CN118126634A - Potting material with good heat insulation performance - Google Patents
Potting material with good heat insulation performance Download PDFInfo
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- CN118126634A CN118126634A CN202410253237.4A CN202410253237A CN118126634A CN 118126634 A CN118126634 A CN 118126634A CN 202410253237 A CN202410253237 A CN 202410253237A CN 118126634 A CN118126634 A CN 118126634A
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- CN
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- Prior art keywords
- potting material
- insulation performance
- heat insulation
- good heat
- metallized film
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- 239000000463 material Substances 0.000 title claims abstract description 36
- 238000004382 potting Methods 0.000 title claims abstract description 28
- 238000009413 insulation Methods 0.000 title claims abstract description 18
- 229920005989 resin Polymers 0.000 claims abstract description 22
- 239000011347 resin Substances 0.000 claims abstract description 22
- 239000003822 epoxy resin Substances 0.000 claims abstract description 18
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 18
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 17
- 239000000843 powder Substances 0.000 claims abstract description 16
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000012752 auxiliary agent Substances 0.000 claims abstract description 6
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims abstract description 5
- 239000007822 coupling agent Substances 0.000 claims abstract description 5
- 239000003063 flame retardant Substances 0.000 claims abstract description 5
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 8
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims description 6
- 150000003512 tertiary amines Chemical class 0.000 claims description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 5
- DLHONNLASJQAHX-UHFFFAOYSA-N aluminum;potassium;oxygen(2-);silicon(4+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[O-2].[O-2].[O-2].[Al+3].[Si+4].[Si+4].[Si+4].[K+] DLHONNLASJQAHX-UHFFFAOYSA-N 0.000 claims description 4
- 239000011324 bead Substances 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 3
- 239000010453 quartz Substances 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- -1 acrylic ester Chemical class 0.000 claims description 2
- 239000003990 capacitor Substances 0.000 abstract description 18
- 239000011104 metalized film Substances 0.000 abstract description 17
- 238000005476 soldering Methods 0.000 abstract description 14
- 239000000565 sealant Substances 0.000 abstract description 6
- 239000012776 electronic material Substances 0.000 abstract description 2
- 238000004806 packaging method and process Methods 0.000 abstract description 2
- 238000001723 curing Methods 0.000 description 15
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 230000008569 process Effects 0.000 description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 125000002723 alicyclic group Chemical group 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 239000003085 diluting agent Substances 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- LTVUCOSIZFEASK-MPXCPUAZSA-N (3ar,4s,7r,7as)-3a-methyl-3a,4,7,7a-tetrahydro-4,7-methano-2-benzofuran-1,3-dione Chemical compound C([C@H]1C=C2)[C@H]2[C@H]2[C@]1(C)C(=O)OC2=O LTVUCOSIZFEASK-MPXCPUAZSA-N 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 239000003779 heat-resistant material Substances 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical group O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention discloses a potting material with good heat insulation performance, which belongs to the technical field of electronic materials, and comprises the following components in percentage by mass: resin part: 30-40% of epoxy resin, 52-65% of inorganic powder, 4-6% of flame retardant powder and 1-2% of auxiliary agent; curing agent part: 95-97% of methyl tetrahydrophthalic anhydride, 2-3% of accelerator and 1-2% of coupling agent; the resin part and the curing agent part are mixed according to the mass ratio of 100:30-50. The invention can improve the heat resistance of the metallized film capacitor packaging pouring sealant, reduce the heat conductivity coefficient of the traditional pouring sealant, and can perform the pouring sealant configuration with different heat resistance capacities according to different materials. Therefore, when the client PCB is assembled, the metallized film capacitor is soldered by reflow soldering, the temperature can not be quickly transferred into the product to melt the product, and the metallized film capacitor has the advantages of low cost, easy operation, high efficiency and high reliability.
Description
Technical Field
The invention belongs to the technical field of electronic materials, and particularly relates to a potting material with good heat insulation performance.
Background
Metallized film capacitors are the primary electronic components in electronic devices. The metallized film capacitor adopts a metallized film non-inductive winding structure, has good self-healing performance, high insulation resistance and stable capacitance. The DC/DC pulse circuit is suitable for DC and pulse circuits, and is widely applied to occasions such as filtering, blocking, bypass, coupling, noise reduction and the like in the fields of various electronic appliances, electrical equipment and new energy sources. At present, the metallized film has poor temperature resistance, and can shrink severely under the environment of 130 ℃ and even melt out. Meanwhile, the metallized film capacitor is subjected to a high-temperature reflow soldering process, the furnace temperature of the metallized film capacitor is about 260 ℃ and far exceeds the upper temperature limit of the metallized film capacitor, the capacitor is required to be packaged before the high-temperature reflow soldering process is carried out, the currently adopted main packaging material is epoxy resin, the heat conduction coefficient of the epoxy resin is 0.2-0.4W/m K, and in the tunnel furnace process, heat can be rapidly conducted to the metallized film inside the capacitor, and product burst occurs. The epoxy resin potting material mainly adopts bisphenol A epoxy resin and anhydride to carry out heat curing reaction, wherein powder materials are added to be used as heat-resistant materials, the powder materials mainly comprise aluminum hydroxide/silicon micropowder to be used as filling materials, wherein the heat conductivity coefficient of the aluminum hydroxide is 2.5-4W/m K, the heat conductivity coefficient of the silicon micropowder is 100-200W/m K, the proportion of the aluminum hydroxide or/and the silicon micropowder in the existing powder materials reaches 52-65%, so that the heat conductivity coefficient of the epoxy resin potting adhesive is greatly increased, but for surface-mounted reflow soldering products, the lower the heat conductivity coefficient is, the better the lower the heat conductivity coefficient is, the heat in the reflow soldering process can be prevented from being rapidly transferred into a metallized film of a film capacitor, and the film is prevented from being heated and melted. Therefore, how to reduce the heat conductivity coefficient of the potting material, improve the heat resistance of the product, protect the core from the heat in the reflow soldering process, and become the key of whether the metallized film capacitor can pass through the reflow soldering tunnel furnace.
An epoxy resin potting material disclosed in Chinese patent number ZL201510031518.6, a preparation method and application thereof, wherein the epoxy resin potting material is mainly prepared from the following raw materials: resin part: bisphenol A type epoxy resin, dicyclopentadiene phenol type epoxy resin, a multifunctional diluent, a filler, a silane coupling agent and an auxiliary agent; curing agent part: methyl nadic anhydride and/or methyl tetrahydrophthalic anhydride, alicyclic epoxy resin and accelerator; mixing the resin part and the curing agent part. According to the encapsulating material, dicyclopentadiene phenol type epoxy resin is added into a resin part, a silane coupling agent is used for activating a filler, and a multifunctional diluent is matched with the filler, and alicyclic epoxy resin is added into a curing agent part, so that the finally obtained encapsulating material has the characteristics of high temperature resistance and high humidity resistance. The potting material is used for preparing the capacitor, so that the capacitor has stable capacity, small capacity and longer service life when being electrified at high temperature and high humidity and operated with load. The filler in the encapsulating material is at least one of aluminum hydroxide, silicon micropowder and calcium carbonate, the heat conductivity coefficient is large, and when the PCB assembly of the client is subjected to reflow soldering, the soldering temperature can be quickly transferred to the inside of the capacitor to cause the metallized film to melt.
Disclosure of Invention
Aiming at the defects of the prior art, the invention reduces the heat conductivity coefficient of the potting material through material replacement, improves the heat resistance of the product and protects the core from the heat in the reflow soldering process.
The invention discloses a potting material with good heat insulation performance, which consists of the following components in percentage by mass: resin part: resin part: 30-40% of epoxy resin, 52-65% of inorganic powder, 4-6% of flame retardant powder and 1-2% of auxiliary agent;
Curing agent part: 95-97% of methyl tetrahydrophthalic anhydride, 2-3% of accelerator and 1-2% of coupling agent;
and mixing the resin part and the curing agent part according to the mass ratio of 100:30-50, and curing.
Preferably, the inorganic powder is at least one of potassium feldspar, hollow glass beads and quartz powder.
Preferably, the flame retardant powder is aluminum oxide.
Preferably, the auxiliary agent is acrylic ester.
Preferably, the coupling agent is a silane coupling agent.
Preferably, the accelerator is at least one of tertiary amine and imidazole.
Preferably, the curing condition of the potting material is that the potting material is cured for 1.5 to 2 hours at the temperature of 100 to 120 ℃.
Compared with the prior art, the invention has the following advantages:
The invention can improve the heat resistance and adhesion performance of the packaging pouring sealant of the metallized film capacitor, reduce the heat conductivity coefficient of the traditional pouring sealant, and can perform the pouring sealant configuration with different heat resistance capacities according to different materials. Therefore, when the metallized film capacitor is assembled on the PCB of the client, the temperature can not be quickly transferred to the inside of the product to melt the product through reflow soldering, and the metallized film capacitor has the advantages of low cost, easy operation, high efficiency and high reliability.
Drawings
FIG. 1 is a graph of furnace temperature versus time for the reflow soldering high temperature bake test of example 1.
Detailed Description
The following will describe embodiments of the present invention in detail with reference to specific examples, thereby solving the technical problems by applying technical means to the present invention, and realizing the technical effects can be fully understood and implemented accordingly. Unless otherwise indicated, the technical means employed in the examples are conventional means well known to those skilled in the art, and the starting materials employed are also commercially available. Various processes and methods not described in detail are conventional methods well known in the art.
Example 1
The invention discloses a potting material with good heat insulation performance, which consists of the following components in percentage by mass: resin part: resin part: 35% of epoxy resin, 60% of potassium feldspar, 4% of alumina and 1% of methyl acrylate;
Curing agent part: 95% of methyltetrahydrophthalic anhydride, 3% of tertiary amine and 2% of silane coupling agent;
The resin part and the curing agent part are mixed according to the mass ratio of 100:50, and are cured for 1.5 hours at the temperature of 110 ℃.
Example 2
The invention discloses a potting material with good heat insulation performance, which consists of the following components in percentage by mass: resin part: resin part: 35% of epoxy resin, 60% of quartz powder, 4% of alumina and 1% of methyl acrylate;
Curing agent part: 95% of methyltetrahydrophthalic anhydride, 3% of tertiary amine and 2% of silane coupling agent;
The resin part and the curing agent part are mixed according to the mass ratio of 100:50, and are cured for 1.5 hours at the temperature of 110 ℃.
Example 3
The invention discloses a potting material with good heat insulation performance, which consists of the following components in percentage by mass: resin part: resin part: 35% of epoxy resin, 60% of hollow glass beads, 4% of alumina and 1% of methyl acrylate;
Curing agent part: 95% of methyltetrahydrophthalic anhydride, 3% of tertiary amine and 2% of silane coupling agent;
The resin part and the curing agent part are mixed according to the mass ratio of 100:50, and are cured for 1.5 hours at the temperature of 110 ℃.
Example 4
The invention discloses a potting material with good heat insulation performance, which consists of the following components in percentage by mass: resin part: resin part: 40% of epoxy resin, 53% of potassium feldspar, 5% of alumina and 2% of methyl acrylate;
Curing agent part: 95% of methyltetrahydrophthalic anhydride, 3% of tertiary amine and 2% of silane coupling agent;
the resin part and the curing agent part are mixed according to the mass ratio of 100:40, and are cured for 1.5 hours at the temperature of 110 ℃.
Reflow soldering high temperature baking test was performed on the potting compound of example 1, and the experimental results are shown in table 1 below:
description: CAP is capacity, TAN is loss, and IR is insulation resistance. The furnace temperature and time curve of the reflow soldering high temperature baking test is shown in figure 1.
The foregoing is merely exemplary embodiments of the present invention, and it should be noted that various changes, modifications, substitutions and alterations can be made herein by those skilled in the art without departing from the technical principles of the present invention, which are also intended to be regarded as the scope of the invention.
Claims (7)
1. The potting material with good heat insulation performance is characterized by comprising the following components in percentage by mass:
Resin part: 30-40% of epoxy resin, 52-65% of inorganic powder, 4-6% of flame retardant powder and 1-2% of auxiliary agent;
curing agent part: 95-97% of methyl tetrahydrophthalic anhydride, 2-3% of accelerator and 1-2% of coupling agent;
and mixing the resin part and the curing agent part according to the mass ratio of 100:30-50, and curing.
2. The potting material with good heat insulation performance according to claim 1, wherein the inorganic powder is at least one of potassium feldspar, hollow glass beads and quartz powder.
3. The potting material with good heat insulation performance as claimed in claim 1, wherein the flame retardant powder is alumina.
4. The potting material with good heat insulation performance according to claim 1, wherein the auxiliary agent is acrylic ester.
5. The potting material with good heat insulation performance according to claim 1, wherein the coupling agent is a silane coupling agent.
6. The potting material with good heat insulation performance according to claim 1, wherein the accelerator is at least one of tertiary amine and imidazole.
7. The potting material with good heat insulation performance according to claim 1, wherein the curing condition of the potting material is that the potting material is cured for 1.5-2 hours at a temperature of 100-120 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410253237.4A CN118126634A (en) | 2024-03-06 | 2024-03-06 | Potting material with good heat insulation performance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410253237.4A CN118126634A (en) | 2024-03-06 | 2024-03-06 | Potting material with good heat insulation performance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN118126634A true CN118126634A (en) | 2024-06-04 |
Family
ID=91243770
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410253237.4A Pending CN118126634A (en) | 2024-03-06 | 2024-03-06 | Potting material with good heat insulation performance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN118126634A (en) |
-
2024
- 2024-03-06 CN CN202410253237.4A patent/CN118126634A/en active Pending
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