CN118142925B - Clamp cleaning device for wafer electroplating - Google Patents
Clamp cleaning device for wafer electroplating Download PDFInfo
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- CN118142925B CN118142925B CN202410573126.1A CN202410573126A CN118142925B CN 118142925 B CN118142925 B CN 118142925B CN 202410573126 A CN202410573126 A CN 202410573126A CN 118142925 B CN118142925 B CN 118142925B
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- cleaning box
- fixedly connected
- gear
- mechanical arm
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- 238000004140 cleaning Methods 0.000 title claims abstract description 185
- 238000009713 electroplating Methods 0.000 title abstract description 11
- 230000007246 mechanism Effects 0.000 claims abstract description 92
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 49
- 238000001179 sorption measurement Methods 0.000 claims abstract description 29
- 238000001035 drying Methods 0.000 claims abstract description 23
- 230000009471 action Effects 0.000 claims abstract description 17
- 229920000742 Cotton Polymers 0.000 claims abstract description 14
- 238000005507 spraying Methods 0.000 claims abstract description 13
- 239000008213 purified water Substances 0.000 claims abstract description 8
- 229910000831 Steel Inorganic materials 0.000 claims description 14
- 238000007747 plating Methods 0.000 claims description 14
- 239000010959 steel Substances 0.000 claims description 14
- 238000004804 winding Methods 0.000 claims description 13
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 8
- 230000005540 biological transmission Effects 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 8
- 238000007789 sealing Methods 0.000 claims description 8
- 239000000741 silica gel Substances 0.000 claims description 8
- 229910002027 silica gel Inorganic materials 0.000 claims description 8
- 238000007664 blowing Methods 0.000 claims description 6
- 239000004519 grease Substances 0.000 claims description 5
- 230000001050 lubricating effect Effects 0.000 claims description 5
- 239000002351 wastewater Substances 0.000 claims description 5
- 229920002635 polyurethane Polymers 0.000 claims description 3
- 239000004814 polyurethane Substances 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 abstract description 49
- 230000000694 effects Effects 0.000 abstract description 11
- 239000007921 spray Substances 0.000 description 5
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 239000003344 environmental pollutant Substances 0.000 description 3
- 231100000719 pollutant Toxicity 0.000 description 3
- 230000008569 process Effects 0.000 description 2
- 238000000746 purification Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000012864 cross contamination Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention belongs to the technical field of wafer electroplating cleaning, in particular to a clamp cleaning device for wafer electroplating, which comprises a supporting table, wherein a wafer fixing mechanism is arranged on the upper surface of the supporting table, a mechanical arm is arranged on the upper surface of one side supporting table of the wafer fixing mechanism, a clamp cleaning assembly is further arranged on the upper surface of one side supporting table of the wafer fixing mechanism, the clamp cleaning assembly comprises a cleaning box, a through hole is formed in the axis of the upper surface of the cleaning box, a drying mechanism is fixedly connected to the inner wall of the through hole, a stretching mechanism is arranged on one side of the cleaning box, a slot in and out is formed in one side of the cleaning box, and an opening and closing mechanism is connected to the inner wall of the cleaning box where the slot in and out is located in a sliding manner. According to the clamp cleaning device, purified water entering from the connecting pipe is sprayed out through the water spraying hole, the adsorption disc at the lower end of the clamp is soaked by the purified water, and cleaning cotton is rotated and cleaned under the action of the rotating column, so that the cleaning effect on the pollution attached to the lower end of the adsorption disc is realized, and the cross pollution between wafers is avoided.
Description
Technical Field
The invention relates to the technical field of wafer electroplating cleaning, in particular to a clamp cleaning device for wafer electroplating.
Background
In the existing wafer cleaning process, the wafer placed in the wafer storage box is generally adsorbed and taken out by the mechanical arm and then placed in the wafer cleaning mechanism, but when the wafer is adsorbed by the clamp at the lower end of the mechanical arm, if a certain pollutant exists on the surface of one wafer, the lower surface of the clamp adsorption disc can be attached with a certain pollutant due to the adsorption of the wafer, so that when the cleaned wafer is taken out by the mechanical arm, the surface of the wafer is still affected by the adsorbed part of the adsorption disc, and especially, the wafer with no pollutant on the subsequent surface forms cross pollution, so that the subsequent wafer cannot be used.
In order to solve the above problems, the present invention provides a jig cleaning apparatus for wafer plating.
Disclosure of Invention
Based on the existing wafer electroplating cleaning technical problem, the invention provides a clamp cleaning device for wafer electroplating.
The invention provides a clamp cleaning device for wafer electroplating, which comprises a supporting table, wherein a wafer fixing mechanism is arranged on the upper surface of the supporting table, a mechanical arm is arranged on the upper surface of the supporting table on one side of the wafer fixing mechanism, a clamp cleaning assembly is further arranged on the upper surface of the supporting table on one side of the wafer fixing mechanism, the clamp cleaning assembly comprises a cleaning box, a through hole is formed in the axis of the upper surface of the cleaning box, a drying mechanism is fixedly connected to the inner wall of the through hole, a stretching mechanism is arranged on one side of the cleaning box, an inlet and outlet groove is formed in one side of the cleaning box, an opening and closing mechanism is slidingly connected to the inner wall of the cleaning box where the inlet and outlet groove is located, a cleaning mechanism is arranged in the cleaning box, a driving mechanism is fixedly connected to the lower surface of the cleaning box, an intelligent control valve is fixedly connected to the lower surface of the cleaning box, the inner wall of the upper end of the intelligent control valve is fixedly communicated with the inner bottom wall of the cleaning box, and the lower end of the intelligent control valve is connected with a negative pressure pipeline.
The drying mechanism realizes the drying action of the adsorption disc on the lower surface of the clamp at the tail end of the mechanical arm.
The stretching mechanism realizes the stretching action of the opening and closing mechanism.
The opening and closing mechanism realizes the opening and closing action on the side surface of the cleaning box.
The cleaning mechanism is used for cleaning the adsorption disc on the lower surface of the clamp at the tail end of the mechanical arm.
The driving mechanism realizes the rotation action of the cleaning mechanism.
Preferably, the drying mechanism comprises a placing frame, a first motor is fixedly connected to the inner wall of the placing frame, an electric telescopic rod is fixedly connected to an output shaft of the first motor through a coupler, an 'infinity' type fixing ring is fixedly sleeved on the outer surface of the lower end of the electric telescopic rod, a hot air pipe is fixedly connected to the inner wall of one side ring of the 'infinity' type fixing ring, a hot air fan is externally connected to the upper end of the hot air pipe, and the air outlet of the lower end of the hot air pipe is flat.
Preferably, the stretching mechanism comprises a second motor, the bottom end of the second motor is fixed on the upper surface of the cleaning box, the output shaft of the second motor is fixedly connected with a first gear through a coupler, the first gears are axially symmetrically provided with wire rope winding wheels along the vertical direction, the surfaces of one side of each wire rope winding wheel are tooth-shaped surfaces meshed with the first gear tooth-shaped surfaces, one side of each wire rope winding wheel is rotationally connected with the side surface of the cleaning box, the surface winding of each wire rope winding wheel is connected with a wire rope, the surface of each wire rope is slidably connected with a fixed pulley, one end of each fixed pulley is fixedly connected with the side surface of the cleaning box, and one end of each wire rope is fixedly connected with a cam.
Preferably, the opening and closing mechanism comprises a side face and a side-by-side door fixedly connected with one end of the cam, an L-shaped cross section is formed in the upper end of the side-by-side door, a telescopic rod is fixedly connected with the surface of the L-shaped cross section, one end of the telescopic rod is fixedly connected with the inner wall of the cleaning box, a spring is sleeved on the surface of the telescopic rod, a T-shaped sliding groove is further formed in one side of the upper end of the side-by-side door, the surface of the T-shaped sliding groove is in sliding connection with the inner top wall of the cleaning box, and semicircular grooves are formed in two opposite sides of the side-by-side door.
Preferably, the round grooves formed by the two semicircular grooves are matched with the surfaces of round tubes fixedly connected with the tail ends of the mechanical arms, the surfaces of the two semicircular grooves are provided with silica gel gaskets, and polyurethane sealing layers are smeared at the contact positions of the side-by-side doors and the inner walls of the cleaning boxes.
Preferably, the cleaning mechanism comprises a fixing rod, one end of the fixing rod penetrates through the side face of the cleaning box and the surface of the fixing rod is rotationally connected with the inner wall of the cleaning box through a bearing, the other end of the fixing rod is fixedly connected with a rotating column, a cylindrical water inlet groove is formed in the axis of the rotating column, a water spraying hole is formed in the circumferential array of the outer surface of the rotating column, the inner wall of the water spraying hole is fixedly communicated with the surface of the cylindrical water inlet groove, a T-shaped fixing groove is further formed in the surface of the rotating column, the T-shaped fixing groove is located between the water spraying holes, a fixing strip is fixedly arranged on the surface of the T-shaped fixing groove through a screw, cleaning cotton is fixedly connected to the outer surface array of the fixing strip, a connecting pipe is fixedly connected to the center of a side face of the rotating column through a sealing bearing, the inner wall of the connecting pipe is fixedly communicated with the surface of the cylindrical water inlet groove, one end of the connecting pipe penetrates through the side face of the cleaning box and extends to the outer side of the cleaning box, and one end of the connecting pipe is located on the outer side of the cleaning box is connected with the outer side of the cleaning box through an external flange.
Preferably, the driving mechanism comprises a placing frame fixed on the lower surface of the cleaning box, a third motor is fixedly connected to the inside of the placing frame, a second gear is fixedly connected to an output shaft of the third motor through a coupling, a third gear is fixedly connected to one end of the fixing rod, located on the outer side of the cleaning box, a gear belt is connected to the second gear in a transmission mode, and one end of the gear belt is connected with the surface of the third gear in a transmission mode.
Preferably, the surface of the T-shaped chute is smeared with lubricating grease.
Preferably, a sensor is embedded in the surface of the box body of the cleaning box at the outer side of the split door.
Preferably, the method for using the clamp cleaning device for wafer electroplating comprises the following steps:
The method comprises the steps that firstly, a wafer to be cleaned is placed at the upper end of a wafer fixing mechanism through a mechanical arm, the mechanical arm drives a clamp at the tail end of the mechanical arm to rotate to the side of a cleaning box, a sensor controls a second motor to drive a first gear to rotate, the first gear drives one side of a steel wire rope coiling wheel meshed with the first gear to rotate in the same direction, the steel wire rope coiling wheel drives a steel wire rope to wind on the surface of the steel wire rope coiling wheel, the steel wire rope pulls a cam, and the cam drives a split door to move to the outer side of the cleaning box;
Step two, the mechanical arm drives the clamp at the tail end of the mechanical arm to enter the cleaning box until the clamp completely enters the cleaning box, the mechanical arm descends to the adsorption disc at the lower end of the mechanical arm to contact the upper end of the cleaning cotton, then the second motor reversely rotates, the wire rope winding wheel loosens the wound wire rope, the split door is restored under the action of the spring, and the silica gel gasket on the surface of the semicircular groove is tightly attached to the surface of the connecting pipe at the tail end of the mechanical arm;
Step three, a third motor drives a second gear to rotate, a fixed rod fixedly connected with the third gear is driven to rotate through a gear belt, so that a rotating column fixedly connected with the fixed rod is driven to rotate, meanwhile, a water inlet pipe externally connected with a connecting pipe is filled with purified water, the purified water is sprayed out through a water spraying hole, and rotary cleaning cotton cleans the lower end of an adsorption disc of a clamp at the tail end of a mechanical arm;
Step four, the water supply of the water inlet pipe in the step three is stopped, the third motor stops working, the rotation angle of the mechanical arm is between 80 degrees and 90 degrees, the adsorption disc at the lower end of the clamp of the mechanical arm and the lower end of the hot air pipe are opposite, meanwhile, the hot air starts to work through an external hot air blower of the hot air pipe, the adsorption disc is dried through the lower end of the hot air pipe, the first motor drives an electric telescopic rod connected with an inner ring of a bearing to rotate, so that a flat air outlet at the lower end of the hot air pipe is driven to rotate for blowing, an intelligent control valve is opened, and the waste water after cleaning and internal hot air are discharged together through a negative pressure pipeline;
And step five, after the cleaning and drying are finished, the mechanical arm is moved out, and the operations from the step one to the step five are repeated after the wafer to be cleaned is replaced.
The beneficial effects of the invention are as follows:
1. Through setting up drying mechanism, hot-blast in the hot-blast pipe blows out through its terminal platykurtic air outlet, platykurtic air outlet can blow out the air more intensively, forms stronger air current to accelerate the adsorption disc drying effect of anchor clamps lower extreme, and first motor drives platykurtic air outlet of hot-blast pipe lower extreme through driving electric telescopic handle at the dry in-process of hot-blast pipe and rotatory blowing in certain angle, has further realized the drying effect that anchor clamps lower extreme adsorption disc can evenly blow.
2. Through setting up stretching mechanism, wire rope is contracted and is released by wire rope reel under first motor drive first gear rotation, realizes the automatic closing and the opening and shutting of to opening and shutting.
3. Through setting up the mechanism that opens and shuts, the automatic opening and closing of realization under stretching mechanism's effect of split door, and the silica gel gasket that the semicircle groove surface set up and the lubricating grease that "T" type spout surface was paintd have promoted the sealed effect of wasing the incasement portion, avoid wasing the waste water molecule after the incasement washs and overflow through the gap between semicircle groove and the "T" type spout to destroy wafer abluent dustless environment.
4. Through setting up wiper mechanism, the purification water that gets into from the connecting pipe passes through the hole for water spraying blowout, and the adsorption disc of anchor clamps lower extreme is soaked by the purification water, and the cleaning cotton is rotatory washd under the effect of spliced pole, has realized the cleaning performance to the attached pollution of adsorption disc lower extreme, has avoided cross contamination between the wafer.
Drawings
FIG. 1 is a schematic view of a jig cleaning apparatus for wafer plating according to the present invention;
FIG. 2 is a diagram showing the position of a cleaning mechanism of a jig cleaning device for wafer plating according to the present invention;
FIG. 3 is a perspective view of a drying mechanism of a jig cleaning device for wafer plating according to the present invention;
FIG. 4 is a drawing showing the position of a stretching mechanism of a jig cleaning device for wafer plating according to the present invention;
FIG. 5 is a perspective view of a side-by-side combination door of a jig cleaning device for wafer plating according to the present invention;
fig. 6 is a perspective view of a cleaning mechanism of a jig cleaning device for wafer plating according to the present invention.
In the figure: 1. a support table; 2. a wafer fixing mechanism; 3. a mechanical arm; 4. a clamp cleaning assembly; 41. a cleaning box; 42. a drying mechanism; 421. a placing rack; 422. a first motor; 423. an electric telescopic rod; 424. a hot air pipe; 425. a "+_infinity" type fixing ring; 426. a placing rack; 43. a stretching mechanism; 431. a second motor; 432. a first gear; 433. a wire rope reel; 434. a fixed pulley; 435. a wire rope; 436. a cam; 44. an opening and closing mechanism; 441. split door; 442. an "L" shaped cross section; 443. a telescopic rod; 444. a spring; 445. t-shaped sliding groove; 446. a semicircular groove; 45. a cleaning mechanism; 451. a fixed rod; 452. rotating the column; 453. a water spraying hole; 454. a fixing strip; 455. cleaning cotton; 456. a connecting pipe; 46. a driving mechanism; 461. placing a frame; 462. a third motor; 463. a second gear; 464. a third gear; 465. a gear belt; 47. and an intelligent control valve.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments.
Referring to fig. 1-6, a jig cleaning device for wafer electroplating comprises a supporting table 1, wherein a wafer fixing mechanism 2 is arranged on the upper surface of the supporting table 1, a mechanical arm 3 is arranged on the upper surface of one side supporting table 1 of the wafer fixing mechanism 2, a jig cleaning component 4 is further arranged on the upper surface of one side supporting table 1 of the wafer fixing mechanism 2, the jig cleaning component 4 comprises a cleaning box 41, a through hole is formed in the axis of the upper surface of the cleaning box 41, a drying mechanism 42 is fixedly connected to the inner wall of the through hole, a stretching mechanism 43 is arranged on one side of the cleaning box 41, an inlet and outlet groove is formed in one side of the cleaning box 41, an opening and closing mechanism 44 is slidingly connected to the inner wall of the cleaning box 41 where the inlet and outlet groove is located, a cleaning mechanism 45 is arranged in the cleaning box 41, a driving mechanism 46 is fixedly connected to the lower surface of the cleaning box 41, an intelligent control valve 47 is fixedly connected to the lower surface of the cleaning box 41, the upper end inner wall of the intelligent control valve 47 is fixedly communicated with the inner bottom wall of the cleaning box 41, and the lower end of the intelligent control valve 47 is connected to a negative pressure pipeline.
In order to realize the drying action of the drying mechanism 42 on the adsorption disc on the lower surface of the clamp at the tail end of the mechanical arm 3, the drying mechanism 42 comprises a placing frame 421, a first motor 422 is fixedly connected to the inner wall of the placing frame 421, an output shaft of the first motor 422 is fixedly connected with an electric telescopic rod 423 through a coupler, an 'infinity' type fixing ring 425 is fixedly sleeved on the outer surface of the lower end of the electric telescopic rod 423, a hot air pipe 424 is fixedly connected to the inner wall of one side ring of the 'infinity' type fixing ring 425, a hot air fan is externally connected to the upper end of the hot air pipe 424, and the air outlet of the lower end of the hot air pipe 424 is flat.
Specifically so implement, through this mechanism, hot-blast in the hot-blast pipe 424 blows out through its terminal platykurtic air outlet, platykurtic air outlet can blow out the air more intensively, forms stronger air current to accelerate the adsorption disc drying effect of arm 3 anchor clamps lower extreme, and first motor 422 is through driving electric telescopic handle 423 and driving the platykurtic air outlet of hot-blast pipe 424 lower extreme at the dry in-process of hot-blast pipe 424 rotatory blowing in certain angle, has further realized that arm 3 anchor clamps lower extreme adsorption disc can receive the drying effect of evenly blowing.
In order to realize the stretching action of the stretching mechanism 43 on the opening and closing mechanism 44, the stretching mechanism 43 comprises a second motor 431 with the bottom end fixed on the upper surface of the cleaning box 41, an output shaft of the second motor 431 is fixedly connected with a first gear 432 through a coupling, the first gear 432 is axially symmetrically provided with wire rope coiling wheels 433 along the vertical direction, one side surfaces of the two wire rope coiling wheels 433 are respectively provided with a toothed surface meshed with the toothed surface of the first gear 432, one side of the wire rope coiling wheels 433 is rotationally connected with the side surface of the cleaning box 41, a wire rope 435 is wound on the surface of the wire rope coiling wheels 433, a fixed pulley 434 is slidingly connected with the surface of the wire rope 435, one end of the fixed pulley 434 is fixedly connected with the side surface of the cleaning box 41, and one end of the wire rope 435 is fixedly connected with a cam 436.
Specifically, by means of the mechanism, the second motor 431 drives the first gear 432 and the wire rope reeling wheel 433 to rotate and reel the wire rope 435, the split door 441 moves outwards under the pulling of the wire rope 435, the fixed pulley 434 provides a moving track for the stretching of the wire rope 435, friction force generated when the wire rope 435 stretches is reduced, and automatic closing and opening of the split door 441 are achieved.
In order to realize the opening and closing action of the opening and closing mechanism 44 on the side surface of the cleaning box 41, the opening and closing mechanism 44 comprises a side surface and a side-by-side door 441 fixedly connected with one end of a cam 436, an L-shaped cross section 442 is arranged at the upper end of the side-by-side door 441, a telescopic rod 443 is fixedly connected with the surface of the L-shaped cross section 442, one end of the telescopic rod 443 is fixedly connected with the inner wall of the cleaning box 41, a spring 444 is sleeved on the surface of the telescopic rod 443, a T-shaped sliding groove 445 is also arranged at one side of the upper end of the side-by-side door 441, the surface of the T-shaped sliding groove 445 is in sliding connection with the inner top wall of the cleaning box 41, and semicircular grooves 446 are arranged at the opposite sides of the two side-by-side doors 441; the round grooves formed by the two semicircular grooves 446 are matched with the surfaces of round tubes fixedly connected with the tail ends of the mechanical arms 3, and silica gel gaskets are arranged on the surfaces of the two semicircular grooves 446; the surface of the T-shaped chute 445 is smeared with lubricating grease, and the contact part of the side-by-side door 441 and the inner wall of the cleaning box 41 is smeared with a polyurethane sealing layer; a sensor is embedded in the surface of the casing of the washing casing 41 outside the split door 441.
Specifically, by means of the mechanism, the silica gel gasket arranged on the surface of the semicircular groove 446 and the lubricating grease smeared on the surface of the T-shaped sliding groove 445 improve the sealing effect inside the cleaning box 41, and waste water molecules after cleaning in the cleaning box 41 are prevented from overflowing through gaps between the semicircular groove 446 and the connecting pipe at the tail end of the mechanical arm 3 and gaps between the T-shaped sliding groove 445 and the inner top wall of the cleaning box 41, so that the dust-free environment for cleaning wafers is damaged.
In order to realize the cleaning action of the cleaning mechanism 45 on the lower surface adsorption disc of the clamp at the tail end of the mechanical arm, the cleaning mechanism 45 comprises a fixing rod 451, one end of the fixing rod 451 penetrates through the side face of the cleaning box 41, the surface of the fixing rod 451 is rotationally connected with the inner wall of the cleaning box 41 through a bearing, the other end of the fixing rod 451 is fixedly connected with a rotating column 452, a cylindrical water inlet groove is formed in the axis of the rotating column 452, water spray holes 453 are formed in the circumferential array of the outer surface of the rotating column 452, the inner wall of the water spray holes 453 are fixedly communicated with the surface of the cylindrical water inlet groove, T-shaped fixing grooves are formed in the surface of the rotating column 452, the T-shaped fixing grooves are located between the water spray holes 453, and the design of the water spray holes 453 can realize rotary water spray cleaning to ensure that each corner of the adsorption disc is cleaned, and the cleaning effect is improved.
The surface of the T-shaped fixing groove is fixedly provided with a fixing strip 454 through a screw, and the outer surface array of the fixing strip 454 is fixedly connected with cleaning cotton 455; the cleaning cotton 455 attached to the fixing strip 454 can increase cleaning strength, help remove contaminants, and improve cleaning efficiency.
A connecting pipe 456 is fixedly connected to the center of one side surface of the rotating column 452 through a sealing bearing, the inner wall of the connecting pipe 456 is fixedly communicated with the surface of the cylindrical water inlet groove, one end of the connecting pipe 456 penetrates through the side surface of the cleaning box 41 and extends to the outer side of the cleaning box 41, and one end of the connecting pipe 456 positioned at the outer side of the cleaning box 41 is externally connected with a water inlet pipe through a flange; the external water inlet pipeline can be conveniently connected, so that the water source supply in the cleaning process is ensured to be sufficient, and the cleaning effect is ensured.
The cleaning mechanism has the advantages of comprehensive cleaning, uniform water spraying, cotton cleaning assistance, external water inlet pipe and sealing bearing design and the like, and can improve the cleaning efficiency and the cleaning quality.
In order to realize the rotation of the cleaning mechanism 45 by the driving mechanism 46, the driving mechanism 46 is provided with a placing frame 461 fixed on the lower surface of the cleaning tank 41, and a third motor 462 is fixedly connected inside the placing frame 461; the third motor 462 is fixed to the lower surface of the cleaning tank 41 by the placement frame 461, so that the transmission structure between the driving mechanism 46 and the cleaning mechanism 45 is more stable, vibration and noise are reduced, and the reliability of the whole system is improved.
The output shaft of the third motor 462 is fixedly connected with a second gear 463 through a coupling, one end of a fixing rod 451 positioned at the outer side of the cleaning box 41 is fixedly connected with a third gear 464, the second gear 463 is in transmission connection with a gear belt 465, and one end of the gear belt 465 is in transmission connection with the surface of the third gear 464.
In particular, by this mechanism, such an arrangement can effectively realize the rotation action of the cleaning mechanism 45, and has certain advantages in terms of stability, transmission efficiency, maintenance convenience, and the like.
Referring to fig. 1 to 6, a method for using a jig cleaning device for wafer plating includes the steps of:
Firstly, placing a wafer to be cleaned at the upper end of a wafer fixing mechanism 2 through a mechanical arm 3, driving a clamp at the tail end of the mechanical arm 3 to rotate to one side of a cleaning box 41, controlling a second motor 431 to drive a first gear 432 to rotate through a sensor, driving one side of the first gear 432 to rotate in the same direction with a wire rope coiling wheel 433 meshed with the first gear 432, driving the wire rope 435 to wind on the surface of the wire rope 433, and driving a cam 436 by the wire rope 435, wherein the cam 436 drives a split door 441 to move to the outer side of the cleaning box 41;
Step two, the mechanical arm 3 drives the clamp at the tail end of the mechanical arm to enter the cleaning box 41 until the clamp completely enters the cleaning box 41, the adsorption disc at the lower end of the mechanical arm 3 descends to be in contact with the upper end of the cleaning cotton 455, then the second motor 431 reversely rotates, the wire rope reeling wheel 433 loosens the winding wire rope 435, the split door 441 is restored under the action of the spring 444, and the silica gel gasket on the surface of the semicircular groove 446 is tightly attached to the surface of the connecting pipe at the tail end of the mechanical arm 3;
Step three, a third motor 462 drives a second gear 463 to rotate, and a gear belt 465 drives a fixed rod 451 fixedly connected with a third gear 464 to rotate, so as to drive a rotating column 452 fixedly connected with the fixed rod 451 to rotate, meanwhile, a water inlet pipe externally connected with a connecting pipe 456 is filled with purified water, the purified water is sprayed out through a water spraying hole 453, and the rotating cleaning cotton 455 cleans the lower end of an adsorption disc of a clamp at the tail end of a mechanical arm 3;
Step four, the water supply of the water inlet pipe in step three is stopped, the third motor 462 stops working, the rotation angle of the mechanical arm 3 is between 80 degrees and 90 degrees, the adsorption disc at the lower end of the clamp of the mechanical arm 3 is opposite to the lower end of the hot air pipe 424, meanwhile, a hot air blower externally connected with the hot air pipe 424 starts working, hot air is dried through the lower end of the hot air pipe 424, the first motor 422 drives the electric telescopic rod 423 connected with the bearing inner ring to rotate, so that the flat air outlet at the lower end of the hot air pipe 424 is driven to rotate for blowing, the intelligent control valve 47 is opened, and the waste water after cleaning and the internal hot air are discharged together through the negative pressure pipeline;
and step five, after the cleaning and drying are finished, the mechanical arm 3 is moved out, and the operations from the step one to the step five are repeated after the wafer to be cleaned is replaced.
The foregoing is only a preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art, who is within the scope of the present invention, should make equivalent substitutions or modifications according to the technical scheme of the present invention and the inventive concept thereof, and should be covered by the scope of the present invention.
Claims (7)
1. The utility model provides a wafer is electroplated and is used anchor clamps belt cleaning device, includes brace table (1), its characterized in that: the automatic cleaning device comprises a supporting table (1), and is characterized in that a wafer fixing mechanism (2) is arranged on the upper surface of the supporting table (1), a mechanical arm (3) is arranged on one side of the wafer fixing mechanism (2), a clamp cleaning assembly (4) is further arranged on the upper surface of the supporting table (1), the clamp cleaning assembly (4) comprises a cleaning box (41), a through hole is formed in the axis of the upper surface of the cleaning box (41), a drying mechanism (42) is fixedly connected to the inner wall of the through hole, a stretching mechanism (43) is arranged on one side of the cleaning box (41), an inlet and outlet groove is formed in one side of the cleaning box (41), an opening and closing mechanism (44) is slidably connected to the inner wall of the cleaning box (41) where the inlet and outlet groove is located, a cleaning mechanism (45) is arranged in the cleaning box (41), a driving mechanism (46) is fixedly connected to the lower surface of the cleaning box (41), an intelligent control valve (47) is fixedly connected to the lower surface of the cleaning box (41), and an intelligent control valve (47) is fixedly connected to the inner wall of the intelligent control valve (47), and the inner bottom wall of the intelligent control valve (47) is fixedly communicated with the inner bottom wall (47);
The drying mechanism (42) is used for realizing the drying action of the adsorption disc on the lower surface of the clamp at the tail end of the mechanical arm (3);
The drying mechanism (42) comprises a placing rack (421), a first motor (422) is fixedly connected to the inner wall of the placing rack (421), an output shaft of the first motor (422) is fixedly connected with an electric telescopic rod (423) through a coupler, an 'infinity' type fixing ring (425) is fixedly sleeved on the outer surface of the lower end of the electric telescopic rod (423), a hot air pipe (424) is fixedly connected to the inner wall of one side ring of the 'infinity' type fixing ring (425), a hot air fan is externally connected to the upper end of the hot air pipe (424), and the air outlet of the lower end of the hot air pipe (424) is flat;
The stretching mechanism (43) realizes the stretching action of the opening and closing mechanism (44);
The opening and closing mechanism (44) realizes the opening and closing action of the side surface of the cleaning box (41);
the cleaning mechanism (45) is used for cleaning the adsorption disc on the lower surface of the clamp at the tail end of the mechanical arm;
The cleaning mechanism (45) comprises a fixed rod (451), one end of the fixed rod (451) penetrates through the side face of the cleaning box (41) and the surface of the fixed rod (451) is rotatably connected with the inner wall of the cleaning box (41) through a bearing, the other end of the fixed rod (451) is fixedly connected with a rotating column (452), a cylindrical water inlet groove is formed in the axis of the rotating column (452), water spraying holes (453) are formed in the circumferential array of the outer surface of the rotating column (452), the inner wall of the water spraying holes (453) is fixedly communicated with the surface of the cylindrical water inlet groove, a T-shaped fixed groove is formed in the surface of the rotating column (452) and is positioned between the water spraying holes (453), a fixed strip (454) is fixedly connected with cleaning cotton (455) through a screw, a connecting pipe (456) is fixedly connected to the center of a circle of one side face of the rotating column (452) through a sealing bearing, and the inner wall of the connecting pipe (453) is fixedly communicated with the outer side face of the cleaning box (41) through a flange (456), and the outer side face of the connecting pipe (41) is fixedly connected with the outer side face of the cleaning box (41);
the driving mechanism (46) realizes the rotation action of the cleaning mechanism (45);
The stretching mechanism (43) comprises a second motor (431) with the bottom end fixed on the upper surface of the cleaning box (41), an output shaft of the second motor (431) is fixedly connected with a first gear (432) through a coupler, the first gear (432) is axially symmetrically provided with a steel wire rope winding wheel (433) along the vertical direction, one side surfaces of the two steel wire rope winding wheels (433) are respectively provided with a toothed surface meshed with the toothed surface of the first gear (432), one side of the steel wire rope winding wheel (433) is rotationally connected with the side surface of the cleaning box (41), the surface of the steel wire rope winding wheel (433) is wound with a steel wire rope (435), the surface of the steel wire rope (435) is slidably connected with a fixed pulley (434), one end of the fixed pulley (434) is fixedly connected with the side surface of the cleaning box (41), and one end of the steel wire rope (435) is fixedly connected with a cam (436).
2. The jig cleaning apparatus for wafer plating according to claim 1, wherein: the opening and closing mechanism (44) comprises a side face and a side-by-side door (441) fixedly connected with one end of a cam (436), an L-shaped cross section (442) is arranged at the upper end of the side-by-side door (441), a telescopic rod (443) is fixedly connected with the surface of the L-shaped cross section (442), one end of the telescopic rod (443) is fixedly connected with the inner wall of the cleaning box (41), a spring (444) is sleeved on the surface of the telescopic rod (443), a T-shaped sliding groove (445) is further formed in one side of the upper end of the side-by-side door (441), the surface of the T-shaped sliding groove (445) is in sliding connection with the inner top wall of the cleaning box (41), and semicircular grooves (446) are formed in opposite sides of the two side-by-side doors (441).
3. The jig cleaning apparatus for wafer plating according to claim 2, wherein: the round grooves formed by the two semicircular grooves (446) are matched with the surfaces of round tubes fixedly connected with the tail ends of the mechanical arms (3), silica gel gaskets are arranged on the surfaces of the two semicircular grooves (446), and polyurethane sealing layers are smeared at the contact positions of the side-by-side doors (441) and the inner walls of the cleaning boxes (41).
4. A jig cleaning apparatus for wafer plating according to claim 3, wherein: the driving mechanism (46) comprises a placing frame (461) fixed on the lower surface of the cleaning box (41), a third motor (462) is fixedly connected to the inside of the placing frame (461), a second gear (463) is fixedly connected to an output shaft of the third motor (462) through a coupler, a third gear (464) is fixedly connected to one end of the fixing rod (451) located on the outer side of the cleaning box (41), a gear belt (465) is connected to the second gear (463) in a transmission mode, and one end of the gear belt (465) is connected to the surface of the third gear (464) in a transmission mode.
5. The jig cleaning apparatus for wafer plating according to claim 4, wherein: the surface of the T-shaped chute (445) is smeared with lubricating grease.
6. The jig cleaning apparatus for wafer plating according to claim 5, wherein: a sensor is embedded in the surface of the cleaning box (41) outside the side-by-side door (441).
7. The method of using a jig cleaning apparatus for wafer plating according to claim 6, comprising the steps of:
Firstly, placing a wafer to be cleaned at the upper end of a wafer fixing mechanism (2) through a mechanical arm (3), driving a clamp at the tail end of the mechanical arm (3) to rotate to one side of a cleaning box (41), controlling a second motor (431) to drive a first gear (432) to rotate through a sensor, driving one side of the first gear (432) to rotate in the same direction with a wire rope coiling wheel (433) meshed with the first gear, driving the wire rope (435) to wind on the surface of the wire rope coiling wheel (433), and driving the wire rope (435) to pull a cam (436), wherein the cam (436) drives a split door (441) to move to the outer side of the cleaning box (41);
Step two, the mechanical arm (3) drives the clamp at the tail end of the mechanical arm to enter the cleaning box (41) until the clamp completely enters the cleaning box (41) and the mechanical arm (3) descends to the lower end of the mechanical arm to enable the adsorption disc to be in contact with the upper end of the cleaning cotton (455), then the second motor (431) reversely rotates, the winding steel wire rope (435) is loosened by the steel wire rope winding wheel (433), the opposite opening door (441) is restored under the action of the spring (444), and the silica gel gasket on the surface of the semicircular groove (446) is tightly attached to the surface of the tail end connecting pipe of the mechanical arm (3);
Step three, a third motor (462) drives a second gear (463) to rotate, a gear belt (465) drives a fixed rod (451) fixedly connected with a third gear (464) to rotate, so that a rotating column (452) fixedly connected with the fixed rod (451) is driven to rotate, meanwhile, a water inlet pipe externally connected with a connecting pipe (456) is filled with purified water, the purified water is sprayed out through a water spraying hole (453), and rotary cleaning cotton (455) cleans the lower end of an adsorption disc of a clamp at the tail end of a mechanical arm (3);
Step four, the water supply of the water inlet pipe in the step three is stopped, the third motor (462) stops working, the rotation angle of the mechanical arm (3) is between 80 degrees and 90 degrees, the adsorption disc at the lower end of the clamp of the mechanical arm (3) and the lower end of the hot air pipe (424) are located on opposite surfaces, meanwhile, the hot air starts to work through an external hot air machine of the hot air pipe (424), the adsorption disc is dried through the lower end of the hot air pipe (424), the first motor (422) drives the electric telescopic rod (423) connected with the bearing inner ring to rotate, so that the flat air outlet at the lower end of the hot air pipe (424) is driven to rotate for blowing, the intelligent control valve (47) is opened, and the waste water after cleaning and the internal hot air are discharged together through the negative pressure pipeline;
and step five, after the cleaning and drying are finished, the mechanical arm (3) is moved out, and the operations from the step one to the step five are repeated after the wafer to be cleaned is replaced.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202410573126.1A CN118142925B (en) | 2024-05-10 | 2024-05-10 | Clamp cleaning device for wafer electroplating |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202410573126.1A CN118142925B (en) | 2024-05-10 | 2024-05-10 | Clamp cleaning device for wafer electroplating |
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| CN118142925B true CN118142925B (en) | 2024-07-09 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN117531746A (en) * | 2023-11-28 | 2024-02-09 | 兴化市兆泰金属材料有限公司 | Intelligent processing and cleaning device for metal materials |
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| CN112038270B (en) * | 2020-11-02 | 2021-01-19 | 宁波丞达精机股份有限公司 | Wafer processing device and processing method |
| JP2024066669A (en) * | 2022-11-02 | 2024-05-16 | 株式会社荏原製作所 | SUBSTRATE CLEANING APPARATUS, SUBSTRATE DRYING APPARATUS, SUBSTRATE TRANSPORT APPARATUS, SUBSTRATE MOUNTING APPARATUS, SUBSTRATE PROCESSING APPARATUS, CHARGE AMOUNT CONTROL METHOD, AND CHARGE AMOUNT CONTROL PROGRAM |
| CN117718268A (en) * | 2024-01-10 | 2024-03-19 | 江西巨浪压缩机有限公司 | Cleaning mechanism for cleaning air cooling screw of air compressor |
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| CN117531746A (en) * | 2023-11-28 | 2024-02-09 | 兴化市兆泰金属材料有限公司 | Intelligent processing and cleaning device for metal materials |
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