CN118126437A - Resin composition, master batch, adhesive film, photovoltaic module and display device - Google Patents
Resin composition, master batch, adhesive film, photovoltaic module and display device Download PDFInfo
- Publication number
- CN118126437A CN118126437A CN202211538886.6A CN202211538886A CN118126437A CN 118126437 A CN118126437 A CN 118126437A CN 202211538886 A CN202211538886 A CN 202211538886A CN 118126437 A CN118126437 A CN 118126437A
- Authority
- CN
- China
- Prior art keywords
- quantum dots
- resin composition
- adhesive film
- film
- doping agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002313 adhesive film Substances 0.000 title claims abstract description 49
- 239000011342 resin composition Substances 0.000 title claims abstract description 36
- 239000004594 Masterbatch (MB) Substances 0.000 title claims abstract description 12
- 239000002096 quantum dot Substances 0.000 claims abstract description 101
- 239000002019 doping agent Substances 0.000 claims abstract description 45
- 229920005989 resin Polymers 0.000 claims abstract description 20
- 239000011347 resin Substances 0.000 claims abstract description 20
- 239000011159 matrix material Substances 0.000 claims abstract description 12
- 229910044991 metal oxide Inorganic materials 0.000 claims abstract description 11
- 150000004706 metal oxides Chemical group 0.000 claims abstract description 11
- 229910052976 metal sulfide Inorganic materials 0.000 claims abstract description 8
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 46
- -1 amine cations Chemical class 0.000 claims description 26
- 239000011787 zinc oxide Substances 0.000 claims description 12
- 238000007789 sealing Methods 0.000 claims description 10
- 239000010410 layer Substances 0.000 claims description 9
- 239000002356 single layer Substances 0.000 claims description 7
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 125000000217 alkyl group Chemical group 0.000 claims description 3
- 125000003118 aryl group Chemical group 0.000 claims description 3
- UHYPYGJEEGLRJD-UHFFFAOYSA-N cadmium(2+);selenium(2-) Chemical class [Se-2].[Cd+2] UHYPYGJEEGLRJD-UHFFFAOYSA-N 0.000 claims description 3
- 229910052799 carbon Inorganic materials 0.000 claims description 3
- 239000002105 nanoparticle Substances 0.000 claims description 3
- 150000003376 silicon Chemical class 0.000 claims description 2
- 229920006280 packaging film Polymers 0.000 claims 1
- 239000012785 packaging film Substances 0.000 claims 1
- 238000006243 chemical reaction Methods 0.000 abstract description 23
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 12
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract description 6
- 230000009286 beneficial effect Effects 0.000 abstract description 6
- 229910052760 oxygen Inorganic materials 0.000 abstract description 6
- 239000001301 oxygen Substances 0.000 abstract description 6
- 239000000126 substance Substances 0.000 abstract description 6
- 239000013078 crystal Substances 0.000 abstract description 5
- 239000005038 ethylene vinyl acetate Substances 0.000 description 12
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 12
- 239000003292 glue Substances 0.000 description 8
- 239000000203 mixture Substances 0.000 description 8
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 8
- 238000012360 testing method Methods 0.000 description 7
- 239000003431 cross linking reagent Substances 0.000 description 6
- 238000004806 packaging method and process Methods 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- 239000003963 antioxidant agent Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 229920001577 copolymer Polymers 0.000 description 5
- 229910021419 crystalline silicon Inorganic materials 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 230000003078 antioxidant effect Effects 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 239000004611 light stabiliser Substances 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 238000002834 transmittance Methods 0.000 description 4
- 229940124543 ultraviolet light absorber Drugs 0.000 description 4
- 239000002250 absorbent Substances 0.000 description 3
- 230000002745 absorbent Effects 0.000 description 3
- 239000005022 packaging material Substances 0.000 description 3
- MYWOJODOMFBVCB-UHFFFAOYSA-N 1,2,6-trimethylphenanthrene Chemical compound CC1=CC=C2C3=CC(C)=CC=C3C=CC2=C1C MYWOJODOMFBVCB-UHFFFAOYSA-N 0.000 description 2
- RKMGAJGJIURJSJ-UHFFFAOYSA-N 2,2,6,6-Tetramethylpiperidine Substances CC1(C)CCCC(C)(C)N1 RKMGAJGJIURJSJ-UHFFFAOYSA-N 0.000 description 2
- PUGOMSLRUSTQGV-UHFFFAOYSA-N 2,3-di(prop-2-enoyloxy)propyl prop-2-enoate Chemical class C=CC(=O)OCC(OC(=O)C=C)COC(=O)C=C PUGOMSLRUSTQGV-UHFFFAOYSA-N 0.000 description 2
- BJELTSYBAHKXRW-UHFFFAOYSA-N 2,4,6-triallyloxy-1,3,5-triazine Chemical compound C=CCOC1=NC(OCC=C)=NC(OCC=C)=N1 BJELTSYBAHKXRW-UHFFFAOYSA-N 0.000 description 2
- BVUXDWXKPROUDO-UHFFFAOYSA-N 2,6-di-tert-butyl-4-ethylphenol Chemical compound CCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 BVUXDWXKPROUDO-UHFFFAOYSA-N 0.000 description 2
- XFCMNSHQOZQILR-UHFFFAOYSA-N 2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOC(=O)C(C)=C XFCMNSHQOZQILR-UHFFFAOYSA-N 0.000 description 2
- XOUQAVYLRNOXDO-UHFFFAOYSA-N 2-tert-butyl-5-methylphenol Chemical compound CC1=CC=C(C(C)(C)C)C(O)=C1 XOUQAVYLRNOXDO-UHFFFAOYSA-N 0.000 description 2
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 150000001491 aromatic compounds Chemical class 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 2
- 239000012634 fragment Substances 0.000 description 2
- 229920000578 graft copolymer Polymers 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- QUAMTGJKVDWJEQ-UHFFFAOYSA-N octabenzone Chemical compound OC1=CC(OCCCCCCCC)=CC=C1C(=O)C1=CC=CC=C1 QUAMTGJKVDWJEQ-UHFFFAOYSA-N 0.000 description 2
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical compound OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 229940116351 sebacate Drugs 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-L sebacate(2-) Chemical compound [O-]C(=O)CCCCCCCCC([O-])=O CXMXRPHRNRROMY-UHFFFAOYSA-L 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- RIPYNJLMMFGZSX-UHFFFAOYSA-N (5-benzoylperoxy-2,5-dimethylhexan-2-yl) benzenecarboperoxoate Chemical compound C=1C=CC=CC=1C(=O)OOC(C)(C)CCC(C)(C)OOC(=O)C1=CC=CC=C1 RIPYNJLMMFGZSX-UHFFFAOYSA-N 0.000 description 1
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 description 1
- GOAHRBQLKIZLKG-UHFFFAOYSA-N 1-tert-butylperoxybutane Chemical compound CCCCOOC(C)(C)C GOAHRBQLKIZLKG-UHFFFAOYSA-N 0.000 description 1
- WMYINDVYGQKYMI-UHFFFAOYSA-N 2-[2,2-bis(hydroxymethyl)butoxymethyl]-2-ethylpropane-1,3-diol Chemical compound CCC(CO)(CO)COCC(CC)(CO)CO WMYINDVYGQKYMI-UHFFFAOYSA-N 0.000 description 1
- YIJYFLXQHDOQGW-UHFFFAOYSA-N 2-[2,4,6-trioxo-3,5-bis(2-prop-2-enoyloxyethyl)-1,3,5-triazinan-1-yl]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCN1C(=O)N(CCOC(=O)C=C)C(=O)N(CCOC(=O)C=C)C1=O YIJYFLXQHDOQGW-UHFFFAOYSA-N 0.000 description 1
- HWSSEYVMGDIFMH-UHFFFAOYSA-N 2-[2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOCCOC(=O)C(C)=C HWSSEYVMGDIFMH-UHFFFAOYSA-N 0.000 description 1
- GTELLNMUWNJXMQ-UHFFFAOYSA-N 2-ethyl-2-(hydroxymethyl)propane-1,3-diol;prop-2-enoic acid Chemical class OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.CCC(CO)(CO)CO GTELLNMUWNJXMQ-UHFFFAOYSA-N 0.000 description 1
- IQQVCMQJDJSRFU-UHFFFAOYSA-N 2-ethyl-2-(hydroxymethyl)propane-1,3-diol;prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.CCC(CO)(CO)CO IQQVCMQJDJSRFU-UHFFFAOYSA-N 0.000 description 1
- SKVOYPCECYQZAI-UHFFFAOYSA-N 2-ethylhexyl 2-methylbutan-2-ylperoxy carbonate Chemical compound CCCCC(CC)COC(=O)OOOC(C)(C)CC SKVOYPCECYQZAI-UHFFFAOYSA-N 0.000 description 1
- LZHCVNIARUXHAL-UHFFFAOYSA-N 2-tert-butyl-4-ethylphenol Chemical compound CCC1=CC=C(O)C(C(C)(C)C)=C1 LZHCVNIARUXHAL-UHFFFAOYSA-N 0.000 description 1
- IKEHOXWJQXIQAG-UHFFFAOYSA-N 2-tert-butyl-4-methylphenol Chemical compound CC1=CC=C(O)C(C(C)(C)C)=C1 IKEHOXWJQXIQAG-UHFFFAOYSA-N 0.000 description 1
- SFDGJDBLYNJMFI-UHFFFAOYSA-N 3,1-benzoxazin-4-one Chemical compound C1=CC=C2C(=O)OC=NC2=C1 SFDGJDBLYNJMFI-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- PFRLCKFENIXNMM-UHFFFAOYSA-N 3-trimethylsilylpropan-1-amine Chemical compound C[Si](C)(C)CCCN PFRLCKFENIXNMM-UHFFFAOYSA-N 0.000 description 1
- 229920002126 Acrylic acid copolymer Polymers 0.000 description 1
- 241000208818 Helianthus Species 0.000 description 1
- 235000003222 Helianthus annuus Nutrition 0.000 description 1
- 229910018068 Li 2 O Inorganic materials 0.000 description 1
- GIATZHZBSIMOEE-UHFFFAOYSA-N P(O)(O)O.P(O)(O)O.C(C)(C)(C)C1=C(C=CC(=C1)C(C)(C)C)C(O)(C(CO)(CO)CO)C1=C(C=C(C=C1)C(C)(C)C)C(C)(C)C Chemical compound P(O)(O)O.P(O)(O)O.C(C)(C)(C)C1=C(C=CC(=C1)C(C)(C)C)C(O)(C(CO)(CO)CO)C1=C(C=C(C=C1)C(C)(C)C)C(C)(C)C GIATZHZBSIMOEE-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- JKIJEFPNVSHHEI-UHFFFAOYSA-N Phenol, 2,4-bis(1,1-dimethylethyl)-, phosphite (3:1) Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP(OC=1C(=CC(=CC=1)C(C)(C)C)C(C)(C)C)OC1=CC=C(C(C)(C)C)C=C1C(C)(C)C JKIJEFPNVSHHEI-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 1
- OKKRPWIIYQTPQF-UHFFFAOYSA-N Trimethylolpropane trimethacrylate Chemical compound CC(=C)C(=O)OCC(CC)(COC(=O)C(C)=C)COC(=O)C(C)=C OKKRPWIIYQTPQF-UHFFFAOYSA-N 0.000 description 1
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 description 1
- VLVZXTNDRFWYLF-UHFFFAOYSA-N [2-ethyl-2-(prop-2-enoyloxymethyl)hexyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CC)(CCCC)COC(=O)C=C VLVZXTNDRFWYLF-UHFFFAOYSA-N 0.000 description 1
- BGYHLZZASRKEJE-UHFFFAOYSA-N [3-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]-2,2-bis[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxymethyl]propyl] 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCC(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 BGYHLZZASRKEJE-UHFFFAOYSA-N 0.000 description 1
- KNSXNCFKSZZHEA-UHFFFAOYSA-N [3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical class C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C KNSXNCFKSZZHEA-UHFFFAOYSA-N 0.000 description 1
- DFWZMKPMKLOVGJ-UHFFFAOYSA-N [4-[4-bis(2,4-ditert-butylphenoxy)phosphanyloxyphenyl]phenyl] bis(2,4-ditert-butylphenyl) phosphite Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP(OC=1C(=CC(=CC=1)C(C)(C)C)C(C)(C)C)OC1=CC=C(C=2C=CC(OP(OC=3C(=CC(=CC=3)C(C)(C)C)C(C)(C)C)OC=3C(=CC(=CC=3)C(C)(C)C)C(C)(C)C)=CC=2)C=C1 DFWZMKPMKLOVGJ-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000002318 adhesion promoter Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 150000008366 benzophenones Chemical class 0.000 description 1
- 150000001565 benzotriazoles Chemical class 0.000 description 1
- ZEFSGHVBJCEKAZ-UHFFFAOYSA-N bis(2,4-ditert-butyl-6-methylphenyl) ethyl phosphite Chemical compound CC=1C=C(C(C)(C)C)C=C(C(C)(C)C)C=1OP(OCC)OC1=C(C)C=C(C(C)(C)C)C=C1C(C)(C)C ZEFSGHVBJCEKAZ-UHFFFAOYSA-N 0.000 description 1
- QUZSUMLPWDHKCJ-UHFFFAOYSA-N bisphenol A dimethacrylate Chemical class C1=CC(OC(=O)C(=C)C)=CC=C1C(C)(C)C1=CC=C(OC(=O)C(C)=C)C=C1 QUZSUMLPWDHKCJ-UHFFFAOYSA-N 0.000 description 1
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 1
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- MCPKSFINULVDNX-UHFFFAOYSA-N drometrizole Chemical compound CC1=CC=C(O)C(N2N=C3C=CC=CC3=N2)=C1 MCPKSFINULVDNX-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- STVZJERGLQHEKB-UHFFFAOYSA-N ethylene glycol dimethacrylate Chemical compound CC(=C)C(=O)OCCOC(=O)C(C)=C STVZJERGLQHEKB-UHFFFAOYSA-N 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000005283 ground state Effects 0.000 description 1
- MWHNJARVACPRAF-UHFFFAOYSA-N hydroxy 2-methylbutan-2-yl carbonate Chemical compound CCC(C)(C)OC(=O)OO MWHNJARVACPRAF-UHFFFAOYSA-N 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910001502 inorganic halide Inorganic materials 0.000 description 1
- YOBAEOGBNPPUQV-UHFFFAOYSA-N iron;trihydrate Chemical compound O.O.O.[Fe].[Fe] YOBAEOGBNPPUQV-UHFFFAOYSA-N 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- OTRIMLCPYJAPPD-UHFFFAOYSA-N methanol prop-2-enoic acid Chemical compound OC.OC.OC(=O)C=C.OC(=O)C=C OTRIMLCPYJAPPD-UHFFFAOYSA-N 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- YDKNBNOOCSNPNS-UHFFFAOYSA-N methyl 1,3-benzoxazole-2-carboxylate Chemical compound C1=CC=C2OC(C(=O)OC)=NC2=C1 YDKNBNOOCSNPNS-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 1
- SSDSCDGVMJFTEQ-UHFFFAOYSA-N octadecyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 SSDSCDGVMJFTEQ-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 238000001782 photodegradation Methods 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000005871 repellent Substances 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 238000013112 stability test Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical compound CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 description 1
- 238000000870 ultraviolet spectroscopy Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/16—Halogen-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/20—Compounding polymers with additives, e.g. colouring
- C08J3/22—Compounding polymers with additives, e.g. colouring using masterbatch techniques
- C08J3/226—Compounding polymers with additives, e.g. colouring using masterbatch techniques using a polymer as a carrier
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/30—Sulfur-, selenium- or tellurium-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/32—Phosphorus-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/04—Homopolymers or copolymers of ethene
- C09J123/08—Copolymers of ethene
- C09J123/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
- C09J123/0853—Vinylacetate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2423/00—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers
- C08J2423/02—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers not modified by chemical after treatment
- C08J2423/04—Homopolymers or copolymers of ethene
- C08J2423/08—Copolymers of ethene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2203—Oxides; Hydroxides of metals of lithium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2231—Oxides; Hydroxides of metals of tin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2296—Oxides; Hydroxides of metals of zinc
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/30—Sulfur-, selenium- or tellurium-containing compounds
- C08K2003/3009—Sulfides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention provides a resin composition, a master batch, an adhesive film, a photovoltaic module and a display device. The resin composition comprises the following components in parts by weight: 100 parts of matrix resin, 0.01-5 parts of quantum dots and 0.01-1 part of doping agent, wherein the doping agent is selected from metal oxide or metal sulfide. The addition of the quantum dots is beneficial to improving the photoelectric conversion efficiency of the adhesive film, and the matrix resin (such as EVA resin) is easy to generate moisture after being solidified into a film, and the quantum dots are unstable when meeting water. The metal oxide or the metal sulfide is added as the doping agent, so that on one hand, the doping agent can be combined with the quantum dots to form a relatively stable crystal structure, on the other hand, the two substances also have relatively good compactness, and after the doping agent is added, water and oxygen can be inhibited from contacting with the quantum dots, and therefore, the stability of the quantum dots in a film formed after the resin composition is solidified can be greatly improved after the doping agent is added. The adhesive film formed after the resin composition is cured can greatly improve the photoelectric conversion efficiency of the adhesive film.
Description
Technical Field
The invention relates to the field of photovoltaics, in particular to a resin composition, master batch, adhesive film, a photovoltaic module and a display device.
Background
The ultraviolet absorber in the EVA film is typically an aromatic compound. These aromatic compounds are conjugated to carbonyl groups and have an electron-releasing amine or methoxy group in the ortho or para position. When irradiated by ultraviolet rays, the ultraviolet absorber is excited to a high energy state, and after part of energy absorbed by the ultraviolet absorber is released in a mode of light (wavelength > 380 nm) radiation, the ultraviolet absorber returns to a ground state. Part of the ultraviolet absorbent can be isomerized under the irradiation of ultraviolet rays and decomposed into isomer fragments for degradation, and the isomer fragments have no ultraviolet absorption function, so that the stability of the ultraviolet absorbent is caused.
Semiconductor quantum dots absorb light in a short wavelength band strongly, so that ultraviolet rays can be absorbed by the semiconductor quantum dots. The stability of the semiconductor quantum dot is higher than that of the traditional ultraviolet absorber. If the semiconductor quantum dots are used for replacing the ultraviolet absorbent in the EVA adhesive film, the problem of photodegradation does not exist, so that the ultraviolet aging resistance of the EVA adhesive film can be improved. In addition, after the semiconductor quantum dots absorb ultraviolet light, the semiconductor quantum dots can efficiently emit light in a wavelength range of 500 to 1000 nanometers.
However, perovskite quantum dots are directly added into the photovoltaic packaging material, the perovskite quantum dots cannot exist stably, and the perovskite quantum dots are water-repellent, so that the photovoltaic packaging material has poor photoelectric conversion performance. While organic-inorganic halide perovskites are extremely sensitive to oxygen and moisture, they are environmentally limited in their storage, manufacture and operation of the equipment. Therefore, the EVA adhesive film compounded into the light conversion functional material containing perovskite quantum dots with stable photoelectric conversion performance is not reported by other people at present.
In view of the above problems, it is necessary to develop a quantum dot adhesive film with relatively stable photoelectric conversion performance.
Disclosure of Invention
The invention mainly aims to provide a resin composition, a master batch, a glue film, a photovoltaic module and a display device, so as to solve the problem that the photoelectric conversion performance of a glue film containing quantum dots is poor due to the fact that the quantum dots cannot be stably present in the glue film.
In order to achieve the above object, the present invention provides, in one aspect, a resin composition comprising, in parts by weight: 100 parts of matrix resin, 0.01-5 parts of quantum dots and 0.01-1 part of doping agent, wherein the doping agent is selected from metal oxide or metal sulfide.
Further, the dopant is represented by M xEy, wherein M is selected from one or more of Al, zn, cd, in, sn, hg, li, be, ge, ga and P, E is selected from O and/or S, and x and y have values ranging from 0.01 to 10.
Further, the dopant is represented by M xEy, wherein M is selected from one or more of Al, zn, cd, in, sn, hg, li, be, ge, ga and P, E is selected from O and/or S, and x and y have values ranging from 0.01 to 10.
Further, the quantum dots include CdSe quantum dots or perovskite quantum dots; the perovskite quantum dots are represented by A mBnXt, wherein m is more than or equal to 1 and less than or equal to 4; n is more than or equal to 1 and less than or equal to 2, t is more than or equal to 3 and less than or equal to 9, and A is one or more of CH3NH3 +、NH2CHNH2 +、C(NH2)3 +、Cs+、Li+、Na+、K+、Rb+ or Q; q is selected from at least one of aryl or alkyl organic amine cation with carbon number not less than 3; b is one or more of Pb2+、Cu2+、Sn2+、Mn2+、Zn2+、Cd2+、Ge2+、Sr2+、Bi3+、Eu2+、Yb2+、Sb3+、Tl3+、In3+、Cu+ and Ag +; x is selected from one or more of Cl -,Br- and I -.
Further, the perovskite quantum dot has a structure represented by ABX 3, a is selected from methylamino ions and/or Cs +, B is selected from Pb 2 +,Sn2+ or Bi 2+, and X is selected from one or more of Cl -,Br- and I -.
Further, the perovskite quantum dots are selected from one or more of CsPbBr 3 perovskite quantum dots, cs 2AgBiBr6 double perovskite quantum dots and CH 3NH3PbBr3 inorganic perovskite quantum dots.
Further, the quantum dots further comprise one or more of mercapto-modified SiC silicon carbide quantum dots, amino-functionalized SiC silicon carbide quantum dots, carboxyl-modified SiC silicon carbide quantum dots, NHS-modified SiC silicon carbide quantum dots, water-soluble ZnO fluorescent quantum dot nanoparticles, amino-functionalized ZnO zinc oxide quantum dots, carboxyl-functionalized ZnO zinc oxide quantum dots, MAA-modified ZnO quantum dots, PEG-modified ZnO zinc oxide quantum dots, PEG-modified Si quantum dots (PEG-Si QDs) and BSA-modified ZnO zinc oxide quantum dots.
Further, the resin composition comprises, in parts by weight: 100 parts of matrix resin, 0.05 to 1 part of quantum dots and 0.02 to 0.6 part of metal oxide.
The second aspect of the present application also provides a masterbatch formed from the resin composition provided by the present application.
The third aspect of the application also provides a glue film, wherein the glue film is a single-layer film or a multi-layer film, and at least one layer of the single-layer film or the multi-layer film is formed by the master batch.
The fourth aspect of the application also provides a photovoltaic module comprising an encapsulating film comprising the film of claim 8 or 9.
The fifth aspect of the application also provides a display device, which comprises a light-emitting unit and a sealing unit, wherein the sealing unit is used for sealing the light-emitting unit, and the sealing unit comprises the adhesive film provided by the application.
By applying the technical scheme of the invention, the addition of the quantum dots is beneficial to improving the photoelectric conversion efficiency of the adhesive film, the existing matrix resin (such as EVA resin) is easy to generate moisture after being solidified into a film, and the quantum dots are unstable when meeting water. The metal oxide or the metal sulfide is added as the doping agent, so that on one hand, the doping agent can be combined with the quantum dots to form a relatively stable crystal structure, on the other hand, the two substances also have relatively good compactness, and after the doping agent is added, water and oxygen can be inhibited from contacting with the quantum dots, and therefore, the stability of the quantum dots in a film formed after the resin composition is solidified can be greatly improved after the doping agent is added. Therefore, the photoelectric conversion efficiency of the adhesive film can be greatly improved by the adhesive film formed after the resin composition with the composition is cured.
Detailed Description
It should be noted that, without conflict, the embodiments of the present application and features of the embodiments may be combined with each other. The present application will be described in detail with reference to examples.
As described in the background art, the problem that the photoelectric conversion performance of the EVA adhesive film containing the quantum dots is poor due to the fact that the quantum dots cannot be stably contained in the EVA adhesive film. In order to solve the technical problems, the present application provides a resin composition comprising, in parts by weight: 100 parts of matrix resin, 0.01-5 parts of quantum dots and 0.01-1 part of doping agent, wherein the doping agent is selected from metal oxide or metal sulfide.
The addition of the quantum dots is beneficial to improving the photoelectric conversion efficiency of the adhesive film, moisture is easy to generate after the existing matrix resin (such as EVA resin) is solidified into a film, and the quantum dots are unstable when meeting water. The metal oxide or the metal sulfide is added as the doping agent, so that on one hand, the doping agent can be combined with the quantum dots to form a relatively stable crystal structure, on the other hand, the two substances also have relatively good compactness, and after the doping agent is added, water and oxygen can be inhibited from contacting with the quantum dots, and therefore, the stability of the quantum dots in a film formed after the resin composition is solidified can be greatly improved after the doping agent is added. Therefore, the photoelectric conversion efficiency of the adhesive film can be greatly improved by the adhesive film formed after the resin composition with the composition is cured.
Preferably, the particle size of the quantum dots is 10-50 nm, and the particle size of the dopant is 50-200 nm.
In a preferred embodiment, the above dopant is represented by M xEy, wherein M is selected from one or more of Al, zn, cd, in, sn, hg, li, be, ge, ga and P, E is selected from O and/or S, and x and y range from 0.01 to 10. The above substances have high electron mobility, proper energy level and inherent stability. Therefore, compared with other kinds of dopants, the dopant with the composition can form a more stable structure with the quantum dots, thereby further improving the stability and photoelectric conversion performance of the quantum dots in the adhesive film.
In a preferred embodiment, the quantum dots comprise CdSe quantum dots and/or perovskite quantum dots.
The perovskite quantum dot material can absorb 550-560 nm visible light and convert the visible light into infrared light, so that the light absorption capacity of the crystalline silicon component is enhanced, and the energy conversion efficiency is improved by about 10%. The surface of the crystalline silicon battery is uneven and is pyramid-shaped, the perovskite quantum dot material emits fluorescence, and the luminous path is not fixed, but the perovskite quantum dot material can be perfectly absorbed by the crystalline silicon component, and Fresnel reflection (FresnelReflection) generated by the surface of the crystalline silicon battery and an air interface is reduced. The perovskite quantum dot material has rich color, and can easily change the inherent color of the crystalline silicon component. Preferably, the perovskite quantum dots are represented by A mBnXt, wherein m is equal to or greater than 1 and equal to or less than 4; n is more than or equal to 1 and less than or equal to 2, t is more than or equal to 3 and less than or equal to 9, and A is one or more of CH3NH3 +、NH2CHNH2 +、C(NH2)3 +、Cs+、Li+、Na+、K+、Rb+ or Q; q is selected from at least one of aryl or alkyl organic amine cation with carbon number not less than 3; b is one or more of Pb2+、Cu2+、Sn2+、Mn2+、Zn2 +、Cd2+、Ge2+、Sr2+、Bi3+、Eu2+、Yb2+、Sb3+、Tl3+、In3+、Cu+ and Ag +; x is selected from one or more of Cl -,Br- and I -.
More preferably, the perovskite quantum dot has a structure represented by ABX 3, a is selected from methylamino ions (CH 3NH3 +) and/or Cs +, B is selected from Pb 2+,Sn2+ or Bi 2+, and X is selected from one or more of Cl -,Br- and I -. The size of the a-site ion affects the stability of the crystal structure; larger cations at the a-position can help it acquire a more stable crystalline phase; and ions of the B site and the X site mainly participate in the energy band structure composition of the perovskite, so that the doping of the B site and the X site can greatly influence the optical and electrical properties of the perovskite quantum dot. The perovskite quantum dots with the composition are favorable for further improving the stability and photoelectric conversion performance of the perovskite quantum dots.
In a preferred embodiment, the perovskite quantum dots include, but are not limited to, csPbBr 3 perovskite quantum dots, one or more of Cs 2AgBiBr6 double perovskite quantum dots and CH 3NH3PbBr3 inorganic perovskite quantum dots.
In order to further improve the compatibility of the quantum dots with other components in the adhesive film, some quantum dots modified by specific groups can be added. Preferably, the quantum dots further comprise one or more of mercapto-modified SiC silicon carbide quantum dots, amino-functionalized SiC silicon carbide quantum dots, carboxyl-modified SiC silicon carbide quantum dots, NHS-modified SiC silicon carbide quantum dots, water-soluble ZnO fluorescent quantum dot nanoparticles, amino-functionalized ZnO zinc oxide quantum dots, carboxyl-functionalized ZnO zinc oxide quantum dots, MAA-modified ZnO quantum dots, PEG-modified ZnO zinc oxide quantum dots, PEG-modified silicon quantum dots (PEG-Si QDs) and BSA-modified ZnO zinc oxide quantum dots.
In order to further improve the overall properties of the adhesive film formed from the resin composition, it is preferable that the resin composition comprises, in parts by weight: 100 parts of matrix resin, 0.05 to 1 part of quantum dots and 0.02 to 0.6 part of metal oxide.
In a preferred embodiment, the matrix resin includes, but is not limited to, one or more of ethylene-vinyl acetate resin, ethylene-propylene copolymer, ethylene-butene copolymer, ethylene-pentene copolymer, ethylene-octene copolymer, ethylene- (meth) acrylate copolymer, ethylene- (meth) acrylic acid copolymer, polyethylene, liquid silicone, polypropylene, and polymethyl methacrylate.
The resin composition further comprises one or more of a crosslinking agent, a co-crosslinking agent, an antioxidant, an ultraviolet light absorber, a tackifier and a light stabilizer.
In a preferred embodiment, the cross-linking agent is a molecule having multiple ethylenically unsaturated groups, which may promote cross-linking of the polymer to a higher degree of cross-linking. The cross-linking agent in the above composition may be selected from the types commonly used in the art, preferably, crosslinking agents include, but are not limited to, isopropyl t-butylperoxycarbonate, 2, 5-dimethyl-2, 5- (bis-t-butylperoxy) hexane, 2-ethylhexyl t-butylperoxycarbonate, 1-bis (t-butylperoxy) -3, 5-trimethylcyclohexane, 1-bis (t-amyl peroxy) cyclohexane 1, 1-bis (t-butylperoxy) cyclohexane, 2-bis (t-butylperoxy) butane, t-amyl peroxy-2-ethylhexyl carbonate, 2, 5-dimethyl-2, 5-bis (benzoylperoxy) -hexane, t-amyl peroxycarbonate, t-butyl peroxy-3, 5-trimethylhexanoate.
In a preferred embodiment, the co-crosslinking agent includes, but is not limited to, one or more of triallyl isocyanurate, triallyl cyanurate, trimethylolpropane triacrylate, trimethylolpropane trimethacrylate, pentaerythritol triacrylate, tris (2-hydroxyethyl) isocyanurate triacrylate, ethoxylated trimethylolpropane triacrylate, propoxylated trimethylolpropane triacrylate, ethoxylated glycerol triacrylate, propoxylated glycerol triacrylate, pentaerythritol tetraacrylate, ethoxylated pentaerythritol tetraacrylate, trimethylolpropane tetraacrylate, ditrimethylolpropane tetramethacrylate, propoxylated pentaerythritol tetraacrylate, 2,4, 6-tris (2-propenyloxy) -1,3, 5-triazine, tricyclic sunflower dimethanol diacrylate, propoxylated neopentyl glycol diacrylate, ethoxylated bisphenol A dimethacrylate, 2-butyl-2-ethyl-1, 3-propanediol diacrylate, diethylene glycol dimethacrylate, triethylene glycol dimethacrylate, and polyethylene glycol dimethacrylate.
The antioxidant is used for improving the stability of the polymer in the extrusion processing process, the long-term and use process and delaying degradation caused by the action of hot oxygen. In a preferred embodiment, the antioxidant is a hindered phenol-based compound and/or a phosphite-based compound. Compared with other antioxidants, the antioxidant has better stability and oxidation resistance. More preferably, the hindered phenolic compound includes, but is not limited to, one or more of the group consisting of 2, 6-di-tert-butyl-4-ethylphenol, 2' -methylene-bis- (4-methyl-6-tert-butylphenol), 2' -methylene-bis- (4-ethyl-6-tert-butylphenol), 4' -butylene-bis- (3-methyl-6-tert-butylphenol), octadecyl-3- (3, 5-di-tert-butyl-4-hydroxyphenyl) propionate, pentaerythritol-tetrakis [3- (3, 5-di-tert-butyl-4-hydroxyphenyl) propionate ], 7-octadecyl-3- (4 ' -hydroxy-3 ',5' -di-tert-butylphenyl) propionate, tetrakis- [ methylene-3- (3 ',5' -di-tert-butyl-4 ' -hydroxyphenyl) propionate ] methane; phosphite-based compounds include, but are not limited to, one or more of the group consisting of tris (2, 4-di-t-butylphenyl) phosphite, bis [2, 4-bis (1, 1-dimethylethyl) -6-methylphenyl ] ethyl phosphite, tetrakis (2, 4-di-t-butylphenyl) [1, 1-biphenyl ] -4,4' -diyl bisphosphite, and bis (2, 4-di-t-butylphenyl) pentaerythritol bisphosphite.
Ultraviolet light absorbers refer to substances that are capable of absorbing a substantial portion of ultraviolet energy and converting it to heat, thereby protecting certain electronic devices from ultraviolet light. In a preferred embodiment, the ultraviolet light absorber includes, but is not limited to, benzophenones and/or benzotriazoles, and more preferably, the ultraviolet light absorber includes, but is not limited to, one or more of the group consisting of 2-hydroxy-4-n-octoxybenzophenone, 2-tetramethylenebis (3, 1-benzoxazin-4-one), 2- (2 ' -hydroxy-5-methylphenyl) benzotriazole, 2' -dihydroxy-4, 4' -dimethoxybenzophenone.
The light stabilizer is used for improving the stability of the packaging adhesive film under long-term ultraviolet irradiation. Preferably, the light stabilizer is a hindered amine-based compound. In a preferred embodiment of the present invention, light stabilizers include, but are not limited to, bis (2, 6-tetramethyl-4-piperidinyl) sebacate, bis (1-octyloxy-2, 6-tetramethyl-4-piperidinyl) sebacate graft copolymer obtained by polymerizing 4- (methyl) acryloyloxy-2, 6-tetramethyl piperidine and alpha-vinyl monomer 4- (meth) acryloyloxy-2, 6-tetramethylpiperidine graft copolymers obtained by polymerization with alpha-vinyl monomers.
The tackifier can improve the adhesive performance of the adhesive film. In a preferred embodiment, the adhesion promoter includes, but is not limited to, one or more of the group consisting of gamma-aminopropyl triethoxysilane, gamma-methacryloxypropyl trimethoxysilane, gamma- (2, 3-glycidoxy) propyl trimethoxysilane, vinyl trimethoxysilane, N- (beta-aminoethyl) -gamma-aminopropyl trimethoxysilane, gamma-glycidoxypropyl trimethylsilane, 3-aminopropyl trimethylsilane.
In another aspect, the present application also provides a masterbatch formed from the above resin composition provided by the present application.
The photoelectric conversion efficiency of the adhesive film can be greatly improved due to the adhesive film formed after the resin composition is cured, and the convenience of application of the adhesive film can be greatly improved after the adhesive film is prepared into master batches.
The third aspect of the application also provides a glue film, wherein the glue film is a single-layer film or a multi-layer film, and at least one layer of the single-layer film or the multi-layer film is formed by the master batch or the resin composition.
The film formed by curing the resin composition or the master batch provided by the application has excellent photoelectric conversion performance, and can be made into a single-layer film or a multi-layer film with other film layers according to the requirement.
The fourth aspect of the application also provides a photovoltaic module, which comprises a packaging adhesive film, wherein the packaging adhesive film comprises the adhesive film provided by the application. The packaging adhesive film formed by the adhesive film is beneficial to greatly improving the photoelectric conversion performance of the photovoltaic module because the adhesive film has excellent photoelectric conversion performance.
The fifth aspect of the application also provides a display device comprising a light emitting unit and a sealing unit for sealing the light emitting unit, the sealing unit comprising the adhesive film provided by the application. The packaging adhesive film formed by the adhesive film is beneficial to greatly improving the display performance of the display device because the adhesive film has excellent photoelectric conversion performance.
The application is described in further detail below in connection with specific examples which are not to be construed as limiting the scope of the application as claimed.
Example 1
A resin composition comprising, in parts by weight: 100 parts of EVA resin, 0.08 part of CsPbBr 3 part of perovskite quantum dots (particle size of 20 nm) and 0.5 part of doping agent zinc oxide (particle size of 80 nm).
Example 2
The differences from example 1 are: the dopant is Al 2O3.
Example 3
The differences from example 1 are: the dopant is SnO.
Example 4
The differences from example 1 are: the dopant is Li 2 O.
Example 5
The differences from example 1 are: the dopant is BeO.
Example 6
The differences from example 1 are: the dopant is P 2O5.
Example 7
The differences from example 1 are: the dopant is In 2S3.
Example 8
The differences from example 1 are: the dopant is HgS.
Example 9
The differences from example 1 are: the quantum dots are amino-functionalized ZnO zinc oxide quantum dots.
Example 10
The differences from example 1 are: the quantum dots are amino-functionalized SiC silicon carbide quantum dots.
Example 11
The differences from example 1 are: the quantum dots are MAA modified ZnO quantum dots.
Example 12
The differences from example 1 are: the quantum dots are Cs 2AgBiBr6 double perovskite quantum dots.
Example 13
The differences from example 1 are: the quantum dot is CH 3NH3PbBr3.
Example 14
The differences from example 1 are: the quantum dots are NH 2CHNH2PbBr3.
Example 15
The differences from example 1 are: the weight portion of the quantum dots is 0.01.
Example 16
The differences from example 1 are: the weight portion of the quantum dots is 5.
Example 17
The differences from example 1 are: the weight portion of the quantum dots is 0.05.
Example 18
The differences from example 1 are: the weight portion of the quantum dots is 1.
Example 19
The differences from example 1 are: the weight fraction of the dopant was 0.01.
Example 20
The differences from example 1 are: the weight portion of the dopant is 1.
Example 21
The differences from example 1 are: the weight fraction of dopant was 0.02.
Example 22
The differences from example 1 are: the weight fraction of dopant was 0.6.
Comparative example 1
And a glue film without quantum dots is added.
Comparative example 2
No dopant film was added.
Comparative example 3
The adhesive film composition comprises: a resin composition comprises, in parts by weight, based on the resin: 100 parts of EVA resin, 8 parts of CsPbBr 3 perovskite quantum dots and 2 parts of doping agent zinc oxide.
The quantum dots used in this example were all purchased from sienna ziyue biotechnology limited.
The testing method comprises the following steps:
(1) Water stability test: after the photovoltaic packaging adhesive film is soaked in water for 2 months, the soaked luminous intensity I 1 is tested, and compared with the luminous intensity I 0 before soaking, the luminous intensity I 0 is used for testing the water stability of the quantum dots in the adhesive film, and the water stability D=i 1/I0 is 100%.
(2) Light transmittance test: and (3) light transmittance testing of the light-receiving surface side adhesive film: the packaging materials of examples 1 to 22 and comparative examples 1 to 3 were laminated, and then the films of each example and comparative example after lamination had a thickness of 0.45mm, and the transmittance was measured according to GB/T2410-2008, and the transmittance of the films of 700 to 400nm was measured by an ultraviolet-visible spectrophotometer.
(3) Photoelectric conversion efficiency test:
And testing the power attenuation condition of the dual-glass photovoltaic module after aging for 1000 hours at the temperature of 85 ℃ and the humidity of 85% according to the regulation in IEC61215, wherein the power attenuation rate of the photovoltaic module is = (module initial power-module PID aged power)/module initial power, and the required power attenuation is less than or equal to 5%.
The test results are shown in Table 1.
TABLE 1
From the above description, it can be seen that the above embodiments of the present invention achieve the following technical effects: the addition of the quantum dots is beneficial to improving the photoelectric conversion efficiency of the adhesive film, moisture is easy to generate after the existing matrix resin (such as EVA resin) is solidified into a film, and the quantum dots are unstable when meeting water. The metal oxide or the metal sulfide is added as the doping agent, so that on one hand, the doping agent can be combined with the quantum dots to form a relatively stable crystal structure, on the other hand, the two substances also have relatively good compactness, and after the doping agent is added, water and oxygen can be inhibited from contacting with the quantum dots, and therefore, the stability of the quantum dots in a film formed after the resin composition is solidified can be greatly improved after the doping agent is added. Therefore, the photoelectric conversion efficiency of the adhesive film can be greatly improved by the adhesive film formed after the resin composition with the composition is cured.
It should be noted that the terms "first," "second," and the like in the description and in the claims are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the terms so used are interchangeable under appropriate circumstances such that the embodiments of the application described herein are, for example, capable of operation in sequences other than those described herein.
The above description is only of the preferred embodiments of the present invention and is not intended to limit the present invention, but various modifications and variations can be made to the present invention by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (11)
1. A resin composition characterized by comprising, in parts by weight: 100 parts of matrix resin, 0.01-5 parts of quantum dots and 0.01-1 part of doping agent, wherein the doping agent is selected from metal oxide or metal sulfide.
2. The resin composition according to claim 1, wherein the dopant is represented by M xEy, wherein M is selected from one or more of Al, zn, cd, in, sn, hg, li, be, ge, ga and P, E is selected from O and/or S, and x and y have values ranging from 0.01 to 10.
3. The resin composition according to claim 1 or 2, wherein the quantum dots comprise CdSe quantum dots or perovskite quantum dots; the perovskite quantum dots are represented by A mBnXt, wherein m is more than or equal to 1 and less than or equal to 4; n is more than or equal to 1 and less than or equal to 2, t is more than or equal to 3 and less than or equal to 9, and A is one or more of CH3NH3 +、NH2CHNH2 +、C(NH2)3 +、Cs+、Li+、Na+、K+、Rb+ or Q; q is selected from at least one of aryl or alkyl organic amine cations with the carbon number not less than 3; b is one or more of Pb2+、Cu2+、Sn2+、Mn2+、Zn2+、Cd2+、Ge2+、Sr2+、Bi3+、Eu2+、Yb2+、Sb3+、Tl3+、In3+、Cu+ and Ag +; x is selected from one or more of Cl -,Br- and I -.
4. A resin composition according to claim 3, wherein the perovskite quantum dot structure is represented by ABX 3, wherein a is selected from methylamino ions and/or Cs +, B is selected from Pb 2+,Sn2+ or Bi 2+, and X is selected from one or more of Cl -,Br- and I -.
5. A resin composition according to claim 3, wherein the perovskite quantum dots are selected from one or more of CsPbBr 3 perovskite quantum dots, cs 2AgBiBr6 double perovskite quantum dots and CH 3NH3PbBr3 inorganic perovskite quantum dots.
6. The resin composition of any one of claims 1 to 5, wherein the quantum dots further comprise one or more of mercapto-modified SiC silicon carbide quantum dots, amino-functionalized SiC silicon carbide quantum dots, carboxyl-modified SiC silicon carbide quantum dots, NHS-modified SiC silicon carbide quantum dots, water-soluble ZnO fluorescent quantum dot nanoparticles, amino-functionalized ZnO zinc oxide quantum dots, carboxyl-functionalized ZnO zinc oxide quantum dots, MAA-modified ZnO quantum dots, PEG-modified ZnO zinc oxide quantum dots, PEG-modified silicon quantum dots, and BSA-modified ZnO zinc oxide quantum dots.
7. The resin composition according to claim 6, wherein the resin composition comprises, in parts by weight: 100 parts of matrix resin, 0.05 to 1 part of quantum dots and 0.02 to 0.6 part of metal oxide.
8. A masterbatch, characterized in that it is formed from the resin composition of any one of claims 1 to 7.
9. An adhesive film, characterized in that the adhesive film is a single-layer film or a multilayer film, wherein at least one layer of the single-layer film or the multilayer film is formed from the master batch of claim 8.
10. A photovoltaic module comprising a packaging film comprising the film of claim 8 or 9.
11. A display device comprising a light emitting unit and a sealing unit for sealing the light emitting unit, characterized in that the sealing unit comprises the adhesive film of claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211538886.6A CN118126437A (en) | 2022-12-02 | 2022-12-02 | Resin composition, master batch, adhesive film, photovoltaic module and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211538886.6A CN118126437A (en) | 2022-12-02 | 2022-12-02 | Resin composition, master batch, adhesive film, photovoltaic module and display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN118126437A true CN118126437A (en) | 2024-06-04 |
Family
ID=91231304
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211538886.6A Pending CN118126437A (en) | 2022-12-02 | 2022-12-02 | Resin composition, master batch, adhesive film, photovoltaic module and display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN118126437A (en) |
-
2022
- 2022-12-02 CN CN202211538886.6A patent/CN118126437A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5219504B2 (en) | Method for producing solar cell encapsulant | |
| CA2666666C (en) | Fluorescent resin composition and solar battery module using the same | |
| JP6900519B2 (en) | Polyolefin elastomer encapsulation sheet with low water vapor permeability and its manufacturing method | |
| KR101260901B1 (en) | Crosslinkable ethylene copolymer, solar battery sealing material sheet produced from the crosslinkable ethylene copolymer, and solar battery module using the solar battery sealing material sheet | |
| JP6152099B2 (en) | Solar cell module | |
| US20130074930A1 (en) | Polymethyl (meth)acrylate mouldings for fluorescence conversion, production of these by the sheet casting process and use in solar collectors | |
| CN112724851A (en) | Packaging adhesive film | |
| KR20160075336A (en) | Co-crosslinker systems for encapsulation films comprising ethylene glycol di(meth)acrylate compounds | |
| KR101439426B1 (en) | A solar cell sealing sheet and a solar cell module using thereof | |
| JP2012069865A (en) | Solar cell sealant and solar cell module using the same | |
| CN113683984B (en) | Resin composition, master batch containing same and application thereof | |
| CN118126437A (en) | Resin composition, master batch, adhesive film, photovoltaic module and display device | |
| KR101162101B1 (en) | Sealing material for solar cell and sheet for solar-cell sealing | |
| JP2005129925A (en) | Sheet for solar cell sealing medium | |
| KR20130067389A (en) | Encapsulation sheet for a solar cell having an improved efficacy of power generation and the preparing process thereof | |
| KR20160101453A (en) | Optical sheet | |
| KR20170102964A (en) | Sealing sheet and solar cell module | |
| KR101210322B1 (en) | Adhesive sheet composition for solar battery, adhesive sheet and solar battery using the same | |
| JP6173789B2 (en) | Solar cell encapsulant composition, solar cell encapsulant layer, and solar cell module using the same | |
| KR20120024515A (en) | Adhesive sheet composition for thin film solar battery, adhesive sheet and thin film solar battery using the same | |
| KR101119954B1 (en) | Adhesive sheet composition for solar battery, adhesive sheet and solar battery using the same | |
| CN115725252B (en) | Resin composition, master batch, liquid adhesive, adhesive film and application | |
| KR101126600B1 (en) | Cmposition for solar battery, adhesive sheet and solar battery using the same | |
| KR101298430B1 (en) | Encapsulant sheet composition for solar cell, encapsulant sheet and photovoltaic module using the same | |
| CN118580787A (en) | Photovoltaic adhesive film and solar cell module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |