CN118113090A - High-voltage box temperature and humidity control method and device, electronic equipment and high-voltage box - Google Patents

Abstract

The application provides a high-voltage box control method, a device, electronic equipment and a high-voltage box, wherein the high-voltage box is controlled to work by monitoring the internal temperature of the high-voltage box, namely the temperature of a high-voltage plug-in unit and/or the temperature of a high-voltage acquisition board and the internal humidity of the high-voltage box, and based on the monitored high-voltage plug-in unit temperature and/or the high-voltage acquisition board temperature and whether the internal humidity of the high-voltage box is abnormal or not. Wherein, because the temperature variation of high-pressure connector and high-pressure acquisition board is comparatively sensitive, it is faster to heat up, whether abnormal through this high-pressure connector temperature and high-pressure acquisition board temperature, can in time reflect the risk that whether there is thermal runaway in current high-pressure box with accuracy, in addition, the inside too high humidity of high-pressure box can cause insulation problem, consequently, based on high-pressure connector temperature and/or high-pressure acquisition board temperature, and the inside humidity of high-pressure box, can control the work of high-pressure box betterly, avoid the emergence of conditions such as thermal runaway, insulation, reduce the potential safety hazard.

Description

High-voltage box temperature and humidity control method and device, electronic equipment and high-voltage box

Technical Field

The application relates to the technical field of vehicles, in particular to a high-voltage box temperature and humidity control method and device, electronic equipment and a high-voltage box.

Background

In a Battery Management System (BMS), there must be a high voltage harvesting and high voltage portion, and currently many vehicles use a distributed BMS architecture, where the high voltage box distributes power to the whole vehicle independently of the outside of the electric box. Along with the power demand of charging and whole car is bigger and bigger, the inside ambient temperature of high-pressure box can be higher, and current sealed this kind of high-pressure box structure is unknown to internal temperature rise, and the phenomenon of thermal runaway probably can appear, has the hidden danger of safety. In addition, due to alternate water inlet of the connector or cold and hot weather, the high-voltage box may have insulation problems, but the insulation problems are problems of a high-voltage system, so that the high-voltage box is high in sporability, extremely time-consuming and difficult to check, and potential safety hazards may be caused.

Disclosure of Invention

Based on the defects and shortcomings of the prior art, the application provides a high-voltage box control method, a device, electronic equipment and a high-voltage box, which can solve the problem that potential safety hazards are caused by the conditions of thermal runaway, insulation and the like in the prior art based on the monitored high-voltage plug-in temperature and/or the monitored high-voltage acquisition board temperature and the humidity inside the high-voltage box.

According to a first aspect of an embodiment of the present application, there is provided a high-voltage cassette control method including:

monitoring the internal temperature of the high-pressure box and the internal humidity of the high-pressure box, wherein the internal temperature of the high-pressure box comprises the temperature of a high-pressure connector and/or the temperature of a high-pressure acquisition plate;

Judging whether the internal temperature of the high-pressure box and the internal humidity of the high-pressure box are abnormal or not based on the first preset internal temperature of the high-pressure box and the preset internal humidity of the high-pressure box;

And controlling the high-pressure box to work based on whether the internal temperature of the high-pressure box and the internal humidity of the high-pressure box are abnormal.

According to a second aspect of an embodiment of the present application, there is provided a high-voltage cassette control apparatus including:

The monitoring module is used for monitoring the internal temperature of the high-pressure box and the internal humidity of the high-pressure box, wherein the internal temperature of the high-pressure box comprises the temperature of the high-pressure connector and/or the temperature of the high-pressure acquisition board;

The judging module is used for judging whether the internal temperature of the high-pressure box and the internal humidity of the high-pressure box are abnormal or not based on the first preset internal temperature of the high-pressure box and the preset internal humidity of the high-pressure box;

and the control module is used for controlling the high-pressure box to work based on whether the internal temperature of the high-pressure box and the internal humidity of the high-pressure box are abnormal.

According to a third aspect of embodiments of the present application, there is provided an electronic device comprising a memory and a processor;

the memory is connected with the processor and used for storing programs;

the processor is configured to implement the high voltage box control method according to the first aspect by running a program in the memory.

According to a fifth aspect of the embodiment of the present application, there is provided a high-voltage box control system, the system including a temperature sensor, a humidity sensor, a high-voltage box, and a battery management system BMS master control, the high-voltage box including a high-voltage acquisition board and a high-voltage connector therein, the temperature sensor including a first temperature sensor and/or a second temperature sensor;

The first temperature sensor is positioned on the high-voltage connector, and is used for acquiring the temperature of the high-voltage connector and sending the temperature to the high-voltage acquisition board; the second temperature sensor is positioned on the high-voltage acquisition board and used for acquiring the temperature of the high-voltage acquisition board and sending the temperature to the high-voltage acquisition board; the humidity sensor is positioned on the high-voltage acquisition board and is used for acquiring the internal humidity of the high-voltage box; the high-voltage acquisition board is connected with the first temperature sensor and the second temperature sensor and is used for sending the temperature of the high-voltage connector and the temperature of the high-voltage acquisition board to the BMS main control;

The BMS master control is used for monitoring the internal temperature of the high-voltage box and the internal humidity of the high-voltage box, wherein the internal temperature of the high-voltage box comprises the temperature of a high-voltage connector and/or the temperature of a high-voltage acquisition board; judging whether the internal temperature of the high-pressure box and the internal humidity of the high-pressure box are abnormal or not based on the first preset internal temperature of the high-pressure box and the preset internal humidity of the high-pressure box; based on whether the internal temperature of the high-pressure box and the internal humidity of the high-pressure box are abnormal, controlling the high-pressure box to work

According to a fourth aspect of embodiments of the present application, there is provided a storage medium having stored thereon a computer program which, when executed by a processor, implements the high voltage cartridge control method as described in the first aspect.

According to a fifth aspect of an embodiment of the present application, there is provided a vehicle in which the high-voltage cartridge control apparatus according to the second aspect or the electronic device according to the third aspect is provided.

In the high-voltage box control method, the device, the electronic equipment and the high-voltage box, the temperature inside the high-voltage box, namely the temperature of the high-voltage plug-in unit and/or the temperature of the high-voltage acquisition board and the humidity inside the high-voltage box are monitored, and the high-voltage box is controlled to work based on the monitored temperature of the high-voltage plug-in unit and/or the temperature of the high-voltage acquisition board and whether the humidity inside the high-voltage box is abnormal or not. Wherein, because the temperature variation of high-pressure connector and high-pressure acquisition board is comparatively sensitive, it is faster to heat up, whether abnormal through this high-pressure connector temperature and high-pressure acquisition board temperature, can in time reflect the risk that whether there is thermal runaway in current high-pressure box with accuracy, in addition, the inside too high humidity of high-pressure box can cause insulation problem, consequently, based on high-pressure connector temperature and/or high-pressure acquisition board temperature, and the inside humidity of high-pressure box, can control the work of high-pressure box betterly, avoid the emergence of conditions such as thermal runaway, insulation, reduce the potential safety hazard.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are required to be used in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only embodiments of the present application, and that other drawings can be obtained according to the provided drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic flow chart of a control method of a high-voltage box according to an embodiment of the present application;

FIG. 2 is a schematic diagram of a control flow of a high voltage box according to an embodiment of the present application;

FIG. 3 is a schematic illustration of an internal layout of a high voltage cassette according to an embodiment of the present application;

fig. 4 is a schematic structural diagram of a control device for a high-voltage box according to an embodiment of the present application;

Fig. 5 is a schematic structural diagram of an electronic device according to an embodiment of the present application.

Detailed Description

The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.

SUMMARY

As described in the background art, in the battery management system (batterymanagement system, BMS), there must be a high-voltage collection and high-voltage part, and currently, many vehicles use a distributed BMS architecture, and the high-voltage box is independent of the electric box to distribute power to the whole vehicle. Along with the power demand of charging and whole car is bigger and bigger, the inside ambient temperature of high-pressure box can be higher, and current sealed this kind of high-pressure box structure is unknown to internal temperature rise, and the phenomenon of thermal runaway probably can appear, has the hidden danger of safety. In addition, due to alternate water inlet of the connector or cold and hot weather, the high-voltage box may have insulation problems, but the insulation problems are problems of a high-voltage system, so that the high-voltage box is high in sporability, extremely time-consuming and difficult to check, and potential safety hazards may be caused.

Based on this, the inventors have further studied and found that the operation of the high-pressure box is controlled by monitoring the internal temperature of the high-pressure box, i.e., the high-pressure plug-in temperature and/or the high-pressure acquisition board temperature, and the internal humidity of the high-pressure box, and based on the monitored high-pressure plug-in temperature and/or the high-pressure acquisition board temperature, and whether the internal humidity of the high-pressure box is abnormal or not. Wherein, because the temperature variation of high-pressure connector and high-pressure acquisition board is comparatively sensitive, it is faster to heat up, whether abnormal through this high-pressure connector temperature and high-pressure acquisition board temperature, can in time reflect the risk that whether there is thermal runaway in current high-pressure box with accuracy, in addition, the inside too high humidity of high-pressure box can cause insulation problem, consequently, based on high-pressure connector temperature and/or high-pressure acquisition board temperature, and the inside humidity of high-pressure box, can control the work of high-pressure box betterly, avoid the emergence of conditions such as thermal runaway, insulation, reduce the potential safety hazard.

Based on the above-described concept, the present embodiments provide a high-voltage cassette control method, which will be exemplarily described below with reference to the accompanying drawings.

Exemplary method

Referring to fig. 1, in an exemplary embodiment, a high voltage cassette control method is provided, which is applied to a high voltage cassette control system, and in particular, to a BMS master (or BMS motherboard) of the high voltage cassette control system. As shown in fig. 1, the method includes steps S101-S103:

S101: monitoring the temperature inside the high-pressure box and the humidity inside the high-pressure box.

Wherein the high pressure box internal temperature comprises a high pressure connector temperature, and/or a high pressure acquisition board temperature.

That is, the high pressure box internal temperature includes a high pressure connector temperature. Or the high pressure box internal temperature includes a high pressure acquisition board temperature. Or the internal temperature of the high-voltage box comprises the temperature of the high-voltage connector and the temperature of the high-voltage acquisition board.

The temperature of the high-voltage connector comprises the temperatures of a plurality of high-voltage connectors, the high-voltage connector is acquired through a temperature sensor arranged on the high-voltage connector, and the high-voltage connector is transmitted to the BMS main control through a high-voltage acquisition board.

S102: based on the first preset high-pressure box internal temperature and the preset high-pressure box internal humidity, judging whether the high-pressure box internal temperature and the high-pressure box internal humidity are abnormal or not.

Specifically, whether the high-pressure box interior humidity and the high-pressure box interior temperature are abnormal or not is judged based on the magnitude relation between the first preset high-pressure box interior temperature and the magnitude relation between the preset high-pressure box interior humidity and the high-pressure box interior humidity.

S103: and controlling the high-pressure box to work based on whether the internal temperature of the high-pressure box and the internal humidity of the high-pressure box are abnormal.

In this embodiment, the operation of the high-voltage box is controlled by monitoring the internal temperature of the high-voltage box, i.e., the high-voltage connector temperature and/or the high-voltage acquisition board temperature, and the internal humidity of the high-voltage box, and based on the monitored high-voltage connector temperature and/or the high-voltage acquisition board temperature, and whether the internal humidity of the high-voltage box is abnormal. Wherein, because the temperature variation of high-pressure connector and high-pressure acquisition board is comparatively sensitive, it is faster to heat up, whether abnormal through this high-pressure connector temperature and high-pressure acquisition board temperature, can in time reflect the risk that whether there is thermal runaway in current high-pressure box with accuracy, in addition, the inside too high humidity of high-pressure box can cause insulation problem, consequently, based on high-pressure connector temperature and/or high-pressure acquisition board temperature, and the inside humidity of high-pressure box, can control the work of high-pressure box betterly, avoid the emergence of conditions such as thermal runaway, insulation, reduce the potential safety hazard.

In some embodiments, based on the first preset high-pressure box internal temperature and the preset high-pressure box internal humidity, when judging whether the high-pressure box internal temperature and the high-pressure box internal humidity are abnormal, if at least one temperature in the high-pressure plug-in temperature and/or the high-pressure acquisition board temperature is greater than the first preset high-pressure box internal temperature, determining that the high-pressure box internal temperature is abnormal; if the humidity inside the high-pressure box is greater than the preset humidity inside the high-pressure box, determining that the humidity inside the high-pressure box is abnormal.

When the internal temperature of the high-voltage box comprises the high-voltage plug-in temperature, if at least one high-voltage plug-in temperature in the high-voltage plug-in temperature is larger than the first preset internal temperature of the high-voltage box, determining that the internal temperature of the high-voltage box is abnormal;

when the internal temperature of the high-pressure box comprises the temperature of the high-pressure acquisition plate, the temperature of the high-pressure acquisition plate is larger than the internal temperature of the first preset high-pressure box, and the internal temperature of the high-pressure box is determined to be abnormal.

When the internal temperature of the high-voltage box comprises the high-voltage connector temperature and the high-voltage acquisition board temperature, if at least one of the high-voltage connector temperature and the high-voltage acquisition board temperature is higher than the first preset internal temperature of the high-voltage box, determining that the internal temperature of the high-voltage box is abnormal.

The high-voltage connector temperature corresponds to the high-voltage connector, and the number of the high-voltage connectors is generally plural, and accordingly, the number of the high-voltage connectors is plural.

Correspondingly, based on the first preset high-voltage box internal temperature and the preset high-voltage box internal humidity, judging whether the high-voltage box internal temperature and the high-voltage box internal humidity are abnormal or not, and if the high-voltage plug-in temperature and/or the high-voltage acquisition board temperature are/is smaller than or equal to the first preset high-voltage box internal temperature, determining that the high-voltage box internal temperature is abnormal; if the humidity inside the high-pressure box is smaller than or equal to the preset humidity inside the high-pressure box, determining that the humidity inside the high-pressure box is abnormal.

When the internal temperature of the high-voltage box comprises the high-voltage connector temperature, if the high-voltage connector temperature is smaller than or equal to the first preset internal temperature of the high-voltage box, determining that the internal temperature of the high-voltage box is normal;

When the internal temperature of the high-pressure box comprises the temperature of the high-pressure acquisition plate, the temperature of the high-pressure acquisition plate is smaller than or equal to the first preset internal temperature of the high-pressure box, and the internal temperature of the high-pressure box is determined to be normal.

When the internal temperature of the high-voltage box comprises the high-voltage connector temperature and the high-voltage acquisition board temperature, the high-voltage connector temperature and the high-voltage acquisition board temperature are both smaller than or equal to the first preset internal temperature of the high-voltage box, and then the internal temperature of the high-voltage box is determined to be normal.

In this embodiment, the high-voltage connector and the high-voltage collecting board are both located inside the high-voltage box, and since any temperature rise is likely to lead to the rise of the environmental temperature inside the high-voltage box, it is determined whether each high-voltage connector temperature and the high-voltage collecting board temperature are greater than the first preset high-voltage box internal temperature, any temperature is greater than the first preset high-voltage box internal temperature, the internal temperature abnormality of the high-voltage box is determined, the internal temperature condition of the high-voltage box can be determined more accurately, measures are taken in time, and the occurrence of the thermal runaway condition is avoided. In addition, the humidity inside the high-voltage box is larger than the preset humidity inside the high-voltage box, and the abnormality of the humidity inside the high-voltage box can be accurately determined, so that measures are taken in time, and the occurrence of insulation problems is avoided.

In some embodiments, the control unit is configured to control the current of the target high-voltage loop in the high-voltage box to decrease if the high-voltage box internal temperature is abnormal and the high-voltage box internal humidity is normal when the high-voltage box is operated based on whether the high-voltage box internal temperature and the high-voltage box internal humidity are abnormal. The target high-voltage loop is a high-voltage loop corresponding to the target temperature in the high-voltage box. The target temperature is the temperature of the high-voltage connector and/or the temperature of the high-voltage acquisition board which are/is higher than the internal temperature of the first preset high-voltage box;

In the high-voltage box internal temperature, the high-voltage plug-in temperature 1-2 and the high-voltage acquisition board temperature are larger than the first preset high-voltage box internal temperature, the high-voltage plug-in temperature 1-2 and the high-voltage acquisition board temperature are target temperatures, and the high-voltage circuit of the high-voltage plug-in 1-2 and the high-voltage acquisition board corresponding to the high-voltage plug-in temperature 1-2 and the high-voltage acquisition board temperature is a target high-voltage circuit.

When the current of the target voltage loop is controlled to be reduced, the current of the target voltage loop can be controlled to be different values based on the difference of the degree that the corresponding target temperature of the target voltage loop exceeds the internal temperature of the first preset high-voltage box. Typically, the current of the control target voltage loop is reduced to, for example, 50% of its own current.

If the temperature inside the high-voltage box is abnormal and the humidity inside the high-voltage box is abnormal, controlling the current of a target high-voltage loop in the high-voltage box to be reduced, and sending out prompt information, wherein the prompt information is used for reminding a user to check the high-voltage box and dry the inside of the high-voltage box;

If the temperature inside the high-pressure box is normal and the humidity inside the high-pressure box is abnormal, sending out prompt information;

if the temperature inside the high-pressure box is normal and the humidity inside the high-pressure box is normal, the treatment is not performed.

That is, when the internal temperature of the high-voltage box is abnormal, the current of the target high-voltage circuit in the high-voltage box is controlled to be reduced. When the humidity in the high-pressure box is abnormal, a prompt message is sent out to remind a user or a driver to check the high-pressure box and dry the inside of the high-pressure box.

In this embodiment, the abnormal factors, that is, the internal temperature abnormality of the high-voltage box and the humidity abnormality of the high-voltage box are treated by adopting corresponding measures respectively, so as to adjust the temperature and the humidity in a targeted manner, and effectively avoid the occurrence of thermal runaway and insulation problems.

In some embodiments, controlling current reduction of a target high voltage loop in a high voltage box comprises: if the target temperature is less than or equal to the second preset high-voltage box internal temperature, controlling the current value of the target voltage loop to be a first preset value, wherein the first preset high-voltage box internal temperature is less than the second preset high-voltage box internal temperature; and if the target temperature is greater than the second preset high-voltage box internal temperature, controlling the current value of the target voltage loop to be a second preset value, wherein the first preset value is greater than the second preset value.

For example, the first preset value and the second preset value may be different for each target voltage loop, and each target voltage loop is determined based on the present current of the high voltage loop.

In general, the second preset value may be uniform, and 0.

Of course, according to different actual requirements, the first preset value may be set to, for example, 50%, 70% and so on of the current of the loop, and the second preset value may be set to 30%, 40% and so on of the current of the loop. Typically, the first preset value is greater than the second preset value.

In this embodiment, the current of the target voltage loop may be controlled to be different values based on the difference in the degree to which the target temperature corresponding to the target voltage loop exceeds the internal temperature of the first preset high voltage box. The current of the target high-voltage loop can be dynamically adjusted, and the situation that the working requirement cannot be met due to too low current of the adjusted target high-voltage loop or the problem cannot be solved due to too high current of the adjusted target high-voltage loop is avoided.

Similarly, based on the difference of the humidity inside the high-pressure box exceeding the preset humidity inside the high-pressure box, different prompt messages can be sent out, for example, a first prompt message is sent out when the exceeding degree is smaller, the high-pressure box is prompted to be checked, a second prompt message is sent out when the exceeding degree is larger, the high-pressure box is prompted to be checked and the high-pressure box is dried. Or for example, when the exceeding degree is small, the text prompt information is sent out to prompt the user, and when the exceeding degree is large, not only the text prompt information but also the acousto-optic prompt information is sent out.

In some embodiments, while monitoring the high pressure box interior temperature and the high pressure box humidity, a determination may also be made as to whether a fault has occurred within the high pressure box interior based on the monitored high pressure box interior temperature and high pressure box humidity.

Optionally, if the difference of the internal temperatures of the high-voltage box in the first preset time period exceeds the preset temperature difference, determining that the high-voltage connector and/or the high-voltage acquisition board in the high-voltage box is in fault. The first preset time period is the current time and a period of time before the current time.

Similarly, if the difference of the internal humidity of the high-voltage box in the second preset time period exceeds the preset humidity difference, determining that the high-voltage box has an insulation fault.

The preset temperature difference value and the preset humidity difference value may be determined based on historical normal data, where, for the preset temperature difference value, the historical normal data is the change data of the internal temperature of the high-pressure box when no fault occurs before the first preset time period. For the preset humidity difference, the historical normal data is the change data of the humidity inside the high-pressure box when no fault occurs before the second preset time period.

At this time, based on two points, namely that the temperature of the high-voltage connector is easier to rise than before, and the humidity data is suddenly increased than before, whether the inside of the high-voltage box breaks down can be accurately judged, the effect of the possibility that the BMS actively recognizes the faults of the high-voltage connector/the high-voltage acquisition board or the insulation faults is achieved, measures are taken in time, and the faults are avoided.

For example, as shown in fig. 2, after the hardware is powered on, the BMS main control and the high-voltage acquisition board cooperate to complete the initialization of components such as the temperature sensor and the humidity sensor, and the high-voltage acquisition board collects all temperature and humidity data, namely the internal temperature of the high-voltage box and the internal humidity of the high-voltage box. Afterwards, the BMS master control analyzes the temperature and humidity data and judges whether the internal temperature of the high-voltage box and the internal temperature of the high-voltage box are abnormal. Whether the internal temperature of the high-pressure box and the internal temperature of the high-pressure box are abnormal or not can be basically divided into four conditions: the temperature and humidity inside the high-pressure box are normal, the temperature inside the high-pressure box (namely the temperature of the high-pressure connector or the temperature of the high-pressure acquisition plate) is abnormal, the humidity inside the high-pressure box is normal, the temperature inside the high-pressure box is normal, the humidity inside the high-pressure box is abnormal, and the temperature and humidity inside the high-pressure box are abnormal.

Wherein, inside humiture of high pressure box is normal: when the internal temperature of the high-pressure box is less than 110 ℃, and meanwhile, when the internal humidity of the high-pressure box is less than 80% of the preset internal humidity of the high-pressure box (namely, the temperature is less than 110 ℃ and the humidity is less than 80%), the internal state of the high-pressure box is in a normal state, and the BMS continuously monitors the internal state of the high-pressure box and does not perform any treatment.

The internal temperature of the high-pressure box is abnormal, and the internal humidity of the high-pressure box is normal: when the temperature of the connector (i.e. the high-voltage connector) or the temperature of the high-voltage acquisition board is higher than 110 ℃ (i.e. the temperature inside the first preset high-voltage box) and is lower than 120 ℃ (i.e. the temperature inside the second preset high-voltage box), the humidity inside the high-voltage box is lower than 80% (the temperature is more than 110 ℃) and the humidity is less than 80%), abnormal points of the temperature inside the high-voltage box, i.e. the connector or the high-voltage acquisition board with abnormal temperature, high-voltage current limiting treatment is carried out on the abnormal points, and the current of the high-voltage limiting circuit is half of the current (i.e. the first preset value). When the internal temperature of the high-pressure box is higher than 120 ℃ (i.e. the temperature is higher than 120 ℃), and the internal humidity of the high-pressure box is lower than 80%, the current limit is 0 (i.e. the second preset value).

The internal temperature of the high-pressure box is normal, and the internal humidity of the high-pressure box is abnormal: when the internal temperature of all the high-voltage boxes is less than 110 ℃, the internal humidity of the high-voltage boxes is more than 80% (namely, the temperature is less than 110 ℃ and the humidity is more than 80%), the internal humidity of the high-voltage boxes is abnormal, and even insulation faults are possibly generated, at the moment, the high-voltage boxes are inspected, and the inside of the high-voltage boxes is dried.

The temperature inside the high-pressure box is abnormal and the humidity inside the high-pressure box is abnormal: when the temperature of the connector or the temperature of the high-pressure acquisition board is higher than 110 ℃, the internal temperature of the high-pressure box is higher than 80% (the temperature is higher than 110 ℃ and the humidity is lower than 80%), abnormal points of the internal temperature of the high-pressure box are determined, and the abnormal points are subjected to current limiting treatment. The current of the high-voltage limiting loop is half of the current of the loop, the trend that the high-voltage box possibly has insulation faults can be predicted and judged, and the high-voltage box is checked and dried. When the internal temperature of the high-voltage box is higher than 120 ℃ (namely, the temperature is higher than 120 ℃), and when the internal temperature of the high-voltage box is higher than 80%, the current limit is 0, and meanwhile, the high-voltage box is checked, and the inside of the high-voltage box is dried.

According to the technical scheme provided by the application, based on the temperature and humidity of the environment (namely the temperature of the high-voltage acquisition board and the humidity inside the high-voltage box) and the temperature data on the high-voltage connector obtained by the high-voltage acquisition board through the sensor, the comprehensive analysis is carried out on all the obtained temperature and humidity data through the BMS main control, and the state of the high-voltage box, namely whether the temperature and humidity inside the high-voltage box are abnormal or not is pre-judged, so that the high-voltage box is protected by adopting proper measures, the service life of the high-voltage box is prolonged, and the difficulty of detecting insulation faults caused by water inflow and the possibility of thermal runaway caused by overcurrent are reduced.

Exemplary System

The embodiment of the application also provides a high-voltage box control system, which comprises a temperature sensor, a humidity sensor, a high-voltage box and a battery management system BMS main control, wherein the high-voltage box comprises a high-voltage acquisition board and a high-voltage connector, and the temperature sensor comprises a first temperature sensor and/or a second temperature sensor;

the first temperature sensor is positioned on the high-voltage connector and used for collecting the temperature of the high-voltage connector and sending the temperature to the high-voltage collecting plate;

the second temperature sensor is positioned on the high-voltage acquisition board and used for acquiring the temperature of the high-voltage acquisition board and sending the temperature to the high-voltage acquisition board;

The humidity sensor is positioned on the high-pressure acquisition board and used for acquiring the humidity inside the high-pressure box;

The high-pressure acquisition board is connected with the first temperature sensor and the second temperature sensor, and the effect of tracking the internal environment of the high-pressure box can be achieved by monitoring the data acquired by the temperature sensor and the humidity sensor. The high-voltage acquisition board is used for sending the temperature of the high-voltage connector and the temperature of the high-voltage acquisition board to the BMS master control;

The BMS master control is used for monitoring the internal temperature of the high-voltage box and the internal humidity of the high-voltage box, wherein the internal temperature of the high-voltage box comprises the temperature of a high-voltage connector and/or the temperature of a high-voltage acquisition board; judging whether the internal temperature of the high-pressure box and the internal humidity of the high-pressure box are abnormal or not based on the first preset internal temperature of the high-pressure box and the preset internal humidity of the high-pressure box; and controlling the high-pressure box to work based on whether the internal temperature of the high-pressure box and the internal humidity of the high-pressure box are abnormal.

Wherein, BMS master control can be located high-pressure box inside, also can be located high-pressure box outside.

For example, the high-voltage box internal layout may be as shown in fig. 3, with the upper blank box representing a high-voltage acquisition board on the BMS master, and the high-voltage acquisition board provided with a humidity sensor and a second temperature sensor. The connectors on two sides in the high-voltage box are provided with first temperature sensors.

For example, before the control flow of the high-voltage box shown in fig. 2, a temperature and humidity sampling layout is further required, that is, the position point of each high-voltage connector is determined inside the high-voltage box, the temperature sampling points NTC (i.e., the first temperature sensor) are respectively laid out, all the sampling signal lines are collected on the high-voltage sampling board, and meanwhile, the humidity sensor and the (second) temperature sensor are laid out on the high-voltage sampling board and are used for sampling the temperature inside the high-voltage box (i.e., the temperature of the high-voltage sampling board) and the humidity inside the high-voltage box.

It can be understood that in the application, a software and hardware scheme is proposed based on risk points (high-voltage plug-in points) in the high-voltage box. In terms of hardware, the detection of the internal environment temperature is carried out by using a high-voltage acquisition board circuit, the operation can be combined with the temperature detection of the high-voltage connector, the temperature sensor at the high-voltage acquisition board or the high-voltage connector can be selected and matched according to the cost, the cost of the whole high-voltage box can be effectively reduced, the safety risk is reduced, and the effect of protecting the high-voltage box is achieved; the high-voltage connector is used as a weak point of a thermal runaway point of the high-voltage box, and the temperature sensor is directly arranged at the high-voltage connector for detection, so that the thermal runaway problem of the high-voltage box can be prevented in advance, and the service life of the high-voltage connector is prolonged.

Exemplary apparatus

As shown in fig. 4, the embodiment of the application further provides a high-voltage box control device, which comprises a monitoring module 401, a judging module 402 and a control module 403.

Wherein,

A monitoring module 401 for monitoring a high pressure box internal temperature and a high pressure box internal humidity, the high pressure box internal temperature including a high pressure connector temperature, and/or a high pressure acquisition board temperature;

A judging module 402, configured to judge whether the high-pressure box internal temperature and the high-pressure box internal humidity are abnormal based on a first preset high-pressure box internal temperature and a preset high-pressure box internal humidity;

and the control module 403 is configured to control the high-pressure box to operate based on whether the internal temperature of the high-pressure box and the internal humidity of the high-pressure box are abnormal.

The high-voltage box control device provided by the embodiment belongs to the same application conception as the high-voltage box control method provided by the embodiment of the application, can execute the method provided by any embodiment of the application, and has the corresponding functional modules and beneficial effects of the execution method. Technical details not described in detail in this embodiment may be referred to the specific processing content of the high-voltage box control method provided in the foregoing embodiment of the present application, and will not be described herein.

The functions implemented by the above monitoring module 401, the judging module 402 and the control module 403 may be implemented in the form of calling software by the same or different processors, respectively, and the embodiment of the present application is not limited.

Exemplary electronic device

Another embodiment of the present application further provides an electronic device, referring to fig. 5, including: a memory 500 and a processor 510.

Wherein the memory 500 is connected to the processor 510, and is used for storing a program;

The processor 510 is configured to implement the high voltage box control method disclosed in any of the foregoing embodiments by executing a program stored in the memory 500.

Specifically, the electronic device may further include: a bus, a communication interface 520, an input device 530, and an output device 540.

The processor 510, the memory 500, the communication interface 520, the input device 530, and the output device 540 are connected to each other by a bus. Wherein:

A bus may comprise a path that communicates information between components of a computer system.

Processor 510 may be a general-purpose processor, such as a general-purpose Central Processing Unit (CPU), microprocessor, etc., or may be an application-specific integrated circuit (ASIC), or one or more integrated circuits for controlling the execution of programs in accordance with aspects of the present application. But may also be a Digital Signal Processor (DSP), application Specific Integrated Circuit (ASIC), an off-the-shelf programmable gate array (FPGA) or other programmable logic device, discrete gate or transistor logic device, discrete hardware components.

Processor 510 may include a main processor, and may also include a baseband chip, modem, and the like.

The memory 500 stores programs for implementing the technical scheme of the present application, and may also store an operating system and other key services. In particular, the program may include program code including computer-operating instructions. More specifically, memory 500 may include read-only memory (ROM), other types of static storage devices that may store static information and instructions, random access memory (random access memory, RAM), other types of dynamic storage devices that may store information and instructions, disk storage, flash, and the like.

The input device 530 may include means for receiving data and information entered by a user, such as a keyboard, mouse, camera, scanner, light pen, voice input device, touch screen, pedometer, or gravity sensor, among others.

Output device 540 may include means, such as a display screen, printer, speakers, etc., that allow information to be output to a user.

Communication interface 520 may include devices that use any type of transceiver to communicate with other devices or communication networks, such as an ethernet, a Radio Access Network (RAN), a Wireless Local Area Network (WLAN), etc.

The processor 510 executes programs stored in the memory 500 and invokes other devices that may be used to implement the various steps of any of the high voltage cartridge control methods provided in the above-described embodiments of the present application.

It will be appreciated by those skilled in the art that the structure shown in fig. 5 is merely a block diagram of a portion of the structure associated with the present inventive arrangements and is not limiting of the electronic device to which the present inventive arrangements are applied, and that a particular electronic device may include more or fewer components than shown, or may combine certain components, or have a different arrangement of components.

The embodiment of the application also provides a chip, which comprises a processor and a data interface, wherein the processor reads and runs a program stored in a memory through the data interface so as to execute the high-voltage box control method described in any embodiment, and the specific processing process and the beneficial effects thereof can be described by referring to the embodiment of the high-voltage box control method.

The embodiment of the application also provides a vehicle, wherein the high-voltage box control device or the electronic equipment is arranged in the vehicle.

In addition to the methods and apparatus described above, embodiments of the present application provide a computer program product comprising computer program instructions which, when executed by a processor, cause the processor to perform the steps in the high voltage box control method according to the various embodiments of the present application described in the "exemplary methods" section of the specification.

The computer program product may write program code for performing operations of embodiments of the present application in any combination of one or more programming languages, including an object oriented programming language such as Java, C++ or the like and conventional procedural programming languages, such as the "C" programming language or similar programming languages. The program code may execute entirely on the user's computing device, partly on the user's device, as a stand-alone software package, partly on the user's computing device, partly on a remote computing device, or entirely on the remote computing device or server.

Furthermore, embodiments of the present application also propose a storage medium having stored thereon a computer program which is executed by a processor to perform the steps in the high-voltage cassette control method according to the various embodiments of the present application described in the above-described "exemplary method" section of the present specification.

It will be appreciated that the specific examples herein are intended only to assist those skilled in the art in better understanding the embodiments of the present description and are not intended to limit the scope of the present description.

It should be understood that, in various embodiments of the present disclosure, the sequence number of each process does not mean that the execution sequence of each process should be determined by the function and the internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present disclosure.

It will be appreciated that the various embodiments described in this specification may be implemented either alone or in combination, and are not limited in this regard.

Unless defined otherwise, all technical and scientific terms used in the embodiments of this specification have the same meaning as commonly understood by one of ordinary skill in the art to which this specification belongs. The terminology used in the description is for the purpose of describing particular embodiments only and is not intended to limit the scope of the description. The term "and/or" as used in this specification includes any and all combinations of one or more of the associated listed items. As used in this specification and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

It will be appreciated that the processor of the embodiments of the present description may be an integrated circuit chip having signal processing capabilities. In implementation, the steps of the above method embodiments may be implemented by integrated logic circuits of hardware in a processor or instructions in software form. The Processor may be a general purpose Processor, a digital signal Processor (DIGITAL SIGNAL Processor, DSP), an Application SPECIFIC INTEGRATED Circuit (ASIC), an off-the-shelf programmable gate array (Field Programmable GATEARRAY, FPGA) or other programmable logic device, discrete gate or transistor logic device, discrete hardware components. The methods, steps and logic blocks disclosed in the embodiments of the present specification may be implemented or performed. A general purpose processor may be a microprocessor or the processor may be any conventional processor or the like. The steps of a method disclosed in connection with the embodiments of the present specification may be embodied directly in hardware, in a decoded processor, or in a combination of hardware and software modules in a decoded processor. The software modules may be located in a random access memory, flash memory, read only memory, programmable read only memory, or electrically erasable programmable memory, registers, etc. as well known in the art. The storage medium is located in a memory, and the processor reads the information in the memory and, in combination with its hardware, performs the steps of the above method.

It will be appreciated that the memory in the embodiments of this specification may be either volatile memory or nonvolatile memory, or may include both volatile and nonvolatile memory. The nonvolatile memory may be a read-only memory (ROM), a Programmable ROM (PROM), an Erasable Programmable ROM (EPROM), an Electrically Erasable Programmable ROM (EEPROM), or a flash memory, among others. The volatile memory may be Random Access Memory (RAM). It should be noted that the memory of the systems and methods described herein is intended to comprise, without being limited to, these and any other suitable types of memory.

Those of ordinary skill in the art will appreciate that the elements and algorithm steps described in connection with the embodiments disclosed herein can be implemented as electronic hardware, or combinations of computer software and electronic hardware. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the solution. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present specification.

It will be clear to those skilled in the art that, for convenience and brevity of description, specific working procedures of the above-described system, apparatus and unit may refer to corresponding procedures in the foregoing method embodiments, and are not repeated herein.

In the several embodiments provided in this specification, it should be understood that the disclosed systems, apparatuses, and methods may be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative, e.g., the division of the units is merely a logical function division, and there may be additional divisions when actually implemented, e.g., multiple units or components may be combined or integrated into another system, or some features may be omitted or not performed. Alternatively, the coupling or direct coupling or communication connection shown or discussed with each other may be an indirect coupling or communication connection via some interfaces, devices or units, which may be in electrical, mechanical or other form.

The units described as separate units may or may not be physically separate, and units shown as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the embodiment.

In addition, each functional unit in each embodiment of the present specification may be integrated into one processing unit, each unit may exist alone physically, or two or more units may be integrated into one unit.

The functions, if implemented in the form of software functional units and sold or used as a stand-alone product, may be stored in a computer-readable storage medium. Based on this understanding, the technical solutions of the present specification may be essentially or portions contributing to the prior art or portions of the technical solutions may be embodied in the form of a software product stored in a storage medium, including several instructions to cause a computer device (which may be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the methods described in the embodiments of the present specification. And the aforementioned storage medium includes: a usb disk, a removable hard disk, a read-only memory (ROM), a random-access memory (RAM), a magnetic disk, or an optical disk, etc.

The foregoing is merely specific embodiments of the present disclosure, but the scope of the disclosure is not limited thereto, and any person skilled in the art who is skilled in the art can easily think about variations or substitutions within the scope of the disclosure of the present disclosure, and it is intended to cover the variations or substitutions within the scope of the disclosure. Therefore, the protection scope of the present specification shall be subject to the protection scope of the claims.

Claims (10)

1. A method of controlling a high pressure cartridge, the method comprising:

monitoring the internal temperature of the high-pressure box and the internal humidity of the high-pressure box, wherein the internal temperature of the high-pressure box comprises the temperature of a high-pressure connector and/or the temperature of a high-pressure acquisition plate;

Judging whether the internal temperature of the high-pressure box and the internal humidity of the high-pressure box are abnormal or not based on the first preset internal temperature of the high-pressure box and the preset internal humidity of the high-pressure box;

And controlling the high-pressure box to work based on whether the internal temperature of the high-pressure box and the internal humidity of the high-pressure box are abnormal.

2. The method according to claim 1, wherein the determining whether the high-pressure box interior temperature and the high-pressure box interior humidity are abnormal based on a first preset high-pressure box interior temperature and a preset high-pressure box interior humidity, comprises:

If at least one of the high-voltage connector temperature and/or the high-voltage acquisition board temperature is higher than the first preset high-voltage box internal temperature, determining that the high-voltage box internal temperature is abnormal;

if the humidity inside the high-pressure box is larger than the preset humidity inside the high-pressure box, determining that the humidity inside the high-pressure box is abnormal.

3. The control method of the high-pressure cartridge according to claim 2, wherein the controlling the operation of the high-pressure cartridge based on whether the high-pressure cartridge internal temperature and the high-pressure cartridge internal humidity are abnormal, comprises:

If the internal temperature of the high-voltage box is abnormal and the internal humidity of the high-voltage box is normal, controlling the current of a target high-voltage loop in the high-voltage box to be reduced, wherein the target high-voltage loop is a high-voltage loop corresponding to the target temperature in the high-voltage box, and the target temperature is a high-voltage connector temperature and/or a high-voltage acquisition board temperature which are/is higher than the internal temperature of the first preset high-voltage box;

If the temperature inside the high-voltage box is abnormal and the humidity inside the high-voltage box is abnormal, controlling the current of the target high-voltage loop in the high-voltage box to be reduced, and sending out prompt information, wherein the prompt information is used for reminding a user to check the high-voltage box and dry the inside of the high-voltage box;

If the internal temperature of the high-pressure box is normal and the internal humidity of the high-pressure box is abnormal, sending out the prompt message;

If the temperature inside the high-pressure box is normal, the humidity inside the high-pressure box is normal, and no treatment is performed.

4. A high voltage cartridge control method according to claim 3, wherein said controlling the current reduction of a target high voltage circuit in the high voltage cartridge comprises:

If the target temperature is less than or equal to the second preset high-voltage box internal temperature, controlling the current value of the target high-voltage loop to be a first preset value, wherein the first preset high-voltage box internal temperature is less than the second preset high-voltage box internal temperature;

And if the target temperature is greater than the second preset high-voltage box internal temperature, controlling the current value of the target high-voltage loop to be a second preset value, wherein the first preset value is greater than the second preset value.

5. The high-pressure cartridge control method according to claim 1, characterized in that the method further comprises:

if the difference value of the internal temperature of the high-voltage box in the first preset time period exceeds the preset temperature difference value, determining that the high-voltage connector and/or the high-voltage acquisition board in the high-voltage box is in fault.

6. The high-pressure cartridge control method according to claim 1, characterized in that the method further comprises:

And if the difference value of the internal humidity of the high-voltage box in the second preset time period exceeds the preset humidity difference value, determining that the high-voltage box has insulation faults.

7. The system is characterized by comprising a temperature sensor, a humidity sensor, a high-voltage box and a battery management system BMS main control, wherein the high-voltage box comprises a high-voltage acquisition board and a high-voltage connector, and the temperature sensor comprises a first temperature sensor and/or a second temperature sensor;

The first temperature sensor is positioned on the high-voltage connector, and is used for acquiring the temperature of the high-voltage connector and sending the temperature to the high-voltage acquisition board;

the second temperature sensor is positioned on the high-voltage acquisition board and used for acquiring the temperature of the high-voltage acquisition board and sending the temperature to the high-voltage acquisition board;

the humidity sensor is positioned on the high-voltage acquisition board and is used for acquiring the internal humidity of the high-voltage box;

The high-voltage acquisition board is connected with the first temperature sensor and the second temperature sensor and is used for sending the temperature of the high-voltage connector and the temperature of the high-voltage acquisition board to the BMS main control;

the BMS master control is used for monitoring the internal temperature of the high-voltage box and the internal humidity of the high-voltage box, wherein the internal temperature of the high-voltage box comprises the temperature of a high-voltage connector and/or the temperature of a high-voltage acquisition board; judging whether the internal temperature of the high-pressure box and the internal humidity of the high-pressure box are abnormal or not based on the first preset internal temperature of the high-pressure box and the preset internal humidity of the high-pressure box; and controlling the high-pressure box to work based on whether the internal temperature of the high-pressure box and the internal humidity of the high-pressure box are abnormal.

8. A high pressure cartridge control device, the device comprising:

The monitoring module is used for monitoring the internal temperature of the high-pressure box and the internal humidity of the high-pressure box, wherein the internal temperature of the high-pressure box comprises the temperature of the high-pressure connector and/or the temperature of the high-pressure acquisition board;

The judging module is used for judging whether the internal temperature of the high-pressure box and the internal humidity of the high-pressure box are abnormal or not based on the first preset internal temperature of the high-pressure box and the preset internal humidity of the high-pressure box;

and the control module is used for controlling the high-pressure box to work based on whether the internal temperature of the high-pressure box and the internal humidity of the high-pressure box are abnormal.

9. An electronic device comprising a memory and a processor;

the memory is connected with the processor and used for storing programs;

the processor is configured to implement the high-voltage cartridge control method according to any one of claims 1 to 6 by running a program in the memory.

10. A vehicle in which the high-voltage cartridge control apparatus according to claim 8 or the electronic device according to claim 9 is provided.