CN118113120A - Heat dissipation control method and device and electronic equipment - Google Patents

Abstract

The application discloses a heat dissipation control method, a heat dissipation control device and electronic equipment, wherein the heat dissipation control method comprises the following steps: acquiring configuration information of the electronic equipment; controlling the working parameters of a target heat radiation module of the electronic equipment by a target control strategy at least based on the configuration information; under a target control strategy, the adjustment proportion of the working parameters of the target heat radiation module in the target adjustment range is determined based on the configuration information.

Description

Heat dissipation control method and device and electronic equipment

Technical Field

The present application relates to the field of heat dissipation control technologies, and in particular, to a heat dissipation control method and apparatus, and an electronic device.

Background

The current speed regulation scheme of the fan of the server mostly adopts a mode of combining an open loop and a closed loop, wherein a closed loop speed regulation method is generally adopted aiming at elements with larger temperature change gradient in a CPU/memory, on one hand, the fan can rapidly respond to reach a certain rotating speed, and the heat dissipation requirement of the elements is met; on the other hand, the rotating speed of the fan can be ensured to be the lowest rotating speed meeting the heat dissipation requirement of the system.

Generally, the closed loop speed regulation scheme is divided into PID speed regulation and simple feedback regulation, and both schemes can set an element speed regulation target temperature, and when the element speed regulation target temperature is lower than the target temperature, the fan speed is controlled to be continuously reduced so as to reduce the system power consumption; above the target temperature, the fan speed is controlled to continuously rise to meet the heat dissipation requirement of the element. For a single element in a single configuration, the best effect can be achieved by adopting a PID parameter tuning mode, but a server usually has tens or even hundreds of different combined machine types, each machine type has hundreds of element temperature sensors, and when closed-loop speed regulation is adopted, the PID parameter tuning of the best effect cannot be achieved for each machine type and each element, and the best heat dissipation and the best power consumption cannot be achieved.

Disclosure of Invention

The embodiment of the application aims to provide a heat dissipation control method and device and electronic equipment.

In a first aspect, an embodiment of the present application provides a heat dissipation control method, including:

Acquiring configuration information of the electronic equipment;

Controlling the working parameters of a target heat radiation module of the electronic equipment by a target control strategy at least based on the configuration information;

Under the target control strategy, the adjustment proportion of the working parameters of the target heat radiation module in the target adjustment range is determined based on the configuration information.

In a possible implementation manner, the controlling, based on at least the configuration information, the operating parameters of the target heat dissipation module of the electronic device with a target control policy includes:

Obtaining a current temperature of a target heat generating component of the electronic device;

Under the condition that the current temperature is lower than the lower limit value of the target temperature range, the working parameters of the target heat radiation module are regulated down by a first regulation strategy;

when the current temperature is in the target temperature range, the working parameters of the target heat radiation module are regulated down by a second regulation strategy matched with the configuration information;

wherein the single adjustment ratio of the working parameter under the second adjustment strategy is different from the single adjustment ratio under the first adjustment strategy.

In a possible implementation manner, the controlling, based on at least the configuration information, the operating parameters of the target heat dissipation module of the electronic device with a target control policy includes:

Obtaining a current temperature of a target heat generating component of the electronic device;

Under the condition that the current temperature is lower than the upper limit value of the target temperature range, the working parameters of the target heat radiation module are regulated down by a second regulation strategy matched with the configuration information;

Under the condition that the current temperature is higher than the upper limit value of the target temperature range, the working parameters of the target heat radiation module are regulated up by a third regulation strategy;

wherein the single adjustment ratio of the working parameter under the second adjustment strategy is different from the single adjustment ratio under the third adjustment strategy.

In one possible implementation manner, the adjusting the working parameter of the target heat dissipation module with the second adjustment policy includes:

Obtaining a first adjustment coefficient of the electronic device and a second adjustment coefficient of the target heat generating component based on the configuration information;

And calculating a single adjustment proportion of the working parameter based on the first adjustment coefficient, the second adjustment coefficient and a difference value between the current temperature and the upper limit value of the target temperature range, so as to respectively reduce the working parameter in each adjustment period according to the calculated single adjustment proportion.

In a possible implementation manner, the method for controlling the working parameters of the target heat dissipation module of the electronic device according to the target control strategy at least based on the configuration information further includes:

determining a difference value between the current temperature of a target heating component of the electronic equipment and a target temperature range, and adjusting up or down the adjustment proportion of the working parameter in each adjustment period by a target difference coefficient based on the difference value range of the difference value;

The target difference coefficient is determined based on a difference range in which the difference is located.

In a possible implementation manner, the method for controlling the working parameters of the target heat dissipation module of the electronic device according to the target control strategy at least based on the configuration information further includes:

Determining the number of target heat generating components of the electronic device based on the configuration information and the operation information of the electronic device;

Under the condition that the target heating components are all provided with heat dissipation modules, calculating single adjustment proportions of working parameters of the heat dissipation modules corresponding to the target heating components respectively based on the difference value between the current temperature of each target heating component and the corresponding target temperature range and the first adjustment coefficient and the second adjustment coefficient corresponding to the configuration information, so as to adjust the working parameters based on the single adjustment proportions;

And under the condition that at least one of the target heating components is not provided with a heat radiation module, adjusting a first adjustment coefficient and a second adjustment coefficient corresponding to the configuration information based on the number of the target heating components so as to calculate a single adjustment proportion of the working parameters of the heat radiation module based on the adjusted adjustment coefficients, and adjusting the working parameters based on the single adjustment proportion.

In one possible embodiment, at least one of the following is also included:

acquiring environmental temperature change information of a space environment in which the electronic equipment is located, and adjusting the adjustment proportion of the working parameter in each adjustment period based on the environmental temperature change information;

and obtaining the electricity consumption information of the electronic equipment, and adjusting the adjustment proportion of the working parameters in each adjustment period based on the electricity consumption information.

In a possible implementation manner, the configuration information of the electronic device is obtained, including at least one of the following:

Identifying, by a baseboard management controller of an electronic device, identification information of the electronic device to obtain configuration information of the electronic device based on the identified identification information;

in the starting process of the electronic equipment, enumeration data of all hardware components of the electronic equipment are obtained through a guide system of the electronic equipment so as to obtain configuration information of the electronic equipment.

In a second aspect, an embodiment of the present application further provides a heat dissipation control device, including:

An obtaining module configured to obtain configuration information of the electronic device;

the control module is configured to control the working parameters of the target heat dissipation module of the electronic equipment according to a target control strategy at least based on the configuration information;

Under the target control strategy, the adjustment proportion of the working parameters of the target heat radiation module in the target adjustment range is determined based on the configuration information.

In a third aspect, an embodiment of the present application further provides an electronic device, including:

A baseboard management controller for obtaining configuration information of the electronic device;

At least one heating component for performing a target task;

the at least one heat dissipation module is used for dissipating heat of the at least one heating component;

One of the baseboard management controller and the heating component can control working parameters of a target heat dissipation module of the electronic equipment according to a target control strategy based on the configuration information, wherein the target heat dissipation module is one or more of the heat dissipation modules;

Under the target control strategy, the adjustment proportion of the working parameters of the target heat radiation module in the target adjustment range is determined based on the configuration information.

According to the embodiment of the application, the target control strategy is determined based on the configuration information of the electronic equipment, and the working parameters of the target heat dissipation module of the electronic equipment are controlled according to the adjustment proportion in the target adjustment range, so that the target heat dissipation module can achieve the purpose of dissipating heat with lower power consumption, the hardware of the electronic equipment is not required to be adjusted, the universality is higher, meanwhile, the calculated amount is lower, and the calculation load of a control device in the electronic equipment is not increased additionally.

Drawings

In order to more clearly illustrate the application or the technical solutions of the prior art, the drawings that are used in the embodiments or the description of the prior art will be briefly described below, it being obvious that the drawings in the following description are only some embodiments described in the present application, and that other drawings can be obtained according to these drawings without inventive faculty for a person skilled in the art.

Fig. 1 shows a flow chart of a heat dissipation control method provided by the application;

FIG. 2 is a flowchart of a method for controlling the operating parameters of a target heat sink module of an electronic device with a target control strategy based at least on configuration information according to the present application;

FIG. 3 is a flowchart showing another method for controlling the operating parameters of a target heat sink module of an electronic device with a target control strategy based at least on configuration information according to the present application;

fig. 4 shows a schematic structural diagram of a heat dissipation control device provided by the present application;

fig. 5 shows a schematic structural diagram of an electronic device provided by the present application.

Detailed Description

Various aspects and features of the present application are described herein with reference to the accompanying drawings.

It should be understood that various modifications may be made to the embodiments of the application herein. Therefore, the above description should not be taken as limiting, but merely as exemplification of the embodiments. Other modifications within the scope and spirit of the application will occur to persons of ordinary skill in the art.

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the application and, together with a general description of the application given above, and the detailed description of the embodiments given below, serve to explain the principles of the application.

These and other characteristics of the application will become apparent from the following description of a preferred form of embodiment, given as a non-limiting example, with reference to the accompanying drawings.

It is also to be understood that, although the application has been described with reference to some specific examples, a person skilled in the art will certainly be able to achieve many other equivalent forms of the application, having the characteristics as set forth in the claims and hence all coming within the field of protection defined thereby.

The above and other aspects, features and advantages of the present application will become more apparent in light of the following detailed description when taken in conjunction with the accompanying drawings.

Specific embodiments of the present application will be described hereinafter with reference to the accompanying drawings; however, it is to be understood that the disclosed embodiments are merely exemplary of the application, which can be embodied in various forms. Well-known and/or repeated functions and constructions are not described in detail to avoid obscuring the application in unnecessary or unnecessary detail. Therefore, specific structural and functional details disclosed herein are not intended to be limiting, but merely as a basis for the claims and as a representative basis for teaching one skilled in the art to variously employ the present application in virtually any appropriately detailed structure.

The specification may use the word "in one embodiment," "in another embodiment," "in yet another embodiment," or "in other embodiments," which may each refer to one or more of the same or different embodiments in accordance with the application.

For the convenience of understanding the present application, a detailed description will be given of a heat dissipation control method provided by the present application. Fig. 1 shows a flowchart of a heat dissipation control method provided by an embodiment of the present application, where specific steps include S101 and S102.

S101, obtaining configuration information of the electronic equipment.

Optionally, the execution body of the embodiment of the present application may be a controller or a processor of an electronic device, and the embodiment of the present application uses a baseboard management controller of the electronic device as the execution body for subsequent description.

In a specific implementation, after the electronic device is started, the baseboard management controller obtains configuration information of the electronic device. The configuration information of the electronic device at least comprises the model configuration of the electronic device, the configuration information of the heating element in the electronic device and the like. Alternatively, the baseboard management controller may be obtained according to the configuration of the electronic device, such as the number of included central processing units (Central Processing Unit/processors, CPU) and/or graphics processing units (Graphics Processing Unit, GPU), etc., and according to factory information of the heating element, etc., or may be obtained by reading data reported by self-inspection of the device by the baseboard management controller (Baseboard Management Controller, BMC) or the unified extensible firmware interface (Unified Extensible FIRMWARE INTERFACE, UEFI), etc.

Specifically, when the configuration information of the electronic device is obtained, at least one of the following is obtained.

First mode of acquisition

Identifying, by a baseboard management controller of the electronic device, identification information of the electronic device to obtain configuration information of the electronic device based on the identified identification information. The identification information of the electronic device may characterize the uniqueness of the electronic device, such as a device identification code UUID of the electronic device, or a model number of the electronic device, or an application type of the electronic device, such as a storage type, a calculation type, and the like.

Second mode of acquisition

During the startup process of the electronic device, enumeration data (POST data) of each hardware component of the electronic device is obtained through a boot system (BIOS or UEFI, etc.) of the electronic device, so as to obtain configuration information of the electronic device. For example, when a basic input output system (Basic Input Output System, BIOS) performs power-on self-test, self-test data is synchronized to a baseboard management controller, wherein the self-test data includes test data for a CPU, a motherboard, a memory, a floppy disk subsystem, a display subsystem, a serial-parallel interface, a CD-ROM drive, and the like of an electronic device.

S102, controlling the working parameters of the target heat dissipation module of the electronic equipment by a target control strategy at least based on the configuration information.

After the configuration information of the electronic device is obtained, the working parameters of the target heat dissipation module of the electronic device are controlled according to the target control strategy at least based on the configuration information. The electronic device includes a plurality of heat generating components, and optionally, each heat generating component is configured with a heat dissipation module, that is, the system is configured with a system heat dissipation module, and a certain heat generating component is configured with a component heat dissipation module, for example, a GPU fan corresponding to the GPU may be configured, a PSU fan corresponding to the power supply unit (Power Supply Unit, PSU) may be configured, and the like. Of course, a plurality of heating components can be arranged to be provided with one heat dissipation module, and part of the heating components can be arranged to be not provided with one heat dissipation module, so long as the space design requirement and the heat dissipation requirement of the electronic equipment are met.

Optionally, the heat dissipation module includes a fan and a water-cooled radiator. When the working parameters of the target heat radiation module are controlled, the rotating speed of the heat radiation module of the fan is adjusted, and the turbine rotating speed of the pump and/or the opening and closing angle of the flow valve in the water cooling heat radiation module are adjusted for the heat radiation module of the water cooling radiator, so that the flow and flow speed adjustment of the heat radiation medium of each water cooling pipeline is realized.

And adjusting the temperature of the target heating component corresponding to the target heat dissipation module by controlling the working parameters of the target heat dissipation module by using a target control strategy. The target control strategy comprises a target adjustment range and an adjustment proportion, and the adjustment proportion of the working parameters of the target heat radiation module in the target adjustment range is determined based on configuration information under the target control strategy. Here, the target adjustment range may be determined according to the configuration information, such as an upper temperature limit and a lower temperature limit allowed by the target heat generating component; the target adjustment range can also be determined according to an adjustment process, such as starting adjustment to ending adjustment of the working parameters of the target heat dissipation module.

As one example, fig. 2 shows a flowchart of a method for controlling an operating parameter of a target heat sink module of an electronic device with a target control policy based at least on configuration information, wherein the specific steps include S201-S203.

S201, obtaining a current temperature of a target heat generating component of the electronic device.

S202, under the condition that the current temperature is lower than the lower limit value of the target temperature range, the working parameters of the target heat radiation module are regulated down by the first regulation strategy.

S203, under the condition that the current temperature is in the target temperature range, the working parameters of the target heat radiation module are regulated down by a second regulation strategy matched with the configuration information.

In order to ensure that the electronic equipment and each element in the electronic equipment can normally operate, each heating component in the electronic equipment can be used as a target heating component, and of course, the heat dissipation module corresponding to the target heating component is the target heat dissipation module.

After the electronic device is started, the current temperature of each target heat generating component is acquired in real time or periodically. The electronic equipment is provided with a temperature collector, and the current temperature of each target heating component can be collected through the temperature collector.

After the current temperature of the target heat generating component is obtained, the current temperature is compared with a target temperature range corresponding to the target heat generating component, wherein each target heat generating component corresponds to a target temperature range determined by the temperature allowed when the target heat generating component is operated, for example, the target temperature range corresponding to the CPU is 70 ° -80 °.

And after comparing the current temperature with a target temperature range corresponding to the target heating component, if the current temperature is lower than the lower limit value of the target temperature range, regulating down the working parameters of the target heat radiation module by using a first regulation strategy. The first adjustment strategy can be a system heat dissipation control strategy preset by the electronic equipment or a self-defined component heat dissipation control strategy, namely, the working parameters of the target heat dissipation module are adjusted based on the fan rotating speed or the refrigerant flow data corresponding to the current temperature; the first adjustment strategy may also be a heat dissipation control strategy that is determined based on the configuration information and matches the configuration information, so as to implement precise control over the target heat generating component. For example, the current temperature of the CPU is 65 ° and is lower than the lower limit value of the corresponding target temperature range, that is, 70 °, at this time, the CPU is characterized in that the target heat dissipation module is not required to dissipate heat, based on this, the working parameters of the target heat dissipation module are adjusted down by the first adjustment strategy, such as adjusting down the rotation speed of the fan, adjusting down the flow and the flow rate of the heat dissipation medium of the water cooling pipeline, or directly closing the target heat dissipation module. The first adjustment strategy includes adjustment times, adjustment proportion of each adjustment, and the like. When the current temperature is lower than the lower limit value of the target temperature range, the working parameters of the target heat dissipation module are regulated down by the first regulation strategy, so that unnecessary power consumption of the target heat dissipation module can be avoided, and further resource waste of the electronic equipment is avoided.

After the current temperature is compared with the target temperature range corresponding to the target heating component, if the current temperature is in the target temperature range, a second adjustment strategy for the target heat dissipation module is determined based on the configuration information, and then the working parameters of the target heat dissipation module are adjusted down by the second adjustment strategy.

Wherein the single adjustment ratio of the working parameter under the second adjustment strategy is different from the single adjustment ratio under the first adjustment strategy. Alternatively, since the first adjustment strategy is an adjustment strategy that is employed without heat dissipation from the target heat generating component, the single adjustment ratio under the first adjustment strategy may be set to a fixed value. Because the response degrees of different target heating components to the target heat dissipation module are different, the single adjustment proportion under the second adjustment strategy is determined based on the configuration information, so that the problem that the current temperature change of the target heating component is large due to the fact that the response of the target heating component to the target heat dissipation module is fast is prevented, and the stability of the target heating component is ensured.

As yet another example, fig. 3 shows another method flowchart for controlling an operating parameter of a target heat sink module of an electronic device with a target control strategy based at least on configuration information, wherein the specific steps include S301-S303.

S301, obtaining a current temperature of a target heat generating component of the electronic device.

S302, under the condition that the current temperature is lower than the upper limit value of the target temperature range, the working parameters of the target heat radiation module are regulated down by a second regulation strategy matched with the configuration information.

S303, under the condition that the current temperature is higher than the upper limit value of the target temperature range, the working parameters of the target heat radiation module are regulated up by a third regulation strategy.

Here, the current temperature of the target heat generating component of the electronic device may be obtained with reference to the above description, and will not be described in detail herein.

And after comparing the current temperature with a target temperature range corresponding to the target heating component, if the current temperature is lower than the upper limit value of the target temperature range, adjusting down the working parameters of the target heat radiation module by using a second adjustment strategy matched with the configuration information. The current temperature of the target heat-generating component is lower than the upper limit value of the target temperature range to represent the temperature allowed by the normal operation of the target heat-generating component, at this time, a second adjustment strategy for the target heat-radiating module is determined based on configuration information, for example, a matched adjustment strategy is determined based on configuration information of a system, and/or a matched adjustment strategy is determined based on configuration information of the target heat-generating component, so that the current temperature of the target heat-generating component can be controlled more accurately, the problem that the expected temperature cannot be achieved by utilizing a general PID heat-radiating strategy is avoided, and meanwhile, resource waste can be avoided.

After the current temperature is compared with the target temperature range corresponding to the target heating component, if the current temperature is higher than the upper limit value of the target temperature range, the current temperature of the target heating component is represented to be not the temperature at which the target heating component normally operates, heat dissipation needs to be performed on the target heating component, and then the working parameters of the target heat dissipation module are adjusted to be high by a third adjustment strategy, so that the purpose of heat dissipation on the target heating component is achieved. For example, the rotating speed of the fan is increased, and the flow rate and the flow velocity of the heat-dissipating medium of the water cooling pipeline are increased.

Wherein the single adjustment ratio of the working parameter under the second adjustment strategy is different from the single adjustment ratio under the third adjustment strategy. Likewise, the single adjustment proportion under the third adjustment strategy can be set to a fixed value, and optionally, the fixed value can be set to a larger value, so that after the working parameters of the target heat dissipation module are adjusted to be high by the third adjustment strategy, heat dissipation can be quickly performed for the target heat dissipation component, and damage caused by the fact that the current temperature of the target heat dissipation component is too high is prevented.

Specifically, when the working parameters of the target heat radiation module are regulated down by the second regulation strategy, the first regulation coefficient of the electronic equipment and the second regulation coefficient of the target heating component are obtained based on the configuration information. The first adjustment coefficient and the second adjustment coefficient are both predetermined, and the first adjustment coefficient and the second adjustment coefficient may be stored in the baseboard management controller, or may be stored on any device capable of communicating with the baseboard management controller, as long as the baseboard management controller is available.

The first adjustment coefficient of the electronic device is determined based on the type identifier of the electronic device and/or the number of storage modules and processing modules in the electronic device, for example, the type identifier of the electronic device indicates that the electronic device belongs to the storage type, so that the first adjustment coefficient is set to be larger; and when the number of the storage modules and the processing modules in the electronic equipment is large, setting a first adjustment coefficient to be large, and the like. Optionally, the second adjustment coefficient of the target heat generating component is determined based on attribute information of the target heat generating component, such as a degree of response to the heat dissipation module, for example, the target heat generating component can respond to its corresponding heat dissipation module faster.

After the first adjustment coefficient and the second adjustment coefficient are obtained, a single adjustment ratio of the operating parameter is calculated based on the first adjustment coefficient, the second adjustment coefficient, and a difference between the current temperature and an upper limit value of the target temperature range, so as to adjust the operating parameter by the calculated single adjustment ratio in each adjustment period, respectively. Of course, each adjustment period comprises at least one adjustment of the working parameter in a single adjustment proportion, and the current temperature can be accurately adjusted to be the target temperature corresponding to the target heating component through adjustment of the adjustment proportion for multiple times of adjustment of the working parameter, so that the target heating component can normally operate.

In still another example, when the operating parameters of the target heat dissipation module of the electronic device are controlled by the target control policy based at least on the configuration information, a difference between the current temperature of the target heat generating component of the electronic device and the target temperature range may be determined first, and the adjustment proportion of the operating parameters in each adjustment period may be adjusted up or down by the target difference coefficient based on the difference range in which the difference is located; the target difference coefficient is determined based on a difference range in which the difference is located.

For example, the difference range includes two difference sub-ranges, a high difference sub-range and a low difference sub-range, and the differences in the two difference sub-ranges are continuous and non-overlapping, and each difference sub-range corresponds to a target difference coefficient. Based on the above, when the difference between the current temperature and the target temperature range falls into Gao Chazhi sub-ranges, the working parameters of the target heat dissipation module are characterized to be greatly adjusted so as to quickly adjust the current temperature of the program mark heating component, and accordingly, a target difference coefficient corresponding to the high-difference sub-range is set to be larger than 1; when the difference between the current temperature and the target temperature range falls into a low difference sub-range, the characterization needs to adjust the working parameter of the target heat radiation module in a smaller range so as to finely adjust the current temperature of the target heat radiation component, further fine adjustment of the working parameter of the target heat radiation module is realized, and accordingly, the target difference coefficient corresponding to the high difference sub-range is set to be smaller than 1. Of course, the embodiment of the present application is not particularly limited thereto.

In particular implementations, multiple target heat generating components may be present at the same time when the electronic device is operating. Based on this, the number of target heat generating components of the electronic device is determined based on the configuration information and the operation information of the electronic device when the operating parameters of the target heat dissipating module of the electronic device are controlled in the target control strategy based at least on the configuration information. Here, the operation information of the electronic device includes programs currently operated in the electronic device, components each of which corresponds to operation, and the like. The program running in the electronic device may correspond to different running components, and the component capable of generating heat is determined as a target heating component, for example, the electronic device performs video editing when the electronic device is not connected to an external power supply, where the target heating component in the electronic device at least includes a CPU and a GPU.

As can be seen from the above, the heat generating component in the electronic device may be configured with one heat dissipating module, or may be configured with another heat generating component together, or may not be configured with one heat dissipating module. Based on this, after determining the number of target heat generating components of the electronic device, it is further determined whether each target heat generating component is configured with a heat dissipating module. And under the condition that the heat dissipation modules are arranged on the target heating components, calculating single adjustment proportions of the working parameters of the heat dissipation modules corresponding to the target heating components respectively based on the difference value between the current temperature of each target heating component and the corresponding target temperature range and the first adjustment coefficient and the second adjustment coefficient of the corresponding configuration information, so as to adjust the working parameters based on the single adjustment proportions. Of course, in the case where each target heat generating component is configured with a heat dissipating module, a single adjustment ratio of the operating parameters of the heat dissipating module corresponding to each target heat generating component may be calculated for each target heat generating component; under the condition that a plurality of target heating components are provided with a heat dissipation module, the single adjustment proportion of the working parameters of the heat dissipation module can be calculated according to the distance between each target heating component and the target heat dissipation module, the proportion of the operation memory occupied by each target heating component and the like.

After determining whether each target heating component is provided with a heat dissipation module, if at least one of the target heating components is not provided with a heat dissipation module, adjusting a first adjustment coefficient and a second adjustment coefficient corresponding to configuration information based on the number of the target heating components so as to calculate a single adjustment proportion of an operating parameter of the heat dissipation module based on the adjusted adjustment coefficients, and adjusting the operating parameter based on the single adjustment proportion. In a specific implementation, due to the layout design of the electronic device, the size of each element in the electronic device, and other problems, there is a case that a heat dissipation module is not configured for a part of the heat generating components in the electronic device, at this time, when the current temperature of the part of the heat generating components is higher than the upper limit value of the target temperature range, heat is dissipated by using the heat dissipation capability of other heat dissipation modules, or a system heat dissipation system is formed by using other heat dissipation modules and a system heat dissipation module, so as to adjust the working parameters of the heat dissipation system of the whole device, thereby achieving the purpose of dissipating heat for the part of the heat generating components. The heat dissipation module is configured to perform heat dissipation according to a relative spatial position between the part of the heat generating component and other heat generating components, for example, according to a relative spatial position between the part of the heat generating component and other heat generating components, an adjacent heat generating component adjacent to the part of the heat generating component is selected, and the heat dissipation is performed by increasing an operating parameter of the heat dissipation module corresponding to the adjacent heat generating component, so as to improve a heat dissipation effect of heat dissipation on the part of the heat generating component.

In a specific implementation, the environmental temperature of the space environment where the electronic device is located affects the current temperature of the target heat-emitting module, and also affects the heat-emitting effect of the target heat-emitting module.

In another example, the power supply of the electronic device supplies power to the target heat dissipation module, the target heat generating component, and other elements, so that in order to enable the electronic device to operate at a low cost, the application obtains the power consumption information of the electronic device when the electronic device operates, wherein the power consumption information of the electronic device at least comprises power consumption duration, power consumption period, power supply parameter variation, and the like. And then, adjusting the adjustment proportion of the working parameters in each adjustment period based on the electricity consumption, for example, because the electricity prices of different electricity consumption periods are different, different adjustment proportions can be set for different electricity consumption periods, namely, the adjustment proportion is adjusted based on the electricity prices of different electricity consumption periods, so that the purpose of reducing the electricity consumption cost is achieved.

According to the embodiment of the application, the target control strategy is determined based on the configuration information of the electronic equipment, and the working parameters of the target heat dissipation module of the electronic equipment are controlled according to the adjustment proportion in the target adjustment range, so that the target heat dissipation module can achieve the purpose of dissipating heat with lower power consumption, the hardware of the electronic equipment is not required to be adjusted, the universality is higher, meanwhile, the calculated amount is lower, and the calculation load of a control chip in the electronic equipment is not increased additionally.

Based on the same inventive concept, the second aspect of the present application also provides a heat dissipation control device corresponding to the heat dissipation control method, and because the principle of solving the problem of the heat dissipation control device in the present application is similar to that of the heat dissipation control method in the present application, the implementation of the electronic device can refer to the implementation of the method, and the repetition is omitted.

Fig. 4 shows a schematic diagram of a heat dissipation control apparatus according to an embodiment of the present application, which specifically includes:

An obtaining module 401 configured to obtain configuration information of the electronic device;

A control module 402 configured to control an operating parameter of a target heat sink module of the electronic device with a target control strategy based at least on the configuration information;

Under the target control strategy, the adjustment proportion of the working parameters of the target heat radiation module in the target adjustment range is determined based on the configuration information.

In yet another embodiment, the control module 402 is specifically configured to:

Obtaining a current temperature of a target heat generating component of the electronic device;

Under the condition that the current temperature is lower than the lower limit value of the target temperature range, the working parameters of the target heat radiation module are regulated down by a first regulation strategy;

when the current temperature is in the target temperature range, the working parameters of the target heat radiation module are regulated down by a second regulation strategy matched with the configuration information;

wherein the single adjustment ratio of the working parameter under the second adjustment strategy is different from the single adjustment ratio under the first adjustment strategy.

In yet another embodiment, the control module 402 is further configured to:

Obtaining a current temperature of a target heat generating component of the electronic device;

Under the condition that the current temperature is lower than the upper limit value of the target temperature range, the working parameters of the target heat radiation module are regulated down by a second regulation strategy matched with the configuration information;

Under the condition that the current temperature is higher than the upper limit value of the target temperature range, the working parameters of the target heat radiation module are regulated up by a third regulation strategy;

wherein the single adjustment ratio of the working parameter under the second adjustment strategy is different from the single adjustment ratio under the third adjustment strategy.

In yet another embodiment, the control module 402, when adjusting down the operating parameters of the target heat sink module with the second adjustment strategy, includes:

Obtaining a first adjustment coefficient of the electronic device and a second adjustment coefficient of the target heat generating component based on the configuration information;

And calculating a single adjustment proportion of the working parameter based on the first adjustment coefficient, the second adjustment coefficient and a difference value between the current temperature and the upper limit value of the target temperature range, so as to respectively reduce the working parameter in each adjustment period according to the calculated single adjustment proportion.

In yet another embodiment, the control module 402 is further configured to:

determining a difference value between the current temperature of a target heating component of the electronic equipment and a target temperature range, and adjusting up or down the adjustment proportion of the working parameter in each adjustment period by a target difference coefficient based on the difference value range of the difference value;

The target difference coefficient is determined based on a difference range in which the difference is located.

In yet another embodiment, the control module 402 is further configured to:

Determining the number of target heat generating components of the electronic device based on the configuration information and the operation information of the electronic device;

Under the condition that the target heating components are all provided with heat dissipation modules, calculating single adjustment proportions of working parameters of the heat dissipation modules corresponding to the target heating components respectively based on the difference value between the current temperature of each target heating component and the corresponding target temperature range and the first adjustment coefficient and the second adjustment coefficient corresponding to the configuration information, so as to adjust the working parameters based on the single adjustment proportions;

And under the condition that at least one of the target heating components is not provided with a heat radiation module, adjusting a first adjustment coefficient and a second adjustment coefficient corresponding to the configuration information based on the number of the target heating components so as to calculate a single adjustment proportion of the working parameters of the heat radiation module based on the adjusted adjustment coefficients, and adjusting the working parameters based on the single adjustment proportion.

In yet another embodiment, the heat dissipation control apparatus further includes an adjustment module 403 configured to:

acquiring environmental temperature change information of a space environment in which the electronic equipment is located, and adjusting the adjustment proportion of the working parameter in each adjustment period based on the environmental temperature change information;

and obtaining the electricity consumption information of the electronic equipment, and adjusting the adjustment proportion of the working parameters in each adjustment period based on the electricity consumption information.

In yet another embodiment, the obtaining module 401 is specifically configured to at least one of:

Identifying, by a baseboard management controller of an electronic device, identification information of the electronic device to obtain configuration information of the electronic device based on the identified identification information;

in the starting process of the electronic equipment, enumeration data of all hardware components of the electronic equipment are obtained through a guide system of the electronic equipment so as to obtain configuration information of the electronic equipment.

According to the embodiment of the application, the target control strategy is determined based on the configuration information of the electronic equipment, and the working parameters of the target heat dissipation module of the electronic equipment are controlled according to the adjustment proportion in the target adjustment range, so that the target heat dissipation module can achieve the purpose of dissipating heat with lower power consumption, the hardware of the electronic equipment is not required to be adjusted, the universality is higher, meanwhile, the calculated amount is lower, and the calculation load of a control chip in the electronic equipment is not increased additionally.

The embodiment of the application provides an electronic device, the structural schematic diagram of which can be shown in fig. 5, comprising a baseboard management controller 501, at least one heating component 502 and at least one heat dissipation module 503, wherein the baseboard management controller is connected with the heating component and the heat dissipation module;

the baseboard management controller is used for obtaining configuration information of the electronic equipment;

the heating component is used for executing a target task;

the heat radiation module is used for radiating heat of the at least one heating component;

One of the baseboard management controller and the heating component can control working parameters of a target heat dissipation module of the electronic equipment according to a target control strategy based on the configuration information, wherein the target heat dissipation module is one or more of the heat dissipation modules;

Under the target control strategy, the adjustment proportion of the working parameters of the target heat radiation module in the target adjustment range is determined based on the configuration information.

According to the embodiment of the application, the target control strategy is determined based on the configuration information of the electronic equipment, and the working parameters of the target heat dissipation module of the electronic equipment are controlled according to the adjustment proportion in the target adjustment range, so that the target heat dissipation module can achieve the purpose of dissipating heat with lower power consumption, the hardware of the electronic equipment is not required to be adjusted, the universality is higher, meanwhile, the calculated amount is lower, and the calculation load of a control chip in the electronic equipment is not increased additionally.

Alternatively, in the present embodiment, the storage medium may include, but is not limited to: a usb disk, a Read-Only Memory (ROM), a random access Memory (RAM, random Access Memory), a removable hard disk, a magnetic disk, or an optical disk, or other various media capable of storing program codes. Optionally, in this embodiment, the processor performs the method steps described in the above embodiment according to the program code stored in the storage medium. Alternatively, specific examples in this embodiment may refer to examples described in the foregoing embodiments and optional implementations, and this embodiment is not described herein. It will be appreciated by those skilled in the art that the modules or steps of the application described above may be implemented in a general purpose computing device, they may be concentrated on a single computing device, or distributed across a network of computing devices, they may alternatively be implemented in program code executable by computing devices, so that they may be stored in a memory device for execution by computing devices, and in some cases, the steps shown or described may be performed in a different order than that shown or described, or they may be separately fabricated into individual integrated circuit modules, or multiple modules or steps within them may be fabricated into a single integrated circuit module for implementation. Thus, the present application is not limited to any specific combination of hardware and software.

Furthermore, although exemplary embodiments have been described herein, the scope thereof includes any and all embodiments having equivalent elements, modifications, omissions, combinations (e.g., of the various embodiments across), adaptations or alterations as pertains to the present application. The elements in the claims are to be construed broadly based on the language employed in the claims and are not limited to examples described in the present specification or during the practice of the application, which examples are to be construed as non-exclusive. It is intended, therefore, that the specification and examples be considered as exemplary only, with a true scope and spirit being indicated by the following claims and their full scope of equivalents.

The above description is intended to be illustrative and not restrictive. For example, the above-described examples (or one or more aspects thereof) may be used in combination with each other. For example, other embodiments may be used by those of ordinary skill in the art upon reading the above description. In addition, in the above detailed description, various features may be grouped together to streamline the application. This is not to be interpreted as an intention that the disclosed features not being claimed are essential to any claim. Rather, inventive subject matter may lie in less than all features of a particular disclosed embodiment. Thus, the following claims are hereby incorporated into the detailed description as examples or embodiments, with each claim standing on its own as a separate embodiment, and it is contemplated that these embodiments may be combined with one another in various combinations or permutations. The scope of the application should be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled.

While various embodiments of the present application have been described in detail, the present application is not limited to these specific embodiments, and various modifications and embodiments can be made by those skilled in the art on the basis of the inventive concept, and these modifications and modifications should be included in the scope of the claimed application.

Claims (10)

1. A heat dissipation control method, comprising:

Acquiring configuration information of the electronic equipment;

Controlling the working parameters of a target heat radiation module of the electronic equipment by a target control strategy at least based on the configuration information;

Under the target control strategy, the adjustment proportion of the working parameters of the target heat radiation module in the target adjustment range is determined based on the configuration information.

2. The method of claim 1, wherein controlling the operating parameters of the target heat sink module of the electronic device with a target control strategy based at least on the configuration information comprises:

Obtaining a current temperature of a target heat generating component of the electronic device;

Under the condition that the current temperature is lower than the lower limit value of the target temperature range, the working parameters of the target heat radiation module are regulated down by a first regulation strategy;

when the current temperature is in the target temperature range, the working parameters of the target heat radiation module are regulated down by a second regulation strategy matched with the configuration information;

wherein the single adjustment ratio of the working parameter under the second adjustment strategy is different from the single adjustment ratio under the first adjustment strategy.

3. The method of claim 1, wherein controlling the operating parameters of the target heat sink module of the electronic device with a target control strategy based at least on the configuration information comprises:

Obtaining a current temperature of a target heat generating component of the electronic device;

Under the condition that the current temperature is lower than the upper limit value of the target temperature range, the working parameters of the target heat radiation module are regulated down by a second regulation strategy matched with the configuration information;

Under the condition that the current temperature is higher than the upper limit value of the target temperature range, the working parameters of the target heat radiation module are regulated up by a third regulation strategy;

wherein the single adjustment ratio of the working parameter under the second adjustment strategy is different from the single adjustment ratio under the third adjustment strategy.

4. A method according to claim 2 or 3, wherein adjusting down the operating parameters of the target heat sink module with a second adjustment strategy comprises:

Obtaining a first adjustment coefficient of the electronic device and a second adjustment coefficient of the target heat generating component based on the configuration information;

And calculating a single adjustment proportion of the working parameter based on the first adjustment coefficient, the second adjustment coefficient and a difference value between the current temperature and the upper limit value of the target temperature range, so as to respectively reduce the working parameter in each adjustment period according to the calculated single adjustment proportion.

5. A method according to any one of claims 1 to 3, wherein controlling the operating parameters of the target heat sink module of the electronic device with a target control strategy based at least on the configuration information, further comprises:

determining a difference value between the current temperature of a target heating component of the electronic equipment and a target temperature range, and adjusting up or down the adjustment proportion of the working parameter in each adjustment period by a target difference coefficient based on the difference value range of the difference value;

The target difference coefficient is determined based on a difference range in which the difference is located.

6. The method of claim 1, wherein controlling the operating parameters of the target heat sink module of the electronic device with a target control strategy based at least on the configuration information further comprises:

Determining the number of target heat generating components of the electronic device based on the configuration information and the operation information of the electronic device;

Under the condition that the target heating components are all provided with heat dissipation modules, calculating single adjustment proportions of working parameters of the heat dissipation modules corresponding to the target heating components respectively based on the difference value between the current temperature of each target heating component and the corresponding target temperature range and the first adjustment coefficient and the second adjustment coefficient corresponding to the configuration information, so as to adjust the working parameters based on the single adjustment proportions;

And under the condition that at least one of the target heating components is not provided with a heat radiation module, adjusting a first adjustment coefficient and a second adjustment coefficient corresponding to the configuration information based on the number of the target heating components so as to calculate a single adjustment proportion of the working parameters of the heat radiation module based on the adjusted adjustment coefficients, and adjusting the working parameters based on the single adjustment proportion.

7. The method of claim 1, further comprising at least one of:

acquiring environmental temperature change information of a space environment in which the electronic equipment is located, and adjusting the adjustment proportion of the working parameter in each adjustment period based on the environmental temperature change information;

and obtaining the electricity consumption information of the electronic equipment, and adjusting the adjustment proportion of the working parameters in each adjustment period based on the electricity consumption information.

8. The method of claim 1, wherein obtaining configuration information for an electronic device comprises at least one of:

Identifying, by a baseboard management controller of an electronic device, identification information of the electronic device to obtain configuration information of the electronic device based on the identified identification information;

in the starting process of the electronic equipment, enumeration data of all hardware components of the electronic equipment are obtained through a guide system of the electronic equipment so as to obtain configuration information of the electronic equipment.

9. A heat dissipation control apparatus comprising:

An obtaining module configured to obtain configuration information of the electronic device;

the control module is configured to control the working parameters of the target heat dissipation module of the electronic equipment according to a target control strategy at least based on the configuration information;

Under the target control strategy, the adjustment proportion of the working parameters of the target heat radiation module in the target adjustment range is determined based on the configuration information.

10. An electronic device, comprising:

A baseboard management controller for obtaining configuration information of the electronic device;

At least one heating component for performing a target task;

the at least one heat dissipation module is used for dissipating heat of the at least one heating component;

One of the baseboard management controller and the heating component can control working parameters of a target heat dissipation module of the electronic equipment according to a target control strategy based on the configuration information, wherein the target heat dissipation module is one or more of the heat dissipation modules;

Under the target control strategy, the adjustment proportion of the working parameters of the target heat radiation module in the target adjustment range is determined based on the configuration information.