CN118102846A - Preparation and transfer printing method of patterned piezoelectric ceramic film - Google Patents
Preparation and transfer printing method of patterned piezoelectric ceramic film Download PDFInfo
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
- H10N30/072—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
- H10N30/073—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies by fusion of metals or by adhesives
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
- H10N30/085—Shaping or machining of piezoelectric or electrostrictive bodies by machining
- H10N30/088—Shaping or machining of piezoelectric or electrostrictive bodies by machining by cutting or dicing
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/30—Piezoelectric or electrostrictive devices with mechanical input and electrical output, e.g. functioning as generators or sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/30—Piezoelectric or electrostrictive devices with mechanical input and electrical output, e.g. functioning as generators or sensors
- H10N30/302—Sensors
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/85—Piezoelectric or electrostrictive active materials
- H10N30/853—Ceramic compositions
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Abstract
The invention provides a preparation and transfer printing method of a patterned piezoelectric ceramic film, which comprises the following steps: providing a substrate and a piezoelectric ceramic plate, placing the piezoelectric ceramic plate on the surface of the substrate, and bonding the piezoelectric ceramic plate and the substrate together; thinning the piezoelectric ceramic sheet to form a piezoelectric ceramic film; cutting the piezoelectric ceramic film to form a piezoelectric ceramic film with a geometric pattern; removing temporary bonding glue used for bonding to separate the piezoelectric ceramic film from the substrate to obtain a patterned piezoelectric ceramic film; adhering the patterned piezoelectric ceramic film to the surface of the transfer material; providing a flexible substrate, and coating conductive paste on the flexible substrate in a screen printing mode; imprinting the patterned piezoelectric ceramic film on the surface of the conductive paste, bonding the patterned piezoelectric ceramic film with a flexible substrate, and stripping the transfer material; the patterned piezoelectric ceramic film and the flexible substrate are heated until the conductive paste is completely cured. The invention realizes the patterning preparation and the reliable transfer printing of the piezoelectric ceramic film.
Description
Technical Field
The invention relates to the technical field of piezoelectric ceramic films, in particular to a preparation and transfer printing method of a patterned piezoelectric ceramic film.
Background
The piezoelectric material can realize the mutual conversion of mechanical energy and electric energy, and has very wide application prospect in the fields of sensors, energy collectors and drivers. The piezoelectric material mainly comprises piezoelectric single crystals, piezoelectric ceramics, piezoelectric polymers and piezoelectric composite materials. With the rapid development of flexible electronic technology, piezoelectric polymers and piezoelectric composite materials are receiving a great deal of attention, however, the piezoelectric performance of the piezoelectric polymer and piezoelectric composite materials is much lower than that of piezoelectric single crystals and piezoelectric ceramics, and efficient electromechanical conversion is difficult to realize. In addition, piezoelectric single crystals have a higher electromechanical coupling coefficient than piezoelectric ceramics, but have a relatively low curie temperature, and high temperature treatment processes need to be avoided in the process. At present, piezoelectric ceramics occupy a considerable proportion in the market, and are also the piezoelectric materials most widely used.
Thinning of piezoelectric ceramic materials is a key technology for developing high-performance piezoelectric sensors and actuators compatible with MEMS technology. The development of the piezoelectric material film technology is mainly carried out along two lines: deposition methods and thinning processes. Common deposition methods such as sol gel, hydrothermal, aerosol deposition, pulsed laser deposition, sputtering, and the like. Although the thickness of the piezoelectric ceramic thin films prepared based on the deposition process can be controlled to the nanometer level, so that the prepared piezoelectric devices have more excellent flexibility, the piezoelectric performance of the piezoelectric thin films is limited. The preparation method based on the thinning process can thin the massive piezoelectric ceramic prepared by high-temperature sintering through chemical mechanical polishing, and keeps good compactness and piezoelectric properties of the piezoelectric ceramic. However, due to the inherent mechanical stiffness, piezoceramic films are somewhat brittle and break easily, requiring temporary rigid substrates to provide reliable mechanical support against grinding wheel shear forces. In addition, the patterned structure design of the piezoelectric ceramic thin film is expected to provide unprecedented characteristics or functions. Compared with the modes of photoetching, 3D printing and the like, the laser cutting is simpler and more efficient. However, the piezoelectric ceramic is easy to warp due to the low thickness after being thinned, and the piezoelectric ceramic film is smoothly transferred to the target flexible substrate, so that the method is challenging.
Through the search of the prior art, the following steps:
yi Qi, noah T. Jaffeis et al, nano Letters, written "Piezoelectric ribbons printed onto rubber for flexible energy conversion", which reports introducing a method of transferring PZT nanoribbons onto flexible PDMS substrates, preparing PZT nanoribbons with a thickness of 500 nanometers on a magnesium oxide substrate by radio frequency sputtering, and annealing at 750 ℃ to convert PZT into perovskite structure; then, the MgO wafer is etched by phosphoric acid to loosen the PZT nanoribbon without complete dislocation. The PDMS may form a conformal contact with the PZT due to van der waals forces and eventually transfer to the PDMS substrate. The PZT preparation process is complex, and the piezoelectric coefficient is only 57.0pm/V, which is far lower than that of bulk PZT (200-400 pm/V) prepared by high-temperature sintering.
Geon-Tae Hwang, joonseok Yang et al, ADVANCED ENERGY MATERIALS written "AReconfigurable Rectified Flexible ENERGY HARVESTER VIA Solid-STATE SINGLE CRYSTAL Grown PMN-PZT", which prepared (011) -oriented single crystal PMN-PZT blocks based on Solid single crystal growth, the single crystal PMN-PZT blocks were completely bonded to a glass substrate by a bonding wax having a melting temperature of 60 ℃, and then thinned to a thickness of 10 μm by a polishing process; the PMN-PZT thin film is stuck on a PET substrate with the thickness of 125 mu m through PU glue, and then the PU glue is solidified by ultraviolet light. After heating to the melting temperature of the bonding wax, the PMN-PZT thin film is separated from the glass. The prior art does not mention the uniformity of the PMN-PZT thin film nor the patterning. In addition, the PU adhesive is an insulating adhesive and cannot be suitable for interconnecting the PMN-PZT thin film and the electrode.
P.Janphuang, R.Lockhart et al, sensors andActuators A Physical written "Vibrational Piezoelectric Energy Harvesters Based On Thinned Bulk PZT Sheets FabricatedAt The Wafer Level", by spin-on bonding glue WaferBOND CR-110 to bond bulk PZT and SOI wafers at low temperature, and then mechanically grinding to thin the PZT to a thickness of 20 μm. The processing is performed on an SOI wafer without involving transfer of PZT from a rigid substrate to a flexible substrate, and patterned fabrication of PZT.
In summary, most of the currently reported preparation methods of the piezoelectric ceramic thin film on the flexible substrate aim at the piezoelectric ceramic thin film prepared based on the deposition process, and the piezoelectric performance of the piezoelectric ceramic thin film is far lower than that of the bulk piezoelectric ceramic. The piezoelectric ceramic film has high mechanical hardness and is easy to break. For bulk piezoelectric ceramics, reliable thinning and transfer methods are important. In addition, patterning of the piezoelectric ceramic film is beneficial to the preparation of various functional devices and the improvement of performance, so that a stable, reliable, simple and practical preparation and transfer printing method of the patterned piezoelectric ceramic film is necessary to be provided through experiments.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to provide a preparation and transfer printing method of a patterned piezoelectric ceramic film.
According to an aspect of the present invention, there is provided a method for preparing a patterned piezoelectric ceramic thin film, comprising:
Providing a substrate and a piezoelectric ceramic sheet, placing the piezoelectric ceramic sheet on the surface of the substrate, and bonding the piezoelectric ceramic sheet and the substrate together;
thinning the piezoelectric ceramic sheet to form a piezoelectric ceramic film;
cutting the piezoelectric ceramic film to form a piezoelectric ceramic film with a geometric pattern;
Removing temporary bonding glue used for bonding to separate the piezoelectric ceramic film from the substrate to obtain a patterned piezoelectric ceramic film;
adhering the patterned piezoelectric ceramic film to the surface of a transfer material;
providing a flexible substrate, and coating conductive paste on the flexible substrate in a screen printing mode;
Imprinting the patterned piezoelectric ceramic film on the surface of the conductive paste, bonding the patterned piezoelectric ceramic film with the flexible substrate, and stripping the transfer material;
and heating the patterned piezoelectric ceramic film and the flexible substrate until the conductive paste is completely cured.
Optionally, the providing a substrate and a piezoelectric ceramic sheet, wherein: the substrate is a rigid substrate.
Optionally, the providing a substrate and a piezoelectric ceramic sheet, wherein: the piezoelectric ceramic plate is made of any one of PZT piezoelectric ceramic, alN, PMN-PT, baTiO 3、ZrO2 and BNT.
Optionally, bonding the piezoceramic sheet and the substrate together includes: and bonding the piezoelectric ceramic piece and the substrate together by a hot-pressing method, wherein hot-pressing parameters comprise hot-pressing temperature, time and pressure, the hot-pressing temperature is lower than the Curie temperature of the piezoelectric ceramic piece, and the hot-pressing parameters are determined according to temporary bonding glue used for bonding.
Optionally, bonding the piezoceramic sheet and the substrate together, wherein: the spin-coating thickness of the temporary bonding glue is 5-50 μm.
Optionally, thinning the piezoelectric ceramic sheet to form a piezoelectric ceramic film, wherein: the thickness of the piezoelectric ceramic sheet is 200-1000 mu m, and the thickness of the piezoelectric ceramic film is 1-100 mu m.
Optionally, cutting the piezoelectric ceramic film to form a piezoelectric ceramic film with a geometric pattern, wherein: the geometric pattern of the piezoelectric ceramic film comprises any one of a rectangle, a circle, a triangle and a polygon.
Optionally, removing temporary bonding glue used for bonding, wherein: the de-bonding mode is determined according to the material adopted by the temporary bonding adhesive.
Optionally, adhering the patterned piezoceramic film to a surface of a transfer material, wherein: the transfer material includes any one of PDMS, a water-soluble adhesive tape, and a heat release adhesive tape.
Optionally, the providing a flexible substrate, wherein: the flexible substrate comprises any one of a flexible polymeric film material, a mica sheet, and a conductive metal material.
Compared with the prior art, the invention has at least one of the following beneficial effects:
According to the invention, the piezoelectric ceramic sheet and the silicon wafer are bonded together by the bonding method, so that not only is enough bonding force provided to resist strong shearing force in the thinning process, but also parallel stacking of materials of each layer is ensured, and thickness spread of the thinned ceramic film is avoided, thereby ensuring thickness uniformity of the piezoelectric ceramic film; the method for transferring the patterned piezoelectric ceramic film to the flexible substrate can be used for preparing a flexible piezoelectric sensor, an energy collector and a driver, and has important significance for improving the performance of a device.
Drawings
Other features, objects and advantages of the present invention will become more apparent upon reading of the detailed description of non-limiting embodiments, given with reference to the accompanying drawings in which:
FIG. 1 is a schematic flow chart of a method for preparing and transferring a patterned piezoelectric ceramic film according to an embodiment of the invention;
fig. 2 is a schematic diagram of a transfer effect in an embodiment of the present invention.
The reference numerals in the figures correspond to: 1-temporary bonding glue, 2-substrate, 3-piezoceramic wafer, 4-grinding wheel, 5-laser, 6-glass container, 7-sol agent, 8-transfer material, 9-conductive silver paste, 10-flexible substrate and 11-iron block.
Detailed Description
The present invention will be described in detail with reference to specific examples. The following examples will assist those skilled in the art in further understanding the present invention, but are not intended to limit the invention in any way. It should be noted that variations and modifications could be made by those skilled in the art without departing from the inventive concept. These are all within the scope of the present invention.
Referring to fig. 1, a flow chart of a method for preparing and transferring a patterned piezoelectric ceramic film according to an embodiment of the invention is shown, which includes:
S1, providing a substrate 2 and a piezoelectric ceramic sheet 3, placing the piezoelectric ceramic sheet 3 on the surface of the substrate 2, and bonding the piezoelectric ceramic sheet 3 and the substrate 2 together;
s2, thinning the piezoelectric ceramic sheet 3 to form a piezoelectric ceramic film;
s3, cutting the piezoelectric ceramic film to form the piezoelectric ceramic film with the geometric pattern;
S4, removing temporary bonding glue used for bonding to separate the piezoelectric ceramic film from the substrate, so as to obtain a patterned piezoelectric ceramic film;
s5, providing the patterned piezoelectric ceramic film prepared by the preparation method, and adhering the patterned piezoelectric ceramic film to the surface of the transfer material 8;
S6, providing a flexible substrate 10, and coating conductive paste 9 such as conductive silver paste on the flexible substrate 10 by a screen printing mode;
S7, stamping the patterned piezoelectric ceramic film on the surface of the conductive paste 9, bonding the patterned piezoelectric ceramic film with the flexible substrate 10, and stripping the transfer material 8;
and S8, heating the patterned piezoelectric ceramic film and the flexible substrate 10 until the conductive paste 9 is completely cured.
In some embodiments, the substrate 2 is a rigid substrate with high hardness, flat and smooth surface and good thermal stability, and provides sufficient mechanical support for the piezoelectric ceramic film, and avoids the film from warping and cracking due to stress generated during the chemical mechanical polishing process. Illustratively, the substrate 2 may be Si, ITO glass, borosilicate glass, quartz, or the like. The piezoelectric ceramic plate is a polycrystal formed by mixing, forming and sintering various raw materials at high temperature and is formed by irregularly integrating fine grains obtained by solid phase reaction and sintering process among particles, the material of the piezoelectric ceramic plate 3 comprises any one of PZT piezoelectric ceramic, alN, PMN-PT, baTiO 3、ZrO2 and BNT, the mechanical properties and the piezoelectric properties of different materials are different, the piezoelectric ceramic plate is suitable for different purposes, and the material of the piezoelectric ceramic plate 3 is determined according to the specific device performance. In other embodiments, other materials may be used as the piezoelectric ceramic sheet.
In step S1, if the thickness of the temporary bonding adhesive 1 is too thin, it is impossible to ensure that the adhesion force is maintained strong during the chemical mechanical polishing process, and if the thickness is too thick, the temporary bonding adhesive 1 is liable to overflow from the side during the bonding process. In some embodiments, bonding the piezoceramic sheet 3 and the substrate 2 together comprises: a layer of temporary bonding adhesive 1 is spin-coated on the substrate 2, the spin-coating thickness of the temporary bonding adhesive 1 is 5-50 mu m, so that strong adhesion is ensured in the chemical mechanical polishing process, and the piezoelectric ceramic sheet 3 is prevented from being separated; the spin coating thickness has a certain influence on the bonding quality, and factors such as the material types of the piezoelectric ceramic sheet 3 and the substrate 2, the thickness of the piezoelectric ceramic sheet 3, the fluidity of the temporary bonding adhesive 1 and the like need to be considered so as to provide good bonding quality. The piezoelectric ceramic plate 3 is placed on the surface of the substrate 2, the piezoelectric ceramic plate 3 and the substrate 2 are bonded together through a hot pressing method, and hot pressing parameters comprise hot pressing temperature, time and pressure, wherein the hot pressing temperature is lower than the Curie temperature of the piezoelectric ceramic plate, so that depolarization of the piezoelectric ceramic plate 3 is avoided, and otherwise, polarization treatment is needed after bonding of the piezoelectric ceramic plate 3. The hot pressing parameters are determined according to the temporary bonding glue used for bonding, and the hot pressing parameters are set and adjusted through a hot press. In the case of using a commercially available temporary bonding adhesive, the corresponding hot pressing parameters may be determined according to the instructions thereof.
In the embodiment of the invention, the piezoelectric ceramic sheet and the silicon wafer are bonded together by a bonding method, so that not only is enough bonding force (bonding force) provided to resist strong shearing force in the thinning process, but also parallel stacking of materials of each layer is ensured, and thickness spread of the thinned ceramic film is avoided, thereby ensuring thickness uniformity of the piezoelectric ceramic film.
In some embodiments, the piezoelectric ceramic sheet 3 is thinned to form a piezoelectric ceramic thin film, wherein: the thickness of the piezoelectric ceramic sheet 3 is 200-1000 μm, preferably 300 μm. The thickness of the piezoelectric ceramic thin film is 1 to 100. Mu.m, preferably 50. Mu.m. The thickness of the piezoelectric ceramic film has a decisive influence on the resonant frequency, the electromechanical conversion efficiency, the driving voltage, the mechanical strength and the like, and the selection of the thickness is determined according to the application of the device. As shown in fig. 1 (b), the piezoelectric ceramic sheet 3 may be thinned to a target thickness by chemical mechanical polishing using the grinding wheel 4.
In some embodiments, as shown in fig. 1 (c), the geometric pattern of the piezoelectric ceramic thin film is formed by laser cutting using a laser 5, and the geometric pattern of the piezoelectric ceramic thin film includes any one of a rectangle, a circle, a triangle, and a polygon. In other embodiments, the geometric pattern may also employ other complex geometric patterns, which are not particularly limited in this regard. Compared with photoetching, 3D printing and other modes, the embodiment of the invention adopts a laser cutting mode, so that the method is more stable and efficient.
In some embodiments, the temporary bonding glue 1 used for bonding is removed, wherein: the de-bonding mode is determined according to the material adopted by the temporary bonding adhesive. Illustratively, as shown in fig. 1 (d), the temporary bonding paste is removed by immersing the piezoelectric ceramic film and the substrate in a glass container 6 containing a sol agent 7. In other embodiments, mechanical stripping, thermal slip, etc. may also be used to remove the temporary bonding glue.
In some embodiments, the transfer material 8 comprises any one of PDMS, a water-soluble adhesive tape, and a heat release adhesive tape. The transfer material 8 has higher initial adhesive force, and can realize a simple piezoelectric ceramic film stripping process; in addition, under specific conditions, such as heating and water soaking, the adhesive force can be reduced or removed, so that the piezoelectric ceramic film can be easily separated from the piezoelectric ceramic film without damaging the piezoelectric ceramic film.
In some embodiments, the flexible substrate 10 includes any one of flexible polymer film materials, mica sheets, and conductive metal materials, which have characteristics of softness, low modulus, easy deformation, etc., so that the piezoelectric ceramic film has a certain bending and deformability as a whole after being combined with the flexible substrate 10. Because of the inherent mechanical hardness, piezoelectric ceramic films have a degree of brittleness, are easily broken, and have limited application to flexible devices. The flexible substrate 10 in combination with the piezoelectric ceramic thin film can significantly enhance the deformability of the piezoelectric ceramic thin film. Illustratively, the flexible polymeric film material includes PET, PI, parylene, PU and the like, and the conductive metallic material includes stainless steel, beryllium bronze, aluminum foil, and the like. The patterned piezoelectric ceramic film is bonded to the flexible substrate 10 by the conductive paste 9, and pressure is applied thereto by an iron block 11 or the like, as shown in fig. 1 (g), in order to secure close adhesion.
According to the embodiment of the invention, the temporary bonding glue is utilized to realize uniform thinning and nondestructive release of the piezoelectric ceramic film, and the de-bonded patterned piezoelectric ceramic film is transferred, so that the breakage of the piezoelectric ceramic film is effectively avoided, and the piezoelectric ceramic film is smoothly transferred to the target flexible substrate.
In a specific embodiment, with continued reference to fig. 1, the method for preparing and transferring the patterned piezoelectric ceramic thin film comprises the following steps:
In the first step, as shown in FIG. 1 (a), a silicon wafer having a thickness of 500 μm is used as the substrate 2. Placing the silicon wafer into acetone, ethanol and deionized water, respectively ultrasonically cleaning for 5min, drying water vapor on the silicon wafer with nitrogen after cleaning, spin-coating a 20 mu m temporary bonding adhesive 1 on the surface of the silicon wafer, and bonding the piezoelectric ceramic sheet 3 and the silicon wafer through a hot press; the piezoelectric ceramic plate material is PZT piezoelectric ceramic plate with thickness of 300 μm.
In the second step, as shown in fig. 1 (b), the piezoelectric ceramic sheet is thinned by the grinding wheel 4 by a chemical mechanical polishing process, and the thickness of the thinned piezoelectric ceramic sheet is 50 μm.
And thirdly, as shown in (c) of fig. 1, cutting the piezoelectric ceramic film by using a laser 5 according to a designed geometric figure by adopting a laser processing technology, wherein the geometric figure of laser cutting is an array of 1*2, array elements are squares with the side length of 1cm, and the spacing between the array elements is 3mm.
Fourth, as shown in fig. 1 (d), the piezoelectric ceramic film and the silicon wafer are put into a glass container 6 containing a sol 7 for soaking.
And fifthly, as shown in (e) of fig. 1, after the temporary bonding glue is completely dissolved, the pattern array is reserved, the piezoelectric ceramic pattern array is adhered to the surface of the transfer material 8, and the transfer material is a low-viscosity PDMS substrate.
In the sixth step, as shown in FIG. 1 (f), the flexible substrate was a PET film having a length of 3cm and a width of 2cm and a thickness of 100. Mu.m. The conductive silver paste 9 is printed on the flexible substrate 10 by adopting a screen printing process, and the pattern of the conductive silver paste 9 is consistent with the pattern of the piezoelectric ceramic.
Seventh, as shown in fig. 1 (g), the piezoelectric ceramic pattern array and the flexible substrate are combined together by conductive silver paste, and pressure is applied by the iron block 11, thereby ensuring close adhesion.
Eighth, as shown in fig. 1 (h), the transfer material is peeled off and the device is placed in an oven until the conductive silver paste is cured.
The transfer effect of the patterned piezoelectric ceramic film is shown in fig. 2. As can be seen from fig. 2, by the method for preparing and transferring the patterned piezoelectric ceramic film in the above embodiment, it is ensured that the patterned piezoelectric ceramic film is transferred onto the flexible PET substrate without structural damage.
According to the embodiment of the invention, the patterning preparation and the reliable transfer printing of the piezoelectric ceramic film are realized, wherein a hot-press bonding mode not only provides enough bonding force, but also ensures the uniform thickness of the piezoelectric ceramic film; jie Jian and transfer printing are combined to effectively avoid the cracking of the patterned piezoelectric ceramic film. The preparation and transfer printing method of the patterned piezoelectric ceramic film can be used for preparing piezoelectric sensors, energy collectors, drivers and the like.
The foregoing describes specific embodiments of the present invention. It is to be understood that the invention is not limited to the particular embodiments described above, and that various changes and modifications may be made by one skilled in the art within the scope of the claims without affecting the spirit of the invention. The above-described preferred features may be used in any combination without collision.
Claims (10)
1. The preparation and transfer printing method of the patterned piezoelectric ceramic film is characterized by comprising the following steps of:
Providing a substrate and a piezoelectric ceramic sheet, placing the piezoelectric ceramic sheet on the surface of the substrate, and bonding the piezoelectric ceramic sheet and the substrate together;
thinning the piezoelectric ceramic sheet to form a piezoelectric ceramic film;
cutting the piezoelectric ceramic film to form a piezoelectric ceramic film with a geometric pattern;
Removing temporary bonding glue used for bonding to separate the piezoelectric ceramic film from the substrate to obtain a patterned piezoelectric ceramic film;
adhering the patterned piezoelectric ceramic film to the surface of a transfer material;
providing a flexible substrate, and coating conductive paste on the flexible substrate in a screen printing mode;
Imprinting the patterned piezoelectric ceramic film on the surface of the conductive paste, bonding the patterned piezoelectric ceramic film with the flexible substrate, and stripping the transfer material;
and heating the patterned piezoelectric ceramic film and the flexible substrate until the conductive paste is completely cured.
2. The method of preparing and transferring a patterned piezoelectric ceramic film according to claim 1, wherein the substrate and the piezoelectric ceramic sheet are provided, wherein: the substrate is a rigid substrate.
3. The method of preparing and transferring a patterned piezoelectric ceramic film according to claim 1, wherein the substrate and the piezoelectric ceramic sheet are provided, wherein: the piezoelectric ceramic plate is made of any one of PZT piezoelectric ceramic, alN, PMN-PT, baTiO 3、ZrO2 and BNT.
4. The method of preparing and transferring a patterned piezoelectric ceramic film according to claim 1, wherein bonding the piezoelectric ceramic sheet and the substrate together comprises: and bonding the piezoelectric ceramic piece and the substrate together by a hot-pressing method, wherein hot-pressing parameters comprise hot-pressing temperature, time and pressure, the hot-pressing temperature is lower than the Curie temperature of the piezoelectric ceramic piece, and the hot-pressing parameters are determined according to temporary bonding glue used for bonding.
5. The method of preparing and transferring a patterned piezoelectric ceramic film according to claim 1, wherein the piezoelectric ceramic sheet and the substrate are bonded together, wherein: the spin-coating thickness of the temporary bonding glue is 5-50 μm.
6. The method of preparing and transferring a patterned piezoelectric ceramic film according to claim 1, wherein the piezoelectric ceramic sheet is thinned to form a piezoelectric ceramic film, wherein: the thickness of the piezoelectric ceramic sheet is 200-1000 mu m, and the thickness of the piezoelectric ceramic film is 1-100 mu m.
7. The method of preparing and transferring a patterned piezoelectric ceramic film according to claim 1, wherein the piezoelectric ceramic film is cut to form a piezoelectric ceramic film having a geometric pattern, wherein: the geometric pattern of the piezoelectric ceramic film comprises any one of a rectangle, a circle, a triangle and a polygon.
8. The method for preparing and transferring a patterned piezoelectric ceramic film according to claim 1, wherein temporary bonding glue used for bonding is removed, wherein: the de-bonding mode is determined according to the material adopted by the temporary bonding adhesive.
9. The method of preparing and transferring a patterned piezoelectric ceramic film according to claim 1, wherein the patterned piezoelectric ceramic film is adhered to a surface of a transfer material, wherein: the transfer material includes any one of PDMS, a water-soluble adhesive tape, and a heat release adhesive tape.
10. The method of making and transferring a patterned piezoelectric ceramic film according to claim 1, wherein the providing a flexible substrate, wherein: the flexible substrate comprises any one of a flexible polymeric film material, a mica sheet, and a conductive metal material.
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