CN118108969A - Preparation method of high-strength polyphenylene sulfide film - Google Patents
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- CN118108969A CN118108969A CN202410534277.6A CN202410534277A CN118108969A CN 118108969 A CN118108969 A CN 118108969A CN 202410534277 A CN202410534277 A CN 202410534277A CN 118108969 A CN118108969 A CN 118108969A
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- 239000004734 Polyphenylene sulfide Substances 0.000 title claims abstract description 77
- 229920000069 polyphenylene sulfide Polymers 0.000 title claims abstract description 77
- 238000002360 preparation method Methods 0.000 title claims abstract description 22
- 239000002096 quantum dot Substances 0.000 claims abstract description 34
- 238000001816 cooling Methods 0.000 claims abstract description 24
- 239000000463 material Substances 0.000 claims abstract description 23
- 239000011347 resin Substances 0.000 claims abstract description 22
- 229920005989 resin Polymers 0.000 claims abstract description 22
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims abstract description 20
- 238000002156 mixing Methods 0.000 claims abstract description 17
- 238000000034 method Methods 0.000 claims abstract description 9
- 238000002844 melting Methods 0.000 claims abstract description 7
- 230000008018 melting Effects 0.000 claims abstract description 7
- 238000010438 heat treatment Methods 0.000 claims abstract description 6
- 238000003756 stirring Methods 0.000 claims abstract description 6
- 239000000126 substance Substances 0.000 claims abstract description 6
- 238000001035 drying Methods 0.000 claims abstract description 5
- 238000007789 sealing Methods 0.000 claims abstract description 5
- 239000002904 solvent Substances 0.000 claims abstract description 5
- 229920002689 polyvinyl acetate Polymers 0.000 claims abstract description 4
- 239000011118 polyvinyl acetate Substances 0.000 claims abstract description 4
- AZJTUYPIWZAMTM-UHFFFAOYSA-N 7-Mercaptoheptanoic acid Chemical compound OC(=O)CCCCCCS AZJTUYPIWZAMTM-UHFFFAOYSA-N 0.000 claims description 19
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 claims description 15
- 239000003446 ligand Substances 0.000 claims description 13
- RMVRSNDYEFQCLF-UHFFFAOYSA-N thiophenol Chemical compound SC1=CC=CC=C1 RMVRSNDYEFQCLF-UHFFFAOYSA-N 0.000 claims description 12
- 238000009998 heat setting Methods 0.000 claims description 10
- 230000002040 relaxant effect Effects 0.000 claims description 5
- GWOLZNVIRIHJHB-UHFFFAOYSA-N 11-mercaptoundecanoic acid Chemical compound OC(=O)CCCCCCCCCCS GWOLZNVIRIHJHB-UHFFFAOYSA-N 0.000 claims description 4
- SDAWVOFJSUUKMR-UHFFFAOYSA-N 12-sulfanyldodecanoic acid Chemical compound OC(=O)CCCCCCCCCCCS SDAWVOFJSUUKMR-UHFFFAOYSA-N 0.000 claims description 4
- CFPHMAVQAJGVPV-UHFFFAOYSA-N 2-sulfanylbutanoic acid Chemical compound CCC(S)C(O)=O CFPHMAVQAJGVPV-UHFFFAOYSA-N 0.000 claims description 4
- DKIDEFUBRARXTE-UHFFFAOYSA-N 3-mercaptopropanoic acid Chemical compound OC(=O)CCS DKIDEFUBRARXTE-UHFFFAOYSA-N 0.000 claims description 4
- XUJNEKJLAYXESH-UHFFFAOYSA-N cysteine Natural products SCC(N)C(O)=O XUJNEKJLAYXESH-UHFFFAOYSA-N 0.000 claims description 4
- 235000018417 cysteine Nutrition 0.000 claims description 4
- DNJIEGIFACGWOD-UHFFFAOYSA-N ethyl mercaptane Natural products CCS DNJIEGIFACGWOD-UHFFFAOYSA-N 0.000 claims description 4
- PJUIMOJAAPLTRJ-UHFFFAOYSA-N monothioglycerol Chemical compound OCC(O)CS PJUIMOJAAPLTRJ-UHFFFAOYSA-N 0.000 claims description 4
- DGVVWUTYPXICAM-UHFFFAOYSA-N β‐Mercaptoethanol Chemical compound OCCS DGVVWUTYPXICAM-UHFFFAOYSA-N 0.000 claims description 4
- XUJNEKJLAYXESH-REOHCLBHSA-N L-Cysteine Chemical compound SC[C@H](N)C(O)=O XUJNEKJLAYXESH-REOHCLBHSA-N 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims 3
- 239000000155 melt Substances 0.000 claims 1
- 230000000704 physical effect Effects 0.000 abstract description 3
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- 238000012360 testing method Methods 0.000 description 5
- 238000001125 extrusion Methods 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229920006269 PPS film Polymers 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 235000013305 food Nutrition 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000001308 synthesis method Methods 0.000 description 1
- WTHDKMILWLGDKL-UHFFFAOYSA-N urea;hydrate Chemical compound O.NC(N)=O WTHDKMILWLGDKL-UHFFFAOYSA-N 0.000 description 1
- 238000001291 vacuum drying Methods 0.000 description 1
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Abstract
The invention belongs to the field of polyphenylene sulfide, and particularly relates to a preparation method of a high-strength polyphenylene sulfide film. The method comprises the following steps: step S1: adding polyphenylene sulfide resin and ligand-modified CdS quantum dots into an acetone solvent, stirring at room temperature for 2 hours, uniformly mixing, then drying to remove an acetone solution, heating the rest substances, and naturally cooling to room temperature; step S2: mixing the product obtained in the step S1 with polyvinyl acetate, melting, blending and extruding by a double-screw extruder, and carrying out sealing, cooling and solidifying while applying electrostatic charge cold roll conveying to the material with the surface temperature of 45 ℃; and S3, longitudinally stretching the material obtained in the step S1 in the length direction and transversely stretching the material in the width direction, so that the polyphenylene sulfide film with excellent physical properties is obtained.
Description
Technical Field
The invention belongs to the field of polyphenylene sulfide, and particularly relates to a preparation method of a high-strength polyphenylene sulfide film.
Background
Polyphenylene Sulfide (PPS) stands out for its excellent chemical resistance and stable thermal properties at high temperatures. The PPS has low water absorption and low moisture absorption, and combines flame retardance, insulation, radiation resistance and excellent mechanical properties, so that the PPS is widely applied to the fields of automobiles, aerospace, electronics, food engineering and the like. The PPS film is an ideal insulating material for magnetic recording medium base films, capacitors and other electronic components or equipment by the characteristics of excellent heat resistance, flame retardance, rigidity, excellent chemical reagent resistance, electrical insulation, low hygroscopicity and the like.
However, it is not neglected that single PPS material products perform poorly in terms of toughness and strength, and in particular PPS film products, which have relatively low toughness and elongation at break, which limits to some extent their satisfaction of the high demands on material properties in modern society. Therefore, in order to widen the application field of PPS materials, improving toughness and strength thereof is a problem to be solved currently.
Disclosure of Invention
The invention aims to provide a preparation method of a high-strength polyphenylene sulfide film.
The invention is realized by the following technical scheme:
The preparation method of the high-strength polyphenylene sulfide film comprises the following steps:
step S1: adding polyphenylene sulfide resin and ligand-modified CdS quantum dots into an acetone solvent, stirring at room temperature for 2 hours, uniformly mixing, then drying to remove an acetone solution, heating the rest substances, and naturally cooling to room temperature;
Step S2: mixing the product obtained in the step S1 with polyvinyl acetate, melting, blending and extruding by a double-screw extruder, and carrying out sealing, cooling and solidifying while applying electrostatic charge cold roll conveying to the material with the surface temperature of 45 ℃;
step S3, longitudinally stretching the material obtained in the step S1 in the length direction, and transversely stretching the material in the width direction to obtain a polyphenylene sulfide film;
The ligand of the ligand modified CdS quantum dot is selected from one of mercaptopropionic acid, mercaptobutyric acid, 7-mercaptoheptanoic acid, 11-mercaptoundecanoic acid, mercaptoethanol, thiophenol, 1-thioglycerol, cysteine and 12-mercaptododecanoic acid.
Further, the ligand of the ligand-modified CdS quantum dot is selected from 7-mercaptoheptanoic acid.
Further, the polyphenylene sulfide resin is 100 parts by weight, the polybutylece is 1 part by weight, the vinyl acetate is 1 part by weight, and the 7-mercaptoheptanoic acid modified CdS quantum dot is 0.5-2 parts by weight.
Further, the weight part of the 7-mercaptoheptanoic acid modified CdS quantum dot is 0.7-1 part.
Further, the weight part of the 7-mercaptoheptanoic acid modified CdS quantum dot is 1 part.
Further, the remaining material was heated to a temperature of 285 ℃ and maintained for 48 hours.
Further, in the step S2, the feeding speed is 60r/min, the screw speed is 250r/min, the rotation speed of a metering pump is 40r/min, the melting plasticizing temperature is 210 ℃, and the die head temperature is 230 ℃.
Further, the longitudinal stretching is to feed the cast film sheet into a longitudinal stretching roll, stretch it in the longitudinal direction of the film with a stretching ratio of 3 times, a stretching temperature of 101 ℃, and then cool it with a cooling roll set of 30 ℃.
Further, the transverse stretching is to send the longitudinally stretched thick sheet into a transverse stretching machine for transverse stretching, and the preheating temperature is 100 ℃ and the preheating time is 20s; the stretching temperature is 110 ℃, and the stretching multiplying power is 4.0 times; and then carrying out heat setting while relaxing the stretched film in the width direction, wherein the heat setting temperature is 160 ℃, the time is 15s, the relaxation rate is 4%, and finally cooling to room temperature to obtain the polyphenylene sulfide film.
Compared with the prior art, the invention has the following advantages and beneficial effects: according to the invention, cdS quantum dots modified by different ligands, especially 7-mercaptoheptanoic acid, are added into the polyphenylene sulfide resin, and the polyphenylene sulfide value and the ligand modified quantum dots are heated at 285 ℃ in the preparation stage and then are mixed with other components, so that the physical properties of the polyphenylene sulfide film are improved.
Detailed Description
The present invention will be described in further detail with reference to the following examples, for the purpose of making the objects, technical solutions and advantages of the present invention more apparent, and the description thereof is merely illustrative of the present invention and not intended to be limiting.
The synthesis method of the CdS quantum dot modified by different ligands comprises the following steps:
Taking 11mmol Cd (CH 3COO)2·2H2 O and 27mmol ligand, adding into 200mL deionized water, then using 1M KOH to adjust pH to 10, under nitrogen environment, dropwise adding 50mL urea water solution with urea content of 3mmol under vigorous stirring, then refluxing and heating at 100 ℃ for 2h, centrifuging to obtain precipitate, and vacuum drying the precipitate to obtain the catalyst.
The ligand selected includes mercaptopropionic acid, mercaptobutyric acid, 7-mercaptoheptanoic acid, 11-mercaptoundecanoic acid, mercaptoethanol, thiophenol, 1-thioglycerol, cysteine, 12-mercaptododecanoic acid.
The number average molecular weight of the polyphenylene sulfide in the invention is 10000.
Example 1
A high-strength polyphenylene sulfide film comprises the following components in parts by weight: 100 parts of polyphenylene sulfide resin, 1 part of polybutylece, 1 part of vinyl acetate and 0.5 part of 7-mercaptoheptanoic acid modified CdS quantum dot;
The preparation method of the polyphenylene sulfide film comprises the following steps:
step S1: adding polyphenylene sulfide resin and ligand-modified CdS quantum dots into an acetone solvent, stirring at room temperature for 2 hours, uniformly mixing, then drying to remove an acetone solution, heating the rest substances to 285 ℃ and maintaining for 48 hours, and then naturally cooling to room temperature;
Step S2: mixing the product obtained in the step S1 with the rest raw materials, carrying out melt blending extrusion by a double-screw extruder, and carrying out sealing cooling solidification while applying electrostatic charge cold roll conveying to the material with the surface temperature of 45 ℃; wherein the feeding speed is 60r/min, the screw speed is 250r/min, the rotation speed of a metering pump is 40r/min, the melting plasticizing temperature is 210 ℃, and the die head temperature is 230 ℃;
step S3, longitudinally stretching the material obtained in the step S1 in the length direction, and transversely stretching the material in the width direction;
The longitudinal stretching: feeding the cast film sheet into a longitudinal stretching roller, stretching in the longitudinal direction of the film at a stretching ratio of 3 times and a stretching temperature of 101 ℃, and then cooling by a cooling roller set at 30 ℃;
The lateral stretching: feeding the longitudinally stretched thick sheet into a transverse stretching machine for transverse stretching, wherein the preheating temperature is 100 ℃, and the preheating time is 20s; the stretching temperature is 110 ℃, and the stretching multiplying power is 4.0 times; and then carrying out heat setting while relaxing the stretched film in the width direction, wherein the heat setting temperature is 160 ℃, the time is 15s, the relaxation rate is 4%, and finally cooling to room temperature to obtain the polyphenylene sulfide film.
Example 2
A high-strength polyphenylene sulfide film comprises the following components in parts by weight: 100 parts of polyphenylene sulfide resin, 1 part of polybutylece, 1 part of vinyl acetate and 0.7 part of 7-mercaptoheptanoic acid modified CdS quantum dot;
The preparation method is the same as in example 1.
Example 3
A high-strength polyphenylene sulfide film comprises the following components in parts by weight: 100 parts of polyphenylene sulfide resin, 1 part of polybutylece, 1 part of vinyl acetate and 1.0 part of 7-mercaptoheptanoic acid modified CdS quantum dot;
The preparation method is the same as in example 1.
Example 4
A high-strength polyphenylene sulfide film comprises the following components in parts by weight: 100 parts of polyphenylene sulfide resin, 1 part of polybutylece, 1 part of vinyl acetate and 1.5 parts of 7-mercaptoheptanoic acid modified CdS quantum dots;
The preparation method is the same as in example 1.
Example 5
A high-strength polyphenylene sulfide film comprises the following components in parts by weight: 100 parts of polyphenylene sulfide resin, 1 part of polybutylece, 1 part of vinyl acetate and 2 parts of 7-mercaptoheptanoic acid modified CdS quantum dots;
The preparation method is the same as in example 1.
Comparative example 1
A high-strength polyphenylene sulfide film comprises the following components in parts by weight: 100 parts of polyphenylene sulfide resin, 1 part of polybutylece, 1 part of vinyl acetate and 1 part of mercaptopropionic acid modified CdS quantum dot;
The preparation method of the polyphenylene sulfide film comprises the following steps:
Step S1: adding polyphenylene sulfide resin and ligand-modified CdS quantum dots into an acetone solvent, stirring at room temperature for 2 hours, uniformly mixing, then drying to remove an acetone solution, heating the rest substances to 285 ℃ and maintaining for 48 hours, and then naturally cooling to room temperature.
Step S2: mixing the product obtained in the step S1 with the rest raw materials, and carrying out melt blending extrusion by a double-screw extruder to obtain a product with the surface temperature of 45 DEG C
The material is closely cooled and solidified while being conveyed by a static charge cold roller; wherein the feeding speed is 60r/min, the screw speed is 250r/min, the rotation speed of a metering pump is 40r/min, the melting plasticizing temperature is 210 ℃, and the die head temperature is 230 ℃;
step S3, longitudinally stretching the material obtained in the step S1 in the length direction, and transversely stretching the material in the width direction;
The longitudinal stretching: feeding the cast film sheet into a longitudinal stretching roller, stretching in the longitudinal direction of the film at a stretching ratio of 3 times and a stretching temperature of 101 ℃, and then cooling by a cooling roller set at 30 ℃;
The lateral stretching: feeding the longitudinally stretched thick sheet into a transverse stretching machine for transverse stretching, wherein the preheating temperature is 100 ℃, and the preheating time is 20s; the stretching temperature is 110 ℃, and the stretching multiplying power is 4.0 times; and then carrying out heat setting while relaxing the stretched film in the width direction, wherein the heat setting temperature is 160 ℃, the time is 15s, the relaxation rate is 4%, and finally cooling to room temperature to obtain the polyphenylene sulfide film.
Comparative example 2
A high-strength polyphenylene sulfide film comprises the following components in parts by weight: 100 parts of polyphenylene sulfide resin, 1 part of polybutylece, 1 part of vinyl acetate and 1 part of mercapto butyric acid modified CdS quantum dot;
The preparation method is the same as that of comparative example 1.
Comparative example 3
A high-strength polyphenylene sulfide film comprises the following components in parts by weight: 100 parts of polyphenylene sulfide resin, 1 part of polybutylece, 1 part of vinyl acetate and 1 part of 11-mercaptoundecanoic acid modified CdS quantum dot;
The preparation method is the same as that of comparative example 1.
Comparative example 4
A high-strength polyphenylene sulfide film comprises the following components in parts by weight: 100 parts of polyphenylene sulfide resin, 1 part of polybutylece, 1 part of vinyl acetate and 1 part of mercaptoethanol modified CdS quantum dot;
The preparation method is the same as that of comparative example 1.
Comparative example 5
A high-strength polyphenylene sulfide film comprises the following components in parts by weight: 100 parts of polyphenylene sulfide resin, 1 part of polybutylece, 1 part of vinyl acetate and 1 part of thiophenol modified CdS quantum dot;
The preparation method is the same as that of comparative example 1.
Comparative example 6
A high-strength polyphenylene sulfide film comprises the following components in parts by weight: 100 parts of polyphenylene sulfide resin, 1 part of polybutylece, 1 part of vinyl acetate and 1 part of 1-thioglycerol modified CdS quantum dot;
The preparation method is the same as that of comparative example 1.
Comparative example 7
A high-strength polyphenylene sulfide film comprises the following components in parts by weight: 100 parts of polyphenylene sulfide resin, 1 part of polyvinyl acetate, 1 part of cysteine modified CdS quantum dot;
The preparation method is the same as that of comparative example 1.
Comparative example 8
A high-strength polyphenylene sulfide film comprises the following components in parts by weight: 100 parts of polyphenylene sulfide resin, 1 part of polybutylece, 1 part of vinyl acetate and 1 part of 12-mercapto-dodecanoic acid modified CdS quantum dot;
The preparation method is the same as that of comparative example 1.
Comparative example 9
A high-strength polyphenylene sulfide film comprises the following components in parts by weight: 100 parts of polyphenylene sulfide resin, 1 part of polybutylece, 1 part of vinyl acetate and 1.0 part of 7-mercaptoheptanoic acid modified CdS quantum dot;
The preparation method of the polyphenylene sulfide film comprises the following steps:
Step S1: mixing the raw materials, carrying out melt blending extrusion by a double-screw extruder, and carrying out sealing cooling solidification while applying electrostatic charge cold roll conveying to the material with the surface temperature of 45 ℃; wherein the feeding speed is 60r/min, the screw speed is 250r/min, the rotation speed of a metering pump is 40r/min, the melting plasticizing temperature is 210 ℃, and the die head temperature is 230 ℃;
step S2, longitudinally stretching the material obtained in the step S1 in the length direction, and transversely stretching the material in the width direction;
The longitudinal stretching: feeding the cast film sheet into a longitudinal stretching roller, stretching in the longitudinal direction of the film at a stretching ratio of 3 times and a stretching temperature of 101 ℃, and then cooling by a cooling roller set at 30 ℃;
The lateral stretching: feeding the longitudinally stretched thick sheet into a transverse stretching machine for transverse stretching, wherein the preheating temperature is 100 ℃, and the preheating time is 20s; the stretching temperature is 110 ℃, and the stretching multiplying power is 4.0 times; and then carrying out heat setting while relaxing the stretched film in the width direction, wherein the heat setting temperature is 160 ℃, the time is 15s, the relaxation rate is 4%, and finally cooling to room temperature to obtain the polyphenylene sulfide film.
Test example 1
The impact strength testing method comprises the following steps: the test was performed using the method in GB/T1843-2008, and each sample was tested 5 times, and the average was taken.
The tensile strength testing method comprises the following steps: the test was performed using the method in GB/T1040.1-2018, 5 times per sample, and the average was taken.
The impact strength and tensile strength of each example are shown in table 1.
Table 1 performance test
| Impact strength (KJ/m 2) | Tensile strength (Mpa) | |
| Example 1 | 74 | 75 |
| Example 2 | 76 | 76 |
| Example 3 | 87 | 85 |
| Example 4 | 84 | 78 |
| Example 5 | 82 | 75 |
| Comparative example 1 | 67 | 30 |
| Comparative example 2 | 64 | 37 |
| Comparative example 3 | 63 | 35 |
| Comparative example 4 | 62 | 41 |
| Comparative example 5 | 66 | 42 |
| Comparative example 6 | 61 | 53 |
| Comparative example 7 | 65 | 33 |
| Comparative example 8 | 66 | 46 |
| Comparative example 9 | 57 | 65 |
As can be seen from table 1, in the CdS quantum dots modified by different ligands, only CdS modified by adding 7-mercaptoheptanoic acid brings good impact strength and tensile strength to the polyphenylene sulfide film, and the influence of other ligands after modification is small. Meanwhile, the CdS and the polyphenylene sulfide are firstly heated at 285 ℃, so that the bonding strength of the CdS quantum dots and the polyphenylene sulfide can be enhanced, and the physical properties of the polyphenylene sulfide film can be further improved.
The foregoing description of the embodiments has been provided for the purpose of illustrating the general principles of the invention, and is not meant to limit the scope of the invention, but to limit the invention to the particular embodiments, and any modifications, equivalents, improvements, etc. that fall within the spirit and principles of the invention are intended to be included within the scope of the invention.
Claims (9)
1. The preparation method of the high-strength polyphenylene sulfide film is characterized by comprising the following steps of:
step S1: adding polyphenylene sulfide resin and ligand-modified CdS quantum dots into an acetone solvent, stirring at room temperature for 2 hours, uniformly mixing, then drying to remove an acetone solution, heating the rest substances, and naturally cooling to room temperature;
Step S2: mixing the product obtained in the step S1 with polyvinyl acetate, melting, blending and extruding by a double-screw extruder, and carrying out sealing, cooling and solidifying while applying electrostatic charge cold roll conveying to the material with the surface temperature of 45 ℃;
Step S3, longitudinally stretching the material obtained in the step S2 in the length direction, and transversely stretching the material in the width direction to obtain the polyphenylene sulfide film;
The ligand of the ligand modified CdS quantum dot is selected from one of mercaptopropionic acid, mercaptobutyric acid, 7-mercaptoheptanoic acid, 11-mercaptoundecanoic acid, mercaptoethanol, thiophenol, 1-thioglycerol, cysteine and 12-mercaptododecanoic acid.
2. The method for preparing a high-strength polyphenylene sulfide film according to claim 1, wherein the ligand of the ligand-modified CdS quantum dot is selected from 7-mercaptoheptanoic acid.
3. The method for preparing a high-strength polyphenylene sulfide film according to claim 2, wherein the polyphenylene sulfide resin is 100 parts by weight, the polybutylece is 1 part by weight, the vinyl acetate is 1 part by weight, and the 7-mercaptoheptanoic acid modified CdS quantum dots are 0.5 to 2 parts by weight.
4. The method for preparing a high-strength polyphenylene sulfide film according to claim 3, wherein the weight part of the 7-mercaptoheptanoic acid modified CdS quantum dot is 0.7-1 part.
5. The method for preparing a high-strength polyphenylene sulfide film according to claim 4, wherein the weight part of the 7-mercaptoheptanoic acid modified CdS quantum dot is 1 part.
6. The method for producing a high-strength polyphenylene sulfide film as claimed in claim 1, wherein the remaining material is heated to a temperature of 285 ℃ and maintained for 48 hours.
7. The method for preparing a high-strength polyphenylene sulfide film according to claim 1, wherein in the step S2, a feeding speed is 60r/min, a screw speed is 250r/min, a rotation speed of a metering pump is 40r/min, a melt plasticizing temperature is 210 ℃, and a die temperature is 230 ℃.
8. The method for producing a high-strength polyphenylene sulfide film as claimed in claim 1, wherein the longitudinal stretching is a process of feeding a cast film sheet to a longitudinal stretching roll, stretching in the longitudinal direction of the film at a stretching ratio of 3 times, stretching at a temperature of 101℃and cooling with a cooling roll set at 30 ℃.
9. The method for producing a high-strength polyphenylene sulfide film as claimed in claim 1,
The transverse stretching is to send the longitudinally stretched thick sheet into a transverse stretching machine for transverse stretching, and the preheating temperature is 100 ℃ and the preheating time is 20s; the stretching temperature is 110 ℃, and the stretching multiplying power is 4.0 times; and then carrying out heat setting while relaxing the stretched film in the width direction, wherein the heat setting temperature is 160 ℃, the time is 15s, the relaxation rate is 4%, and finally cooling to room temperature to obtain the polyphenylene sulfide film.
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