path S5 can exchange heat with the refrigerant in the eighth flow path S6 in the intermediate heat exchange portion 4.

The seventh flow path S5 includes a fifth porthole 41, a sixth porthole 42 and a plurality of third plate interspaces (not shown), and the eighth flow path S6 includes a seventh porthole 43, an eighth porthole 44 and a plurality of fourth plate interspaces (not shown), which are isolated from each other in the intermediate heat exchanging portion 4.

The plates of the heat exchange device 7 further comprise a plurality of fifth plates I, a plurality of sixth plates J and a bottom plate G. In the thickness direction of the heat exchange device 7, the fifth plate I and the sixth plate J are alternately stacked, the top plate E, the first plate a, the second plate B, the third plate C, the fourth plate D, and the first intermediate plate M are located at one side of the fifth plate I and the sixth plate J, the bottom plate G is located at the other side of the fifth plate I and the sixth plate J, the first plate a, the second plate B, the third plate C, the fourth plate D, and the first intermediate plate M are located at the same side of the top plate E, and the fifth plate I and the sixth plate J are located at the same side of the bottom plate G. The bottom plate G, the plurality of fifth plates I and the plurality of sixth plates J are stacked to form the intermediate heat exchanging portion 4.

Optionally, the projected profiles of the top plate E, the first intermediate plate M, the bottom plate G, the first plate a, the second plate B, the third plate C, the fourth plate D, the fifth plate I and the sixth plate J coincide in the stacking direction of the plates.

The top plate E has a sixteenth orifice E1, a seventeenth orifice E2, an eighteenth orifice E3, a nineteenth orifice E4, and a twentieth orifice E5, the sixteenth orifice E1 being in communication with the inlet of the fifth flow channel S1, the seventeenth orifice E2 being in communication with the inlet of the sixth flow channel S2, the eighteenth orifice E3 being in communication with the outlet of the sixth flow channel S2, the nineteenth orifice E4 being in communication with the inlet of the fourth flow channel S4, and the twentieth orifice E5 being in communication with the outlet of the fourth flow channel S4.

The plurality of plates further includes a second intermediate plate N on one side of which the top plate E, the first plate a, the second plate B, the third plate C, the fourth plate D and the first intermediate plate M are located, and the bottom plate G, the fifth plate I and the sixth plate J are located on the other side of the second intermediate plate N in the thickness direction of the heat exchange device 7. The third and fourth plates C and D are located between the first and second intermediate plates M and N.

The bottom plate G, the fifth plate I and the sixth plate J each include a fifth plate portion P5, and the fifth plate portion P5 of the fifth plate I, the fifth plate portion P5 of the sixth plate J, the fifth plate portion P5 of the bottom plate G and the second intermediate plate N are stacked to form the intermediate heat exchanging portion 4.

Referring to fig. 3 to 5, the first and second plates a and B each have a ninth port H1, a tenth port H2, and an eleventh port H3. The ninth porthole H1 of the first plate a and the ninth porthole H1 of the second plate B are stacked to form a ninth porthole 11, the tenth porthole H2 of the first plate a and the tenth porthole H2 of the second plate B are stacked to form a tenth porthole 12, and the eleventh porthole H3 of the first plate a and the eleventh porthole H3 of the second plate B are stacked to form an eleventh porthole 13. A fifth inter-plate channel is formed between the front face of the second plate B and the back face of the first plate A, and a sixth inter-plate channel is formed between the back face of the same second plate B and the front face of the other first plate A.

The first and second plates a and B each have a twelfth orifice H4, a thirteenth orifice H5, a fourteenth orifice H6, and a fifteenth orifice H7. The twelfth orifice H4 of the first plate a and the twelfth orifice H4 of the second plate B are stacked to form a twelfth orifice 31, the thirteenth orifice H5 of the first plate a and the thirteenth orifice H5 of the second plate B are stacked to form a thirteenth orifice 32, the fourteenth orifice H6 of the first plate a and the fourteenth orifice H6 of the second plate B are stacked to form a fourteenth orifice 33, and the fifteenth orifice H7 of the first plate a and the fifteenth orifice H7 of the second plate B are stacked to form a fifteenth orifice 34. A seventh inter-plate channel is formed between the front face of the second plate B and the back face of the first plate a, and an eighth inter-plate channel is formed between the back face of the same second plate B and the front face of the other first plate a.

The first plate A and the second plate B are respectively provided with a hollowed-out hole H8, the hollowed-out holes H8 penetrate through the plate sheet along the thickness direction of the heat exchange equipment 7, and the hollowed-out holes H8 of the first plate A, the hollowed-out holes H8 of the second plate B, the top plate E and the first middle plate M are laminated to form a liquid storage cavity 21.

The first plate a and the second plate B each have a first orifice H10, a second orifice H11, a third orifice H12, and a fourth orifice H13, the first orifice H10 of the first plate a and the first orifice H10 of the second plate B being stacked to form a first orifice 81, the second orifice H11 of the first plate a and the second orifice H11 of the second plate B being stacked to form a second orifice 82, the third orifice H12 of the first plate a and the third orifice H12 of the second plate B being stacked to form a third orifice 83, the fourth orifice H13 of the first plate a and the fourth orifice H13 of the second plate B being stacked to form a fourth orifice 84. A first inter-plate channel is formed between the front face of the fourth plate D and the back face of the third plate C, and a second inter-plate channel is formed between the back face of the same fourth plate D and the front face of the other third plate C.

The ninth porthole 11, the tenth porthole 12, the eleventh porthole 13, the twelfth porthole 31, the thirteenth porthole 32, the fourteenth porthole 33, the fifteenth porthole 34, the first porthole 81, the second porthole 82, the third porthole 83 and the fourth porthole 84 extend in the thickness direction of the heat exchanging device 7.

The front face of each first plate A is opposite to the back face of the adjacent second plate B, and the back face of the same first plate A is opposite to the front face of the other adjacent second plate B. The fifth inter-plate channel and a part of the seventh inter-plate channel are located between the front face of the second plate B and the back face of the adjacent first plate a, and the sixth inter-plate channel and a part of the eighth inter-plate channel are located between the back face of the second plate B and the front face of the other adjacent first plate a.

According to the design difference of the heat exchange equipment 7, if the plate adjacent to the top plate E is the first plate A, a sixth inter-plate channel and a part of eighth inter-plate channels are formed between the back surface of the top plate E and the front surface of the first plate A; if the sheet adjacent to the top plate E is the second plate B, a fifth inter-plate channel and a part of seventh inter-plate channel are formed between the back surface of the top plate E and the front surface of the second plate B. The same reason is that depending on the design of the heat exchanger device 7, the plate adjacent to the first intermediate plate M may be the first plate a or the second plate B.

In the present embodiment, the openings of the first duct 81, the third duct 83 and the fourth duct 84 are located on the first middle plate M, the opening of the second duct 82 is located on the second middle plate N, and the other sides of the first duct 81, the second duct 82, the third duct 83 and the fourth duct 84 are blocked. The opening of the ninth cell 11 is located at the first intermediate plate M, the opening of the tenth cell 12 is located at the top plate E, the opening of the other side of the tenth cell 12 is located at the first intermediate plate M, the opening of the eleventh cell 13 is located at the top plate E, the opening of the other side of the eleventh cell 13 is located at the first intermediate plate M, the openings of the twelfth cell 31 and the thirteenth cell 32 are located at the first intermediate plate M, the opening of the one side of the fourteenth cell 33 is located at the top plate E, the opening of the other side of the fourteenth cell 33 is located at the second intermediate plate N, the opening of the one side of the fifteenth cell 34 is located at the top plate E, and the other sides of the fifteenth cell 34, the ninth cell 11, the twelfth cell 31 and the thirteenth cell 32 are blocked. The external interfaces of the first duct 81, the third duct 83, the fourth duct 84, the ninth duct 11, the tenth duct 12, the eleventh duct 13, the twelfth duct 31 and the thirteenth duct 32 are all disposed on the first middle plate M, i.e., on the same side of the heat exchange device 7, so that the communication path between the flow channels can be shortened, which is advantageous for miniaturization.

In the first plate a and the second plate B, the ninth port H1, the tenth port H2, and the eleventh port H3 are provided in the fourth plate portion P1, and the twelfth port H4, the thirteenth port H5, the fourteenth port H6, and the fifteenth port H7 are provided in the first plate portion P3. In the third plate C and the fourth plate D, the first port H10, the second port H11, the third port H12, the fourth port H13, and the twenty-second port H14 are provided in the second plate portion P4. A fifth inter-plate channel is formed between the front face of the fourth plate portion P1 of the second plate B and the back face of the fourth plate portion P1 of the first plate a, and a sixth inter-plate channel is formed between the back face of the fourth plate portion P1 of the same second plate B and the front face of the fourth plate portion P1 of the other first plate a. A seventh inter-plate channel is formed between the front face of the first plate portion P3 of the second plate B and the back face of the first plate portion P3 of the first plate a, and an eighth inter-plate channel is formed between the back face of the first plate portion P3 of the same second plate B and the front face of the first plate portion P3 of the other first plate a. A first inter-plate channel is formed between the front face of the second plate portion P4 of the fourth plate D and the back face of the second plate portion P4 of the third plate C, and a second inter-plate channel is formed between the back face of the second plate portion P4 of the same fourth plate D and the front face of the second plate portion P4 of the other third plate C.

The front face of each fifth plate I is opposite to the back face of the adjacent sixth plate J, the back face of the same fifth plate I is opposite to the front face of the other adjacent sixth plate J, the third inter-plate channel is located between the front face of the sixth plate J and the back face of the adjacent fifth plate I, and the fourth inter-plate channel is located between the back face of the sixth plate J and the front face of the other adjacent fifth plate I. Depending on the design of the heat exchanger 7, the plate adjacent to the first intermediate plate M may be the fifth plate I or the sixth plate J; the sheet adjacent to the second intermediate plate N may be the fifth plate I or the sixth plate J.

The fifth plate I and the sixth plate J each include a fifth orifice K1, a sixth orifice K2, a seventh orifice K3, and an eighth orifice K4, the fifth orifice K1 of the fifth plate I and the fifth orifice K1 of the sixth plate J being stacked to form a fifth orifice 41, the sixth orifice K2 of the fifth plate I and the sixth orifice K2 of the sixth plate J being stacked to form a sixth orifice 42, the seventh orifice K3 of the fifth plate I and the seventh orifice K3 of the sixth plate J being stacked to form a seventh orifice 43, the eighth orifice K4 of the fifth plate I and the eighth orifice K4 of the sixth plate J being stacked to form an eighth orifice 44. The fifth portholes 41, the sixth portholes 42, the seventh portholes 43, the eighth portholes 44 extend in the thickness direction of the heat exchanging device 7.

In the present embodiment, the openings of the fifth, seventh and eighth cells 41, 43 and 44 are located in the second intermediate plate N, the opening of the sixth cell 42 is located in the bottom plate G, and the other sides of the fifth, sixth, seventh and eighth cells 41, 42, 43 and 44 are blocked. The liquid storage part 2, the evaporation part 3 and the supercooling part 8 are positioned at one side of the second intermediate plate N, and the intermediate heat exchange part 4 is positioned at the other side of the second intermediate plate N, so that the communication path between the seventh flow channel S5 and the first flow channel S7 and the communication path between the eighth flow channel S6 and the third flow channel S3 can be shortened, which is beneficial to miniaturization of the heat exchange device 7.

In the present embodiment, communication of the seventh flow passage S5 with the first flow passage S7 and communication of the eighth flow passage S6 with the third flow passage S3 are achieved by the second intermediate plate N. Specifically, the second intermediate plate N has a first through hole N1, a second through hole N2, and a third through hole N3, and the first through hole N1, the second through hole N2, and the third through hole N3 penetrate the second intermediate plate N in the thickness direction of the second intermediate plate N, respectively. The first through hole N1 is communicated with the outlet of the first flow channel S7 and the inlet of the seventh flow channel S5, the second through hole N2 is communicated with the outlet of the seventh flow channel S5, and the third through hole N3 is communicated with the inlet of the eighth flow channel S6. The fifth orifice K1 of the fifth plate I, the fifth orifice K1 of the sixth plate J, and the first through-hole N1 are provided correspondingly in the thickness direction of the heat exchange device 7, the first through-hole N1 communicating the fifth porthole 41 and the second porthole 82. The seventh orifice K3 of the fifth plate I, the seventh orifice K3 of the sixth plate J, the thirteenth orifice H5 of the first plate a, the thirteenth orifice H5 of the second plate B, the thirteenth orifice H5 of the third plate C, the thirteenth orifice H5 of the fourth plate D, and the third through hole N3 are disposed correspondingly in the thickness direction of the heat exchange device 7, and the third through hole N3 communicates the seventh porthole 43 and the thirteenth porthole 32. The second intermediate plate N is used for forming the supercooling part 8 and the evaporating part 3, is also used for forming the intermediate heat exchange part 4, can also realize the communication of two spaces, reduces the number of parts as much as possible, simplifies the structure, has compact structure of the heat exchange equipment 7, and is beneficial to miniaturization.

The bottom plate G, the fifth plate I and the sixth plate J each include a fifth plate portion P5, and the fifth plate portion P5 of the fifth plate I, the fifth plate portion P5 of the sixth plate J, the fifth plate portion P5 of the bottom plate G and the second intermediate plate N are stacked to form the intermediate heat exchanging portion 4.

The fifth plate I and the sixth plate J are provided with the fifth orifice K1, the sixth orifice K2, the seventh orifice K3 and the eighth orifice K4 in the fifth plate portion P5, and a third inter-plate channel is formed between the front surface of the fifth plate portion P5 of the sixth plate J and the back surface of the fifth plate portion P5 of the fifth plate I, and a fourth inter-plate channel is formed between the back surface of the fifth plate portion P5 of the same sixth plate J and the front surface of the fifth plate portion P5 of the other fifth plate I.

The heat exchange device 7 further comprises a throttling part 5, the throttling part is provided with a first opening 51 and a second opening 52, the first opening 51 and the second opening 52 are respectively communicated with the inner cavity of the throttling part 5, and the throttling part 5 is provided with throttling capability; the outlet of the seventh flow passage S5 communicates with the first opening 51, and the inlet of the third flow passage S3 communicates with the second opening 52. The throttling part 5 is in sealing connection with the bottom plate G, and the throttling part 5 may be a throttle valve or an expansion valve, such as an electronic expansion valve.

The fifth plate I and the sixth plate J each include a second communication port K5, the second communication port K5 of the fifth plate I, the second communication port K5 of the sixth plate J, and the ninth through-hole G2 of the bottom plate G are disposed correspondingly in the thickness direction of the heat exchange device 7, and the second communication port K5 of the fifth plate I and the second communication port K5 of the sixth plate J are laminated to form a second communication duct 45. The second communication duct 45 communicates with the inlet of the third flow passage S3, and the ninth through-hole G2 of the bottom plate G communicates with the second communication duct 45 and the second opening 52 of the throttle 5. The bottom plate G is located on a side of the intermediate heat exchanging portion 4 away from the second intermediate plate N, and has a twenty-third through hole G1 and a ninth through hole G2, the twenty-third through hole G1 and the ninth through hole G2 penetrating the bottom plate G in a thickness direction of the bottom plate G, respectively. The first opening 51 communicates with the twenty-third through hole G1, the twenty-third through hole G1 communicates with the outlet of the seventh flow passage S5, the second opening 52 communicates with the ninth through hole G2, and the ninth through hole G2 communicates with the inlet of the third flow passage S3.

The sixth orifice K2 of the fifth plate I, the sixth orifice K2 of the sixth plate J, the twenty-third through-hole G1, and the first opening 51 are provided correspondingly in the thickness direction of the heat exchange device 7, and the twenty-third through-hole G1 communicates with the sixth porthole 42 and the first opening 51. The second communication port K5 of the fifth plate I, the second communication port K5 of the sixth plate J, the twelfth port H4 of the first plate a, the twelfth port H4 of the second plate B, the twelfth port H4 of the third plate C, the twelfth port H4 of the fourth plate D, the second through-hole N2, the ninth through-hole G2, and the second opening 52 are provided correspondingly in the thickness direction of the heat exchanging device 7, the second through-hole N2 communicates with the second communication duct 45 and the twelfth duct 31, and the second through-hole N2 communicates with the second communication duct 45 and the second opening 52. In order to facilitate the installation of the heat exchange device 7 and the connection of the heat exchange device 7 and other components, the side of the heat exchange device 7, which is close to the bottom plate G, has no opening of a pore canal, and all external interfaces of the heat exchange device 7 are arranged on the top plate E. The external pipeline that is connected with heat transfer equipment 7 all is located the one side that is close to roof E, and bottom plate G one side is convenient for realize the installation of heat transfer equipment 7.

In order to continue the outlet of the eighth flow passage S6 to the top plate E, the heat exchange device 7 has a first communication duct 22, the first communication duct 22 extending in the thickness direction of the heat exchange device 7, the first communication duct 22 penetrating both sides in the thickness direction of the liquid storage portion 2 and the supercooling portion 8, the first communication duct 22 being formed with openings in each of the first intermediate plate M, the second intermediate plate N, and the top plate E. The first communication passage 22 and the reservoir chamber 21 are isolated from each other in the reservoir portion 2, and the first communication passage 22 communicates with the eighth passage 44.

The top plate E also has a twenty-first orifice E6, and the first plate a and the second plate B each have a first communication orifice H9, and the first communication orifice H9 of the first plate a and the first communication orifice H9 of the second plate B are laminated to form a first communication passage 22. The first intermediate plate M has a seventh through hole M4, and the seventh through hole M4 penetrates the first intermediate plate M in the thickness direction of the first intermediate plate M. The third plate C and the fourth plate D each have a twenty-second aperture H14. The second intermediate plate N has an eighth through hole N4. The twenty-first orifice E6 of the top plate E, the first communication orifice H9 of the first plate a, the first communication orifice H9 of the second plate B, the seventh through hole M4 of the first intermediate plate M, the twenty-second orifice H14 of the third plate C, the twenty-second orifice H14 of the fourth plate D, and the eighth through hole N4 of the second intermediate plate N are disposed in correspondence in the thickness direction of the heat exchange device 7, and the twenty-first orifice E6 of the top plate E, the first communication orifice H9 of the first plate a, the first communication orifice H9 of the second plate B, the seventh through hole M4 of the first intermediate plate M, the twenty-second orifice H14 of the third plate C, and the twenty-second orifice H14 of the fourth plate D are stacked to form a first communication passage 22, and the eighth through hole N4 communicates the first communication passage 22 and the eighth communication passage 44.

The heat exchange equipment 7 comprises ten plates, the ten plates are punched according to design requirements, then the plates are stacked according to preset rules, and the heat exchange equipment 7 can be prepared through a one-time welding process, so that the production efficiency is high, and the production cost is low.

In the present embodiment, the first plate portion P3, the second plate portion P4, the third plate portion P2, the fourth plate portion P1, and the fifth plate portion P5 are flat plates except for portions where the apertures are provided. Optionally, in the stamping step, structures such as protruding points, herringbone waves and the like can be formed on the plate, or protruding ribs of the U-shaped flow can be stamped, so that the heat exchange effect is enhanced.

In accordance with one embodiment of the thermal management system of the present application, referring to fig. 1 to 2, the thermal management system is mainly used to generally manage the cooling capacity and the heat so as to satisfy the cooling capacity and the heat demand in the whole vehicle range, such as the cooling/heating demand of the cabin space, the cooling demand of the motor, the heating/cooling demand of the battery, and the like. Wherein a part of the cold/heat is supplied by means such as running a refrigerant circulation circuit, starting a heater, the cooling liquid itself carrying the cold, and the like, and a part of the heat is obtained by means such as recovering the other part of the cold/heat. Wherein a part of the components of the thermal management system are integrated to form the heat exchange device 7.

The components of the thermal management system are connected through pipelines to form two large systems, namely a refrigerant system and a cooling liquid system, which are isolated from each other and are not communicated with each other. The refrigerant system is communicated with a refrigerant, the cooling liquid system is communicated with a cooling liquid, the refrigerant can be R134A or carbon dioxide or other heat exchange media, and the cooling liquid can be a mixed solution of ethanol and water or other cooling media.

In the present application, the heat management system includes the compressor 6 and the heat exchange device 7 of any of the above embodiments, and the structure of the heat exchange device 7 may be adjusted according to actual requirements, and for convenience of description, the heat exchange device 7 includes the throttling part 5 in this embodiment is described as an example.

The condensing part 1 and the evaporating part 3 are respectively used for realizing the heat exchange of the refrigerant and the cooling liquid, and the intermediate heat exchange part 4 is used for realizing the heat exchange of two refrigerants in the same loop. The supercooling portion 8 is for achieving a state of cooling the refrigerant below its saturation temperature. The first, fifth, third, seventh and eighth flow passages S7, S1, S3, S5 and S6 are connected to a refrigerant system, and the second, sixth and fourth flow passages S8, S2 and S4 are connected to a coolant system. The outlet of the compressor 6 communicates with the ninth porthole 11 of the heat exchanging device 7, and the inlet of the compressor 6 communicates with the first communication porthole 22 of the heat exchanging device 7. The thermal management system of the present application is a full circuit system, as shown in fig. 1 to 5, the flow path of the refrigerant is as follows:

Flows out from the outlet of the compressor 6, and enters the inlet of the compressor 6 through the fifth flow passage S1 of the condensing unit 1, the liquid storage chamber 21 of the liquid storage unit 2, the first flow passage S7 of the supercooling unit 8, the seventh flow passage S5 of the intermediate heat exchange unit 4, the first opening 51 of the throttle unit 5, the inner cavity of the throttle unit 5, the second opening 52 of the throttle unit 5, the third flow passage S3 of the evaporating unit 3, and the eighth flow passage S6 of the intermediate heat exchange unit 4.

Referring to fig. 1 to 10, the thermal management system is in an operating state, and the flow path of the refrigerant in the heat exchange device 7 is as follows: the refrigerant flows into the heat exchange device 7 from the ninth duct 11 and flows to the liquid storage chamber 21 along the plurality of fifth inter-plate channels; after flowing through the liquid storage cavity 21, the liquid enters the first pore canal 81 from the sixth through hole M3, flows to the second pore canal 82 along the plurality of first inter-plate channels, enters the fifth pore canal 41 from the first through hole N1, and flows to the sixth pore canal 42 along the plurality of third inter-plate channels; then sequentially flowing through the twenty-third through hole G1 and the first opening 51, and then entering the inner cavity of the throttling part 5, and realizing throttling through the throttling part 5; the throttled refrigerant sequentially flows through the second opening 52, the ninth through hole G2, the second communicating duct 45, and the second through hole N2, and then enters the twelfth duct 31, and flows along the seventh inter-plate passages to the thirteenth duct 32; then from the third through-hole N3 into the seventh porthole 43, along the plurality of fourth inter-plate channels to the eighth porthole 44; then from the eighth through-hole N4 into the first communication channel 22 and finally out of the heat exchange device 7.

The condensing portion 1 serves as a water-cooled condenser for heating the cooling liquid. The supercooling part 8 is used for cooling the refrigerant to a state lower than the saturation temperature, and further reducing the heat brought by the refrigerant, thereby improving the energy efficiency of the refrigeration system. The evaporation portion 3 functions as a water-cooled evaporator for reducing the temperature of the cooling liquid. The intermediate heat exchange portion 4 serves as an intermediate heat exchanger for effecting heat exchange of the higher temperature refrigerant and the lower temperature refrigerant. The liquid storage portion 2 serves as a liquid reservoir that can store a refrigerant. The cooling liquid system can be designed according to the requirements, and the application is not limited.

The heat management system is a full-loop system, can reduce the filling amount of the refrigerant, has lower leakage rate, and is more beneficial to the integration of the refrigerant system. The heat exchange device 7 with higher integration level is used, so that the occupied space of the thermal management system is smaller.

The two components in the application can be directly connected or connected through a pipeline, and only a pipeline can be arranged between the two components, or a valve device or other components besides the pipeline can be arranged between the two components. Similarly, in the application, the two components can be directly communicated, or can be communicated through a pipeline, and the two components can be communicated through a pipeline only, or can be communicated after being further provided with a valve device or other components.

The present application is not limited to the above-mentioned embodiments, but is not limited to the above-mentioned embodiments, and any simple modification, equivalent changes and modification made to the above-mentioned embodiments according to the technical matters of the present application can be made by those skilled in the art without departing from the scope of the present application.

Claims (10)

1. A heat exchange apparatus, comprising: a plurality of plates stacked to form a supercooling portion and an evaporating portion;

The supercooling part has a first flow passage and a second flow passage isolated from each other, the evaporating part has a third flow passage and a fourth flow passage isolated from each other, and an outlet of the first flow passage can communicate with an inlet of the third flow passage.

2. The heat exchange apparatus according to claim 1, wherein the plurality of plates includes a plurality of first plates, a plurality of second plates, a plurality of third plates, a plurality of fourth plates, and a first intermediate plate;

Along the thickness direction of the heat exchange device, the first plates and the second plates are alternately stacked, the third plates and the fourth plates are alternately stacked, the first plates and the second plates are located at one side of the first intermediate plates, and the third plates and the fourth plates are located at the other side of the first intermediate plates.

3. The heat exchange device according to claim 2, wherein projected outer contours of the first plate, the second plate, the third plate, the fourth plate, and the first intermediate plate coincide on a plane perpendicular to a thickness direction of the heat exchange device.

4. A heat exchange device according to claim 2 or 3, wherein the first plate, the second plate, the third plate, the fourth plate and the first intermediate plate each comprise a first plate portion, the first plate portions of the first plate, the second plate, the third plate, the fourth plate and the first intermediate plate are stacked to form the evaporation portion, the third plate and the fourth plate each comprise a second plate portion, and the second plate portions of the third plate and the fourth plate are stacked to form the supercooling portion.

5. The heat exchange apparatus according to claim 4, wherein a front face of each of the third plates is disposed opposite to a back face of an adjacent one of the fourth plates, and a back face of the same one of the third plates is disposed opposite to a front face of another one of the adjacent fourth plates, defining a direction from the back face of the third plate toward the front face of the third plate as a first direction, and a direction from the front face of the third plate toward the back face of the third plate as a second direction;

the third plate and the fourth plate both comprise first ribs, the first ribs are positioned between the supercooling part and the evaporating part, and the first ribs extend to two side edges along the width direction of the heat exchange equipment;

The first ribs of the third plate protrude from the front face of the third plate along the first direction, the first ribs of the fourth plate protrude from the front face of the fourth plate along the first direction, the front face of the first ribs of the fourth plate is in sealing connection with the back face of the first ribs of the adjacent third plate, and the back face of the first ribs of the fourth plate is in sealing connection with the front face of the first ribs of the other adjacent third plate.

6. The heat exchange apparatus of claim 2 wherein the plurality of plates are further stacked to form a reservoir having a reservoir cavity in communication with the inlet of the first flow passage;

The heat exchange device comprises a plurality of plates, and is characterized in that the plates further comprise a top plate, a plurality of first plates and a plurality of second plates are located between the top plate and the first middle plate, the top plate and the first middle plate comprise third plate portions, the first plates and the second plates are provided with hollowed holes, the hollowed holes penetrate through the plates in the thickness direction of the heat exchange device, the hollowed holes of the first plates, the hollowed holes of the second plates, the third plate portions of the top plate and the third plate portions of the first middle plate are stacked to form a liquid storage portion, the first plates, the second plates, the top plate and the first middle plate comprise second protruding ribs, and the second protruding ribs are located between the liquid storage portion and the evaporation portion.

7. The heat exchange apparatus according to claim 6, wherein the plurality of plates are further stacked to form a condensing portion having a fifth flow passage and a sixth flow passage isolated from each other, an outlet of the fifth flow passage being in communication with the liquid storage chamber;

the top plate, the first middle plate, the first plate and the second plate all comprise a fourth plate part, the fourth plate part of the first plate, the fourth plate part of the second plate, the fourth plate part of the top plate and the fourth plate part of the first middle plate are stacked to form the condensation part, the first plate, the second plate, the top plate and the first middle plate all comprise a third convex rib, and the third convex rib is positioned between the condensation part and the liquid storage part.

8. The heat exchange apparatus according to claim 6 or 7, wherein the plurality of plates further comprises a plurality of fifth plates, a plurality of sixth plates, and a bottom plate; the top plate, the first plate, the second plate, the third plate, the fourth plate, and the first intermediate plate are alternately stacked in a thickness direction of the heat exchange apparatus, the bottom plate is positioned at one side of the fifth plate and the sixth plate, the first plate, the second plate, the third plate, the fourth plate, and the first intermediate plate are positioned at the same side of the top plate, and the fifth plate and the sixth plate are positioned at the same side of the bottom plate;

The fifth plate, the sixth plate and the bottom plate are stacked to form an intermediate heat exchange part, the intermediate heat exchange part is provided with a seventh runner and an eighth runner which are mutually isolated, the outlet of the first runner is communicated with the inlet of the seventh runner, the outlet of the seventh runner is communicated with the inlet of the third runner, and the outlet of the third runner is communicated with the inlet of the eighth runner.

9. The heat exchange device of claim 8, wherein said plurality of plates further comprises a second intermediate plate, said top plate, said first plate, said second plate, said third plate, said fourth plate, and said first intermediate plate being located on one side of said second intermediate plate and said bottom plate, said fifth plate, and said sixth plate being located on the other side of said second intermediate plate in a thickness direction of said heat exchange device;

The bottom plate, the fifth plate and the sixth plate each include a fifth plate portion, and the fifth plate portion of the fifth plate, the fifth plate portion of the sixth plate, the fifth plate portion of the bottom plate and the second intermediate plate are stacked to form the intermediate heat exchange portion.

10. A thermal management system comprising a compressor and a heat exchange device according to any one of claims 1 to 9, wherein the inlet of the compressor is capable of communicating with the outlet of the third flow passage when the thermal management system is in an operational state.